Sound box with heat dissipation channel structure

Abstract

The invention relates to a sound box with a heat dissipation channel structure, the sound box comprises a box body and at least one layer of loudspeaker unit group, the sound box is provided with at least one layer of heat dissipation channel structure communicated with the inside and the outside of the box body, the heat dissipation channel structure comprises a phase inversion hole penetrating through the box wall of the box body and a phase inversion tube arranged in the box body, and the phase inversion tube is communicated with the phase inversion hole; the loudspeaker unit group comprises at least one loudspeaker unit, the loudspeaker unit is installed in the box body, a magnetic circuit system of the loudspeaker unit is arranged in the heat dissipation channel structure, and the magnetic circuit system of at least part of the loudspeaker unit is arranged in the inverter tube. According to the invention, the heat dissipation channel structure communicating the inside and the outside of the box body is arranged in the box body, and the magnetic circuit system is arranged in the heat dissipation channel structure, so that heat dissipation of the magnetic circuit system is facilitated; the phase inversion hole and the phase inversion tube are used as one part of the heat dissipation channel structure, so that the structure of the heat dissipation channel structure can be simplified; the magnetic circuit system is arranged in the inverter tube, so that the magnetic circuit system is close to the outside, the heat dissipation effect is good, and the temperature rise can be effectively inhibited.

Description

Technical Field

[0001] This invention relates to the field of speaker technology, and more particularly to a speaker with a heat dissipation channel structure. Background Technology

[0002] The magnetic circuit system of a loudspeaker unit typically consists of a magnet, a T-iron, a washer, and a voice coil. This system is responsible for generating and converging a constant, uniform magnetic field. Its core function is to provide the working magnetic field for the voice coil. When alternating current passes through the voice coil, it experiences an electromagnetic force within the magnetic field, driving the diaphragm to vibrate and thus producing sound.

[0003] Under high-power operation, the magnetic circuit system generates significant heat due to thermal conduction from the voice coil and eddy current losses induced in the metal components of the magnetic circuit (such as T-irons and washer). As the temperature rises, the magnetic flux density of the magnet decreases, which weakens the effective magnetic field strength in the magnetic gap and reduces the critical driving force factor (BL value).

[0004] A decrease in the BL value means that a larger current is required from the voice coil to drive the diaphragm to produce the same vibration amplitude (i.e., the same sound pressure level) as at low temperatures. This phenomenon, where the input electrical power increases but the sound output does not increase proportionally, is called "power compression," which directly leads to a significant decrease in the electro-acoustic conversion efficiency of the loudspeaker unit as the temperature rises.

[0005] Therefore, effectively managing the heat dissipation of the magnetic circuit system to suppress temperature rise is crucial for maintaining the performance of the speaker unit at high power (especially BL value and efficiency). Summary of the Invention

[0006] To address the aforementioned deficiencies in the prior art, this invention provides an improved speaker with a heat dissipation channel structure.

[0007] The technical solution adopted by this invention to solve its technical problem is: constructing a speaker with a heat dissipation channel structure, comprising: The enclosure includes at least one heat dissipation channel structure connecting the inside and outside of the enclosure. The heat dissipation channel structure includes a phase-reversing hole penetrating the enclosure wall and a phase-reversing pipe disposed within the enclosure, the phase-reversing pipe being connected to the phase-reversing hole; and... At least one layer of speaker unit group, the speaker unit group including at least one speaker unit, the speaker unit being installed in the enclosure, the magnetic circuit system of the speaker unit being disposed in the heat dissipation channel structure, and at least a portion of the magnetic circuit system of the speaker unit being disposed in the bass reflex tube.

[0008] Preferably, the loudspeaker unit group includes at least two loudspeaker units, which are arranged facing each other and together form a sound outlet space. The heat dissipation channel structure includes two bass reflex ports and two bass reflex tubes. The two bass reflex ports are located on both sides of the sound outlet, and the magnetic circuit systems of the speaker units located on both sides are respectively arranged in the two bass reflex tubes.

