Vapor chamber, heat dissipation module and electronic equipment

Abstract

The embodiment of the invention provides a vapor chamber, a heat dissipation module and electronic equipment, relates to the technical field of heat dissipation devices, and aims at solving the problem that the heat dissipation performance of the vapor chamber is poor. The uniform-temperature plate comprises a plate shell and a capillary structure, wherein the plate shell comprises a first cover plate, a second cover plate and a surrounding side plate which surround to form a uniform-temperature cavity; the temperature equalizing cavity comprises a first heat exchange area, a second heat exchange area and a channel area which are arranged on the first cover plate; the surrounding side plates comprise the first side plate and the second side plate which are oppositely arranged on the two sides of the channel area. The capillary structure is arranged on the first cover plate and comprises a first capillary structure and a second capillary structure which are located in the channel area; the first capillary structure and the second capillary structure are connected and are respectively connected with the first side plate and the second side plate; the first capillary structure is in contact with the second cover plate, and the second capillary structure and the second cover plate form a cavity channel; the first capillary structure and the cavity channel are connected with the first heat exchange area and the second heat exchange area respectively. The vapor chamber can be applied to a heat dissipation module.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to a heat dissipation plate, a heat dissipation module and an electronic device. Background Technology

[0002] A vapor chamber (VC) heat exchanger, also known simply as a vapor chamber plate, is a heat dissipation device that utilizes the latent heat transfer zone of the working medium through evaporation and condensation to remove heat. The heat dissipation method employed by vapor chambers offers high efficiency and is therefore widely used in electronic devices with high heat flux densities.

[0003] The related technology provides a heat spreader comprising a lower cover plate, an upper cover plate, and a capillary structure; wherein the upper cover plate and the lower cover plate are fastened together to form a closed heat spreader cavity. The capillary structure is laid on the lower cover plate, forming a vapor chamber between it and the upper cover plate. The heat spreader also includes a working medium stored in the heat spreader cavity.

[0004] During operation, the capillary structure is used to provide the reflux capillary force for the return of the liquid working medium. However, due to the size of the capillary structure in the vapor chamber, the reflux capillary force that the capillary structure can generate is limited, that is, the liquid reflux capacity is limited, which restricts the improvement of the heat dissipation performance of the vapor chamber and makes it difficult to support a high thermal design power (TDP). Summary of the Invention

[0005] This application provides a vapor chamber, a heat dissipation module, and an electronic device to improve the poor heat dissipation performance of vapor chambers in related technologies.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a heat exchange plate, which includes a shell and a capillary structure. The shell includes a first cover plate and a second cover plate disposed opposite to each other in the thickness direction, and a surrounding side plate connecting the first cover plate and the second cover plate. The surrounding side plate, the first cover plate, and the second cover plate surround to form a heat exchange cavity. The heat exchange cavity includes a first heat exchange zone, a second heat exchange zone, and a channel zone arranged on the first cover plate, and the channel zone connects the first heat exchange zone and the second heat exchange zone. The surrounding side plate includes a first side plate and a second side plate disposed opposite to each other on both sides of the first heat exchange zone, the channel zone, and the second heat exchange zone.

[0008] A capillary structure is disposed on the first cover plate, including a first capillary structure and a second capillary structure located in the channel area; the first capillary structure and the second capillary structure are connected and respectively connected to the first side plate and the second side plate; in the thickness direction, the first capillary structure is in contact with the second cover plate, and the second capillary structure and the second cover plate form a cavity channel; the first capillary structure, the second capillary structure and the cavity channel are all connected to the first heat exchange zone and the second heat exchange zone respectively.

[0009] In use, the vapor chamber provided in this embodiment can have a first heat exchange zone used as an evaporation zone and a second heat exchange zone used as a condensation zone. A heat source can be attached to the vapor chamber via a thermal interface material and positioned at the location of the first heat exchange zone. The heat generated by the heat source is transferred to the first heat exchange zone, where the liquid working medium absorbs heat and evaporates, transforming into a gaseous working medium, i.e., high-temperature steam. The high-temperature steam then travels through the cavity channel to the second heat exchange zone, where it exchanges heat with the outside and condenses into a liquid working medium. The first capillary structure generates a backflow capillary force on the liquid working medium generated in the second heat exchange zone, drawing the liquid working medium closer to the first heat exchange zone, thereby forming a stable heat dissipation cycle.

[0010] As can be seen from the above, the heat spreader provided in this application, through the design of a capillary structure, forms a gas channel in the heat spreader cavity for high-temperature steam to be transported from the first heat exchange zone to the second heat exchange zone, and a liquid channel for the liquid working medium to flow back from the second heat exchange zone to the first heat exchange zone. The gas channel is a hollow channel without capillary structures in the channel area. This hollow channel can reduce the diffusion resistance of high-temperature steam from the first heat exchange zone to the second heat exchange zone, reduce the pressure drop during gas operation, and enhance the heat spreader's temperature uniformity. The liquid channel is a capillary channel filled with capillary structures in the channel area. This capillary channel can enhance the liquid's backflow capability, thereby enabling more liquid working medium to be drawn into the first heat exchange zone, which is beneficial for supporting higher thermal design power (TDP).

[0011] In the heat spreader provided in this embodiment, the gas channel (cavity channel) and the liquid channel (first capillary structure) are respectively attached to the side plates (first side plate and second side plate) on both sides of the channel area. This design facilitates the fabrication of the first and second capillary structures, thereby reducing the fabrication difficulty and cost of the heat spreader. Furthermore, compared to a scheme where the liquid channel (first capillary structure) is located in the middle of the gas channel (cavity channel), i.e., the gas channel is divided into two sub-cavity channels located on both sides of the liquid channel, the arrangement of the gas and liquid channels on both sides allows for a gas channel with a larger single gas flow cross-sectional area. This further reduces the diffusion resistance of high-temperature steam from the first heat exchange zone to the second heat exchange zone, further reduces the pressure drop during gas flow, and further enhances the heat spreader's temperature uniformity.

[0012] On the other hand, the gas diffusion in the gas channel and the liquid reflux in the liquid channel do not interfere with each other, forming a stable gas-liquid separation operating architecture. This can improve the independence of the flow of high-temperature steam and liquid working medium in the heat spreader, improve the problem of mutual interference, and thus improve the heat transfer efficiency in the heat spreader, and improve the stability and reliability of the heat spreader during operation.

[0013] In the heat exchanger provided in this application embodiment, the first capillary structure forming the liquid channel is set away from the second heat exchange zone. This design avoids setting an excessively thick capillary structure at the location of the second heat exchange zone, which helps to reduce the thickness of the liquid film in the second heat exchange zone, thereby reducing the heat transfer resistance of high-temperature steam exchanging heat with the outside and improving the overall heat exchange efficiency of the heat exchanger.

[0014] The heat exchange plate provided in this application embodiment can also support heat dissipation from multiple heat sources. That is, in addition to setting a heat source at the location of the first heat exchange zone, a heat source can also be set at the location of the second capillary structure, thereby achieving the purpose of heat dissipation from multiple heat sources.

[0015] In some embodiments, the capillary structure further includes a third capillary structure covering the second heat exchange zone; in the thickness direction, the third capillary structure and the second capillary structure are flush, and the third capillary structure and the second capillary structure are an integral structure. This design facilitates heat exchange between high-temperature steam and the outside environment in the second heat exchange zone, and also facilitates the rapid and efficient extraction of the liquid working medium in the second heat exchange zone; furthermore, it facilitates the fabrication and molding of the third capillary structure and the second capillary structure, reducing the manufacturing difficulty and cost of the heat exchange plate.

[0016] In some embodiments, the second heat exchange zone and the second capillary structure are both disposed between the first capillary structure and the second side plate. This design makes the layout of the first and second capillary structures more conducive to processing and manufacturing, thereby helping to reduce the manufacturing difficulty and cost of the heat exchange plate.

[0017] In some embodiments, the capillary structure further includes a fourth capillary structure covering the first heat exchange zone. The fourth capillary structure is connected to the first and second capillary structures and forms a cavity communicating with the cavity channel with the second cover plate. This design ensures that the liquid working medium can be drawn from the first capillary structure to the first heat exchange zone while improving the overflow capacity of high-temperature steam in the first heat exchange zone, thereby improving the heat exchange efficiency of the heat exchanger.

