Wafer turning and multi-angle regulating device

Abstract

The application discloses a wafer overturning and multi-angle regulating device, and belongs to the technical field of semiconductor manufacturing equipment. The device comprises a main support, a clamp support, a wafer clamp and an adjusting mechanism. The clamp support is rotationally connected with the main support and can rotate around a first axis which is collinear with the wafer axis; the wafer clamp only clamps the edge or side surface of the wafer to avoid contacting the front and back surfaces. The main support is driven by the adjusting mechanism to overturn and rotate around the second axis and the third axis which are perpendicular to each other, so that multi-degree-of-freedom posture adjustment is realized. The device is integrated with an angle monitoring and closed-loop control unit, can realize real-time feedback and automatic adjustment of the deflection angle, is provided with a force sensor on the clamping part to adaptively control the clamping force, is equipped with a wafer detection and radial adjustment device to dynamically adapt to wafers with different diameters, and is additionally provided with a dynamic vibration suppression mechanism to actively suppress mechanical resonance in the adjustment process. The wafer can be overturned and regulated in a high-precision, non-damage and multi-angle mode, and the yield and efficiency of the semiconductor process are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and more specifically to a wafer flipping and multi-angle control device. Background Technology

[0002] As the carrier of semiconductor devices, the cleanliness, flatness, and edge integrity of the wafer directly determine the product yield. In current production and R&D processes, to maximize the performance of materials, both sides of the wafer need to be processed, and the processing angles are no longer limited to a certain angle. In this case, both sides of the wafer need to be protected. The optimal solution is to avoid contact between the front and back sides of the wafer, allowing the wafer to be flipped directly in its original position and adjusted at multiple angles. In this situation, equipment that can flip and adjust the wafer simultaneously becomes extremely important.

[0003] Wafers often need to be flipped and positioned at different angles for double-sided processing or inspection. Existing wafer flipping devices have the following shortcomings:

[0004] (1) The fixtures often come into direct contact with the front or back of the wafer, which can easily cause scratches or contamination;

[0005] (2) The flipping angle is limited and the adjustment is inflexible, making it difficult to meet the requirements of complex processes;

[0006] (3) The lack of real-time monitoring and active control of parameters such as clamping force, vibration, and wafer size makes it easy to cause fragmentation, edge chipping or hidden damage when processing ultra-thin and large-size wafers. The degree of automation also needs to be improved.

[0007] This shows that existing technologies still have certain shortcomings. Summary of the Invention

[0008] The purpose of this invention is to provide a wafer flipping and multi-angle control device to solve at least one of the above-mentioned existing problems.

[0009] To achieve the above objectives, the present invention provides a wafer flipping and multi-angle control device, comprising:

[0010] The main support frame provides structural support and installation foundation;

[0011] A fixture support for mounting a wafer fixture, the fixture support being rotatably engaged with the main support, and the fixture support being rotatable relative to the main support about a first axis collinear with the wafer axis;

[0012] The wafer clamps are provided in multiple ways, and the multiple wafer clamps are symmetrically distributed with the first axis as the center of symmetry. The wafer clamps are configured to clamp the edge or side of the wafer to avoid contact with the front and back of the wafer.

[0013] An adjustment mechanism is connected to the main support and the clamp support, and is used to drive the main support to flip around a second axis and rotate around a third axis, wherein the second axis and the third axis are perpendicular to each other.

[0014] In the above solution, the coordinated operation of the main support, the fixture support, and the adjustment mechanism enables precise flipping and angle control of the wafer within space with multiple degrees of freedom. This design avoids the contamination or damage that may be caused by traditional fixtures contacting the front and back of the wafer, making it particularly suitable for semiconductor manufacturing processes with extremely high surface cleanliness requirements.

[0015] In a preferred embodiment of this application, the adjustment mechanism includes a crankshaft connecting rod mechanism and a rotating seat. The crankshaft connecting rod mechanism includes a first crankshaft arm and a second crankshaft arm. One end of the first crankshaft arm is connected to the main body support, and the other end of the first crankshaft arm is rotatably connected to the second crankshaft arm. The end of the second crankshaft arm away from the first crankshaft arm is connected to the rotating seat. The first crankshaft arm drives the main body support to rotate relative to the second crankshaft arm around the second axis. The rotating seat drives the second crankshaft arm, the first crankshaft arm, and the main body support to rotate around the third axis.

