Full-color display device and preparation method thereof

Abstract

The invention provides a full-color display device and a preparation method thereof, and belongs to the technical field of semiconductors. The display device comprises a driving backboard and a plurality of pixel units, the pixel units comprise a blue-light pixel unit, a green-light pixel unit and a red-light pixel unit; each blue light pixel unit, each green light pixel unit and each red light pixel unit are respectively bonded on the driving back plate; on the cross section parallel to the driving back plate, the cross section area of the red light pixel unit is larger than that of the blue light pixel unit and that of the green light pixel unit; the blue light pixel units, the green light pixel units and the red light pixel units are arranged in a staggered mode in the direction perpendicular to the driving backboard. The light emitting efficiency of the red light pixel unit can be effectively improved.

Description

Technical Field

[0001] This disclosure belongs to the field of semiconductor technology, and specifically relates to a full-color display device and its fabrication method. Background Technology

[0002] Micro LEDs are a new type of light-emitting diode that miniaturizes traditional LEDs to the micrometer level. Micro LEDs can be used in display devices, where each pixel can emit light independently. Through voltage control, these pixels can independently adjust their light intensity and color, resulting in a highly detailed display effect.

[0003] In related technologies, full-color display devices include blue light pixel units, green light pixel units, and red light pixel units, which are used to emit blue light, green light, and red light, respectively.

[0004] However, due to the limitations of its epitaxial material, the light extraction efficiency of red light pixel units is lower compared to that of blue and green light pixel units. Summary of the Invention

[0005] This disclosure provides a full-color display device and its manufacturing method, which can effectively improve the light extraction efficiency of red light pixel units. The technical solution is as follows: In a first aspect, embodiments of this disclosure provide a display device, including: a driving backplate and a plurality of pixel units; The pixel unit includes a blue light pixel unit, a green light pixel unit, and a red light pixel unit; Each of the blue light pixel units, each of the green light pixel units, and each of the red light pixel units are respectively bonded to the driving backplate; In a cross-section parallel to the drive backplate, the cross-sectional area of ​​the red light pixel unit is larger than that of the blue light pixel unit and the green light pixel unit. The blue light pixel unit, the green light pixel unit, and the red light pixel unit are arranged alternately in a direction perpendicular to the drive back plate.

[0006] In one implementation of this disclosure, the cross-sectional area of ​​the red light pixel unit is 1.5 to 2.5 times that of the cross-sectional area of ​​the blue light pixel unit or the green light pixel unit in a cross-section parallel to the driving backplate.

[0007] In another implementation of this disclosure, there are multiple transverse and multiple longitudinal arrangement tracks on a plane parallel to the drive backplate, wherein the transverse and longitudinal arrangement tracks are perpendicular to each other. Along the horizontal arrangement trajectory, the blue light pixel unit, the green light pixel unit, and the red light pixel unit are arranged periodically in sequence; Along the vertical arrangement trajectory, each of the blue light pixel units is arranged in sequence, or each of the green light pixel units is arranged in sequence, or each of the red light pixel units is arranged in sequence.

[0008] In another implementation of this disclosure, the pixel units arranged adjacent to a red light pixel unit are both the blue light pixel unit and the green light pixel unit.

[0009] In another implementation of this disclosure, three blue light pixel units and three green light pixel units are arranged adjacent to each red light pixel unit, and the arrangement trajectory of the three blue light pixel units and the three green light pixel units is a regular hexagon.

[0010] In another implementation of this disclosure, each of the blue light pixel units is located on a first plane, each of the green light pixel units is located on a second plane, and each of the red light pixel units is located on a third plane. The first plane, the second plane, and the third plane are spaced apart from each other, and the first plane, the second plane, and the third plane are all parallel to the driving backplate.

[0011] In another implementation of this disclosure, the distance between the first plane and the drive backplate, the distance between the second plane and the drive backplate, and the distance between the third plane and the drive backplate increase sequentially.

[0012] In another implementation of this disclosure, the distance between the first plane and the second plane is equal to the distance between the second plane and the third plane.

