Display panel, preparation method thereof and display device

Abstract

A display panel includes: a driving substrate; the isolation structure layer is arranged on the driving substrate, and a plurality of first openings are defined by the isolation structure layer; a plurality of light-emitting devices, wherein one light-emitting device is arranged corresponding to one first opening; the light-emitting device comprises an anode, a light-emitting part and a cathode which are sequentially stacked in the direction away from the driving substrate, and the cathode is electrically connected with the isolation structure layer; the insulating layer is arranged on one side, far away from the driving substrate, of the isolation structure layer, the insulating layer is provided with a plurality of through holes, and the plurality of through holes are used for exposing the surface, far away from the driving substrate, of the isolation structure layer; the auxiliary electrode layer is arranged on the side, away from the isolation structure layer, of the insulation layer, the auxiliary electrode layer is in electric contact with the surface, exposed by the through holes, of the isolation structure layer, and the auxiliary electrode layer is made of a transparent conductive material.

Description

Display panel, preparation method thereof and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display technology is a technology that uses light-emitting materials to emit light under the drive of current to realize display. OLED display has the advantages of ultra-light, ultra-thin, high brightness, wide viewing angle, low voltage, low power consumption, fast response, high definition, shock resistance, bendable, low cost, simple process, less use of raw materials, high luminous efficiency, wide temperature range, etc.

[0003] SUMMARY

[0004] In one aspect, a display panel is provided. The display panel includes a driving substrate, an isolation structure layer, a plurality of light-emitting devices, an insulating layer, and an auxiliary electrode layer. The isolation structure layer is disposed on the driving substrate, and the isolation structure layer defines a plurality of first openings. One of the light-emitting devices is disposed corresponding to one of the first openings; the light-emitting device includes an anode, a light-emitting part, and a cathode which are sequentially stacked in a direction away from the driving substrate, and the cathode is electrically connected to the isolation structure layer. The insulating layer is disposed on a side of the isolation structure layer away from the driving substrate, and the insulating layer has a plurality of through holes for exposing a surface of the isolation structure layer away from the driving substrate. The auxiliary electrode layer is disposed on a side of the insulating layer away from the isolation structure layer, the auxiliary electrode layer is in electrical contact with the surface of the isolation structure layer exposed by the plurality of through holes, and the auxiliary electrode layer is made of a transparent conductive material.

[0005] In some embodiments, the insulating layer includes a plurality of insulating parts which are disconnected from each other, one of the insulating parts is located in one of the first openings, and edges of the insulating parts are overlapped on the side of the isolation structure layer away from the driving substrate, and gaps are formed between adjacent insulating parts, and the gaps form the through holes.

[0006] In some embodiments, in a direction perpendicular to a thickness direction of the display panel, a width of the through hole is equal to or approximately equal to a distance between two ends of any adjacent two first openings of the isolation structure layer away from the driving substrate.

[0007] In some embodiments, the display panel further comprises a pixel defining layer disposed on the driving substrate, the pixel defining layer defines a plurality of second openings, one second opening corresponds to one anode; the pixel defining layer further has a recess, the isolation structure layer is disposed in the recess.

[0008] In some embodiments, the display panel further comprises a pad layer disposed at the bottom of the recess, the isolation structure layer is disposed on the side of the pad layer away from the driving substrate.

[0009] In some embodiments, the material of the pad layer comprises an organic material, and the material of the pixel defining layer comprises an inorganic material.

[0010] In some embodiments, the pad layer comprises a first sub-portion, the first sub-portion covers the bottom wall of the recess.

[0011] In some embodiments, the pad layer further comprises a second sub-portion connected to the first sub-portion, the second sub-portion covers the side wall of the recess.

[0012] In some embodiments, the distance from the surface of the driving substrate away from the first sub-portion to the driving substrate is less than the distance from the surface of the driving substrate away from the pixel defining layer to the driving substrate.

[0013] In some embodiments, the distance from the surface of the driving substrate away from the isolation structure layer to the driving substrate is greater than or equal to the distance from the surface of the driving substrate away from the pixel defining layer to the driving substrate.

[0014] In some embodiments, the ratio of the distance from the surface of the driving substrate away from the first sub-portion to the driving substrate to the distance from the surface of the driving substrate away from the pixel defining layer to the driving substrate is greater than or equal to 0.5 and less than 1.

[0015] In some embodiments, the recess is disposed around the light emitting device.

[0016] In some embodiments, the recess penetrates the pixel defining layer in a direction perpendicular to the driving substrate; or, the bottom wall of the recess is located inside the pixel defining layer, and the slot of the recess faces away from the driving substrate.

[0017] In some embodiments, the display panel further comprises an encapsulation structure disposed on the side of the auxiliary electrode layer away from the driving substrate, the encapsulation structure comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are sequentially stacked in a direction away from the driving substrate; and a touch structure layer disposed on the side of the encapsulation structure away from the auxiliary electrode layer.

[0018] In another aspect, a method for manufacturing a display panel is provided. The method includes: forming an isolation structure layer and a plurality of light emitting devices on a driving substrate; the isolation structure layer has a plurality of first openings, one of the light emitting devices is disposed in one of the first openings, the light emitting device includes an anode, a light emitting part and a cathode which are sequentially stacked in a direction away from the driving substrate, the cathode is electrically connected with the isolation structure layer; forming an insulating layer on a side of the isolation structure layer away from the driving substrate, the insulating layer has a plurality of through holes, the plurality of through holes expose a surface of the isolation structure layer away from the driving substrate; forming an auxiliary electrode layer on a side of the insulating layer away from the isolation structure layer, the auxiliary electrode layer is in electrical contact with the surface of the isolation structure layer exposed by the plurality of through holes, and the auxiliary electrode layer is light-transmissive.

[0019] In some embodiments, before forming the isolation structure layer on the driving substrate, the method further includes: forming a pixel defining film on the driving substrate; etching the pixel defining film to form a groove; forming a pad layer on a bottom of the groove.

[0020] In some embodiments, forming the isolation structure layer includes: forming an isolation structure film on the pixel defining film; etching the isolation structure film to form the isolation structure layer having the plurality of first openings, the first openings expose part of the pixel defining film; etching the pixel defining film through the first openings to form a pixel defining layer having a plurality of second openings, one of the second openings is in communication with one of the first openings.

[0021] In some embodiments, the plurality of second openings includes a first sub-pixel opening and a second sub-pixel opening; forming the light emitting device and forming the insulating layer includes: forming a first laminated film covering the pixel defining layer and the isolation structure layer, the first laminated film including a first light emitting material film, a cathode film and an insulating material film sequentially stacked in a direction away from the driving substrate; etching the first laminated film to form a first light emitting part, a first cathode and a first insulating part in the first sub-pixel opening and the first opening penetrating therethrough, an edge of the first insulating part being overlapped on a side of the isolation structure layer away from the driving substrate; forming a second laminated film covering the pixel defining layer and the isolation structure layer, the second laminated film including a second light emitting material film, a cathode film and an insulating material film sequentially stacked in a direction away from the driving substrate; etching the second laminated film to form a second light emitting part, a second cathode and a second insulating part in the second sub-pixel opening and the first opening penetrating therethrough, an edge of the second insulating part being overlapped on the side of the isolation structure layer away from the driving substrate; etching the first insulating part and the second insulating part overlapped on the side of the isolation structure layer away from the driving substrate to form the through hole.

[0022] In another aspect, a display device is provided. The display device includes the display module as described in any of the above embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings described in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, etc. of the products involved in the embodiments of the present disclosure.

[0024] FIG. 1 is a structural diagram of a display device according to some embodiments;

[0025] FIG. 2 is a structural diagram of a display panel according to some embodiments;

[0026] FIG. 3 is a structural diagram of another display panel according to some embodiments;

[0027] FIG. 4 is a structural diagram of another display panel according to some embodiments;

[0028] FIG. 5 is a structural diagram of another display panel according to some embodiments;

[0029] FIG. 6 is a structural diagram of another display panel according to some embodiments;

[0030] FIG. 7 is a structural diagram of yet another display panel according to some embodiments;

[0031] FIG. 8 is a flowchart of a method for manufacturing a display panel according to some embodiments;

[0032] FIGS. 9-23 are structural diagrams of screenshots corresponding to respective steps in a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION

[0033] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0034] Unless otherwise required by context, the term “comprise” and other forms of the term “comprise”, such as “comprises” and “comprising”, are to be construed as open, inclusive, meaning that “comprising” means “including, but not limited to”. In the description of the specification, the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “example”, “specific example” or “some examples” are intended to mean that the specific features, structures, materials or characteristics related to the embodiment or example include in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0035] Hereinafter, the terms “first” and “second” are used only for descriptive purposes, and cannot be understood to indicate or imply relative importance or implicitly indicate the number of the indicated technical features. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of “a plurality of” is two or more.

[0036] In describing some embodiments, "coupled" and "connected," along with their derivatives, can be used. It should be understood that these terms are not intended as synonyms for each other. Rather, "connected" can be used to indicate that two or more elements are in direct physical or electrical contact with each other. "Coupled" can be used to indicate that two or more elements are in either physical or electrical contact with each other, even at a distance. As will be apparent, "coupled" can also be used to indicate that two or more elements cooperate or interact with each other to

[0037] "at least one of A, B, and C" has the same meaning as "at least one of A, B, or C" and includes the following combinations: only A, only B, only C, A and B, A and C, B and C, and A and B and C.

[0038] "A and / or B" includes the following combinations: A alone, B alone, and A and B together.

[0039] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate or intervening layers can also be present.

[0040] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized illustrations. In the interest of clarity, not all of the scale of the layers and regions can be shown in the drawings, and the dimensions of the layers and regions can be exaggerated relative to each other. Accordingly, the exemplary embodiments are not intended to be limited to the precise shapes and configurations shown in the drawings, but rather are intended to include all modifications and variations that would be apparent to one skilled in the art upon reading this description. For example, the shapes and configurations of the regions shown in the drawings are intended to be illustrative and not limiting of the shapes and configurations of the regions that can be used in the exemplary embodiments. The shapes and configurations of the regions shown in the drawings are not intended to be limiting of the shapes and configurations of the regions that can be used in the exemplary embodiments, and are not intended to limit the scope of the exemplary embodiments.

[0041] Some embodiments of the present disclosure provide a display device, which can be any display device displaying images whether moving (e.g., video) or fixed (e.g., still image) and whether text or graphics. More specifically, it is contemplated that the display device of the embodiments can be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projections, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry) and the like.

[0042] FIG. 1 is a structural diagram of a display device according to some embodiments. As shown in FIG. 1, the display device 1000 includes a frame 100, a cover plate 200, a display panel 300, a circuit board 400, and other electronic components including a camera.

