Water cleaning device for copper wire enameling

Abstract

The invention relates to the technical field of enameled wire production and cleaning equipment, in particular to a water cleaning device for copper wire enamelling, which comprises a water tank, a water outlet column is fixedly mounted in the water tank, a water outlet grid is arranged on the surface of the water outlet column, and a cleaning mechanism is arranged on the surface of the water outlet column and is used for spirally conveying a bare copper wire and cleaning the surface of the bare copper wire; the cleaning mechanism comprises an upper spiral plate and a lower spiral plate, the upper spiral plate and the lower spiral plate are both fixedly installed on the outer surface of the water outlet column and are arranged in parallel, and a cleaning room is formed among the upper spiral plate, the lower spiral plate and the surface of the water outlet column. By arranging the cleaning mechanism, a copper wire can be spirally conveyed along a cleaning room, the conveying path of the copper wire is prolonged, the retention time is prolonged, meanwhile, the surface of the copper wire is cleaned through water flow and bubbles, and the water cleaning effect is effectively enhanced; meanwhile, bidirectional bubble up-and-down scouring can counteract one-way water flow unbalance loading, and copper wire vibration is avoided.

Description

Technical Field

[0001] This invention relates to the field of cleaning equipment technology for enameled wire production, specifically a water cleaning device for copper wire enameling. Background Technology

[0002] As a core component of electrical equipment, the performance of enameled wire directly depends on the cleanliness of its copper surface. In the enameling process, water cleaning is a crucial pre-process, designed to thoroughly remove residual lubricant, oxide layers, oil, and other impurities from the surface of the drawn copper wire. Incomplete cleaning can hinder the uniform adhesion of the insulating varnish, leading to defects such as pinholes, bubbles, or insufficient adhesion in the varnish film, thus affecting the wire's voltage withstand capability, mechanical strength, and service life. Therefore, efficient and non-destructive water cleaning equipment is essential for improving the quality of enameled wire.

[0003] Currently, most common enameled wire water cleaning devices employ linear conveying and unidirectional water flow rinsing. Due to the short linear conveying path, the copper wire does not remain in the washing zone long enough to thoroughly remove stubborn contaminants. Furthermore, relying solely on unidirectional water rinsing easily creates cleaning dead zones, especially on the back surface of the copper wire and in folds where impurities remain at high rates. Uneven water flow impact can also cause vibration in the copper wire, affecting its surface properties and consequently the smoothness of subsequent coating.

[0004] In view of this, we propose a water cleaning device for copper wire enameled coating. Summary of the Invention

[0005] The purpose of this invention is to provide a water cleaning device for copper wire enameled coatings, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A copper wire enameled cleaning device includes a water tank, a water outlet column fixedly installed inside the water tank, a water outlet grid formed on the surface of the water outlet column, and a cleaning mechanism provided on the surface of the water outlet column for spiral conveying and cleaning the surface of the bare copper wire; the cleaning mechanism includes an upper spiral plate and a lower spiral plate, both of which are fixedly installed on the outer surface of the water outlet column and arranged in parallel, forming a cleaning chamber between the upper spiral plate, the lower spiral plate, and the surface of the water outlet column; The upper spiral plate is equipped with a sample feeding mechanism to assist in the spiral transport of bare copper wires.

[0007] Preferably, the inner walls of the upper and lower spiral plates are provided with a plurality of air bubble openings, the water outlet column is a hollow structure, the upper and lower spiral plates are connected to the water outlet column, and the air bubble openings are connected to an air pump through the water outlet column and a pipe.

[0008] Preferably, the water outlet grille is arranged in a spiral shape, the water outlet grille is installed in the cleaning room, and the bottom of the water outlet column is connected to a purification circulation box through a pipe and a pump.

[0009] Preferably, the surface of the water column is rotatably mounted with multiple mounting seats located in the cleaning room position. A fixed frame is fixedly mounted on the mounting seat, and an air rod is fixedly mounted on both sides near the bottom end of the mounting seat. A movable frame is fixedly mounted on one end of the air rod.

