LED chip packaging device for lamp and packaging method

Abstract

The invention relates to the technical field of LED chip packaging, and discloses an LED chip packaging device for a lamp and a packaging method.The LED chip packaging device for the lamp comprises a dispensing machine, a fixing plate is installed in the dispensing machine, one side of the fixing plate is fixedly connected with a mounting frame, one side of the mounting frame is fixedly connected with an electric push rod, and the electric push rod is fixedly connected with an LED chip. The bottom of the electric push rod is fixedly connected with a mounting head, the bottom of the mounting head is in threaded connection with a conversion head, a glue injection pipeline is arranged in the center of the conversion head, and the bottom of the conversion head is fixedly connected with a clamping ring. Through simple rotation switching, switching among different dies can be carried out, so that two different optical structures and functional effects are realized, the equipment investment cost is reduced, the production remodeling period is shortened, the multi-variety and small-batch flexible production requirements in lamp manufacturing are met, long-time shutdown debugging is not needed in rotation switching operation, and the production efficiency is improved. Tedious steps such as disassembly and calibration in the traditional remodeling process are simplified, and the production efficiency and the product adaptability are improved.

Description

Technical Field

[0001] This invention relates to the field of LED chip packaging technology, and in particular to an LED chip packager and packaging method for lighting fixtures. Background Technology

[0002] LED chip packagers used in lighting fixtures are key equipment for transforming LED chips into practical light sources. Their core function is to isolate the fragile LED chip from the external environment through processes such as die bonding, wire bonding, encapsulation, and curing, while completing electrical connections and optical performance regulation, ultimately forming an LED device with stable luminous efficiency, mechanical strength, and weather resistance.

[0003] The encapsulation device is the core module of the encapsulator. It is mainly responsible for accurately applying encapsulating adhesives such as silicone and epoxy resin to designated areas of the chip and the bracket. Through mold shaping or dispensing control, it forms specific optical structures such as hemispheres and curved surfaces, which not only protects the chip from moisture, dust corrosion and mechanical impact, but also optimizes the light emission efficiency through the refractive index design of the adhesive, ensuring that the luminous efficacy, color temperature and lifespan of the LED lamps meet the usage standards.

[0004] However, current mainstream sealing devices suffer from functional limitations: their dispensing heads and matching molds are mostly designed for fixed fit, meaning one device can only match one mold specification, thus limiting the sealing operation to a specific shape. For example, a device adapted to a hemispherical mold can only produce LED devices with a focusing effect; if switching to lens-shaped sealing with a diffused effect is required, the entire dispensing head, mold, and corresponding parameter system of the sealing device must be replaced. It's impossible to quickly switch between two different optical structures and functional effects through simple mold conversion, which not only increases equipment investment costs but also extends production changeover cycles, making it difficult to meet the flexible production needs of multi-variety, small-batch manufacturing in lighting fixtures. Summary of the Invention

[0005] In view of the problem that the existing sealing devices have limited functionality, an LED chip packager and packaging method for lighting fixtures are proposed.

[0006] One aspect of this application provides an LED chip package for lighting fixtures, the purpose of which is to enable rapid switching between two different optical structures and functional effects.

[0007] The technical solution of the present invention is as follows: an LED chip packager for lamps, including a dispensing machine, a fixing plate installed inside the dispensing machine, a mounting bracket fixedly connected to one side of the fixing plate, an electric push rod fixedly connected to one side of the mounting bracket, a mounting head fixedly connected to the bottom of the electric push rod, a conversion head connected to the bottom of the mounting head by a thread, an injection pipe opened at the center of the conversion head, a snap-fit ​​ring fixedly connected to the bottom of the conversion head, a conversion base provided at the bottom of the conversion head, a snap-fit ​​groove opened at the connection between the conversion base and the snap-fit ​​ring, the snap-fit ​​ring being rotatably snap-fitted into the snap-fit ​​groove, a first output tube opened on the surface of the conversion base, and a second output tube opened on the other surface of the conversion base;

[0008] The conversion base is equipped with a curved mold corresponding to the position of the first output tube. The curved mold is set as an integrated mold for glue injection. The conversion base is equipped with a hemispherical mold corresponding to the position of the second output tube. The hemispherical mold is set as a separate glue injection. When in use, rotate the bottom conversion base to rotate the required mold to vertical downward. Then, start the electric push rod to drive the conversion head to press down and seal the mold.