[0009] Preferably, the loudspeaker unit group includes three loudspeaker units; The heat dissipation channel structure also includes an air supply device installed in the enclosure, with the exhaust side of the air supply device facing the magnetic circuit system of the third speaker unit located in the middle.

[0010] Preferably, the heat dissipation channel structure further includes a connecting channel disposed within the housing, the connecting channel connecting the two bass reflex tubes; the magnetic circuit system of the third speaker unit is disposed in the connecting channel; The air supply device is disposed in the connecting channel, and both the air intake side and the air exhaust side of the air supply device are located in the connecting channel, which is used to drive the gas flow in the heat dissipation channel structure.

[0011] Preferably, the three speaker units are arranged in a U-shape at the same height of the enclosure, and the connecting channel is arranged in a U-shape.

[0012] Preferably, the speaker unit group has two or more layers, and the two or more layers of speaker unit groups are arranged parallel to each other along the height direction of the enclosure. The number of speaker units in each layer is the same, and they are arranged in a one-to-one correspondence in the height direction. The number of layers in the heat dissipation channel structure is the same as the number of layers in the speaker unit group, and each heat dissipation channel structure layer is respectively arranged in a one-to-one correspondence with the magnetic circuit system of each speaker unit group in the height direction.

[0013] Preferably, the enclosure includes a top wall, a bottom wall, a rear wall, two side walls, and two front walls. The two front walls are respectively connected to the same side of the two side walls and are spaced apart to form the sound outlet. The bass reflex port is opened on the front wall. The enclosure also includes a mounting plate for mounting the speaker unit. The mounting plate includes two first mounting plates connected to the two front walls respectively, and a second mounting plate connected between the two first mounting plates. The first mounting plates and the second mounting plate are provided with mounting holes, and the speaker unit is mounted in the mounting holes.

[0014] Preferably, the second mounting plate is provided with reinforcing support members on both sides, the reinforcing support members connect the second mounting plate and the rear wall, and the air supply device is installed on one of the reinforcing support members.

[0015] Preferably, at least a portion of the magnetic circuit system of the loudspeaker unit is disposed in the bass reflex port; The bass reflex tube includes side portions disposed on both sides of the bass reflex port, and connecting portions that connect the two side portions vertically. The side portion near the first mounting plate is provided with an opening through which the magnetic circuit system of the speaker unit passes, and the magnetic circuit system of the speaker unit is placed in the bass reflex tube through the opening.

[0016] Preferably, the housing further includes a connecting support member connecting the first mounting plate and the side wall, and the connecting support member has an air vent communicating with the phase inversion hole.

[0017] The speaker with a heat dissipation channel structure that implements the present invention has the following beneficial effects: A heat dissipation channel structure connecting the inside and outside of the enclosure is set up in the enclosure. By placing the magnetic circuit system in the heat dissipation channel structure, the heat dissipation of the magnetic circuit system is facilitated. Furthermore, incorporating the phase inversion hole and phase inversion tube as part of the heat dissipation channel structure simplifies the structure of the heat dissipation channel structure. At the same time, placing the magnetic circuit system in the phase inversion tube brings the magnetic circuit system closer to the outside, resulting in better heat dissipation and effectively suppressing temperature rise. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a three-dimensional structural diagram of a speaker with a heat dissipation channel structure according to some embodiments of the present invention; Figure 2 yes Figure 1 The diagram shows an exploded view of a speaker with a heat dissipation channel structure. Figure 3 yes Figure 1 The exploded structural diagram of the speaker with a heat dissipation channel structure is shown from another angle. Figure 4 yes Figure 1 The diagram shows a partial structural schematic of a speaker with a heat dissipation channel structure. Figure 5 This is a schematic diagram of the structure of a loudspeaker unit in the prior art; Figure 6 yes Figure 5 The diagram shows the exploded structure of the loudspeaker unit.

