A connector local gold plating control method, device and system

Abstract

The application discloses a kind of connector local gold plating control method, equipment and system, it is related to electroplating technical field.The method comprises the following steps: in response to the gold plating operation of the first connector of target connector type, the plating thickness value of the multiple detection points in the gold plating area of the first connector, the concave area of gold plating area and the first electroplating unevenness of gold plating area are obtained;Determine the first form complexity of gold plating area based on the plating thickness value of the multiple detection points in the gold plating area of the first connector and the concave area of gold plating area;Determine the necessity of hieroglyphic plate based on the first electroplating unevenness of gold plating area and the first form complexity of gold plating area;The necessity of hieroglyphic plate is the necessity of using hieroglyphic plate when the gold plating operation of the connector of target connector type is executed;In response to hieroglyphic plate necessity degree greater than preset necessary degree threshold value, the gold plating operation of the connector of target connector type is executed by hieroglyphic plate.The present application can improve the accuracy of gold plating control.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and specifically to a method, device, and system for controlling local gold plating on connectors. Background Technology

[0002] In connector manufacturing, localized gold plating is crucial for improving connector performance. The quality of the gold plating layer, such as uniformity and thickness consistency, directly affects the connector's contact reliability, abrasion resistance, and corrosion resistance. To achieve high-quality gold plating, the plating process needs to be precisely controlled to accommodate the different morphological characteristics of the gold-plated areas on the connector.

[0003] Currently, traditional methods for controlling localized gold plating in connectors employ a fixed plating pattern. However, this lacks dynamism and makes it difficult to flexibly adjust the plating pattern based on the actual conditions of the gold-plated area, resulting in poor precision in gold plating control. Summary of the Invention

[0004] This invention provides a method, device, and system for controlling local gold plating of connectors, which can improve the accuracy of gold plating control.

[0005] A first aspect of the present invention provides a method for controlling local gold plating on a connector, comprising:

[0006] In response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area are obtained; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness.

[0007] Based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area, the first morphological complexity of the gold-plated area is determined.

[0008] The necessity of the pictogram plate is determined based on the first electroplating unevenness and the first morphological complexity of the gold-plated area; the necessity of the pictogram plate is the necessity of using the pictogram plate when performing gold plating operation on a connector of the target connector type.

[0009] In response to the pictogram necessity exceeding a preset necessity threshold, gold plating is performed on the connector of the target connector type using the pictogram.

[0010] Furthermore, the present invention also proposes determining the first morphological complexity of the gold-plated region based on the plating thickness values ​​of multiple detection points in the gold-plated region of the first connector and the concave region of the gold-plated region, including:

[0011] Multiple detection points in the gold-plated area of ​​the first connector are clustered to obtain at least one gold-plated cluster;

[0012] Based on the detection points in each gold-plated cluster, the distribution dispersion of each gold-plated cluster is determined; the distribution dispersion is the average of the minimum distances between each detection point and other detection points in the gold-plated cluster.

[0013] Obtain the maximum number of clusters in the gold-plated area of ​​the target historical connector, the maximum depth ratio of the concave area in the gold-plated area of ​​the target historical connector, the current number of clusters in the gold-plated area of ​​the first connector, and the minimum depth ratio and number of concave areas in the gold-plated area of ​​the first connector; the target historical connector is a historical connector of the target connector type.

[0014] The first morphological complexity of the gold-plated region is determined based on the dispersion difference between the maximum and minimum dispersion of the distribution dispersion of each gold-plated cluster, the difference in the number of clusters between the maximum and current number of clusters, the difference in the depth ratio between the maximum and minimum depth ratio, and the number of concave regions.

[0015] Furthermore, the present invention also proposes determining the necessity of the pictographic plate based on the first electroplating unevenness and the first morphological complexity of the gold-plated area, including:

[0016] Divide the first morphological complexity of the gold-plated area by the maximum morphological complexity of the target historical connector to obtain the first morphological complexity ratio; the target historical connector is a historical connector of the target connector type.

[0017] The product of the first morphological complexity ratio and the first electroplating unevenness is normalized to obtain the pictographic plate necessity degree.

[0018] Furthermore, the present invention also proposes that, in response to the pictogram necessity degree being greater than a preset necessity degree threshold, after performing a gold plating operation on a connector of the target connector type using the pictogram, the method further includes:

[0019] Obtain the second electroplating non-uniformity of the gold-plated area of ​​the second connector; the second connector is a connector of the target connector type for which the gold plating operation is performed by a pictogram plate.

[0020] In response to the second plating unevenness being greater than the first preset plating unevenness threshold, the original processing control parameters of the connector of the target connector type are adjusted based on the second plating unevenness to obtain the corrected processing control parameters.

[0021] Furthermore, the present invention also proposes that the original processing control parameters include the original average current density, and the corrected processing control parameters include the corrected average current density.

[0022] Based on the second electroplating unevenness, the original processing control parameters of the connector of the target connector type are adjusted to obtain the corrected processing control parameters, including:

[0023] The ratio of the second plating unevenness to the target historical plating unevenness is determined as the first correction coefficient; the target historical plating unevenness is the maximum value among the historical plating unevennesses of the target historical connector, and the target historical connector is a historical connector of the target connector type.

[0024] The product of the first correction factor and the standard current correction value is determined as the final current correction value;

[0025] Based on the final current correction value, the original average current density is adjusted to obtain the corrected average current density.

[0026] Furthermore, the present invention also proposes that the original processing control parameters include the original stirring intensity, and the modified processing control parameters include the modified stirring intensity;

[0027] Based on the second electroplating unevenness, the original processing control parameters of the connector of the target connector type are adjusted to obtain the corrected processing control parameters, which also include:

[0028] The second morphological complexity ratio is obtained by dividing the second morphological complexity of the gold-plated area of ​​the second connector by the maximum morphological complexity of the target historical connector; the target historical connector is a historical connector of the target connector type.

[0029] The second correction coefficient is determined based on the second morphological complexity ratio, the current density difference between the maximum average current density of the target historical connector and the corrected average current density;

[0030] The product of the second correction factor and the standard stirring intensity correction value is determined as the final stirring intensity correction value;

[0031] Based on the final stirring intensity correction value, the original stirring intensity is adjusted to obtain the corrected stirring intensity.

[0032] Furthermore, the present invention also proposes that, in response to a second plating unevenness exceeding a first preset plating unevenness threshold, after adjusting the original processing control parameters of the connector of the target connector type based on the second plating unevenness to obtain corrected processing control parameters, the invention further includes:

[0033] Obtain the third electroplating non-uniformity of the gold-plated area of ​​the third connector; the third connector is a connector of the target connector type for which the gold plating operation is performed based on the modified processing control parameters;

[0034] In response to the third plating unevenness being greater than the second preset plating unevenness threshold, the original pulse off duration of the connector of the target connector type is adjusted to obtain the corrected pulse off duration until the preset correction condition is met.

[0035] Furthermore, the present invention also proposes adjusting the original pulse-off duration of a connector of the target connector type to obtain a corrected pulse-off duration, including:

[0036] Obtain the fourth plating unevenness of the gold-plated area of ​​the third connector before the s-th adjustment of the pulse off duration, and the fifth plating unevenness of the gold-plated area of ​​the third connector after the s-th adjustment of the pulse off duration; s is a positive integer.

[0037] The third correction coefficient is determined based on the fourth electroplating unevenness, the fifth electroplating unevenness, and the duration adjustment of the s-th adjustment pulse.

[0038] The product of the third correction factor and the standard pulse off duration correction value is determined as the final pulse off duration correction value;

[0039] Based on the final pulse off duration correction value, the pulse off duration after the s-th adjustment of the pulse off duration is adjusted to obtain the pulse off duration after the (s+1)-th adjustment of the pulse off duration.

[0040] A second aspect of the present invention provides a connector local gold plating control system, comprising:

[0041] The parameter acquisition module is used to acquire, in response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness.

[0042] The morphological evaluation module is used to determine the first morphological complexity of the gold-plated area based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area.

[0043] The necessity determination module is used to determine the necessity of the pictogram plate based on the first electroplating unevenness and the first morphological complexity of the gold-plated area; the necessity of the pictogram plate is the necessity of using the pictogram plate when performing gold plating operation on a connector of the target connector type.

[0044] The gold plating control module is used to perform gold plating operations on connectors of the target connector type via the pictogram when the pictogram necessity exceeds a preset necessity threshold.

[0045] A third aspect of the present invention provides a connector local gold plating control device, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement any of the above-described connector local gold plating control methods.