[0009] Furthermore, a square outer shell is fixedly connected to one side of the first output pipe, and a funnel tube is fixedly connected to the connection between the square outer shell and the first output pipe. A Y-shaped groove is fixedly connected to one side of the funnel tube, and the Y-shaped groove is connected to the funnel tube. A curved top plate is fixedly connected to one side of the square outer shell corresponding to the first output pipe. Flow grooves are respectively opened at both ends of the curved top plate corresponding to the Y-shaped grooves. The flow grooves are connected to the interior of the square outer shell. A first exhaust hole is opened at the center of the curved top plate.

[0010] Furthermore, a connecting pipe is fixedly connected to the bottom of the second output pipe, and a circular outer shell is fixedly connected to the bottom of the connecting pipe. An installation groove is provided inside the circular outer shell. A piston block is slidably connected inside the connecting pipe. A linkage block is fixedly connected to the bottom of the piston block. A spherical cover is fixedly connected to the top of the circular outer shell through the linkage block. A second vent hole is provided at the center of the top of the spherical cover. An installation ring is fixedly connected to the surface of the spherical cover. The installation ring is slidably connected to the installation groove. Sliding rods are arranged in an array corresponding to the position of the installation ring in the installation groove. The installation ring is slidably connected to the surface of the sliding rods. A return spring is sleeved on the surface of the sliding rods at the top of the installation ring. An installation pipe is fixedly connected to the surface of the connecting pipe at the bottom position of the piston block. A glue delivery pipe is fixedly connected to the bottom of the installation pipe. An output groove is provided in the circular outer shell corresponding to the position of the glue delivery pipe. The output groove is connected to the installation groove. The other end of the glue delivery pipe is fixedly connected to the output groove.

[0011] Furthermore, the square molding groove is opened inside the square shell. The square molding groove is rectangular in design, and the curved top plate on one side of the square molding groove is curved in design.

[0012] Furthermore, a blocking ring is fixedly connected to the bottom of the mounting ring, and a sliding groove is provided on the inner wall of the bottom of the mounting groove corresponding to the position of the blocking ring, and the sliding groove is slidably connected to the blocking ring.

[0013] Furthermore, the snap-fit ​​ring at the bottom of the adapter is a circular T-shaped protrusion, and the snap-fit ​​groove is a circular T-shaped recess, with the two snapping together.

[0014] Furthermore, an electric slide rail is fixedly connected to one side of the fixed plate, and the electric slide rail is fixedly connected to the dispensing machine on both sides. A worktable is fixedly connected inside the dispensing machine at the position corresponding to the electric slide rail.

[0015] Furthermore, the second output tube is designed to be perpendicular to the first output tube, with one end of the glue injection pipe connected to the bottom channel, while the other end is blocked.

[0016] Furthermore, the present invention also provides a method for packaging LED chip packages for lighting fixtures, using an LED chip package for lighting fixtures, comprising the following steps:

[0017] Step 1: Die bonding. Fix the LED chip onto the worktable using conductive adhesive or solder paste to ensure a stable connection between the chip and the worktable.

[0018] Step 2: Wire bonding. Use gold or copper wire to connect the chip electrodes to the bracket pins to achieve electrical conductivity and ensure the current transmission path.

[0019] Step 3: Adhesive injection. Dispense the encapsulating adhesive into the lower mold cavity according to the preset amount to cover the chip and bonding wire areas;

[0020] Step 4: Curing. The adhesive is cured by heating or UV irradiation to form the target optical structure.