[0010] Preferably, both the mounting base and the movable frame are rotatably mounted with guide wheels.

[0011] Preferably, a connecting plate is fixedly connected between the upper spiral plate and the lower spiral plate, and multiple mounting seats are evenly distributed along the cleaning room. The connecting plate is provided with an opening at the mounting seat position, and the air rod is connected to the air pump through a pipe.

[0012] Preferably, the sample loading mechanism includes a sliding rail, which is opened on the upper spiral plate. A sliding rod is slidably installed inside the sliding rail. A top plate is fixedly installed at the top end of the sliding rod, and a bottom plate is fixedly installed at the bottom end of the sliding rod.

[0013] Preferably, an elastic rod is fixedly installed at the bottom end of the top plate and the top end of the bottom plate, and a rolling ball is rotatably installed on the elastic rod, the rolling ball being in contact with the surface of the upper spiral plate.

[0014] Preferably, a fixed clamping plate is fixedly installed on the side of the base plate near the water outlet column, and a movable clamping plate is provided on the other side of the base plate. A lead screw is fixedly installed on the movable clamping plate, and the lead screw is slidably connected to the base plate.

[0015] Preferably, a rotating rod is rotatably installed through the top plate and the sliding rod, and a bevel gear one is fixedly installed at the bottom end of the rotating rod. A lead screw is fixedly connected to the movable clamping plate, and the lead screw is slidably connected to the bottom plate. A bevel gear two is threaded onto the lead screw, and the bevel gear one and the bevel gear two are meshed together. Both the bevel gear one and the bevel gear two are rotatably connected to the bottom plate.

[0016] By employing the above technical solution, the present invention provides a copper wire enameled coating water cleaning device that has at least the following beneficial effects: (1) By setting up a cleaning mechanism, the copper wire can be spirally conveyed along the cleaning room, extending the copper wire conveying path and increasing its residence time in the water washing area. At the same time, the surface of the copper wire is cleaned by water flow and air bubbles, which effectively enhances the water cleaning effect. Meanwhile, the bidirectional air bubble flushing can counteract the unidirectional water flow load and avoid copper wire vibration.

[0017] (2) By setting up a mounting base, a fixed frame, a movable frame and a guide wheel, the present invention can constrain the conveying direction of the copper wire, the rotating connection of the mounting base can improve the uniformity of the force during the conveying process of the copper wire, and the movable frame can adapt to copper wires of different diameters, thereby achieving precise constraint on the position of the copper wire, preventing serpentine deviation and ensuring uniform force on each section of copper wire.

[0018] (3) By setting up a sample loading mechanism, the present invention can quickly clamp the end of the copper wire and use rolling balls to achieve low-resistance sample loading of the copper wire, which effectively improves the efficiency of equipment line changing and the applicability of line changing for copper wires of different diameters. Attached Figure Description

[0019] The accompanying drawings, which are provided to further illustrate the invention, constitute a part of this application: Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention. Figure 1 ; Figure 3 This is an enlarged structural schematic diagram of the water outlet column and spiral plate of the present invention; Figure 4 This is a partial cross-sectional structural diagram of the water outlet column and spiral plate of the present invention. Figure 5 This is a schematic diagram of the guide wheel and its connecting part of the present invention; Figure 6 This is an enlarged schematic diagram of the guide wheel structure of the present invention; Figure 7 This is a schematic diagram of the sample loading mechanism of the present invention. Figure 8 This is a schematic cross-sectional view of the rolling ball and its connecting part according to the present invention; Figure 9 This is a schematic cross-sectional view of the sample loading mechanism of the present invention.