[0043] The longitudinal section of the frame 100 is in a U shape, the display panel 300, the circuit board 400, and other electronic components including a camera are arranged in the frame 100, the circuit board 400 is located between the display panel 300 and the frame 100, and the cover plate 200 is located on the light-out side of the display panel 300. The side of the display panel 300 for displaying images is the light-out side of the display panel 300, and the side of the display panel 300 facing away from the light-out side of the display panel 300 is the non-light-out side of the display panel 300.

[0044] For example, the circuit board 400 is located on the non-light-out side of the display panel 300, and the circuit board 400 is electrically connected to the display panel 300. The circuit board 400 is configured to provide driving signals for the display panel 300, thereby ensuring normal display of the display panel 300.

[0045] Exemplarily, the display panel 300 can be an organic light emitting diode (OLED) display panel, a quantum dot light emitting diodes (QLED) display panel, a micro light emitting diodes (Micro LED) display panel, a mini light emitting diodes (Mini LED) display panel, or the like, which are not limited in the present disclosure. Some embodiments of the present disclosure will be described illustratively below taking the display panel 300 as an OLED display panel.

[0046] In some examples, as shown in FIG. 2, the display panel 300 includes a driving substrate 1 and a plurality of light emitting devices 2.

[0047] Exemplarily, as shown in FIG. 2, the driving substrate 1 includes a substrate 11 and a circuit structure layer 12 which are sequentially stacked.

[0048] The type of the substrate 11 includes various types, which can be selected according to actual needs.

[0049] Exemplarily, the substrate 11 can be a rigid substrate. The rigid substrate can be a glass substrate or a polymethyl methacrylate (PMMA) substrate, or the like.

[0050] Exemplarily, the substrate 11 can be a flexible substrate. The flexible substrate can be a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate two formic acid glycol ester (PEN) substrate, or a polyimide (PI) substrate, or the like. At this time, the display panel 300 can realize flexible display, for example.

[0051] Optionally, the substrate 11 can be formed as a single layer, a double layer, or a multi-layer, which is not limited in the embodiments of the present disclosure.

[0052] Exemplarily, the circuit structure layer 12 is disposed on the substrate 11. It can be understood that the circuit structure layer 12 refers to a film layer where a plurality of pixel driving circuit arrays are located, including a plurality of patterned conductive layers and insulating layers. Exemplarily, the circuit structure layer 12 includes a plurality of pixel driving circuits 120 and a plurality of signal lines, and the like.

[0053] The pixel driving circuit 120 is generally composed of electronic devices such as thin film transistors (TFT), capacitors, etc. For example, the pixel driving circuit 120 can specifically be of a structure of “2T1C”, “6T1C”, “7T1C”, “6T2C”, or “7T2C”, etc. Here, “T” represents a transistor, for example, a thin film transistor. The number before “T” represents the number of transistors. “C” represents a capacitor, and the number before “C” represents the number of capacitors. In the drawings of some embodiments of the present disclosure, only one thin film transistor 121 is schematically shown. For example, the thin film transistor 121 can be a driving transistor.

[0054] It can be understood that the thin film transistor 121 included in the pixel driving circuit 120 can be a top-gate thin film transistor or a bottom-gate thin film transistor, and the embodiments of the present disclosure do not limit this. For example, the thin film transistor 121 shown in FIG. 2 is a bottom-gate thin film transistor.

[0055] As shown in FIG. 2, the light emitting device 2 is located on the driving substrate 1.

[0056] The light emitting device 2 and the pixel driving circuit 120 are electrically connected. The pixel driving circuit 120 can provide a driving signal for the light emitting device 2 to drive the light emitting device 2 to emit light.

[0057] For example, the light emitting device 2 and the pixel driving circuit 120 can be electrically connected in various manners, which can be selected and arranged according to actual needs, and the present disclosure does not limit this.

[0058] For example, the plurality of pixel driving circuits 120 and the plurality of light emitting devices 2 can be one-to-one coupled. For another example, one pixel driving circuit 120 can be coupled with a plurality of light emitting devices 2. For another example, a plurality of pixel driving circuits 120 can be coupled with one light emitting device 2.

[0059] Hereinafter, the present disclosure will take one pixel driving circuit 120 coupled with one light emitting device 2 as an example to schematically describe the structure of the display panel 300.

[0060] For example, in the display panel 300, the pixel driving circuit 120 can generate a driving signal, each light emitting device 2 can emit light under the driving action of the driving signal generated by the corresponding pixel driving circuit 120, and the light emitted by the plurality of light emitting devices 2 cooperates with each other, so that the display panel 300 realizes image display.

[0061] For example, the light emitting device 2 described above can be an OLED light emitting device.

[0062] As shown in FIG. 2, the light emitting device 2 includes an anode 201, a light emitting part 202, and a cathode 203 which are sequentially stacked in a direction away from the driving substrate 1. Among them, the anode 201 is electrically connected to the drain of the thin film transistor 121 used as the driving transistor in the pixel driving circuit 120.

[0063] In some examples, the light emitting part 202 can include an electroluminescent (EL) layer. In other examples, the light emitting part 202 further includes one or more of an election transporting layer (ETL), an election injection layer (EIL), a hole transporting layer (HTL), and a hole injection layer (HIL) in addition to the EL layer. In the case where the display panel 300 is an organic electroluminescent display substrate, the EL layer is an organic EL layer. In the case where the display panel 300 is a quantum dot electroluminescent display substrate, the EL layer is a quantum dot EL layer.

[0064] In some implementations, in the preparation process of the light emitting device 2, a fine metal mask (FMM) technology is used to form the light emitting part 202 of the light emitting device 2 by a vapor deposition process.

[0065] Specifically, in the process of vapor deposition to form the light emitting part 202 of the light emitting device 2, the display panel to be vapor deposited and the FMM first need to be aligned. After the alignment is completed, the opening area on the FMM exposes a sub-pixel of a certain color. The light emitting part material of the light emitting device 2 in the sub-pixel of the corresponding color is deposited in the area of the sub-pixel by vapor deposition or inkjet printing. At the same time, the remaining color sub-pixels are shielded by the shielding area on the FMM, so that the deposition of the light emitting part material of the light emitting device 2 in the sub-pixels of each color is sequentially completed. The display panel 300 includes sub-pixels of multiple colors, and the light emitting devices 2 in the sub-pixels of different colors can emit light of different colors. The materials of the light emitting parts 202 of the light emitting devices 2 emitting light of different colors are different, so the light emitting parts 202 of the light emitting devices 2 emitting light of different colors need to be formed separately. In the process of forming the light emitting parts 202 of the multiple light emitting devices 2 by vapor deposition through the FMM, multiple alignments are required.

[0066] Furthermore, as mentioned above, the area of ​​a subpixel is directly limited by the size of the FMM (Fiber to the Machine) opening. As PPI requirements gradually increase, the area of ​​a single subpixel gradually decreases, and the opening on the FMM must also be correspondingly reduced, leading to a series of problems with the FMM: for example, smaller openings increase the difficulty of mask fabrication and cleaning, mainly due to increased difficulty in processes such as sagging, tensioning, and welding; during use, the alignment between the vapor-deposited display panel and the FMM becomes more difficult, and the expansion problem becomes more severe, causing serious color mixing in OLED display devices when pursuing high PPI display effects, resulting in reduced production yield and increased costs.

[0067] Furthermore, before forming the light-emitting part 202 using FMM evaporation, the FMM needs to be positioned and fixed on the frame using a screen stretching machine. Due to the possible mismatch between the force applied to the frame by the screen stretching machine and the tension of the FMM on the frame, the overall dimensional accuracy (TP) of the FMM will deteriorate, which in turn will affect the pixel position accuracy (PPA) of each sub-pixel.

[0068] Based on this, in the embodiments of this disclosure, as shown in FIG3, the display panel 300 further includes an isolation structure layer 3. The isolation structure layer 3 is disposed on the driving substrate 1, and the isolation structure layer 3 defines a plurality of first openings 31. A light-emitting device 2 is disposed within one of the first openings 31. The cathode 203 of the light-emitting device 2 is electrically connected to the isolation structure layer 3.

[0069] For example, the isolation structure layer 3 can be a stacked structure of metallic materials. The metallic material can be a pure metal or a metal compound. Metallic materials include titanium (Ti), aluminum (Al), molybdenum (Mo), or other ferrous metals. For instance, the isolation structure layer 3 can be a Ti / Al / Ti stacked structure. As another example, the isolation structure layer 3 can be a Mo / Al / Mo stacked structure.

[0070] For example, as shown in Figure 3, the isolation structure layer 3 includes a first sublayer 301, a second sublayer 302, and a third sublayer 303, which are sequentially stacked along a direction away from the driving substrate 1. The first sublayer 301 and the third sublayer 303 can be made of titanium (Ti), and the second sublayer 302 can be made of aluminum (Al). The cross-sectional shape of the isolation structure layer 3 is an undercut structure (e.g., an "I" shape).

[0071] It should be noted that the isolation structure layer 3 can be not only the three-layer structure ("I" shaped structure) shown in Figure 3, but also a two-layer structure, a four-layer structure, or even a more layered structure. There are no specific limitations here, as long as the isolation structure layer 3 has an undercut structure.

[0072] The isolation structure layer 3 can isolate the light-emitting parts 202 of any two light-emitting devices 2 and the cathodes 203 of any two light-emitting devices 2. The cathodes 203 of adjacent light-emitting devices 2 are spaced apart and not directly connected. The cathodes 203 of the light-emitting devices 2 are electrically connected to the isolation structure layer 3, and the cathodes 203 of adjacent light-emitting devices 2 are electrically connected through the isolation structure layer 3. This ensures that the light-emitting parts 202 in each light-emitting device 2 can receive approximately the same electrical signal transmitted from the cathodes 203, which improves the accuracy of the electrical signals received by multiple light-emitting parts 202, and thus improves the display uniformity of the display panel 300.

[0073] When the display panel 300 includes the isolation structure layer 3, the light-emitting part 202 of the light-emitting device 2 can be prepared by photolithography.

[0074] Specifically, the aforementioned "photolithography process" may include: after forming a complete light-emitting layer, coating the entire light-emitting layer with photoresist, then placing a mask on the side of the photoresist away from the driving substrate 1, exposing and developing the photoresist through the mask to remove the exposed portions and retain the unexposed portions, thereby forming a patterned photoresist; then using the patterned photoresist as a mask to etch the entire light-emitting layer, removing the portions not covered by the patterned photoresist, thereby obtaining the light-emitting portion 202 of the light-emitting device 2. Finally, the display panel 300 to be formed can be placed in a stripping solution to dissolve and peel off the patterned photoresist layer.