[0016] The adjustment mechanism further includes an angle monitoring component and an adjustment control unit. The angle monitoring component is used to provide real-time feedback on the deflection angle of the first crankshaft arm relative to the second crankshaft arm and the rotation angle of the rotating seat. The adjustment control unit is connected to the angle monitoring component, the crankshaft connecting rod mechanism and the rotating seat respectively, and is configured to automatically adjust the deflection angle of the first crankshaft arm relative to the second crankshaft arm and the rotation angle of the rotating seat based on the feedback signal of the angle monitoring component.

[0017] In the above scheme, the combination of crankshaft connecting rod mechanism realizes complex flipping and rotational movements with a compact structure. The introduction of angle monitoring components and adjustment control units realizes closed-loop feedback control of the motion process, which can correct angle deviations in real time, significantly improving the accuracy and repeatability of wafer positioning and laying the foundation for automated production.

[0018] In a preferred embodiment of this application, the wafer jig includes a clamping part and a force sensor connected to the clamping part. The force sensor is integrated into the contact surface between the clamping part and the wafer and is used to monitor the clamping force applied by the clamping part to the wafer in real time.

[0019] It also includes a clamp control unit, which is connected to the clamping part and the force sensor respectively, and is configured to automatically adjust the opening and closing force of the clamping part based on the feedback signal of the force sensor.

[0020] In the above solution, by integrating a force sensor and connecting it to the fixture control unit, real-time monitoring and adaptive adjustment of the clamping force are achieved. This effectively prevents the wafer from slipping due to insufficient clamping force, or from developing stress cracks or hidden damage at the wafer edge due to excessive clamping force, making it particularly suitable for processing ultra-thin wafers.

[0021] As a preferred embodiment of this application, a modular cleaning accessory is also included, which includes a dust suction port and an LED light ring. The dust suction port is connected to an external fan via a pipe, and the LED light ring is arranged around the dust suction port. The dust suction port and the LED light ring are detachably mounted on the main support for simultaneously removing dust from the wafer surface and providing illumination during the flipping process.

[0022] The above solution integrates the flipping operation with online cleaning and lighting functions. The suction port can simultaneously remove dust during operation, reducing wafer transfer and exposure times and lowering the risk of contamination. The LED light ring provides good illumination, facilitating visual inspection or monitoring, and improving operational convenience and quality control.

[0023] In a preferred embodiment of this application, the dust suction port is designed with a porous structure; the color temperature of the LED light ring is adjustable, ranging from 3000K to 6000K.

[0024] In the above solution, the porous suction port allows for more even suction distribution, improving cleaning performance. The color-temperature adjustable LED light ring (3000K-6000K) provides the most suitable lighting conditions according to different process requirements or testing content (such as observation of films of different materials), enhancing the applicability and testing accuracy of the device.

[0025] As a preferred embodiment of this application, it further includes a wafer inspection device and a radial adjustment device. The wafer inspection device is mounted on the main support or the fixture support and points towards the wafer clamping area for non-contact measurement of the thickness and diameter of the wafer. The radial adjustment device is linked to the wafer fixture and is configured to dynamically adjust the radial position of the wafer fixture on the fixture support based on the wafer diameter data measured by the wafer inspection device.

[0026] In the above scheme, the non-contact measurement of the wafer inspection device avoids contact damage and can quickly obtain the key dimensional parameters of the wafer. The radial adjustment device is linked to it, and its core effect is to automatically adapt to wafers of different diameters, realize automatic adjustment of the fixture position, improve the flexibility and intelligence of the equipment, and reduce changeover and debugging time.

[0027] In a preferred embodiment of this application, the radial adjustment device includes a plurality of fixture mounting seats and radial drive mechanisms corresponding to the fixture mounting seats. The fixture mounting seats are used to mount the wafer fixture. The radial drive mechanisms are respectively connected to the fixture support and the fixture mounting seats, and are used to drive the fixture mounting seats to move the wafer fixture relative to the fixture support along the wafer radial direction.

[0028] In the above scheme, by setting the fixture mounting base and the radial drive mechanism, each wafer fixture can be driven independently or synchronously with precision, ensuring that the wafer is accurately aligned and stably clamped, which is crucial for ensuring the uniformity of subsequent processes.

