Double-sided laser engraving machine

Abstract

The invention belongs to the technical field of laser marking equipment, and particularly relates to a double-sided laser carving machine which comprises a rack, a case, a controller, an upper marking device, a feeding mechanism and a lower marking device. The upper marking device comprises a first X-axis module, a first Y-axis module, a first lifting mechanism, an upper marking mechanism, an upper detection mechanism and a dust collection mechanism. The lower marking device comprises a second X-axis module, a second Y-axis module, a lower marking mechanism and a lower detection mechanism. According to the double-face laser carving machine, the upper marking device and the lower marking device detect and mark the upper surface and the lower surface of the circuit board correspondingly, the upper marking device and the lower marking device conduct detection and marking at the same time, the marking efficiency is improved, the two faces of the circuit board can be marked at a time through the upper marking device and the lower marking device, and through the feeding mechanism, the two faces of the circuit board can be marked at a time. A circuit board can be moved and fed to a material opening, and after the circuit board is marked, discharging is convenient.

Description

Technical Field

[0001] This invention belongs to the field of laser marking equipment technology, and particularly relates to a double-sided laser engraving machine. Background Technology

[0002] Laser marking is widely used in the production process of printed circuit boards (PCBs) and flexible printed circuit boards (FPCs) for engraving markings such as model numbers, QR codes, batch numbers, and anti-counterfeiting labels.

[0003] A Chinese invention patent with publication number CN117620486A, entitled "A Circuit Board Flip-Type Laser Engraving Machine," describes a solution that uses a flipping component to flip the circuit board, and an automatic loading and unloading component to automatically load and unload the board. This solves the problem of manual loading and flipping for double-sided engraving of circuit boards, improving production efficiency and product quality. The circuit board is held in place by synchronous belts from two sets of conveyors, preventing it from sliding during flipping and affecting the engraving effect. A blocking cylinder and a stop block limit the circuit board, preventing it from sliding out of the flipping component.

[0004] However, the above solution has the following drawbacks: the solution sets up a laser engraving module, which can only engrave one side of the circuit board at a time. After engraving one side, the circuit board is flipped over by a flipping component to engrave the other side. The flipping process also takes time, resulting in low circuit board engraving efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a double-sided laser engraving machine, which aims to solve the technical problem of low engraving efficiency in traditional circuit board laser engraving machines in the prior art.

[0006] To achieve the above objectives, the double-sided laser engraving machine provided in this embodiment of the invention includes a frame, a housing, a controller, an upper marking device, a feeding mechanism, and a lower marking device. The housing is fixed to the outside of the frame. The upper marking device, the feeding mechanism, and the lower marking device are sequentially fixed to the frame. The feeding mechanism is disposed between the upper marking device and the lower marking device. The upper marking device, the feeding mechanism, and the lower marking device are all electrically connected to the controller. The upper marking device and the lower marking device simultaneously mark the circuit board on the feeding mechanism.

[0007] The upper marking device includes a first X-axis module, a first Y-axis module, a first lifting mechanism, an upper marking mechanism, an upper detection mechanism, and a dust collection mechanism;

[0008] The lower marking device includes a second X-axis module, a second Y-axis module, a lower marking mechanism, and a lower detection mechanism;

[0009] While the upper marking device detects and marks the circuit board through the upper detection mechanism and the upper marking mechanism, the lower marking device detects and marks the circuit board through the lower marking mechanism and the lower detection mechanism.

[0010] As an optional embodiment of the present invention, the first X-axis module is fixed to the frame, the first Y-axis module is fixed to the first X-axis module, the first lifting mechanism is fixed to the first Y-axis module, the upper marking mechanism is fixed to the first lifting mechanism, the upper detection mechanism is fixed to the upper marking mechanism, the upper marking mechanism and the upper detection mechanism are both disposed above the feeding mechanism, and the dust collection mechanism is fixed to the upper marking mechanism; the first lifting mechanism includes a lifting fixed seat, a lifting slide rail, a lifting slider, a lifting cylinder, and a lifting slide block, the lifting fixed seat is fixed to the first Y-axis module, the lifting slide rail is fixed to the lifting fixed seat, the lifting slider is slidably connected to the lifting slide rail, one end of the lifting cylinder is fixed to the lifting fixed seat, and the other end is fixed to the lifting slide block, and the lifting slide block is respectively fixed to the lifting slider and the upper marking mechanism.

[0011] As an optional embodiment of the present invention, the upper marking mechanism includes an upper laser, an upper laser head, an upper cooling fan, and an upper infrared sensor. The upper laser is fixed to the lifting slide, and the upper laser head is fixed to the upper laser and disposed above the feeding mechanism. The upper laser head marks the upper surface of the circuit board through the upper laser. The upper cooling fan is fixed to the side of the upper laser, and the upper infrared sensor is fixed to the side of the upper laser.

[0012] As an optional embodiment of the present invention, the upper detection mechanism includes an upper detection seat and an upper detection camera. The upper detection seat is fixed to the upper laser, and the upper detection camera is fixed to the upper detection seat. The upper detection camera detects the upper surface of the circuit board. A material port is provided on the side of the chassis. The material port is located on one side of the feeding frame, and the circuit board is fed or discharged through the material port.