[0046] The present invention has the following beneficial effects:

[0047] In the connector local gold plating control method provided by this invention, firstly, the plating thickness values, concave areas, and first electroplating unevenness of multiple detection points in the gold plating area of ​​the first connector are acquired, enabling a comprehensive understanding of the current plating thickness distribution and overall unevenness of the gold plating area. Next, based on this information, a first morphological complexity is determined, allowing for precise control of the morphological characteristics of the gold plating area. Then, the necessity of the shaped plate is determined based on the first electroplating unevenness and the first morphological complexity, enabling a scientific assessment of the necessity of using the shaped plate. When the necessity of the shaped plate exceeds a preset threshold, the gold plating operation is performed using the shaped plate. Because the shaped plate better conforms to the shape of the gold plating area, the gold plating process can be dynamically adjusted according to the actual situation, thereby more precisely controlling the gold plating parameters. This effectively compensates for the inflexibility of traditional fixed modes, significantly improving the accuracy of gold plating control and meeting the requirements for high-quality gold plating effects. Attached Figure Description

[0048] To more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic flowchart of a first connector local gold plating control method provided in an embodiment of the present invention;

[0050] Figure 2 This is a schematic flowchart of a second connector local gold plating control method provided in an embodiment of the present invention;

[0051] Figure 3 This is a flowchart illustrating a third method for controlling local gold plating of a connector according to an embodiment of the present invention.

[0052] Figure 4 This is a schematic diagram of a connector partial gold plating control system provided in one embodiment of the present invention;

[0053] Figure 5 This is a schematic diagram of a connector local gold plating control device provided in one embodiment of the present invention. Detailed Implementation

[0054] To further illustrate the technical means and effects adopted by the present invention to achieve its intended purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation, structure, features, and effects of a connector partial gold plating control method, device, and system proposed according to the present invention. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0056] In traditional localized gold plating processes for connectors, the uniformity and thickness consistency of the gold plating layer have a decisive impact on the connector's contact reliability, wear resistance, and corrosion resistance. However, existing technologies use a fixed gold plating mode for control. This mode cannot dynamically adjust the gold plating parameters according to the actual morphological characteristics of the gold plating area, resulting in a mismatch between the plating thickness distribution and the area's geometry. The non-uniformity of the plating thickness is directly attributed to the dynamic changes in the complexity of the gold plating area's morphology. Traditional methods rely solely on preset parameters to perform the gold plating operation, failing to perceive the distribution of plating thickness values ​​at detection points and the physical characteristics of concave areas in real time. Consequently, the gold plating control process lacks a quantitative evaluation mechanism for plating thickness deviations, making it impossible to effectively correct the dispersion between the average plating thickness and the actual values ​​at each detection point. This ultimately leads to a significant reduction in the accuracy of gold plating control, thereby affecting the electrical performance stability of the connector during service.

[0057] In this regard, such as Figure 1 As shown, the present invention provides a flowchart of a method for controlling local gold plating of a connector. This method can be applied to electronic devices and may include the following steps S100 to S400:

[0058] S100, in response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area are obtained; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness.

[0059] In this step, the target connector type refers to a type of connector with common characteristics such as specific specifications, design, and application. Subsequently, a series of gold-plating related operations and judgments are performed on this type of connector, such as a specific model of connector used for signal transmission in electronic devices. The first connector refers to any one of the target connector types, which is used as a representative to obtain relevant data to reflect the gold-plating characteristics of the target connector type.

[0060] Gold plating refers to the process of plating gold onto the surface of a connector. The purpose is to form a gold plating layer on the connector surface to improve its conductivity, corrosion resistance, and other properties. The gold plating area refers to the specific part or area on the connector that needs to be gold-plated, which may be the connector's pins, sockets, or other critical contact parts. The plating thickness value refers to the specific value of the thickness of the gold plating layer measured at each test point, usually in micrometers (μm).

[0061] A concave region refers to an area within the gold-plated region that is recessed inwards. This concave structure may affect the quality of the gold plating, such as causing uneven plating thickness. The first plating non-uniformity is an index used to measure the uniformity of plating thickness within the gold-plated region of the first connector. It is calculated by summing the absolute values ​​of the differences between the plating thickness values ​​at each detection point within the gold-plated region of the first connector and the average plating thickness. For example, it can be determined by arithmetic calculations after obtaining thickness data from multiple detection points using a plating thickness gauge, or by statistical analysis based on a plating thickness distribution histogram. It is mainly used to objectively characterize the dispersion of plating thickness.

[0062] Specifically, a first connector is randomly selected from the target connector types, and a gold plating operation is performed on it. After the gold plating operation is completed, multiple detection points are selected in the gold-plated area of ​​the first connector, and the plating thickness value of each detection point is measured and recorded using a suitable measuring tool (such as a plating thickness gauge). At the same time, the gold-plated area is observed to identify any concave areas. Based on the recorded plating thickness values ​​of each detection point, the average plating thickness of these values ​​is calculated. Then, the absolute value of the difference between the plating thickness value of each detection point and the average plating thickness is calculated. Finally, these absolute values ​​of difference are summed to obtain the first electroplating non-uniformity.

[0063] This process involves selecting a representative connector from the target connector type for gold plating and acquiring relevant data. The gold plating condition of this single connector reflects the overall gold plating characteristics of the target connector type. Measuring the plating thickness is to understand the specific condition of the plating thickness; identifying the concave area is because the concave structure may affect the gold plating quality; calculating the first plating unevenness is to quantify the uniformity of the plating thickness, providing basic data for subsequent steps.

[0064] S200, based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area, the first morphological complexity of the gold-plated area is determined.

[0065] In this step, the first morphological complexity refers to an index used to describe the morphological complexity of the gold-plated area of ​​the first connector. It is determined based on the plating thickness values ​​at multiple detection points in the gold-plated area of ​​the first connector and the concave regions within the gold-plated area. It comprehensively considers the potential impact of the shape characteristics of the gold-plated area (such as concavity) and the plating thickness distribution on the difficulty and quality of the gold-plating operation. For example, a gold-plated area with more concave regions and complex variations in plating thickness may have a higher morphological complexity.

[0066] Specifically, based on the plating thickness values ​​of multiple detection points in the first connector's gold-plated area and the determined concave area, a specific algorithm or evaluation model is used to determine the first morphological complexity of the gold-plated area. For example, considering factors such as the number, size, and shape of the concave areas, as well as the range and trend of changes in the plating thickness values, a specific numerical value of the first morphological complexity is obtained through a specific calculation method (such as weighted calculation, comprehensive scoring, etc.).

[0067] The complexity of the morphology of the gilded area affects the difficulty and quality of the gilding process. The presence of concave areas and uneven plating thickness distribution increase the difficulty of the gilding process, potentially leading to substandard plating thickness or uneven plating. Determining the first morphological complexity by comprehensively considering these factors allows for a more holistic assessment of the characteristics of the gilded area, providing a basis for subsequent judgments on whether a pictographic template is necessary.

[0068] S300, based on the first electroplating unevenness of the gold-plated area and the first morphological complexity of the gold-plated area, determines the necessity of the pictographic plate; the necessity of the pictographic plate is the necessity of using the pictographic plate when performing gold plating operation on a connector of the target connector type.

[0069] In this step, the pictogram necessity is an indicator used to determine the necessity of using a pictogram when performing gold plating on a connector of the target connector type. It is determined based on the first plating unevenness and the first morphological complexity of the plating area. The pictogram plays a role in the gold plating process by assisting in positioning and ensuring uniform plating. A higher pictogram necessity indicates greater importance of using the pictogram for achieving a good gold plating effect. It can be implemented as a weighted sum of the first plating unevenness and the first morphological complexity, for example, by mapping the two to a necessity level through a preset decision rule table, or by calculating the necessity value based on an empirical formula using historical gold plating data. Its main purpose is to determine the rationality of the pictogram application.

[0070] Specifically, based on the first electroplating unevenness and the first morphological complexity calculated above, the necessity of the pictogram is determined according to preset rules or algorithms. For example, a weighted sum of the first electroplating unevenness and the first morphological complexity can be used, assigning weights to each and adding their weighted values ​​to obtain the necessity of the pictogram; or, through a preset decision rule table, the first electroplating unevenness and the first morphological complexity can be mapped to specific necessity levels to determine the necessity of the pictogram. Furthermore, considering data comparability, the calculated necessity of the pictogram can be normalized.

[0071] Among these factors, the first electroplating unevenness reflects the uniformity of the plating thickness, and the first morphological complexity reflects the morphological complexity of the gold-plated area; both affect the gold plating effect. The pictographic template plays a role in the gold plating process, assisting in positioning and ensuring plating uniformity. By comprehensively considering these two factors to determine the necessity of the pictographic template, we can more accurately assess its importance in achieving good gold plating results, providing a scientific basis for whether or not to use it.

[0072] S400, in response to the pictogram necessity being greater than a preset necessity threshold, performs a gold plating operation on the connector of the target connector type through the pictogram.