[0018] In some embodiments, the fourth capillary structure includes a first capillary portion and a second capillary portion. The first capillary portion is disposed on the first cover plate and covers the first heat exchange zone. The first capillary portion is flush with the second capillary structure in the thickness direction. Both the first capillary structure and the second capillary structure are connected to the first capillary portion.

[0019] The second capillary portion is disposed on the side of the first capillary portion away from the first cover plate and is connected to the first capillary structure; the second capillary portion and the second cover plate form a cavity that communicates with the cavity channel.

[0020] In the heat exchange plate provided in this application embodiment, the cavity in the first heat exchange zone that communicates with the cavity channel is located above the first capillary structure, that is, in a position opposite to the cavity channel. This design is beneficial to improving the overflow efficiency of high-temperature steam.

[0021] In some embodiments, the second capillary portion is a comb-like structure, including a plurality of spaced-apart comb teeth, the top of which is away from the first capillary portion and contacts the second cover plate; the spacing between adjacent comb teeth forms a cavity communicating with the cavity channel.

[0022] In the heat exchange plate provided in this application embodiment, the second capillary portion adopts a comb-like structure, which can ensure that the liquid working medium can be drawn from the first capillary structure to the first heat exchange zone, while improving the overflow capacity of high-temperature steam in the first heat exchange zone, thereby improving the heat exchange efficiency of the heat exchange plate; and can also reduce the manufacturing difficulty and manufacturing cost of the heat exchange plate.

[0023] In some embodiments, the second capillary portion covers the first heat exchange zone and includes a first sub-portion and a second sub-portion; the first sub-portion is connected to the first side plate, and the second sub-portion is connected to the end of the first sub-portion near the second side plate.

[0024] In the thickness direction, the first sub-part contacts the second cover plate, and the second sub-part and the second cover plate form a cavity that communicates with the cavity channel.

[0025] In the heat exchange plate provided in this application embodiment, the second capillary portion adopts a stepped structure, which can ensure that the liquid working medium can be drawn from the first capillary structure to the first heat exchange zone, while improving the overflow capacity of high-temperature steam in the first heat exchange zone, thereby improving the heat exchange efficiency of the heat exchange plate; and can also reduce the manufacturing difficulty and manufacturing cost of the heat exchange plate.

[0026] In some embodiments, the capillary structure includes a first capillary layer and a second capillary layer, the first capillary layer covering a first cover plate, and the second capillary layer being disposed on the side of the first capillary layer away from the first cover plate.

[0027] The second capillary layer extends a certain distance from the first side plate toward the second side plate, and extends along the first side plate from the second heat exchange zone to the first heat exchange zone.

[0028] In the thickness direction, the first capillary layer and the second cover plate are spaced apart, and the second capillary layer is in contact with the second cover plate.

[0029] The first capillary structure includes a second capillary layer and a portion of the first capillary layer covered by the second capillary layer; the second capillary structure includes a portion of the first capillary layer located in the channel region and not covered by the second capillary layer.

[0030] In the heat spreader provided in this application embodiment, the capillary structure is formed by layering. This design is beneficial for manufacturing different first capillary structures and second capillary structures, thereby reducing the manufacturing difficulty and cost of the heat spreader.

[0031] In some embodiments, the surrounding side plate further includes a third side plate, which connects the first and second side plates on the outer side of the second heat exchange zone away from the first heat exchange zone; the second capillary layer extends to the position where it contacts the third side plate. This design makes the layout of the second capillary layer more conducive to processing and manufacturing, thereby helping to reduce the manufacturing difficulty and cost of the heat exchange plate.

[0032] In some embodiments, the second capillary layer includes a first subcapillary layer in the channel region and a second subcapillary layer in the first heat exchange region.

[0033] The first sub-capillary layer extends a certain distance from the first side plate toward the second side plate, and extends along the first side plate from the second heat exchange zone to the first heat exchange zone; the first sub-capillary layer is connected to the second sub-capillary layer, one side of the second sub-capillary layer is connected to the first side plate, and extends into the first heat exchange zone.

[0034] In the thickness direction, the first sub-capillary layer contacts the second cover plate, and the second sub-capillary layer and the second cover plate form a cavity that communicates with the cavity channel.

[0035] This design ensures that the liquid working medium can be drawn from the first capillary structure to the first heat exchange zone, while also improving the overflow capacity of high-temperature steam in the first heat exchange zone, thereby improving the heat exchange efficiency of the heat exchange plate; and it can also reduce the manufacturing difficulty and cost of the heat exchange plate.

[0036] In some embodiments, the first capillary layer includes a first region capillary structure and a second region capillary structure connected together. The first region capillary structure is at least partially located in a first heat exchange zone, and the pore size of the first region capillary structure is smaller than that of the second region capillary structure. This design allows the first region capillary structure to provide greater reflux capillary force to support greater liquid reflux capacity; at the same time, it can provide a larger surface area to support faster evaporation of the liquid into gas, thereby helping to support higher thermal design power (TDP).

[0037] In some embodiments, the second capillary layer includes a third capillary region and a fourth capillary region; the third capillary region is closer to the first heat exchange zone than the fourth capillary region; the pore size of the third capillary region is smaller than that of the fourth capillary region. This design allows for reduced liquid reflux resistance through the fourth capillary region and provides greater reflux capillary force through the third capillary region to support greater liquid reflux; it also provides a larger surface area to support liquid evaporation into gas; thus facilitating the support of higher thermal design power (TDP).

[0038] In some embodiments, the pore size of the first capillary layer is larger than that of the second capillary layer. This design allows the second capillary layer to provide greater reflux capillary force to the first capillary structure, supporting greater liquid reflux capacity, which in turn helps to support higher thermal design power (TDP).

[0039] In some embodiments, the heat exchanger further includes an isolation baffle wall disposed in the heat exchange cavity; the isolation baffle wall is located between the first side plate and the second side plate, extending from the first heat exchange zone to the second heat exchange zone; the first capillary structure and the second capillary structure are respectively connected to both sides of the isolation baffle wall; in the thickness direction, the isolation baffle wall is in contact with both the first cover plate and the second cover plate. This design further isolates the gas channel (cavity channel) and the liquid channel (first capillary structure) in the heat exchanger, further improving the independence of the flow of high-temperature steam and liquid working medium in the heat exchanger, mitigating the problem of mutual interference, and thus improving the heat transfer efficiency in the heat exchanger; and improving the stability and reliability of the heat exchanger during operation.

[0040] In some embodiments, the first capillary structure and the first heat exchange zone are located on one side of the isolation barrier; the second capillary structure and the second heat exchange zone are located on the other side of the isolation barrier. This design makes the layout of the first and second capillary structures more conducive to processing and manufacturing, and helps to reduce the manufacturing difficulty and cost of the heat exchange plate.

[0041] In some embodiments, the vapor chamber includes at least two second heat exchange zones and at least two channel zones; the channel zones correspond one-to-one with the second heat exchange zones, and the channel zones connect the first heat exchange zone and the corresponding second heat exchange zone. The vapor chamber provided in this application embodiment can be a single gas channel, a single liquid channel architecture, a dual gas channel, a dual liquid channel architecture, or a multi-gas channel, multi-liquid channel architecture; it can adapt to different heat source distributions and heat dissipation scenarios.

[0042] In some embodiments, the vapor chamber includes two second heat exchange zones and two channel zones; the channel zones correspond one-to-one with the second heat exchange zones, and the channel zones connect the first heat exchange zone and the corresponding second heat exchange zone; the two second heat exchange zones are symmetrically arranged with respect to the first heat exchange zone, and the two channel zones are symmetrically arranged with respect to the first heat exchange zone. This design, while improving heat dissipation performance through a dual-gas-channel and dual-liquid-channel architecture, helps to reduce manufacturing difficulty and cost.

[0043] Secondly, embodiments of this application provide a heat dissipation module, which includes a heat spreader, heat dissipation fins, and a cooling fan as described in any one of the embodiments of the first aspect; wherein the heat dissipation fins are disposed on the heat spreader and located in the second heat exchange zone of the heat spreader. The cooling fan is disposed on the heat spreader and is located on the same side of the heat spreader as the heat dissipation fins; the cooling fan is used to generate a cooling airflow acting on the heat dissipation fins.

[0044] Thirdly, embodiments of this application provide an electronic device, which includes:

[0045] The heat spreader as described in any one of the embodiments of the first aspect, and

[0046] The first heat source is in contact with the structure at the location of the first heat exchange zone in the heat exchange plate;

[0047] Alternatively, as described in any one of the second aspect embodiments, the heat dissipation module includes a vapor chamber; and

[0048] The first heat source is in contact with the structure at the location of the first heat exchange zone in the heat exchange plate.

