Automatic semiconductor base surface treatment process

Abstract

The invention discloses an automatic semiconductor base surface treatment process, and belongs to the field of semiconductor base production. The device comprises a coating plate which can be overturned to cover an overturning plate, a glue dripping groove in the surface of the coating plate can be aligned with the side edge of a semiconductor base, organic high-temperature glue dripping from the glue dripping groove can slide to a specific position of the semiconductor base, and a sliding laying rod is arranged in the coating plate. The paving rod slides to drive dripping organic high-temperature glue to be flatly paved on the surface of the semiconductor base, meanwhile, a sliding driving block is arranged in the coating plate, the driving block continuously slides to drive a moving rod to slide, then a sealing block for sealing a glue dripping groove is promoted to rotate, dripping glue at the local position can be promoted to drip, and after the driving block and the moving rod are separated, the coating plate is fixed. The moving rod moves reversely under the action of the fixing spring to limit dripping of the organic high-temperature glue, meanwhile, the driving block and the laying rod are fixed, the laying rod can make the dripping glue on the surface of the semiconductor base tiled, and it is guaranteed that the dripping glue on the surface of the semiconductor base is flat and even in thickness.

Description

Technical Field

[0001] This invention relates to the field of semiconductor substrate manufacturing, and in particular to an automated semiconductor substrate surface treatment process. Background Technology

[0002] Semiconductor substrates are key components in semiconductor manufacturing, and are generally classified into vibration-isolated substrates, coated graphite substrates, and insulating substrates. They have a significant impact on the precision, stability, and efficiency of semiconductor manufacturing.

[0003] The reference patent title is: A Semiconductor Substrate Coating Process (Patent Publication No.: CN116689255B), which specifically includes the following steps: Step 1: The semiconductor substrate is thoroughly cleaned of impurities and tested for qualification using external cleaning and testing equipment; Step 2: Several qualified semiconductor substrates are sequentially flipped onto the coating equipment for coating operation; Step 3: The coated semiconductor is removed from the coating equipment; After the organic high-temperature adhesive is applied, a rotary cylinder drives the flipping plate to rotate 180 degrees. At this time, one end of the flipping plate contacts the support base. Simultaneously, the iron filings located in the storage tank are attracted by the magnetism on the heat sink base, so that the iron filings are embedded in the organic high-temperature adhesive and also adsorbed on the surface of the heat sink base. One end of the iron filings extends out of the organic high-temperature adhesive, and the other end contacts the heat sink base, thereby increasing the heat dissipation area of ​​the heat sink base and improving the heat dissipation efficiency of the heat sink base for the laser diode.

[0004] However, the following problems exist when implementing the above technical solutions: it is difficult to ensure the overall flatness of the high-temperature adhesive on the surface in the above devices, which in turn makes it difficult to ensure the flatness of the semiconductor substrate after covering with iron filings; when using a brush to apply organic high-temperature adhesive, the bending and rebound of the brush bristles will cause the adhesive to form uneven areas on the substrate surface, making it difficult to control the distribution of the adhesive, and the brush may leave brush marks or streaks during the application process, which may result in areas with thick adhesive or no adhesive on the surface of the semiconductor substrate, affecting the flatness of the semiconductor substrate after processing.

[0005] In summary, the use of a brush when applying high-temperature adhesive to the surface of a semiconductor substrate in the existing technology has the problem of difficulty in ensuring uniform adhesive application, which affects the flatness of the semiconductor substrate during processing. Summary of the Invention

[0006] This invention provides an automated semiconductor substrate surface treatment process, which can solve the problem in the prior art where a brush is used to apply high-temperature adhesive to the surface of a semiconductor substrate, which makes it difficult to ensure the uniformity of the adhesive and affects the flatness of the semiconductor substrate.

[0007] An automated semiconductor substrate surface treatment process specifically includes the following steps: Step 1: Flip the clean semiconductor substrate onto the flip plate of the coating equipment; Step 2: Flip the coating plate to make the coating plate stage parallel, and apply adhesive to the surface of the semiconductor substrate through the coating operation; Step 3: Restore the coating plate to its original position, flip the plate over, fix the iron filings on the semiconductor substrate surface, remove and store it. The specific coating operation in step two is as follows: Organic high-temperature adhesive is manually filled into the coating plate. The drive motor is started, the drive block moves, the drive block pushes the moving rod to slide, the sealing block inside the dispensing tank rotates, the organic high-temperature adhesive flows inside the dispensing tank and drips onto the surface of the semiconductor substrate. The drive block continues to move, the moving rod moves under the action of the moving spring, the sealing block rotates to seal the dispensing tank, and at the same time the spreading rod on the surface of the drive block comes into contact with the organic high-temperature adhesive and spreads the organic high-temperature adhesive evenly.

