Heating substrate and camera module including the same

Abstract

The present disclosure relates to a heating substrate comprising a heating layer; the first insulating layer is arranged on the first surface of the heating layer; and a first outer layer disposed on the first insulating layer and having a roughness greater than a roughness of the first insulating layer. The present disclosure also relates to a camera module comprising the heated substrate.

Description

Technical Field

[0001] This disclosure relates to a heating substrate (or heating element) and a camera module including the heating substrate. Background Technology

[0002] Ultra-compact cameras are widely used in vehicles. For example, they can be used in dashcams for vehicle protection or to collect objective data in traffic accidents, in rear-view cameras that allow drivers to monitor blind spots behind the vehicle to ensure safety when reversing, and in perimeter detection cameras that can monitor the environment around the vehicle.

[0003] Because camera modules used in vehicles may be exposed to the external environment, it may be necessary to use, for example, a heated substrate to remove ice, frost, etc. from the lens. The insulating material on the surface of the heated substrate may have a smooth characteristic, which may cause the substrate to separate from the lens barrel or housing when the substrate is placed on the camera module used in the vehicle.

[0004] The above information is presented as background information and is intended only to aid in understanding this disclosure. No determination is made, and no assertion is made, regarding whether any of the above content is applicable to the prior art relative to this disclosure. Summary of the Invention

[0005] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0006] In one general aspect, the heating substrate includes: a heating layer; a first insulating layer disposed on a first surface of the heating layer; and a first outer layer disposed on the first insulating layer and having a roughness greater than that of the first insulating layer.

[0007] The heating substrate may further include: a second insulating layer disposed on a second surface of the heating layer facing the first surface; and a second outer layer disposed on the second insulating layer and having a roughness greater than that of the second insulating layer.

[0008] The first outer layer can have an embossed pattern.

[0009] The heating layer may include a conductive metallic material.

[0010] Conductive metallic materials may include any one or any combination of two or more of stainless steel, copper, and aluminum.

[0011] The first insulating layer may include polyimide.

[0012] In another general aspect, the camera module includes: a substrate on which an image sensor is mounted; a connecting member connected to the substrate; and a heating substrate connected to the connecting member and configured to transfer heat to a lens barrel, wherein the heating substrate includes: a heating layer; a first insulating layer disposed on a first surface of the heating layer; and a first outer layer disposed on the first insulating layer and having a roughness greater than that of the first insulating layer.

[0013] The heating substrate may further include: a second insulating layer disposed on a second surface of the heating layer facing the first surface; and a second outer layer disposed on the second insulating layer and having a roughness greater than that of the second insulating layer.

[0014] The first outer layer can have an embossed pattern.

[0015] The heating layer may include a conductive metallic material.

[0016] The first insulating layer may include polyimide.

[0017] The camera module may also include a housing that accommodates a substrate, wherein the connecting member has a portion that contacts the inner wall of the housing.

[0018] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description

[0019] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment.

[0020] Figure 2 This is an exploded perspective view of the camera module according to the implementation method.

[0021] Figure 3 It is shown Figure 2 A cross-sectional view of a portion of the shell.

[0022] Figure 4 It is shown Figure 3 A view of the heating substrate and connecting components.

[0023] Figure 5 It shows along Figure 4 An example view of a cross section taken by the V-V' line.

[0024] Figure 6 It shows along Figure 4 Another example view of the cross section taken by the V-V' line.

[0025] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0026] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0027] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.

[0028] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.

[0029] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.

[0030] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0031] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.

[0032] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0033] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0034] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.

[0035] It should be noted that in this document, the word “may” is used relative to “example”, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0036] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.

[0037] In the following text, the optical axis can be set as the central axis of the lens, perpendicular to the lens surface, and the direction of the optical axis can be parallel to the central axis. In the accompanying drawings, the optical axis can be set as the Z-axis, and the X-axis and Y-axis can be set in directions perpendicular to the optical axis. In this case, the X-axis and Y-axis can be perpendicular to each other, and the XY plane formed by the X-axis and Y-axis can be a plane perpendicular to the optical axis.

[0038] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment. Figure 2 This is an exploded perspective view of the camera module according to the implementation method.

[0039] Reference Figure 1 and Figure 2 According to this embodiment, the camera module 10 may include a lens barrel 100, a housing 200, a heat insulation component 500, a heating substrate (or heat-generating substrate) 300, a connecting component 400, a substrate 600, and an image sensor 610.