[0075] In some examples, please continue to refer to Figure 3, the display panel 300 also includes an insulating layer 4 and an auxiliary electrode layer 5.

[0076] The insulating layer 4 is disposed on the side of the isolation structure layer 3 away from the driving substrate 1. The insulating layer 4 has multiple through holes 41 for exposing the surface of the isolation structure layer 3 away from the driving substrate 1. The auxiliary electrode layer 5 is disposed on the side of the insulating layer 4 away from the isolation structure layer 3. The auxiliary electrode layer 5 is in electrical contact with the surface of the isolation structure layer 3 exposed by the multiple through holes 41, and the auxiliary electrode layer 5 is made of a transparent conductive material.

[0077] For example, the plurality of through holes 41 can expose the entire surface of the isolation structure layer 3 away from the driving substrate 1, or only expose a portion of the surface of the isolation structure layer 3 away from the driving substrate 1. The embodiments of this disclosure are not limited in this respect.

[0078] Exemplarily, in the planar direction of the display panel 300, the size of the through hole 41 is greater than or equal to 2.3 μm. In this way, the effectiveness of the auxiliary electrode layer 5 and the surface of the isolation structure layer 3 exposed by the plurality of through holes 41 can be guaranteed to be in electrical contact.

[0079] In addition, the material of the insulating layer 4 can be an inorganic material. For example, the material of the insulating layer 4 can be at least one of silicon nitride, silicon carbide, and silicon oxide.

[0080] Exemplarily, the auxiliary electrode layer 5 is a transparent electrode layer. The "transparent" refers to the light can pass through the transparent structure. For example, the light transmittance of the auxiliary electrode layer 5 in the present disclosure can reach 80% or more. The light emitted by the light emitting device 2 can pass through the auxiliary electrode layer 5 and be emitted from the display side of the display panel 300.

[0081] Exemplarily, the material of the auxiliary electrode layer 5 includes at least one of indium tin oxide, aluminum zinc oxide, or indium zinc oxide.

[0082] Indium tin oxide (ITO) is mainly composed of In2O3 and SnO2, which has good light transmittance and good conductivity. Indium zinc oxide (IZO) also has good light transmittance and conductivity. For example, indium tin oxide can be used to form the auxiliary electrode layer 5 by sputtering, such as PVD (Physical Vapor Deposition). The auxiliary electrode layer 5 made of indium tin oxide or indium zinc oxide can reduce the shielding of light, thereby improving the light efficiency of the display panel 300.

[0083] It should be noted that indium tin oxide or indium zinc oxide can exist in various forms, and the embodiments of the present disclosure do not limit the form of indium tin oxide or indium zinc oxide, that is, all forms are included. For example, indium tin oxide includes amorphous indium tin oxide and polycrystalline indium tin oxide.

[0084] In the embodiment, the isolation structure layer 3 is arranged to separate the light emitting parts 202 of the adjacent light emitting devices 2. In the process of manufacturing the light emitting part 202 of the light emitting device 2, the light emitting layer material can be uniformly evaporated on the display panel 300 to be evaporated, and the light emitting layer material is patterned by using the photolithography process, so as to form the light emitting part 202 of the light emitting device 2 without the need of using the mask plate to evaporate the area where the light emitting device 2 is located to form the light emitting part 202. The complicated FMM screen process is reduced, the preparation difficulty of the display panel 300 is effectively reduced, the preparation cost of the display panel 300 is reduced, the preparation efficiency of the display panel 300 is improved, the arrangement density of each light emitting device 2 in the display panel 300 is not limited by the size of the FMM, the pixel density of the display panel 300 is improved, the FMM and the etching process are not used, the problem of inaccurate alignment is avoided, the mask plate is not used to form the light emitting part 202, the pixel position accuracy of the sub-pixel is not poor, the serious color mixing phenomenon is not prone to occur in the high PPI display effect, and the problem of scratching between the mask plate and the display panel to be evaporated is avoided.

[0085] In addition, the entire auxiliary electrode layer 5 is arranged, the auxiliary electrode layer 5 is electrically connected with the isolation structure layer 3, and the isolation structure layer 3 is electrically connected with the cathode 203 of the light emitting device 2, so as to realize the entire cathode, thereby ensuring that the light emitting part 202 in each light emitting device 2 can receive the approximately same electrical signal transmitted by the cathode 203, the accuracy of the electrical signal received by the plurality of light emitting parts 202 is improved, and the display uniformity of the display panel 300 is improved.

[0086] In some embodiments, as shown in FIG. 3, the insulating layer 4 includes a plurality of insulating parts 401 that are disconnected from each other, one insulating part 401 is located in one first opening 31, and the edge of the insulating part 401 is lapped on the side of the isolation structure layer 3 away from the driving substrate 1, and the adjacent insulating parts 401 have a gap, and the gap forms a through hole 41.

[0087] For example, in the case that the cross-sectional view of the isolation structure layer 3 is in an undercut structure, in the edge of the insulating part 401 close to the isolation structure layer 3, part of the edge abuts against the edge of the isolation structure layer 3 close to the insulating part 401; the part of the insulating part 401 lapped on the side of the isolation structure layer 3 away from the driving substrate 1 has a projection on the driving substrate 1 that overlaps with the side of the isolation structure layer 3 away from the driving substrate 1.

[0088] It can be understood that in the process of forming the auxiliary electrode layer 5, the material of the auxiliary electrode layer 5 also fills in the through hole 41. In this way, the electrical connection between the auxiliary electrode layer 5 and the isolation structure layer 3 is achieved.

[0089] With the above arrangement, part of the surface of the isolation structure layer 3 away from the driving substrate 1 is exposed by the through hole 41, and the auxiliary electrode layer 5 is in contact with the surface of the isolation structure layer 3 exposed by the through hole 41, thereby achieving the electrical connection between the auxiliary electrode layer 5 and the isolation structure layer 3, and the electrical connection between the isolation structure layer 3 and the cathode 203 of the light emitting device 2, thereby achieving the full-surface cathode, and ensuring that the light emitting part 202 in each light emitting device 2 can receive approximately the same electrical signal transmitted by the cathode 203, which is conducive to improving the accuracy of the electrical signal received by the plurality of light emitting parts 202, and further conducive to improving the display uniformity of the display panel 300.

[0090] In some embodiments, as shown in FIG. 4, in a direction perpendicular to the thickness direction of the display panel 300, the width of the through hole 41 is equal to or approximately equal to the distance between the two ends of any two adjacent first openings 31 in the isolation structure layer 3 away from the driving substrate 1.

[0091] For example, the boundary of the through hole 41 coincides with the boundary of the surface of the isolation structure layer 3 away from the driving substrate 1.

[0092] For example, in the case where the isolation structure layer 3 includes the first sub-layer 301, the second sub-layer 302, and the third sub-layer 303 arranged in sequence, the upper surface of the portion of the insulating part 401 abutting against the first sub-layer 301 (the surface of the portion of the insulating part 401 abutting against the first sub-layer 301 away from the driving substrate 1) can be flush with the surface of the first sub-layer 301 away from the driving substrate 1 in the isolation structure layer 3. For another example, the upper surface of the portion of the insulating part 401 abutting against the first sub-layer 301 can be higher than the surface of the first sub-layer 301 away from the driving substrate 1 in the isolation structure layer 3, as shown in FIG. 4. Embodiments of the present disclosure do not limit this.

[0093] With the above arrangement, the surface of the isolation structure layer 3 away from the driving substrate 1 is completely exposed by the through hole 41, and the auxiliary electrode layer 5 is in contact with the surface of the isolation structure layer 3 away from the driving substrate 1, thereby achieving the electrical connection between the auxiliary electrode layer 5 and the isolation structure layer 3, and the electrical connection between the isolation structure layer 3 and the cathode 203 of the light emitting device 2, thereby achieving the full-surface cathode, and ensuring that the light emitting part 202 in each light emitting device 2 can receive approximately the same electrical signal transmitted by the cathode 203, which is conducive to improving the accuracy of the electrical signal received by the plurality of light emitting parts 202, and further conducive to improving the display uniformity of the display panel 300.

[0094] In addition, the surface of the isolation structure layer 3 away from the driving substrate 1 is completely exposed by the through hole 41, so that the contact area between the auxiliary electrode layer 5 and the isolation structure layer 3 is larger, and the effectiveness of the electrical connection between the auxiliary electrode layer 5 and the isolation structure layer 3 is further ensured.

[0095] In some embodiments, as shown in FIGS. 3 and 4, the display panel 300 further comprises a pixel definition layer 6 disposed on the driving substrate 1, and the pixel definition layer 6 defines a plurality of second openings 61, one second opening 61 corresponding to one anode 201.

[0096] For example, one second opening 61 exposes the entire anode 201. For another example, one second opening 61 exposes part of the anode 201, and the other part of the anode 201 is covered by the pixel definition layer 6. Embodiments of the present disclosure do not limit this.

[0097] In some examples, as shown in FIGS. 5 and 6, the pixel definition layer 6 further has a groove 62, and the isolation structure layer 3 is disposed in the groove 62.

[0098] With the above arrangement, the groove 62 is arranged on the pixel definition layer 6, and the isolation structure layer 3 is arranged in the groove 62, which can improve the problem that when the isolation structure layer 3 is directly arranged on the pixel definition layer 6, the height of the isolation structure layer 3 is relatively high, which causes the isolation structure layer 3 and the pixel definition layer 6 to easily peel off. In addition, it can also improve the problem that when the isolation structure layer 3 is directly arranged on the pixel definition layer 6, the height of the part of the isolation structure layer 3 protruding from the pixel definition layer 6 is relatively high, and the insulating layer 4 needs to be relatively thick to fill the recessed position of the edge of the isolation structure layer 3.

[0099] On the other hand, when the display panel 300 is a foldable display panel, the height of the part of the isolation structure layer 3 protruding from the pixel definition layer 6 is reduced, which can make the gap between the isolation structure layer 3 and the groove 62 and the film layer (for example, the insulating layer 4 and the auxiliary electrode layer 5 mentioned above) arranged on the isolation structure layer 3 fit more tightly, thereby reducing the probability of peeling between the isolation structure layer 3 and the insulating layer 4 or between the isolation structure layer 3 and the auxiliary electrode layer 5 caused by the folding of the display panel 300, thereby improving the yield of the display panel 300.

[0100] In some embodiments, as shown in FIG. 6, the display panel 300 further comprises a pad layer 7 disposed at the bottom of the groove 62, and the isolation structure layer 3 is disposed away from the driving substrate 1 on the side of the pad layer 7.