[0019] Reference numerals: 10. Speaker enclosure, 1. Cabinet, 11. Heat dissipation channel structure, 111. Bass reflex port, 112. Bass reflex tube, 1121. Side, 1122. Connecting part, 1123. Opening, 113. Air supply device, 1131. Intake side, 1132. Exhaust side, 114. Connecting channel, 121. Top wall, 122. Bottom wall, 123. Rear wall, 124. Side wall, 125. Front wall, 126. First mounting plate, 127. Second mounting plate, 128. Mounting hole, 129. Reinforcing support, 130. 131. Vent, 132. Reinforced structure, 133. Reinforced component, 134. Connecting support, 135. Support, 136. Connector, 137. Vent, 2. Loudspeaker unit assembly, 21. Loudspeaker unit, 211. Magnetic circuit system, 2111. Magnet, 2112. T-iron, 2113. Washer, 2114. Opening, 2115. Bass, 2116. Voice coil, 22. Sound outlet, 23. Sound outlet space. Detailed Implementation

[0020] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the invention will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "horizontal," "top," "bottom," "inner," and "outer" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing the technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on the present invention.

[0021] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0022] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0023] Figures 1 to 3 A speaker 10 (hereinafter referred to as "speaker 10") with a heat dissipation channel structure is shown in some embodiments of the present invention, such as... Figures 1 to 3 As shown, the speaker 10 includes a cabinet 1 and at least one speaker unit group 2. The cabinet 1 is provided with at least one heat dissipation channel structure 11 connecting the inside and outside of the cabinet 1. The heat dissipation channel structure 11 includes a bass reflex port 111 penetrating the cabinet wall of the cabinet 1 and a bass reflex tube 112 disposed inside the cabinet 1. The bass reflex tube 112 is connected to the bass reflex port 111. The speaker unit group 2 includes at least one speaker unit 21. The speaker unit 21 is installed in the cabinet 1. The magnetic circuit system 211 of the speaker unit 21 is disposed in the heat dissipation channel structure 11, and at least some of the magnetic circuit systems 211 of the speaker unit 21 are disposed in the bass reflex tube 112.

[0024] like Figure 5 and Figure 6 As shown, the magnetic circuit system 211 of the speaker unit 21 includes a magnet 2111, a T-iron 2112, a washer 2113, and a voice coil 2116. Understandably, the magnetic circuit system 211 will generate heat during high-power operation. To avoid "power compression" caused by the increased temperature of the magnetic circuit system 211, this invention provides a heat dissipation channel structure 11 connecting the inside and outside of the enclosure 1. By placing the magnetic circuit system 211 within the heat dissipation channel structure 11, heat dissipation of the magnetic circuit system 211 is facilitated. Furthermore, incorporating the bass reflex port 111 and the bass reflex tube 112 as part of the heat dissipation channel structure 11 simplifies its structure. Simultaneously, placing the magnetic circuit system 211 within the bass reflex tube 112 brings it closer to the outside environment, resulting in better heat dissipation and effectively suppressing temperature rise.

[0025] The loudspeaker unit group 2 includes at least two loudspeaker units 21, which are arranged facing each other and together form a sound outlet space 23 with a sound outlet 22 in the layer; the heat dissipation channel structure 11 includes two bass reflex ports 111 and two bass reflex tubes 112, the two bass reflex ports 111 are respectively located on both sides of the sound outlet 22, and the magnetic circuit systems 211 of the loudspeaker units 21 on both sides are respectively arranged in the two bass reflex tubes 112.

[0026] Understandably, a single-layer speaker unit group 2 includes two or more speaker units 21. The speaker units 21 of this layer are arranged facing each other, that is, the openings 2114 of all the speaker units 21 of this layer are arranged facing each other, so that all the speaker units 21 of this layer can emit sound in the same direction, so that the sound waves can converge in the sound outlet space 23 and propagate outward from the sound outlet 22.

[0027] Combination Figures 1 to 3 As shown, the speaker units 21 of this layer can be arranged at intervals or adjacent to each other along the horizontal direction of the enclosure 1, that is, the speaker units 21 of this layer are arranged from one side of the enclosure 1 to the other side of the enclosure 1. Two bass reflex ports 111 are respectively provided on both sides of the sound outlet 22, that is, the two bass reflex ports 111 are also located on both sides of the enclosure 1, and are respectively provided with corresponding magnetic circuit systems 211 of the speaker units 21 located on both sides, so that the magnetic circuit systems 211 of the speaker units 21 located on both sides can be respectively provided in the bass reflex tubes 112 on both sides.