[0021] The beneficial effects of this invention are:

[0022] 1. Through simple rotation switching, different molds can be switched to achieve two different optical structures and functional effects, reducing equipment investment costs and shortening the production changeover cycle. This meets the flexible production needs of multiple varieties and small batches in lighting manufacturing. At the same time, the rotation switching operation does not require long-term downtime for debugging, simplifying the cumbersome steps such as disassembly and calibration in the traditional changeover process, and improving production efficiency and product adaptability.

[0023] 2. The encapsulating adhesive is shaped into a curved rectangle using a curved top plate and a square molding groove. This curved rectangle allows for more effective refraction and scattering of light emitted from the chip, resulting in more uniform light dispersion. This helps reduce light concentration and dark areas, thereby improving the uniformity of illumination. By rationally designing the curvature and angle of the curved rectangle, the light emission angle can be altered, reducing total internal reflection at the chip-encapsulating adhesive interface and improving light extraction efficiency. This allows more light to escape from the encapsulation structure, enhancing the luminous efficiency of the lamp.

[0024] 3. The encapsulating adhesive is molded into a circular hemisphere by pressing down the spherical cap. The circular hemisphere has a high degree of optical symmetry. After the light is emitted from the chip, it is refracted by the surface of the hemispherical encapsulating adhesive and can be dispersed in a more regular manner. This makes the light intensity distribution of the lamp more uniform in all directions, which is particularly suitable for application scenarios with strict requirements for light distribution curves. The circular hemispherical encapsulating adhesive is similar to a simple convex lens. Even without an additional optical lens, it can still play a certain role in converging the light, so that the light forms a more concentrated spot at a specific distance. Attached Figure Description

[0025] Figure 1 This is a perspective view of the LED chip package for lighting fixtures according to the present invention;

[0026] Figure 2 This is a diagram of the encapsulation mechanism in the LED chip package for lighting fixtures according to the present invention;

[0027] Figure 3 This is a cross-sectional schematic diagram of the sealing mechanism of the present invention;

[0028] Figure 4 This is a cross-sectional view of the converter head of the present invention;

[0029] Figure 5 This is a schematic diagram of the adapter installation of the present invention;

[0030] Figure 6 This is a perspective view of the conversion head mechanism of the present invention;

[0031] Figure 7 This is a perspective view of the adapter and the square housing of the present invention.

[0032] Figure 8 This is a perspective view of the adapter and circular housing of the present invention.

[0033] Figure 9 This is a schematic diagram of the internal installation of the circular outer shell of the present invention;

[0034] In the picture:

[0035] 1. Dispensing machine; 2. Fixing plate; 3. Mounting bracket; 4. Electric push rod; 5. Mounting head; 6. Converter head; 7. Dispensing pipe; 8. Snap-fit ​​ring; 9. Snap-fit ​​groove; 10. Converter base; 11. First output pipe; 12. Second output pipe; 13. Funnel pipe; 14. Y-shaped groove; 15. Square outer shell; 16. Flow channel; 17. First vent hole; 18. Curved top plate; 19. Square shaping groove; 20. Connecting pipe; 21. Circular outer shell; 22. Piston block; 23. Linking block; 24. Mounting pipe; 25. Dispensing pipe; 26. Output groove; 27. Spherical cover; 28. Mounting ring; 29. ​​Blocking ring; 30. Slide groove; 31. Slide rod; 32. Return spring; 33. Mounting groove; 34. Second vent hole; 35. Worktable; 36. Electric slide rail. Detailed Implementation

[0036] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Example 1, referring to Figure 3 - Figure 6 The first embodiment of the present invention provides an LED chip packager for lighting fixtures, including a dispensing machine 1, a fixing plate 2 installed inside the dispensing machine 1, a mounting bracket 3 fixedly connected to one side of the fixing plate 2, and an electric push rod 4 fixedly connected to one side of the mounting bracket 3. The dispensing component is installed through the fixing plate 2, the mounting bracket 3 and other structures, and the electric push rod 4 can drive the dispensing component to descend and move above the chip.