[0101] Exemplarily, in the thickness direction of the display panel 300, the thickness of the pad layer 7 can be set as needed. For example, in the thickness direction of the display panel 300, the thickness of the pad layer 7 can be less than the thickness of the pixel defining layer 6.

[0102] In the case where the pixel density of the display panel 300 is large, for the pixel defining layer 6, the distance between two adjacent second openings 61 for accommodating the light emitting device 2 is small, and the groove 62 is located between the second openings 61 for accommodating the light emitting device 2. In the case where the isolation structure layer 3 is directly arranged on the driving substrate 1, the distance between the isolation structure layer 3 and the anode 201 in the second opening 61 is close.

[0103] In the embodiment, the pad layer 7 is arranged between the isolation structure layer 3 and the driving substrate 1, which can improve the problem that the distance between the isolation structure layer 3 and the anode 201 in the second opening 61 is close, and reduce the probability of short circuit (Short) between the isolation structure layer 3 and the anode 201 in the adjacent second opening 61. On the other hand, by setting the thickness of the pad layer 7, the problem that the whole isolation structure layer 3 is located in the groove 62, which causes the poor lap between the cathode 203 and the isolation structure layer 3 when the cathode 203 is formed by evaporation, and causes part of the sub-pixels to be in the island state, can be improved. In addition, when the height of the part of the isolation structure layer 3 protruding from the pixel defining layer 6 is high, the problem that the insulating layer 4 needs to be thick to fill the recessed position of the edge of the isolation structure layer 3 can be avoided.

[0104] On the other hand, when the display panel 300 is a foldable display panel, by setting the height of the part of the isolation structure layer 3 protruding from the pixel defining layer 6 through the pad layer 7, the gap between the isolation structure layer 3 and the groove 62 is more closely fitted with the film layer (for example, the insulating layer 4 and the auxiliary electrode layer 5 mentioned above) arranged on the isolation structure layer 3, thereby reducing the probability of peeling between the isolation structure layer 3 and the insulating layer 4, or between the isolation structure layer 3 and the auxiliary electrode layer 5 due to the folding of the display panel 300, thereby improving the yield of the display panel 300.

[0105] In some embodiments, the material of the pad layer 7 includes an organic material, and the material of the pixel defining layer 6 includes an inorganic material.

[0106] It should be noted that the specific materials of the inorganic material of the pixel defining layer 6 and the organic material of the pad layer 7 are not limited. Exemplarily, the material of the pad layer 7 can be polyimide (Polyimide, abbreviated as PI). The material of the pixel defining layer 6 can be silicon nitride (SiNx), silicon oxynitride (SiON), or silicon oxide (SiOx), etc.

[0107] It can be understood that the adhesion between the isolation structure layer 3 of the metal material and the pixel defining layer 6 of the inorganic material is smaller than the adhesion between the isolation structure layer 3 of the metal material and the pad layer 7 of the organic material.

[0108] With the above arrangement, the overall isolation structure layer 3 can be located in the groove 62, which can prevent the cathode 203 from being poorly overlapped with the isolation structure layer 3 when the cathode 203 is formed by evaporation, and can prevent some sub-pixels from being in an island state. In addition, when the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 is high, the insulating layer 4 needs to be thick to fill the recessed position at the edge of the isolation structure layer 3. The adhesion between the isolation structure layer 3 and the pad layer 7 is improved, and the probability of peeling between the isolation structure layer 3 and the pad layer 7 is reduced, thereby improving the yield of the product.

[0109] It should be noted that there are various ways to arrange the pad layer 7, which can be selected according to actual needs.

[0110] In an implementation manner, as shown in FIG. 6, the pad layer 7 includes a first sub-part 71, and the first sub-part 71 covers the bottom wall of the groove 62.

[0111] For example, the first sub-part 71 is a flat surface away from the surface of the driving substrate 1. That is, the distance from any two positions of the first sub-part 71 away from the surface of the driving substrate 1 to the driving substrate 1 is equal.

[0112] With the above arrangement, the pad layer 7 is arranged between the isolation structure layer 3 and the driving substrate 1, and the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 can be adjusted. Therefore, the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 can be too low, which can prevent the cathode 203 from being poorly overlapped with the isolation structure layer 3. In addition, the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 can be too high, which can prevent the insulating layer 4 from being thick to fill the recessed position at the edge of the isolation structure layer 3.

[0113] In another implementation manner, as shown in FIG. 7, the pad layer 7 includes the first sub-part 71, and further includes a second sub-part 72 connected with the first sub-part 71, and the second sub-part 72 covers the side wall of the groove 62.

[0114] For example, as shown in FIG. 7, the pad layer 7 includes two second sub-parts 72, and the first sub-part 71 is located between the two second sub-parts 72 and connected with the two second sub-parts 72.

[0115] In addition, the first sub-part 71 and the two second sub-parts 72 form a groove. In the thickness direction of the display panel 300, part of the isolation structure layer 3 is located in the groove formed by the first sub-part 71 and the two second sub-parts 72, and another part of the isolation structure layer 3 protrudes from the groove formed by the first sub-part 71 and the two second sub-parts 72.

[0116] In the embodiment, the cushion layer 7 includes the first sub-part 71 and the second sub-part 72 connected to each other, and the first sub-part 71 and the two second sub-parts 72 form a groove, and part of the isolation structure layer 3 is arranged in the groove formed by the first sub-part 71 and the two second sub-parts 72, so that the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 can be adjusted, thereby improving the problem that the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 is too low, and the overlap between the cathode 203 and the isolation structure layer 3 is poor, and improving the problem that the height of the part of the isolation structure layer 3 protruding from the surface of the pixel defining layer 6 away from the driving substrate 1 is too high, and the insulating layer 4 needs to be thick to fill the recessed position of the edge of the isolation structure layer 3.

[0117] In some embodiments, the distance from the surface of the first sub-part 71 away from the driving substrate 1 to the driving substrate 1 is less than the distance from the surface of the pixel defining layer 6 away from the driving substrate 1 to the driving substrate 1.

[0118] For example, in the case where the distance from the surface of the pixel defining layer 6 away from the driving substrate 1 to the driving substrate 1 is , the distance from the surface of the first sub-part 71 away from the driving substrate 1 to the driving substrate 1 can be , and so on. For another example, in the case where the distance from the surface of the pixel defining layer 6 away from the driving substrate 1 to the driving substrate 1 is , the distance from the surface of the first sub-part 71 away from the driving substrate 1 to the driving substrate 1 can be , and so on.

[0119] For example, in the case where the distance from the surface of the pixel defining layer 6 away from the driving substrate 1 to the driving substrate 1 is

[0120] In this embodiment, by making the first sub-portion 71 away from the surface of the driving substrate 1 lower than the pixel defining layer 6 away from the surface of the driving substrate 1, the subsequently formed isolation structure layer 3 has a part thereof located in the groove 62 and a part thereof protruding out of the groove 62 along the thickness direction of the display panel 300, which can not only improve the problem that the whole isolation structure layer 3 is located in the groove 62, causing the cathode 203 to be easily poorly overlapped with the isolation structure layer 3 during the evaporation of the cathode 203, resulting in some pixels in an island state, but also avoid the problem that the height of the part of the isolation structure layer 3 protruding out of the pixel defining layer 6 is high, causing the insulating layer 4 to be thick to fill the recessed position of the edge of the isolation structure layer 3.

[0121] In some embodiments, the distance from the surface of the driving substrate 1 to the isolation structure layer 3 away from the surface of the driving substrate 1 is greater than or equal to the distance from the surface of the driving substrate 1 to the pixel defining layer 6 away from the surface of the driving substrate 1.

[0122] For example, the distance from the surface of the driving substrate 1 to the isolation structure layer 3 away from the surface of the driving substrate 1 is greater than or equal to the distance from the surface of the driving substrate 1 to the pixel defining layer 6 away from the surface of the driving substrate 1 along the thickness direction of the display panel 300, as shown in FIG. 7.

[0123] For example, the distance from the surface of the driving substrate 1 to the isolation structure layer 3 away from the surface of the driving substrate 1 is greater than or equal to the distance from the surface of the driving substrate 1 to the pixel defining layer 6 away from the surface of the driving substrate 1 along the thickness direction of the display panel 300. and less than For example, the distance from the surface of the driving substrate 1 to the isolation structure layer 3 away from the surface of the driving substrate 1 is greater than or equal to the distance from the surface of the driving substrate 1 to the pixel defining layer 6 away from the surface of the driving substrate 1 along the thickness direction of the display panel 300. and less than

[0124] With the above arrangement, the isolation structure layer 3 away from the surface of the driving substrate 1 is higher than the pixel defining layer 6 away from the surface of the driving substrate 1, which can improve the problem that the isolation structure layer 3 away from the surface of the driving substrate 1 blocks the cathode material during the evaporation of the cathode 203, thereby affecting the effectiveness of the electrical connection between the cathode 203 and the isolation structure layer 3.

[0125] In some embodiments, the ratio of the distance from the surface of the driving substrate 1 to the first sub-portion 71 away from the surface of the driving substrate 1 to the distance from the surface of the driving substrate 1 to the pixel defining layer 6 away from the surface of the driving substrate 1 is greater than or equal to 0.5 and less than 1.

[0126] For example, the ratio of the distance from the surface of the driving substrate 1 to the driving substrate 1 of the first sub-portion 71 to the distance from the surface of the driving substrate 1 to the driving substrate 1 of the pixel defining layer 6 can be 0.5, 0.6, 0.7, 0.8, 0.9, etc. Embodiments of the present disclosure do not limit this.

[0127] Specifically, in the thickness direction of the display panel 300, the height of the pixel defining layer 6 is The distance from the surface of the driving substrate 1 to the driving substrate 1 of the first sub-portion 71 can be In the thickness direction of the display panel 300, the height of the isolation structure layer 3 is In the case of

[0128] Through the above setting, it can be ensured that in the thickness direction of the display panel 300, part of the isolation structure layer 3 is located in the groove 62 of the pixel defining layer 6, and part of the isolation structure layer 3 protrudes from the groove 62, thereby improving the problem that the entire isolation structure layer 3 is located in the groove 62, causing the cathode 203 to be easily connected to the isolation structure layer 3 during evaporation to form the cathode 203, resulting in some sub-pixels in an island state, and also avoiding the problem that when the height of the part of the isolation structure layer 3 protruding from the pixel defining layer 6 is high, the insulating layer 4 needs to be thick to fill the recessed position of the edge of the isolation structure layer 3.

[0129] In some embodiments, the groove 62 is arranged around the light emitting device 2.

