Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment structures. The electronic equipment comprises a battery cover, a circuit board, a loudspeaker, a heat insulation layer and a heat conduction layer, the battery cover and the circuit board are arranged in a stacked mode, the loudspeaker is arranged on the side, facing the battery cover, of the circuit board, the heat insulation layer is arranged between the loudspeaker and the circuit board in a clamped mode, and the heat conduction layer is arranged between the loudspeaker and the battery cover. The heat conduction layer is arranged corresponding to a first area of the battery cover, and the first area comprises a projection area of the loudspeaker on the battery cover.

Description

Technical Field

[0001] This application belongs to the field of electronic device structure technology, and specifically relates to an electronic device. Background Technology

[0002] As consumers' demand for longer battery life in mobile phones and other electronic devices grows stronger, the battery capacity of electronic devices continues to increase. However, electronic devices also need to accommodate other components such as speakers, circuit boards, and antennas, making the space for battery placement very limited.

[0003] In related technologies, in order to improve battery layout space, the speaker in electronic devices is changed from a broken board solution to a frame board solution. The broken board solution involves making a hole in the circuit board and placing the speaker in the hole; while the frame board solution places the speaker on one side of the circuit board. In this case, the other side of the circuit board opposite the speaker can be used to deploy electronic components, thereby increasing the area and space available for component placement on the circuit board, reducing the overall space occupied by the circuit board, and improving the battery layout space within a given size of electronic device.

[0004] However, in the rack-mount solution, the distance between the speaker and the battery cover of the electronic device is closer. On the one hand, when the speaker plays audio at a high volume, it will generate a lot of heat due to the long-term operation of the high current. Since the speaker is close to the inside of the battery cover, a lot of heat will spread to the surface of the battery cover, causing the surface temperature of the battery cover to rise. On the other hand, when the electronic device is working under high load, the heat generated by the heat-generating components on the circuit board will spread through the circuit board to the speaker, and then to the back of the battery cover, causing the surface temperature of the battery cover to rise.

[0005] This shows that, in related technologies, there is a defect in the area of ​​the battery cover of electronic devices corresponding to the speaker that suffers from severe localized overheating. Summary of the Invention

[0006] The purpose of this application is to provide an electronic device that can solve the problem of severe localized overheating in the area corresponding to the speaker on the battery cover of electronic devices in related technologies.

[0007] This application provides an electronic device, which includes: a battery cover, a circuit board, a speaker, a heat insulation layer, and a heat-conducting layer; The battery cover and the circuit board are stacked together. The speaker is located on the side of the circuit board facing the battery cover. The heat insulation layer is sandwiched between the speaker and the circuit board. The heat-conducting layer is located between the speaker and the battery cover. The heat-conducting layer is correspondingly located to a first area of ​​the battery cover. The first area includes the projection area of ​​the speaker on the battery cover.

[0008] In this embodiment, on the one hand, by sandwiching a heat insulation layer between the speaker and the circuit board, the heat generated by the components on the circuit board can be reduced from being transferred to the speaker, and the heat generated by the components near the circuit board can be reduced from being transferred to the speaker through the circuit board, thereby reducing the overall heat of the speaker and alleviating the localized overheating problem in the area of ​​the battery cover corresponding to the speaker. On the other hand, by providing a heat-conducting layer in the first area of ​​the battery cover corresponding to the speaker, the heat conduction speed at the location of the speaker can be accelerated, so that the heat in the area of ​​the battery cover corresponding to the speaker is evenly distributed, thereby further alleviating the localized overheating problem in the area of ​​the battery cover corresponding to the speaker. Attached Figure Description

[0009] Figure 1 This is a schematic diagram showing the positional relationship between the speaker, NFC coil, and camera decorative ring in a speaker bracket solution used in related technologies. Figure 2 yes Figure 1 A cross-section along the AA direction and a schematic diagram of heat conduction; Figure 3 This is a schematic diagram of the circuit board facing the battery cover side in some embodiments of this application; Figure 4 yes Figure 3 A cross-sectional view of the electronic device shown along the BB direction; Figure 5 yes Figure 4 A magnified view of a portion of region C in the middle; Figure 6 This is a schematic diagram of the circuit board bracket facing the battery cover side in some embodiments of this application; Figure 7 This is a schematic diagram showing the positional relationship of the speaker, NFC coil, and camera decorative ring in some embodiments of this application; Figure 8 yes Figure 7 Cross-sectional view along the DD direction; Figure 9 yes Figure 7 A cross-sectional view of the electronic device shown along the EE direction; Figure 10 This is a schematic diagram of the circuit board; Figure 11 yes Figure 10 Cross-sectional view along the FF direction. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] In related technologies, there are speaker board breaking solutions and speaker board mounting solutions.