[0029] As a preferred embodiment of this application, a dynamic vibration suppression mechanism is also included, which includes a high-frequency acceleration sensor and an adaptive damper. The high-frequency acceleration sensor is located on the fixture support near the wafer clamping area and is used to capture the resonance frequency and amplitude generated by the wafer during flipping and rotation in real time. The adaptive damper is installed at the connection node between the first crankshaft arm and the second crankshaft arm and the rotating seat, and is configured to generate a reverse force opposite to the vibration phase based on the feedback signal of the high-frequency acceleration sensor, so as to actively suppress mechanical resonance to avoid edge chipping or hidden damage to the wafer due to vibration impact.

[0030] In the above scheme, a high-frequency accelerometer captures the resonance signal in real time, and an adaptive damper generates a counterforce, which can actively and effectively suppress mechanical vibration. This directly avoids edge chipping or internal micro-damage caused by vibration during rapid flipping / rotation of the wafer, which is of great significance for ensuring the yield of high-end wafers.

[0031] In a preferred embodiment of this application, the high-frequency acceleration sensor is a MEMS piezoelectric acceleration sensor, which is fixed to the mounting hole on the side wall of the fixture support near the wafer clamping area by threaded connection or epoxy resin bonding. The sensor sensing direction is perpendicular to the wafer plane and is used to capture vibration signals in the frequency range of 0.1Hz to 10kHz. The adaptive damper is a rotary magnetorheological damper. Two rotary magnetorheological dampers are provided. One rotary magnetorheological damper is located at the connection node between the first crankshaft arm and the second crankshaft arm and is coaxial with the second axis. The other rotary magnetorheological damper is connected to the rotating seat and is coaxial with the third axis.

[0032] In the above scheme, the MEMS piezoelectric accelerometer features high sensitivity and a wide frequency response range (0.1Hz-10kHz), capable of capturing full-spectrum vibrations from low-frequency swaying to high-frequency tremors. The rotary magnetorheological damper has a fast response and adjustable damping force, and is directly integrated on the second and third axes, enabling precise vibration control and improving the dynamic stability of the entire system.

[0033] In a preferred embodiment of this application, an automated control module is also included, comprising an integrated processor and a wireless communication unit; the wireless communication unit is used to receive external control commands, and the integrated processor is configured to parse the commands and control the operating parameters of the adjustment mechanism to achieve remote monitoring and automated sequence execution.

[0034] In the above solution, the integration of a processor and a wireless communication unit enables remote monitoring and automated sequence control of the equipment. Users can send commands via a host computer to execute complex multi-step processes, significantly improving production efficiency. Attached Figure Description

[0035] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0036] Figure 1 This is a front view schematic diagram of a wafer flipping and multi-angle control device in an example.

[0037] Figure 2 for Figure 1 Enlarged view of the structure of section A in the middle;

[0038] Figure 3 This is a schematic diagram of the mating structure between the main support and the clamp support in an example.

[0039] Figure 4 This is a schematic diagram of a wafer fixture in one example;

[0040] Figure 5 This is a side view of a wafer flipping and multi-angle control device in an example.

[0041] Figure 6 A side view of the main support structure of the wafer flipping and multi-angle adjustment device after the first crank arm deflects relative to the second crank arm;

[0042] Figure 7 This is a schematic diagram of the electrical connections between an automated control module and a wafer fixture, adjustment mechanism, wafer inspection unit, radial adjustment device, and dynamic vibration suppression mechanism in an example.

[0043] List of components and reference numerals:

[0044] 1. Main support; 11. Gas flow channel; 12. Groove; 13. Rolling element;

[0045] 2. Fixture bracket; 21. Mating part;

[0046] 3. Wafer fixture, 31. Clamping part, 311. Jaw holder, 312. Jaw, 32. Force sensor, 33. Fixture control unit;

[0047] 4 wafers;

[0048] 5 Adjustment mechanism, 51 First crankshaft arm, 52 Second crankshaft arm, 53 Rotary seat, 54 Hinge shaft, 55 Angle monitoring assembly, 56 Adjustment control unit;

[0049] 61. Dust suction port; 62. LED light ring;

[0050] 7 wafer inspection units;

[0051] 8. Radial adjustment device; 81. Radial drive mechanism; 82. Clamp mounting base;

[0052] 9. Dynamic vibration suppression mechanism; 91. High-frequency acceleration sensor; 92. Adaptive damper;

[0053] 10. Automation control module, 101. Integrated processor, 102. Wireless communication unit. Detailed Implementation

[0054] To more clearly illustrate the overall concept of the present invention, a detailed description will be provided below with reference to the accompanying drawings and examples.