[0130] For example, the orthographic projection of the isolation structure layer 3 on the driving substrate 1 is located in the orthographic projection of the groove 62 on the driving substrate 1.

[0131] The isolation structure layer 3 is arranged around the light emitting device 2, so that the cathode 203 of each light emitting device 2 can be electrically connected to the isolation structure layer 3.

[0132] In the present embodiment, the groove 62 is arranged around the light emitting device 2, and the pad layer 7 located in the groove 62 is uniformly arranged between the isolation structure layer 3 and the driving substrate 1, and further through the setting of the thickness of the pad layer 7, the problem that the entire isolation structure layer 3 is located in the groove 62, causing the cathode 203 to be easily connected to the isolation structure layer 3 during evaporation to form the cathode 203, resulting in some sub-pixels in an island state, and also avoiding the problem that when the height of the part of the isolation structure layer 3 protruding from the pixel defining layer 6 is high, the insulating layer 4 needs to be thick to fill the recessed position of the edge of the isolation structure layer 3.

[0133] In some embodiments, the groove 62 penetrates the pixel defining layer 6 in a direction perpendicular to the driving substrate 1, as shown in FIGS. 6 and 7. In the case where the groove 62 penetrates the pixel defining layer 6 in a direction perpendicular to the driving substrate 1, the pad layer 7 is in direct contact with the driving substrate 1.

[0134] In other examples, the bottom of the groove 62 is located inside the pixel defining layer 6, and the opening of the groove 62 faces away from the driving substrate 1. That is, the groove 62 penetrates a portion of the pixel defining layer 6 in a direction perpendicular to the driving substrate 1.

[0135] In some embodiments, as shown in FIGS. 3-7, the display panel 300 further includes an encapsulation structure 8 disposed on the side of the auxiliary electrode layer 5 away from the driving substrate 1. The encapsulation structure 8 includes a first inorganic encapsulation layer 81, an organic encapsulation layer 82, and a second inorganic encapsulation layer 83, which are sequentially stacked in a direction away from the driving substrate 1.

[0136] The encapsulation structure 8 is configured to encapsulate the pixel driving circuit 120 and the plurality of light emitting devices 2 in the driving substrate 1 on the substrate 11 in the driving substrate 1, so as to block water and oxygen, avoid the erosion of the light emitting devices 2 caused by external water and oxygen, and thus affect the light emitting efficiency and service life of the light emitting devices 2.

[0137] For example, the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 83 can be made of inorganic insulating materials. The organic encapsulation layer 82 can be made of organic insulating materials.

[0138] It can be understood that the organic encapsulation layer 82 is mainly used for planarization and stress relief, and the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 83 are mainly used for blocking water / oxygen and wrapping the organic encapsulation layer 82 located therebetween.

[0139] In some examples, as shown in FIG. 7, the display panel 300 further includes a touch structure layer 9 disposed on the side of the encapsulation structure 8 away from the auxiliary electrode layer 5.

[0140] The touch structure layer 9 is used to realize the touch function of the display panel 300.

[0141] For example, the touch structure layer 9 can be a touch structure designed by using an FMLOC (Flexible Multi-Layer On Cell) process. The FMLOC process refers to manufacturing a metal mesh electrode layer on the encapsulation structure of the display panel, so as to perform touch control without external TSP. This process can reduce the thickness of the display panel 300 and the display device 1000, and is conducive to the thin and light design of the display device 1000.

[0142] It can be understood that the touch structure layer 9 includes a touch driving electrode and a touch sensing electrode. When a driving signal is input to the touch driving electrode, a voltage signal coupled out by the touch sensing electrode is detected. In this process, when a human body contacts the capacitive touch screen, the human body electric field acts on the sensing capacitor, so that the capacitance of the sensing capacitor changes, thereby changing the voltage signal coupled out by the touch sensing electrode. According to the change of the voltage signal, the position of the human body touching the capacitive touch screen can be determined.

[0143] In the case of poor lap joint between the cathode 203 of the partial light emitting device 2 and the isolation structure layer 3, there may be a case that the cathode 203 of the partial light emitting device 2 is inconsistent with the electrical signal on the cathode 203 of the other light emitting device 2. The coupling capacitance between the cathode 203 inconsistent with the electrical signal and the touch structure layer 9 is different, thereby affecting the accuracy of the touch function of the touch structure layer 9.

[0144] In the embodiments of the present disclosure, the full-area auxiliary electrode layer 5 is electrically connected with the isolation structure layer 3, and the isolation structure layer 3 is electrically connected with the cathode 203 of the light emitting device 2, so as to realize the full-area cathode, and also avoid the problem that the partial cathode 203 and the isolation structure layer 3 are poorly lapped, so that the partial sub-pixels are in an island state, the electrical signal received by the partial sub-pixels in the island state is inconsistent with that received by the other sub-pixels, and the accuracy of the touch function of the touch structure layer 9 is affected.

[0145] The embodiments of the present disclosure also provide a manufacturing method of a display panel, for example, for manufacturing the display panel 300 provided in some of the above embodiments. FIG. 8 is a flowchart of the manufacturing method of the display panel 300 provided in some embodiments of the present disclosure; and FIGS. 9-23 are cross-sectional structure diagrams corresponding to respective steps in the manufacturing method of the display panel 300 according to some embodiments.

[0146] It should be understood that the steps shown in FIG. 8 are not exclusive, and other steps can also be performed before, after or between any of the steps shown. In addition, some of the steps can be performed simultaneously, or can be performed in an order different from that shown in FIG. 8.

[0147] As shown in FIG. 8, the above manufacturing method includes the following a1-a3.

[0148] a1: forming the isolation structure layer 3 and the plurality of light emitting devices 2 on the driving substrate 1; the isolation structure layer 3 has a plurality of first openings 31. One light emitting device 2 is arranged in one first opening 31. The light emitting device 2 includes an anode 201, a light emitting part 202 and a cathode 203 which are sequentially stacked in a direction away from the driving substrate 1. The cathode 203 of the light emitting device 2 is electrically connected with the isolation structure layer 3.

[0149] For example, the structure of the driving substrate 1 and the isolation structure layer 3 can refer to the description of some embodiments above, and will not be repeated here.

[0150] For example, before forming the isolation structure layer 3 and the plurality of light emitting devices 2 on the driving substrate 1, the preparation method further comprises: forming a planar layer 10 on the driving substrate 1 to provide a flat surface for the plurality of light emitting devices 2, as shown in FIG. 9.

[0151] In addition, the planar layer 10 has a plurality of openings, and the anode 201 of the light emitting device 2 is electrically connected to the pixel driving circuit 120 in the driving substrate 1 through the openings in the planar layer 10, so that the pixel driving circuit 120 can provide a driving signal for the light emitting device 2 to drive the light emitting device 2 to emit light.

[0152] For example, the anode 201 can be made of transparent metal oxide conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), and fluorine-doped tin oxide (FTO); or a multilayer structure of the above transparent metal oxide conductive materials and metal materials (such as silver Ag), for example, prepared by ITO\Ag\ITO three layers.

[0153] For example, the anode thin film can be formed by sputtering or evaporation process, then a photoresist pattern is formed on the anode thin film by coating, exposure and development process, and based on the photoresist pattern, the anode thin film is etched by etching process to form a plurality of anodes 201. Finally, the photoresist pattern is stripped.

[0154] For example, the light emitting part 202 can be formed by photolithography process. For example, after forming a whole layer of light emitting layer, a patterned photoresist is formed on the whole layer of light emitting layer, and the whole layer of light emitting layer is etched by using the patterned photoresist as a mask, and the part of the light emitting layer not covered by the patterned photoresist is removed, to obtain the light emitting part 202.

[0155] Exemplarily, the cathode 203 can be formed by an evaporation process. That is, first, a heating method such as current heating, electron beam bombardment heating, and laser heating is used to evaporate the evaporation material into an evaporation vapor of atoms or molecules; second, the evaporation vapor diffuses to a predetermined position of the deposition surface of the substrate under the action of a mask plate; and finally, the evaporation vapor collides with the substrate surface in the predetermined position and condenses, thereby forming different thin films. Specifically, in the process of forming the cathode 203 by evaporation, the evaporation source evaporates the evaporation material to the display panel 300 to be evaporated. For example, the evaporation source evaporates the material of the cathode to the display panel 300 to be evaporated. By controlling the evaporation angle of the display panel 300 to be evaporated, the cathode 203 is in contact with the isolation structure layer 3, the effective electrical connection between the cathode 203 and the isolation structure layer 3 is realized, and then the electrical connection between any two adjacent cathodes 203 is ensured.

[0156] In addition, the light-emitting part 202 and the cathode 203 can be formed by the same patterning process, thereby facilitating the simplification of the preparation process of the display panel 300.

[0157] a2: Forming an insulating layer 4 on the side of the isolation structure layer 3 away from the driving substrate 1. The insulating layer 4 has a plurality of through holes 41 for exposing the surface of the isolation structure layer 3 away from the driving substrate 1.

[0158] Exemplarily, the material of the insulating layer 4 can be an inorganic material. For example, the material of the insulating layer 4 can be at least one of silicon nitride, silicon carbide, and silicon oxide.

[0159] Exemplarily, the insulating layer 4 can be formed by a CVD (Chemical Vapor Deposition) process.

[0160] a3: Forming an auxiliary electrode layer 5 on the side of the insulating layer 4 away from the isolation structure layer 3, the auxiliary electrode layer 5 being in electrical contact with the surface of the isolation structure layer 3 exposed by the plurality of through holes 41, and the auxiliary electrode layer 5 being light-transmissive.

[0161] Exemplarily, the material of the auxiliary electrode layer 5 includes at least one of indium tin oxide, aluminum zinc oxide, or indium zinc oxide.

[0162] Exemplarily, the auxiliary electrode layer 5 can be formed by a sputtering or evaporation process.

[0163] Exemplarily, the thickness of the auxiliary electrode layer 5 can be set to

[0164] In the embodiment, the isolation structure layer 3 is arranged to separate the light emitting parts 202 of the adjacent light emitting devices 2. In the process of manufacturing the light emitting part 202 of the light emitting device 2, the light emitting layer material can be deposited on the display panel 300 to be evaporated, and the light emitting layer material is patterned by using the photolithography process, so as to form the light emitting part 202 of the light emitting device 2 without using the mask plate to evaporate the area where the light emitting device 2 is located to form the light emitting part 202. The FMM screen process is reduced, the preparation difficulty of the display panel 300 is effectively reduced, the preparation cost of the display panel 300 is reduced, the preparation efficiency of the display panel 300 is improved, the arrangement density of the light emitting devices 2 in the display panel 300 is not limited by the size of the FMM, the pixel density of the display panel 300 is improved, and the FMM and the etching process are not used, so as to avoid the problem of inaccurate alignment.