[0013] In the speaker-breaking-the-board solution, a hole needs to be made in the circuit board, and the speaker is placed in the hole. The bracketed-board solution, on the other hand, places the speaker on one side of the circuit board. In this case, the opposite side of the circuit board can be used to deploy electronic components, thus increasing the area and space available for component placement on the circuit board, reducing the overall space occupied by the circuit board, and improving the battery layout space within a given electronic device size. However, the bracketed-board solution, due to the small distance between the speaker and the battery cover, suffers from severe localized heat generation by the speaker, resulting in localized hot spots on the battery cover corresponding to the speaker location.

[0014] In this embodiment, on the one hand, by sandwiching a heat insulation layer between the speaker and the circuit board, the heat generated by the components on the circuit board can be reduced from being transferred to the speaker, and the heat generated by the components near the circuit board can be reduced from being transferred to the speaker through the circuit board. This reduces the overall heat of the speaker and alleviates the localized overheating problem in the area of ​​the battery cover corresponding to the speaker. On the other hand, by providing a heat-conducting layer in the first area of ​​the battery cover corresponding to the speaker, the heat conduction speed at the location of the speaker can be accelerated, so that the heat in the area of ​​the battery cover corresponding to the speaker is evenly distributed, thereby further alleviating the localized overheating problem in the area of ​​the battery cover corresponding to the speaker.

[0015] It is worth noting that in some embodiments, the electronic device in this application embodiment can be a mobile phone, the speaker can be the upper speaker inside the mobile phone, and the circuit board can be the main circuit board located near the top of the mobile phone. In other embodiments, the speaker in this application embodiment can also be the lower speaker, and the circuit board can be the auxiliary circuit board located near the bottom of the mobile phone.

[0016] Of course, the electronic device in this application embodiment can be other electronic devices besides mobile phones, such as tablet computers, laptops, handheld computers, in-vehicle electronic devices, mobile internet devices (MID), augmented reality (AR) / virtual reality (VR) devices, robots, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not impose specific limitations. In this case, the positions of the speaker and circuit board in this application embodiment can also change accordingly with the change in the type and structure of the electronic device. For ease of explanation, this application embodiment uses a mobile phone as the electronic device, the upper speaker inside the mobile phone as the speaker, and the main circuit board inside the mobile phone as the example for illustration, without imposing specific limitations.

[0017] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0018] See Figure 3 , Figure 4 and Figure 5 An electronic device provided in this application includes: Battery cover 1, circuit board 2, speaker 3, heat insulation layer 4, and heat-conducting layer 5; The battery cover 1 and the circuit board 2 are stacked together. The speaker 3 is located on the side of the circuit board 2 facing the battery cover 1. The heat insulation layer 4 is sandwiched between the speaker 3 and the circuit board 2. The heat conduction layer 5 is located between the speaker 3 and the battery cover 1. The heat conduction layer 5 is correspondingly located to the first area of ​​the battery cover 1. The first area includes the projection area of ​​the speaker 3 on the battery cover 1.

[0019] In some embodiments, the heat insulation layer 4 may be a material layer with heat insulation properties, such as an aerogel layer, used to reduce the heat conduction efficiency between the circuit board 2 and the speaker 3 distributed on opposite sides of the heat insulation layer 4.

[0020] In some embodiments, the thermally conductive layer 5 may be a material layer with highly efficient thermal conductivity, such as pyrolytic graphite sheet (PGS), to improve the thermal conductivity of the components covered by the thermally conductive layer 5, including the speaker 3.

[0021] In some embodiments, the heat-conducting layer 5 is disposed corresponding to the first area of ​​the battery cover 1, or the heat-conducting layer 5 may be attached to the first area of ​​the battery cover 1.

[0022] In other embodiments, the heat-conducting layer 5 is spaced apart from and directly opposite the first region of the battery cover 1.

[0023] For example, if the electronic device also includes a motherboard bracket 10, the motherboard bracket 10 is disposed between the circuit board 2 and the battery cover 1. In this case, the heat-conducting layer 5 can be attached to the surface of the motherboard bracket 10 facing the battery cover 1, and the projection area of ​​the heat-conducting layer 5 on the battery cover 1 includes the first area.