[0073] In this step, the preset necessity threshold is a pre-set standard value used to determine whether to use a template for gold plating. When the calculated template necessity is greater than this preset necessity threshold, it is considered necessary to use the template for gold plating, and thus the template is used to perform gold plating on the connector of the target connector type; otherwise, the template may not be used for gold plating. For example, the preset necessity threshold can be 0.7.

[0074] Specifically, a preset necessity threshold is set, and the necessity of the pictogram plate calculated above is compared with this preset necessity threshold. If the necessity of the pictogram plate is greater than the preset necessity threshold, it is determined that it is necessary to use the pictogram plate for gold plating, and then the gold plating operation is performed on the connector of the target connector type using the pictogram plate; if the necessity of the pictogram plate is less than or equal to the preset necessity threshold, it is determined that it may not be necessary to use the pictogram plate for gold plating.

[0075] The preset necessity threshold is a criterion used to distinguish under what circumstances using a pattern plate can bring better gold plating results. When the necessity of the pattern plate is high, it means that the current gold plating condition of the connector makes the use of the pattern plate significantly effective in improving the gold plating quality and reducing the difficulty of operation, and therefore the pattern plate needs to be used; conversely, the necessity of using the pattern plate is considered low, and it can be omitted.

[0076] This invention acquires the plating thickness values, concave areas, and first electroplating unevenness at multiple detection points in the plating area. Combined with the determination of the first morphological complexity, it dynamically generates a pictographic plate necessity score. When the pictographic plate necessity score exceeds a preset necessity threshold, the pictographic plate is activated to perform the plating operation, achieving a shift from a fixed mode to on-demand decision-making. Specifically, this method transforms the plating thickness distribution and geometric features into measurable data, avoiding the limitations of relying solely on preset parameters while ignoring the actual state. Simultaneously, by coupling and analyzing plating uniformity and regional complexity through quantitative indicators, it ensures that the pictographic plate is used only when necessary to optimize the current distribution, thus forming a closed-loop adaptive adjustment mechanism during the plating process. As a preferred embodiment, the plating thickness value can be acquired in real-time using non-contact optical measurement equipment, and the concave area can be identified by reconstructing the surface morphology of the plating area using 3D scanning technology, thereby further improving the accuracy and efficiency of data acquisition. Ultimately, this invention effectively solves the problem of traditional methods lacking dynamism and thus being unable to flexibly adjust the plating mode, significantly improving the accuracy of plating control.

[0077] In the process of controlling local gold plating of a connector, when a gold plating operation is performed on a first connector of the target connector type, the plating thickness values ​​at multiple detection points in the gold plating area, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area are acquired. The first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​at each detection point in the gold plating area and the average plating thickness. Further, based on the plating thickness values ​​at multiple detection points in the gold plating area of ​​the first connector and the concave area of ​​the gold plating area, the first morphological complexity of the gold plating area is determined. Subsequently, based on the first electroplating unevenness and the first morphological complexity of the gold plating area, the pictographic plate necessity is determined; the pictographic plate necessity characterizes the necessity of using a pictographic plate when performing a gold plating operation on a connector of the target connector type. When the pictographic plate necessity exceeds a preset necessity threshold, a gold plating operation on the connector of the target connector type using the pictographic plate is triggered. This process quantifies the plating thickness distribution and geometric characteristics, transforming the gold plating quality into measurable objective data. The cumulative value of the absolute difference between the plating thickness value and the mean value accurately captures the plating uniformity deviation, while the acquisition of the concave region directly reflects the complexity of the physical structure. The combination of these two factors provides a real-time basis for dynamic adjustment. Based on the correlation between the plating thickness distribution characteristics and the geometric parameters of the concave region, the first morphological complexity is assessed, truly reflecting the comprehensive processing difficulty of the gold plating area. By coupling the first electroplating non-uniformity and the first morphological complexity, the necessity of the pictographic plate is determined, realizing the transformation from a fixed mode to on-demand decision-making, thereby forming a closed-loop adaptive control mechanism.

[0078] This embodiment first obtains the plating thickness values, concave areas, and first electroplating unevenness at multiple detection points in the gold-plated area of ​​the first connector, providing a comprehensive understanding of the current plating thickness distribution and overall unevenness. Next, based on this information, the first morphological complexity is determined, allowing for precise control of the morphological characteristics of the gold-plated area. Then, the necessity of the shaped plate is determined based on the first electroplating unevenness and the first morphological complexity, enabling a scientific assessment of the necessity of using the shaped plate. When the necessity of the shaped plate exceeds a preset threshold, the gold plating operation is performed using the shaped plate. Because the shaped plate better conforms to the shape of the gold-plated area, the gold plating process can be dynamically adjusted according to the actual situation, thereby more precisely controlling the gold plating parameters. This effectively compensates for the inflexibility of traditional fixed modes, significantly improving the accuracy of gold plating control and meeting the requirements for high-quality gold plating effects.

[0079] In some embodiments of the present invention described above, a first morphological complexity of the gilded area is proposed to assess the complexity of the area. However, in its implementation, due to the lack of refined quantitative analysis of the internal structural details and spatial distribution characteristics of the detection points in the gilded area, the calculation of morphological complexity is too general and cannot accurately capture the local thickness variation patterns and structural complexity differences of the gilded area. This results in inaccurate judgment of the necessity of the pictographic plate, which may lead to unnecessary use of the pictographic plate or uneven gilding.

[0080] In this regard, the present invention further proposes that S200 includes:

[0081] Multiple detection points in the gold-plated area of ​​the first connector are clustered to obtain at least one gold-plated cluster;

[0082] Based on the detection points in each gold-plated cluster, the distribution dispersion of each gold-plated cluster is determined; the distribution dispersion is the average of the minimum distances between each detection point and other detection points in the gold-plated cluster.

[0083] Obtain the maximum number of clusters in the gold-plated area of ​​the target historical connector, the maximum depth ratio of the concave area in the gold-plated area of ​​the target historical connector, the current number of clusters in the gold-plated area of ​​the first connector, and the minimum depth ratio and number of concave areas in the gold-plated area of ​​the first connector; the target historical connector is a historical connector of the target connector type.

[0084] The first morphological complexity of the gold-plated region is determined based on the dispersion difference between the maximum and minimum dispersion of the distribution dispersion of each gold-plated cluster, the difference in the number of clusters between the maximum and current number of clusters, the difference in the depth ratio between the maximum and minimum depth ratio, and the number of concave regions.

[0085] In this embodiment, the gold-plated cluster refers to a set of regions formed by grouping the plating thickness detection points using a clustering algorithm. This can be achieved using K-means clustering, density-based clustering, etc., with the aim of identifying local variation patterns caused by morphological differences within the gold-plated region. Distribution dispersion is a quantitative indicator of the spatial dispersion of detection points within the gold-plated cluster. It can be calculated using the average of the minimum distances between point pairs within the cluster, reflecting the thickness uniformity of the local area. Maximum depth ratio refers to the maximum ratio of the depth of the concave region to the standard depth in the gold-plated region of the target historical connector, providing a reference benchmark for the concave depth. Minimum depth ratio refers to the minimum ratio of the depth of the concave region to the standard depth in the gold-plated region of the first connector. First morphological complexity is a quantitative indicator comprehensively reflecting the structural complexity of the gold-plated region, aiming to accurately distinguish the gold-plating difficulty of different connectors. The standard depth can be determined by collecting a large amount of measured data on the gold-plated areas of similar connectors under ideal process conditions, and taking the average value of the gold plating thickness in the concave area from these data as the standard depth; or it can be determined by directly adopting the standard thickness value of the gold plating in the concave area specified in the industry's clear specifications for the gold plating process of this type of connector, and using this as a benchmark to accurately calculate the maximum depth ratio and the minimum depth ratio.

[0086] Specifically, the first-order complexity of the gilded area can be determined using the following formula 1:

[0087] Formula 1

[0088] In formula 1, The first morphological complexity is used to characterize the j-th gold-plated region of the first connector. The maximum dispersion among the gold-plated clusters used to characterize the distribution dispersion of the j-th gold-plated region of the first connector. The minimum dispersion among the distribution dispersions of each gold-plated cluster used to characterize the j-th gold-plated region of the first connector. The maximum number of clusters in the j-th gold-plated region used to characterize the target history connector. The current cluster number used to characterize the j-th gold-plated region of the first connector. The number of recessed regions used to characterize the j-th gold-plated area of ​​the first connector. The maximum depth ratio of the concave region in the j-th gold-plated region of the target historical connector is used to characterize the target historical connector. The minimum depth ratio used to characterize the recessed area in the j-th gold-plated region of the first connector.