[0165] In addition, the auxiliary electrode layer 5 is formed on the whole surface, the auxiliary electrode layer 5 is electrically connected with the isolation structure layer 3, and the isolation structure layer 3 is electrically connected with the cathode 203 of the light emitting device 2, so as to realize the whole surface cathode, and ensure that the light emitting part 202 in each light emitting device 2 can receive the approximately same electrical signal transmitted by the cathode 203, which is beneficial to improve the accuracy of the electrical signal received by the plurality of light emitting parts 202, and further improve the display uniformity of the display panel 300.

[0166] In some embodiments, before the insulating layer 4 is formed on the side of the isolation structure layer 3 away from the driving substrate 1, the preparation method further comprises:

[0167] (1) As shown in FIG. 9, the pixel defining film 06 is formed on the driving substrate 1.

[0168] For example, before the pixel defining film 06 is formed on the driving substrate 1, the preparation method further comprises: forming a plurality of anodes 201 on the side of the planar layer 10 away from the driving substrate 1, as shown in FIG. 9.

[0169] For example, the material of the pixel defining layer 6 includes an inorganic material.

[0170] For example, the pixel defining film 06 with a certain thickness can be deposited on the driving substrate 1 by a physical vapor deposition (PVD) or a plasma enhanced chemical vapor deposition (PECVD) method.

[0171] For example, the thickness of the pixel defining film 06 can be 1.2 μm.

[0172] (2) As shown in FIG. 10, the pixel definition film 06 is etched to form the groove 62.

[0173] For example, the pixel definition film 06 can be patterned by a photolithography process to form the pixel definition layer 6 with the groove 62.

[0174] It should be noted that the photolithography process can include: coating a photoresist on the pixel definition film 06, then disposing a mask plate on the side of the photoresist away from the driving substrate 1, exposing and developing the photoresist through the mask plate, removing the exposed part of the photoresist, and retaining the part of the photoresist that is not exposed, thereby forming the patterned photoresist; then etching the pixel definition film 06 with the patterned photoresist as a mask to remove the part of the pixel definition film 06 that is not shielded by the patterned photoresist, thereby forming the groove 62, and obtaining the pixel definition layer 6. Finally, the display panel 300 to be formed can be placed in a stripping solution to dissolve and strip off the patterned photoresist layer.

[0175] (3) As shown in FIG. 11, the pad layer 7 is formed at the bottom of the groove 62.

[0176] For example, the structure of the pad layer 7 can refer to the description in some of the above embodiments, which will not be repeated here.

[0177] For example, the material of the pad layer 7 includes an organic material.

[0178] For example, a coating process can be used to form a thin film of the organic material with a certain thickness, and then a photolithography process can be used to pattern the thin film of the organic material, retain the part of the thin film of the organic material inside the groove 62, and remove the part of the thin film of the organic material outside the groove 62, thereby forming the pad layer 7.

[0179] In this embodiment, the groove 62 is formed on the pixel definition layer 6, and the pad layer 7 is formed at the bottom of the groove 62. By setting the thickness of the pad layer 7, the problem that the whole isolation structure layer 3 is located inside the groove 62, causing the cathode 203 to be easily connected to the isolation structure layer 3 during evaporation to form the cathode 203, and causing some sub-pixels to be in an island state, can be solved. In addition, the problem that the height of the part of the isolation structure layer 3 protruding from the pixel definition layer 6 is high, causing the insulating layer 4 to be thick to fill the recessed position of the edge of the isolation structure layer 3, can be avoided.

[0180] In some embodiments, the isolation structure layer 3 is formed, including a11-a13.

[0181] a11: As shown in FIG. 12, the isolation structure film 03 is formed on the pixel definition film 06.

[0182] Exemplarily, the isolation structure film 03 can be formed by a sputtering process.

[0183] In the case that the isolation structure layer 3 is a three-layer structure, forming the isolation structure film 03 by a sputtering process can specifically include: sequentially forming a first sub-isolation structure film 031, a second sub-isolation structure film 032, and a third sub-isolation structure film 033 on the pixel defining film 06, as shown in FIG. 12.

[0184] For example, the material of the first sub-isolation structure film 031 and the third sub-isolation structure film 033 is titanium (Ti), and the material of the second sub-isolation structure film 032 can be aluminum (Al). Because the wet etching rates of Ti and Al are different, in the process of etching the first sub-isolation structure film 031, the second sub-isolation structure film 032, and the third sub-isolation structure film 033, the second sub-isolation structure film 032 can be ensured to be less affected by etching, and the etching speed of the first sub-isolation structure film 031 and the third sub-isolation structure film 033 is faster, thereby forming an undercut structure (for example, a “T” shaped structure). Those skilled in the art can also select other suitable materials as long as the above technical effects can be achieved, and embodiments of the present disclosure do not limit this.

[0185] a12: etching the isolation structure film 03 to form the isolation structure layer 3 with a plurality of first openings 31, the first openings 31 exposing part of the pixel defining film 06, as shown in FIGS. 13 and 14.

[0186] Exemplarily, the above step can specifically include: (1) forming a first photoresist layer 011 on the side of the isolation structure film 03 away from the pixel defining film 06, as shown in FIG. 13, the first photoresist layer 011 has a plurality of openings, and the openings of the first photoresist layer 011 are opposite to the positions of the first openings 31 to be formed, and the etching (for example, dry etching) of the whole isolation structure film 03 is performed by taking the patterned first photoresist layer 011 as a mask, and the part of the isolation structure film 03 not covered by the patterned first photoresist layer 011 is removed. That is, the part of the isolation structure film 03 corresponding to the position of the light emitting device 2 to be formed is removed.

[0187] (2) The first photoresist layer 011 is peeled off, as shown in FIGS. 13 and 14.

[0188] (3) As shown in Figure 16A, a first organic protective layer 013 is formed at the location corresponding to the light-emitting device 2 to be formed. The isolation structure film 03 is then etched again using an alkaline etching solution. The alkaline etching solution has a relatively high etching rate on the second sub-isolation structure film 032, which is greater than its etching rate on the first sub-isolation structure film 031 and the third sub-isolation structure film 033. This results in the cross-sectional shape of the formed isolation structure layer 3 being approximately "I"-shaped. After the isolation structure layer 3 is formed, the first organic protective layer 013 is removed.

[0189] It should be noted that, in order to avoid unnecessary damage to the anode 201 when using alkaline etching solution to etch the isolation structure film 03, after removing the portion of the isolation structure film 03 corresponding to the position of the light-emitting device 2 to be formed, the gap size between the orthogonal projection of the isolation structure film 03 on the driving substrate 1 and the orthogonal projection of the anode 201 on the driving substrate 1 is greater than or equal to 2μm.

[0190] a13: As shown in Figures 15, 16A and 16B, a pixel defining film 06 is etched through the first opening 31 to form a pixel defining layer 6 having a plurality of second openings 61, wherein one second opening 61 is connected to one first opening 31.

[0191] For example, step a13 above may specifically include:

[0192] (1) As shown in FIG15, a second photoresist layer 012 is formed on the side of the pixel defining film 06 away from the driving substrate 1. The second photoresist layer 012 has multiple openings, and the multiple openings of the second photoresist layer 012 correspond to the first opening 31 of the isolation structure layer 3, exposing the pixel defining film 06 opposite to the first opening 31 of the isolation structure layer 3.

[0193] (2) As shown in Figures 15, 16A and 16B, the second photoresist layer 012 is used as a mask to etch the entire pixel defining film 06, removing the part of the pixel defining film 06 that is not covered by the second photoresist layer 012, thereby obtaining a pixel defining layer 6 with multiple second openings 61.

[0194] It should be noted that the multiple light-emitting devices 2 can have multiple colors. In the above steps a11 to a13, the pixel openings corresponding to the light-emitting devices 2 of different colors (for example, including the above-mentioned second opening 61 and the first opening 31 that are connected to it) are made separately.

[0195] In the pixel opening (e.g., the first opening 31 including the second opening 61) corresponding to each preset color of the light emitting device 2, the light emitting part 202 and the cathode 203 of the light emitting device 2 of the preset color are formed.

[0196] Specifically, in the process of forming the light emitting device 2 of a certain color, the pixel opening (e.g., the first opening 31 including the second opening 61) corresponding to the light emitting device 2 of the color is first formed, then the light emitting part 202 and the cathode 203 of the light emitting device 2 of the color are formed in the pixel opening (e.g., the first opening 31 including the second opening 61), and then the pixel opening (e.g., the first opening 31 including the second opening 61) corresponding to the light emitting device 2 of another color is formed, and the light emitting part 202 and the cathode 203 of the light emitting device 2 of the color are formed in the pixel opening (e.g., the first opening 31 including the second opening 61).

[0197] In some examples, in the case where the insulating layer 4 includes a plurality of insulating parts 401 that are disconnected from each other, after the light emitting part 202 and the cathode 203 of the light emitting device 2 of each preset color are formed, the insulating part 401 corresponding to the light emitting device 2 needs to be formed.

[0198] In some embodiments, the plurality of second openings 61 includes a first sub-pixel opening 611 and a second sub-pixel opening 612.

[0199] For example, the plurality of light emitting devices 2 includes a plurality of first light emitting devices 210 and a plurality of second light emitting devices 220. The light emitted by the plurality of first light emitting devices 210 and the plurality of second light emitting devices 220 is of different colors.

[0200] In the case where the plurality of second openings 61 includes a first sub-pixel opening 611 and a second sub-pixel opening 612, the first sub-pixel opening 611 corresponds to the first light emitting device 210, and the second sub-pixel opening 612 corresponds to the second light emitting device 220.

[0201] In some examples, the plurality of light emitting devices 2 further includes a plurality of third light emitting devices 230. The light emitted by the plurality of first light emitting devices 210, the plurality of second light emitting devices 220, and the plurality of third light emitting devices 230 is of different colors. For example, the first light emitting device 210 can emit red light, the second light emitting device 220 can emit blue light, and the third light emitting device 230 can emit green light.

[0202] It can be understood that the plurality of second openings 61 can also include a third sub-pixel opening 613 corresponding to the third light emitting device 230.

[0203] In the case where the plurality of light emitting devices 2 include the plurality of first light emitting devices 210, the plurality of second light emitting devices 220, and the third light emitting device 230, a corresponding pixel opening of the plurality of first light emitting devices 210 (including the first opening 31 through which the one second opening 61 described above is penetrated) can be formed first, and then the light emitting part 202 and the cathode 203 of the plurality of first light emitting devices 210 can be formed in the pixel opening (including the first opening 31 through which the one second opening 61 described above is penetrated).