[0024] For example, the heat-conducting layer 5 can be used to cover the area of ​​the speaker 3 facing the battery cover 1.

[0025] In some embodiments, in addition to the projection area of ​​the speaker 3 on the battery cover 1, the first region may also include other regions, such as the projection area of ​​the battery on the battery cover 1. In other words, the heat-conducting layer 5 can cover the area where the speaker 3 is located, and at the same time, the heat-conducting layer 5 extends to the battery compartment area. In this way, when the speaker 3 has a high temperature, the heat-conducting layer 5 can quickly transfer the high heat of the area where the speaker 3 is located to the lower temperature battery compartment area, thereby reducing the overall temperature of the area where the speaker 3 is located and reducing the local heat generation formed by the speaker 3 on the battery cover 1.

[0026] In this embodiment, on the one hand, by sandwiching a heat insulation layer 4 between the speaker 3 and the circuit board 2, the heat generated by the components on the circuit board 2 can be reduced from being transferred to the speaker 3, and the heat generated by the components near the circuit board 2 can be reduced from being transferred to the speaker 3 through the circuit board 2, thereby reducing the overall heat of the speaker 3 and alleviating the local heating problem in the area corresponding to the speaker 3 on the battery cover 1; on the other hand, by providing a heat-conducting layer 5 in the first area corresponding to the speaker 3 on the battery cover 1, the heat conduction speed at the location of the speaker 3 can be accelerated, so that the heat in the area corresponding to the speaker 3 on the battery cover 1 is evenly distributed, thereby further alleviating the local heating problem in the area corresponding to the speaker 3 on the battery cover 1.

[0027] In some implementations, such as Figure 7 As shown, the electronic device provided in this application embodiment also includes: a metal frame 6, a near field communication (NFC) coil 7, and an NFC radio frequency circuit; A metal frame 6 surrounds the periphery of the battery cover 1. The NFC radio frequency circuit is located on the circuit board 2. The NFC coil 7 is stacked on the second area of ​​the circuit board 2. The second area does not overlap with the area where the speaker 3 is located. The first segment 61 of the metal frame 6 is electrically connected to the NFC radio frequency circuit, and the NFC coil 7 is electrically connected to the NFC radio frequency circuit. The NFC radio frequency circuit implements near-field communication functionality based on the first segment 61 and the NFC coil 7, respectively.

[0028] It should be noted that the NFC radio frequency circuit is implemented through the circuit traces in the circuit board 2. The structure and working principle of the NFC radio frequency circuit are the same as those of the NFC radio frequency circuit in related technologies. The difference is that the NFC radio frequency circuit in this embodiment is also electrically connected to the first segment 61. The structure and working principle of the NFC radio frequency circuit will not be described in detail here.

[0029] In some implementations, the first segment 61 may be a segment of the metal frame 6 facing the top of the electronic device, which may be the top of the electronic device where the speaker 3 is located. In this case, when the top of the electronic device in this embodiment of the application approaches the NFC antenna of another near-field communication device, the near-field communication function can be triggered. For example, taking the electronic device provided in this embodiment of the application as a mobile phone, when the tops of two mobile phones touch, the "one-touch transfer" function can be triggered.

[0030] Of course, besides the top edge of the electronic device, the first segment 61 can be a segment at other locations on the metal frame 6, such as a segment of the metal frame 6 facing the left side of the electronic device, a segment of the metal frame 6 facing the right side of the electronic device, or a segment of the metal frame 6 facing the bottom of the electronic device. For ease of explanation, this embodiment uses the example of the first segment 61 being a segment of the metal frame 6 facing the top of the electronic device, which does not constitute a specific limitation.

[0031] In some embodiments, the second region may include the area of ​​the circuit board 2 located on the side of the speaker 3 opposite to the first segment 61, such as... Figure 6 As shown, the second region may include the area of ​​the circuit board 2 located below the speaker 3.

[0032] In some embodiments, the second region may include a region parallel to the speaker 3 along the extending direction of the first segment 61, such as... Figure 7 As shown, the second area may include the area of ​​the circuit board 2 located at the lower left corner of the speaker 3, that is, the area covered by the camera decorative ring 9.