[0028] Understandably, when a single-layer speaker unit group 2 includes two speaker units 21, these two speaker units 21 are the speaker units 21 located on both sides, and the magnetic circuit systems 211 of these two speaker units 21 are respectively and correspondingly arranged in the two bass reflex tubes 112 located on both sides. When a single-layer speaker unit group 2 includes three or more speaker units 21, the magnetic circuit systems 211 of the two speaker units 21 located on both sides are respectively and correspondingly arranged in the two bass reflex tubes 112 located on both sides.

[0029] like Figures 1 to 3 As shown, in some embodiments, the speaker unit group 2 may include three speaker units 21; the heat dissipation channel structure 11 also includes an air supply device 113 installed in the housing 1, with the exhaust side 1132 of the air supply device 113 facing the magnetic circuit system 211 of the third speaker unit 21 located in the middle.

[0030] Understandably, a single-layer speaker unit group 2 includes three speaker units 21, with the third speaker unit 21 positioned between the speaker units 21 on both sides. Therefore, by providing an air supply device 113, with the exhaust side 1132 of the air supply device 113 facing the magnetic circuit system 211 of the third speaker unit 21, heat dissipation of the magnetic circuit system 211 of the third speaker unit 21 can be achieved through exhaust via the air supply device 113.

[0031] Preferably, the exhaust side 1132 of the air supply device 113 is positioned directly opposite the magnetic circuit system 211 of the third speaker unit 21.

[0032] like Figure 2As shown, the heat dissipation channel structure 11 also includes a connecting channel 114 disposed in the housing 1, the connecting channel 114 connecting two phase inverters 112; the magnetic circuit system 211 of the third speaker unit 21 is disposed in the connecting channel 114; the air supply device 113 is disposed in the connecting channel 114, and the air intake side 1131 and the air exhaust side 1132 of the air supply device 113 are both located in the connecting channel 114, which is used to drive the air flow in the heat dissipation channel structure 11.

[0033] Understandably, the connecting channel 114 connects the two bass reflex tubes 112 located on both sides, thus forming a heat dissipation channel structure 11 that runs through both sides of the enclosure 1. The magnetic circuit system 211 of all the speaker units 21 in the first-layer speaker unit group 2 is located in the heat dissipation channel structure 11, so that heat can be transferred to the outside of the enclosure 1 through the heat dissipation channel structure 11, that is, to the outside world.

[0034] Furthermore, the suction side 1131 and exhaust side 1132 of the air supply device 113 are both located in the connecting channel 114, thereby drawing in gas from one side of the connecting channel 114 and discharging it to the other side of the connecting channel 114, thus driving the gas flow within the connecting channel 114 and achieving gas circulation. Part of the airflow path in the heat dissipation channel structure 11 is as follows: Figure 3 As shown. Optionally, the air supply device 113 can be implemented using a fan.

[0035] Understandably, during the operation of the speaker unit 21, when the diaphragm of the speaker unit 21 moves toward the opening 2114, the airflow enters the enclosure 1 through the bass reflex port 111. When the diaphragm moves toward the magnetic circuit system 211, the airflow exits the enclosure 1 through the bass reflex port 111. This can achieve heat dissipation of the magnetic circuit system 211 of the speaker unit 21 located on both sides. Moreover, the gas flow rate at the bass reflex port 111 is high, resulting in high heat dissipation efficiency.

[0036] In high-power operation, i.e., high sound pressure level operation, when the operating power of the speaker unit 21 exceeds a set threshold, the air supply device 113 is activated. Through ventilation, the heat from the magnetic circuit system 211 inside the enclosure 1 is expelled outside the enclosure 1. Understandably, in specific applications, a threshold for the operating power can be set according to requirements, so that when the operating power of the speaker unit 21 reaches this threshold, the air supply device 113 is activated, achieving the aforementioned heat dissipation function.

