Capacitive ceramic base vacuum gauge with microstructured support

Abstract

The invention relates to the field of capacitive vacuum gauges, and discloses a capacitive ceramic base vacuum gauge with a micro-structured support, which comprises a main body, a metal film is transversely and horizontally arranged in the middle of the inner side of the main body, and a ceramic substrate is arranged on the inner side of the main body corresponding to the upper end of the metal film. A space formed by the upper end of the metal film and the inner side of the body is a vacuum cavity, a vacuumizing connector is arranged at the middle end of the top of the body, a space formed by the lower end of the metal film and the inner side of the body is a medium cavity, a positive electrode connecting ring is arranged on one side of the upper end of the body, and a positive electrode conductive assembly is arranged on the inner side of the positive electrode connecting ring. According to the invention, through the annular array design of the micro support columns, precise support of the metal film is realized, excessive deformation damage of the metal film is effectively avoided, diaphragm vibration is inhibited, signal instability is reduced, and measurement stability is significantly improved; the buffer pad design of the metal film and the ceramic substrate further absorbs external vibration and pressure impact, reduces the loss of parts, and prolongs the service life of equipment.

Description

Technical Field

[0001] This invention relates to the field of capacitive vacuum gauges, and more particularly to a capacitive ceramic base vacuum gauge with microstructured support. Background Technology

[0002] A capacitive ceramic-based vacuum gauge is a high-precision vacuum measuring instrument based on capacitive sensing technology. Its core principle is to indirectly reflect the vacuum level by detecting changes in capacitance caused by deformation of the ceramic material. The core function of this type of vacuum gauge relies on a capacitance detection structure, and its corresponding valid IPC classification number is H01G (capacitors; electrolytic capacitors, rectifiers, detectors, switching devices, photosensitive devices, or thermistors). The capacitive ceramic-based vacuum gauge utilizes the principle of a parallel-plate capacitor. When a pressure difference exists inside and outside the vacuum chamber, the ceramic substrate undergoes slight deformation due to the force, causing a change in the distance between the two electrodes, thus resulting in a change in capacitance. By detecting this change in capacitance and combining it with a pre-calibrated pressure-capacitance relationship curve, the corresponding vacuum level can be calculated.

[0003] Existing capacitive vacuum gauges suffer from technical problems in practical applications, including poor measurement stability, easy damage to the metal thin film, insufficient installation compatibility, and susceptibility to interference from impurities. The elastic diaphragm of traditional capacitive vacuum gauges lacks an effective support structure, and the traditional ceramic substrate support structure has poor compatibility with the metal thin film, making it prone to damage due to stress concentration. At the same time, the diaphragm is prone to excessive deformation or even rupture when the differential pressure fluctuates greatly, and diaphragm vibration can also lead to unstable measurement signals. Gaps are easily present when assembling the diaphragm, substrate, and main body of existing vacuum gauges, which can cause relative displacement under environmental vibration or pressure impact, resulting in increased measurement errors. Summary of the Invention

[0004] The technical problem to be solved by this invention is to provide a capacitive ceramic base vacuum gauge with microstructured support to solve the technical problems of poor measurement stability, easy damage to metal thin film, insufficient installation compatibility and susceptibility to impurities in the practical application of existing capacitive vacuum gauges. The elastic diaphragm of traditional capacitive vacuum gauges lacks an effective support structure, and the traditional ceramic base support structure has poor compatibility with metal thin film, which easily leads to film damage due to stress concentration. At the same time, the diaphragm is prone to excessive deformation or even rupture when the pressure difference fluctuates greatly. Diaphragm vibration can also lead to unstable measurement signals. In existing vacuum gauges, gaps are easily present when the diaphragm, substrate and body are assembled. Under environmental vibration or pressure impact, relative displacement will occur, resulting in increased measurement error.

[0005] To address the aforementioned problems, the present invention is implemented through the following technical solution.