[0040] The lens barrel 100 can be disposed at the housing 200. At least a portion of the lens barrel 100 can be accommodated in the housing 200. At least a portion of the lens barrel 100 can be inserted into an opening in the housing 200, and at least a portion of the lens barrel 100 can be disposed above the housing 200.

[0041] The diameter of the upper part of the lens barrel 100 may differ from the diameter of the lower part of the lens barrel 100. That is, the width of the upper part of the lens barrel 100, measured in a direction perpendicular to the optical axis, may differ from the width of the lower part of the lens barrel 100, measured in a direction perpendicular to the optical axis. The diameter of the upper part of the lens barrel 100 may be larger than the diameter of the lower part of the lens barrel 100. A step difference may be formed between the upper and lower parts of the lens barrel 100, and a first surface 100a, serving as the surface of the step difference, may be provided between the upper and lower parts of the lens barrel 100. The first surface 100a may be perpendicular to the optical axis. The first surface 100a may be supported by the housing 200.

[0042] For example, the lens barrel 100 can be threaded to the inner circumferential surface of the housing 200. Corresponding threads can be formed on the outer circumferential surface of the lens barrel 100 and the inner circumferential surface of the housing 200, respectively.

[0043] The lens barrel 100 can accommodate at least one lens. Each lens in the lens barrel 100 can be made of synthetic resin, glass, quartz, or the like. However, the material of the lens is not limited to these.

[0044] Figure 3 It is shown Figure 2 A cross-sectional view of a portion of the shell. Figure 4 It is shown Figure 3 A view of the heating substrate and connecting components.

[0045] Reference Figure 2 and Figure 3 The camera module 10 may include a housing 200. The housing 200 may form the exterior of the camera module 10. The lens barrel 100, the substrate 600, and the connecting member 400 may be disposed within the housing 200. The heat insulation member 500 may be disposed on the housing 200.

[0046] The housing 200 may include an upper housing 210 and a lower housing 220. The upper housing 210 may be disposed on the lower housing 220. An opening may be formed in the upper part of the upper housing 210. The lens barrel 100 may be inserted into the opening of the upper housing 210. The inner surface of the upper housing 210 and the lens barrel 100 disposed within the housing 200 may be spaced apart by a predetermined distance. At least a portion of the connecting member 400 may be disposed in the space between the inner surface of the upper housing 210 and the outer surface of the lens barrel 100.

[0047] The lower housing 220 can be disposed below the upper housing 210. The lower housing 220 can be connected to the upper housing 210. The upper housing 210 can be integrally formed with the lower housing 220.

[0048] A heat insulation component 500 may be disposed on the housing 200. A heating substrate 300 may be disposed on the heat insulation component 500. The heat insulation component 500 prevents heat loss by blocking the heat generated by the heating substrate 300 from being transferred to the housing 200. In other words, the heat insulation component 500 can increase the ratio of heat generated by the heating substrate 300 to the lens barrel 100.

[0049] The heat insulation member 500 may be disposed along the circumference of at least a portion of the lens barrel 100. The heat insulation member 500 may be configured to surround at least a portion of the lens barrel 100. The heat insulation member 500 may have a donut shape with a hollow space. The lens barrel 100 may be inserted into this hollow space. The heat insulation member 500 may have a shape corresponding to the shape of the heating substrate 300. Therefore, the contact area between the heat insulation member 500 and the heating substrate 300 can be increased, thereby more effectively blocking the heat generated by the heating substrate 300 from being transferred to the housing 200. However, the shape of the heat insulation member 500 is not limited to this, and the heat insulation member 500 may have any shape corresponding to the heating substrate 300 into which the lens barrel 100 can be inserted.

[0050] The heat insulation member 500 may have a second surface 500a facing the first surface 100a. The heat insulation member 500 may have a shape extending outward from the inserted lens barrel 100 in a direction perpendicular to the optical axis. The second surface 500a may be in a direction perpendicular to the optical axis. The second surface 500a may extend in a direction perpendicular to the optical axis.

[0051] For example, the insulation member 500 can be formed of ceramic, plastic, or silicon-based materials. However, this is just an example, and the material of the insulation member 500 can be any material with a low thermal conductivity. If the insulation member 500 is formed of a material with a low thermal conductivity, it can more effectively block the heat generated by the heating substrate 300 from being transferred to the housing 200.