[0055] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0056] like Figures 1-7 As shown, this application provides a wafer flipping and multi-angle adjustment device, which includes a main support 1, a fixture support 2, and an adjustment mechanism 5. The main support 1 provides structural support and a mounting base. The fixture support 2 is rotatably coupled to the main support 1 and is used to mount a wafer fixture 3. The fixture support 2 can rotate relative to the main support 1 about a first axis collinear with the axis of the wafer 4. The adjustment mechanism 5 is connected to the main support 1 and the fixture support 2, and is used to drive the main support 1 to flip about a second axis and rotate about a third axis, the second and third axes being perpendicular to each other.

[0057] In the above scheme, the main support 1 is rotated relative to the first axis by the fixture support 2, and the main support 1 is driven to deflect around the second axis and rotate around the third axis by the adjustment mechanism 5, thus achieving precise flipping and angle control of the wafer 4 in space with multiple degrees of freedom. Furthermore, as a preferred embodiment of this application, multiple wafer fixtures 3 are provided, symmetrically distributed around the first axis as the center of symmetry, and configured to hold the edge or side of the wafer 4, avoiding contact with the front and back surfaces of the wafer 4. This design avoids the contamination or damage that may be caused by traditional fixtures contacting the front and back surfaces of the wafer 4, and is particularly suitable for semiconductor manufacturing processes with extremely high surface cleanliness requirements.

[0058] In one example, refer to Figure 1 and Figure 2 As shown, both the main support 1 and the clamp support 2 adopt a ring structure. The main support 1 is sleeved on the outside of the clamp support 2 and is concentrically arranged with the clamp support 2. A mutually cooperating rotating structure is provided between the main support 1 and the clamp support 2 so that the clamp support 2 can rotate relative to the main support 1. In an optional embodiment, refer to... Figure 3 As shown, a groove 12 is formed on the annular inner wall of the main support 1, and a mating part 21 corresponding to the groove 12 is provided on the annular outer wall of the fixture support 2. The mating part 21 extends into the groove 12 and engages with the groove 12 to achieve axial positioning of the fixture support 2 and the main support 1. Preferably, rolling elements 13 such as balls or needle rollers are also provided between the mating surfaces of the mating part 21 and the groove 12 to convert the sliding friction between the two mating surfaces into rolling friction, thereby reducing the resistance to rotation of the fixture support 2 relative to the main support 1, and also reducing friction loss, ensuring the stability and fitting accuracy of the mating structure between the fixture support 2 and the main support 1. More preferably, the above-mentioned mating part 21 and / or groove 12 structure is made of self-lubricating material or has a coating of lubricating material on its surface, thereby eliminating the need for lubricating oil, grease or other lubricants and avoiding the diffusion and contamination of the wafer 4 by lubricating oil or grease.

[0059] It should be noted that the above examples are only preferred examples of this application. The structure of the main support 1 and the clamp support 2, as well as the cooperation structure and cooperation method between them, are not limited to the above examples. They can also adopt more different structures and cooperation methods than the above examples, such as adopting a magnetic levitation cooperation structure. This application does not make specific limitations on this.

[0060] It should also be noted that this application does not specifically limit the driving method and structure for the rotation of the clamp bracket 2 relative to the main support 1. It can be a manually adjusted driving method, or it can use a motor with a drive gear on the main support 1, with a gear tooth structure integrated on the outer wall of the clamp bracket 2, driving the clamp bracket 2 to rotate relative to the main support 1 through meshing transmission. Many other different driving methods and structures can also be used. Similarly, this application does not specifically limit the limiting structure after the clamp bracket 2 has rotated to its position relative to the main support 1. It can achieve self-locking through the aforementioned motor gear drive structure, or it can use pawls or other limiting components on the main support 1 to clamp the clamp bracket 2 and fix it after it has rotated to its position. Of course, many other different limiting methods and structures can also be used.