[0013] In a second aspect, embodiments of this disclosure provide a method for manufacturing a display device, the method being used in the display device described in the first aspect, the method comprising: Provide a drive backplane; Blue light pixel units, green light pixel units, and red light pixel units are sequentially fabricated on one side of the driving backplate. In a cross-section parallel to the driving backplate, the cross-sectional area of ​​the red light pixel unit is larger than that of the blue light pixel unit and the green light pixel unit. In a direction perpendicular to the driving backplate, the blue light pixel units, the green light pixel units, and the red light pixel units are arranged alternately.

[0014] In another implementation of this disclosure, the preparation method further includes: In a cross-section parallel to the drive backplate, the cross-sectional area of ​​the red light pixel unit is 1.5 to 2.5 times the cross-sectional area of ​​the blue light pixel unit or the green light pixel unit.

[0015] The beneficial effects of the technical solutions provided in this disclosure are: The display device provided in this disclosure includes a driving backplane and a plurality of pixel units bonded to the driving backplane. The pixel units include blue light pixel units, green light pixel units, and red light pixel units, which emit blue light, green light, and red light, respectively. In a cross-section parallel to the driving backplane, the cross-sectional area of ​​the red light pixel unit is larger than that of the blue light pixel unit and the green light pixel unit. Therefore, the light-emitting area of ​​the red light pixel unit is larger than that of the blue light pixel unit and the green light pixel unit, effectively compensating for the low light-emitting efficiency of the red light pixel unit. Furthermore, in a direction perpendicular to the driving backplane, the blue light pixel unit, the green light pixel unit, and the red light pixel unit are arranged alternately, thereby utilizing the space perpendicular to the driving backplane to prevent the red light pixel unit from blocking the blue light pixel unit and the green light pixel unit due to its increased cross-sectional area.

[0016] In other words, the display device provided in this embodiment increases the light-emitting area of ​​the red light pixel unit by increasing the cross-sectional area of ​​the red light pixel unit, thereby effectively compensating for the low light-emitting efficiency of the red light pixel unit. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure; Figure 2 This is a top view of a display device provided in an embodiment of this disclosure; Figure 3 This is a flowchart of a method for manufacturing a display device according to an embodiment of this disclosure; Figure 4 This is a flowchart of another method for manufacturing a display device provided in this disclosure embodiment; Figure 5 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 6 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 7 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 8 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 9 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 10 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 11 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 12 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 13 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure; Figure 14 This is a process diagram of the manufacturing of the display device provided in the embodiments of this disclosure.

[0019] The symbols in the diagram represent the following meanings: 10. Drive backplane; 110. Drive bonded section; 20. Pixel unit; 210 blue light pixel units; 220 green light pixel units; 230 red light pixel units; 310. Horizontal arrangement trajectory; 320. Vertical arrangement trajectory; 410. First plane; 420. Second plane; 430. Third plane; 510, Epitaxial layer; 511, First semiconductor layer; 512, First current blocking layer; 513, Active layer; 514, Second current blocking layer; 515, Second semiconductor layer; 520, P-side transparent conductive layer; 530, Pixel bonding portion; 540, Epitaxial passivation layer; 550, Common cathode transparent conductive layer; 560, Epitaxial substrate; 570, Buffer layer; 580, N-side passivation layer; 60. Filling electrodes.

[0020] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0022] Figure 1This is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure. See also: Figure 1 In this embodiment, the display device includes a driving backplate 10 and a plurality of pixel units 20.

[0023] Pixel unit 20 includes a blue light pixel unit 210, a green light pixel unit 220, and a red light pixel unit 230. Each blue light pixel unit 210, each green light pixel unit 220, and each red light pixel unit 230 is bonded to the driving backplate 10. In a cross-section parallel to the driving backplate 10, the cross-sectional area of ​​the red light pixel unit 230 is larger than the cross-sectional areas of the blue light pixel unit 210 and the green light pixel unit 220 (see...). Figure 2 In a direction perpendicular to the drive backplate 10, the blue light pixel unit 210, the green light pixel unit 220, and the red light pixel unit 230 are arranged alternately.