[0020] In the diagram: 1. Water tank; 2. Water column; 21. Water grid; 3. Discharge port; 4. Purification circulation tank; 5. Cleaning mechanism; 6. Sample loading mechanism; 51. Upper spiral plate; 52. Lower spiral plate; 53. Connecting plate; 54. Bubble inlet; 55. Mounting base; 56. Fixed frame; 57. Movable frame; 58. Guide wheel; 59. Air rod; 61. Sliding rail; 62. Top plate; 63. Sliding rod; 64. Base plate; 65. Elastic rod; 66. Rolling ball; 67. Fixed clamping plate; 68. Movable clamping plate; 69. Rotating rod; 610. Bevel gear one; 611. Lead screw; 612. Bevel gear two. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-8 A water cleaning device for copper wire enameling includes a water tank 1. The water tank 1 is used to clean the bare copper wire after drawing, removing impurities from the surface of the copper wire, such as drawing lubricant residue, oxide layer, dust, oil, etc., to ensure uniform adhesion of the paint film in the subsequent painting process and avoid defects such as bubbles, pinholes, and insufficient adhesion. A water outlet column 2 is fixedly installed inside the water tank 1. A water outlet grille 21 is opened on the surface of the water outlet column 2. Water in the water tank 1 can enter the water outlet column 2 through the water outlet grille 21 and be discharged, thereby cleaning the bare copper wire and removing impurities. A purification circulation tank 4 is connected to the bottom of the water outlet column 2 through a pipe and a pump. The outlet of the purification circulation tank 4 is connected to the water tank 1, and the height of the outlet of the purification circulation tank 4 is higher than the top of the water tank 1. Under the action of the pump, the water flow carries impurities into the purification circulation tank 4, where they are purified. The purified water then re-enters the water tank 1, achieving water circulation.

[0023] Please see Figure 1 The water tank 1 has a discharge port 3 for discharging the cleaned bare copper wire. The discharge port 3 is sealed with a sponge so that the bare copper wire can be discharged and water can be prevented from overflowing along the discharge port 3.

[0024] Please see Figure 2 A cleaning mechanism 5 is installed on the surface of the water column 2, used for spiral conveying of bare copper wires and cleaning the surface of the copper wires using water flow and air bubbles. The cleaning mechanism 5 includes an upper spiral plate 51 and a lower spiral plate 52, which are identical spiral structures and are arranged parallel to each other on the outer surface of the water column 2, forming a spiral cleaning space between the upper spiral plate 51, the lower spiral plate 52, and the surface of the water column 2. This allows the bare copper wires to be spirally conveyed along the cleaning space, effectively extending the residence time of the bare copper wires in the water tank 1 and enhancing the cleaning effect.

[0025] Please see Figure 3Several bubble ports 54 are provided on the inner walls of the opposite surfaces of the upper spiral plate 51 and the lower spiral plate 52. The water outlet column 2 has a hollow structure, and both the upper spiral plate 51 and the lower spiral plate 52 are connected to the water outlet column 2. The bubble ports 54 are connected to an air pump through the water outlet column 2 and a pipe. The pipe is located at the bottom of the water outlet column 2. The air pump can continuously fill the hollow structure of the water outlet column 2 with compressed gas, so that the hollow structure of the water outlet column 2 maintains a certain positive pressure. Under positive pressure, the gas will be evenly discharged along the bubble ports 54, thereby achieving the cleaning effect on the surface of the copper wire. Since the bubble ports 54 are located on the inner walls of the opposite surfaces of the upper spiral plate 51 and the lower spiral plate 52, the bubbles generated by the bubble ports 54 can simultaneously impact and clean the upper and lower surfaces of the copper wire. Using bubbles for counter-current rinsing can not only enhance the cleaning effect, but also avoid the unidirectional force that would cause vibration of the bare copper wire, which would affect the performance of the copper wire. Meanwhile, the water outlet grille 21 is set in a spiral shape inside the cleaning chamber, so that the water flow will enter the water outlet column 2 through the water outlet grille 21. The flow of water will carry air bubbles and impurities out at the same time. The combination of water flow and air bubbles can effectively remove impurities from the surface of bare copper wires gently and thoroughly.

[0026] It should be noted that the water outlet grille 21 is preferably a mesh structure, which can evenly distribute the water flow without significantly interfering with the flow of the water while ensuring structural strength.

