A semiconductor device debonding apparatus and a debonding method

Abstract

The application relates to a semiconductor device debonding device and a debonding method. The device comprises: a turntable assembly provided with a plurality of loading tables in the circumferential direction, the turntable assembly being capable of driving the plurality of loading tables to rotate under the action of external force; a transfer assembly capable of moving semiconductor devices into or out of the loading tables; a debonding assembly comprising a laser generator and an annular air suction element located above the semiconductor devices, the debonding assembly being configured so that the laser generator is used for debonding the semiconductor devices by emitting laser, and the annular air suction element is used for adsorbing particles generated by the debonding of the semiconductor devices; and a transfer assembly arranged on one side of the turntable assembly and used for separating the loading table from the wafer after debonding, wherein when the semiconductor devices on one of the loading tables are moved to the debonding station for debonding operation, the transfer assembly can synchronously move the semiconductor devices to be debonded into another empty loading table, so that the loading is started without waiting for the completion of the previous process, and the waiting time between processes is shortened.

Description

Technical Field

[0001] This application relates to the field of semiconductor device debonding technology, specifically to a semiconductor device debonding device and debonding method. Background Technology

[0002] In the manufacturing process of semiconductor devices, in order to meet the process requirements of ultra-thin wafer processing, high-precision photolithography, and chip stacking, it is usually necessary to temporarily bond the wafer to the carrier. After the wafer completes the predetermined processing, the carrier must be separated from the wafer through a debonding process in order to perform subsequent packaging, testing and other processes on the wafer. Therefore, the operating efficiency of the debonding equipment directly affects the capacity of the entire semiconductor production line.

[0003] Currently, most semiconductor device debonding equipment uses laser debonding, which works by using laser energy to break the bonding layer between the wafer and the carrier, thus separating them. However, existing laser debonding equipment only has the function of debonding alone. After the debonded semiconductor device is unloaded, the transfer, debonding, separation, and cleaning processes must be completed sequentially in a linear fashion. The next process can only start after the previous process is completed. There is a lot of waiting time between processes, resulting in low overall equipment efficiency and making it difficult to meet the capacity requirements of high-density, automated semiconductor production lines.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0005] In view of this, the present application provides a semiconductor device debonding apparatus to solve at least one problem existing in the prior art. The semiconductor device includes a wafer and a carrier wafer bonded to the wafer. The apparatus includes:

[0006] Drive motor;

[0007] A turntable assembly is connected to the drive motor. The turntable assembly is provided with multiple platforms along the circumference. The drive motor can drive the turntable assembly to rotate so that the multiple platforms rotate simultaneously.

[0008] A transfer assembly, located on one side of the turntable assembly, is capable of moving semiconductor devices into or out of the mounting stage;

[0009] A debonding assembly is disposed on one side of the turntable assembly, including a laser generator and an annular suction device located above the semiconductor device. The debonding assembly is configured such that the laser generator emits laser light to debond the semiconductor device, while the annular suction device adsorbs particles generated during the debonding of the semiconductor device.

[0010] A transfer assembly, disposed on one side of the turntable assembly, is used to separate the debonded carrier from the wafer;

[0011] Cleaning components are used to remove particles from the surface of the debonded wafer.

[0012] Optionally, in the above-mentioned semiconductor device debonding device, the annular suction element has a first position and a second position;

[0013] The annular suction component has a circular suction port. When it is located in the first position, there is a first distance between the circular suction port and the semiconductor device in the height direction. The circular suction port and the semiconductor device are concentrically arranged, and the diameter of the circular suction port is larger than that of the semiconductor device.

[0014] Optionally, in the above-mentioned semiconductor device debonding device, the annular suction component includes a first housing and a second housing connected to the first housing, with the circular suction port formed between the first housing and the second housing, and the second housing being arc-shaped.

[0015] Optionally, in the above-described semiconductor device debonding apparatus, the debonding component further includes a fixing structure disposed on one side of the mounting stage, the fixing structure being used to fix the semiconductor device.

[0016] Optionally, in the above-mentioned semiconductor device debonding device, the transfer component includes a suction cup with a plurality of flexible adsorption ports arranged along the circumference of the suction cup for adsorbing the substrate.