[0024] The display device provided in this embodiment includes a driving backplate 10 and a plurality of pixel units 20 bonded to the driving backplate 10. The pixel units 20 include a blue light pixel unit 210, a green light pixel unit 220, and a red light pixel unit 230, which emit blue light, green light, and red light, respectively. In a cross-section parallel to the driving backplate 10, the cross-sectional area of ​​the red light pixel unit 230 is larger than that of the blue light pixel unit 210 and the green light pixel unit 220. Therefore, the light-emitting area of ​​the red light pixel unit 230 is larger than that of the blue light pixel unit and the green light pixel unit, effectively compensating for the low light-emitting efficiency of the red light pixel unit 230. Furthermore, in the direction perpendicular to the drive backplate 10, the blue light pixel unit 210, the green light pixel unit 220 and the red light pixel unit 230 are arranged in an alternating manner, thereby utilizing the space in the direction perpendicular to the drive backplate 10 to avoid the red light pixel unit 230 from blocking the blue light pixel unit 210 and the green light pixel unit 220 due to the increase in cross-sectional area.

[0025] In other words, the display device provided in this embodiment increases the light-emitting area of ​​the red light pixel unit 230 by increasing its cross-sectional area, thereby effectively compensating for the low light-emitting efficiency of the red light pixel unit 230.

[0026] For example, in a cross section parallel to the drive backplate 10, the cross-sectional area of ​​the red light pixel unit 230 is 1.5 to 2.5 times the cross-sectional area of ​​the blue light pixel unit 210 or the green light pixel unit 220.

[0027] In the above implementation, by increasing the cross-sectional area of ​​the red light pixel unit 230, the light-emitting area of ​​the red light pixel unit 230 can be effectively increased, thus effectively compensating for the low light-emitting efficiency of the red light pixel unit 230.

[0028] In this embodiment, the cross-sectional area of ​​the red light pixel unit 230 is 1.8 times the cross-sectional area of ​​the blue light pixel unit 210 or the green light pixel unit 220.

[0029] In some examples, the cross-sectional area of ​​the blue light pixel unit 210 is the same as that of the green light pixel unit 220.

[0030] This design facilitates the fabrication of the blue light pixel unit 210 and the green light pixel unit 220.

[0031] In other examples, the cross-sectional area of ​​the blue light pixel unit 210 is different from that of the green light pixel unit 220.

[0032] In other words, this embodiment does not limit the relationship between the cross-sectional areas of the blue light pixel unit 210 and the green light pixel unit 220, and can be adjusted according to the requirements. It is only necessary to ensure that the cross-sectional area of ​​the red light pixel unit 230 is greater than the cross-sectional areas of the blue light pixel unit 210 and the green light pixel unit 220.

[0033] See you again Figure 2 In this embodiment, there are multiple horizontal arrangement tracks 310 and multiple vertical arrangement tracks 320 on a plane parallel to the drive back plate 10, and the horizontal arrangement tracks 310 and the vertical arrangement tracks 320 are perpendicular to each other.

[0034] In the above implementation, the horizontal arrangement trajectory 310 and the vertical arrangement trajectory 320 are both virtual trajectories used to arrange the pixel units 20. They do not exist as physical entities and are only used to assist in explaining the arrangement planning of the pixel units 20.

[0035] On the horizontal arrangement trajectory 310, blue light pixel unit 210, green light pixel unit 220 and red light pixel unit 230 are arranged periodically in sequence.

[0036] It is worth noting that a blue light pixel unit 210, a green light pixel unit 220, and a red light pixel unit 230 are arranged in sequence, forming one cycle.

[0037] Of course, during the arrangement along the horizontal arrangement trajectory 310, due to size limitations, the arrangement period of the blue light pixel unit 210, green light pixel unit 220, and red light pixel unit 230 can be a complete period or a partial period. For example, see... Figure 2 The top row of horizontal arrangement trajectory 310 consists of two complete cycles plus one incomplete cycle, and the incomplete cycle includes a blue light pixel unit 210.

[0038] On the vertical arrangement trajectory 320, each blue light pixel unit 210 is arranged in sequence, or each green light pixel unit 220 is arranged in sequence, or each red light pixel unit 230 is arranged in sequence.