[0061] Furthermore, referring to Figure 1 , Figure 4 and Figure 5 As shown, the adjustment mechanism 5 includes a crankshaft connecting rod mechanism and a rotating seat 53. The crankshaft connecting rod mechanism includes a first crankshaft arm 51 and a second crankshaft arm 52. One end of the first crankshaft arm 51 is connected to the main support 1, and the other end of the first crankshaft arm 51 is rotatably connected to the second crankshaft arm 52. The end of the second crankshaft arm 52 away from the first crankshaft arm 51 is connected to the rotating seat 53. The first crankshaft arm 51 drives the main support 1 to rotate relative to the second crankshaft arm 52 around a second axis. The rotating seat 53 drives the second crankshaft arm 52, the first crankshaft arm 51, and the main support 1 to rotate around a third axis. In one example, refer to... Figure 1 , Figure 4 and Figure 5 As shown, the first crankshaft arm 51 and the second crankshaft arm 52 are rotatably connected by a hinge shaft 54 ​​coaxial with the second axis. Preferably, the hinge shaft 54 ​​has an installation space and a built-in micro motor. The micro motor drives the first crankshaft arm 51 to deflect relative to the second crankshaft arm 52. The rotating seat 53 has a built-in drive motor that is in transmission cooperation with the second crankshaft arm 52, driving the second crankshaft arm 52 and causing the first crankshaft arm 51, the main support 1, the fixture support 2, and the wafer fixture 3 to rotate as a whole around the third axis. It should also be noted that the driving method and driving structure of the first crankshaft arm 51 and the second crankshaft arm 52 in this application are not limited to the above example. The above example is only a preferred example of this application. Other different existing mature driving methods and driving structures can also be used, and this application does not make specific limitations on them.

[0062] In a preferred embodiment of this application, the adjustment mechanism 5 further includes an angle monitoring component 55 and an adjustment control unit 56. The angle monitoring component 55 is used to provide real-time feedback on the deflection angle of the first crankshaft arm 51 relative to the second crankshaft arm 52 and the rotation angle of the rotating seat 53. The adjustment control unit 56 is connected to the angle monitoring component 55, the crankshaft connecting rod mechanism, and the rotating seat 53, and is configured to automatically adjust the deflection angle of the first crankshaft arm 51 relative to the second crankshaft arm 52 and the rotation angle of the rotating seat 53 based on the feedback signal from the angle monitoring component 55. Preferably, the angle monitoring component 55 is an angle encoder, with each of the first crankshaft arm 51 and the second crankshaft arm 52 connected to an angle encoder. The angle encoders monitor and record the deflection angle of the first crankshaft arm 51 relative to the second crankshaft arm 52 and the rotation angle of the rotating seat 53. The adjustment control unit 56 is preferably a microprocessor connected to the angle encoder and the aforementioned micro motor and drive motor used to drive the first crankshaft arm 51 and the rotating seat 53.

[0063] In the above scheme, the combination of crankshaft connecting rod mechanism realizes complex flipping and rotational movements with a compact structure. The introduction of angle monitoring component 55 and adjustment control unit 56 realizes closed-loop feedback control of the motion process, which can correct angle deviations in real time, significantly improving the accuracy and repeatability of wafer 4 positioning, and laying the foundation for automated production.

[0064] In a preferred embodiment of this application, the wafer jig 3 includes a clamping part 31 and a force sensor 32 connected to the clamping part 31. The force sensor 32 is integrated into the contact surface between the clamping part 31 and the wafer 4, and is used to monitor the clamping force applied by the clamping part 31 to the wafer 4 in real time. In one example, refer to... Figure 4 As shown, the clamping part 31 includes a claw seat 311 and two claws 312 connected to the end of the claw seat 311. Along the axis of the wafer 4, claw 312 clearance grooves are provided on both sides of the end of the claw seat 311. The two claws 312 are rotatably connected to their corresponding claw 312 clearance grooves and can rotate relative to the claw 312 clearance grooves. The two claws 312 deflect towards each other to clamp the wafer 4 and deflect away from each other to release the wafer 4. The clamping and releasing of the wafer 4 is achieved through the cooperative movement of the two claws 312. It should be noted that this application does not specifically limit the driving method and driving structure of the two grippers 312. The two grippers 312 can be driven by a micro motor or by a micro hydraulic cylinder / pneumatic cylinder / electric cylinder or electric actuator. In practical applications, micro motors or micro electric cylinders and micro electric actuators are preferred to avoid hydraulic oil or gas leakage from contaminating the wafer 4. Moreover, the application of micro motors and micro electric cylinders is mature and easy to install. Of course, in practical applications, the installation method and installation structure can be adaptively adjusted according to actual installation needs or process limitations.