[0027] Please see Figure 4 The surface of the water column 2 is rotatably mounted with multiple mounting bases 55 located in the cleaning room. The mounting bases 55 can rotate at a certain angle, thereby adapting to the conveying angle of the bare copper wire and avoiding large bending angles during conveying, which would affect the surface performance of the copper wire.

[0028] Please see Figure 5 Multiple mounting bases 55 are evenly distributed along the cleaning chamber. A mounting frame 56 is fixedly mounted on each mounting base 55, and a guide wheel 58 is rotatably mounted on the mounting frame 56. The guide wheel 58 consists of two frustums, with the smaller diameter end of each frustum fixedly connected. The guide wheel 58 within the mounting frame 56 guides and conveys the bare copper wire, allowing it to be spirally conveyed along the cleaning chamber. The bare copper wire only contacts the guide wheel 58, reducing the probability of surface damage during conveying. The rotatable mounting of the guide wheel 58 converts the friction between the guide wheel 58 and the copper wire into rotational friction, preventing damage to the copper wire surface during conveying.

[0029] In this embodiment, a pneumatic rod 59 is fixedly installed on both sides of the bottom end of the mounting base 55. The pneumatic rod 59 consists of two sleeved round rods connected by a piston. The pneumatic rod 59 is connected to an air pump via a pipe. The air pump can adjust the internal air pressure of the round rods of the pneumatic rod 59, thereby adjusting the overall length of the pneumatic rod 59 by adjusting the displacement of the piston. A movable frame 57 is fixedly installed at one end of the pneumatic rod 59, so that the position of the movable frame 57 can be adjusted by adjusting the overall length of the pneumatic rod 59.

[0030] It is worth noting that guide wheels 58 are rotatably installed inside the movable frame 57. These guide wheels 58 are horizontally positioned with the guide wheels 58 on the fixed frame 56, allowing them to clamp and transport the bare copper wire, thus improving stability during transport. Furthermore, a connecting plate 53 is fixedly connected between the upper spiral plate 51 and the lower spiral plate 52, providing support for both. The connecting plate 53 also has an opening at the mounting base 55 for water entry and easy adjustment and maintenance. Additionally, the movable frame 57 has a U-shaped cross-section, with the guide wheels 58 positioned inside, ensuring even force distribution and greater stability during rotation. Moreover, the movable frame 57 and the fixed frame 56 can rotate synchronously with the mounting base 55, with the rotation angle limited by the contact between the movable frame 57 / fixed frame 56 and the upper and lower spiral plates 51 / 52.

[0031] Please see Figure 2 A sample loading mechanism 6 is provided on the upper spiral plate 51 to clamp the end of the bare copper wire, thereby assisting the bare copper wire to be spirally conveyed along the cleaning chamber, facilitating the sample loading of the bare copper wire. The sample loading mechanism 6 includes a sliding rail 61, which is provided on the upper spiral plate 51. The sliding rail 61 is located in the middle of the upper spiral plate 51 and passes through the upper spiral plate 51.

[0032] Please see Figure 6 The sample loading mechanism 6 also includes a top plate 62, with a sliding rod 63 fixedly installed below the top plate 62. A bottom plate 64 is fixedly installed at the lower end of the sliding rod 63. The top plate 62, the sliding rod 63, and the bottom plate 64 form an I-shaped structure. The sliding rod 63 passes through the sliding rail 61 and is slidably connected to it. The sliding rod 63 is a round rod, and its surface is in contact with the inner wall of the sliding rail 61. The I-shaped structure serves as a limit, preventing the sliding rod 63 from detaching from the sliding rail 61.

[0033] Based on this, elastic rods 65 are fixedly installed at the bottom of the top plate 62 and the top of the bottom plate 64. Rolling balls 66 are rotatably mounted on the elastic rods 65, and the rolling balls 66 contact the surface of the upper spiral plate 51. The elastic rods 65 consist of two elastically connected round rods, allowing the rolling balls 66 to have a certain displacement distance, preventing jamming during operation. Simultaneously, the contact between the rolling balls 66 and the surface of the upper spiral plate 51 converts sliding friction into rolling friction, thus facilitating stable delivery of bare copper wires.