[0038] An installation head 5 is fixedly connected to the bottom of the electric push rod 4. A conversion head 6 is threadedly connected to the bottom of the installation head 5. An injection pipe 7 is provided at the center of the conversion head 6. A snap ring 8 is fixedly connected to the bottom of the conversion head 6. A conversion base 10 is provided at the bottom of the conversion head 6. A snap groove 9 is provided at the connection between the conversion base 10 and the snap ring 8. The snap ring 8 is rotated and snapped into the snap groove 9. A first output pipe 11 is provided on the surface of the conversion base 10. A second output pipe 12 is provided on the other surface of the conversion base 10. When the conversion base 10 rotates, when either the second output pipe 12 or the first output pipe 11 is facing downwards, it will connect with the injection pipe 7. The injection will then enter the corresponding mold through the injection pipe 7, thus facilitating conversion to meet different needs.

[0039] The conversion base 10 is provided with a curved mold at the position corresponding to the first output tube 11. The curved mold is set as an integrated mold for injection. The integrated mold cavity is machined as a whole, and the curvature of the curved surface is continuous without splicing. This can ensure the smoothness of the curved surface after the encapsulation glue is formed and the consistency with the design, reduce optical refraction deviation, and there is no parting surface spliced ​​between the upper and lower molds. After the encapsulation glue is formed, there are no splicing marks on the surface, which improves the uniformity of light emission. It is especially suitable for scenarios with high requirements for optical performance. At the same time, it meets the encapsulation requirements of multiple curvature combinations. The integrated mold can completely replicate the design shape and is easier to realize complex optical structures than the combined mold.

[0040] The conversion base 10 is equipped with a hemispherical mold at the position corresponding to the second output pipe 12. The hemispherical mold is designed for split injection, which generally consists of a punch and a die. First, a portion of the adhesive is injected into the lower mold cavity, and then the upper mold is pressed down to squeeze the adhesive into the entire cavity. During the injection, the upper mold is not fully closed, and the adhesive rises from bottom to top. Air can be discharged from the gap between the upper and lower molds or the top vent hole, resulting in almost no air bubbles. This achieves a hemispherical sealant with no air bubbles, full filling, and uniform inner wall curvature.

[0041] When in use, rotate the bottom conversion base 10 to rotate the required mold to vertical downward, and then start the electric push rod 4 to drive the conversion head 6 to press down and seal the mold.

[0042] Reference Figure 1 - Figure 6 A square outer shell 15 is fixedly connected to one side of the first output tube 11. A funnel tube 13 is fixedly connected to the connection between the square outer shell 15 and the first output tube 11. A Y-shaped groove 14 is fixedly connected to one side of the funnel tube 13. The Y-shaped groove 14 is connected to the funnel tube 13. The single glue flow is divided into two paths through the Y-shaped groove 14, and glue is injected into different points simultaneously to improve efficiency.

[0043] A curved top plate 18 is fixedly connected to one side of the square outer shell 15 corresponding to the first output pipe 11. The curved top plate 18 has flow channels 16 at both ends of the Y-shaped groove 14. The flow channels 16 are connected to the inside of the square outer shell 15. The glue injection port of the flow channel 16 is located at the top of the square molding groove 19, which is more suitable for the shallow and irregular shape of the curved surface cavity and can avoid the problem of adapting the bottom flow channel to the complex curved surface.

[0044] The curved top plate 18 has a first exhaust hole 17 at its center. The first exhaust hole 17 is designed with a flared mouth. It utilizes the principle of fluid dynamics to allow gas to be discharged smoothly, while preventing the rubber material from overflowing due to resistance.