[0065] In a preferred embodiment of this application, a clamp control unit 33 is also included. The clamp control unit 33 is connected to both the clamping part 31 and the force sensor 32, and is configured to automatically adjust the opening and closing force of the clamping part 31 based on the feedback signal from the force sensor 32. Preferably, the clamp control unit 33 is a microprocessor connected to both the force sensor 32 and the aforementioned clamp driving structure such as a micro motor / micro electric cylinder / micro electric actuator for driving the gripper 312.

[0066] In the above solution, by integrating a force sensor 32 and connecting it to a fixture control unit 33, real-time monitoring and adaptive adjustment of the clamping force are achieved. This effectively prevents the wafer 4 from slipping due to insufficient clamping force, or from developing stress cracks or hidden damage at the edge of the wafer 4 due to excessive clamping force, making it particularly suitable for processing ultra-thin wafers 4.

[0067] As a preferred embodiment of this application, a modular cleaning accessory is also included. The cleaning accessory includes a dust suction port 61 and an LED light ring 62. The dust suction port 61 is connected to an external fan via a pipe, and the LED light ring 62 is arranged around the dust suction port 61. Preferably, the dust suction port 61 and the LED light ring 62 are detachably mounted on the main support 1 for simultaneously removing dust from the surface of the wafer 4 and providing illumination during the flipping process. Meanwhile, to prevent the aforementioned pipes from getting tangled on the main support 1 or adjustment mechanism 5 during the flipping process, in a preferred embodiment of this application, the main support 1 has a built-in gas flow channel 11, and the outer walls of the first crankshaft arm 51 and the second crankshaft arm 52 are provided with binding points for fixing the external connecting pipes. One end of the external connecting pipe is connected to the gas flow channel 11, and the other end is connected to an external fan. Simultaneously, the end of the external connecting pipe closest to the gas flow channel 11 is bound and fixed to the first crankshaft arm 51 and the second crankshaft arm 52. Sufficient space is reserved between the first crankshaft arm 51 and the second crankshaft arm 52 to allow for the first crankshaft arm 51 to deflect, and sufficient space is reserved between the second crankshaft arm 52 / rotating seat 53 and the external fan to allow for the second crankshaft arm 52 / rotating seat 53 to rotate, thereby preventing the pipes from getting tangled and affecting the operation of the adjustment mechanism 5. In the above solution, the flipping operation is integrated with online cleaning and lighting functions. The dust extraction port 61 can simultaneously remove dust during operation, reducing the number of times the wafer 4 is transferred and exposed, and lowering the risk of contamination. The LED light ring 62 provides good illumination, facilitating visual inspection or monitoring, and improving operational convenience and quality control. Preferably, the dust suction port 61 is designed with a porous structure; the color temperature of the LED light ring 62 is adjustable, ranging from 3000K to 6000K.

[0068] In the above design, the porous suction port 61 allows for more even suction distribution, improving cleaning performance. The color-temperature adjustable LED light ring 62 allows for the provision of optimal lighting conditions according to different process requirements or testing content, enhancing the applicability and testing accuracy of the device.

[0069] In a preferred embodiment, the wafer 4 flipping and multi-angle adjustment device of this application further includes a wafer 4 detection device and a radial adjustment device 8. The wafer 4 detection device is mounted on the main support 1 or the fixture support 2 and points towards the wafer 4 clamping area. It is used for non-contact measurement of the thickness and diameter of the wafer 4. The radial adjustment device 8 is linked with the wafer fixture 3 and is configured to dynamically adjust the radial position of the wafer fixture 3 on the fixture support 2 based on the wafer 4 diameter data measured by the wafer 4 detection device. Preferably, the wafer detection unit 7 uses a laser triangulation sensor, which is mounted on the main support 1 and points towards the wafer 4 clamping area. The radial adjustment device 8 includes multiple fixture mounting seats 82 and radial drive mechanisms 81 corresponding to the fixture mounting seats 82. The fixture mounting seats 82 are used to mount the wafer fixture 3. The radial drive mechanisms 81 are connected to the fixture support 2 and the fixture mounting seats 82 respectively, and are used to drive the fixture mounting seats 82 to move the wafer fixture 3 radially relative to the fixture support 2 along the wafer 4. It should be noted that this application does not specifically limit the type and installation structure of the radial drive mechanism 81. It can be a miniature electric actuator or other different drive devices or drive structures.