[0049] In some embodiments, the electronic device further includes a second heat source that is in contact with a structure in the heat spreader that is opposite to the second capillary structure.

[0050] The heat dissipation module and electronic device provided in this application have the same technical effects as those achieved by the heat dissipation plate and heat dissipation module in any of the above embodiments, and will not be described again here. Attached Figure Description

[0051] Figure 1 A front view of a heat spreader provided for related technologies;

[0052] Figure 2 for Figure 1 Cross-sectional view of line A-A';

[0053] Figure 3 A front view of a heat spreader provided in an embodiment of this application;

[0054] Figure 4 for Figure 3 Cross-sectional view of B-B';

[0055] Figure 5 for Figure 4 A structural diagram omitting the capillary structure;

[0056] Figure 6 for Figure 3 Schematic diagram of the partitioning of the heat exchange plate in the heat exchange cavity;

[0057] Figure 7 for Figure 3 A schematic diagram of the intermediate temperature distribution plate after the first cover plate is removed;

[0058] Figure 8 The heat spreader provided in the embodiments of this application is in Figure 7 Cross-sectional view of C-C';

[0059] Figure 9 The heat spreader provided in the embodiments of this application is in Figure 7 Cross-sectional view of D-D';

[0060] Figure 10 This is a schematic diagram of another heat spreader after removing the first cover plate, provided in an embodiment of this application.

[0061] Figure 11 Another heat spreader provided in the embodiments of this application is Figure 10 Cross-sectional view of E-E';

[0062] Figure 12 A diagram showing the relationship between a heat spreader and a heat source provided in an embodiment of this application;

[0063] Figure 13 Another diagram showing the relationship between a heat spreader and a heat source provided in an embodiment of this application;

[0064] Figure 14 Another heat spreader provided in the embodiments of this application is Figure 7 Cross-sectional view of D-D';

[0065] Figure 15 This is a schematic diagram of another heat spreader structure with the first cover plate removed, provided in an embodiment of this application.

[0066] Figure 16 This is a front view of a heat dissipation module provided in an embodiment of this application;

[0067] Figure 17 This is a bottom view of a heat dissipation module provided in an embodiment of this application. Detailed Implementation

[0068] A vapor chamber (VC) heat exchanger, also known simply as a vapor chamber plate, is a heat dissipation device that utilizes the latent heat transfer zone of the working medium through evaporation and condensation to remove heat. The heat dissipation method employed by vapor chambers offers high efficiency and is therefore widely used in electronic devices with high heat flux densities.

[0069] like Figure 1 and Figure 2 As shown, a heat spreader 1 provided by the related technology includes a lower cover plate 102, an upper cover plate 101, and a capillary structure 2; wherein, the upper cover plate 101 and the lower cover plate 102 are fastened together to form a closed heat spreader cavity. The capillary structure 2 is laid on the lower cover plate 102, forming a steam cavity 103 between it and the upper cover plate 101. The heat spreader 1 also includes a working medium stored in the heat spreader cavity.

[0070] During operation, the heat source 100 is fitted against the outer side of the lower cover plate 102 and positioned in the middle of the heat spreader 1. The heat generated by the heat source 100 is transferred to the capillary structure 2 on the lower cover plate 102. The liquid working medium located at the location of the heat source 100 absorbs heat and evaporates, transforming into a gaseous working medium, i.e., high-temperature steam. The high-temperature steam diffuses through the steam chamber 103 to both ends of the heat spreader 1, where it exchanges heat with the outside environment and condenses to form a liquid working medium; thus achieving the purpose of transferring the heat generated by the heat source 100 to the outside. The capillary structure 2 generates a backflow capillary force on the condensed liquid working medium through its own structure, thereby drawing the liquid working medium back to the location of the heat source 100; forming a stable heat dissipation cycle.

[0071] However, due to the limited size of the capillary structure 2 in the vapor chamber 1, the capillary force that the capillary structure 2 can generate is limited, that is, the liquid reflux capability is limited, which restricts the improvement of the heat dissipation performance of the vapor chamber 1 and makes it difficult to support a high thermal design power (TDP).

[0072] Based on this, embodiments of this application provide a heat spreader to improve the above-mentioned problems.

[0073] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them.

[0074] In the following embodiments of this application, the terms "first," "second," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0075] In the embodiments of this application, "upper", "lower", "left" and "right" are not limited to the orientation of the components in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0076] In the embodiments of this application, unless the context otherwise requires, the term "comprising" is interpreted as open and encompassing throughout the specification and claims, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplarily," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0077] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0078] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0079] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on another layer or substrate, or that there is an intermediate layer between the layer or element and another layer or substrate.

[0080] Exemplary embodiments are described in this application with reference to cross-sectional views and / or plan views and / or equivalent circuit diagrams, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0081] This application provides a heat spreader, such as... Figures 3 to 6 As shown, the heat exchanger 1 includes a shell 3, an isolation barrier 7, a capillary structure, and a working medium. The shell 3 is a thin plate structure with a small dimension in the thickness direction Z, including a first cover plate 31, a second cover plate 33, and a surrounding side plate 32. The first cover plate 31 and the second cover plate 33 are arranged opposite each other in the thickness direction Z. One end of the surrounding side plate 32 is connected to the first cover plate 31 in the thickness direction Z, and the other end is connected to the second cover plate 33. Between the first cover plate 31 and the second cover plate 33, the surrounding side plate 32 extends along a closed path to form a closed surrounding structure, which surrounds the area located between the first cover plate 31 and the second cover plate 33. The first cover plate 31, the second cover plate 33, and the surrounding side plate 32 surround and form a heat exchanger cavity 4.

[0082] In this embodiment, as Figure 4 and Figure 5As shown, the second cover plate 33 and the surrounding side plate 32 are an integral structure. The surrounding side plate 32 can be formed by flanging the edge portion of the second cover plate 33; or the second cover plate 33 and the surrounding side plate 32 can be integrally formed by processes such as stamping. The second cover plate 33 and the surrounding side plate 32 are fastened to the first cover plate 31, thereby simplifying the connection process when the first cover plate 31, the second cover plate 33, and the surrounding side plate 32 form the temperature equalization cavity 4.

[0083] In some other embodiments, the first cover plate 31 and the surrounding side plate 32 can be an integral structure. The end structure of the surrounding side plate 32 away from the first cover plate 31 surrounds and forms a shell opening opposite to the first cover plate 31. The second cover plate 33 is connected to the end of the surrounding side plate 32 away from the first cover plate 31 and seals the shell opening. In other embodiments, the surrounding side plate 32 can be divided in the thickness direction Z into a first part side plate integrally formed with the first cover plate 31, and a second part side plate integrally formed with the second cover plate 33. During assembly, the first part side plate and the second part side plate are joined together.

[0084] The housing 3 can be made of a material with good thermal conductivity, such as copper, aluminum, or stainless steel. The shape of the housing 3 can be set according to the actual heat dissipation requirements.

[0085] For ease of description and explanation, this article will... Figure 3 The lateral direction in the middle is defined as the length direction X of the shell 3. Figure 3 The longitudinal direction is defined as the width direction Y of the shell 3. The following description uses the thickness direction Z, length direction X, and width direction Y of the shell 3 as references to illustrate the structure of the heat exchange plate 1.

[0086] In this embodiment, as Figure 3 , Figure 6 and Figure 7 As shown, the shell 3 is a long strip-shaped structure that is wider in the middle and narrower at both ends. The temperature equalization cavity 4 in the shell 3 includes a first heat exchange zone R1 and two second heat exchange zones R2 arranged on the first cover plate 31. The first heat exchange zone R1 is located in the middle of the shell 3 where the width is greater, and the two second heat exchange zones R2 are located at the two ends of the shell 3 where the width is less. That is, the first heat exchange zone R1 and the two second heat exchange zones R2 are distributed at different positions along the length X of the shell 3.

[0087] The temperature equalization cavity 4 in the shell 3 also includes two channel regions R3 arranged on the first cover plate 31. Each channel region R3 corresponds one-to-one with a second heat exchange region R2. Each channel region R3 extends from its corresponding second heat exchange region R2 along the length direction X of the shell 3 to the first heat exchange region R1, connecting the first heat exchange region R1 and the corresponding second heat exchange region R2. The two channel regions R3 can be connected at the location of the first heat exchange region R1. Along the length direction X of the shell 3, the two second heat exchange regions R2 and the two channel regions R3 can be symmetrically arranged relative to the first heat exchange region R1.