[0008] Optionally, a tilting cylinder is fixedly connected to the surface of the worktable, and the end of the output shaft inside the tilting cylinder is fixedly connected to the coating plate.

[0009] Optionally, a drive rod is fixedly connected to the output shaft end of the drive motor, and the drive rod is threadedly connected to the drive block; the drive block includes a sliding block and a triangular block, the sliding block and the triangular block are fixedly connected, the sliding block is threadedly connected to the drive rod, and the distance between the triangular block and the moving rod is less than the distance between the sliding block and the moving rod.

[0010] Optionally, a sliding rod is fixedly connected inside the coating plate, and the sliding rod is slidably connected to a sliding block.

[0011] Optionally, the closed block has a through groove inside, the through groove is adapted to the moving rod, a moving shaft is fixedly connected inside the through groove, and a spiral groove is formed on the surface of the moving rod, the moving shaft is adapted to the spiral groove.

[0012] Optionally, connecting blocks are fixedly connected to both ends of the laying rod, one of the connecting blocks is fixedly connected to the driving block, and the other connecting block is slidably connected to the coating plate. The cross-section of the laying rod is trapezoidal, and the inclined surface of the laying rod faces the coating plate.

[0013] Optionally, the surface of the pole is provided with a partition groove and two inclined grooves. The partition groove and the inclined groove are both provided on the inclined surface of the pole. The partition groove is connected to the inclined groove, and the two inclined grooves are symmetrically arranged. The surface of the connecting block is provided with a connecting groove, and the connecting groove is connected to the inclined groove.

[0014] Optionally, a receiving block is slidably connected to the surface of the connecting block, and a receiving groove is formed on the surface of the receiving block.

[0015] Optionally, the surface of the connecting block is provided with a sliding groove, and the surface of the receiving block is fixedly connected with a sliding shaft, the sliding shaft being adapted to the sliding groove.

[0016] Optionally, the drip groove includes a conical groove and a rectangular groove, the conical groove and the rectangular groove are connected, the closing block is located at the junction of the conical groove and the rectangular groove, and the distance between the conical groove and the laying rod is greater than the distance between the rectangular groove and the laying rod.

[0017] This invention provides an automated semiconductor substrate surface treatment process, including a coating plate that can be flipped to cover a flip plate. The coating plate surface has a dispensing groove that can be aligned with the side of the semiconductor substrate. Organic high-temperature adhesive dripping from the dispensing groove can slide to a specific position on the semiconductor substrate. A sliding spreading rod is provided inside the coating plate. The sliding of the spreading rod can cause the dripping organic high-temperature adhesive to spread evenly on the surface of the semiconductor substrate. At the same time, a sliding driving block is provided inside the coating plate. The continuous sliding of the driving block can drive a moving rod to slide, thereby causing the sealing block that closes the dispensing groove to rotate, thereby enabling the dispensing of adhesive to fall at a local position. When the driving block and the moving rod are separated, the moving rod can move in the opposite direction under the action of a fixed spring, limiting the dripping of organic high-temperature adhesive and fixing the driving block and the spreading rod. The spreading rod can make the dispensing of adhesive on the surface of the semiconductor substrate spread evenly, thereby ensuring that the dispensing of adhesive on the surface of the semiconductor substrate is flat and of uniform thickness, so that the surface of the semiconductor substrate is flat after iron filings are fixed. Dividing grooves and oblique grooves are made on the surface of the pole. The oblique grooves can guide the high temperature of the organic adhesive on the surface of the pole and slide it towards both ends of the pole. It can also slide into the inside of the receiving block through the connecting groove, so that the excess high temperature organic adhesive can accumulate inside the receiving block for subsequent continuous use. Attached Figure Description

[0018] Figure 1 A schematic diagram of an automated semiconductor substrate surface treatment process structure provided by the present invention; Figure 2 A three-dimensional sectional view of the dispensing tank provided by the present invention; Figure 3 An exploded view of the three-dimensional structure of the closed block provided by the present invention; Figure 4 Provided by the present invention Figure 3 Enlarged view of the local structure at point A; Figure 5 A three-dimensional view of the moving shaft provided by the present invention.