[0052] A heating substrate 300 can be disposed on a heat-insulating member 500. The heating substrate 300 can be disposed along the circumference of the lens barrel 100. The heating substrate 300 can be disposed around the lens barrel 100. The lens barrel 100, heating substrate 300, heat-insulating member 500, and housing 200 can be arranged sequentially along the optical axis. The heating substrate 300 can have an annular shape. The lens barrel 100 can be inserted into the heating substrate 300. That is, a hollow space can be formed at the heating substrate 300, and the heating substrate 300 can have a shape extending outward from the outer peripheral surface of the lens barrel 100 inserted into the hollow space. The heating substrate 300 can have a shape corresponding to the shape of the heat-insulating member 500. Figures 1 to 4 In the illustration, the heating substrate is shown as having an annular shape, but this disclosure is not limited thereto, and the shape of the heating substrate can be any shape in which an opening is formed for inserting the lens barrel 100.

[0053] The substrate 600 may be disposed within the housing 200. The substrate 600 may be disposed below the lens barrel 100. The substrate 600 may include a printed circuit board (PCB), such as a flexible printed circuit board (FPCB). The substrate 600 may be coupled to the connecting member 400. The substrate 600 may be electrically connected to the connecting member 400.

[0054] The substrate 600 can be secured to the interior of the housing 200 using a fixing member 601. The fixing member 601 can penetrate the substrate 600. For example, the fixing member 601 can be in the shape of a screw.

[0055] Image sensor 610 may be disposed within housing 200. Image sensor 610 may be mounted on substrate 600. Image sensor 610 may be electrically connected to substrate 600. Image sensor 610 may be disposed on the front or top surface of substrate 600. For example, surface mount technology (SMT) can be used to mount image sensor 610 to substrate 600. As another example, flip chip technology can be used to mount image sensor 610 to substrate 600. Image sensor 610 may be aligned parallel to lens barrel 100 in the direction of the optical axis.

[0056] Reference Figure 2 , Figure 3 and Figure 4 The heating substrate 300 may have a third surface 300a and a fourth surface 300b, which face opposite directions relative to the optical axis. The third surface 300a may face the surface of the step difference in the lens barrel 100. The third surface 300a may contact the surface of the step difference. The fourth surface 300b may face the second surface 500a of the heat insulation member 500. The fourth surface 300b may contact the upper surface of the heat insulation member 500.

[0057] The heating substrate 300 can be joined (or adhered) to a surface of the lens barrel 100 via an adhesive member (not shown). The heating substrate 300 can be joined to a first surface 100a of the lens barrel 100 via an adhesive member. The third surface 300a of the heating substrate 300 can be joined to the first surface 100a of the lens barrel 100 via an adhesive member. The heating substrate 300 can be joined to a heat insulation member 500 via an adhesive member. The heating substrate 300 can be joined to a second surface 500a of the heat insulation member 500 via an adhesive member. The fourth surface 300b of the heating substrate 300 can be joined to the second surface 500a of the heat insulation member 500 via an adhesive member.

[0058] The heating substrate 300 may have an annular shape. That is, the heating substrate 300 may have an O-shaped or a donut-shaped shape. However, the shape of the heating substrate 300 is not limited to this shape, and the shape of the heating substrate 300 may be any shape in which an opening is formed for inserting the lens barrel 100.

[0059] The connecting member 400 can be electrically connected to the heating substrate 300. The connecting member 400 can be connected to the substrate 600. The connecting member 400 can be electrically connected to the substrate 600. The connecting member 400 can be connected to a power source disposed on the substrate 600. The connecting member 400 can electrically connect the heating substrate 300 to the substrate 600.

[0060] The connecting member 400 can be connected to the heating substrate 300 from the inside. The connecting member 400 can be connected to the heating substrate 300 through a portion of the heating substrate 300 having a hollow space. The connecting member 400 may have a portion extending from the heating substrate 300 along the optical axis. The connecting member 400 may have a portion disposed within the internal space of the heat insulation member 500. The connecting member 400 may have a portion disposed within the internal space of the housing 200. The connecting member 400 can extend from the heating substrate 300 toward the substrate 600 along the internal spaces of the heat insulation member 500 and the housing 200. The connecting member 400 can be connected to an edge portion of the substrate 600. The connecting member 400 may have at least a bent shape. The bent shape of the connecting member 400 may correspond to the shape of the housing 200. The connecting member 400 may have a portion contacting the inner wall of the housing 200.