[0013] As an optional embodiment of the present invention, the dust collection mechanism includes a positive pressure component, a nozzle assembly, a negative pressure component, and an electrode assembly. The positive pressure component is fixed to the upper laser, the nozzle assembly is fixed to the upper laser head and connected to the positive pressure component and the negative pressure component respectively, and the electrode assembly is fixed to the nozzle assembly of the upper laser. The positive pressure component includes a positive pressure air pump, a positive pressure air pipe, and a positive pressure connector. The positive pressure air pump is fixed to the upper laser, one end of the positive pressure air pipe is connected to the positive pressure air pump, and the other end is connected to the positive pressure connector. The positive pressure connector is fixed to the nozzle assembly. The nozzle assembly includes a nozzle body, a nozzle cover, a flow guide tube, and a flow stabilizer tube. The nozzle body is fixed to the upper laser head, the nozzle cover is fixed to the top side of the nozzle body, the flow guide tube is fixed inside the nozzle body, the positive pressure connector is fixed to the nozzle cover, and the flow stabilizer tube is fixed to the bottom of the nozzle body. The nozzle body is provided with a laser channel, a slit outlet, and a negative pressure channel. The laser channel is located at the center of the nozzle body. Multiple slit outlets are provided and are evenly arranged in a ring around the nozzle body. Multiple negative pressure channels are provided and are evenly arranged around the nozzle body.

[0014] As an optional embodiment of the present invention, the negative pressure assembly includes a negative pressure air pipe, a negative pressure connector, and a negative pressure air pump. The number of negative pressure air pipes and connectors is the same as the number of negative pressure channels. One end of the negative pressure air pipe is connected to the negative pressure channel, and the other end passes through the nozzle cover and is connected to the negative pressure air pump. The negative pressure connector is fixed to the nozzle cover, and the negative pressure air pump is fixed to the upper laser. The electrode assembly includes an electrostatic adsorption electrode, a low-voltage DC electrostatic generator, and an insulated wire. The low-voltage DC electrostatic generator is fixed to the upper laser and is electrically connected to the low-voltage DC electrostatic generator through the insulated wire. One end of the insulated wire is electrically connected to the electrostatic adsorption electrode, and the other end passes through the nozzle body and the nozzle cover, and is electrically connected to the low-voltage DC electrostatic generator; one end of the electrostatic adsorption electrode is fixed in a ring shape inside the flow stabilizing cylinder and located in the insulating interlayer between the flow stabilizing cylinder and the flow guiding cylinder; the electrostatic adsorption electrode is located above the slit outlet and outside the laser channel; the lower surface of the electrostatic adsorption electrode is flush with or recessed from the bottom surface of the flow stabilizing cylinder; the electric field direction of the electrostatic adsorption electrode is perpendicular to the laser marking center area; a ceramic insulating layer is fixed on the outside of the electrostatic adsorption electrode.

[0015] As an optional embodiment of the present invention, the second X-axis module is fixed to the frame, the second Y-axis module is fixed to the second X-axis module, the lower marking mechanism is fixed to the second Y-axis module, and the lower detection mechanism is fixed to the lower marking mechanism. Both the lower marking mechanism and the lower detection mechanism are located below the feeding mechanism. The lower marking mechanism includes a lower fixing base, a lower laser, a lower laser head, a lower cooling fan, and a lower infrared sensor. The lower fixing base is fixed to the second Y-axis module, the lower laser is fixed to the lower fixing base, and the lower laser head is fixed to the lower laser and located below the feeding mechanism. The lower laser head marks the lower surface of the circuit board through the lower laser. The lower cooling fan is fixed to the side of the lower laser, and the lower infrared sensor is fixed to the side of the lower laser.

[0016] As an optional embodiment of the present invention, the lower detection mechanism includes a lower detection seat and a lower detection camera. The lower detection seat is fixed to the lower laser, and the lower detection camera is fixed to the lower detection seat. The lower detection camera detects the lower surface of the circuit board.

[0017] As an optional embodiment of the present invention, the feeding mechanism includes an adjustment component and a feeding component. The adjustment component is fixed to the frame, and the feeding component is fixed to the adjustment component. The adjustment component includes an adjustment frame, an adjustment motor, an adjustment drive pulley, an adjustment driven pulley, an adjustment screw, an adjustment belt, an adjustment slide rail, and an adjustment slider. The adjustment frame is fixed to the frame, the adjustment motor is fixed to the adjustment frame, the adjustment drive pulley is fixed to the adjustment motor, the adjustment driven pulley is rotatably connected to the adjustment frame, the adjustment screw is fixed to the adjustment driven pulley and rotatably connected to the adjustment frame, the adjustment belt is fixedly wound around the adjustment drive pulley and the adjustment driven pulley, the adjustment slide rail is fixed to the frame, and the adjustment slider is slidably connected to the adjustment slide rail.

[0018] As an optional embodiment of the present invention, two feeding assemblies are provided and symmetrically arranged, one of which is fixed to the adjusting slider; the feeding assembly includes a feeding nut seat, a feeding frame, a feeding motor, a driving pulley, a driven pulley, a feeding belt, and a feeding infrared sensor. The feeding nut seat is fixed to the adjusting slider and the feeding frame respectively, and is threadedly connected to the adjusting screw; the feeding motor is fixed to the feeding frame, the driving pulley is fixed to the feeding motor, multiple driven pulleys are provided and are all rotatably connected to the feeding frame, the feeding belt is fixedly wound around the driving pulley and the driven pulley respectively, and multiple feeding infrared sensors are provided and are all fixed to the feeding frame.