[0088] It can be seen that the connection direction (also called the extension direction, arrangement direction, etc.) between the connected first heat exchange zone R1, channel zone R3, and second heat exchange zone R2 is parallel to the length direction X of the shell 3. It should be noted that the length direction X of the shell 3 is related to the connection direction between the first heat exchange zone R1, channel zone R3, and second heat exchange zone R2, as well as the shape of the shell 3. The length direction X of the shell 3 is not limited to a straight line extending along a straight line; it can also be a non-linear direction extending along a curve, broken line, or other non-linear direction. When the length direction X of the shell 3 is a non-linear direction, since the width direction Y of the shell 3 is perpendicular to both the length direction X and the thickness direction Z, the width direction Y of the shell 3 will also change in relation to the length direction X.

[0089] Please continue to refer to this. Figure 6 and Figure 7 In the shell 3 using the above design, the surrounding side plates 32 can be divided into a first side plate 321, a second side plate 322, a third side plate 323, and a fourth side plate 324 according to their different positions. The first side plate 321 and the second side plate 322 are arranged opposite each other in the width direction Y of the shell 3. The first heat exchange zone R1, the two second heat exchange zones R2, and the two channel zones R3 are located between the first side plate 321 and the second side plate 322; that is, the first side plate 321 and the second side plate 322 are arranged opposite each other on both sides of the first heat exchange zone R1, the two second heat exchange zones R2, and the two channel zones R3. The third side plate 323 and the fourth side plate 324 are arranged opposite each other in the length direction X of the shell 3, and are used to connect the first side plate 321 and the second side plate 322 at their respective ends in the length direction X of the shell 3. The first side plate 321, the third side plate 323, the second side plate 322, and the fourth side plate 324 are connected end-to-end to form a closed surrounding structure extending along a closed path. The first side plate 321, the second side plate 322, the third side plate 323, and the fourth side plate 324 can be plate-like structures extending along a straight line, or plate-like structures extending along a curve, a broken line, or any line shape.

[0090] In this embodiment, as Figure 5As shown, the third side plate 323 and the fourth side plate 324 are both plate-like structures extending along a straight line parallel to the width direction Y of the shell 3. The second side plate 322 is a plate-like structure extending along a straight line parallel to the length direction X of the shell 3. The first side plate 321 is a plate-like structure extending along a zigzag line, including a longitudinal side plate portion parallel to the width direction Y of the shell 3 and a transverse side plate portion parallel to the length direction X of the shell 3. In the length direction X of the shell 3, the distance between the first side plate 321 and the second side plate 322 in the middle is greater than the distance between the two ends. This design can form a long strip plate-like structure that is wide in the middle and narrow at both ends.

[0091] The following description will use the structure located between the first heat exchange zone R1 and the third side plate 323 as an example to illustrate the heat exchange plate 1 provided in the embodiments of this application.

[0092] Please continue to refer to this. Figures 4 to 7 The heat exchange plate 1 also includes an isolation barrier 7 disposed in the heat exchange cavity 4. In the width direction Y of the plate shell 3, the isolation barrier 7 is located between the first side plate 321 and the second side plate 322; in the length direction X of the plate shell 3, one end of the isolation barrier 7 contacts the first heat exchange zone R1, and the other end contacts the second heat exchange zone R2; in the thickness direction Z of the plate shell 3, one end of the isolation barrier 7 contacts the first cover plate 31, and the other end contacts the second cover plate 33. The isolation barrier 7 can be a plate-like structure extending along any trajectory.

[0093] The isolation barrier 7, in conjunction with the first side plate 321 and the second side plate 322, divides the channel area R3 into a first sub-channel area R31 and a second sub-channel area R32. The first sub-channel area R31 and the second sub-channel area R32 extend side-by-side within the channel area R3, both connecting to the first heat exchange area R1 and the second heat exchange area R2. In the width direction Y of the shell 3, the outer sides of the first sub-channel area R31 and the second sub-channel area R32, which are far apart from each other, contact the first side plate 321 and the second side plate 322, respectively. The inner sides of the first sub-channel area R31 and the first sub-channel area R32, which are close to each other, contact the isolation barrier 7. The outer shape of the first sub-channel area R31 matches the first side plate 321, and the outer shape of the second sub-channel area R32 matches the second side plate 322; the inner shapes of the first sub-channel area R31 and the second sub-channel area R32 match the isolation barrier 7.

[0094] In this embodiment, as Figure 6 and Figure 7As shown, the shell 3 is a long strip-shaped structure that is wider in the middle and narrower at both ends. The first heat exchange zone R1 is located in the middle of the shell 3, where the width is greater. The first heat exchange zone R1 includes a first side and a second side that are arranged opposite each other in the width direction Y of the shell 3; and a third side and a fourth side that are arranged opposite each other in the length direction X of the shell 3. The first side is in contact with the first side plate 321, and the second side is opposite to the second side plate 322 and has a certain gap, which is called the first gap area. The third side is closer to the third side plate 323 than the fourth side. The first side plate 321 includes a longitudinal side plate portion that is opposite to the third side and has a certain gap.

[0095] Along the length direction X of the shell 3, the isolation barrier 7 extends to a position flush with the second side of the first heat exchange zone R1 and contacts the apex corners of the third and second sides of the first heat exchange zone R1. Along the width direction Y of the shell 3, the first heat exchange zone R1 and the second heat exchange zone R2 are located on opposite sides of the isolation barrier 7. The first sub-channel zone R31 is connected to the third side of the first heat exchange zone R1, thus connecting the first sub-channel zone R31 to the first heat exchange zone R1. The second sub-channel zone R32 includes a first partition area, which is connected to the second side of the first heat exchange zone R1, thus connecting the second sub-channel zone R32 to the first heat exchange zone R1. It can be seen that the first sub-channel zone R31, the second sub-channel zone R32, and the first side plate 321 define the boundary of the first heat exchange zone R1. The position, shape, and size of the first heat exchange zone R1 are influenced by the first sub-channel zone R31, the second sub-channel zone R32, and the first side plate 321.

[0096] Please continue to refer to this. Figure 6 and Figure 7 In this embodiment, the second heat exchange zone R2 is in contact with both the second side plate 322 and the third side plate 323, and has a certain gap from the first side plate 321, which is called the second gap area. The isolation barrier 7 extends to the side of the second heat exchange zone R2 opposite to the first side plate 321, and contacts a portion of that side (i.e., does not extend to the third side plate 323). That is, the second heat exchange zone R2 is located on the side of the isolation barrier 7 away from the first side plate 321, and the second sub-channel zone R32 includes the second gap area. The first sub-channel zone R31 extends between the second heat exchange zone R2 and the first side plate 321 to the third side plate 323. In the width direction Y of the shell 3, the end portion of the first sub-channel zone R31 is opposite to the second heat exchange zone R2 and connected to the (partial) side of the second heat exchange zone R2 near the first side plate 321, so as to achieve the purpose of connecting the first sub-channel zone R31 and the second heat exchange zone R2. The second sub-channel region R32 and the second heat exchange region R2 are connected on the side of the shell 3 in the length direction X, close to the first heat exchange region R1, so as to achieve the purpose of connecting the second sub-channel region R32 and the second heat exchange region R2.

[0097] It can be seen that the first sub-channel region R31, the second sub-channel region R32, the second side plate 322 and the third side plate 323 together define the boundary of the second heat exchange region R2. The position, shape and size of the second heat exchange region R2 are affected by the first sub-channel region R31, the second sub-channel region R32, the second side plate 322 and the third side plate 323.

[0098] In some embodiments, the second heat exchange zone R2 is in contact with both the second side plate 322 and the third side plate 323, and has a second gap region between it and the first side plate 321. The isolation barrier 7 extends to the side of the second heat exchange zone R2 along the length X direction of the shell 3 near the side of the first heat exchange zone R1, and its end contacts that side. In this case, the first sub-channel zone R31 is connected to the side of the second heat exchange zone R2 near the first side plate 321, and also to the side of the second heat exchange zone R2 along the length X direction of the shell 3 near the side of the first heat exchange zone R1; thus achieving the purpose of connecting the first sub-channel zone R31 to the second heat exchange zone R2. The second sub-channel zone R32 is connected to the side of the second heat exchange zone R2 along the length X direction of the shell 3 near the side of the first heat exchange zone R1, thus achieving the purpose of connecting the second sub-channel zone R32 to the second heat exchange zone R2. It can be seen that the first sub-channel region R31, the second sub-channel region R32, the second side plate 322, and the third side plate 323 together define the boundary of the second heat exchange zone R2. The position, shape, and size of the second heat exchange zone R2 are influenced by the first sub-channel region R31, the second sub-channel region R32, the second side plate 322, and the third side plate 323.