[0006] A capacitive ceramic-based vacuum gauge with microstructured support includes: a main body; a metal thin film horizontally disposed in the middle of the inner side of the main body; a ceramic substrate disposed on the upper end of the metal thin film on the inner side of the main body; a space formed by the upper end of the metal thin film and the inner side of the main body forming a vacuum cavity; a vacuum connector disposed at the middle of the top of the main body; a dielectric cavity formed by the lower end of the metal thin film and the inner side of the main body; a positive electrode connecting ring disposed on one side of the upper end of the main body, and a positive electrode conductive component disposed inside the positive electrode connecting ring; a negative electrode connecting ring disposed on the side of the upper end of the main body away from the positive electrode connecting ring, and a negative electrode conductive component disposed inside the negative electrode connecting ring; micro-support pillars disposed on the side of the ceramic substrate facing the metal thin film, and the micro-support pillars are distributed in a ring array on one side of the ceramic substrate, with a spacing of 200-300μm between the micro-support pillars; the top of the micro-support pillars is polished and the roughness Ra≤0.1μm; a top cover is disposed on the top of the main body; and a filter connecting component is disposed on the bottom of the main body.

[0007] In one embodiment, the outer ring of the metal film is wrapped with a first buffer pad, and the outer side of the first buffer pad is tightly fitted with the inner side of the main body.

[0008] In one embodiment, the outer ring of the ceramic substrate is wrapped with a second buffer pad, and the outer side of the second buffer pad is in close contact with the inner side of the main body.

[0009] In one embodiment, the positive electrode conductive component includes a positive electrode wire, a first protective sleeve, a positive electrode capacitor plate, a positive electrode conductor rod, and a first lower capacitor plate. The positive electrode wire passes through the positive electrode connecting ring and the main body and extends into the vacuum cavity.

[0010] In one embodiment, one end of the positive electrode wire extending into the vacuum cavity is connected to a positive electrode capacitor plate, a first protective sleeve is provided on the outside of the positive electrode wire, and the outside of the first protective sleeve is tightly fitted to the inside of the main body, and the positive electrode capacitor plate is fan-shaped.

[0011] In one embodiment, the bottom of the positive capacitor plate is provided with positive conductor rods arranged in a ring at equal intervals. The positive conductor rods penetrate the interior of the ceramic substrate. A first lower capacitor plate is provided on the side of the positive conductor rod away from the positive capacitor plate. One side of the first lower capacitor plate is in close contact with the bottom of the ceramic substrate.

[0012] In one embodiment, the negative electrode conductive component includes a negative electrode wire, a second protective sleeve, a negative electrode capacitor plate, a negative electrode conductor rod, and a second lower capacitor plate. The negative electrode wire passes through the positive electrode connecting ring and the main body and extends into the vacuum cavity.

[0013] In one embodiment, one end of the negative electrode wire extending into the vacuum cavity is connected to a negative electrode capacitor plate, and a second protective sleeve is provided on the outside of the negative electrode wire, with the outer side of the second protective sleeve tightly fitted to the inner side of the main body.

[0014] In one embodiment, the negative capacitor plate is fan-shaped, and negative conductor rods are provided at equal intervals in an annular pattern at the bottom of the negative capacitor plate. The negative conductor rods penetrate the interior of the ceramic substrate. A second lower capacitor plate is provided on the side of the negative conductor rod away from the negative capacitor plate, and one side of the second lower capacitor plate is in close contact with the bottom of the ceramic substrate.

[0015] In one embodiment, the filter connection assembly includes a connecting base sleeve, a threaded ring, and a filter screen. The connecting base sleeve has threaded rings on both its outer side and the inner side of the bottom of the main body. The connecting base sleeve has a hollow structure, and a filter screen is provided on the top of the inner side of the connecting base sleeve.