[0019] Explanation of reference numerals in the attached figures: 1. Workbench; 2. Flip-over plate; 31. Coating plate; 32. Drive block; 33. Moving rod; 34. Sealing block; 35. Glue drip tray; 36. Moving spring; 37. Laying rod; 41. Tilting cylinder; 42. Drive rod; 43. Sliding rod; 44. Moving shaft; 45. Spiral groove; 51. Connecting block; 52. Partition groove; 53. Inclined groove; 54. Connecting groove; 55. Receiving block; 56. Sliding shaft. Detailed Implementation

[0020] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0021] like Figures 1 to 5 As shown in the figure, an automated semiconductor substrate surface treatment process provided by an embodiment of the present invention specifically includes the following steps: Step 1: The clean semiconductor substrate, after being cleaned and tested by external equipment, is flipped onto the flip plate 2 of the coating equipment; Step 2: Flip the coating plate 31 and apply adhesive to the surface of the semiconductor substrate through a coating operation; Step 3: Restore the position of the coating plate 31, flip the flip plate 2, fix the iron filings on the surface of the semiconductor substrate, and remove and store the iron filings after they are fixed. The specific coating operation in step two is as follows: After the coating plate 31 is flipped over, it is made parallel to the workbench 1, and the surface dispensing groove 35 is aligned with the side of the semiconductor substrate. Organic high-temperature adhesive is manually filled into the coating plate 31, and then the drive motor is started to move the drive block 32. After the drive block 32 moves, it contacts the moving rod 33 and pushes the moving rod 33 to slide, causing the sealing block 34 inside the dispensing groove 35 to rotate. The organic high-temperature adhesive flows inside the dispensing groove 35 and drips onto the surface of the semiconductor substrate. The drive block 32 continues to move, and the moving rod 33 moves under the action of the moving spring 36. The sealing block 34 rotates again to seal the dispensing groove 35. At the same time, the spreading rod 37 on the surface of the drive block 32 contacts the organic high-temperature adhesive, and the spreading rod 37 spreads the organic high-temperature adhesive evenly onto the surface of the semiconductor substrate. It should be noted that the flip plate 2 has a structure that can limit the semiconductor base, and the displacement of the flip plate 2 and the fixing of iron filings on the surface of the semiconductor base are both existing technologies. In summary, the automated semiconductor substrate surface treatment process provided by this embodiment of the invention includes a coating plate 31 that can be flipped to cover a flip plate 2. The surface of the coating plate 31 has a dispensing groove 35 that can be aligned with the side of the semiconductor substrate. Organic high-temperature adhesive dripped from the dispensing groove 35 can slide to a specific position on the semiconductor substrate. A sliding spreading rod 37 is provided inside the coating plate 31. The sliding of the spreading rod 37 can cause the dripped organic high-temperature adhesive to spread evenly on the surface of the semiconductor substrate. Simultaneously, a sliding driving block 32 is provided inside the coating plate 31 to drive... The continuous sliding of block 32 can drive the sliding rod 33 to slide, thereby causing the sealing block 34 of the closed dispensing tank 35 to rotate, which in turn can cause the dispensing of adhesive to drip in a local position. When the driving block 32 and the moving rod 33 are separated, the moving rod 33 can move in the opposite direction under the action of the fixed spring, limiting the dripping of organic high temperature adhesive, while fixing the driving block 32 and the spreading rod 37. The spreading rod 37 can make the dispensing of adhesive on the surface of the semiconductor substrate flat, thereby ensuring that the dispensing of adhesive on the surface of the semiconductor substrate is flat and of uniform thickness, and making the semiconductor substrate surface flat after fixing iron filings. In some specific implementations, a tilting cylinder 41 is fixedly connected to the surface of the workbench 1, and the end of the output shaft inside the tilting cylinder 41 is fixedly connected to the coating plate 31; the tilting cylinder 41 can drive the coating plate 31 to rotate around the output shaft, thereby controlling the position of the coating plate 31; In some specific implementations, a drive rod 42 is fixedly connected to the output shaft end of the drive motor, the drive rod 42 is threadedly connected to the drive block 32, and the drive motor is electrically connected to an external power source; the drive block 32 includes a sliding block and a triangular block, the sliding block and the triangular block are fixedly connected, the sliding block is threadedly connected to the drive rod 42, and the distance between the triangular block and the moving rod 33 is less than the distance between