[0033] It is worth noting that in related technologies, the NFC coil extends to the speaker surface facing the battery cover, for example: Figure 1 and Figure 2Taking a mobile phone as an example in the related technology, the motherboard 101 and the first motherboard bracket 301 are stacked and spaced apart from each other. A first NFC coil 302 is disposed on the first motherboard bracket 301. Furthermore, for the sake of the phone's distinctive appearance, a metal first camera decorative ring 303 is disposed at the rear camera position. This first camera decorative ring 303 can be recessed into the first motherboard bracket 301, forming a concave floating texture, enhancing the phone's unique appearance. The frame and central area of ​​the first camera decorative ring 303 are made of metal, which provides shielding against signal radiation. In related technologies, to improve the layout space and radiation performance of the first NFC coil 302, the first NFC coil 302 and the first camera decorative ring 303 are staggered in the plane of the first battery cover 304. However, due to the size requirements of the phone, the first NFC coil 302 can only be placed in the area including the first speaker 102. This results in the first NFC coil 302 reducing the distance between the first speaker 102 and the first battery cover 304. This reduced distance will, on the one hand, exacerbate the heat generated by the first speaker 102, leading to localized hot spots on the surface of the first battery cover 304. On the other hand, due to the small distance between the first battery cover 304 and the first speaker 102, the adhesive-coated structure 305 around the first speaker 102 needs to protrude towards the first motherboard bracket 301 to form the acoustic cavity structure of the first speaker 102. This protrusion of the adhesive-coated structure 305 will also create localized hot spots on the surface of the first battery cover 304.

[0034] In this embodiment, the NFC coil in the speaker 3 area is removed, thus reducing the effective area of ​​the NFC coil. To improve the radiation performance of the NFC antenna, the first segment 61 of the metal frame 6 is reused for short-range communication. For example, in related technologies, touching the tops of two mobile phones together can trigger the "one-touch transfer" function for data transmission between the phones. In this embodiment, based on the electrical connection between the NFC radio frequency circuit and the first segment 61 at the top of the mobile phone, NFC communication can be performed using the first segment 61. This makes the NFC communication function unaffected by the reduced area of ​​the NFC coil 7 and the absence of the speaker 3 area near the top of the mobile phone.

[0035] Optionally, the area of ​​NFC coil 7 is less than or equal to 700 mm². 2 .

[0036] In related technologies, to meet the requirements of NFC communication, the area of ​​the NFC coil is typically greater than 700 mm². 2 and less than or equal to 1000 mm 2 In this embodiment, the area of ​​the NFC coil can be less than or equal to 700 mm². 2Furthermore, by reusing the first segment 61 of the metal frame 6, complete short-range communication functionality can be achieved. For example, in related technologies, touching the tops of two mobile phones together can trigger the "one-touch transfer" function for data transmission between the phones.

[0037] In some embodiments, the electronic device in this application further includes a first radio frequency circuit and an antenna switch; The first end of the antenna switch is electrically connected to the first segment 61, the second end of the antenna switch is electrically connected to the first radio frequency circuit, and the third end of the antenna switch is electrically connected to the NFC radio frequency circuit. When the electronic device activates the target NFC function, the first terminal of the antenna switch is connected to the third terminal of the antenna switch; when the electronic device does not activate the target NFC function, the first terminal of the antenna switch is connected to the second terminal of the antenna switch. The target NFC function is a short-range data transmission function triggered by the proximity of the electronic device to an external NFC communication device, such as the "one-touch transfer" function.

[0038] In this embodiment, the first segment 61 can be reused as the radiator of the frame antenna on the electronic device, and the first segment 61 can be used for short-range communication or for frame antenna communication by means of an antenna switch, which can save space on the electronic device for laying out the frame antenna.

[0039] As an optional implementation method, such as Figure 7 and Figure 8 As shown, the electronic device in this embodiment further includes: a battery protection board 8; The battery protection board 8 is arranged side by side with the circuit board 2. The third region of the battery protection board 8 is recessed in the direction away from the battery cover 1 to form a recessed portion 81. The NFC coil 7 extends from the edge of the circuit board 2 to the battery protection board 8 and is stacked on the recessed portion 81. The third region includes the edge region of the battery protection board 8 adjacent to the circuit board 2.

[0040] In some embodiments, the NFC coil 7 is located on the side of the speaker 3 facing the battery protection plate 8, so that the NFC coil 7 can extend from the edge of the circuit board 2 to the recess 81 on the battery protection plate 8 without passing through the area where the speaker 3 is located.