[0045] Reference Figure 7 - Figure 9The bottom of the second output pipe 12 is fixedly connected to a connecting pipe 20, and the bottom of the connecting pipe 20 is fixedly connected to a circular outer shell 21. An installation groove 33 is opened inside the circular outer shell 21. A piston block 22 is slidably connected inside the connecting pipe 20. A linkage block 23 is fixedly connected to the bottom of the piston block 22. A spherical cover 27 is fixedly connected to the top of the circular outer shell 21 through the linkage block 23. Pressure is applied to the spherical cover 27 through glue, so that the spherical cover 27 can make piston movement inside the connecting pipe 20, so that the piston block 22 synchronously drives the linkage block 23 and the spherical cover 27 to press down.

[0046] A second vent 34 is provided at the center of the top of the spherical cover 27. A mounting ring 28 is fixedly connected to the surface of the spherical cover 27. The mounting ring 28 is slidably connected in the mounting groove 33. Slide rods 31 are arranged in an array in the mounting groove 33 corresponding to the position of the mounting ring 28. The mounting ring 28 is slidably connected to the surface of the slide rods 31. The slide rods 31 can ensure that the spherical cover 27 and the mounting ring 28 can slide on the surface of the slide rods 31 and limit the mounting ring 28. When the mounting ring 28 finishes moving, the elastic force of the return spring 32 drives the mounting ring 28 to return to its original position.

[0047] A return spring 32 is sleeved on the top of the mounting ring 28 on the surface of the slide rod 31. An mounting tube 24 is fixedly connected to the bottom of the piston block 22 on the surface of the connecting tube 20. A glue supply tube 25 is fixedly connected to the bottom of the mounting tube 24. An output slot 26 is opened on the circular outer shell 21 corresponding to the position of the glue supply tube 25. The output slot 26 is connected to the mounting slot 33. The other end of the glue supply tube 25 is fixedly connected to the output slot 26. The plastic is formed into a circular hemisphere by the spherical cover 27. The circular hemisphere can simulate the lens effect, converge, and make the signal more uniform, reduce the irregular reflection loss at the corners, and is suitable for scenarios with high requirements for light effect signal accuracy, such as LEDs and optical sensors.

[0048] Reference Figure 5 - Figure 6 The square molding groove 19 is opened inside the square shell 15. The square molding groove 19 is rectangular. The curved top plate 18 on one side of the square molding groove 19 is curved. The encapsulating glue is formed on the chip to form a curved rectangle through the square molding groove 19 and the curved top plate 18. The curved rectangle structure is regular, which is convenient for directional signal transmission in specific directions such as vertical and horizontal, and is suitable for scenarios with high directional requirements.

[0049] Reference Figure 8 - Figure 9A retaining ring 29 is fixedly connected to the bottom of the mounting ring 28. A sliding groove 30 is provided on the bottom inner wall of the mounting groove 33 corresponding to the position of the retaining ring 29. The sliding groove 30 is slidably connected to the retaining ring 29. The bottom of the retaining ring 29 is set as an inclined surface, corresponding to the bottom sliding groove 30, so as to facilitate the alignment and connection between the retaining ring 29 and the sliding groove 30. The retaining ring 29 prevents the sealant from entering the mounting groove 33, which would damage the parts inside the mounting groove 33 and make cleaning difficult.

[0050] Reference Figure 3 - Figure 6 The bottom of the adapter head 6 has a snap ring 8 with a circular T-shaped protrusion and a snap groove 9 with a circular T-shaped groove. The two snap together. The circular design allows the protrusion and groove to rotate and fit together without precise alignment, reducing the difficulty of alignment during assembly and improving assembly efficiency.

[0051] Reference Figure 1 - Figure 2 An electric slide rail 36 is fixedly connected to one side of the fixed plate 2. The electric slide rail 36 is fixedly connected to the dispensing machine 1 on both sides. Inside the dispensing machine 1, a worktable 35 is fixedly connected to the position corresponding to the electric slide rail 36. Power is provided by the electric slide rail 36 and other mechanical components to drive the dispensing components to move and move precisely to the designated position above the chip, adapting to dispensing scenarios with different chip sizes or package shapes.

