Liquid medium storage device used between heat source and radiator and radiating device

Abstract

The invention relates to a liquid medium storage device used between a heat source and a radiator and a radiating device, and the liquid medium storage device is used for being arranged between the heat source and the radiator and comprises a heat source seat and an interlayer; the heat source seat is provided with a top part and a surrounding part extending downwards from the periphery of the top part, and a bare area is arranged on the top part; the interlayer is horizontally arranged on the top of the heat source seat, the interlayer is provided with an accommodating area and corresponds to the bare area, and the accommodating area is substantially equal to or smaller than the bare area; wherein the surface of the heat source is tightly matched and forced into the accommodating area through the bare area, and the radiator is attached to the interlayer, so that a liquid medium is injected between the heat source in the accommodating area and the radiator.

Description

Technical Field

[0001] This application relates to a radiator, and more particularly to a liquid medium storage device for use between a heat source and a radiator, and a heat dissipation device thereof. Background Technology

[0002] Currently, commercially available CPUs from brands such as Intel and AMD may deform when fitted with heatsinks like water cooling blocks due to excessive tightness in the mounting brackets. Therefore, products like CPU anti-bending clips are available to cover the CPU before the heatsink is installed, preventing damage from bending forces.

[0003] However, when the heatsink comes into contact with the CPU, heat transfer still requires a medium such as thermal paste. Modern thermal media often use liquid metal, and when the CPU motherboard is upright, the liquid metal can overflow due to gravity. This causes the surface where the heatsink and CPU are in contact to lose the aid of the thermal media, leading to CPU overheating and potentially causing the computer system to overheat.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied theoretical principles, and finally proposed a design that is reasonable and effective in improving the above-mentioned deficiencies. Summary of the Invention

[0005] The main objective of this application is to provide a liquid medium storage device and a heat dissipation device for use between a heat source and a radiator, which further forms a space to contain the liquid medium, thereby preventing liquid metal from overflowing between the heat source and the radiator due to gravity or other influences.

[0006] To achieve the above objectives, this application provides a liquid medium reservoir for use between a heat source and a heat sink, which is disposed between the heat source and the heat sink and includes a heat source base and an interlayer; the heat source base has a top and an annular portion extending downward from the periphery of the top, and a void area is provided on the top; the interlayer is placed flat on the top of the heat source base, and the interlayer has a receiving area corresponding to the void area, and the receiving area is substantially equal to or smaller than the void area; wherein, the surface of the heat source is tightly fitted into the receiving area through the void area, and the heat sink is attached to the interlayer to allow liquid medium to be injected between the heat source and the heat sink in the receiving area.

[0007] In one implementation, the heat source socket is a CPU anti-bending fastener.

[0008] In one embodiment, the top of the heat source base is provided with multiple fixing holes, and a screw assembly is inserted into each fixing hole.

[0009] In one embodiment, the interlayer is glued to the top of the heat source base.

[0010] To achieve the above objectives, this application provides a heat dissipation device for placement on a heat source. The heat dissipation device includes a radiator, a heat dissipation fastener, and a liquid medium reservoir. The radiator has a heat-receiving portion and is attached to the heat source. The heat dissipation fastener is correspondingly disposed below the heat source and connected to the radiator. The liquid medium reservoir includes a heat source base and a sandwich layer. The heat source base has a top and a ring portion extending downward from the periphery of the top, and a void area is provided on the top. The sandwich layer is placed flat on the top of the heat source base, and has a receiving area corresponding to the void area, and the receiving area is substantially equal to or smaller than the void area. The surface of the heat source is tightly fitted into the receiving area through the void area, and the heat-receiving portion of the radiator is attached to the sandwich layer to allow liquid medium to be injected between the heat source and the radiator within the receiving area.

[0011] In one embodiment, the radiator is a finned radiator or a water block.

[0012] In one implementation, the heat source socket is a CPU anti-bending fastener.

[0013] In one embodiment, the top of the heat source base is provided with multiple fixing holes, and a screw assembly is inserted into each fixing hole.

[0014] In one embodiment, the interlayer is glued to the top of the heat source base.

[0015] In one embodiment, the liquid medium is a liquid metal. Attached Figure Description

[0016] Figure 1 This is an exploded perspective view of the first embodiment of this application.

[0017] Figure 2 This is an exploded perspective view of the heat source applied in the first embodiment of this application.

[0018] Figure 3 This is an exploded perspective view of the heat dissipation device according to the first embodiment of this application.

[0019] Figure 4 This is a three-dimensional assembly diagram of the heat dissipation device according to the first embodiment of this application.

[0020] Figure 5 This is a cross-sectional schematic diagram of the usage state of the first embodiment of this application.

[0021] Figure 6 This is an exploded perspective view of the second embodiment of this application.