[0041] In this embodiment, the layout space of the NFC coil 7 can be increased by utilizing the third region on the battery protection board 8, and the third region is recessed in the direction away from the battery cover 1 to form a recessed portion 81. In this way, when the NFC coil 7 is stacked on the recessed portion 81, the surface of the NFC coil 7 facing the battery cover 1 and the surface of the battery protection board 8 facing the battery cover 1 can be flush. Thus, without increasing the overall thickness of the electronic device or changing the structure of the battery cover 1, the area of ​​the NFC coil 7 is increased, thereby improving the NFC communication performance of the electronic device.

[0042] As an optional implementation method, such as Figure 9 As shown, the electronic device in this embodiment of the application further includes: a camera decorative ring 9; At least a portion of the camera decorative ring 9 is disposed on the exposed surface of the battery cover 1, and the camera decorative ring 9 and the NFC coil 7 are at least partially stacked; The camera decorative ring 9 includes an annular metal ring 91 and an insulating element 92, with the annular metal ring 91 surrounding the insulating element 92.

[0043] In some implementations, the camera decorative ring 9 can be located between the first segment 61 and the second region, so that the NFC coil 7 can extend through the area below the camera decorative ring 9 toward the first segment 61, which is beneficial to improving the communication performance of the NFC communication function implemented based on the first segment 61 and the NFC coil 7.

[0044] In this embodiment, only the frame of the camera decorative ring 9, i.e., the annular metal ring 91, is made of metal; the insulating part 92 inside the frame, i.e., the decorative panel, is made of insulating material. In this way, the camera decorative ring 9 and at least part of the NFC coil 7 can be stacked. For example, the NFC coil 7 can cover the area directly opposite the insulating part 92. Since the insulating part 92 is made of insulating material, it will not shield the NFC coil 7. Thus, without interfering with NFC communication, the area of ​​the NFC coil 7 can be increased by utilizing the layout space of the camera decorative ring 9, thereby improving NFC communication performance.

[0045] In some embodiments, the exposed surface of the insulating element 92 is provided with a recessed texture.

[0046] In some embodiments, the recessed texture on the insulating element 92 can be manufactured using a mold.

[0047] In this embodiment, the concave texture of the exposed surface of the insulating member 92 can simulate the concave floating texture effect of the metal camera decoration in the related art, thereby enhancing the distinctiveness of the electronic device's appearance.

[0048] As an optional implementation method, such as Figure 4 , Figure 6and Figure 7 As shown, the electronic device in this embodiment of the application further includes: a motherboard bracket 10 and a glue-pulling structure 11; The motherboard bracket 10 is located on the side of the speaker 3 away from the circuit board 2, and is spaced apart from the speaker 3; The adhesive-coated structure 11 is wrapped around the periphery of the speaker 3. The surface of the adhesive-coated structure 11 facing the battery cover 1 is a planar structure, and the distance between the adhesive-coated structure 11 and the battery cover 1 is greater than or equal to the distance between the speaker 3 and the battery cover 1.

[0049] It is worth mentioning that in related technologies, such as Figure 1 and Figure 2 As shown, due to the small distance between the first battery cover 304 and the first speaker 102, the adhesive structure around the first speaker 102 needs to protrude towards the first motherboard bracket 301 to form the sound cavity structure of the first speaker 102. The protrusion of this adhesive structure will also form local hot spots on the surface of the first battery cover 304.

[0050] In this embodiment, the NFC coil 7 and the speaker 3 are misaligned on the plane of the battery cover 1, which increases the gap between the speaker 3 and the battery cover 1. This allows the adhesive-pull structure 11 to be flattened, making the distance between the adhesive-pull structure 11 and the battery cover 1 greater than or equal to the distance between the speaker 3 and the battery cover 1. This reduces the heat generation of local hot spots formed on the surface of the battery cover 1 by the adhesive-pull structure.

[0051] In some embodiments, the thermally conductive layer 5 is attached to the surface of the motherboard bracket 10 facing the battery cover 1.

[0052] In other embodiments, the thermal conductive layer 5 is attached to the surface of the battery cover 1 facing the motherboard bracket 10.

[0053] In this embodiment, the heat-conducting layer 5 is disposed between the motherboard bracket 10 and the battery cover 1. The heat conduction characteristics of the heat-conducting layer 5 can be used to balance the heat in the area covered by the heat-conducting layer 5, thereby reducing local hot spots on the battery cover 1.

[0054] In some embodiments, the heat-conducting layer 5 can extend beyond the first region, such as from the first region facing the speaker 3 to other regions facing the battery. In this way, the heat absorbed from the speaker 3 can be evenly transferred to other regions with lower temperatures, thereby reducing the temperature of the first region.