[0017] Optionally, in the above-mentioned semiconductor device debonding equipment, the transfer component further includes a guide rail, a moving platform disposed on the guide rail, and a flipping robot disposed on one side of the guide rail. The transfer component is configured such that the flipping robot can receive the wafer on the suction cup, thereby causing the wafer to flip and be placed on the moving platform.

[0018] Optionally, the above-mentioned semiconductor device debonding equipment further includes an adsorption pipe located between the debonding component and the cleaning component. The adsorption pipe has an elongated air outlet located above the mounting stage, and the adsorption range of the elongated air outlet covers the semiconductor device.

[0019] This application also provides a method for debonding semiconductor devices, employing the debonding equipment described in any of the above claims, the debonding method comprising:

[0020] The semiconductor device is moved into the mounting stage of the turntable assembly by the transfer component, and the turntable assembly drives the mounting stage to rotate to the debonding station under the action of external force.

[0021] The debonding assembly is activated, and a laser is emitted towards the semiconductor device through a laser generator to perform debonding. At the same time, the annular suction component of the debonding assembly adsorbs the particles generated during the debonding process.

[0022] The debonded carrier is separated from the wafer by a transfer component, and then particles on the surface of the wafer are removed by a cleaning component.

[0023] The processed wafers and carriers are removed from the mounting stage using a transfer assembly.

[0024] Optionally, the above-described semiconductor device debonding method further includes:

[0025] Under the action of external force, the turntable assembly drives the mounting stage to rotate to the debonding station, while the transfer assembly places other semiconductor devices on other mounting stages.

[0026] Optionally, the above-described semiconductor device debonding method, which separates the debonded carrier from the wafer via a transfer assembly, further includes:

[0027] The suction cup picks up the clean side of the slide, the transfer assembly receives the contaminated side of the slide and flips it over, and the moving platform moves under the transfer assembly and picks up and fixes the clean side of the slide.

[0028] Compared with the prior art, this application has the following beneficial effects: by setting up a turntable assembly with multiple mounting stages distributed circumferentially, a transfer assembly, a debonding assembly, a transfer component, and a cleaning assembly on one side of the turntable assembly, the turntable assembly can drive multiple mounting stages to rotate, so as to realize the integrated operation of debonding, separation, and cleaning. Furthermore, when a semiconductor device on one of the mounting stages moves to the debonding station for debonding, the transfer assembly can simultaneously move the semiconductor device to be debonded to another empty mounting stage, without waiting for the previous process to be completed before starting the loading, which greatly shortens the waiting time between processes, improves efficiency, adapts to the capacity requirements of high-density, automated semiconductor production lines, and significantly improves the overall operating efficiency of the equipment and the throughput of the production line. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the semiconductor device debonding device structure shown in this embodiment;

[0030] Figure 2 for Figure 1 A schematic diagram of another direction of the semiconductor device debonding equipment shown;

[0031] Figure 3 for Figure 1 A schematic diagram of another direction of the semiconductor device debonding equipment shown;

[0032] Figure 4 for Figure 1 A schematic diagram of the debonding component in the semiconductor device debonding equipment shown;

[0033] Figure 5 for Figure 4 A cross-sectional view of the annular suction component in the debonding assembly shown;

[0034] Figure 6 for Figure 1 The diagram shows the structure of the transfer component in the semiconductor device debonding device.

[0035] Figure label:

[0036] Turntable assembly 5, mounting stage 51;

[0037] Debonding component 7, annular suction component 72, circular suction port 721, first housing 722, second housing 723, fixing structure 73;

[0038] Transfer component 8, suction cup 81, flexible adsorption port 811, guide rail 82, moving platform 83, flipping robot arm 84;

[0039] Cleaning components 9 and adhesive film 91;

[0040] Adsorption duct 10, elongated air outlet 101. Detailed Implementation

[0041] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0042] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0043] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0045] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0046] refer to Figures 1-6As shown, a preferred embodiment of this application provides a semiconductor device debonding apparatus for debonding bonded semiconductor devices. The semiconductor device includes a wafer and a carrier wafer bonded to the wafer. In this embodiment, the semiconductor device further includes an iron ring and a blue film, with the wafer and carrier wafer adhered to the blue film after bonding. That is, the debonding apparatus of this application can perform debonding of a single wafer and carrier wafer, as well as debonding of a wafer and carrier wafer with both an iron ring and a blue film.