[0016] This invention provides a capacitive ceramic-based vacuum gauge with microstructured support. Compared with the prior art, it has the following advantages: The ring array design of micro-support columns achieves precise support for the metal thin film, effectively preventing excessive deformation and damage, while suppressing diaphragm vibration, reducing signal instability, and significantly improving measurement stability. The buffer pad design between the metal thin film and the ceramic substrate further absorbs external vibration and pressure shocks, reducing component wear and extending equipment lifespan. The first and second protective sleeves isolate the conductive path from the main body, avoiding environmental interference and corrosion, and ensuring the stability of capacitive signal transmission. The filter plate filters impurities from the measured gas, preventing impurities from affecting diaphragm displacement and dielectric environment, ensuring measurement accuracy, and making the equipment suitable for fields such as semiconductors and photovoltaics where high vacuum measurement accuracy is required. The tight fit between the first and second buffer pads and the inner side of the main body not only eliminates assembly gaps but also improves the sealing of the vacuum chamber and the dielectric chamber, preventing chamber leakage that could cause measurement reference deviation. The synergistic effect of the protective sleeves and buffer pads gives the equipment stronger anti-interference capabilities. Attached Figure Description

[0017] Figure 1 This is a side-view three-dimensional structural diagram of a capacitive ceramic-based vacuum gauge with microstructured support.

[0018] Figure 2 This is a bottom-view three-dimensional structural diagram of a capacitive ceramic-based vacuum gauge with microstructured support.

[0019] Figure 3 A frontal planar structural diagram of a capacitive ceramic-based vacuum gauge with microstructured support.

[0020] Figure 4 A frontal cross-sectional view of a capacitive ceramic-based vacuum gauge with microstructured support.

[0021] Figure 5 This is a schematic diagram of the ceramic substrate of a capacitive ceramic base vacuum gauge with microstructured support, viewed from below.

[0022] Figure 6 A capacitive ceramic-based vacuum gauge with microstructured support Figure 4 Enlarged structural diagram at point A in the middle.

[0023] Figure 7 This is a schematic diagram of the filter connection assembly of a capacitive ceramic base vacuum gauge with microstructured support.

[0024] The attached figures are labeled as follows: 1. Main body; 2. Metal film; 3. First buffer pad; 4. Ceramic substrate; 5. Second buffer pad; 6. Positive electrode connecting ring; 7. Positive electrode conductive component; 701. Positive electrode wire; 702. First protective sleeve; 703. Positive electrode capacitor plate; 704. Positive electrode conductor rod; 705. First lower capacitor plate; 8. Negative electrode connecting ring; 9. Negative electrode conductive component; 901. Negative electrode wire; 902. Second protective sleeve; 903. Negative electrode capacitor plate; 904. Negative electrode conductor rod; 905. Second lower capacitor plate; 10. Micro support column; 11. Top cover; 12. Vacuum connector; 13. Filter connection component; 1301. Connecting bottom sleeve; 1302. Threaded ring; 1303. Filter screen; 14. Vacuum chamber; 15. Dielectric chamber. Detailed Implementation

[0025] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0026] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] Reference Figures 1-7A capacitive ceramic-based vacuum gauge with microstructured support includes: a main body 1; a metal thin film 2 is horizontally disposed in the middle of the inner side of the main body 1; a ceramic substrate 4 is disposed on the upper end of the metal thin film 2 on the inner side of the main body 1; the space formed between the upper end of the metal thin film 2 and the inner side of the main body 1 is a vacuum cavity 14; a vacuum connector 12 is disposed at the middle of the top of the main body 1; the space formed between the lower end of the metal thin film 2 and the inner side of the main body 1 is a dielectric cavity 15; a positive electrode connecting ring 6 is disposed on one side of the upper end of the main body 1, and a positive electrode conductive component 7 is disposed inside the positive electrode connecting ring 6. A negative electrode connecting ring 8 is provided on the side of the upper part of the main body 1 away from the positive electrode connecting ring 6. A negative electrode conductive component 9 is provided inside the negative electrode connecting ring 8. A micro support column 10 is provided on the side of the ceramic substrate 4 facing the metal film 2. The micro support columns 10 are distributed in a ring array on one side of the ceramic substrate 4. The spacing between the micro support columns 10 is 200-300μm. The top of the micro support column 10 is polished and the roughness Ra≤0.1μm. A top cover 11 is provided on the top of the main body 1, and a filter connecting component 13 is provided on the bottom of the main body 1.