[0039] For example, see Figure 1 The leftmost column of the vertical arrangement trajectory 320 consists of blue light pixel units 210 arranged sequentially, the second column to the right of the vertical arrangement trajectory 320 consists of red light pixel units 230 arranged sequentially, and the third column to the right of the vertical arrangement trajectory 320 consists of green light pixel units 220 arranged sequentially.

[0040] By arranging each pixel unit 20 according to the horizontal arrangement trajectory 310 and the vertical arrangement trajectory 320, color uniformity can be effectively guaranteed.

[0041] See also Figure 2 In this embodiment, the pixel units 20 arranged around a red light pixel unit 230 are all blue light pixel units 210 and green light pixel units 220.

[0042] In the above implementation, by setting all other pixel units 20 arranged adjacent to the red light pixel unit 230 as blue light pixel units 210 and green light pixel units 220, it is possible to effectively avoid mutual interference between the two red light pixel units 230 due to their large size.

[0043] For example, a red light pixel unit 230 is surrounded by three blue light pixel units 210 and three green light pixel units 220, and the arrangement trajectory of the three blue light pixel units 210 and the three green light pixel units 220 is a regular hexagon.

[0044] In this embodiment, blue light pixel units 210 and green light pixel units 220 are arranged alternately on a regular hexagonal arrangement trajectory.

[0045] The arrangement of blue light pixel units 210 and green light pixel units 220 around the red light pixel unit 230 effectively ensures the color uniformity of the display device.

[0046] Of course, in other embodiments, the blue light pixel unit 210 and the green light pixel unit 220 can also be arranged in other ways on the hexagonal arrangement trajectory, and this disclosure does not limit this.

[0047] See you again Figure 1In this embodiment, each blue light pixel unit 210 is located on the first plane 410, each green light pixel unit 220 is located on the second plane 420, and each red light pixel unit 230 is located on the third plane 430. The first plane 410, the second plane 420, and the third plane 430 are spaced apart from each other, and the first plane 410, the second plane 420, and the third plane 430 are all parallel to the driving backplate 10.

[0048] In the above implementation, pixel units 20 with the same emitted light color are all located in the same plane, while pixel units 20 with different emitted light colors are not located in the same plane. This design not only facilitates the fabrication of the display device but also ensures that pixel units 20 with different emitted light colors do not interfere with each other.

[0049] For example, the distance between the first plane 410 and the drive backplate 10, the distance between the second plane 420 and the drive backplate 10, and the distance between the third plane 430 and the drive backplate 10 increase sequentially.

[0050] This design allows the blue light pixel unit 210, the green light pixel unit 220, and the red light pixel unit 230 to be manufactured in an orderly batch.

[0051] For example, in the process of manufacturing a display device, a blue light pixel unit 210 located on the first plane 410 can be manufactured first, then a green light pixel unit 220 located on the second plane 420 can be manufactured, and finally a red light pixel unit 230 located on the third plane 430 can be manufactured.

[0052] In this embodiment, the distance between the first plane 410 and the second plane 420 is equal to the distance between the second plane 420 and the third plane 430.

[0053] In other words, the first plane 410, the second plane 420, and the third plane 430 are arranged equidistantly in sequence. This design facilitates the orderly batch fabrication of the blue light pixel unit 210, the green light pixel unit 220, and the red light pixel unit 230.

[0054] See also Figure 1 In this embodiment, the thin film layer structures of the blue light pixel unit 210, green light pixel unit 220, and red light pixel unit 230 are similar, with the main differences being the thickness, doping concentration, and fabrication process of each film layer. The thin film layer structures of pixel units 20 emitting various light colors will be described below using the blue light pixel unit 210 as an example.

[0055] In this embodiment, the blue light pixel unit 210 includes an epitaxial layer 510, which includes a first semiconductor layer 511, a first current blocking layer 512, an active layer 513, a second current blocking layer 514, and a second semiconductor layer 515 stacked sequentially.

[0056] In this embodiment, the first semiconductor layer 511 and the first current blocking layer 512 are of the first conductivity type, and the second semiconductor layer 515 and the second current blocking layer 514 are of the second conductivity type, and the second conductivity type is different from the first conductivity type.

[0057] When the display device is working, an electron transition occurs between the first semiconductor layer 511 and the second semiconductor layer 515, and the active layer 513 emits light.