[0052] Reference Figure 3 - Figure 6 The second output tube 12 is designed to be perpendicular to the first output tube 11. One end of the glue injection pipe 7 is connected to the bottom channel, while the other end is blocked.

[0053] The working principle of this invention is as follows: By rotating the conversion base 10, the required mold is rotated to the bottom, and the glue injection pipe 7 is connected to the first output pipe 11 or the second output pipe 12. At this time, glue injection can be started. When the encapsulating glue enters the first output pipe 11, the encapsulating glue will be diverted along the funnel pipe 13 and the Y-shaped groove 14 into the flow channel 16. As the encapsulating glue enters the square molding groove 19, it fills the interior of the square molding groove 19 and contacts the curved top plate 18. Through the curved top plate 18 and the square molding groove... 19. The encapsulating adhesive is shaped to maintain a curved rectangle on the chip. When the encapsulating adhesive enters the connecting tube 20, it will press down on the piston block 22 and the linkage block 23. When the piston block 22 presses down through the mounting tube 24, the encapsulating adhesive will enter the dispensing tube 25 through the mounting tube 24, and then enter the slide groove 30 through the dispensing tube 25. At the same time, the spherical cover 27 is pressed down. The pressed spherical cover 27 shapes the encapsulating adhesive to maintain a circular hemispherical shape on the chip.

[0054] Example 2, refer to Figure 1The second embodiment of the present invention provides: a method for packaging an LED chip package for a lighting fixture, employing an LED chip package for a lighting fixture, comprising the following steps:

[0055] Step 1: Die bonding. Fix the LED chip onto the worktable 35 using conductive adhesive or solder paste to ensure a stable connection between the chip and the worktable 35.

[0056] Step 2: Wire bonding. Use gold or copper wire to connect the chip electrodes to the bracket pins to achieve electrical conductivity and ensure the current transmission path.

[0057] Step 3: Adhesive injection. Dispense the encapsulating adhesive into the lower mold cavity according to the preset amount to cover the chip and bonding wire areas;

[0058] Step 4: Curing. The adhesive is cured by heating or UV irradiation to form the target optical structure.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An LED chip encapsulator for a luminaire comprising a dispenser (1), characterized in that: The dispensing machine (1) is equipped with a fixed plate (2). A mounting bracket (3) is fixedly connected to one side of the fixed plate (2). An electric push rod (4) is fixedly connected to one side of the mounting bracket (3). An installation head (5) is fixedly connected to the bottom of the electric push rod (4). A conversion head (6) is connected to the bottom of the installation head (5) by a thread. An injection pipe (7) is opened at the center of the conversion head (6). A snap ring (8) is fixedly connected to the bottom of the conversion head (6). A conversion base (10) is provided at the bottom of the conversion head (6). A snap groove (9) is opened at the connection between the conversion base (10) and the snap ring (8). The snap ring (8) is rotated and snapped into the snap groove (9). A first output pipe (11) is opened on the surface of the conversion base (10). A second output pipe (12) is opened on the other surface of the conversion base (10). The conversion base (10) is provided with a curved mold corresponding to the position of the first output tube (11). The curved mold is set as an integrated mold for injection. The conversion base (10) is provided with a hemispherical mold corresponding to the position of the second output tube (12). The hemispherical mold is set as a separate injection. When in use, rotate the bottom conversion base (10) to rotate the required mold to vertical downward. Then, by starting the electric push rod (4), the conversion head (6) is driven to press down and seal the mold.