[0089] Wherein, the current cluster number of the j-th gold-plated region of the first connector The maximum number of clusters in the j-th gold-plated region of the target history connector. absolute value of the difference The smaller the value, the greater the dispersion among the gold-plated clusters in the j-th gold-plated region of the first connector. The minimum dispersion among the distribution dispersions of the gold-plated clusters in the j-th gold-plated region of the first connector. The difference The larger the number of recessed areas in the j-th gold-plated region of the first connector; The larger the value; and the smaller the depth of the recessed area in the j-th gold-plated region of the first connector compared to... The ratio of the maximum depth of the recessed area in the j-th gold-plated region of the target historical connector absolute value of the difference The smaller the size, the more complex the density distribution in the j-th gold-plated area of ​​the first connector, the greater the difference, the more concave areas, the more severe the concavity, the sparser the electric field lines, the smaller the current density, and the easier it is to cause uneven electroplating thickness.

[0090] It should be noted that, in order to ensure that the calculation results are meaningful, when performing fractional operations in this embodiment of the invention, if the denominator is 0, a parameter adjustment factor greater than 0 needs to be added to the denominator to prevent the denominator from being 0. 0.01 in Formula 1 above is the preset parameter adjustment factor. The value of the parameter adjustment factor can be set and adjusted by the implementer according to the actual situation. This invention does not impose any special restrictions.

[0091] As a specific implementation method, the solution of the present invention is implemented as follows: During the gold plating operation, the system first obtains multiple detection points in the gold plating area of ​​the first connector, and uses a density-based clustering algorithm to divide these detection points into several gold plating clusters; then, it calculates the average minimum distance between detection points within each gold plating cluster as the distribution dispersion; next, it retrieves the maximum number of clusters and the maximum depth ratio of the concave region of the same type of historical connector from the historical database; at the same time, it obtains the current number of clusters, the minimum depth ratio of the concave region, and the number of concave regions of the current first connector; finally, based on the dispersion difference, the cluster number difference, the depth ratio difference, and the number of concave regions, the first morphological complexity is determined by the preset formula 1 above.

[0092] Through the above scheme, the present invention can achieve a refined quantitative assessment of the morphological complexity of the gold-plated area, accurately capture the differences in local thickness variation patterns and structural complexity, thereby improving the accuracy of the determination of the necessity of the pictographic plate and avoiding unnecessary use of pictographic plates or uneven gold plating.

[0093] In some embodiments of the present invention, a method for determining the necessity of a pictogram based on the first electroplating unevenness and the first morphological complexity of the gold-plated area is proposed to guide the decision-making process of gold plating operations. However, in its implementation, due to the lack of a quantitative calculation method for the necessity of the pictogram, relying solely on empirical judgment or simple threshold comparison leads to subjectivity and instability in the assessment of the necessity of the pictogram. This fails to accurately reflect the combined influence of the morphological complexity and electroplating unevenness of the gold-plated area, and may result in misjudgment of the pictogram's usage requirements, causing fluctuations in gold plating quality or waste of resources.

[0094] In this regard, the present invention further proposes that S300 includes:

[0095] Divide the first morphological complexity of the gold-plated area by the maximum morphological complexity of the target historical connector to obtain the first morphological complexity ratio; the target historical connector is a historical connector of the target connector type.

[0096] The product of the first morphological complexity ratio and the first electroplating unevenness is normalized to obtain the pictographic plate necessity degree.

[0097] In this embodiment, the first morphological complexity refers to a quantitative indicator of the geometric morphological complexity of the gold-plated area. It can be implemented using various generalization methods, such as analysis based on the spatial distribution characteristics of detection points, to objectively characterize the impact of the irregular shape of the gold-plated area on the uniformity of the plating layer. The target historical connector refers to a historical connector sample of the same type as the current connector, to ensure the comparability of historical data and eliminate cross-type interference. The maximum morphological complexity refers to the maximum value of the first morphological complexity among the target historical connectors, which can be determined by traversing historical records and extracting extreme values, to provide a normalized benchmark to eliminate dimensional differences. The first morphological complexity ratio is the ratio of the first morphological complexity to the maximum morphological complexity. It can be understood as the ratio of the current morphological complexity to the most complex historical case, aiming to convert absolute values ​​into relative proportions; the first electroplating unevenness refers to the cumulative value of the absolute difference between the coating thickness value and the average thickness value at each detection point in the gold plating area, which can be calculated by collecting data from a real-time thickness monitoring system, aiming to quantify the degree of unevenness in coating thickness; normalization processing refers to the standardized operation of mapping values ​​to a preset range, which can be achieved by linear transformation or function mapping, aiming to make the pictographic plate necessity degree have a unified dimension and interpretability; pictographic plate necessity degree refers to the degree of necessity of using pictographic plates for gold plating operations, which can be understood as a standardized decision indicator, aiming to provide an objective basis for the selection of gold plating mode.

[0098] Specifically, the present invention transforms the current morphological complexity into a relative proportion by dividing the first morphological complexity by the maximum morphological complexity of the target historical connector, highlighting the difference in the degree of complexity of the current connector morphology relative to the most complex historical case. Subsequently, the first morphological complexity ratio is multiplied by the first electroplating unevenness, capturing the synergistic mechanism of morphological complexity and electroplating unevenness, avoiding the shortcomings of simple linear superposition, and enabling the product result to accurately reflect the risk of both exacerbating uneven gold plating. Finally, the product result is mapped to a unified dimension range through normalization processing, ensuring that the pictogram necessity value has threshold operability and interpretability, thereby providing a reliable and objective decision-making basis for whether to use the pictogram.

[0099] Specifically, the necessity of the pictogram can be determined using the following formula 2:

[0100] Formula 2

[0101] In formula 2, The pictogram used to characterize the j-th gold-plated area of ​​the first connector is necessary. The first morphological complexity is used to characterize the j-th gold-plated region of the first connector. Used to characterize the maximum morphological complexity of the target history connector. The first plating non-uniformity is used to characterize the j-th gold-plated region of the first connector, and norm is used to characterize the normalization process, which can be processed by, for example, minimization normalization.

[0102] It should be noted that, in order to ensure that the calculation results are meaningful, when performing fractional operations in this embodiment of the invention, if the denominator is 0, a parameter adjustment factor greater than 0 needs to be added to the denominator before summing to prevent the denominator from being 0. The value of the parameter adjustment factor can be set and adjusted by the implementer according to the actual situation, and this invention does not impose any special restrictions.

[0103] As a preferred embodiment, the specific implementation of the present invention is as follows: In the gold plating control process of the USB connector, the maximum morphological complexity of the target historical connector is determined based on the records of similar connectors in the historical production database; when the first morphological complexity is close to the maximum morphological complexity, the first morphological complexity ratio approaches 1; if the first electroplating unevenness is large, the product of the first morphological complexity ratio and the first electroplating unevenness increases accordingly; through normalization processing, this product is converted into a pictogram necessity degree, the higher the value, the greater the necessity of using the pictogram. For example, when the pictogram necessity degree exceeds the preset necessity threshold, the system automatically activates the pictogram for gold plating operation.

[0104] Through the above solution, the present invention achieves an objective quantitative assessment of the necessity of pictographic plates, reduces the risk of misjudgment caused by subjective judgment, and effectively improves the stability of gold plating quality and resource utilization efficiency.

[0105] In some embodiments of the present invention described above, a gold plating operation is performed on connectors of the target connector type using a pictogram plate. However, in this process, if the unevenness of the plating still exceeds a reasonable range after the gold plating operation is performed using the pictogram plate, the system lacks an automatic feedback adjustment mechanism based on actual gold plating quality data, resulting in unstable gold plating quality and decreased production consistency.

[0106] In this regard, such as Figure 2 As shown, the present invention further proposes that S500 to S600 are included after S400:

[0107] S500, Obtain the second electroplating unevenness of the gold-plated area of ​​the second connector; the second connector is a connector of the target connector type for which the gold plating operation is performed by a pictogram plate;

[0108] S600, in response to the second plating unevenness being greater than the first preset plating unevenness threshold, the original processing control parameters of the connector of the target connector type are adjusted based on the second plating unevenness to obtain the corrected processing control parameters.

[0109] In this embodiment, if the uniformity of electroplating thickness is still poor after using a shaped plate, the average current density of the pulsed current used should be reduced to slow down the overall deposition rate and allow more time for metal ions to transport to the low current density region. Simultaneously, the stirring intensity of the solution should be adjusted according to the morphological complexity and average current density to accelerate the transport speed of metal ions to the low current density region, thereby achieving a better electroplating uniformity.