[0058] In this embodiment, the first semiconductor layer 511 is an N-type GaN layer, the active layer 513 is a quantum well layer, and the second semiconductor layer 515 is a P-type GaN layer. Of course, in other embodiments, the first semiconductor layer 511 may also be a P-type GaN layer, the second semiconductor layer 515 may be an N-type GaN layer, and the active layer 513 may be a quantum well layer; this disclosure does not impose any limitations on this.

[0059] In this embodiment, the blue light pixel unit 210 further includes a P-side transparent conductive layer 520 and a pixel bonding portion 530. One side of the P-side transparent conductive layer 520 is connected to the second semiconductor layer 515, and the other side of the P-side transparent conductive layer 520 is connected to the pixel bonding portion 530.

[0060] One side of the drive backplate 10 has a drive bonding portion 110, and the drive bonding portion 110 and the pixel bonding portion 530 are bonded to each other.

[0061] In this embodiment, the pixel bonding portion 530 is a stack of Cr / Pt / Ti / Pt / Au / Sn / Au. The driving bonding portion 110 is a stack of Ti / Pt / Au.

[0062] In this embodiment, the epitaxial passivation layer 540 is covered on the side of the epitaxial layer 510. The epitaxial passivation layer 540 has an opening at the position corresponding to the first semiconductor layer 511. A common cathode transparent conductive layer 550 is covered on the epitaxial passivation layer 540. The common cathode transparent conductive layer 550 is electrically connected to the first semiconductor layer 511 of each blue light pixel unit 210 through the opening on the epitaxial passivation layer 540.

[0063] The main difference between the green pixel unit 220, the red pixel unit 230 and the blue pixel unit 210 is that the driving bonding part 110 and the driving back plate 10 corresponding to the green pixel unit 220, as well as the driving bonding part 110 and the driving back plate 10 corresponding to the red pixel unit 230, all have a filling electrode 60.

[0064] For example, the filler electrode 60 is a stack of Cr / Al / TI / Ni / Pt / Au.

[0065] In the direction perpendicular to the drive backplate 10, the filling electrode 60 corresponding to the red light pixel unit 230 is higher than the filling electrode 60 corresponding to the green light pixel unit 220.

[0066] By adjusting the height of the filling electrode 60, the green light pixel unit 220, the red light pixel unit 230, and the blue light pixel unit 210 can be placed on different planes.

[0067] Figure 3 This disclosure provides a method for fabricating a display device, which is used to fabricate... Figure 1 and 2 The display device shown, combined with Figure 3 In this embodiment, the preparation method includes: Step 301: Provide a drive backplane 10.

[0068] Step 302: Blue light pixel unit 210, green light pixel unit 220 and red light pixel unit 230 are sequentially fabricated on one side of the driving backplate 10.

[0069] In this embodiment, on a cross section parallel to the drive backplate 10, the cross-sectional area of ​​the red light pixel unit 230 is larger than that of the blue light pixel unit 210 and the green light pixel unit 220. In a direction perpendicular to the drive backplate 10, the blue light pixel unit 210, the green light pixel unit 220 and the red light pixel unit 230 are arranged alternately.

[0070] Pixel unit 20 includes a blue light pixel unit 210, a green light pixel unit 220, and a red light pixel unit 230, which are used to emit blue light, green light, and red light, respectively. In a cross-section parallel to the driving backplate 10, the cross-sectional area of ​​the red light pixel unit 230 is larger than that of the blue light pixel unit 210 and the green light pixel unit 220. Therefore, the light-emitting area of ​​the red light pixel unit 230 is larger than that of the blue and green light pixels, effectively compensating for the low light-emitting efficiency of the red light pixel unit 230. Furthermore, in a direction perpendicular to the driving backplate 10, the blue light pixel unit 210, the green light pixel unit 220, and the red light pixel unit 230 are arranged in an alternating manner. This utilizes the space perpendicular to the driving backplate 10 to prevent the red light pixel unit 230 from blocking the blue light pixel unit 210 and the green light pixel unit 220 due to its increased cross-sectional area.

[0071] In other words, by increasing the cross-sectional area of ​​the red light pixel unit 230, its light-emitting area is increased, thereby effectively compensating for the low light-emitting efficiency of the red light pixel unit 230.