[0099] In some embodiments, the second heat exchange zone R2 is in contact with the first side plate 321, the second side plate 322, and the third side plate 323. The isolation barrier 7 extends to the side of the second heat exchange zone R2 along the length X of the shell 3 near the first heat exchange zone R1, and its end contacts that side. In this case, both the first sub-channel zone R31 and the second sub-channel zone R32 are connected to the side of the second heat exchange zone R2 along the length X of the shell 3 near the first heat exchange zone R1, thus achieving the purpose of connecting the first sub-channel zone R31 and the second sub-channel zone R32 to the second heat exchange zone R2. It can be seen that the first sub-channel zone R31, the second sub-channel zone R32, the first side plate 321, the second side plate 322, and the third side plate 323 together define the boundary of the second heat exchange zone R2. The position, shape, and size of the second heat exchange zone R2 are influenced by the first sub-channel zone R31, the second sub-channel zone R32, the first side plate 321, the second side plate 322, and the third side plate 323.

[0100] In some embodiments, the second heat exchange zone R2 may also be spaced apart from the second side plate 322. In this case, the positional relationship between the second heat exchange zone R2, the isolation barrier 7, the first sub-channel zone R31, and the second sub-channel zone R32 can be referred to the description above, and will not be repeated here.

[0101] Please continue to refer to this. Figure 4 , Figure 6 and Figure 7 The heat spreader 1 also includes a capillary structure disposed on the first cover plate 31. The capillary structure is typically a porous structure formed by sintering materials such as metal powder or metal mesh, including multiple densely distributed micro- and nano-pores. The capillary structure has a large surface area for liquid evaporation, which is used to enhance the function of liquid evaporation; it can also generate capillary force to drive the liquid flow.

[0102] like Figure 4 , Figure 6 and Figure 7 As shown, based on their different positions within the temperature equalization cavity 4, the capillary structures can be divided into a first capillary structure 6, a second capillary structure 8, a third capillary structure 10, and a fourth capillary structure 9. The first capillary structure 6 is located in the first sub-channel region R31. In the thickness direction Z of the shell 3, the first capillary structure 6 contacts the second cover plate 33 at its top, away from the first cover plate 31. In the length direction X of the shell 3, the first capillary structure 6 extends along the first side plate 321 from the first heat exchange region R1 to the second heat exchange region R2, connecting the first heat exchange region R1 and the second heat exchange region R2. In the width direction Y of the shell 3, the outer side of the first capillary structure 6 contacts the first side plate 321 and extends from the first side plate 321 towards the second side plate 322, extending to a position where it contacts the second heat exchange region R2 and the isolation barrier 7, including extending to the boundary position between the first sub-channel region R31 and the second sub-channel region R32. As can be seen from the above description, the first capillary structure 6 fills the temperature equalization cavity 4 in the first sub-channel region R31.

[0103] The second capillary structure 8 is located in the second sub-channel region R32. Please also consider... Figure 8 and Figure 9 In the thickness direction Z of the shell 3, the size of the second capillary structure 8 is smaller than that of the first capillary structure 6. That is, the second capillary structure 8 and the second cover plate 33 have a certain dimensional gap. From another perspective, the first capillary structure 6 can be divided into a third capillary portion 61 and a fourth capillary portion 62. In the thickness direction Z of the shell 3, the third capillary portion 61 is flush with the second capillary structure 8, and the fourth capillary portion 62 is located on the side of the third capillary portion 61 away from the first cover plate 31. The third capillary portion 61 in the first capillary structure 6 can be a structure manufactured in the same layer as the second capillary structure 8.

[0104] Along the length direction X of the shell 3, the second capillary structure 8 extends from the first heat exchange zone R1 to the second heat exchange zone R2 along the second side plate 322, connecting the first heat exchange zone R1 and the second heat exchange zone R2. Along the width direction Y of the shell 3, the outer side of the second capillary structure 8 contacts the second side plate 322 and extends from the second side plate 322 to the first side plate 321, extending to a position where it contacts the first heat exchange zone R1 and the isolation barrier 7, including extending to the boundary position between the first sub-channel zone R31 and the second sub-channel zone R32.

[0105] As described above, the second capillary structure 8 does not completely fill the temperature equalization cavity 4 in the second sub-channel region R32. The second capillary structure 8, the isolation barrier 7, the second side plate 322, and the second cover plate 33 surround and form a cavity channel 11. This cavity channel 11 is located in the second sub-channel region R32 and is a cavity structure that can connect the first heat exchange zone R1 and the second heat exchange zone R2. In the width direction Y of the shell 3, the outer side of the cavity channel 11 contacts the second side plate 322, and the inner side contacts the isolation barrier 7. In the length direction X of the shell 3, the two ends of the cavity channel 11 contact the first heat exchange zone R1 and the second heat exchange zone R2, respectively.

[0106] During the fabrication of the heat exchanger 1, the first capillary structure 6 and the second capillary structure 8 can be fabricated as an integral connection first, and then an isolation barrier 7 can be fabricated between the first capillary structure 6 and the second capillary structure 8. In this case, it can be understood that the structure of the first capillary structure 6 and the second capillary structure 8 determines the location of the isolation barrier 7, that is, the boundary between the first sub-channel region R31 and the second sub-channel region R32, and determines the boundary of at least one side of the second heat exchange region R2 and the first heat exchange region R1.

[0107] During the fabrication of the heat exchanger plate 1, the isolation barrier 7 can be fabricated first, followed by the first capillary structure 6 and the second capillary structure 8. In this case, the isolation barrier 7 can be understood as determining the boundary between the first sub-channel region R31 and the second sub-channel region R32, as well as the boundary of at least one side of the second heat exchange region R2 and the first heat exchange region R1.

[0108] Please continue to refer to this. Figures 6 to 9The third capillary structure 10 is located in the second heat exchange zone R2. In the thickness direction Z of the shell 3, the size of the third capillary structure 10 is smaller than that of the first capillary structure 6, meaning that the third capillary structure 10 and the second cover plate 33 have a certain size gap, which forms a first heat exchange cavity communicating with the cavity channel 11. In the width direction Y of the shell 3, the third capillary structure 10 contacts the first capillary structure 6 on the side near the first side plate 321 and contacts the second side plate 322 on the side near the second side plate 322. In the length direction X of the shell 3, one side of the third capillary structure 10 contacts the third side plate 323, and the other side contacts the second capillary structure 8.

[0109] In this embodiment, the third capillary structure 10 and the second capillary structure 8 are flush along the thickness direction Z of the shell 3, and are an integral structure manufactured by the same process. In this case, there is no clear boundary between the second capillary structure 8 and the third capillary structure 10; that is, there is no clear boundary between the second heat exchange zone R2 and the second sub-channel zone R32. The second heat exchange zone R2 is typically located at the end of the shell 3 furthest from the first heat exchange zone R1 along the length direction X. When the heat exchange plate 1 is used, the size of the second heat exchange zone R2 and its boundary position with the second sub-channel zone R32 can be determined according to the actual scenario.

[0110] In some embodiments, the third capillary structure 10 and the second capillary structure 8 can be different capillary structures with structural differences, thereby achieving the boundary between the second heat exchange zone R2 and the second sub-channel zone R32; and different capillary structures can be used to match the requirements of different positions in the uniform temperature cavity 4 for the capillary structure.

[0111] like Figures 6 to 9 As shown, the fourth capillary structure 9 is located in the first heat exchange zone R1. In the thickness direction Z of the shell 3, the fourth capillary structure 9 includes a first capillary portion 91 flush with the second capillary structure 8, and a second capillary portion 92 disposed on the first capillary portion 91. The first capillary portion 91 is connected to both the first capillary structure 6 and the second capillary structure 8, the second capillary portion 92 is connected to the first capillary structure 6, and the second cover plate 33 has a certain gap, which forms a second heat exchange cavity 12 communicating with the cavity channel 11, the second heat exchange cavity 12 being positioned above the second capillary structure 8.