[0028] The outer ring of the metal film 2 is wrapped with a first buffer pad 3, and the outer side of the first buffer pad 3 is tightly attached to the inner side of the main body 1.

[0029] The ceramic substrate 4 is surrounded by a second buffer pad 5, and the outer side of the second buffer pad 5 is in close contact with the inner side of the main body 1.

[0030] The positive electrode conductive component 7 includes a positive electrode wire 701, a first protective sleeve 702, a positive electrode capacitor plate 703, a positive electrode conductor rod 704, and a first lower capacitor plate 705. The positive electrode wire 701 passes through the positive electrode connecting ring 6 and the main body 1 and extends into the vacuum chamber 14.

[0031] One end of the positive electrode wire 701 extending into the vacuum cavity 14 is connected to the positive electrode capacitor plate 703. A first protective sleeve 702 is provided on the outside of the positive electrode wire 701, and the outside of the first protective sleeve 702 is tightly fitted to the inside of the main body 1. The positive electrode capacitor plate 703 is fan-shaped.

[0032] The bottom of the positive capacitor plate 703 is provided with positive conductor rods 704 in an annular shape at equal intervals. The positive conductor rods 704 penetrate the interior of the ceramic substrate 4. A first lower capacitor plate 705 is provided on the side of the positive conductor rods 704 away from the positive capacitor plate 703. One side of the first lower capacitor plate 705 is in close contact with the bottom of the ceramic substrate 4.

[0033] The negative electrode conductive component 9 includes a negative electrode wire 901, a second protective sleeve 902, a negative electrode capacitor plate 903, a negative electrode conductor rod 904, and a second lower capacitor plate 905. The negative electrode wire 901 passes through the positive electrode connecting ring 6 and the main body 1 and extends into the vacuum chamber 14.

[0034] One end of the negative electrode wire 901 extending into the vacuum cavity 14 is connected to the negative electrode capacitor plate 903. A second protective sleeve 902 is provided on the outside of the negative electrode wire 901, and the outside of the second protective sleeve 902 is tightly fitted to the inside of the main body 1.

[0035] The negative capacitor plate 903 is fan-shaped, and the bottom of the negative capacitor plate 903 is provided with negative conductor rods 904 in an annular shape at equal intervals. The negative conductor rods 904 penetrate the interior of the ceramic substrate 4. A second lower capacitor plate 905 is provided on the side of the negative conductor rods 904 away from the negative capacitor plate 903. One side of the second lower capacitor plate 905 is tightly attached to the bottom of the ceramic substrate 4.

[0036] The filter connection assembly 13 includes a connecting base sleeve 1301, a threaded ring 1302, and a filter screen 1303. The outer side of the connecting base sleeve 1301 and the inner side of the bottom of the main body 1 are both provided with threaded rings 1302. The connecting base sleeve 1301 has a hollow structure, and the top of the inner side of the connecting base sleeve 1301 is provided with a filter screen 1303.