[0072] Figure 4 This disclosure provides a method for fabricating a display device, which is used to fabricate... Figure 1 and 2 The display device shown, combined with Figure 3 In this embodiment, the preparation method includes: Step 401: Provide an epitaxial substrate 560, and sequentially prepare a buffer layer 570, an epitaxial layer 510, a P-side transparent conductive layer 520 and a pixel bonding portion 530 on one side of the epitaxial substrate.

[0073] For example, the epitaxial layer 510 includes a first semiconductor layer 511, a first current blocking layer 512, an active layer 513, a second current blocking layer 514, and a second semiconductor layer 515.

[0074] In this embodiment, the first semiconductor layer 511 and the first current blocking layer 512 are of the first conductivity type, and the second semiconductor layer 515 and the second current blocking layer 514 are of the second conductivity type, and the second conductivity type is different from the first conductivity type.

[0075] In this embodiment, the first semiconductor layer 511 is an N-type GaN layer, the active layer 513 is a quantum well layer, and the second semiconductor layer 515 is a P-type GaN layer.

[0076] For example, the P-side transparent conductive layer 520 is a tin-doped indium oxide (ITO) thin film, and the thickness of the P-side transparent conductive layer 520 is 100~160nm.

[0077] For example, the pixel bonding portion 530 is a Cr / Pt / TI / Pt / Au / Sn / Au stack.

[0078] Step 402: Provide a drive backplate 10, one side of the drive backplate 10 having a drive bonding portion 110.

[0079] For example, the driving bonding portion 110 is a Ti / Pt / Au stack.

[0080] Step 403: Flip the epitaxial substrate and bond the pixel bonding portion 530 and the drive bonding portion 110 together (see...) Figure 5 ) For example, the pixel bonding portion 530 and the drive bonding portion 110 are bonded to each other by metal hot pressing bonding.

[0081] Step 404: Remove the epitaxial substrate 560 and thin the buffer layer 570.

[0082] For example, if the epitaxial substrate 560 is a sapphire substrate, the epitaxial substrate is removed by laser lift-off. If the epitaxial substrate 560 is a silicon substrate, the epitaxial substrate is removed by CMP (chemical mechanical polishing).

[0083] For example, by etching with ICP (Inductively Coupled Plasma Etching), epitaxial thinning with BCl3 and Cl2 plasmas is performed, leaving 0.9~1.35µm of buffer layer 570 remaining.

[0084] Step 405: Etch the MESA structure (see...) Figure 6 ) By using photolithography array patterning, ICP (Inductively Coupled Plasma) etching, BCl3 and Cl2 plasma etching are used to form a positive trapezoidal pixel unit structure, and the etching angle of the sidewall of the pixel unit is controlled between 65° and 83°.

[0085] Step 406: Perform pixel isolation (see...) Figure 7 ).

[0086] For example, using IBE (Ion Beam Etching), Ar inert gas is used to etch the epitaxial layer 510, the P-side transparent conductive layer 520, the pixel bonding portion 530, the driving bonding portion 110, and the driving backplate, so that each pixel unit has an independent P-side contact. Furthermore, after etching, the first semiconductor layer 511 of the epitaxial layer 510 is retained at the position corresponding to the blue pixel unit 210, while the epitaxial layer 510 is etched away at the positions corresponding to the green pixel unit 220 and the red pixel unit 230, leaving only the P-side transparent conductive layer 520.

[0087] In step 406, the blue light pixel unit 210, the green light pixel unit 220 and the red light pixel unit 230 are initially isolated.

[0088] Step 407: Prepare an epitaxial passivation layer 540 and make openings in the epitaxial passivation layer 540 to expose the first semiconductor layer 511. For example, the epitaxial passivation layer 540 is SiO2, and the thickness of the epitaxial passivation layer 540 is 300~600 nm. In the process of preparing the epitaxial passivation layer 540, a low-temperature deposition operation is adopted, and the temperature is controlled at 240℃~280℃.

[0089] For example, the etching morphology can be controlled by combining ICP and IBE to ensure etching accuracy.