[0022] Figure 7 This is an exploded perspective view of the second embodiment of this application applied to a heat source.

[0023] Figure 8 This is an exploded perspective view of the second embodiment of this application applied to a heat dissipation device.

[0024] Figure 9 This is a perspective view of the heat dissipation device applied to the second embodiment of this application.

[0025] Figure 10 This is a cross-sectional view of the usage state of the second embodiment of this application.

[0026] Figure 11 This is an exploded perspective view of the third embodiment of this application.

[0027] Figure 12 This is an exploded perspective view of the fourth embodiment of this application.

[0028] Figure 13 This is a schematic diagram of an embodiment of a heat sink applied to air cooling according to this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1: Liquid medium storage device;

[0031] 10: Heat source holder;

[0032] 100: Top;

[0033] 101: Surrounding part;

[0034] 102: Bare Void Zone;

[0035] 103: Fixing hole;

[0036] 104: Screw assembly;

[0037] 11: Interlayer;

[0038] 110: Accommodation area;

[0039] 2: Radiator;

[0040] 20: Heated section;

[0041] 20a: Surface;

[0042] 21: Positioning foot;

[0043] 22: Water pump;

[0044] 3: Heat dissipation fasteners;

[0045] 30:Buckle body;

[0046] 31: Fixed foot;

[0047] 32: Locking components;

[0048] 4: Heat source;

[0049] 4a: Surface;

[0050] 40:Substrate;

[0051] L: Liquid medium. Detailed Implementation

[0052] To further disclose the features and technical content of this application, please refer to the following detailed description and accompanying drawings. However, the accompanying drawings are for reference and illustration only and are not intended to limit this application.

[0053] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 These are, respectively, an exploded perspective view of the first embodiment of this application, an exploded perspective view applied to a heat source, an exploded perspective view applied to a heat dissipation device, and a three-dimensional assembly view. This application provides a liquid medium storage device and a heat dissipation device for use between a heat source and a heat sink, wherein the liquid medium storage device 1 is used to be assembled onto the heat source 4 (i.e., as shown in the figure). Figure 2 (As shown), and can further assemble a radiator 2 and a heat dissipation fastener 3 on the heat source 4, thereby preventing deformation or bending of the surface of the heat source 4, and also preventing the overflow of the liquid medium that conducts heat between the heat source 4 and the radiator 2. The liquid medium storage 1 includes a heat source base 10 and a sandwich 11 stacked on the heat source base 10; wherein:

[0054] like Figure 1 and Figure 2 As shown, the heat source holder 10 can be a CPU anti-bending fastener, applicable to heat sources 4 of CPUs such as those from the "Intel" brand. It has a top 100 and a surrounding portion 101 extending downwards from the periphery of the top 100, allowing the heat source holder 10 to cover the heat source 4. The top 100 of the heat source holder has a bare area 102, allowing the surface 4a of the heat source 4 to pass through and protrude from the bare area 102 when the heat source holder 10 is placed on the heat source 4 (i.e., as shown). Figure 5 (As shown). In addition, the heat source base 10 may be provided with a plurality of fixing holes 103 on the top 100, so that screws or other screw-mounting components 104 can be inserted to fix the heat source base 10 to the substrate 40 which is electrically connected to the heat source 4.

[0055] As described above, the interlayer 11 is placed flat on the top 100 of the heat source base 10. Specifically, in actual use, since the liquid medium reservoir 1 is located between the heat source 4 and the radiator 2, the interlayer 11 is also sandwiched between the radiator 2 and the top 100 of the heat source base 10 without the need for any additional fixing structure or other equivalent technical means. However, if necessary, further additions can be made, for example, by using adhesive (not shown) or other bonding methods to attach the interlayer 11 to the top 100 of the heat source base 10, but this is not a limitation. In addition, the interlayer 11 has a receiving area 110 corresponding to the bare void area 102, and the receiving area 110 is substantially equal to or smaller than the bare void area 102, and the surface 4a of the heat source 4 is tightly fitted into it so that the surface 4a is located within the receiving area 110, that is, the surface 4a of the heat source 4 does not protrude outside the receiving area 110 and is lower than the upper surface of the interlayer 11, i.e., as shown. Figure 5 As shown.

[0056] like Figure 3 and Figure 4 As shown, the liquid medium reservoir 1 can also be further applied to a heat dissipation device, which includes the aforementioned radiator 2 and heat dissipation fastener 3. The radiator 2 can be a finned radiator that utilizes air cooling (i.e., as shown in the image). Figure 13 (as shown), or a water cooling head used in a liquid cooling system; in this embodiment, the radiator 2 is a water cooling head, and has a heated part 20 and a plurality of positioning feet 21 extending from the heated part 20. The radiator 2 may further be provided with a water pump 22, which is used to connect to the circulation system of the coolant (not shown). The heat dissipation fastener 3 has a fastener body 30 and a plurality of fixing feet 31 extending from the fastener body 30. Each fixing foot 31 is provided with a locking component 32 for locking to each positioning foot 21 and each fixing foot 31 by means of the base plate 40. Thus, the radiator can be placed on the heat source 4 and the heated part 20 of the radiator 2 can be attached to the liquid medium storage tank 1.