[0034] Please see Figure 8 A fixed clamping plate 67 is fixedly installed on the side of the base plate 64 near the water outlet column 2, and a movable clamping plate 68 is provided on the other side of the base plate 64. The bare copper wire can be clamped and fixed by the fixed clamping plate 67 and the movable clamping plate 68. A lead screw 611 is fixedly installed on the movable clamping plate 68. The lead screw 611 is slidably connected to the base plate 64. Specifically, the contact surface between the lead screw 611 and the base plate 64 has a "T" shape structure, so that the lead screw 611 can only slide along the base plate 64 and will not rotate.

[0035] Based on this, a rotating rod 69 is rotatably installed through the top plate 62 and the sliding rod 63. A bevel gear set is provided between the rotating rod 69 and the lead screw 611. The bevel gear set consists of two meshing bevel gears, a first bevel gear 610 and a second bevel gear 612. The rotating rod 69 is fixedly connected to the first bevel gear 610, and the lead screw 611 is threaded through the second bevel gear 612. Both the first bevel gear 610 and the second bevel gear 612 are rotatably connected to the base plate 64. Rotating the rotating rod 69 can drive the first bevel gear set 610 to rotate, which in turn drives the second bevel gear 612 to rotate. When the second bevel gear 612 rotates, it drives the lead screw 611 to move along the base plate 64 through its threaded connection with the lead screw 611. The displacement of the lead screw 611 causes the movable clamping plate 68 to move, thereby enabling the clamping of copper wires of different diameters.

[0036] Specifically, the air rod 59 is positioned on both sides of the bottom end of the mounting base 55, so that after the movable frame 57 is removed from the mounting base 55, there is a gap between the top of the movable frame 57 and the top of the fixed frame 56. This gap allows the sample loading mechanism 6 to easily drive the bare copper wire to load the sample.

[0037] A water cleaning device for copper wire enameled coatings, the working principle of which is as follows: Sample loading: The air pump is started, increasing the air pressure inside the air rod 59, causing it to extend. This extension moves the movable frame 57 away from the fixed frame 56. After the copper wire is drawn, the end of the wire is passed between the fixed clamping plate 67 and the movable clamping plate 68. By rotating the rotating rod 69, the first bevel gear set 610 rotates, which in turn rotates the second bevel gear 612. The rotation of the second bevel gear 612, through its threaded connection with the lead screw 611, causes the lead screw 611 to move along the base plate 64. This displacement of the lead screw 611 causes the movable clamping plate 68 to move, thus fixing the copper wire. The sliding rod 63 then moves along the sliding rail 61, causing the copper wire to move synchronously with it, thus moving the copper wire along the cleaning area. The copper wire contacts the surfaces of the guide wheels 58 on the multiple mounting seats 55. Finally, the copper wire is discharged through the discharge port 3 on the surface of the water tank 1. After the copper wire is discharged, the length of the air rod 59 is controlled by the air pump so that the guide wheel 58 on the movable frame 57 contacts the copper wire, and the guide wheel 58 on the fixed frame 56 works together to achieve stable delivery of the copper wire.

[0038] Cleaning: The copper wire is spirally conveyed along the guide wheel 58 and the cleaning chamber. During the conveying process, the pump is started, and the water in the water tank 1 enters the water column 2 through the water outlet grille 21, and then enters the purification circulation box 4 through the pipe. After being purified, it is discharged back into the water tank 1, realizing water circulation. The air pump works to discharge dense and uniform air bubbles from the bubble outlets 54 on the upper spiral plate 51 and the lower spiral plate 52. The air bubbles impact and clean the surface of the copper wire from both the top and bottom. When the water flows out along the water outlet grille 21, it cleans the surface of the copper wire from the side. At the same time, the water flow carries the air bubbles out along the water outlet grille 21. The air bubbles can also wrap the surface impurities, making the cleaning of the copper wire surface more thorough, while preventing impurities from accumulating in the water in the water tank 1 and affecting the cleaning effect.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A water cleaning device for copper wire enameled coating, comprising a water tank (1), characterized in that: The water tank (1) is fixedly installed with a water outlet column (2). A water outlet grid (21) is provided on the surface of the water outlet column (2). A cleaning mechanism (5) is provided on the surface of the water outlet column (2) for spiral conveying of bare copper wire and cleaning of its surface. The cleaning mechanism (5) includes an upper spiral plate (51) and a lower spiral plate (52). The upper spiral plate (51) and the lower spiral plate (52) are fixedly installed on the outer surface of the water outlet column (2). The upper spiral plate (51) and the lower spiral plate (52) are arranged in parallel. The upper spiral plate (51), the lower spiral plate (52) and the surface of the water outlet column (2) form a cleaning chamber. The upper spiral plate (51) is provided with a sample feeding mechanism (6) to assist the bare copper wire in spiral conveying.