[0204] Then, a corresponding pixel opening of the plurality of second light emitting devices 220 (including the first opening 31 through which the one second opening 61 described above is penetrated) can be formed again, and then the light emitting part 202 and the cathode 203 of the plurality of second light emitting devices 220 can be formed in the pixel opening (including the first opening 31 through which the one second opening 61 described above is penetrated).

[0205] Finally, a corresponding pixel opening of the plurality of third light emitting devices 230 (including the first opening 31 through which the one second opening 61 described above is penetrated) can be formed again. Then, the light emitting part 202 and the cathode 203 of the plurality of third light emitting devices 230 can be formed in the pixel opening (including the first opening 31 through which the one second opening 61 described above is penetrated).

[0206] In some examples, the light emitting device 2 is formed, and the insulating layer 4 is formed, including: a21-a25.

[0207] a21: As shown in FIG. 17, a first laminated film covering the pixel defining layer 6 and the isolation structure layer 3 is formed, and the first laminated film includes a first light emitting material film 0211, a cathode film 0212, and an insulating material film 0213 which are sequentially stacked in a direction away from the driving substrate 1.

[0208] It should be noted that in the above step a21, the first light emitting material film 0211 can be used to form the light emitting part 202 of the first light emitting device 210; the cathode film 0212 can be used to form the cathode 203 of the first light emitting device 210, and the insulating material film 0213 can be used to form the insulating part 401 corresponding to the first light emitting device 210.

[0209] As described above, the light emitting part 202 and the cathode 203 of the light emitting device 2 of different colors are separately manufactured, and the pixel openings corresponding to the light emitting device 2 of different colors (including the first opening 31 and the second opening 61 penetrating through the first opening 31) are separately manufactured. Before the step a21, there is further included: forming the pixel openings corresponding to the first light emitting device 210 (including the second opening 61 corresponding to the first light emitting device 210 (i.e., the first sub-pixel opening 611) and the first opening 31 penetrating through the first sub-pixel opening 611).

[0210] It can be understood that, as shown in FIG. 17, in the step a21, the thickness of the first light emitting material film 0211 and the thickness of the cathode film 0212 are small, and after the first light emitting material film 0211 and the cathode film 0212 are deposited, the part of the first light emitting material film 0211 located in the first sub-pixel opening 611 and the first opening 31 penetrating through the first sub-pixel opening 611 is disconnected from the part of the first light emitting material film 0211 located away from the surface of the driving substrate 1 of the isolation structure layer 3, and the part of the cathode film 0212 located in the first sub-pixel opening 611 and the first opening 31 penetrating through the first sub-pixel opening 611 is disconnected from the part of the cathode film 0212 located away from the surface of the driving substrate 1 of the isolation structure layer 3.

[0211] The material of the first light emitting material film 0211 can include an organic material.

[0212] For example, the first light emitting material film 0211 can be deposited by using an evaporation process.

[0213] The material of the cathode film 0212 includes a metal material. For example, it can be Indium Tin Oxide (ITO), magnesium-silver alloy (MgAg), silver (Ag), aluminum (Al), magnesium (Mg), etc. The embodiments of the present disclosure do not limit this.

[0214] For example, the cathode film 0212 can be formed by using a sputtering or evaporation process.

[0215] For example, the material of the insulating material film 0213 can be an inorganic material. In the case where the material of the insulating material film 0213 is an inorganic material, the insulating material film 0213 can be formed by using a Chemical Vapor Deposition (CVD) process.

[0216] a22: As shown in FIG. 18A, the first laminated film is etched to form the first light emitting part 211, the first cathode 212 and the first insulating part 213 located in the first sub-pixel opening 611 and the first opening 31 penetrating through the first sub-pixel opening 611, and the edge of the first insulating part 213 is overlapped on the side of the isolation structure layer 3 away from the driving substrate 1.

[0217] It should be noted that when the first sub-pixel opening 611 corresponds to the first light-emitting device 210, the first light-emitting part 211 is the light-emitting part 202 of the first light-emitting device 210, the first cathode 212 is the cathode 203 of the first light-emitting device 210, and the first insulating part 213 is the insulating part 401 corresponding to the first light-emitting device 210.

[0218] This completes the fabrication of the first light-emitting device 210.

[0219] a23: As shown in Figure 19, a second stacked film covering the pixel defining layer 6 and the isolation structure layer 3 is formed. The second stacked film includes a second light-emitting material film 0221, a cathode film 0222 and an insulating material film 0223, which are sequentially stacked along the direction away from the driving substrate 1.

[0220] It should be noted that in step a23 above, the second light-emitting material film 0221 can be used to form the light-emitting part 202 of the second light-emitting device 220; the cathode film 0222 can be used to form the cathode 203 of the second light-emitting device 220; and the insulating material film 0223 can be used to form the insulating part 401 corresponding to the second light-emitting device 220.

[0221] As described above, the light-emitting part 202 and cathode 203 of the light-emitting device 2 of different colors are manufactured separately, and the pixel openings (including the first opening 31 through which the second opening 61 is connected) corresponding to the light-emitting device 2 of different colors are manufactured separately. Before step a23, the process further includes: forming a pixel opening corresponding to the second light-emitting device 220 (including the second opening 61 (i.e., the second sub-pixel opening 612) corresponding to the second light-emitting device 220 and the first opening 31 through which it is connected).

[0222] In the process of etching the isolation structure film 03 to form multiple second light-emitting devices 220 corresponding to the first opening 31, a photoresist layer is first formed on the side of the isolation structure film 03 away from the pixel defining film 06. This photoresist layer has multiple openings, and the positions of the openings in the photoresist layer are opposite to the first opening 31 of the second light-emitting device 220 to be formed. Using this photoresist layer as a mask, the isolation structure film 03 is etched (e.g., dry etching), removing the portion of the isolation structure film 03 corresponding to the position of the photoresist layer to be formed, as shown in Figure 18A. Then, a second organic protective layer 014 is formed at the position corresponding to the position of the light-emitting device 2 to be formed. The isolation structure film 03 is etched again using an alkaline etching solution, so that the cross-sectional shape of the formed isolation structure layer 3 is approximately "I". Referring to Figures 18A and 18B, after the isolation structure layer 3 is formed, the second organic protective layer 014 is removed.

[0223] It can be understood that, as shown in FIG. 19, in the step a23, the thicknesses of the second luminescent material film 0221 and the cathode film 0222 are small, and after the second luminescent material film 0221 and the cathode film 0222 are deposited, the part of the second luminescent material film 0221 located in the second sub-pixel opening 612 and the first opening 31 penetrating therethrough is disconnected from the part of the second luminescent material film 0221 located away from the surface of the isolation structure layer 3 and the driving substrate 1, and the part of the cathode film 0222 located in the second sub-pixel opening 612 and the first opening 31 penetrating therethrough is disconnected from the part of the cathode film 0222 located away from the surface of the isolation structure layer 3 and the driving substrate 1.

[0224] For example, the second luminescent material film 0221 can be deposited by an evaporation process.

[0225] For example, the cathode film 0222 can be formed by a sputtering or evaporation process.

[0226] For example, the insulating material film 0223 can be formed by a chemical vapor deposition (CVD) process.

[0227] a24: As shown in FIG. 20A, the second laminated film is etched to form the second luminescent part 221, the second cathode 222 and the second insulating part 223 located in the second sub-pixel opening 612 and the first opening 31 penetrating therethrough, and the edge of the second insulating part 223 is overlapped on the side of the isolation structure layer 3 away from the driving substrate 1.

[0228] It should be noted that, in the case that the second sub-pixel opening 612 corresponds to the second luminescent device 220, the second luminescent part 221 is the luminescent part 202 of the second luminescent device 220, the second cathode 222 is the cathode 203 of the second luminescent device 220, and the second insulating part 223 is the insulating part 401 arranged corresponding to the second luminescent device 220.

[0229] At this point, the preparation of the second luminescent device 220 is completed.

[0230] a25: The first insulating part 213 and the second insulating part 223 are etched to form a through hole 41 overlapped on the side of the isolation structure layer 3 away from the driving substrate 1.

[0231] The etching method used above can be, for example, dry etching.

[0232] For example, the through hole 41 can expose part of the surface of the side of the isolation structure layer 3 away from the driving substrate 1, or can expose the entire surface of the side of the isolation structure layer 3 away from the driving substrate 1. The embodiments of the present disclosure do not limit this.

[0233] In the case where the multiple light-emitting devices 2 also include a third light-emitting device 230, after step a24 above, the preparation method further includes: a26 to a27.

[0234] a26: As shown in Figure 21, a third stacked film is formed covering the pixel defining layer 6 and the isolation structure layer 3. The third stacked film includes a third light-emitting material film 0231, a cathode film 0232 and an insulating material film 0233, which are sequentially stacked along the direction away from the driving substrate 1.

[0235] It should be noted that in step a26 above, the third light-emitting material film 0231 can be used to form the light-emitting part 202 of the third light-emitting device 230; the cathode film 0232 can be used to form the cathode 203 of the third light-emitting device 230; and the insulating material film 0233 can be used to form the insulating part 401 corresponding to the third light-emitting device 230.

[0236] As described above, the light-emitting part 202 and cathode 203 of the light-emitting devices 2 of different colors are manufactured separately, and the pixel openings (including the first opening 31 through which the second opening 61 is connected) corresponding to the light-emitting devices 2 of different colors are manufactured separately. Before step a25, the process also includes: forming a pixel opening corresponding to the third light-emitting device 230 (including the second opening 61 (i.e., the first sub-pixel opening 611) corresponding to the third light-emitting device 230 and the first opening 31 through which it is connected).

[0237] In the process of etching the isolation structure film 03 to form multiple third light-emitting devices 230 corresponding to the first opening 31, a photoresist layer is first formed on the side of the isolation structure film 03 away from the pixel defining film 06. This photoresist layer has multiple openings, and the positions of the openings in the photoresist layer are opposite to the first opening 31 of the third light-emitting device 230 to be formed. Using this photoresist layer as a mask, the isolation structure film 03 is etched (e.g., dry etching), removing the portion of the isolation structure film 03 corresponding to the position of the photoresist layer to be formed. Then, a third organic protective layer 015 is formed at the position corresponding to the position of the light-emitting device 2 to be formed. The isolation structure film 03 is etched again using an alkaline etching solution, so that the cross-sectional shape of the formed isolation structure layer 3 is approximately "I" shaped, as shown in Figure 20A. Referring to Figures 20A and 20B, after the isolation structure layer 3 is formed, the third organic protective layer 015 is removed.