[0037] In this invention, the magnetic circuit system 211 of the speaker unit 21 is set in the heat dissipation channel structure 11, and the heat dissipation efficiency is improved by utilizing a large airflow rate. At the same time, the air supply device 113 is set in the heat dissipation channel structure 11 to enhance the heat dissipation effect, so that under the premise of high-speed ventilation and heat dissipation, an additional layer of ventilation guarantee is provided.

[0038] Combination Figures 1 to 3 As shown, the three speaker units 21 are arranged in a U-shape at the same height, and the connecting channel 114 is also arranged in a U-shape. Understandably, the three speaker units 21 in the first-layer speaker unit group 2 can be arranged in a U-shape and located at the same height of the enclosure 1.

[0039] In some embodiments, the included angle between the planes containing the openings 2114 of each pair of adjacent speaker units 21 is the same. The included angle can be an acute angle, a right angle, or an obtuse angle, as shown in the figure. The included angle is preferably set as a right angle. And the spacing between each pair of adjacent speaker units 21 is the same.

[0040] Understandably, in each layer of speaker unit group 2, the number of speaker units 21, the angle between the planes where the openings 2114 of two adjacent speaker units 21 are located, and the spacing between two adjacent speaker units 21 can be set according to actual needs.

[0041] The speaker unit group 2 can have two or more layers, and the two or more layers of speaker unit groups 2 are arranged parallel to each other along the height direction of the cabinet 1. The number of speaker units 21 in each layer is the same, and they are arranged one-to-one in the height direction.

[0042] Understandably, in each layer of speaker unit group 2, the speaker units 21 are arranged in the same way, wherein adjacent layers of speaker unit groups 2 are spaced apart or placed next to each other, and the spacing between each pair of adjacent layers of speaker unit groups 2 is the same. The speaker units 21 of all speaker unit groups 2 in the enclosure 1 together form a sound outlet space 23 with a sound outlet 22.

[0043] Correspondingly, the number of layers of the heat dissipation channel structure 11 is the same as the number of layers of the speaker unit group 2, and each layer of the heat dissipation channel structure 11 is respectively arranged in a one-to-one correspondence with the magnetic circuit system 211 of each speaker unit group 2 in the height direction.

[0044] Understandably, each heat dissipation channel structure 11 corresponds to a speaker unit group 2, so that the gas flow of the heat dissipation channel structure 11 on the same plane, that is, the air intake and exhaust of each layer are on the same plane, which makes the gas flow path simple, the air flow smoother and more unobstructed, and reduces airflow noise.

[0045] like Figure 2 and Figure 3 As shown, in some embodiments, the speaker 10's enclosure 1 includes a top wall 121, a bottom wall 122, a rear wall 123, two side walls 124 and two front walls 125. The two front walls 125 are respectively connected to the same side of the two side walls 124 and are spaced apart to form a sound outlet 22. A bass reflex port 111 is formed on the front wall 125.

[0046] The enclosure 1 also includes a mounting plate for mounting the speaker unit 21. The mounting plate includes two first mounting plates 126 respectively connected to the two front walls 125, and a second mounting plate 127 connected between the two first mounting plates 126. Figure 4 As shown, the first mounting plate 126 and the second mounting plate 127 are provided with mounting holes 128, and the speaker unit 21 is mounted in the mounting holes 128. It is understood that the speaker unit 21 is mounted on the corresponding mounting plate through the mounting holes 128, and can be securely fixed to the mounting plate by fastening structures such as screws. It is understood that, for example, the speaker unit 21 can be fixed by fixing the speaker unit 21's frame 2115 to the mounting plate, and this frame 2115 may not be in contact with the bass reflex tube 112.

[0047] Understandably, the top wall 121 and bottom wall 122 of the enclosure 1 can be rectangular. The two first mounting plates 126 are respectively connected to the front wall 125 on the corresponding side, and are connected to the side of the front wall 125 that forms the sound outlet 22. The second mounting plate 127 is connected between the two first mounting plates 126, and is connected to the side of the first mounting plate 126 away from the sound outlet 22.