[0019] The above-mentioned technical solutions of one or more of the double-sided laser engraving machines provided in the embodiments of the present invention have at least one of the following technical effects:

[0020] The double-sided laser engraving machine provided in this application has an upper marking device and a lower marking device that detect and mark the upper and lower surfaces of the circuit board, respectively. The detection and marking by the upper and lower marking devices are performed simultaneously, which improves the marking efficiency. The upper and lower marking devices can mark both sides of the circuit board at one time. Furthermore, the circuit board can be moved by the feeding mechanism and fed to the material port. After the circuit board is marked, it is easy to discharge. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a perspective view of a double-sided laser engraving machine provided in an embodiment of the present invention.

[0023] Figure 2 This is a perspective view of the double-sided laser engraving machine provided in an embodiment of the present invention, omitting the machine casing.

[0024] Figure 3 This is a perspective view of the marking device on the upper part of the double-sided laser engraving machine provided in an embodiment of the present invention.

[0025] Figure 4 This is a perspective view of the feeding mechanism of the double-sided laser engraving machine provided in an embodiment of the present invention.

[0026] Figure 5 This is a perspective view of the lower marking device of the double-sided laser engraving machine provided in an embodiment of the present invention.

[0027] Figure 6 for Figure 2 A magnified view of a portion of point A in the middle.

[0028] Figure 7 This is a perspective view of the dust collection mechanism of the double-sided laser engraving machine provided in an embodiment of the present invention.

[0029] Figure 8 This is a perspective view of the nozzle assembly of a double-sided laser engraving machine provided in an embodiment of the present invention.

[0030] Figure 9 This is a perspective view of the nozzle assembly of a double-sided laser engraving machine provided in an embodiment of the present invention.

[0031] The following are the labeling elements in the figure:

[0032] 1. Frame; 2. Chassis; 3. Controller; 4. Upper marking device; 5. Feeding mechanism; 6. Lower marking device; 7. Circuit board;

[0033] 11. Feed inlet;

[0034] 41. First X-axis module; 42. First Y-axis module; 43. First lifting mechanism; 44. Upper marking mechanism; 45. Upper detection mechanism; 46. Positive pressure assembly; 47. Nozzle assembly; 48. Negative pressure assembly; 49. Electrode assembly;

[0035] 431. Lifting fixed base; 432. Lifting slide rail; 433. Lifting slider; 434. Lifting cylinder; 435. Lifting slide block;

[0036] 441. Install the laser; 442. Install the laser head; 443. Install the cooling fan; 444. Install the infrared sensor;

[0037] 451. Install the testing mount; 452. Install the testing camera;

[0038] 461. Positive pressure air pump; 462. Positive pressure air hose; 463. Positive pressure connector;

[0039] 471. Nozzle body; 472. Nozzle cap; 473. Flow guide tube; 474. Flow stabilizer tube;

[0040] 4711. Laser channel; 4712. Slit outlet; 4713. Negative pressure channel;

[0041] 481. Negative pressure air hose; 482. Negative pressure connector; 483. Negative pressure air pump;

[0042] 491. Electrostatic adsorption electrode; 492. Low-voltage DC electrostatic generator; 493. Insulated wire;

[0043] 51. Adjustment component; 52. Feeding component;

[0044] 511. Adjusting frame; 512. Adjusting motor; 513. Adjusting drive pulley; 514. Adjusting driven pulley; 515. Adjusting screw; 516. Adjusting belt; 517. Adjusting slide rail; 518. Adjusting slider;

[0045] 521. Feed nut seat; 522. Feeding frame; 523. Feeding motor; 524. Drive pulley; 525. Driven pulley; 526. Feeding belt; 527. Feeding infrared sensor;

[0046] 61. Second X-axis module; 62. Second Y-axis module; 63. Lower marking mechanism; 64. Lower inspection mechanism;

[0047] 631. Lower mounting base; 632. Lower laser; 633. Lower laser head; 634. Lower cooling fan; 635. Lower infrared sensor;

[0048] 641. Lower the detection seat; 642. Lower the detection camera. Detailed Implementation

[0049] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0050] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0052] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0053] In one embodiment of the present invention, such as Figures 1-9As shown, a double-sided laser engraving machine is provided, including a frame 1, a housing 2, a controller 3, an upper marking device 4, a feeding mechanism 5, and a lower marking device 6. The housing 2 is fixed to the outside of the frame 1. The upper marking device 4, the feeding mechanism 5, and the lower marking device 6 are sequentially fixed to the frame 1. The feeding mechanism 5 is located between the upper marking device 4 and the lower marking device 6. The upper marking device 4, the feeding mechanism 5, and the lower marking device 6 are all electrically connected to the controller 3. The upper marking device 4 and the lower marking device 6 simultaneously mark the circuit board 7 on the feeding mechanism 5.

[0054] The upper marking device 4 includes a first X-axis module 41, a first Y-axis module 42, a first lifting mechanism 43, an upper marking mechanism 44, an upper detection mechanism 45, and a dust collection mechanism. The first X-axis module 41 is fixed to the frame 1, the first Y-axis module 42 is fixed to the first X-axis module 41, the first lifting mechanism 43 is fixed to the first Y-axis module 42, the upper marking mechanism 44 is fixed to the first lifting mechanism 43, and the upper detection mechanism 45 is fixed to the upper marking mechanism 44. Both the upper marking mechanism 44 and the upper detection mechanism 45 are located above the feeding mechanism 5. The dust collection mechanism is fixed to the upper marking mechanism 44. The first X-axis module 41 and the first Y-axis module 42 are both motor and lead screw transmission pairs, including a motor, lead screw, nut, slide rail, and slider, all of which are existing technologies and will not be described in detail here.