[0047] Specifically, the debonding equipment includes a drive motor, a turntable assembly 5, a transfer assembly, a debonding assembly 7, a transfer assembly 8, and a cleaning assembly 9. The turntable assembly 5 is connected to the drive motor and has multiple mounting stages 51 arranged circumferentially. The drive motor drives the turntable assembly 5 to rotate, causing the multiple mounting stages 51 to rotate simultaneously. The transfer assembly is located on one side of the turntable assembly 5 and can move semiconductor devices into or out of the mounting stages 51. The debonding assembly 7 is located on one side of the turntable assembly 5 and includes a laser generator and an annular suction device 72 located above the semiconductor devices. The debonding assembly 7 is configured such that the laser generator emits laser light to debond the semiconductor devices, while the annular suction device 72 adsorbs particles generated during the debonding process. The transfer assembly 8, located on one side of the turntable assembly, is used to separate the debonded wafer from the carrier. The cleaning assembly 9 is used to remove particles from the surface of the debonded wafer. In this embodiment, the drive motor is a large hollow motor.

[0048] Understandably, by setting up a turntable assembly 5 with multiple placement stages 51 distributed circumferentially, and a transfer assembly, a debonding assembly 7, a transfer assembly 8, and a cleaning assembly 9 on one side of the turntable assembly 5, the turntable assembly 5 can drive the multiple placement stages 51 to rotate, so as to realize the integrated operation of debonding, separation, and cleaning. Furthermore, when a semiconductor device on one of the placement stages 51 moves to the debonding station for debonding, the transfer assembly can simultaneously move the semiconductor device to be debonded to another empty placement stage 51, without waiting for the previous process to be completed before starting the loading, which greatly shortens the waiting time between processes, improves efficiency, adapts to the capacity requirements of high-density, automated semiconductor production lines, and significantly improves the overall operating efficiency of the equipment and the throughput of the production line.

[0049] Understandably, the annular suction component 72 can adsorb the particles generated during laser debonding, achieving simultaneous debonding and impurity removal, reducing particle residue from the source, and preventing particles from adhering to the surface of wafers, carriers, or other equipment during the debonding process.

[0050] In this embodiment, the annular suction component 72 has a first position and a second position. The annular suction component 72 has a circular suction port 721. When it is in the first position, the circular suction port 721 and the semiconductor device are at a first distance in the height direction. The circular suction port 721 and the semiconductor device are concentrically arranged, and the diameter of the circular suction port 721 is larger than that of the semiconductor device, that is, the airflow path is inclined (as shown in A in the figure). This arrangement can prevent physical interference between the annular suction component 72 and the semiconductor device, and also allows the particles generated by the debonding of the laser generator to be directly adsorbed by the circular suction port 721, preventing them from moving laterally on the iron ring and the blue film, thus reducing the risk of other components being contaminated by particles.

[0051] Furthermore, the annular suction component 72 includes a first housing 722 and a second housing 723 connected to the first housing 722. A circular suction port 721 is formed between the first housing 722 and the second housing 723, and the second housing 723 is arc-shaped.

[0052] Understandably, the circular air intake 721 is formed by the combination of the first housing 722 and the arc-shaped second housing 723. The arc-shaped second housing 723 can optimize the airflow path, making the airflow path inclined. This inclined airflow path has the following advantages: First, it can reduce airflow resistance, improve adsorption wind speed and particle capture efficiency, especially accurately capture tiny particles that diffuse to the side when the laser generator debonds, prevent particles from escaping, and enhance the particle removal effect; Second, the inclined airflow can reduce the vertical impact force on the surface of the semiconductor device, preventing the semiconductor device from shifting due to airflow impact.

[0053] In this embodiment, the debonding assembly 7 also includes a fixing structure 73 disposed on one side of the stage 51. The fixing structure 73 is used to fix the semiconductor device so as to stabilize and limit the semiconductor device on the stage 51 during the laser debonding and particle adsorption process, so as to avoid the semiconductor device from shifting, warping or breaking due to the rotation of the turntable, airflow impact or laser irradiation vibration, thus ensuring the consistency and accuracy of the debonding process, reducing product loss and improving the stability of debonding quality.