[0057] like Figure 5 As shown, since the surface 4a of the heat source 4 does not protrude outside the receiving area 110 and is lower than the upper surface of the interlayer 11, a certain gap can exist in the receiving area 110 of the interlayer 11 between the surface 4a of the heat source 4 and the surface 20a of the heated part 20 of the radiator 2, so that a liquid medium L such as liquid metal can be injected into it, thereby serving as a heat transfer medium between the heat source 4 and the radiator 2, and can be effectively restricted by the interlayer 11 so as not to overflow.

[0058] Furthermore, such as Figures 6 to 10The illustration shows an embodiment of this application applicable to CPU heat source 4 of a brand such as "AMD"; the main feature is that the exposed area 102 of the upper heat source holder 10 and the receiving area 110 of the interlayer 11 have corresponding shapes to match the external shape of the heat source 4 of different brands. Other aspects, such as the type or design of the heat sink 2 and the heat dissipation bracket 3, can also be adjusted according to different brands or specifications.

[0059] In addition, such as Figure 11 and Figure 12 As shown, this application reveals that different variations can be made to the shape of interlayer 11 when used with the "Intel" and "AMD" brands. Since these changes do not affect the purpose and function claimed in this application, they are only disclosed and will not be described in detail further.

[0060] like Figure 13 As shown, this application can also be applied to aluminum extruded heat sinks or finned stacked heat sinks, that is, it is applicable to heat sinks 2 that utilize air cooling. Therefore, it is not limited to application to the aforementioned water cooling heads.

[0061] Therefore, by means of the above-described structure, the liquid medium storage device and its heat dissipation device used between the heat source and the heat sink of this application can be obtained.

[0062] However, the above description is only a preferred embodiment of this application and does not limit the scope of this application. Therefore, all equivalent structural changes made using the content of this application's specification and drawings are also included within the scope of this application and are hereby stated.

Claims

1. A liquid medium storage device for use between a heat source and a radiator, characterized in that, Used to be placed between the heat source and the radiator; The liquid medium storage device includes: A heat source holder has a top and a surrounding portion extending downward from the periphery of the top, and the top has an open area; and A sandwich layer is placed flat on top of the heat source base, the sandwich layer having a receiving area corresponding to the bare void area, and the receiving area being substantially equal to or smaller than the bare void area; The surface of the heat source is tightly fitted into the receiving area through the bare void area, while the heat sink is attached to the interlayer to allow liquid medium to be injected between the heat source and the heat sink within the receiving area.

2. The liquid medium storage device for use between a heat source and a radiator as described in claim 1, characterized in that, The heat source holder is a CPU anti-bending fastener.

3. The liquid medium storage device for use between a heat source and a radiator as described in claim 1, characterized in that, The top of the heat source base is provided with multiple fixing holes, and a screw assembly is inserted into each of the fixing holes.

4. The liquid medium storage device for use between a heat source and a radiator as described in claim 1, characterized in that, The interlayer is glued to the top of the heat source base.

5. A heat dissipation device, characterized in that, For mounting on a heat source; the heat dissipation device includes: A radiator having a heat-receiving part and being attached to the heat source; A heat dissipation fastener is correspondingly disposed below the heat source and connected to the heat sink; and Liquid medium storage device, comprising: A heat source holder has a top and a surrounding portion extending downward from the periphery of the top, and the top has an open area; and A sandwich layer is placed flat on top of the heat source base, the sandwich layer having a receiving area corresponding to the bare void area, and the receiving area being substantially equal to or smaller than the bare void area; The surface of the heat source is tightly fitted into the receiving area through the bare void area, and the heated part of the radiator is attached to the interlayer to allow liquid medium to be injected between the heat source and the radiator in the receiving area.

6. The heat dissipation device as described in claim 5, characterized in that, The radiator is a finned radiator or a water block.

7. The heat dissipation device as described in claim 5, characterized in that, The heat source holder is a CPU anti-bending fastener.

8. The heat dissipation device as described in claim 5, characterized in that, The top of the heat source base is provided with multiple fixing holes, and a screw assembly is inserted into each of the fixing holes.

9. The heat dissipation device as described in claim 5, characterized in that, The interlayer is glued to the top of the heat source base.

10. The heat dissipation device as described in claim 5, characterized in that, The liquid medium is liquid metal.

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