[0055] The lower marking device 6 includes a second X-axis module 61, a second Y-axis module 62, a lower marking mechanism 63, and a lower detection mechanism 64. The second X-axis module 61 is fixed to the frame 1, the second Y-axis module 62 is fixed to the second X-axis module 61, the lower marking mechanism 63 is fixed to the second Y-axis module 62, and the lower detection mechanism 64 is fixed to the lower marking mechanism 63. Both the lower marking mechanism 63 and the lower detection mechanism 64 are located below the feeding mechanism 5. The second X-axis module 61 and the second Y-axis module 62 are both motor and lead screw drive structures, including a motor, lead screw, nut, slide rail, and slider, all of which are existing technologies and will not be described in detail here.

[0056] While the upper marking device 4 detects and marks the circuit board 7 through the upper detection mechanism 45 and the upper marking mechanism 44, the lower marking device 6 detects and marks the circuit board 7 through the lower marking mechanism 63 and the lower detection mechanism 64.

[0057] The double-sided laser engraving machine provided in this application has an upper marking device 4 and a lower marking device 6 that respectively detect and mark the upper and lower surfaces of the circuit board 7. The upper marking device 4 and the lower marking device 6 perform detection and marking simultaneously, which improves the marking efficiency. The upper marking device 4 and the lower marking device 6 can mark both sides of the circuit board 7 at one time. Furthermore, the circuit board 7 can be moved by the feeding mechanism 5 and fed to the material port 11. After the circuit board 7 is marked, it is convenient to discharge it.

[0058] In another embodiment of the present invention, the first lifting mechanism 43 includes a lifting fixed seat 431, a lifting slide rail 432, a lifting slider 433, a lifting cylinder 434, and a lifting slide block 435. The lifting fixed seat 431 is fixed to the first Y-axis module 42, the lifting slide rail 432 is fixed to the lifting fixed seat 431, the lifting slider 433 is slidably connected to the lifting slide rail 432, one end of the lifting cylinder 434 is fixed to the lifting fixed seat 431, and the other end is fixed to the lifting slide block 435. The lifting slide block 435 is fixed to the lifting slider 433 and the upper marking mechanism 44 respectively.

[0059] In another embodiment of the present invention, the upper marking mechanism 44 includes an upper laser 441, an upper laser head 442, an upper cooling fan 443, and an upper infrared sensor 444. The upper laser 441 is fixed to the lifting slide 435, the upper laser head 442 is fixed to the upper laser 441 and is disposed above the feeding mechanism 5. The upper laser head 442 marks the upper surface of the circuit board 7 through the upper laser 441. The upper cooling fan 443 is fixed to the side of the upper laser 441, and the upper infrared sensor 444 is fixed to the side of the upper laser 441.

[0060] The working process of the upper marking mechanism 44 is as follows: the controller 3 controls the first lifting mechanism 43 to drive the upper laser head 442 to move up and down to complete the focusing; after the upper infrared sensor 444 detects that the circuit board 7 is in place, it triggers the marking signal; the upper laser 441 starts and drives the upper laser head 442 to perform laser marking on the upper surface of the circuit board 7; at the same time as marking, the dust collection mechanism works synchronously to collect micro debris through air curtain, electrostatic electrode and negative pressure.

[0061] In another embodiment of the present invention, the upper detection mechanism 45 includes an upper detection seat 451 and an upper detection camera 452. The upper detection seat 451 is fixed to the upper laser 441, and the upper detection camera 452 is fixed to the upper detection seat 451. The upper detection camera 452 detects the upper surface of the circuit board 7. A feed port 11 is provided on the side of the housing 2, which is located on one side of the feeding rack 522. The circuit board 7 is fed or discharged through the feed port 11. The upper detection camera 452 is used to detect whether the circuit board 7 is a qualified product. Only qualified products will be marked. If the product is detected as defective, the controller 3 will issue an alarm and remove the defective circuit board 7.

[0062] In another embodiment of the present invention, the vacuuming mechanism includes a positive pressure component 46, a nozzle assembly 47, a negative pressure component 48, and an electrode assembly 49. The positive pressure component 46 is fixed to the upper laser 441, the nozzle assembly 47 is fixed to the upper laser head 442, and is connected to the positive pressure component 46 and the negative pressure component 48 respectively. The electrode assembly 49 is fixed to the upper laser 441 and the nozzle assembly 47 respectively. The positive pressure component 46 includes a positive pressure air pump 461, a positive pressure air pipe 462, and a positive pressure connector 463. The positive pressure air pump 461 is fixed to the upper laser 441. One end of the positive pressure air pipe 462 is connected to the positive pressure air pump 461, and the other end is connected to the positive pressure connector 463. The positive pressure connector 463 is fixed to the nozzle assembly 47. The nozzle assembly 47 includes nozzles. The nozzle body 471 comprises a nozzle cover 472, a flow guide tube 473, and a flow stabilizer tube 474. The nozzle body 471 is fixed to the upper laser head 442, the nozzle cover 472 is fixed to the top side of the nozzle body 471, the flow guide tube 473 is fixed inside the nozzle body 471, the positive pressure connector 463 is fixed to the nozzle cover 472, and the flow stabilizer tube 474 is fixed to the bottom of the nozzle body 471. The nozzle body 471 is provided with a laser channel 4711, a slit outlet 4712, and a negative pressure channel 4713. The laser channel 4711 is located at the center of the nozzle body 471. Multiple slit outlets 4712 are provided and are evenly arranged in a ring around the nozzle body 471. Multiple negative pressure channels 4713 are provided and are evenly arranged around the nozzle body 471.