2. The copper wire enameled coating water cleaning device according to claim 1, characterized in that: The upper spiral plate (51) and the lower spiral plate (52) have several bubble ports (54) on their inner walls. The water column (2) is a hollow structure. The upper spiral plate (51) and the lower spiral plate (52) are connected to the water column (2). The bubble ports (54) are connected to an air pump through the water column (2) and the pipe.

3. The copper wire enameled coating water cleaning device according to claim 1, characterized in that: The water outlet grille (21) is spirally arranged and is located in the cleaning room. The bottom of the water outlet column (2) is connected to the purification circulation box (4) through a pipe and a pump.

4. The copper wire enameled coating water cleaning device according to claim 1, characterized in that: The surface of the water column (2) is rotatably mounted with multiple mounting seats (55) located in the cleaning room. A fixed frame (56) is fixedly mounted on the mounting seat (55). An air rod (59) is fixedly mounted on both sides of the bottom end of the mounting seat (55). A movable frame (57) is fixedly mounted on one end of the air rod (59).

5. A water cleaning device for copper wire enameled coating according to claim 4, characterized in that: Guide wheels (58) are rotatably installed inside both the mounting base (55) and the movable frame (57).

6. A water cleaning device for copper wire enameled coating according to claim 4, characterized in that: A connecting plate (53) is fixedly connected between the upper spiral plate (51) and the lower spiral plate (52). Multiple mounting seats (55) are evenly distributed along the cleaning room. The connecting plate (53) has an opening at the mounting seat (55). The air rod (59) is connected to the air pump through a pipe.

7. A water cleaning device for copper wire enameled coating according to claim 1, characterized in that: The sample loading mechanism (6) includes a sliding rail (61), which is opened on the upper spiral plate (51). A sliding rod (63) is slidably installed inside the sliding rail (61). A top plate (62) is fixedly installed at the top of the sliding rod (63), and a bottom plate (64) is fixedly installed at the bottom of the sliding rod (63).

8. A water cleaning device for copper wire enameled coating according to claim 7, characterized in that: An elastic rod (65) is fixedly installed at the bottom end of the top plate (62) and the top end of the bottom plate (64). A ball bearing (66) is rotatably installed on the elastic rod (65), and the ball bearing (66) is in contact with the surface of the upper spiral plate (51).

9. A water cleaning device for copper wire enameled coating according to claim 8, characterized in that: A fixed clamping plate (67) is fixedly installed on the side of the base plate (64) near the water column (2), and a movable clamping plate (68) is provided on the other side of the base plate (64). A screw rod (611) is fixedly installed on the movable clamping plate (68), and the screw rod (611) is slidably connected to the base plate (64).

10. A water cleaning device for copper wire enameled coating according to claim 8, characterized in that: A rotating rod (69) is rotatably installed through the top plate (62) and the sliding rod (63). A bevel gear (610) is fixedly installed at the bottom end of the rotating rod (69). A lead screw (611) is fixedly connected to the movable clamping plate (68). The lead screw (611) is slidably connected to the bottom plate (62). A bevel gear (612) is threaded onto the lead screw (611). The bevel gear (610) and the bevel gear (612) are meshed together. Both the bevel gear (610) and the bevel gear (612) are rotatably connected to the bottom plate (62).

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