[0037] During use, the main body 1 uses a specially made microstructured ceramic as the core substrate to replace the traditional composite support structure. The metal film 2 is only attached to the top of the array of micro support pillars 10 pre-set on the surface of the ceramic substrate 4. The ceramic substrate 4 is processed by laser micro-engraving technology, and its surface is provided with zirconia ceramic micro support pillars 10 with a diameter of 50-100μm, distributed in a ring array (spacing 200-300μm). The top of the micro support pillars 10 is polished (roughness Ra≤0).(1μm), which can reduce contact wear with the metal film 2; at the same time, the edge of the ceramic substrate 4 is designed with a second buffer pad 5, which is embedded in the main body 1 to ensure that the metal film 2 is accurately attached and avoid capacitance deviation caused by misalignment. The vacuum chamber 14 is evacuated through the vacuum connector 12 at the top of the main body 1 to form a stable reference vacuum environment in the vacuum chamber 14. The filter plate 1303 can filter impurities in the gas entering the medium chamber 15 to avoid impurities affecting the measurement accuracy. At this time, the metal film 2 is subjected to the reference vacuum pressure of the vacuum chamber 14 and the measured vacuum pressure of the medium chamber 15 on both sides, respectively, and maintains an initial equilibrium state under the action of the initial pressure difference. When the measured vacuum system When the pressure changes, the pressure inside the dielectric cavity 15 changes accordingly, causing a change in the pressure difference across the metal film 2. Due to the elastic properties of the metal film 2, it will produce a slight displacement towards the side with lower pressure under the action of the pressure difference. The micro-support pillars 10 on the ceramic substrate 4 can limit the non-uniform deformation of the metal film 2, ensuring that the distance between the metal film 2 and the first lower capacitor plate 705 and the second lower capacitor plate 905 changes along a preset trajectory. The displacement is linearly related to the pressure difference between the two sides, that is, it corresponds to the pressure change in the vacuum cavity 14 being measured. At the same time, the ceramic substrate 4 itself has excellent insulation and structural rigidity, which can ensure the stability of the detection process. The micro-support pillars 10 on the ceramic substrate 4 To provide precise limiting support for the metal thin film 2 and further prevent excessive deformation and damage, the metal thin film 2, together with the first lower capacitor plate 705 and the second lower capacitor plate 905 on the ceramic substrate 4, forms a capacitance detection structure. The metal thin film 2 serves as a movable electrode, while the first lower capacitor plate 705 and the second lower capacitor plate 905 serve as fixed electrodes. When the metal thin film 2 moves along a preset trajectory, the distance between it and the first lower capacitor plate 705 and the second lower capacitor plate 905 changes regularly. According to the parallel plate capacitance formula C=εS / (πkd) (where ε is the dielectric constant, S is the plate area, k is the electrostatic constant, and d is the plate spacing), the capacitance value will change with the spacing. The capacitance change changes accordingly, and the amount of capacitance change is regularly correlated with the displacement of the metal thin film 2. The corresponding vacuum level can be calculated by detecting this capacitance value. The positive electrode conductive component 7's positive electrode wire 701, positive electrode capacitor plate 703, positive electrode conductor rod 704, and first lower capacitor plate 705 constitute the positive electrode conduction path. The negative electrode conductive component 9's negative electrode wire 901, negative electrode capacitor plate 903, negative electrode conductor rod 904, and second lower capacitor plate 905 constitute the negative electrode conduction path. The capacitance change is transmitted to the external detection circuit through these two sets of conductive paths. The external circuit converts the minute capacitance change into a standard current or voltage signal, which, after processing, yields the vacuum level value of the tested vacuum system.

[0038] Therefore, although the invention has been described herein with reference to specific embodiments thereof, freedom of modification, various changes and substitutions are also within the scope of the foregoing disclosure, and it should be understood that in some cases, certain features of the invention may be adopted without departing from the scope and spirit of the invention and without corresponding use of other features. Thus, many modifications can be made to adapt a particular environment or material to the essential scope and spirit of the invention. The invention is not intended to be limited to the specific terminology used in the following claims and / or the specific embodiments disclosed as the best mode for carrying out the invention, but the invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Therefore, the scope of the invention will be defined only by the appended claims.

Claims

1. A capacitance type ceramic base vacuum gauge with microstructured support, characterized by, include: The main body (1) has a horizontally arranged metal thin film (2) in the middle of its inner side. A ceramic substrate (4) is arranged on the upper end of the metal thin film (2) on the inner side of the main body (1). The space formed by the upper end of the metal thin film (2) and the inner side of the main body (1) is a vacuum cavity (14). A vacuum connector (12) is provided at the middle of the top of the main body (1). The space formed by the lower end of the metal thin film (2) and the inner side of the main body (1) is a dielectric cavity (15). A positive electrode connecting ring (6) is provided on one side of the upper end of the main body (1), and a positive electrode conductive component (7) is provided inside the positive electrode connecting ring (6). The upper end of the main body (1) A negative electrode connecting ring (8) is provided on the side away from the positive electrode connecting ring (6). A negative electrode conductive component (9) is provided inside the negative electrode connecting ring (8). A micro support column (10) is provided on the side of the ceramic substrate (4) facing the metal thin film (2). The micro support columns (10) are distributed in a ring array on one side of the ceramic substrate (4). The spacing between the micro support columns (10) is 200-300μm. The top of the micro support column (10) is polished and the roughness Ra≤0.1μm. A top cover (11) is provided on the top of the main body (1), and a filter connecting component (13) is provided at the bottom of the main body (1).