[0063] In another embodiment of the present invention, the negative pressure assembly 48 includes a negative pressure air pipe 481, a negative pressure connector 482, and a negative pressure air pump 483. The number of negative pressure air pipes 481 and negative pressure connectors 482 is the same as that of negative pressure channels 4713. One end of the negative pressure air pipe 481 is connected to the negative pressure channel 4713, and the other end passes through the nozzle cover 472 and is connected to the negative pressure air pump 483. The negative pressure connector 482 is fixed to the nozzle cover 472, and the negative pressure air pump 483 is fixed to the upper laser 441. The electrode assembly 49 includes an electrostatic adsorption electrode 491, a low-voltage DC electrostatic generator 492, and an insulated wire 493. The low-voltage DC electrostatic generator 492 is fixed to the upper laser 441 and is connected to the low-voltage DC electrostatic generator 493 through the insulated wire 493. The generator 492 is electrically connected. One end of the insulated wire 493 is electrically connected to the electrostatic adsorption electrode 491, and the other end passes through the nozzle body 471 and the nozzle cover 472 to be electrically connected to the low-voltage DC electrostatic generator 492. One end of the electrostatic adsorption electrode 491 is fixed in a ring shape inside the flow stabilizer 474 and is located in the insulating interlayer between the flow stabilizer 474 and the flow guide 473. The electrostatic adsorption electrode 491 is set above the slit outlet 4712 and outside the laser channel 4711. The lower surface of the electrostatic adsorption electrode 491 is flush with or recessed from the bottom surface of the flow stabilizer 474. The electric field direction of the electrostatic adsorption electrode 491 is perpendicular to the center area of ​​the laser marking. A ceramic insulating layer is fixed on the outside of the electrostatic adsorption electrode 491.

[0064] This dust collection mechanism adopts a three-stage synergistic dust removal structure of air curtain sealing + electrostatic activation + negative pressure collection, integrated into the upper laser head 442 position of the upper marking mechanism 44. It achieves diffusion-free, residue-free, and damage-free collection of micron-level debris and dust generated during the laser marking process of the circuit board 7. Its working process and principle are as follows:

[0065] I. Detailed Working Process of the Vacuum Cleaning Mechanism

[0066] The dust collection mechanism starts and stops completely synchronously with the laser marking action, and the entire process is automatically controlled by controller 3, divided into 5 continuous stages:

[0067] 1. System pre-start (before labeling)

[0068] Controller 3 sends a marking preparation signal:

[0069] When the positive pressure pump 461 of the positive pressure assembly 46 is started, it outputs clean and dry compressed air, which enters the nozzle assembly 47 through the positive pressure air pipe 462 and the positive pressure connector 463.

[0070] The negative pressure air pump 483 of the negative pressure component 48 starts synchronously, forming a stable low-pressure negative pressure field in the negative pressure channel 4713 of the nozzle component 47;

[0071] The low-voltage DC electrostatic generator 492 of the electrode assembly 49 is powered on and preheated, ready to output micro-current high-voltage DC.

[0072] 2. Formation of annular air curtain

[0073] After compressed air enters the nozzle body 471:

[0074] The multi-stage pressure-stabilizing chamber, composed of the flow guide tube 473 and the flow stabilizer tube 474, equalizes and stabilizes the flow, eliminating airflow turbulence.

[0075] The air is ejected from the uniformly distributed annular slit outlets 4712 at the bottom of the nozzle body 471, and the airflow is inclined towards the central axis of the laser to form a continuous, uninterrupted, conical sealed air curtain.

[0076] The air curtain completely and physically envelops the laser marking area, preventing debris from spreading to the PCB board, components, and the surrounding environment.

[0077] 3. Electrostatic adsorption

[0078] The electrostatic generator supplies power to the annular electrostatic adsorption electrode 491 via the insulated wire 493:

[0079] The electrodes form a stable electric field perpendicularly pointing to the center of the laser marking within the enclosed area of ​​the air curtain.

[0080] When the micro-debris and dust generated by laser ablation pass through the electric field, they are forcibly charged, eliminating the electrostatic adhesion between the debris and the circuit board 7.

[0081] Micro-debris detaches from the PCB surface and component pins, suspends and fluidizes, and becomes easily carried by airflow.

[0082] 4. Negative pressure directional collection and dust removal

[0083] The negative pressure air pump 483 creates continuous suction at the negative pressure channel 4713 of the nozzle:

[0084] Dust-laden airflow and suspended micro-debris within the air curtain enclosed area are directionally drawn into the negative pressure channel 4713;

[0085] Dust-laden airflow is delivered to the filter unit at the rear end of the negative pressure air pump 483 via the negative pressure air pipe 481. Micro-debris is intercepted and collected by the filter element, and clean air is discharged. The filter unit, such as a filter, is installed at the rear end of the negative pressure air pump 483. This is prior art in the field and will not be described in detail.

[0086] The entire suction mechanism uses low-pressure, high-flow airflow, which will not blow away micro-surface components or disturb the circuit board.