[0061] The camera module 10 may include a connector (not shown). The connector may be located at the housing 200. The connector may be coupled to the substrate 600. The connector may be electrically connected to the substrate 600. The connector may supply external power to the camera module 10.

[0062] exist Figures 1 to 3 In this diagram, the heating substrate 300 and the heat insulation member 500 are shown as being disposed outside the housing 200, but this disclosure is not limited thereto. The heating substrate 300 and the heat insulation member 500 may also be disposed inside the housing 200. For example, the heat insulation member 500 may be inserted into the housing 200 through an opening in the housing 200 to house it within the housing 200. The heating substrate 300 may be inserted into the housing 200 through an opening in the housing 200 to house it within the housing 200. The heating substrate 300 may be disposed on the second surface 500a of the heat insulation member 500 located within the housing 200.

[0063] Figure 5 It shows along Figure 4 An example view of a cross section taken by the V-V' line. Figure 6 It shows along Figure 4 Another example view of the cross section taken by the V-V' line.

[0064] Reference Figure 5 and Figure 6 The heating substrate 300 may include a heating layer 310, a first insulating layer 330a, a second insulating layer 330b, a first outer layer 350a, and a second outer layer 350b.

[0065] Heating layer 310 can receive current from substrate 600 to dissipate heat. Heating layer 310 can be electrically connected to connecting member 400. Heating layer 310 can receive current from substrate 600 through connecting member 400. Heating layer 310 can convert the received current into heat energy. Heating layer 310 can directly generate heat using current and discharge the heat to the surrounding environment. Heating layer 310 can include a conductive metallic material. For example, heating layer 310 can include at least one of stainless steel (SUS), copper (Cu), and aluminum (Al). However, the material of heating layer 310 is not limited to these, and the material of heating layer 310 can be any material that generates heat when current is supplied.

[0066] The first insulating layer 330a and the second insulating layer 330b may each be disposed on one surface and the other surface of the heating layer 310. That is, the heating layer 310 may have a first surface and a second surface facing each other, the first insulating layer 330a may be disposed on the first surface of the heating layer 310, and the second insulating layer 330b may be disposed on the second surface of the heating layer 310. The first insulating layer 330a and the second insulating layer 330b may block the flow of current introduced into the heating layer 310 to the outside. Each of the first insulating layer 330a and the second insulating layer 330b may include an insulating material. Each of the first insulating layer 330a and the second insulating layer 330b may include a thermosetting resin such as epoxy resin or polyimide. Alternatively, each of the first insulating layer 330a and the second insulating layer 330b may include a thermoplastic resin such as polyethylene (PE), polycarbonate (PC), or polyvinyl chloride (PVC). The heat generated in the heating layer 310 can be released through the first insulating layer 330a and the second insulating layer 330b, and the current introduced into the heating layer 310 can be blocked by the first insulating layer 330a and the second insulating layer 330b. Each of the first insulating layer 330a and the second insulating layer 330b can have a smooth surface.

[0067] A first outer layer 350a may be disposed on a first insulating layer 330a, and a second outer layer 350b may be disposed on a second insulating layer 330b. The first outer layer 350a and the second outer layer 350b may each have a roughness higher than that of the first insulating layer 330a and the second insulating layer 330b, respectively. The surface of the first outer layer 350a may be a portion attached to the lens barrel 100 by an adhesive. Because the first outer layer 350a, having a roughness higher than that of the first insulating layer 330a, is disposed on the first insulating layer 330a, the connection force between the heating substrate 300 and the lens barrel 100 can be enhanced. The surface of the second outer layer 350b may be a portion attached to the second surface 500a of the heat insulation member 500 using an adhesive. Because the second outer layer 350b, having a roughness higher than that of the second insulating layer 330b, is disposed below the second insulating layer 330b, the connection force between the heating substrate 300 and the heat insulation member 500 can be enhanced. The fact that each of the first outer layer 350a and the second outer layer 350b has roughness can mean that each of the first outer layer 350a and the second outer layer 350b has a pattern that protrudes at predetermined intervals.