the sliding block and the moving rod 33; In a further embodiment, a sliding rod 43 is fixedly connected inside the coating plate 31, and the sliding rod 43 is slidably connected to the sliding block; the sliding block is provided with a sliding rod 43 and a drive rod 42 threadedly connected to the inside of the sliding block. When the drive rod 42 rotates, it can cause the sliding block to slide inside the coating plate 31, and the sliding of the sliding block is restricted by the sliding rod 43, thereby limiting the sliding path of the sliding block inside the coating plate 31. In some specific implementations, the closed block 34 has a through groove inside, the through groove is adapted to the moving rod 33, the moving shaft 44 is fixedly connected inside the through groove, and the moving rod 33 has a spiral groove 45 on its surface, the moving shaft 44 is adapted to the spiral groove 45. In some specific implementations, the two ends of the laying rod 37 are fixedly connected to connecting blocks 51, one of the connecting blocks 51 is fixedly connected to the driving block 32, and the other connecting block 51 is slidably connected to the coating plate 31. The cross-section of the laying rod 37 is trapezoidal, and the inclined surface of the laying rod 37 faces the coating plate 31. In a further embodiment, the surface of the laying rod 37 is provided with a partition groove 52 and two inclined grooves 53. The partition groove 52 and the inclined grooves 53 are both provided on the inclined surface of the laying rod 37. The partition groove 52 is connected to the inclined grooves 53, and the two inclined grooves 53 are symmetrically arranged. The surface of the connecting block 51 is provided with a connecting groove 54, and the connecting groove 54 is connected to the inclined grooves 53. After the laying rod 37 pushes the organic high-temperature adhesive to slide, some of the excess organic high-temperature adhesive can stay inside the partition groove 52 and slide along the inclined grooves 53 towards both ends of the laying rod 37. In a further embodiment, a receiving block 55 is slidably connected to the surface of the connecting block 51, and a receiving groove is formed on the surface of the receiving block 55; excess organic high-temperature adhesive on the surface of the rod 37 can slide into the receiving groove and be collected. In a further embodiment, a sliding groove is formed on the surface of the connecting block 51, and a sliding shaft 56 is fixedly connected to the surface of the receiving block 55, wherein the sliding shaft 56 is adapted to the sliding groove; In some specific implementations, the drip groove includes a conical groove and a rectangular groove, the conical groove and the rectangular groove are connected, the closing block 34 is located at the junction of the conical groove and the rectangular groove, and the distance between the conical groove and the laying rod 37 is greater than the distance between the rectangular groove and the laying rod 37; by setting the drip groove as a combination of conical groove and rectangular groove, when the organic high-temperature adhesive slides to the position of the rectangular groove, it will be spread out, thereby extending the organic high-temperature adhesive. When the laying rod 37 pushes the organic high-temperature adhesive, it can ensure that the organic high-temperature adhesive completely covers the semiconductor substrate. Working principle of the invention: After the semiconductor substrate is inverted onto the surface of the flip plate 2, the flip cylinder 41 is manually controlled to make the coating block parallel to the worktable 1. The coating plate 31 covers the flip plate 2, and the surface dispensing groove 35 is aligned with the side of the semiconductor substrate. Organic high-temperature adhesive is manually filled into the coating plate 31. Then, the drive motor is started to make the drive rod 42 rotate, causing the drive block 32 to move inside the coating plate 31. After the drive block 32 moves, the triangular block on its surface contacts the moving rod 33 and pushes the moving rod 33 to slide. The sealing block 34 inside the dispensing groove 35 moves along the moving shaft 44. Under the action of the spiral groove 45, the organic high-temperature adhesive flows inside the dispensing tank 35 and drips onto the surface of the semiconductor substrate. The drive block 32 continues to move, and the moving rod 33 moves under the action of the moving spring 36. The closing block 34 rotates again to close the dispensing tank 35. At the same time, the spreading rod 37 on the surface of the drive block 32 comes into contact with the organic high-temperature adhesive. The spreading rod 37 makes the organic high-temperature adhesive spread evenly on the surface of the semiconductor substrate. After all the semiconductor substrates are covered with organic high-temperature adhesive, the drive motor is turned off and the flipping cylinder 41 is controlled to make the coating block perpendicular to the worktable 1.