[0070] In the above scheme, the non-contact measurement of the wafer 4 inspection device avoids contact damage and can quickly obtain the key dimensional parameters of the wafer 4. The radial adjustment device 8 is linked to it, and its core function is to automatically adapt to wafers 4 of different diameters, realizing automatic adjustment of the fixture position, improving the flexibility and intelligence of the equipment, and reducing changeover and debugging time. Through the setting of the fixture mounting base 82 and the radial drive mechanism 81, each wafer fixture 3 can be independently or synchronously precision driven, ensuring that the wafer 4 is accurately aligned and stably clamped, guaranteeing the uniformity of subsequent processes.

[0071] In a preferred embodiment of this application, a dynamic vibration suppression mechanism 9 is also included. The dynamic vibration suppression mechanism 9 includes a high-frequency acceleration sensor 91 and an adaptive damper 92. The high-frequency acceleration sensor 91 is located on the fixture support 2 near the clamping area of ​​the wafer 4, and is used to capture the resonance frequency and amplitude generated by the wafer 4 during flipping and rotation in real time. The adaptive damper 92 is installed at the connection node between the first crankshaft arm 51 and the second crankshaft arm 52 and on the rotating seat 53. It is configured to generate a reverse force opposite to the vibration phase based on the feedback signal from the high-frequency acceleration sensor 91, actively suppressing mechanical resonance to avoid edge chipping or hidden damage to the wafer 4 due to vibration impact. By capturing the resonance signal in real time with the high-frequency acceleration sensor 91 and generating a reverse force with the adaptive damper 92, mechanical vibration can be actively and effectively suppressed. This directly avoids edge chipping or internal micro-damage to the wafer 4 caused by vibration during rapid flipping / rotation, which is of great significance for ensuring the yield of high-end wafers 4.

[0072] In a preferred embodiment of this application, the high-frequency accelerometer 91 is a MEMS piezoelectric accelerometer, which is fixed to the mounting hole on the side wall of the fixture bracket 2 near the clamping area of ​​the wafer 4 by threaded connection or epoxy resin bonding. The sensor sensing direction is perpendicular to the plane of the wafer 4, and it is used to capture vibration signals in the frequency range of 0.1Hz to 10kHz. The adaptive damper 92 is a rotary magnetorheological damper. Two rotary magnetorheological dampers are provided. One rotary magnetorheological damper is located at the connection node between the first crankshaft arm 51 and the second crankshaft arm 52 and is coaxial with the second axis. The other rotary magnetorheological damper is connected to the rotating seat 53 and is coaxial with the third axis. The MEMS piezoelectric accelerometer has the characteristics of high sensitivity and wide frequency response range (0.1Hz-10kHz), and can capture full-spectrum vibrations from low-frequency swaying to high-frequency tremors. Rotary magnetorheological dampers offer fast response and adjustable damping force. They are directly integrated onto the second and third axes, enabling precise vibration control and improving the dynamic stability of the entire system.

[0073] In a preferred embodiment of this application, an automation control module 10 is also included, comprising a processor 101 and a wireless communication unit 102. The wireless communication unit 102 receives external control commands, and the processor 101 is configured to parse the commands and control the operating parameters of the adjustment mechanism 5, thereby achieving remote monitoring and automated sequence execution. Through the processor 101 and the wireless communication unit 102, the possibility of remote monitoring and automated sequence control of the device is realized. Users can send commands through a host computer to execute complex multi-step processes, greatly improving production efficiency.

[0074] The technical solutions protected by this invention are not limited to the above embodiments. It should be noted that any combination of the technical solutions of any embodiment with one or more other embodiments is within the protection scope of this invention. Although the invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of this invention are within the scope of protection claimed by this invention.