[0068] For example, refer to Figure 5 The roughness of the first outer layer 350a can mean that multiple protrusions are formed on the surface of the first outer layer 350a. The protrusions can have a columnar shape, or a shape in which their width gradually increases towards the first insulating layer 330a. The roughness of the second outer layer 350b can mean that multiple protrusions are formed on the surface of the second outer layer 350b. The protrusions can have a columnar shape, or a shape in which their width gradually increases towards the second insulating layer 330b. The multiple protrusions can be arranged at regular intervals, such that the protrusions are regularly arranged. A plane parallel to the surface of the first insulating layer 330a can be disposed between the protrusions.

[0069] As another example, see Figure 6 Each of the first outer layer 351a and the second outer layer 351b, which has roughness, can have an embossed form or shape. That is, the fact that each of the first outer layer 351a and the second outer layer 351b has roughness can mean that embossing is formed on the surface of each of the first outer layer 351a and the surface of the second outer layer 351b. Embossing can be raised, arc-shaped protrusions. Embossing can mean regularly arranged raised arc-shaped shapes. The raised arc-shaped shapes can be arranged continuously without interruption. Alternatively, the raised arc-shaped shapes can be arranged at regular intervals. In this case, a plane parallel to the surface of the first insulating layer 330a can be arranged between the raised arc-shaped shapes.

[0070] For example, each of the first outer layer 351a and the second outer layer 351b can be formed using urethane or powder coating. The first outer layer 351a can be formed by coating or spraying urethane or powder coating onto the first insulating layer 330a and then curing the coated or sprayed urethane or powder coating with heat. The second outer layer 351b can be formed by coating or spraying urethane or powder coating under the second insulating layer 330b and then curing the coated or sprayed urethane or powder coating with heat.

[0071] A heating substrate can be attached to the lens barrel to remove ice or frost from the lens. Additionally, the heating substrate can be attached to an insulating component to improve heat transfer efficiency. The heater PCB used as the heating substrate can have insulating layers disposed on one or both surfaces of the heating layer. The insulating layers can be made of a material with low roughness, such as polyimide (PI). This may result in low adhesion between the lens barrel and the heating substrate, as well as low adhesion between the insulating component and the heating substrate.

[0072] According to the camera module disclosed herein, because a layer with high roughness is additionally stacked on the insulating layer of the heating substrate, the adhesion properties of the heating substrate can be improved. Therefore, it is possible to prevent the lens barrel from detaching from the heating substrate or the heat insulation component due to poor adhesion properties.

[0073] One or more embodiments disclose a heating substrate (or heating member) and a camera module including the heating substrate, wherein the heating substrate (or heating member) can prevent the heating substrate from separating from the lens barrel or housing by enhancing adhesive properties.

[0074] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. A heating substrate, comprising: The heating layer is configured to receive current to dissipate heat. A first insulating layer is disposed on the first surface of the heating layer; as well as A first outer layer is disposed on the first insulating layer and has a roughness greater than that of the first insulating layer.

2. The heating substrate according to claim 1, further comprising: A second insulating layer is disposed on the second surface of the heating layer facing the first surface; as well as The second outer layer is disposed on the second insulating layer and has a roughness greater than that of the second insulating layer.

3. The heating substrate according to claim 1, wherein, The first outer layer has an embossed pattern.

4. The heating substrate according to claim 1, wherein, The heating layer comprises a conductive metal material.

5. The heating substrate according to claim 4, wherein, The conductive metal material includes any one or any combination of two or more of stainless steel, copper, and aluminum.

6. The heating substrate according to claim 1, wherein, The first insulating layer comprises polyimide.

7. A camera module, comprising: A substrate on which an image sensor is mounted; Connecting member, connected to the substrate; as well as A heating substrate, connected to the connecting member, and configured to transfer heat to the lens barrel. The heating substrate includes: a heating layer configured to receive current to dissipate heat; a first insulating layer disposed on a first surface of the heating layer; and a first outer layer disposed on the first insulating layer and having a roughness greater than that of the first insulating layer.

8. The camera module according to claim 7, wherein, The heating substrate further includes: a second insulating layer disposed on a second surface of the heating layer facing the first surface; and a second outer layer disposed on the second insulating layer and having a roughness greater than that of the second insulating layer.

9. The camera module according to claim 7, wherein, The first outer layer has an embossed pattern.

10. The camera module according to claim 7, wherein, The heating layer comprises a conductive metal material.

11. The camera module according to claim 7, wherein, The first insulating layer comprises polyimide.

12. The camera module of claim 7, further comprising a housing accommodating the substrate. in, The connecting member has a portion that contacts the inner wall of the housing.

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