[0110] The second electroplating unevenness refers to the cumulative absolute value of the difference between the coating thickness value at each detection point in the gold plating area and the average thickness value. It can be achieved by measuring in real time with a coating thickness gauge and calculating statistical values, with the aim of objectively quantifying the gold plating uniformity. The original processing control parameters may include process parameters that affect the gold plating process, such as average current density and stirring intensity, with the aim of setting the basic control conditions for the gold plating operation. The corrected processing control parameters refer to the parameter values ​​adjusted according to the second electroplating unevenness. They can be achieved using proportional-integral-derivative control algorithms or lookup table methods, with the aim of dynamically optimizing the gold plating uniformity.

[0111] The first preset electroplating unevenness threshold can be an empirical value set based on historical gold plating data or a threshold dynamically generated by an algorithm. Its purpose is to determine whether the gold plating quality meets the process requirements. For example, after statistical analysis of a large amount of historical data, it was found that when the cumulative absolute value of the difference between the plating thickness value at each detection point in the gold plating area and the average thickness does not exceed 5μm, the gold plating quality can meet the conductivity, corrosion resistance, and other performance requirements of the connector in subsequent use, and the produced connector products have good consistency. In this case, the first preset electroplating unevenness threshold can be set to 5μm.

[0112] Specifically, the present invention uses the second plating unevenness of the second connector as a quality feedback benchmark after the gold plating operation of the pictographic plate. When the second plating unevenness exceeds a first preset plating unevenness threshold, a parameter adjustment mechanism is triggered. Based on the magnitude of the second plating unevenness, a corresponding correction amount is generated, and the original processing control parameters are dynamically updated, thus forming a closed-loop control process from gold plating quality monitoring to parameter correction. This process ensures that the system only initiates adjustment when the gold plating quality is substandard, avoiding invalid operations. At the same time, the real-time measured value of the second plating unevenness is directly converted into a basis for parameter adjustment, enabling the control system to adaptively match the actual needs of the gold plating area.

[0113] As a preferred embodiment, the present invention is implemented as follows: In an automated gold plating production line, after the connector completes the gold plating operation through a pictographic plate, an optical sensor array measures the plating thickness at multiple detection points in the gold plating area and calculates a second electroplating unevenness. If the second electroplating unevenness is greater than a first preset electroplating unevenness threshold, the central processing unit corrects the original average current density parameter using a proportional adjustment algorithm based on the value of the second electroplating unevenness, generates a corrected average current density, and applies this parameter to the subsequent gold plating operation of the connector to improve the gold plating uniformity.

[0114] Through the above solution, the present invention realizes real-time quality monitoring and dynamic parameter adjustment of the gold plating process, effectively suppresses fluctuations in gold plating uniformity, and ensures the stability and production consistency of the connector gold plating layer.

[0115] In some embodiments of the present invention described above, it is proposed to adjust the original processing control parameters based on the second electroplating unevenness. However, in its implementation, the adjustment mechanism lacks a specific quantitative method, resulting in inaccurate parameter adjustment and an inability to effectively reduce electroplating unevenness.

[0116] In this regard, the present invention further proposes that the original processing control parameters include the original average current density, and the corrected processing control parameters include the corrected average current density; S600 includes:

[0117] The ratio of the second plating unevenness to the target historical plating unevenness is determined as the first correction coefficient; the target historical plating unevenness is the maximum value among the historical plating unevennesses of the target historical connector, and the target historical connector is a historical connector of the target connector type.

[0118] The product of the first correction factor and the standard current correction value is determined as the final current correction value;

[0119] Based on the final current correction value, the original average current density is adjusted to obtain the corrected average current density.

[0120] In this embodiment, the second plating unevenness refers to the sum of the absolute values ​​of the differences between the plating thickness values ​​at each detection point within the gold plating area of ​​the second connector and the average plating thickness. It can be obtained by collecting data from a plating thickness measuring instrument and then processing it. The purpose is to objectively quantify the degree of thickness distribution deviation in the current gold plating area. The target historical plating unevenness refers to the maximum value of historical plating unevenness in historical connectors of the target connector type. It can be obtained by querying a historical process database. The purpose is to establish a historical worst benchmark for gold plating quality. The first correction coefficient is the ratio of the second plating unevenness to the target historical plating unevenness. It is determined by division. The purpose is to proportionally correlate the current degree of gold plating quality deviation with the historical worst case, avoiding subjective experience judgment. The standard current correction value is a pre-set current density adjustment benchmark unit. It can be set based on electroplating process experimental data or industry standards. The purpose is to provide a standardized adjustment range reference. The final current correction value is the product of the first correction coefficient and the standard current correction value. It is generated by multiplication. The purpose is to dynamically determine the adjustment level of current density according to the severity of the current problem.

[0121] Specifically, the present invention generates a first correction coefficient by calculating the ratio of the second electroplating unevenness to the target historical electroplating unevenness, thus establishing a linear proportional relationship between the adjustment range and the current gold plating quality deviation. Based on this, the first correction coefficient is multiplied by a standard current correction value to obtain a final current correction value, ensuring that the adjustment is neither excessive nor insufficient. Finally, the original average current density is precisely adjusted based on the final current correction value, allowing the current density parameter to directly respond to the actual state of the plating thickness distribution, thereby optimizing the uniformity of current distribution during the electroplating process. This technical solution dynamically correlates gold plating quality feedback data with historical benchmarks, achieving closed-loop precise control of current density through quantitative calculations, effectively solving the problem of insufficient scientific basis for parameter adjustment.

[0122] Specifically, the final current correction value can be determined using the following formula 3:

[0123] Formula 3

[0124] In formula 3, Used to characterize the final current correction value. Used to characterize the standard current correction value Used to characterize the second electroplating unevenness Used to characterize the historical electroplating unevenness of a target.

[0125] If the uniformity of electroplating thickness is still poor after using a pictographic plate, the original average current density of the pulsed current should be reduced to slow down the overall deposition rate and allow more time for metal ions to transport to the low current density region. Therefore, after obtaining the final current correction value, the original average current density should be subtracted from the final current correction value to correct it in the direction of reduction, thus obtaining the corrected average current density.

[0126] As a specific implementation method, the present invention is implemented as follows: In the gold plating control system, the data acquisition unit acquires the plating thickness distribution data of the gold plating area of ​​the second connector through a non-contact thickness gauge; the central processing unit calculates the second electroplating unevenness based on the plating thickness distribution data and retrieves the target historical electroplating unevenness from the historical database; the central processing unit performs a division operation to determine the first correction coefficient, and then multiplies it with the pre-stored standard current correction value to obtain the final current correction value; the control execution unit fine-tunes the original average current density according to the final current correction value, generates a corrected average current density and sends it to the electroplating power supply module, thereby dynamically optimizing the current output characteristics during the electroplating process.

[0127] Through the above scheme, the present invention achieves scientific quantitative adjustment of current density parameters, so that the current distribution in the gold plating process matches the morphological characteristics of the gold plating area, significantly improving the consistency of the plating thickness and effectively solving the problem of excessive electroplating unevenness caused by inaccurate parameter adjustment.

[0128] In some embodiments of the present invention, a method for adjusting processing control parameters based on electroplating unevenness is proposed. However, in its implementation, only the current density is adjusted without considering the dynamic adaptation of the stirring intensity, which leads to limitations in the control of gold plating uniformity. Especially when the gold plating area of ​​the connector has a high degree of morphological complexity, the coordination between stirring intensity and current density is insufficient, which cannot effectively cope with the unevenness of solution flow and ion distribution, thereby affecting the improvement of the uniformity of the plating thickness.

[0129] In this regard, the present invention further proposes that the original processing control parameters include the original stirring intensity, and the modified processing control parameters include the modified stirring intensity; S600 also includes:

[0130] The second morphological complexity ratio is obtained by dividing the second morphological complexity of the gold-plated area of ​​the second connector by the maximum morphological complexity of the target historical connector; the target historical connector is a historical connector of the target connector type.

[0131] The second correction coefficient is determined based on the second morphological complexity ratio, the current density difference between the maximum average current density of the target historical connector and the corrected average current density;

[0132] The product of the second correction factor and the standard stirring intensity correction value is determined as the final stirring intensity correction value;

[0133] Based on the final stirring intensity correction value, the original stirring intensity is adjusted to obtain the corrected stirring intensity.

[0134] In this embodiment, the second morphological complexity ratio refers to a relative quantitative index obtained by normalizing the morphological complexity of the current connector's gold-plated area with its historical maximum value. This can be achieved by dividing the second morphological complexity by the maximum morphological complexity of the target historical connector. The purpose is to convert the morphological complexity into a relative value, avoiding adjustment deviations caused by absolute value differences. The current density difference can be understood as the numerical difference between the maximum average current density of the target historical connector and the corrected average current density. This can be achieved by collecting current density data in real time and calculating the difference, reflecting the actual effect of previous current density adjustments. The second correction coefficient is a dynamic adjustment coefficient determined based on the second morphological complexity ratio and the current density difference. This can be achieved using linear weighting or nonlinear function mapping, ensuring a dynamic correlation between the stirring intensity correction and overall process parameters. The final stirring intensity correction value is the product of the second correction coefficient and the standard stirring intensity correction value, achieved through a multiplication unit. This aims to control the correction amplitude through standardized proportions, preventing process fluctuations caused by over-correction.