[0087] 5. Synchronous Stop and Reset

[0088] After marking is completed, controller 3 shuts down synchronously.

[0089] Positive pressure air pump 461 stops supplying air, and the air curtain disappears;

[0090] When the electrostatic generator is powered off, the electric field is eliminated.

[0091] The negative pressure air pump 483 shuts off after a 1-second delay, stopping once all remaining debris has been completely removed.

[0092] II. Working Principle of the Vacuum Cleaning Mechanism

[0093] 1. Circular air curtain sealing principle (physical isolation)

[0094] Structural principle: The air outlet adopts a coaxial annular slit, combined with an inwardly inclined guide structure, to form a cone-shaped air curtain that converges from top to bottom, creating a locally sealed space between the laser head and the PCB;

[0095] Function: To confine debris to a very small area, preventing it from spreading to other areas of the PCB, optical systems, and the workshop environment, thus creating a closed environment for subsequent collection.

[0096] 2. Electrostatic adsorption activation principle (breaking adhesion)

[0097] Electrical principle: Using a micro-current, low-voltage DC, high-voltage electric field, insulating PCB debris and resin dust are induced to become charged, neutralizing the static electricity of the debris and destroying its adhesion to the board surface.

[0098] The electrodes are placed in the insulating interlayer inside the air curtain. The electric field is confined within the closed area by the air curtain, preventing it from spreading outward, damaging the PCB circuit, or generating discharge arcing.

[0099] Function: It transforms "adhesive" micro-debris into a suspended and flowable state, solving the core problem that simple airflow cannot remove electrostatically adhering micro-dust.

[0100] 3. Negative pressure directional collection principle (powered dust removal)

[0101] Fluid principle: Multiple uniform negative pressure channels 4713 are set at the bottom of the air curtain closed area to form a directional airflow loop from top to bottom;

[0102] Power matching: A low-pressure, high-flow negative pressure pump is used to only suck up dusty gas and does not generate strong vacuum suction, thus avoiding damage to PCBs or blowing away components.

[0103] Function: To completely remove debris encased in an air curtain and activated by electrostatics in one go, achieving residue-free collection.

[0104] 4. General Principle of Three-Level Collaboration

[0105] The air curtain is responsible for "closing" the debris → the electrodes are responsible for "releasing" the debris → the negative pressure is responsible for "removing" the debris.

[0106] The three elements form a closed loop:

[0107] The air curtain provides a closed environment for the electrostatic field, the electrostatic field reduces the difficulty of negative pressure collection, and the negative pressure provides an airflow outlet for the air curtain. Together, they improve the collection rate of micro-debris from laser marking on the circuit board, resulting in no residue, no diffusion, and no component damage.

[0108] In another embodiment of the present invention, the lower marking mechanism 63 includes a lower fixing base 631, a lower laser 632, a lower laser head 633, a lower cooling fan 634, and a lower infrared sensor 635. The lower fixing base 631 is fixed to the second Y-axis module 62, the lower laser 632 is fixed to the lower fixing base 631, the lower laser head 633 is fixed to the lower laser 632 and is disposed below the feeding mechanism 5. The lower laser head 633 marks the lower surface of the circuit board 7 through the lower laser 632. The lower cooling fan 634 is fixed to the side of the lower laser 632, and the lower infrared sensor 635 is fixed to the side of the lower laser 632.

[0109] In another embodiment of the present invention, the lower detection mechanism 64 includes a lower detection seat 641 and a lower detection camera 642. The lower detection seat 641 is fixed to the lower laser 632, and the lower detection camera 642 is fixed to the lower detection seat 641. The lower detection camera 642 detects the lower surface of the circuit board 7.

[0110] The working process of the lower marking mechanism 63 is as follows: the controller 3 controls the second X-axis module 61 and the second Y-axis module 62 to move the lower laser head 633 to complete the focusing; after the lower infrared sensor 635 detects that the circuit board 7 is in place, it triggers the marking signal; the lower laser 632 starts and drives the lower laser head 633 to perform laser marking on the lower surface of the circuit board 7.

[0111] In another embodiment of the present invention, the lower detection mechanism 64 includes a lower detection seat 641 and a lower detection camera 642. The lower detection seat 641 is fixed to the lower laser 632, and the lower detection camera 642 is fixed to the lower detection seat 641. The lower detection camera 642 detects the lower surface of the circuit board 7. A feed port 11 is provided on the side of the housing 2, located on one side of the feeding rack 522. The circuit board 7 is fed or discharged through the feed port 11. The lower detection camera 642 is used to detect whether the circuit board 7 is a qualified product. Only qualified products will be marked. If the product is detected as defective, an alarm will be issued through the controller 3, and the defective circuit board 7 will be removed.

[0112] In another embodiment of the present invention, the feeding mechanism 5 includes an adjustment component 51 and a feeding component 52. The adjustment component 51 is fixed to the frame 1, and the feeding component 52 is fixed to the adjustment component 51. The adjustment component 51 includes an adjustment frame 511, an adjustment motor 512, an adjustment drive pulley 513, an adjustment driven pulley 514, an adjustment screw 515, an adjustment belt 516, an adjustment slide rail 517, and an adjustment slider 518. The adjustment frame 511 is fixed to the frame 1, the adjustment motor 512 is fixed to the adjustment frame 511, the adjustment drive pulley 513 is fixed to the adjustment motor 512, the adjustment driven pulley 514 is rotatably connected to the adjustment frame 511, the adjustment screw 515 is fixed to the adjustment driven pulley 514, and is rotatably connected to the adjustment frame 511. The adjustment belt 516 is fixedly wound around the adjustment drive pulley 513 and the adjustment driven pulley 514, respectively. The adjustment slide rail 517 is fixed to the frame 1, and the adjustment slider 518 is slidably connected to the adjustment slide rail 517.