[0048] Understandably, in embodiments where the included angle between the planes containing the openings 2114 of two adjacent speaker units 21 in the same layer is a right angle, two first mounting plates 126 are arranged in parallel and spaced apart, and a second mounting plate 127 is perpendicular to the two first mounting plates 126 respectively.

[0049] Thus, the two front walls 125, the two side walls 124, the rear wall 123, the two first mounting plates 126, and the second mounting plate 127 form a U-shaped assembly, with the top wall 121 and the bottom wall 122 respectively covering both ends of the assembly. The two first mounting plates 126 and the second mounting plate 127 together form a sound outlet space 23, and a sound outlet 22 is formed between the two front walls 125.

[0050] Understandably, each speaker unit 21 is installed in its respective mounting hole 128. The openings 2114 of the speaker units 21 located on both sides face one side of the sound outlet space 23, and the magnetic circuit system 211 faces the side where the side wall 124 is located. Therefore, the magnetic circuit system 211 can be configured corresponding to the bass reflex tube 112 and can be installed in the bass reflex tube 112. The opening 2114 of the third speaker unit 21 faces one side of the sound outlet space 23, and the magnetic circuit system 211 faces the side where the rear wall 123 is located.

[0051] Understandably, in embodiments where the speaker unit group 2 has two or more layers, the speaker units 21 corresponding to each other in the height direction can be mounted on the same mounting plate, and the mounting plate can be provided with a corresponding number of mounting holes 128, which can effectively simplify the structure.

[0052] Understandably, in embodiments where a single-layer speaker unit group 2 includes four or more speaker units 21, a greater number of second mounting plates 127 can be provided, such that one mounting plate corresponds to one speaker unit 21 per layer. The angle between two adjacent mounting plates can be set according to the angle requirements between two adjacent speaker units 21.

[0053] The second mounting plate 127 has reinforcing support members 129 on both sides, which connect the second mounting plate 127 to the rear wall 123. The air supply device 113 is mounted on one of the reinforcing support members 129. Understandably, the reinforcing support member 129 provides enhanced support without obstructing the third speaker unit 21, allowing the air supply device 113 to directly blow air onto the magnetic circuit system 211, thus facilitating heat dissipation.

[0054] The reinforcing support 129 for installing the air supply device 113 can be plate-shaped and has an installation port for installing the air supply device 113. Another reinforcing support 129 has an air outlet 130 corresponding to the air supply device 113.

[0055] Understandably, since the speaker unit 21 is relatively heavy, especially the magnetic circuit system 211, a reinforcing support 129 is provided to support the speaker unit 21, which also supports the cabinet 1, so as to prevent the cabinet 1 from resonating and deforming when the speaker unit 21 vibrates.

[0056] One side of each of the two reinforcing support members 129 is connected to the side of the second mounting plate 127 near the side wall 124, and the other side is connected to the rear wall 123. The reinforcing support members 129 can be set perpendicular to the second mounting plate 127 and the rear wall 123. A reinforcing structure 131 can be provided between the reinforcing support members 129 and the rear wall 123. An air supply device 113 is installed on one of the reinforcing support members 129, and the air supply device 113 is set according to the number of layers of the speaker unit 21.

[0057] The air supply device 113 is positioned directly opposite the third speaker unit 21, with its exhaust side 1132 facing the magnetic circuit system 211 of the speaker unit 21, and its intake side 1131 facing the side wall 124, and connected to the bass reflex port 112, thereby enabling unidirectional exhaust. Figure 3 As shown.

[0058] Combination Figure 2 and Figure 4As shown, at least a portion of the magnetic circuit system 211 of the speaker unit 21 is disposed in the bass reflex tube 112; the bass reflex tube 112 includes side portions 1121 disposed on both sides of the bass reflex port 111, and connecting portions 1122 that connect the two side portions 1121 vertically. The side portion 1121 near the first mounting plate 126 is provided with an opening 1123 through which the magnetic circuit system 211 of the speaker unit 21 passes, and the magnetic circuit system 211 of the speaker unit 21 is placed in the bass reflex tube 112 through the opening 1123.