[0112] In this embodiment, as Figures 6 to 9 As shown, the second capillary portion 92 in the fourth capillary structure 9 is a comb-like structure. The second capillary portion 92 includes a plurality of spaced-apart comb teeth, which are connected to the first capillary structure 6 and in contact with the second cover plate 33. The gap between two adjacent comb teeth forms a second heat exchange cavity 12 that communicates with the cavity channel 11.

[0113] In some embodiments, such as Figures 10 to 12 As shown, the second capillary portion 92 in the fourth capillary structure 9 adopts a stepped structure, and both the second capillary portion 92 and the first capillary portion 91 cover the first heat exchange zone R1. In the width direction Y of the shell 3, the first capillary portion 91 includes a first sub-part 921 and a second sub-part 922 arranged therein; the first sub-part 921 is connected to the first side plate 321, and the second sub-part 922 is connected to the first sub-part 921; the second sub-part 922 and the first capillary portion 91 are aligned on the side near the second side plate 322. In the thickness direction Z of the shell 3, the first sub-part 921 contacts the second cover plate 33, and the second sub-part 922 has a certain gap with the second cover plate 33. This gap forms a second heat exchange cavity 12 that communicates with the cavity channel 11. The second heat exchange cavity 12 is located above the second capillary structure 8.

[0114] As can be seen from the above description, the capillary structure in the uniform temperature cavity 4 fills the uniform temperature cavity 4 in the first sub-channel region R31, and forms a cavity channel 11 in the second sub-channel region R32, connecting the first heat exchange region R1 and the second heat exchange region R2. This cavity channel 11 is connected to the second heat exchange region R2 through the first heat exchange cavity, and connected to the first heat exchange region R1 through the second heat exchange cavity 12.

[0115] The capillary structure described above can be achieved through a partitioned approach, where the capillary structure of each part is created separately based on the characteristics of each partition. Alternatively, the capillary structure can be achieved through a layered approach.

[0116] In this embodiment, as Figures 4 to 11 As shown, the capillary structure is fabricated in layers, including a first capillary layer and a second capillary layer. The first capillary layer is fully laid on the first cover plate 31, that is, it is laid in the first heat exchange zone R1, the second heat exchange zone R2, and the channel zone R3 (including the first sub-channel zone R31 and the second sub-channel zone R32). In the thickness direction Z of the shell 3, the first capillary layer and the second cover plate 33 have a certain interval. The portion of the first capillary layer located in the second sub-channel zone R32 is the second capillary structure 8, the portion located in the second heat exchange zone R2 is the third capillary structure 10, the portion located in the first heat exchange zone R1 is the first capillary portion 91 of the fourth capillary structure 9, and the portion located in the first sub-channel zone R31 is the third capillary portion 61 of the first capillary structure 6.

[0117] The second capillary layer is disposed on the first capillary layer, specifically on the side of the first capillary layer away from the first cover plate 31 in the thickness direction Z. The second capillary layer includes a first sub-capillary layer and a second sub-capillary layer. The first sub-capillary layer is disposed in the first sub-channel region R31, and is the fourth capillary portion 62 in the first capillary structure 6. The second sub-capillary layer is disposed in the first heat exchange region R1, and is the second capillary portion 92 in the fourth capillary structure 9. In the thickness direction Z of the shell 3, the first sub-capillary layer contacts the second cover plate 33, and the second sub-capillary layer and the second cover plate 33 form a second heat exchange cavity 12 communicating with the cavity channel 11; the description of the second sub-capillary layer regarding the second capillary portion 92 above is not repeated here.

[0118] The first sub-capillary layer and the second sub-capillary layer in the second capillary layer can be formed by removing material from the portion of the second capillary layer located in the first heat exchange zone R1 after the second capillary layer that can contact the second cover plate 33 is made.

[0119] The first capillary layer and the first subcapillary layer located in the first sub-channel region R31 are the first capillary structure 6; the first capillary layer and the second subcapillary layer located in the first heat exchange region R1 are the fourth capillary structure 9.

[0120] In the above embodiments, the first capillary layer and the second capillary layer can have the same pore size or different pore sizes. When the first capillary layer and the second capillary layer have different pore sizes, the pore size of the second capillary layer is larger than that of the first capillary layer. This design can further enhance the reflux capillary force of the first capillary structure 6 on the liquid working medium (this part can be referred to in the following description).

[0121] The above description uses the structure located between the first heat exchange zone R1 and the third side plate 323 as an example to illustrate the heat exchange plate 1 provided in the embodiments of this application. For the structure located between the first heat exchange zone R1 and the fourth side plate 324, please refer to the above description, which will not be repeated here.

[0122] The heat exchange plate 1 also includes a support column 5 and a working medium disposed in the heat exchange cavity 4. The support column 5 is disposed at a position where there is a cavity between the capillary structure 8 and the second cover plate 33, for example, between the second capillary structure 8 and the second cover plate 33; or for example, between the second capillary section 92 with a stepped design and the second cover plate 33. By providing the support column 5, the support between the capillary structure and the second cover plate 33 can be increased, thereby increasing the overall rigidity of the heat exchange plate 1.

[0123] The working medium in the heat spreader 1 is stored in the heat spreader cavity 4. The working medium in the heat spreader cavity 4 is a fluid medium that can undergo a phase change when the temperature changes, and heat transfer is achieved through the phase change of the fluid medium. The working medium can be water or methanol, etc.

[0124] In this embodiment of the application, the heat exchange plate 1, located in the middle of the shell 3, can be used as an evaporation zone, and the two second heat exchange zones R2 located at both ends of the shell 3 can be used as condensation zones. Figure 12 As shown, the heat source 100 can be bonded to the heat exchanger 1 via a thermal interface material and positioned at the location of the first heat exchange zone R1. The operation of the heat exchanger 1 is illustrated below:

[0125] The heat generated by heat source 100 is transferred to the capillary structure in the first heat exchange zone R1, namely the fourth capillary structure 9. When the temperature of the fourth capillary structure 9 rises, the liquid working medium in the first heat exchange zone R1 absorbs heat and evaporates, transforming into a gaseous working medium, namely high-temperature steam; thus achieving the purpose of transferring the heat generated by heat source 100 to the working medium. The high-temperature steam diffuses into the cavity channel 11 through the second heat exchange cavity 12 in the fourth capillary structure 9, and then reaches the first heat exchange cavity in the second heat exchange zone R2 through the cavity channel 11. The high-temperature steam exchanges heat with the outside in the second heat exchange zone R2, condensing into a liquid working medium, thereby achieving the purpose of transferring the heat in the high-temperature steam to the outside for heat dissipation.

[0126] Since the first capillary structure 6 fills the temperature equalization cavity 4 at the first sub-channel region R31, while the second capillary structure 8 does not fill the temperature equalization cavity 4, the first capillary structure 6 can generate a greater backflow capillary force on the liquid working medium generated in the second heat exchange zone R2 compared to the second capillary structure 8. This allows the liquid working medium to be drawn to a position close to the first heat exchange zone R1 through the first capillary structure 6. Then, the fourth capillary structure 9 is used to allow the liquid working medium to flow back to the first heat exchange zone R1, where it continues to absorb the heat generated by the heat source 100, thus forming a stable heat dissipation cycle.

[0127] As can be seen from the above, the heat spreader 1 provided in this embodiment of the application, through the design of a capillary structure, forms a gas channel in the heat spreader cavity 4 for high-temperature steam to be transferred from the first heat exchange zone R1 to the second heat exchange zone R2, and a liquid channel for the liquid working medium to flow back from the second heat exchange zone R2 to the first heat exchange zone R1. The gas channel is located in the first sub-channel region R31 and is a cavity channel 11 without a capillary structure. This cavity channel 11 can reduce the diffusion resistance of high-temperature steam from the first heat exchange zone R1 to the second heat exchange zone R2, reduce the pressure drop during gas operation, and enhance the heat spreader 1's temperature uniformity. The liquid channel is located in the second sub-channel region R32 and is a capillary channel filled with a capillary structure. This capillary channel can enhance the liquid's reflux capability, thereby enabling more liquid working medium to be drawn into the first heat exchange zone R1, which is beneficial for supporting higher thermal design power (TDP).