[0135] Specifically, the present invention first divides the second morphological complexity by the maximum morphological complexity of the target historical connector to obtain a second morphological complexity ratio. This second morphological complexity ratio, together with the current density difference, serves as input to determine a second correction coefficient. Then, a final stirring intensity correction value is calculated, and finally, this final stirring intensity correction value is applied to adjust the original stirring intensity. This process achieves a comprehensive quantification of the effects of morphological complexity and current density adjustment, enabling the stirring intensity correction to adapt to the needs of gold-plating areas with different morphological complexities. Since the morphological complexity of the gold-plating area directly affects the flow path of the electroplating solution, and the current density difference reflects the cumulative effect of previous parameter adjustments, the synergistic calculation of both ensures that the stirring intensity correction reflects both the current complexity of the area and the historical process adjustment status, thereby optimizing the electroplating solution flow state and ion transport efficiency, and achieving a dynamic match between the stirring intensity and the morphology and current distribution of the gold-plating area.

[0136] Specifically, the second correction factor can be determined using the following formula 4:

[0137] Formula 4

[0138] In formula 4, Used to characterize the second correction coefficient The second morphological complexity is used to characterize the gold-plated area of ​​the second connector. Used to characterize the maximum morphological complexity of the target history connector. Used to characterize the maximum average current density of the target historical connector. Used to characterize the corrected average current density For normalization, for example, the minimax normalization method can be used.

[0139] As a preferred embodiment, the present invention is implemented as follows: In the gold plating control system, when a second electroplating unevenness is detected to be greater than a first preset electroplating unevenness threshold, the system calculates a second morphological complexity ratio, which is obtained by dividing the second morphological complexity of the current gold-plated area of ​​the second connector by the historical maximum value; subsequently, the system determines a second correction coefficient based on the second morphological complexity ratio and the current density difference, for example, through a preset mapping function; then, the second correction coefficient is multiplied by a standard stirring intensity correction value to obtain a final correction value; finally, the control system corrects the stirring intensity by adjusting the speed of the stirring motor, for example, by using a frequency converter to control the operating frequency of the stirring device, so that the flow rate of the electroplating solution is adapted to the morphological characteristics of the gold-plated area. It should be understood that when the final correction value is not an integer in the present invention, a rounding operation can be used for processing, which will not be elaborated here.

[0140] If the uniformity of electroplating thickness is still poor after using a pictographic plate, the stirring intensity should be increased. Therefore, after obtaining the final stirring intensity correction value, the original stirring intensity should be added to the final stirring intensity correction value, and the correction should be made in the direction of increase to obtain the corrected stirring intensity.

[0141] Furthermore, the standard stirring intensity correction value is obtained as follows: First, based on extensive experimental and actual production data, the impact of different stirring intensity adjustments on key indicators such as electroplating unevenness and coating quality is analyzed for the gold plating process of a specific type of connector. A series of stirring intensity adjustment experiments with different amplitudes are set up, such as changing the stirring intensity by a fixed percentage (e.g., 5%, 10%) or a fixed value (e.g., 5 r / min, 10 r / min), and the changes in various data related to the electroplating effect after each adjustment are recorded. Then, these experimental data are analyzed in depth to identify the stirring intensity adjustment range that, in most cases, significantly improves electroplating unevenness, stably enhances coating quality, and does not cause other negative effects (e.g., increased coating roughness, electroplating solution splashing). Next, considering factors such as production efficiency, equipment performance, and cost, the most suitable and universally applicable stirring intensity adjustment value is determined within this effective adjustment range; this value is the standard stirring intensity correction value. It serves as the reference step size for subsequent adjustments to the stirring intensity based on actual conditions. It is multiplied by the second correction coefficient to obtain the final correction value, thereby achieving accurate and reasonable correction of the stirring intensity.

[0142] Through the above-mentioned scheme, the present invention can coordinate the stirring intensity with the morphology of the gold plating area and the current distribution, thereby more comprehensively improving the uniformity of the plating thickness and enhancing the accuracy and adaptability of gold plating control.

[0143] In some embodiments of the present invention described above, it is proposed to adjust the processing control parameters based on the second electroplating unevenness to improve the gold plating uniformity. However, in this process, even if parameters such as current density or stirring intensity are optimized by modifying the processing control parameters, the electroplating unevenness may still not be fully met due to the complexity of the morphology of the gold plating area of ​​the connector, resulting in the persistent problem of uneven plating thickness distribution. Therefore, it is necessary to introduce a dynamic iteration mechanism of pulse parameters to achieve more refined process control.

[0144] In this regard, such as Figure 3 As shown, the present invention further proposes that S700 to S800 are included after S600:

[0145] S700, obtain the third electroplating non-uniformity of the gold-plated area of ​​the third connector; the third connector is a connector of the target connector type for which the gold plating operation is performed based on the modified processing control parameters;

[0146] S800, in response to the third plating unevenness being greater than the second preset plating unevenness threshold, adjusts the original pulse off duration of the connector of the target connector type to obtain a corrected pulse off duration until the preset correction condition is met.

[0147] In this embodiment, when the electroplating uniformity is only slightly different from the required value, the electroplating effect of the resulting connector can be gradually brought closer to the required value by gradually extending the current pulse off-time. The magnitude of each adjustment value can be referenced by the current electroplating uniformity and the change in electroplating unevenness under the previous pulse off-time extension.

[0148] The third electroplating unevenness refers to the cumulative value of the absolute difference between the plating thickness value and the mean value at each detection point within the connector's plating area after the gold plating operation is performed based on corrected processing control parameters. It can be obtained by collecting plating data in real time using an online thickness monitoring system and calculating it, with the aim of quantifying the gold plating uniformity. The third connector can be understood as the connector in the current production batch undergoing gold plating operation using corrected processing control parameters; specifically, it can be an actual product sample on the production line, with the purpose of providing feedback on the process effect after parameter adjustment. The original pulse off-time refers to the initial set value of the current off-time period during pulse electroplating, which can be based on... The historical process data preset for the target connector type aims to control the ion diffusion time during electroplating. The corrected pulse off-time refers to the off-time value dynamically adjusted based on electroplating unevenness. This can be adjusted using a proportional-integral-differential algorithm or a lookup table method based on historical data, aiming to optimize local current distribution to compensate for thickness deviations in complex areas. The preset correction conditions can be understood as the criteria for determining whether electroplating unevenness meets the standard or the adjustment process converges. Specifically, it can be set that the third electroplating unevenness is not greater than the second preset electroplating unevenness threshold or the maximum number of adjustments is reached, ensuring that the plating uniformity meets process requirements. For example, the second preset electroplating unevenness threshold can be preset to 2μm. The third electroplating unevenness is the electroplating unevenness of the target connector type based on the corrected processing control parameters during gold plating. In this case, the third electroplating unevenness will be significantly smaller than the second electroplating unevenness. Therefore, the second preset electroplating unevenness threshold should also be significantly smaller than the first preset electroplating unevenness threshold.

[0149] Specifically, the present invention obtains the third plating unevenness of the third connector after gold plating operation based on modified processing control parameters, and monitors the gold plating uniformity in real time. When the third plating unevenness exceeds a second preset plating unevenness threshold, it triggers an adjustment to the original pulse off duration, generating a modified pulse off duration. This adjustment process iterates continuously until the preset correction conditions are met, thus forming a closed-loop control mechanism. In this mechanism, the third plating unevenness, as a feedback signal, directly reflects the plating distribution after the modified processing control parameters, providing a highly relevant input basis for pulse off duration adjustment. The dynamic adjustment of the pulse off duration utilizes the key regulatory role of the off period on ion diffusion, and compensates for plating thickness deviations in complex morphological regions by optimizing the local current distribution. The iterative process ensures that the adjustment terminates with the plating unevenness meeting the standard, avoiding insufficient or excessive parameter adjustment, enabling the gold plating process to adapt to changes in connector morphological characteristics and achieve precise control of plating uniformity.