[0059] Understandably, the cross-sectional area, depth, length, width and height of the bass reflex tube 112 are related to the Ts parameter of the speaker unit 21 in the speaker cabinet 10. Generally speaking, the size of the bass reflex tube 112 is larger than the size of the magnetic circuit system 211 so that the magnetic circuit system 211 can be placed therein and heat dissipation is convenient.

[0060] In some embodiments, a semi-circular opening 1123 is formed on the side of the speaker unit 21 away from the bass reflex port 111 on the side near the first mounting plate 126, through which the magnetic circuit system 211 of the speaker unit 21 is placed in the bass reflex tube 112. The length of the other side 1121 near the sidewall 124 may be greater than the length of the side 1121 near the first mounting plate 126.

[0061] like Figure 2 and Figure 3 As shown, the housing 1 also includes a connecting support 133 that connects the first mounting plate 126 and the side wall 124. The connecting support 133 has an air vent 136 that communicates with the phase inversion hole 111. Understandably, by providing the connecting support 133, the connection between the first mounting plate 126 and the side wall 124 is strengthened, thereby improving the support for the housing 1.

[0062] The connecting support 133 may include at least two support members 134 connecting the first mounting plate 126 and the side wall 124, and a connector 135 connecting the at least two support members 134. The at least two support members 134 may be perpendicular to the first mounting plate 126 and the side wall 124, and are arranged parallel to each other along the height direction of the housing 1.

[0063] Understandably, the number of support members 134 can be set according to the number of layers of the heat dissipation channel structure 11. The number of support members 134 can be one more than the number of layers of the heat dissipation channel structure 11, and they are spaced apart along the height direction of the housing 1. Therefore, an air vent 136 is formed between each two adjacent support members 134.

[0064] For example, in an embodiment where the heat dissipation channel structure 11 has two layers, the support member 134 may be provided in three layers, thus forming two air vents 130. The two air vents 130 correspond to the bass reflex port 111, bass reflex tube 112, and magnetic circuit system 211 of the speaker unit 21 of the corresponding layer, respectively.

[0065] Thus, a cavity 137 is formed between the portion of the rear wall 123 near the side wall 124, the portion of the side wall 124 near the rear wall 123, the connecting support 133, and the reinforcing support 129. This forms a connecting channel 114 between the air outlet 136, the cavity 137, the air outlet 130, and the air supply device 113. This connecting channel 114 is connected to the phase inverter 112 and the phase inverter hole 111, thereby forming a heat dissipation channel structure 11 that connects the inside and outside of the housing 1.

[0066] Understandably, the volume, size, and shape of the speaker 10, as well as the size and shape of each component and structure, can be set according to actual needs, as long as the heat dissipation function requirements mentioned above are met.

[0067] In this invention, by setting a heat dissipation channel structure 11, the magnetic circuit system 211 of the speaker unit 21 inside the enclosure 1 is facilitated to dissipate heat, so that under high sound pressure level and high power use, excessive power compression will not occur, thereby maintaining the performance of the speaker unit under high power and making the speaker enclosure 10 durable.

[0068] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A speaker with a heat dissipation channel structure, characterized in that, include: The enclosure (1) is provided with at least one heat dissipation channel structure (11) connecting the inside and outside of the enclosure (1). The heat dissipation channel structure (11) includes a phase inversion hole (111) penetrating the wall of the enclosure (1) and a phase inversion tube (112) disposed inside the enclosure (1). The phase inversion tube (112) is connected to the phase inversion hole (111). as well as At least one layer of loudspeaker unit group (2), the loudspeaker unit group (2) includes at least one loudspeaker unit (21), the loudspeaker unit (21) is installed in the enclosure (1), the magnetic circuit system (211) of the loudspeaker unit (21) is disposed in the heat dissipation channel structure (11), and at least part of the magnetic circuit system (211) of the loudspeaker unit (21) is disposed in the bass reflex tube (112).