[0128] In the heat spreader 1 provided in this embodiment, the gas channel (cavity channel 11) and the liquid channel (first capillary structure 6) are respectively attached to the side plates (first side plate 321 and second side plate 322) on both sides of the channel region R3. This design facilitates the fabrication of the first capillary structure 6 and the second capillary structure 8, thereby reducing the fabrication difficulty and cost of the heat spreader 1. On the other hand, compared to the scheme where the liquid channel (first capillary structure 6) is located in the middle of the gas channel (cavity channel 11), that is, the gas channel is divided into two sub-cavity channels 11 located on both sides of the liquid channel, the arrangement of the gas channel and the liquid channel on both sides can obtain a gas channel with a larger single gas flow cross-sectional area, which helps to further reduce the diffusion resistance of high-temperature steam from the first heat exchange zone R1 to the second heat exchange zone R2, further reduce the pressure drop during gas operation, and further enhance the heat spreader 1's temperature uniformity.

[0129] On the other hand, the gas diffusion in the gas channel and the liquid reflux in the liquid channel do not interfere with each other, forming a stable gas-liquid separation operating architecture. This can improve the independence of the flow of high-temperature steam and liquid working medium in the heat spreader 1, improve the problem of mutual influence, and thus improve the heat transfer efficiency in the heat spreader 1; and improve the stability and reliability of the heat spreader 1 during operation.

[0130] In the heat exchange plate 1 provided in this application embodiment, the first capillary structure 6 forming the liquid channel is set away from the second heat exchange zone R2. This design can avoid setting an excessively thick capillary structure at the location of the second heat exchange zone R2, which is beneficial to reduce the thickness of the liquid film in the second heat exchange zone R2, thereby reducing the heat transfer resistance of high temperature steam to exchange heat with the outside and improving the overall heat exchange efficiency of the heat exchange plate 1.

[0131] The heat spreader 1 provided in this embodiment can also support heat dissipation from multiple heat sources, such as... Figure 13 As shown, for example, a heat source can be set at the location R32 in the second sub-channel area. For ease of distinction, the heat source set at the location of the first heat exchange area R1 is referred to as the first heat source 110, and the heat source set in the second sub-channel area R32 is referred to as the second heat source 120. One, two, or more second heat sources 120 can be set. The heat dissipation process of the heat exchanger 1 for the first heat source 110 can be referred to the description above, and will not be repeated here. The heat dissipation process of the heat exchanger 1 for the second heat source 120 is illustrated below:

[0132] The heat generated by the second heat source 120 can be transferred to the second capillary structure 8. The liquid working medium absorbs heat and evaporates at the location of the second heat source 120, transforming into high-temperature steam. This high-temperature steam can enter the cavity channel 11 and then be transferred to the second heat exchange zone R2 through the cavity channel 11. The first capillary structure 6 in the second sub-channel zone R32 can also draw the liquid working medium in the second heat exchange zone R2 to the location of the second heat source 120 through its own reflux capillary force, thereby forming a stable heat dissipation cycle.

[0133] As can be seen from the above description, the backflow capillary force generated by the first capillary structure 6 is less than the backflow capillary force generated by the second capillary structure 8; therefore, the heat dissipation capacity of the heat spreader 1 for the second heat source 120 is weaker than that for the first heat source 110. That is, the first heat source 110 is usually the main heat source 100, and the second heat source 120 is usually the small heat source 100.

[0134] This application also provides a heat spreader 1, such as... Figure 14 As shown, the difference between this heat exchanger 1 and the heat exchanger 1 described above is that the first capillary layer 13 includes a first region capillary structure 131 and a second region capillary structure 132 connected together. The first region capillary structure 131 is at least partially located in the first heat exchange zone R1, and the pore size of the first region capillary structure 131 is smaller than that of the second region capillary structure 132. This design allows the first region capillary structure 131 to provide greater reflux capillary force to support greater liquid reflux capacity; at the same time, it can provide a larger surface area to support faster evaporation of liquid into gas; thus, it is beneficial to support higher thermal design power (TDP).

[0135] This application also provides a heat spreader 1, such as... Figure 15 As shown, the difference between this heat exchanger 1 and the heat exchanger 1 described above is that the second capillary layer 14 includes a third capillary structure 141 and a fourth capillary structure 142; the third capillary structure 141 is closer to the first heat exchange zone R1 than the fourth capillary structure 142; the pore size of the third capillary structure 141 is smaller than that of the fourth capillary structure 142. This design reduces liquid reflux resistance through the fourth capillary structure 142 and provides greater reflux capillary force through the third capillary structure 141 to support greater liquid reflux; it also provides a larger surface area to support liquid evaporation into gas; thus, it is beneficial to support higher thermal design power (TDP).

[0136] In some embodiments, the heat spreader 1 may not have an isolation barrier 7, that is, the first sub-channel region R31 and the second sub-channel region R32 are distinguished by the difference in capillary structure. This design simplifies the structure and manufacturing process of the heat spreader 1 while still achieving the above-mentioned technical effects.

[0137] In the above embodiments, the heat exchanger 1 adopts a dual-gas-channel and dual-liquid-channel architecture, namely, it includes a first heat exchange zone R1, two second heat exchange zones R2, and two channel zones R3; however, the heat exchanger 1 provided in this application embodiment is not limited to this. For example, the heat exchanger 1 may include only one second heat exchange zone R2 and one channel zone R3, that is, it adopts a single-gas-channel and single-liquid-channel architecture, or it may include multiple second heat exchange zones R2 and multiple channel zones R3, that is, it adopts a multi-gas-channel and multi-liquid-channel architecture.

[0138] This application also provides a heat dissipation module, such as... Figure 16 and Figure 17 As shown, the heat dissipation module 200 includes a heat spreader 1, heat dissipation fins 220, and a cooling fan 210; wherein, the heat spreader 1 is the heat spreader 1 provided in the above embodiment. The heat dissipation fins 220 are disposed on one side of the heat spreader 1 and are located at the position of the second heat exchange zone R2. The heat dissipation fins 220 can be fixed to the heat spreader 1 by welding or other means. The cooling fan 210 is disposed on the same side of the heat spreader 1 as the heat dissipation fins 220, and the air outlet is positioned directly opposite the channel of the heat dissipation fins 220; it is used to provide airflow for cooling the heat dissipation fins 220. The cooling fan 210 can be connected to the heat spreader 1 by locking or other means.

[0139] For example, such as Figure 16 and Figure 17 As shown, in the heat dissipation module 200, the vapor chamber 1 adopts a dual gas channel and dual liquid channel architecture as an example, and the shell 3 in the vapor chamber 1 is a long strip-shaped structure that is wider in the middle and narrower at both ends; the vapor chamber 4 in the shell 3 includes a first heat exchange zone R1 and two second heat exchange zones R2; wherein, the first heat exchange zone R1 is located in the middle position of the shell 3 with a larger width, and the two second heat exchange zones R2 are located at the two ends of the shell 3 with a smaller width. Two sets of heat dissipation fins 220 are provided, respectively located at the positions of the second heat exchange zones R2 at both ends of the vapor chamber 1. Two cooling fans 210 are provided corresponding to the heat dissipation fins 220, providing heat dissipation airflow to the corresponding heat dissipation fins 220.

[0140] In the heat dissipation module 200 provided in this application embodiment, the heat dissipation fins 220 and the cooling fan 210 can improve the heat exchange capability between the heat exchange plate 1 and the outside world, and accelerate the process of high temperature vapor in the heat exchange plate 1 transferring heat to the outside and condensing into liquid; which is beneficial to supporting higher thermal design power (TDP).

[0141] In the heat dissipation module 200 provided in this embodiment, the heat dissipation fins 220 are disposed at the location of the second heat exchange zone R2, while the first capillary structure 6 in the heat exchange plate 1 is disposed away from the second heat exchange zone R2; thus, it can be seen that the placement positions of the heat dissipation fins 220 and the placement positions of the first capillary structure 6 do not coincide. This design helps to reduce the thickness of the liquid film in the second heat exchange zone R2, thereby reducing the thermal resistance of heat exchange between high-temperature steam and the outside, and improving the overall heat exchange efficiency of the heat exchange plate 1.

[0142] This application also provides an electronic device, which can be a mobile phone, tablet computer, laptop computer, projection device, laser, lighting device, or vehicle power device, etc. The above-mentioned electronic devices all include heat sources that generate heat during operation, such as the system on chip (SOC) in mobile phones and tablet computers, the central processing unit (CPU) and graphics processing unit (GPU) in laptop computers, the light source in projection devices, lasers and lighting devices, etc., and the inverter in vehicle power devices, etc.