[0238] It can be understood that, as shown in FIG. 21, in the step a26, the thickness of the third luminescent material film 0231 and the thickness of the cathode film 0232 are small, and after the third luminescent material film 0231 and the cathode film 0232 are deposited, the part of the third luminescent material film 0231 located in the third sub-pixel opening 613 and the first opening 31 penetrating therethrough is disconnected from the part of the third luminescent material film 0231 located away from the surface of the driving substrate 1 of the isolation structure layer 3, and the part of the cathode film 0232 located in the third sub-pixel opening 613 and the first opening 31 penetrating therethrough is disconnected from the part of the cathode film 0232 located away from the surface of the driving substrate 1 of the isolation structure layer 3.

[0239] For example, the third luminescent material film 0231 can be deposited by an evaporation process.

[0240] For example, the cathode film 0232 can be formed by a sputtering or evaporation process.

[0241] For example, the insulating material film 0233 can be formed by a chemical vapor deposition (CVD) process.

[0242] a27: As shown in FIG. 22, the third laminated film is etched to form the third luminescent part 231, the third cathode 232 and the third insulating part 233 located in the third sub-pixel opening 613 and the first opening 31 penetrating therethrough, and the edge of the third insulating part 233 is overlapped on the side of the isolation structure layer 3 away from the driving substrate 1.

[0243] It should be noted that, in the case that the third sub-pixel opening 613 corresponds to the third luminescent device 230, the third luminescent part 231 is the luminescent part 202 of the third luminescent device 230, the third cathode 232 is the cathode 203 of the third luminescent device 230, and the third insulating part 233 is the insulating part 401 arranged corresponding to the third luminescent device 230.

[0244] At this point, the preparation of the third luminescent device 230 is completed.

[0245] It can be understood that the insulating parts 401 arranged corresponding to the plurality of luminescent devices 2 constitute the insulating layer 4.

[0246] After the luminescent parts 202 of the plurality of luminescent devices 2 (including the plurality of first luminescent devices 210, the plurality of second luminescent devices 220 and the third luminescent device 230) and the corresponding insulating parts 401 are completed, the auxiliary electrode layer 5 is formed on the side of the insulating layer 4 away from the isolation structure layer 3, as shown in FIG. 23.

[0247] In some examples, after the auxiliary electrode layer 5 is formed on the side of the insulating layer 4 away from the isolation structure layer 3, the preparation method further comprises: forming an encapsulation structure 8 on the side of the auxiliary electrode layer 5 away from the driving substrate 1. The encapsulation structure 8 comprises a first inorganic encapsulation layer 81, an organic encapsulation layer 82 and a second inorganic encapsulation layer 83 which are sequentially stacked in the direction away from the driving substrate 1.

[0248] Exemplarily, the material of the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 83 comprises a combination of one or more of silicon nitride (SiNx), silicon dioxide (SiOx) and silicon oxynitride (SiON). The first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 83 can be formed by a chemical vapor deposition (CVD) process.

[0249] Exemplarily, the material of the organic encapsulation layer 82 comprises a polymer combination of one or more of an acrylic-based polymer, a silicon-based polymer and an epoxy-based polymer. The above material is made on the first inorganic encapsulation layer 81 by an ink jet printing (IJP) method, and is subjected to ultraviolet (UV) curing to form the organic encapsulation layer 82.

[0250] Exemplarily, the thickness of the first inorganic encapsulation layer 81 can be set to about 1.0 μm. The thickness of the second inorganic encapsulation layer 83 can be set to about 0.4 μm.

[0251] In some examples, the preparation method further comprises: forming a touch structure layer 9 on the side of the encapsulation structure 8 away from the driving substrate 1.

[0252] In the display panel 300 prepared by the preparation method of the embodiments of the present disclosure, the entire auxiliary electrode layer 5 is electrically connected with the isolation structure layer 3, and the isolation structure layer 3 is electrically connected with the cathode 203 of the light-emitting device 2, so that the entire cathode is realized. In addition, the problem that the partial sub-pixels are in an island state due to poor overlap between the partial cathode 203 and the isolation structure layer 3, and the electrical signals received by the partial sub-pixels in the island state are inconsistent with those received by other sub-pixels, thereby affecting the accuracy of the touch function of the touch structure layer 9, can be avoided.

[0253] The above merely describes specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which shall be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, comprising: a driving substrate; a separation structure layer disposed on the driving substrate, the separation structure layer defining a plurality of first openings; a plurality of light emitting devices, one of the light emitting devices corresponding to one of the first openings, the light emitting device comprising an anode, a light emitting part and a cathode stacked in sequence away from the driving substrate, the cathode being electrically connected to the separation structure layer; an insulating layer disposed on a side of the separation structure layer away from the driving substrate, the insulating layer having a plurality of through holes for exposing a surface of the separation structure layer away from the driving substrate; and an auxiliary electrode layer disposed on a side of the insulating layer away from the separation structure layer, the auxiliary electrode layer being in electrical contact with the surface of the separation structure layer exposed by the plurality of through holes, and the auxiliary electrode layer being made of a transparent conductive material. The insulating layer comprises a plurality of insulating parts disconnected from each other, one of the insulating parts being located in one of the first openings, and edges of the insulating parts being overlapped on a side of the separation structure layer away from the driving substrate, gaps being formed between adjacent insulating parts, the gaps forming the through holes. In a direction perpendicular to a thickness direction of the display panel, a width of the through hole is equal to or substantially equal to a distance between two adjacent first openings of the separation structure layer away from the driving substrate. A pixel defining layer is disposed on the driving substrate, the pixel defining layer defining a plurality of second openings, one of the second openings corresponding to one of the anodes. The pixel defining layer further has a recess, and the separation structure layer is disposed in the recess. Further comprising: a pad layer disposed on a bottom of the recess, and the separation structure layer is disposed on a side of the pad layer away from the driving substrate. The pad layer is made of an organic material, and the pixel defining layer is made of an inorganic material. The pad layer comprises a first sub-part, and the first sub-part covers a bottom wall of the recess. The pad layer further comprises a second sub-part connected to the first sub-part, and the second sub-part covers a side wall of the recess. A distance from a surface of the first sub-part away from the driving substrate to the driving substrate is less than a distance from a surface of the pixel defining layer away from the driving substrate to the driving substrate. A distance from a surface of the separation structure layer away from the driving substrate to the driving substrate is greater than or equal to the distance from the surface of the pixel defining layer away from the driving substrate to the driving substrate. A ratio of the distance from the surface of the first sub-part away from the driving substrate to the driving substrate to the distance from the surface of the pixel defining layer away from the driving substrate to the driving substrate is greater than or equal to 0.5 and less than 1. The recess is disposed around the light emitting device. The recess penetrates the pixel defining layer in a direction perpendicular to the driving substrate, or a bottom wall of the recess is located inside the pixel defining layer, and a slot of the recess faces away from the driving substrate. ​ ​ ​ ​ ​ 2. The display panel of claim 1, wherein, ​ 3. The display panel of claim 1, wherein, ​ 4. The display panel of any one of claims 1-3, further comprising: ​ ​ 5. The display panel of claim 4, wherein, ​ ​ 6. The display panel of claim 5, wherein, ​ 7. The display panel of claim 5 or 6, wherein, ​ 8. The display panel of claim 7, wherein, ​ 9. The display panel of claim 7 or 8, wherein, ​ 10. The display panel of claim 9, wherein, ​ 11. The display panel according to any one of claims 7 to 10, wherein ​ 12. The display panel according to any one of claims 4 to 11, wherein, ​ 13. The display panel according to any one of claims 4 to 12, wherein, ​ ​ 14. The display panel according to any one of claims 1 to 13, wherein, ​ A packaging structure is arranged on a side of the auxiliary electrode layer away from the driving substrate, and the packaging structure comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked in a direction away from the driving substrate; and A touch structure layer is arranged on a side of the packaging structure away from the auxiliary electrode layer.

15. A manufacturing method of a display panel, comprising: forming an isolation structure layer and a plurality of light emitting devices on the driving substrate; the isolation structure layer has a plurality of first openings, one of the light emitting devices is arranged in one of the first openings, the light emitting device comprises an anode, a light emitting part and a cathode which are sequentially stacked in a direction away from the driving substrate, and the cathode is electrically connected with the isolation structure layer; forming an insulating layer on a side of the isolation structure layer away from the driving substrate, the insulating layer has a plurality of through holes, and the plurality of through holes expose a surface of the isolation structure layer away from the driving substrate; forming an auxiliary electrode layer on a side of the insulating layer away from the isolation structure layer, the auxiliary electrode layer is in electrical contact with the surface of the isolation structure layer exposed by the plurality of through holes, and the auxiliary electrode layer is light-transmissive.

16. The method of manufacturing according to claim 15, wherein, Before forming the isolation structure layer on the driving substrate, the manufacturing method further comprises: forming a pixel defining film on the driving substrate; etching the pixel defining film to form a groove; forming a pad layer on a bottom of the groove.

17. The method of making according to claim 16, wherein, forming the isolation structure layer comprises: forming an isolation structure film on the pixel defining film; etching the isolation structure film to form the isolation structure layer having the plurality of first openings, and the first openings expose part of the pixel defining film; etching the pixel defining film via the first openings to form a pixel defining layer having a plurality of second openings, and one of the second openings is in communication with one of the first openings.

18. The method of making according to claim 17, wherein, the plurality of second openings comprises a first sub-pixel opening and a second sub-pixel opening; forming the light emitting device and forming the insulating layer comprises: forming a first laminated film covering the pixel defining layer and the isolation structure layer, the first laminated film comprises a first light emitting material film, a cathode film and an insulating material film which are sequentially stacked in a direction away from the driving substrate; etching the first laminated film to form a first light emitting part, a first cathode and a first insulating part in the first sub-pixel opening and the first opening in communication therewith, and an edge of the first insulating part overlaps a side of the isolation structure layer away from the driving substrate; forming a second laminated film covering the pixel defining layer and the isolation structure layer, the second laminated film comprises a second light emitting material film, a cathode film and an insulating material film which are sequentially stacked in a direction away from the driving substrate; etching the second laminated film to form a second light emitting part, a second cathode and a second insulating part in the second sub-pixel opening and the first opening in communication therewith, and an edge of the second insulating part overlaps a side of the isolation structure layer away from the driving substrate; Etching the first insulating part and the second insulating part to overlap on a side of the isolation structure layer away from the driving substrate to form the through hole.

19. A display device, comprising: The display panel according to any one of claims 1-14; A circuit board electrically connected with the display panel.

Images