2. The speaker with a heat dissipation channel structure according to claim 1, characterized in that, The loudspeaker unit group (2) includes at least two loudspeaker units (21), which are arranged facing each other and together form a sound outlet space (23) with a sound outlet (22). The heat dissipation channel structure (11) includes two bass reflex ports (111) and two bass reflex tubes (112). The two bass reflex ports (111) are located on both sides of the sound outlet (22). The magnetic circuit system (211) of the speaker unit (21) located on both sides is respectively arranged in the two bass reflex tubes (112).

3. The speaker with a heat dissipation channel structure according to claim 2, characterized in that, The loudspeaker unit group (2) includes three loudspeaker units (21); The heat dissipation channel structure (11) also includes an air supply device (113) installed in the housing (1), with the exhaust side (1132) of the air supply device (113) facing the magnetic circuit system (211) of the third speaker unit (21) located in the middle.

4. The speaker with a heat dissipation channel structure according to claim 3, characterized in that, The heat dissipation channel structure (11) also includes a connecting channel (114) disposed in the housing (1), the connecting channel (114) connecting the two bass reflex tubes (112); the magnetic circuit system (211) of the third speaker unit (21) is disposed in the connecting channel (114); The air supply device (113) is disposed in the connecting channel (114), and the air intake side (1131) and air exhaust side (1132) of the air supply device (113) are both located in the connecting channel (114) to drive the gas flow in the heat dissipation channel structure (11).

5. The speaker with a heat dissipation channel structure according to claim 4, characterized in that, The three speaker units (21) are arranged in a U-shape at the same height of the enclosure (1), and the connecting channel (114) is arranged in a U-shape.

6. The speaker with a heat dissipation channel structure according to claim 1, characterized in that, The loudspeaker unit group (2) has two or more layers, and the loudspeaker unit group (2) with two or more layers is arranged parallel to the height direction of the enclosure (1). The number of loudspeaker units (21) in each layer is the same, and they are arranged one-to-one in the height direction. The number of layers of the heat dissipation channel structure (11) is the same as the number of layers of the speaker unit group (2), and each layer of the heat dissipation channel structure (11) is respectively set in a height direction to correspond one-to-one with the magnetic circuit system (211) of each speaker unit group (2).

7. The speaker with a heat dissipation channel structure according to claim 3, characterized in that, The enclosure (1) includes a top wall (121), a bottom wall (122), a rear wall (123), two side walls (124) and two front walls (125). The two front walls (125) are respectively connected to the same side of the two side walls (124) and are spaced apart to form the sound outlet (22). The bass reflex port (111) is opened on the front wall (125). The enclosure (1) further includes a mounting plate for mounting the speaker unit (21). The mounting plate includes two first mounting plates (126) connected to the two front walls (125) respectively, and a second mounting plate (127) connected between the two first mounting plates (126). The first mounting plates (126) and the second mounting plate (127) are provided with mounting holes (128), and the speaker unit (21) is mounted in the mounting holes (128).

8. The speaker with a heat dissipation channel structure according to claim 7, characterized in that, The second mounting plate (127) is provided with reinforcing support members (129) on both sides. The reinforcing support members (129) connect the second mounting plate (127) and the rear wall (123). The air supply device (113) is installed on one of the reinforcing support members (129).

9. The speaker with a heat dissipation channel structure according to claim 7, characterized in that, At least a portion of the magnetic circuit system (211) of the loudspeaker unit (21) is disposed in the bass reflex tube (112); The bass reflex tube (112) includes side portions (1121) disposed on both sides of the bass reflex port (111) and connecting portions (1122) that connect the two side portions (1121) vertically. The side portion (1121) near the first mounting plate (126) is provided with an opening (1123) through which the magnetic circuit system (211) of the speaker unit (21) passes. The magnetic circuit system (211) of the speaker unit (21) is placed in the bass reflex tube (112) through the opening (1123).

10. The speaker with a heat dissipation channel structure according to claim 9, characterized in that, The housing (1) further includes a connecting support (133) connecting the first mounting plate (126) and the side wall (124), and the connecting support (133) has an air vent (136) communicating with the phase inversion hole (111).

Images