[0150] As a specific implementation method, the present invention is implemented as follows: In a gold plating production line, after performing gold plating on a connector based on modified processing control parameters, the third electroplating unevenness of the gold plating area of ​​the third connector is obtained through an online thickness monitoring system. If this value is greater than a second preset electroplating unevenness threshold, the original pulse off-time is extended based on a preset standard pulse off-time correction value to obtain a corrected pulse off-time. The above process is repeated until the third electroplating unevenness meets the preset correction condition, such as not being greater than the second preset electroplating unevenness threshold or reaching the maximum number of adjustments. The preset standard pulse off-time correction value can be selected and adjusted according to actual process requirements and equipment characteristics. For example, in many conventional pulse electroplating processes, for cases where the precision requirements are not extremely high and the connector shape complexity is at a moderate level, the original pulse off-time is extended by 0.1ms each time as the adjustment step, i.e., the standard pulse off-time correction value. The maximum number of adjustments can be obtained by taking the number of adjustments required for 5% batch convergence plus 2 safety redundancies based on historical adjustment data of the target connector type. For example, if historical data shows that convergence can be achieved within 6 adjustments, then the maximum number of adjustments can be set to 8.

[0151] Through the above technical solution, the present invention can solve the problem of residual uneven electroplating that still exists after the processing control parameters are corrected. By dynamically and iteratively adjusting the pulse off duration, the thickness deviation of the plating layer caused by the complexity of the gold plating area of ​​the connector can be effectively compensated, thereby improving the adaptability and accuracy of the gold plating process and ensuring that the plating uniformity meets the standards.

[0152] In some embodiments of the present invention described above, the pulse off duration is adjusted to further reduce electroplating unevenness. However, in its implementation, the adjustment method lacks systematicity and precision, resulting in a reliance on trial and error, low efficiency, and an inability to dynamically optimize the adjustment range based on the actual gold plating effect. This can easily lead to over-correction or under-correction, affecting the stable improvement of coating uniformity.

[0153] In this regard, the present invention further proposes that S800 includes:

[0154] Obtain the fourth plating unevenness of the gold-plated area of ​​the third connector before the s-th adjustment of the pulse off duration, and the fifth plating unevenness of the gold-plated area of ​​the third connector after the s-th adjustment of the pulse off duration; s is a positive integer.

[0155] The third correction coefficient is determined based on the fourth electroplating unevenness, the fifth electroplating unevenness, and the duration adjustment of the s-th adjustment pulse.

[0156] The product of the third correction factor and the standard pulse off duration correction value is determined as the final pulse off duration correction value;

[0157] Based on the final pulse off duration correction value, the pulse off duration after the s-th adjustment of the pulse off duration is adjusted to obtain the pulse off duration after the (s+1)-th adjustment of the pulse off duration.

[0158] In this embodiment, the fourth plating unevenness refers to the measured value of the plating unevenness of the gold-plated area of ​​the third connector before the s-th adjustment of the pulse off duration. It can be obtained by a plating thickness detection sensor or an optical measurement device. The purpose is to provide baseline state data before adjustment to quantify the current plating uniformity level. The fifth plating unevenness refers to the measured value of the plating unevenness of the gold-plated area of ​​the third connector after the s-th adjustment of the pulse off duration. It is also obtained by a real-time monitoring device. The purpose is to reflect the actual impact of the adjustment operation on the plating uniformity. The third correction coefficient is a parameter dynamically calculated based on the change in plating unevenness before and after adjustment and the adjustment amount of duration. Its purpose is to characterize the sensitivity of plating uniformity to changes in pulse off duration and avoid the blindness of fixed step adjustment. The final pulse off duration correction value is the result obtained by multiplying the third correction coefficient and the standard pulse off duration correction value. It is standardized to ensure that the adjustment range matches the characteristics of the gold plating process. The purpose is to prevent plating quality fluctuations caused by excessively large or small correction values.

[0159] Specifically, the present invention establishes a quantitative correlation between changes in plating uniformity and pulse-off duration adjustment by obtaining the plating unevenness before and after the s-th adjustment; a third correction coefficient is determined based on the fourth and fifth plating unevenness and the magnitude of the duration adjustment, enabling the correction coefficient to adaptively reflect the current adjustment efficiency, thereby accurately characterizing the response characteristics of plating uniformity to duration changes; the third correction coefficient is multiplied by the standard pulse-off duration correction value to generate the final pulse-off duration correction value, and process experience is incorporated into the adjustment process through standardization to ensure that the correction magnitude is adapted to the physical characteristics of the gold plating process; finally, the pulse-off duration is updated based on the final pulse-off duration correction value, forming a closed-loop iterative mechanism, so that each adjustment closely depends on the previous gold plating effect data, gradually approaching the optimal parameter value. This mechanism achieves precise optimization of pulse parameters through dynamic feedback, effectively solving the problems of incorrect adjustment direction or inappropriate amplitude in traditional methods.

[0160] Specifically, the third correction factor can be determined using the following formula 5:

[0161] Formula 5

[0162] In formula 5, The third correction coefficient is used to characterize the duration of the (s+1)th adjustment pulse. The fifth plating non-uniformity is used to characterize the gold plating area of ​​the third connector after the s-th adjustment of the pulse off duration. Used to characterize the historical electroplating unevenness of a target. The duration adjustment used to characterize the duration of the s-th adjustment pulse is adjusted. This is used to characterize the absolute value of the difference between the fourth and fifth plating unevenness before and after the s-th adjustment of the pulse duration. It should be noted that, to ensure the calculation results are meaningful, in this embodiment of the invention, when performing fractional operations, if the denominator is 0, a parameter adjustment factor greater than 0 needs to be added to the denominator to prevent it from being 0. The 0.01 in Formula 1 above is the pre-set parameter adjustment factor. The value of the parameter adjustment factor can be set and adjusted by the implementer according to the actual situation; this invention does not impose any special restrictions.

[0163] Among them, the fifth electroplating unevenness of the gold-plated area of ​​the third connector after the s-th adjustment of the pulse off duration. Plating unevenness compared to target historical plating ratio The larger the value, the absolute value of the difference between the fourth and fifth plating unevenness before and after the s-th adjustment of the pulse off duration. The smaller the value, the greater the adjustment value of the duration of the s-th adjustment pulse. The larger the value, the more it indicates that the adjustment of the pulse off duration in the s-th adjustment is insufficient and cannot significantly reduce the unevenness of the sample electroplating. A greater adjustment should be made in the (s+1)-th pulse off duration adjustment.

[0164] As a specific implementation method, the present invention is implemented as follows: In the initial adjustment stage, the system first obtains the electroplating unevenness of the gold-plated area of ​​the third connector using a plating thickness detection device as the fourth electroplating unevenness; then, the pulse off duration is slightly adjusted, for example, by increasing the duration by a certain amount; the adjusted electroplating unevenness is measured again as the fifth electroplating unevenness; based on the difference between the unevenness before and after and the duration adjustment amount, a third correction coefficient is calculated; this third correction coefficient is multiplied by the standard pulse off duration correction value to obtain the actual adjustment amount; the pulse off duration is updated accordingly, and the next round of adjustment is performed. This process is automatically executed in the gold plating control system, ensuring that the adjustment operation is closely dependent on real-time gold plating status data.

[0165] Through the above technical solution, the present invention achieves dynamic and precise optimization of pulse off duration, avoids the inefficiency caused by trial and error, effectively improves the convergence speed and stability of the adjustment process, and thus ensures continuous improvement of coating uniformity.

[0166] Based on the connector local gold plating control method provided by this invention, correspondingly, this invention further provides a specific embodiment of a connector local gold plating control system.

[0167] like Figure 4 As shown in the figure, the present invention provides a schematic diagram of a connector local gold plating control system. The connector local gold plating control system 400 includes a parameter acquisition module 410, a morphology evaluation module 420, a necessity determination module 430, and a gold plating control module 440.

[0168] The parameter acquisition module 410 is used to acquire, in response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness.

[0169] The morphological evaluation module 420 is used to determine the first morphological complexity of the gold-plated area based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area.

[0170] The necessity determination module 430 is used to determine the necessity of the pictogram plate based on the first electroplating unevenness of the gold-plated area and the first morphological complexity of the gold-plated area; the necessity of the pictogram plate is the necessity of using the pictogram plate when performing gold plating operation on a connector of the target connector type.

[0171] The gold plating control module 440 is used to perform gold plating operation on the connector of the target connector type through the pictogram when the pictogram necessity degree is greater than the preset necessity degree threshold.

[0172] In the connector local gold plating control system provided in this embodiment of the invention, firstly, the plating thickness values, concave areas, and first electroplating unevenness of multiple detection points in the gold plating area of ​​the first connector are acquired, enabling a comprehensive understanding of the current plating thickness distribution and overall unevenness of the gold plating area. Next, based on this information, a first morphological complexity is determined, allowing for precise control of the morphological characteristics of the gold plating area. Then, the necessity of the shaped plate is determined based on the first electroplating unevenness and the first morphological complexity, enabling a scientific assessment of the necessity of using the shaped plate. When the necessity of the shaped plate exceeds a preset threshold, the gold plating operation is performed using the shaped plate. Because the shaped plate better conforms to the shape of the gold plating area, the gold plating process can be dynamically adjusted according to the actual situation, thereby more precisely controlling the gold plating parameters. This effectively compensates for the inflexibility of traditional fixed modes, significantly improving the accuracy of gold plating control and meeting the requirements for high-quality gold plating effects.