Claims

1. A wafer flipping and multi-angle control device, characterized in that, include: The main support frame provides structural support and installation foundation; A fixture support for mounting a wafer fixture, the fixture support being rotatably engaged with the main support, and the fixture support being rotatable relative to the main support about a first axis collinear with the wafer axis; The wafer clamps are provided in multiple ways, and the multiple wafer clamps are symmetrically distributed with the first axis as the center of symmetry. The wafer clamps are configured to clamp the edge or side of the wafer to avoid contact with the front and back of the wafer. An adjustment mechanism is connected to the main support and the clamp support, and is used to drive the main support to flip around a second axis and rotate around a third axis, wherein the second axis and the third axis are perpendicular to each other; The adjustment mechanism includes a crankshaft connecting rod mechanism and a rotating seat. The crankshaft connecting rod mechanism includes a first crankshaft arm and a second crankshaft arm. One end of the first crankshaft arm is connected to the main body support, and the other end of the first crankshaft arm is rotatably connected to the second crankshaft arm. The end of the second crankshaft arm away from the first crankshaft arm is connected to the rotating seat. The first crankshaft arm drives the main body support to rotate relative to the second crankshaft arm around the second axis, and drives the rotating seat to drive the second crankshaft arm, the first crankshaft arm, and the main body support to rotate around the third axis. The adjustment mechanism further includes an angle monitoring component and an adjustment control unit. The angle monitoring component is used to provide real-time feedback on the deflection angle of the first crankshaft arm relative to the second crankshaft arm and the rotation angle of the rotating seat. The adjustment control unit is connected to the angle monitoring component, the crankshaft connecting rod mechanism and the rotating seat respectively, and is configured to automatically adjust the deflection angle of the first crankshaft arm relative to the second crankshaft arm and the rotation angle of the rotating seat based on the feedback signal of the angle monitoring component. The wafer jig includes a clamping part and a force sensor connected to the clamping part. The force sensor is integrated into the contact surface between the clamping part and the wafer and is used to monitor the clamping force applied by the clamping part to the wafer in real time. It also includes a clamp control unit, which is connected to the clamping part and the force sensor respectively, and is configured to automatically adjust the opening and closing force of the clamping part based on the feedback signal of the force sensor; It also includes a dynamic vibration suppression mechanism, which includes a high-frequency acceleration sensor and an adaptive damper. The high-frequency acceleration sensor is located on the fixture support near the wafer clamping area and is used to capture the resonance frequency and amplitude generated by the wafer during flipping and rotation in real time. The adaptive damper is installed at the connection node between the first crankshaft arm and the second crankshaft arm and the rotating seat. It is configured to generate a reverse force opposite to the vibration phase based on the feedback signal of the high-frequency acceleration sensor, and actively suppress mechanical resonance to avoid edge chipping or hidden damage to the wafer due to vibration impact.

2. The wafer flipping and multi-angle control device according to claim 1, characterized in that, It also includes modular cleaning accessories, which include a dust suction port and an LED light ring. The dust suction port is connected to an external fan via a pipe, and the LED light ring is arranged around the dust suction port. The dust suction port and the LED light ring are detachably mounted on the main support for simultaneously removing dust from the wafer surface and providing illumination during the flipping process.

3. The wafer flipping and multi-angle control device according to claim 2, characterized in that, The suction port is designed with a porous structure; the color temperature of the LED light ring is adjustable, ranging from 3000K to 6000K.

4. The wafer flipping and multi-angle control device according to claim 1, characterized in that, It also includes a wafer inspection device and a radial adjustment device. The wafer inspection device is mounted on the main support or the fixture support and points towards the wafer clamping area. It is used for non-contact measurement of the thickness and diameter of the wafer. The radial adjustment device is linked to the wafer fixture and is configured to dynamically adjust the radial position of the wafer fixture on the fixture support based on the wafer diameter data measured by the wafer inspection device.

5. The wafer flipping and multi-angle control device according to claim 4, characterized in that, The radial adjustment device includes multiple clamp mounting seats and radial drive mechanisms corresponding to the clamp mounting seats. The clamp mounting seats are used to mount the wafer fixture. The radial drive mechanisms are connected to the clamp support and the clamp mounting seats respectively, and are used to drive the clamp mounting seats to move the wafer fixture relative to the clamp support along the wafer radial direction.

6. The wafer flipping and multi-angle control device according to claim 1, characterized in that, The high-frequency acceleration sensor is a MEMS piezoelectric acceleration sensor, which is fixed to the mounting hole on the side wall of the fixture support near the wafer clamping area by threaded connection or epoxy resin bonding. The sensor sensing direction is perpendicular to the wafer plane and is used to capture vibration signals in the frequency range of 0.1Hz to 10kHz. The adaptive damper is a rotary magnetorheological damper. Two rotary magnetorheological dampers are provided. One rotary magnetorheological damper is located at the connection node between the first crankshaft arm and the second crankshaft arm and is coaxial with the second axis. The other rotary magnetorheological damper is connected to the rotating seat and is coaxial with the third axis.

7. The wafer flipping and multi-angle control device according to claim 1, characterized in that, It also includes an automation control module, comprising a comprehensive processor and a wireless communication unit; the wireless communication unit is used to receive external control commands, and the comprehensive processor is configured to parse the commands and control the operating parameters of the adjustment mechanism to achieve remote monitoring and automated sequence execution.

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