[0055] In some implementations, such as Figure 10 and Figure 11 As shown, the fourth region 21 of the circuit board 2 is not covered with green oil and surface metal, and the speaker 3 is located in the fourth region 21.

[0056] In this embodiment, by removing the green oil and surface metal from the fourth region 21 of the circuit board 2, a recess can be formed in the fourth region 21. The speaker 3 is placed in the recess, which can further increase the distance between the speaker 3 and the battery cover 1, thereby facilitating the reduction of the heat conduction efficiency between the speaker 3 and the battery cover 1. In the embodiment where the adhesive-stretching structure 11 is flattened, sufficient space can be provided to flatten the adhesive-stretching structure 11, and the distance between the adhesive-stretching structure 11 and the battery cover 1 is greater than or equal to the distance between the speaker 3 and the battery cover 1.

[0057] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0058] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: Battery cover, circuit board, speaker, insulation layer, and thermal conductive layer; The battery cover and the circuit board are stacked together. The speaker is located on the side of the circuit board facing the battery cover. The heat insulation layer is sandwiched between the speaker and the circuit board. The heat-conducting layer is located between the speaker and the battery cover. The heat-conducting layer is correspondingly located to a first area of ​​the battery cover. The first area includes the projection area of ​​the speaker on the battery cover.

2. The electronic device according to claim 1, characterized in that, Also includes: Metal frame, NFC coil and NFC radio frequency circuit; The metal frame surrounds the periphery of the battery cover, the NFC radio frequency circuit is disposed on the circuit board, the NFC coil is stacked with the second area of ​​the circuit board, and the second area does not overlap with the area where the speaker is located; The first segment of the metal frame is electrically connected to the NFC radio frequency circuit, and the NFC coil is electrically connected to the NFC radio frequency circuit; The NFC radio frequency circuit implements near-field communication functionality based on the first segment and the NFC coil, respectively.

3. The electronic device according to claim 2, characterized in that, Also includes: Camera decorative ring; At least a portion of the camera decorative ring is disposed on the exposed surface of the battery cover, and the camera decorative ring is at least partially stacked with the NFC coil; The camera decorative ring includes an annular metal ring and an insulating component, with the annular metal ring surrounding the insulating component.

4. The electronic device according to claim 3, characterized in that, The exposed surface of the insulating component is provided with a concave texture.

5. The electronic device according to any one of claims 2 to 4, characterized in that, The area of ​​the NFC coil is less than or equal to 700 mm². 2 .

6. The electronic device according to claim 1, characterized in that, It also includes: motherboard bracket and adhesive bonding structure; The motherboard bracket is located on the side of the speaker away from the circuit board and is spaced apart from the speaker; The adhesive-coated structure is wrapped around the periphery of the speaker. The surface of the adhesive-coated structure facing the battery cover is a planar structure, and the distance between the adhesive-coated structure and the battery cover is greater than or equal to the distance between the speaker and the battery cover.

7. The electronic device according to claim 6, characterized in that, The thermal conductive layer is attached to the surface of the motherboard bracket facing the battery cover, or the thermal conductive layer is attached to the surface of the battery cover facing the motherboard bracket.

8. The electronic device according to claim 1, characterized in that, The fourth region of the circuit board is not covered with green oil and surface metal, and the speaker is located in the fourth region.

9. The electronic device according to any one of claims 2 to 5, characterized in that, Also includes: Battery protection board; The battery protection board is arranged side by side with the circuit board. A third region of the battery protection board is recessed in the direction away from the battery cover to form a recessed portion. The NFC coil extends from the edge of the circuit board to the battery protection board and is stacked on the recessed portion. The third region includes the edge region of the battery protection board adjacent to the circuit board.

10. The electronic device according to any one of claims 2 to 5, characterized in that, It also includes a first radio frequency circuit and an antenna switch; The first terminal of the antenna switch is electrically connected to the first segment, the second terminal of the antenna switch is electrically connected to the first radio frequency circuit, and the third terminal of the antenna switch is electrically connected to the NFC radio frequency circuit. When the electronic device activates the target NFC function, the first terminal of the antenna switch is connected to the third terminal of the antenna switch; when the electronic device does not activate the target NFC function, the first terminal of the antenna switch is connected to the second terminal of the antenna switch. The target NFC function is a near-field data transmission function triggered based on the proximity of the electronic device to an external NFC communication device.

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