[0022] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An automated semiconductor susceptor surface treatment process, characterized by, Specifically, the following steps are included: Step 1: Flip the clean semiconductor substrate onto the flip plate (2) of the coating equipment; Step 2: Flip the coating plate (31) so that the coating plate (31) is parallel to the worktable (1), and apply adhesive to the surface of the semiconductor substrate through the coating operation; Step 3: Restore the position of the coating plate (31), flip the flip plate (2), fix the iron filings on the surface of the semiconductor substrate, take them out and store them; The specific coating operation in step two is as follows: Organic high-temperature adhesive is manually filled into the coating plate (31). The drive motor is started, the drive block (32) moves, the drive block (32) pushes the moving rod (33) to slide, the sealing block (34) inside the dispensing tank (35) rotates, the organic high-temperature adhesive flows inside the dispensing tank (35) and drips onto the surface of the semiconductor substrate. The drive block (32) continues to move, the moving rod (33) moves under the action of the moving spring (36), the sealing block (34) rotates to seal the dispensing tank (35), and at the same time the spreading rod (37) on the surface of the drive block (32) comes into contact with the organic high-temperature adhesive and makes the organic high-temperature adhesive spread flat.

2. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, A tilting cylinder (41) is fixedly connected to the surface of the workbench (1), and the end of the output shaft inside the tilting cylinder (41) is fixedly connected to the coating plate (31).

3. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, The output shaft end of the drive motor is fixedly connected to a drive rod (42), and the drive rod (42) is threadedly connected to the drive block (32); the drive block (32) includes a sliding block and a triangular block, the sliding block and the triangular block are fixedly connected, the sliding block is threadedly connected to the drive rod (42), and the distance between the triangular block and the moving rod (33) is less than the distance between the sliding block and the moving rod (33).

4. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, The coating plate (31) is internally fixedly connected to a sliding rod (43), which is slidably connected to a sliding block.

5. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, The closed block (34) has a through groove inside, which is adapted to the moving rod (33). A moving shaft (44) is fixedly connected inside the through groove. A spiral groove (45) is opened on the surface of the moving rod (33), and the moving shaft (44) is adapted to the spiral groove (45).

6. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, The two ends of the laying rod (37) are fixedly connected to connecting blocks (51). One of the connecting blocks (51) is fixedly connected to the driving block (32), and the other connecting block (51) is slidably connected to the coating plate (31). The cross-section of the laying rod (37) is trapezoidal, and the inclined surface of the laying rod (37) faces the coating plate (31).

7. The automated semiconductor substrate surface treatment process as described in claim 6, characterized in that, The surface of the paving rod (37) is provided with a partition groove (52) and two inclined grooves (53). The partition groove (52) and the inclined grooves (53) are both opened on the inclined surface of the paving rod (37). The partition groove (52) and the inclined grooves (53) are connected, and the two inclined grooves (53) are symmetrically arranged. The surface of the connecting block (51) is provided with a connecting groove (54). The connecting groove (54) is connected to the inclined grooves (53).

8. The automated semiconductor substrate surface treatment process as described in claim 6, characterized in that, The connecting block (51) has a receiving block (55) slidably connected to its surface, and the receiving block (55) has a receiving groove on its surface.

9. The automated semiconductor substrate surface treatment process as described in claim 8, characterized in that, The connecting block (51) has a sliding groove on its surface, and the receiving block (55) has a sliding shaft (56) fixedly connected to its surface. The sliding shaft (56) is adapted to the sliding groove.

10. The automated semiconductor substrate surface treatment process as described in claim 1, characterized in that, The drip groove includes a conical groove and a rectangular groove, the conical groove and the rectangular groove are connected, the closing block (34) is located at the junction of the conical groove and the rectangular groove, and the distance between the conical groove and the laying rod (37) is greater than the distance between the rectangular groove and the laying rod (37).

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