[0113] The working process of the adjustment component 51 is as follows: the controller 3 drives the adjustment motor 512 to rotate, and drives the adjustment driven pulley 514 and the adjustment screw 515 to rotate through the adjustment drive pulley 513 and the adjustment belt 516; the adjustment screw 515 drives the feeding component 52 to move along the adjustment slide rail 517, and automatically adjusts the distance between the two sets of feeding components 52 to adapt to circuit boards 7 of different widths.

[0114] In another embodiment of the present invention, two feeding components 52 are provided and symmetrically arranged, one of which is fixed to the adjusting slider 518. The feeding component 52 includes a feeding nut seat 521, a feeding frame 522, a feeding motor 523, a driving pulley 524, a driven pulley 525, a feeding belt 526, and a feeding infrared sensor 527. The feeding nut seat 521 is fixed to the adjusting slider 518 and the feeding frame 522 respectively, and is threadedly connected to the adjusting screw 515. The feeding motor 523 is fixed to the feeding frame 522, the driving pulley 524 is fixed to the feeding motor 523, multiple driven pulleys 525 are provided and are all rotatably connected to the feeding frame 522, the feeding belt 526 is fixedly wound around the driving pulley 524 and the driven pulley 525 respectively, and multiple feeding infrared sensors 527 are provided and are all fixed to the feeding frame 522.

[0115] The feeding component 52 works as follows: After adjusting the distance between the two sets of feeding components 52, the feeding motor 523 drives the active pulley 524 and the driven pulley 525 to drive the feeding belt 526 to rotate, thereby conveying the circuit board 7; the feeding infrared sensor 527 detects the position of the circuit board 7 in real time and feeds the signal back to the controller 3 to complete automatic feeding, precise positioning, marking and discharge.

[0116] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A double-sided laser engraving machine, characterized in that, The device includes a frame, a chassis, a controller, an upper marking device, a feeding mechanism, and a lower marking device. The chassis is fixed to the outside of the frame. The upper marking device, the feeding mechanism, and the lower marking device are sequentially fixed to the frame. The feeding mechanism is disposed between the upper marking device and the lower marking device. The upper marking device, the feeding mechanism, and the lower marking device are all electrically connected to the controller. The upper marking device and the lower marking device simultaneously mark the circuit board on the feeding mechanism. The upper marking device includes a first X-axis module, a first Y-axis module, a first lifting mechanism, an upper marking mechanism, an upper detection mechanism, and a dust collection mechanism; The lower marking device includes a second X-axis module, a second Y-axis module, a lower marking mechanism, and a lower detection mechanism; While the upper marking device detects and marks the circuit board through the upper detection mechanism and the upper marking mechanism, the lower marking device detects and marks the circuit board through the lower marking mechanism and the lower detection mechanism.

2. The double-sided laser engraving machine according to claim 1, characterized in that, The first X-axis module is fixed to the frame, the first Y-axis module is fixed to the first X-axis module, the first lifting mechanism is fixed to the first Y-axis module, the upper marking mechanism is fixed to the first lifting mechanism, the upper detection mechanism is fixed to the upper marking mechanism, the upper marking mechanism and the upper detection mechanism are both located above the feeding mechanism, and the dust collection mechanism is fixed to the upper marking mechanism; the first lifting mechanism includes a lifting fixed base, a lifting slide rail, a lifting slider, a lifting cylinder, and a lifting slide block, the lifting fixed base is fixed to the first Y-axis module, the lifting slide rail is fixed to the lifting fixed base, the lifting slider is slidably connected to the lifting slide rail, one end of the lifting cylinder is fixed to the lifting fixed base, and the other end is fixed to the lifting slide block, and the lifting slide block is respectively fixed to the lifting slider and the upper marking mechanism.

3. A double-sided laser engraving machine according to claim 2, characterized in that, The upper marking mechanism includes an upper laser, an upper laser head, an upper cooling fan, and an upper infrared sensor. The upper laser is fixed to the lifting slide, and the upper laser head is fixed to the upper laser and positioned above the feeding mechanism. The upper laser head marks the upper surface of the circuit board through the upper laser. The upper cooling fan is fixed to the side of the upper laser, and the upper infrared sensor is fixed to the side of the upper laser.

4. A double-sided laser engraving machine according to claim 3, characterized in that, The upper detection mechanism includes an upper detection seat and an upper detection camera. The upper detection seat is fixed to the upper laser, and the upper detection camera is fixed to the upper detection seat. The upper detection camera detects the upper surface of the circuit board. A material port is provided on the side of the chassis. The material port is located on one side of the feeding frame, and the circuit board is fed or discharged through the material port.