[0054] Furthermore, the transfer component 8 includes a suction cup 81 with a plurality of flexible adsorption ports 811 arranged circumferentially along the suction cup 81. The plurality of flexible adsorption ports 811 are used to adsorb the substrate. The circumferentially evenly distributed adsorption ports 811 can ensure balanced adsorption force, prevent the substrate from shifting during adsorption, and improve the stability of substrate separation and transfer; while the flexible material can adapt to the surface characteristics of the substrate, realize stable and non-destructive adsorption of the substrate, and avoid the scratches and damage to the substrate caused by traditional rigid adsorption.

[0055] Furthermore, the transfer assembly 8 also includes a guide rail 82, a moving platform 83 disposed on the guide rail 82, and a flipping robot 84 disposed on one side of the guide rail 82. The transfer assembly 8 is configured such that the flipping robot 84 can receive the carrier on the suction cup 81, so as to drive the carrier to flip and place it on the moving platform 83.

[0056] In this embodiment, since the wafer is located above the wafer, the flexible chuck 81 is used to adsorb the clean surface of the wafer. That is, at this moment, the lower surface of the wafer is the contaminated surface bonded to the wafer, and the upper surface of the wafer is the clean surface. When unloading the debonded wafer, a robotic arm is ultimately needed to contact the clean surface to unload it. Therefore, the contaminated surface of the wafer cannot directly contact the moving platform 83. In this embodiment, the flexible chuck 81 adsorbs the clean surface of the wafer and moves it above the flipping robotic arm 84, so that the flipping robotic arm 84 can receive the contaminated surface of the wafer, fix it, and flip it, so that the moving platform 83 can receive the clean surface of the wafer and unload it along the guide rail 82. The entire transfer process is automated, requiring no manual intervention, reducing process waiting time and operational errors, improving wafer transfer efficiency and accuracy, and adapting to the operating rhythm of automated production lines.

[0057] In this embodiment, the debonding device further includes an adsorption pipe 10 located between the debonding component 7 and the cleaning component 9. The adsorption pipe 10 has an elongated air outlet 101 located above the stage 51, and the adsorption range of the elongated air outlet 101 covers the semiconductor device.

[0058] Understandably, the annular suction component 72 is used to adsorb particles generated during the debonding of the laser generator. However, most of the movable particles will still exist between the carrier and the wafer. After the carrier is unloaded, the movable particles between the two are exposed and pass through the elongated air vent 101 as it rotates with the stage 51. This allows the elongated air vent 101 to adsorb the movable particles above the wafer, preventing them from scattering onto other components during rotation. In this embodiment, the adsorption range of the elongated air vent 101 can cover the entire wafer surface, that is, it adapts to the rotation trajectory of the stage 51 and prevents movable particles from overflowing the wafer during transfer.

[0059] In this embodiment, the cleaning component 9 performs cleaning through an adhesive film 91. That is, the adhesive film 91 is attached to the wafer, and the adhesive film 91 adheres to the particles on the wafer to completely clean the particles generated by debonding on the wafer.

[0060] This application also provides a semiconductor device debonding method, which is implemented using the aforementioned semiconductor device debonding equipment. The debonding method includes:

[0061] The semiconductor device is moved into the stage 51 of the turntable assembly 5 by the transfer component. The turntable assembly 5 drives the stage 51 to rotate to the debonding station under the action of external force.

[0062] The debonding component 7 is activated, and a laser is emitted to the semiconductor device through the laser generator to perform debonding. At the same time, the annular suction component 72 of the debonding component 7 adsorbs the particles generated during the debonding process.

[0063] The debonded carrier is separated from the wafer by the transfer component 8, and the particles on the wafer surface are removed by the cleaning component 9.

[0064] The processed wafers and carriers are removed from the mounting stage 51 by the transfer assembly.

[0065] Debonding methods also include:

[0066] While the turntable assembly 5 rotates the mounting stage 51 to the debonding station under the action of external force, the transfer assembly places other semiconductor devices on other mounting stages 51.

[0067] Understandably, multiple mounting stages 51 are provided on the rotatable turntable assembly 5. This allows one mounting stage 51 to move to the debonding station for debonding, while the transfer assembly moves another semiconductor device to be debonded to another mounting stage 51. Alternatively, when the debonded semiconductor device is separated from the wafer by the transfer assembly 8, the semiconductor device on the next mounting stage 51 undergoes debonding, and so on. This not only automates the entire process of semiconductor device debonding, wafer-to-carrier separation, cleaning, and unloading on the same equipment, but also allows multiple semiconductor devices to be debonded simultaneously, significantly improving efficiency. In this embodiment, four mounting stages 51 are provided, corresponding precisely to the four steps of semiconductor device loading, debonding, separation, and cleaning.