[0143] The electronic device also includes a heat dissipation device for dissipating heat from the aforementioned heat source. This heat dissipation device can be the vapor chamber and heat dissipation module provided in the above embodiments. For example, in electronic devices with small internal space and low heat dissipation requirements, such as mobile phones and tablets, a vapor chamber can be used as the heat dissipation device; in electronic devices with large internal space and high heat dissipation requirements, such as laptops, a heat dissipation module can be used as the heat dissipation device.

[0144] The technical effects achievable by the electronic device provided in this application embodiment are the same as those achievable by the heat dissipation module and the heat vapor chamber in any of the above embodiments, and will not be repeated here.

[0145] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat spreader, characterized in that, The temperature distribution plate includes: A shell, comprising a first cover plate and a second cover plate disposed opposite to each other in the thickness direction, and an enclosing side plate connecting the first cover plate and the second cover plate; the enclosing side plate, the first cover plate, and the second cover plate enclose a uniform temperature cavity; the uniform temperature cavity includes a first heat exchange zone, a second heat exchange zone, and a channel zone arranged on the first cover plate, the channel zone connecting the first heat exchange zone and the second heat exchange zone; the enclosing side plate includes a first side plate and a second side plate disposed opposite to each other on both sides of the first heat exchange zone, the channel zone, and the second heat exchange zone; and A capillary structure is disposed on the first cover plate, comprising a first capillary structure and a second capillary structure located in the channel region; the first capillary structure and the second capillary structure are connected and respectively connected to the first side plate and the second side plate; in the thickness direction, the first capillary structure contacts the second cover plate, and the second capillary structure forms a cavity channel with the second cover plate; the first capillary structure, the second capillary structure, and the cavity channel are all connected to the first heat exchange region and the second heat exchange region respectively.

2. The temperature distribution plate according to claim 1, characterized in that, The capillary structure further includes a third capillary structure covering the second heat exchange zone; in the thickness direction, the third capillary structure and the second capillary structure are flush, and the third capillary structure and the second capillary structure are an integral structure.

3. The temperature distribution plate according to claim 1 or 2, characterized in that, The second heat exchange zone and the second capillary structure are both disposed between the first capillary structure and the second side plate.

4. The heat spreader according to any one of claims 1 to 3, characterized in that, The capillary structure further includes a fourth capillary structure covering the first heat exchange zone. The fourth capillary structure is connected to the first capillary structure and the second capillary structure, and forms a cavity with the second cover plate that communicates with the cavity channel.

5. The temperature distribution plate according to claim 4, characterized in that, The fourth capillary structure includes a first capillary portion and a second capillary portion. The first capillary portion is disposed on the first cover plate and covers the first heat exchange zone. The first capillary portion is flush with the second capillary structure in the thickness direction. Both the first capillary structure and the second capillary structure are connected to the first capillary portion. The second capillary portion is disposed on the side of the first capillary portion away from the first cover plate and is connected to the first capillary structure; the second capillary portion and the second cover plate form a cavity communicating with the cavity channel.

6. The temperature distribution plate according to claim 5, characterized in that, The second capillary portion has a comb-like structure, including multiple comb teeth arranged at intervals. The top of the comb teeth is away from the first capillary portion and contacts the second cover plate. The interval between adjacent comb teeth forms a cavity that communicates with the cavity channel.

7. The temperature distribution plate according to claim 5, characterized in that, The second capillary portion covers the first heat exchange zone and includes a first sub-part and a second sub-part; the first sub-part is connected to the first side plate, and the second sub-part is connected to the end of the first sub-part near the second side plate. In the thickness direction, the first sub-part contacts the second cover plate, and the second sub-part and the second cover plate form a cavity communicating with the cavity channel.

8. The heat spreader according to any one of claims 1 to 7, characterized in that, The capillary structure includes a first capillary layer and a second capillary layer, the first capillary layer covering the first cover plate, and the second capillary layer being disposed on the side of the first capillary layer away from the first cover plate. The second capillary layer extends a certain distance from the first side plate toward the second side plate, and extends along the first side plate from the second heat exchange zone to the first heat exchange zone; In the thickness direction, the first capillary layer and the second cover plate are spaced apart, and the second capillary layer is in contact with the second cover plate; The first capillary structure includes a second capillary layer and a portion of the first capillary layer covered by the second capillary layer; The second capillary structure includes the portion of the first capillary layer located in the channel region that is not covered by the second capillary layer.

9. The temperature distribution plate according to claim 8, characterized in that, The surrounding side plate also includes a third side plate, which connects the first side plate and the second side plate on the outer side of the second heat exchange zone away from the first heat exchange zone. The second capillary layer extends to the position where it contacts the third side plate.

10. The temperature distribution plate according to claim 8 or 9, characterized in that, The second capillary layer includes a first sub-capillary layer located in the channel region and a second sub-capillary layer located in the first heat exchange region; The first sub-capillary layer extends a certain distance from the first side plate toward the second side plate, and extends along the first side plate from the second heat exchange zone to the first heat exchange zone; the first sub-capillary layer is connected to the second sub-capillary layer, and one side of the second sub-capillary layer is connected to the first side plate and extends into the first heat exchange zone; In the thickness direction, the first sub-capillary layer contacts the second cover plate, and the second sub-capillary layer and the second cover plate form a cavity communicating with the cavity channel.

11. The temperature distribution plate according to any one of claims 8 to 10, characterized in that, The first capillary layer includes a first region capillary structure and a second region capillary structure connected together. The first region capillary structure is at least partially located in the first heat exchange zone, and the pore size of the first region capillary structure is smaller than that of the second region capillary structure.

12. The temperature distribution plate according to any one of claims 8 to 11, characterized in that, The second capillary layer includes a third capillary structure and a fourth capillary structure; the third capillary structure is closer to the first heat exchange zone than the fourth capillary structure. The pore size of the capillary structure in the third region is smaller than that in the capillary structure in the fourth region.

13. The temperature distribution plate according to any one of claims 8 to 12, characterized in that, The pore size of the first capillary layer is larger than that of the second capillary layer.

14. The heat spreader according to any one of claims 1 to 13, characterized in that, The temperature equalization plate also includes an isolation barrier wall disposed in the temperature equalization cavity; The isolation barrier is located between the first side plate and the second side plate, extending from the first heat exchange zone to the second heat exchange zone; the first capillary structure and the second capillary structure are respectively connected to both sides of the isolation barrier; In the thickness direction, the isolation barrier is in contact with both the first cover plate and the second cover plate.

15. The temperature distribution plate according to claim 14, characterized in that, The first capillary structure and the first heat exchange zone are located on one side of the isolation barrier; the second capillary structure and the second heat exchange zone are located on the other side of the isolation barrier.

16. The heat spreader according to any one of claims 1 to 15, characterized in that, The heat exchange plate includes at least two second heat exchange zones and at least two channel zones; each channel zone corresponds to one of the second heat exchange zones and connects the first heat exchange zone and the corresponding second heat exchange zone.

17. The heat spreader according to any one of claims 1 to 16, characterized in that, The heat exchange plate includes two second heat exchange zones and two channel zones; the channel zones correspond one-to-one with the second heat exchange zones, and the channel zones connect the first heat exchange zone and the corresponding second heat exchange zone. The two second heat exchange zones are symmetrically arranged relative to the first heat exchange zone, and the two channel zones are symmetrically arranged relative to the first heat exchange zone.

18. A heat dissipation module, characterized in that, The heat dissipation module includes: The heat spreader as described in any one of claims 1 to 17; Heat dissipation fins, wherein the heat dissipation fins are disposed on the heat exchange plate and are located in the second heat exchange zone of the heat exchange plate; and A cooling fan is disposed on the heat exchange plate and located on the same side of the heat exchange plate as the heat dissipation fins; the cooling fan is used to generate a cooling airflow acting on the heat dissipation fins.

19. An electronic device, characterized in that, The electronic device includes: The heat spreader as described in any one of claims 1 to 17, and The first heat source is in contact with the structure at the location of the first heat exchange zone in the heat exchange plate; Alternatively, the heat dissipation module as described in claim 18, wherein the heat dissipation module includes a heat spreader; and The first heat source is in contact with the structure at the location of the first heat exchange zone in the heat exchange plate.

20. The electronic device according to claim 19, characterized in that, The electronic device further includes a second heat source, which is in contact with a structure in the heat spreader that is opposite to the second capillary structure.

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