[0173] Based on the connector local gold plating control method provided by this invention, correspondingly, this invention also provides specific embodiments of connector local gold plating control equipment.

[0174] Figure 5 A schematic diagram of the hardware structure of the connector partial gold plating control device provided in an embodiment of the present invention is shown.

[0175] The connector local gold plating control device may include a processor 501 and a memory 502 storing computer program instructions.

[0176] Specifically, the processor 501 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement embodiments of the present invention.

[0177] Memory 502 may include mass storage for data or instructions. For example, and not limitingly, memory 502 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 502 may include removable or non-removable (or fixed) media. Where appropriate, memory 502 may be internal to an integrated gateway disaster recovery device. In a particular embodiment, memory 502 is non-volatile solid-state memory.

[0178] The processor 501 reads and executes computer program instructions stored in the memory 502 to implement any of the connector local gold plating control methods in the above embodiments.

[0179] In one example, the connector local gold plating control device may further include a communication interface 503 and a bus 510. Wherein, as Figure 4 As shown, the processor 501, memory 502, and communication interface 503 are connected through bus 510 and complete communication with each other.

[0180] The communication interface 503 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of the present invention.

[0181] Bus 510 includes hardware, software, or both, that couples components of a connector-partially gold-plated control device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 510 may include one or more buses. While specific buses are described and illustrated in embodiments of the invention, the invention contemplates any suitable bus or interconnect.

[0182] It should be noted that the order of the above embodiments of the present invention is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. The processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0183] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

Claims

1. A method for controlling partial gold plating of a connector, characterized by, The method includes: In response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area are obtained; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness. Based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area, the first morphological complexity of the gold-plated area is determined. Based on the first electroplating unevenness and the first morphological complexity of the gold-plated area, the necessity of the pictographic plate is determined, including: dividing the first morphological complexity of the gold-plated area by the maximum morphological complexity of the target historical connector to obtain a first morphological complexity ratio; the target historical connector is a historical connector of the target connector type; normalizing the product of the first morphological complexity ratio and the first electroplating unevenness to obtain the necessity of the pictographic plate; the necessity of the pictographic plate is the necessity of using a pictographic plate when performing gold plating operations on a connector of the target connector type. In response to the fact that the necessity of the pictogram is greater than a preset necessity threshold, a gold plating operation is performed on the connector of the target connector type through the pictogram.

2. The connector partial gold plating control method according to claim 1, characterized by, The determination of the first morphological complexity of the gold-plated area based on the plating thickness values ​​at multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area includes: Clustering the multiple detection points in the gold-plated area of ​​the first connector yields at least one gold-plated cluster. Based on the detection points in each of the gold-plated clusters, the distribution dispersion of each gold-plated cluster is determined; the distribution dispersion is the average of the minimum distances between each detection point and other detection points in the gold-plated cluster. The maximum number of clusters in the gold-plated area of ​​the target historical connector, the maximum depth ratio of the concave area in the gold-plated area of ​​the target historical connector, the current number of clusters in the gold-plated area of ​​the first connector, and the minimum depth ratio and number of concave areas in the gold-plated area of ​​the first connector are obtained; the target historical connector is a historical connector of the target connector type. The first morphological complexity of the gold-plated region is determined based on the difference between the maximum and minimum dispersion in the distribution dispersion of each gold-plated cluster, the difference between the maximum number of clusters and the current number of clusters, the difference between the maximum depth ratio and the minimum depth ratio, and the number of concave regions.

3. The connector partial gold plating control method according to claim 1, characterized by, After the method responds to the fact that the necessity of the pictogram is greater than a preset necessity threshold, and performs a gold plating operation on the connector of the target connector type using the pictogram, the method further includes: Obtain the second electroplating unevenness of the gold-plated area of ​​the second connector; the second connector is a connector of the target connector type for which the gold plating operation is performed by the pictographic plate; In response to the second plating unevenness being greater than the first preset plating unevenness threshold, the original processing control parameters of the connector of the target connector type are adjusted based on the second plating unevenness to obtain the corrected processing control parameters.

4. The connector partial gold plating control method according to claim 3, characterized by, The original processing control parameters include the original average current density, and the corrected processing control parameters include the corrected average current density. The adjustment of the original processing control parameters of the connector of the target connector type based on the second electroplating unevenness to obtain the corrected processing control parameters includes: The ratio of the second electroplating unevenness to the target historical electroplating unevenness is determined as the first correction coefficient; the target historical electroplating unevenness is the maximum value among the historical electroplating unevennesses of the target historical connector, and the target historical connector is a historical connector of the target connector type. The product of the first correction factor and the standard current correction value is determined as the final current correction value; Based on the final current correction value, the original average current density is adjusted to obtain the corrected average current density.

5. The connector partial gold plating control method according to claim 4, characterized by, The original processing control parameters include the original stirring intensity, and the modified processing control parameters include the modified stirring intensity. The step of adjusting the original processing control parameters of the connector of the target connector type based on the second electroplating unevenness to obtain the corrected processing control parameters further includes: The second morphological complexity ratio is obtained by dividing the second morphological complexity of the gold-plated area of ​​the second connector by the maximum morphological complexity of the target historical connector; the target historical connector is a historical connector of the target connector type. The second correction coefficient is determined based on the second morphological complexity ratio, the current density difference between the maximum average current density of the target historical connector and the corrected average current density; The product of the second correction factor and the standard stirring intensity correction value is determined as the final stirring intensity correction value; Based on the final stirring intensity correction value, the original stirring intensity is adjusted to obtain the corrected stirring intensity.

6. The connector local gold plating control method according to claim 3, characterized in that, In response to the second plating unevenness being greater than a first preset plating unevenness threshold, after adjusting the original processing control parameters of the connector of the target connector type based on the second plating unevenness to obtain the corrected processing control parameters, the method further includes: Obtain the third electroplating unevenness of the gold-plated area of ​​the third connector; the third connector is a connector of the target connector type for which the gold plating operation is performed based on the modified processing control parameters; In response to the third plating unevenness being greater than the second preset plating unevenness threshold, the original pulse off duration of the connector of the target connector type is adjusted to obtain a corrected pulse off duration until the preset correction condition is met.

7. The connector local gold plating control method according to claim 6, characterized in that, The adjustment of the original pulse-off duration of the connector of the target connector type to obtain the corrected pulse-off duration includes: Obtain the fourth plating unevenness of the gold-plated area of ​​the third connector before the s-th adjustment pulse off duration, and the fifth plating unevenness of the gold-plated area of ​​the third connector after the s-th adjustment pulse off duration; s is a positive integer; Based on the fourth electroplating unevenness, the fifth electroplating unevenness, and the duration adjustment of the s-th adjustment pulse duration, a third correction coefficient is determined. The product of the third correction coefficient and the standard pulse off duration correction value is determined as the final pulse off duration correction value; Based on the final pulse off duration correction value, the pulse off duration after the s-th adjustment of the pulse off duration is adjusted to obtain the pulse off duration after the (s+1)-th adjustment of the pulse off duration.

8. A connector local gold plating control system, characterized in that, The system includes: The parameter acquisition module is used to acquire, in response to performing a gold plating operation on a first connector of the target connector type, the plating thickness values ​​of multiple detection points in the gold plating area of ​​the first connector, the concave area of ​​the gold plating area, and the first electroplating unevenness of the gold plating area; the first connector is any connector of the target connector type, and the first electroplating unevenness is the sum of the absolute values ​​of the differences between the plating thickness values ​​of each detection point in the gold plating area of ​​the first connector and the average plating thickness. The morphological evaluation module is used to determine the first morphological complexity of the gold-plated area based on the plating thickness values ​​of multiple detection points in the gold-plated area of ​​the first connector and the concave area of ​​the gold-plated area. The necessity determination module is used to determine the necessity of the pictographic plate based on the first electroplating unevenness and the first morphological complexity of the gold-plated area, including: dividing the first morphological complexity of the gold-plated area by the maximum morphological complexity of the target historical connector to obtain a first morphological complexity ratio; the target historical connector is a historical connector of the target connector type; normalizing the product of the first morphological complexity ratio and the first electroplating unevenness to obtain the pictographic plate necessity; the pictographic plate necessity is the necessity of using the pictographic plate when performing gold plating operation on the connector of the target connector type. The gold plating control module is used to perform a gold plating operation on the connector of the target connector type through the pictogram when the necessity of the pictogram exceeds a preset necessity threshold.

9. A connector local gold plating control device, comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the connector local gold plating control method according to any one of claims 1 to 7.

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