5. A double-sided laser engraving machine according to claim 3, characterized in that, The dust collection mechanism includes a positive pressure component, a nozzle assembly, a negative pressure component, and an electrode assembly. The positive pressure component is fixed to the upper laser, and the nozzle assembly is fixed to the upper laser head and connected to the positive pressure component and the negative pressure component respectively. The electrode assembly is fixed to the nozzle assembly of the upper laser. The positive pressure component includes a positive pressure air pump, a positive pressure air pipe, and a positive pressure connector. The positive pressure air pump is fixed to the upper laser, one end of the positive pressure air pipe is connected to the positive pressure air pump, and the other end is connected to the positive pressure connector. The positive pressure connector is fixed to the nozzle assembly. The nozzle assembly includes a spray nozzle... The nozzle body comprises a nozzle body, a nozzle cap, a flow guide tube, and a flow stabilizer tube. The nozzle body is fixed to the upper laser head, the nozzle cap is fixed to the top side of the nozzle body, the flow guide tube is fixed inside the nozzle body, the positive pressure connector is fixed to the nozzle cap, and the flow stabilizer tube is fixed to the bottom of the nozzle body. The nozzle body is provided with a laser channel, a slit outlet, and a negative pressure channel. The laser channel is located at the center of the nozzle body. Multiple slit outlets are provided and are evenly arranged in a ring around the nozzle body. Multiple negative pressure channels are provided and are evenly arranged around the nozzle body.

6. A double-sided laser engraving machine according to claim 5, characterized in that, The negative pressure assembly includes a negative pressure air pipe, a negative pressure connector, and a negative pressure air pump. The number of negative pressure air pipes and connectors is the same as the number of negative pressure channels. One end of the negative pressure air pipe is connected to the negative pressure channel, and the other end passes through the nozzle cover and is connected to the negative pressure air pump. The negative pressure connector is fixed to the nozzle cover, and the negative pressure air pump is fixed to the upper laser. The electrode assembly includes an electrostatic adsorption electrode, a low-voltage DC electrostatic generator, and an insulated wire. The low-voltage DC electrostatic generator is fixed to the upper laser and is electrically connected to the low-voltage DC electrostatic generator through the insulated wire. One end of the insulated wire is electrically connected to the electrostatic adsorption electrode, and the other end passes through the nozzle body and the nozzle cover, and is electrically connected to the low-voltage DC electrostatic generator. One end of the electrostatic adsorption electrode is fixed in a ring shape inside the flow stabilizing cylinder and located in the insulating interlayer between the flow stabilizing cylinder and the flow guiding cylinder. The electrostatic adsorption electrode is disposed above the slit outlet and outside the laser channel. The lower surface of the electrostatic adsorption electrode is flush with or recessed from the bottom surface of the flow stabilizing cylinder. The electric field direction of the electrostatic adsorption electrode is perpendicular to the center area of ​​the laser marking. A ceramic insulating layer is fixed on the outside of the electrostatic adsorption electrode.

7. A double-sided laser engraving machine according to claim 1, characterized in that, The second X-axis module is fixed to the frame, the second Y-axis module is fixed to the second X-axis module, the lower marking mechanism is fixed to the second Y-axis module, and the lower detection mechanism is fixed to the lower marking mechanism. Both the lower marking mechanism and the lower detection mechanism are located below the feeding mechanism. The lower marking mechanism includes a lower fixed base, a lower laser, a lower laser head, a lower cooling fan, and a lower infrared sensor. The lower fixed base is fixed to the second Y-axis module, the lower laser is fixed to the lower fixed base, and the lower laser head is fixed to the lower laser and located below the feeding mechanism. The lower laser head marks the lower surface of the circuit board through the lower laser. The lower cooling fan is fixed to the side of the lower laser, and the lower infrared sensor is fixed to the side of the lower laser.

8. A double-sided laser engraving machine according to claim 7, characterized in that, The lower detection mechanism includes a lower detection seat and a lower detection camera. The lower detection seat is fixed to the lower laser, and the lower detection camera is fixed to the lower detection seat. The lower detection camera detects the lower surface of the circuit board.

9. A double-sided laser engraving machine according to claim 1, characterized in that, The feeding mechanism includes an adjustment component and a feeding component. The adjustment component is fixed to the frame, and the feeding component is fixed to the adjustment component. The adjustment component includes an adjustment frame, an adjustment motor, an adjustment drive pulley, an adjustment driven pulley, an adjustment screw, an adjustment belt, an adjustment slide rail, and an adjustment slider. The adjustment frame is fixed to the frame, the adjustment motor is fixed to the adjustment frame, the adjustment drive pulley is fixed to the adjustment motor, the adjustment driven pulley is rotatably connected to the adjustment frame, and the adjustment screw is fixed to the adjustment driven pulley and rotatably connected to the adjustment frame. The adjustment belt is fixedly wound around the adjustment drive pulley and the adjustment driven pulley, respectively. The adjustment slide rail is fixed to the frame, and the adjustment slider is slidably connected to the adjustment slide rail.

10. A double-sided laser engraving machine according to claim 9, characterized in that, Two feeding assemblies are provided and symmetrically arranged, one of which is fixed to the adjusting slider. Each feeding assembly includes a feeding nut seat, a feeding frame, a feeding motor, a driving pulley, a driven pulley, a feeding belt, and a feeding infrared sensor. The feeding nut seat is fixed to the adjusting slider and the feeding frame, and threadedly connected to the adjusting screw. The feeding motor is fixed to the feeding frame, the driving pulley is fixed to the feeding motor, multiple driven pulleys are provided and rotatably connected to the feeding frame, the feeding belt is fixedly wound around the driving pulley and the driven pulley, and multiple feeding infrared sensors are provided and fixed to the feeding frame.

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