[0068] Furthermore, separating the debonded carrier from the wafer via transfer component 8 also includes:

[0069] The suction cup 81 adsorbs the clean surface of the slide, the flipping robot 84 receives the contaminated surface of the slide and flips it, and the moving platform 83 moves to the bottom of the flipping robot 84 and adsorbs and fixes the clean surface of the slide.

[0070] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A semiconductor device debonding apparatus, characterized in that, The semiconductor device includes a wafer and a carrier wafer bonded to the wafer, and the apparatus includes: Drive motor; A turntable assembly is connected to the drive motor. The turntable assembly is provided with multiple platforms along the circumference. The drive motor can drive the turntable assembly to rotate so that the multiple platforms rotate simultaneously. A transfer assembly, located on one side of the turntable assembly, is capable of moving semiconductor devices into or out of the mounting stage; A debonding assembly is disposed on one side of the turntable assembly, including a laser generator and an annular suction device located above the semiconductor device. The debonding assembly is configured such that the laser generator emits laser light to debond the semiconductor device, while the annular suction device adsorbs particles generated during the debonding of the semiconductor device. A transfer assembly, disposed on one side of the turntable assembly, is used to separate the debonded carrier from the wafer; Cleaning components are used to remove particles from the surface of the debonded wafer.

2. The semiconductor device debonding apparatus according to claim 1, characterized in that, The annular suction component has a first position and a second position; The annular suction component has a circular suction port. When it is located in the first position, there is a first distance between the circular suction port and the semiconductor device in the height direction. The circular suction port and the semiconductor device are concentrically arranged, and the diameter of the circular suction port is larger than that of the semiconductor device.

3. The semiconductor device debonding apparatus according to claim 2, characterized in that, The annular suction component includes a first housing and a second housing connected to the first housing, with the circular suction port formed between the first housing and the second housing, and the second housing being arc-shaped.

4. The semiconductor device debonding apparatus according to claim 1, characterized in that, The debonding assembly also includes a fixing structure disposed on one side of the stage, the fixing structure being used to fix the semiconductor device.

5. The semiconductor device debonding apparatus according to claim 1, characterized in that, The transfer component includes a suction cup with several flexible suction ports arranged along the circumference of the suction cup for adsorbing the substrate.

6. The semiconductor device debonding apparatus according to claim 5, characterized in that, The transfer assembly further includes a guide rail, a moving platform disposed on the guide rail, and a flipping robot disposed on one side of the guide rail. The transfer assembly is configured such that the flipping robot can receive a carrier plate on the suction cup, thereby causing the carrier plate to flip and be placed on the moving platform.

7. The semiconductor device debonding apparatus according to claim 6, characterized in that, The debonding device further includes an adsorption pipe located between the debonding component and the cleaning component. The adsorption pipe has an elongated air outlet located above the mounting stage, and the adsorption range of the elongated air outlet covers the semiconductor device.

8. A method for debonding semiconductor devices, characterized in that, Using the debonding apparatus according to any one of claims 1-7, the debonding method comprises: The semiconductor device is moved into the mounting stage of the turntable assembly by the transfer component, and the turntable assembly drives the mounting stage to rotate to the debonding station under the action of external force. The debonding assembly is activated, and a laser is emitted towards the semiconductor device through a laser generator to perform debonding. At the same time, the annular suction component of the debonding assembly adsorbs the particles generated during the debonding process. The debonded carrier is separated from the wafer by a transfer component, and then particles on the surface of the wafer are removed by a cleaning component. The processed wafers and carriers are removed from the mounting stage using a transfer assembly.

9. The semiconductor device debonding method according to claim 8, characterized in that, The debonding method further includes: Under the action of external force, the turntable assembly drives the mounting stage to rotate to the debonding station, while the transfer assembly places other semiconductor devices on other mounting stages.

10. The semiconductor device debonding method according to claim 8, characterized in that, Separating the debonded carrier from the wafer via a transfer assembly also includes: The suction cup picks up the clean side of the slide, the transfer assembly receives the contaminated side of the slide and flips it over, and the moving platform moves under the transfer assembly and picks up and fixes the clean side of the slide.

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