2. A capacitance type ceramic base vacuum gauge with microstructured support according to claim 1, characterized in that, The outer ring of the metal film (2) is wrapped with a first buffer pad (3), and the outer side of the first buffer pad (3) is closely attached to the inner side of the main body (1).

3. A capacitance type ceramic base vacuum gauge with microstructured support according to claim 2, characterized in that, The ceramic substrate (4) is surrounded by a second buffer pad (5), and the outer side of the second buffer pad (5) is closely attached to the inner side of the main body (1).

4. The capacitance type ceramic base vacuum gauge with microstructured support according to claim 1, characterized in that, The positive electrode conductive component (7) includes a positive electrode wire (701), a first protective sleeve (702), a positive electrode capacitor plate (703), a positive electrode conductor rod (704) and a first lower capacitor plate (705). The positive electrode wire (701) passes through the positive electrode connecting ring (6) and the main body (1) and extends into the vacuum cavity (14).

5. A capacitance type ceramic base vacuum gauge with microstructured support according to claim 4, characterized in that, One end of the positive electrode wire (701) extending into the vacuum cavity (14) is connected to a positive electrode capacitor plate (703). A first protective sleeve (702) is provided on the outside of the positive electrode wire (701), and the outside of the first protective sleeve (702) is tightly fitted with the inside of the main body (1). The positive electrode capacitor plate (703) is fan-shaped.

6. A capacitive ceramic-based vacuum gauge with microstructured support according to claim 5, characterized in that, The bottom of the positive capacitor plate (703) is provided with positive conductor rods (704) arranged in a ring at equal intervals. The positive conductor rods (704) penetrate the interior of the ceramic substrate (4). A first lower capacitor plate (705) is provided on the side of the positive conductor rods (704) away from the positive capacitor plate (703). One side of the first lower capacitor plate (705) is closely attached to the bottom of the ceramic substrate (4).

7. A capacitive ceramic base vacuum gauge with microstructured support according to claim 1, characterized in that, The negative electrode conductive component (9) includes a negative electrode wire (901), a second protective sleeve (902), a negative electrode capacitor plate (903), a negative electrode conductor rod (904), and a second lower capacitor plate (905). The negative electrode wire (901) passes through the positive electrode connecting ring (6) and the main body (1) and extends into the vacuum chamber (14).

8. A capacitive ceramic base vacuum gauge with microstructured support according to claim 7, characterized in that, The negative electrode wire (901) extends into the vacuum cavity (14) and is connected to a negative electrode capacitor plate (903). A second protective sleeve (902) is provided on the outside of the negative electrode wire (901), and the outside of the second protective sleeve (902) is closely fitted to the inside of the main body (1).

9. A capacitive ceramic base vacuum gauge with microstructured support according to claim 8, characterized in that, The negative capacitor plate (903) is fan-shaped, and the bottom of the negative capacitor plate (903) is provided with negative conductor rods (904) in an annular shape at equal intervals. The negative conductor rods (904) penetrate the interior of the ceramic substrate (4). A second lower capacitor plate (905) is provided on the side of the negative conductor rod (904) away from the negative capacitor plate (903). One side of the second lower capacitor plate (905) is closely attached to the bottom of the ceramic substrate (4).

10. A capacitive ceramic-based vacuum gauge with microstructured support according to claim 1, characterized in that, The filter connection assembly (13) includes a connecting base sleeve (1301), a threaded ring (1302) and a filter screen plate (1303). The outer side of the connecting base sleeve (1301) and the inner side of the bottom of the main body (1) are both provided with threaded rings (1302). The connecting base sleeve (1301) is a hollow structure, and the top of the inner side of the connecting base sleeve (1301) is provided with a filter screen plate (1303).

Images