2. The LED chip package for a lamp according to claim 1, characterized by: A square outer shell (15) is fixedly connected to one side of the first output pipe (11). A funnel tube (13) is fixedly connected to the connection between the square outer shell (15) and the first output pipe (11). A Y-shaped groove (14) is fixedly connected to one side of the funnel tube (13). The Y-shaped groove (14) is connected to the funnel tube (13). A curved top plate (18) is fixedly connected to one side of the square outer shell (15) corresponding to the first output pipe (11). Flow grooves (16) are respectively opened at both ends of the curved top plate (18) corresponding to the Y-shaped groove (14). The flow grooves (16) are connected to the inside of the square outer shell (15). A first exhaust hole (17) is opened at the center of the curved top plate (18).

3. The LED chip package for a lamp according to claim 1, characterized by: The bottom of the second output pipe (12) is fixedly connected to a connecting pipe (20), and the bottom of the connecting pipe (20) is fixedly connected to a circular outer shell (21). An installation groove (33) is provided inside the circular outer shell (21). A piston block (22) is slidably connected inside the connecting pipe (20). A linkage block (23) is fixedly connected to the bottom of the piston block (22). The linkage block (23) passes through the top of the circular outer shell (21) and is fixedly connected to a spherical cover (27). A second exhaust hole (34) is provided at the center of the top of the spherical cover (27). An installation ring (28) is fixedly connected to the surface of the spherical cover (27). The installation ring (28) is slidably connected in the installation groove (33). The mounting groove (33) has slide rods (31) arranged in an array corresponding to the mounting ring (28). The mounting ring (28) is slidably connected to the surface of the slide rod (31). A return spring (32) is sleeved on the surface of the slide rod (31) at the top of the mounting ring (28). The surface of the connecting tube (20) is fixedly connected to the mounting tube (24) at the bottom of the piston block (22). The bottom of the mounting tube (24) is fixedly connected to the glue supply tube (25). The circular outer shell (21) has an output groove (26) corresponding to the glue supply tube (25). The output groove (26) is connected to the mounting groove (33). The other end of the glue supply tube (25) is fixedly connected to the output groove (26).

4. The LED chip package for a lamp according to claim 2, characterized by: The square plastic groove (19) is opened inside the square shell (15). The square plastic groove (19) is rectangular in design, and the curved top plate (18) on one side of the square plastic groove (19) is curved in design.

5. The LED chip package for a lamp according to claim 3, characterized by: The bottom of the mounting ring (28) is fixedly connected to a blocking ring (29), and a sliding groove (30) is provided on the inner wall of the bottom of the mounting groove (33) corresponding to the position of the blocking ring (29). The sliding groove (30) is slidably connected to the blocking ring (29).

6. The LED chip package for a lamp according to claim 1, characterized by: The snap ring (8) at the bottom of the adapter (6) is a circular T-shaped protrusion, and the snap groove (9) is a circular T-shaped groove, and the two snap together.

7. The LED chip package for a lamp according to claim 1, characterized by: An electric slide rail (36) is fixedly connected to one side of the fixed plate (2), and the electric slide rail (36) is fixedly connected to the dispensing machine (1) on both sides. A worktable (35) is fixedly connected inside the dispensing machine (1) at the position corresponding to the electric slide rail (36).

8. The LED chip package for a lamp according to claim 1, characterized by: The second output tube (12) is designed to be perpendicular to the first output tube (11). One end of the glue injection pipe (7) is connected to the bottom channel, while the other end is blocked.

9. A method for packaging an LED chip package for a luminaire, using the LED chip package for a luminaire according to claim 7, characterized by, Includes the following steps: Step 1: Die bonding, fix the LED chip to the worktable (35) with conductive glue or solder paste to ensure a stable connection between the chip and the worktable (35); Step 2: Wire bonding. Use gold or copper wire to connect the chip electrodes to the bracket pins to achieve electrical conductivity and ensure the current transmission path. Step 3: Adhesive injection. Dispense the encapsulating adhesive into the lower mold cavity according to the preset amount to cover the chip and bonding wire areas; Step 4: Curing. The adhesive is cured by heating or UV irradiation to form the target optical structure.

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