[0090] Step 408: Prepare a common cathode transparent conductive layer 550, such that the common cathode transparent conductive layer 550 is electrically connected to the first semiconductor layer 511 of each blue light pixel unit.

[0091] For example, the common cathode transparent conductive layer 550 is a tin-doped indium oxide (ITO) thin film, and the thickness of the common cathode transparent conductive layer 550 is 200~350nm.

[0092] Step 409: Prepare the N-plane passivation layer 580 and perform CMP planarization on the N-plane passivation layer 580.

[0093] For example, using a PECVD (plasma-enhanced chemical vapor deposition) device, the deposition temperature is set to 240°C~280°C to deposit a 2~3.5µm N-side passivation layer 580, wherein the N-side passivation layer 580 is SiO2 (see [link to PECVD equipment]). Figure 8 ).

[0094] This completes the fabrication of the blue light pixel unit 210.

[0095] Step 4010: Make openings in the N-side passivation layer 580 to expose the common cathode transparent conductive layer 550 corresponding to the green and red pixel units.

[0096] Step 4011: Electroplating to form the filler electrode 60, followed by CMP planarization (see...). Figure 9 ).

[0097] For example, the filler electrode 60 is an electroplated copper pillar.

[0098] Step 4012: Fabricate green pixel unit 220 (see...) Figures 10-11 ).

[0099] The process of fabricating the green pixel unit 220 is similar to the process of fabricating the blue pixel unit 210 described above. Referring to steps 401 to 409, that is, the epitaxial layer 510 and the driving bonding portion 110 are fabricated, and the epitaxial layer 510 and the driving bonding portion 110 are bonded to each other to fabricate a common cathode transparent conductive layer 550, so that the first semiconductor layer 511 of each green pixel unit 220 is electrically connected.

[0100] Step 4013: Fabricate red light pixel unit 230 (see Figures 12-14 ).

[0101] The process of preparing the red light pixel unit 230 is similar to the process of preparing the blue light pixel unit 210 and the green light pixel unit 220 described above, and will not be repeated here.

[0102] Step 4014: Photolithography is performed on the N-plane passivation layer 580 to form an array of microlenses (see...) Figure 1 ).

[0103] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.

[0104] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display device, characterized in that, include: Drive backplate (10), multiple pixel units (20); The pixel unit (20) includes a blue light pixel unit (210), a green light pixel unit (220), and a red light pixel unit (230). Each of the blue light pixel units (210), each of the green light pixel units (220) and each of the red light pixel units (230) are respectively bonded to the driving backplate (10); On a cross section parallel to the drive back plate (10), the cross-sectional area of ​​the red light pixel unit (230) is greater than the cross-sectional areas of the blue light pixel unit (210) and the green light pixel unit (220); In a direction perpendicular to the drive backplate (10), the blue light pixel unit (210), the green light pixel unit (220) and the red light pixel unit (230) are arranged alternately.

2. The display device according to claim 1, characterized in that, On a cross section parallel to the drive backplate (10), the cross-sectional area of ​​the red light pixel unit (230) is 1.5 to 2.5 times the cross-sectional area of ​​the blue light pixel unit (210) or the green light pixel unit (220).

3. The display device according to claim 1, characterized in that, On a plane parallel to the drive backplate (10), there are multiple transverse arrangement tracks (310) and multiple longitudinal arrangement tracks (320), the transverse arrangement tracks (310) and the longitudinal arrangement tracks (320) are perpendicular to each other; On the horizontal arrangement trajectory (310), the blue light pixel unit (210), the green light pixel unit (220) and the red light pixel unit (230) are arranged periodically in sequence; On the longitudinal arrangement trajectory (320), each of the blue light pixel units (210) is arranged in sequence, or each of the green light pixel units (220) is arranged in sequence, or each of the red light pixel units (230) is arranged in sequence.

4. The display device according to claim 3, characterized in that, The pixel units (20) arranged around a red light pixel unit (230) are all blue light pixel units (210) and green light pixel units (220).

5. The display device according to claim 4, characterized in that, A red light pixel unit (230) is surrounded by three blue light pixel units (210) and three green light pixel units (220), and the arrangement trajectory of the three blue light pixel units (210) and the three green light pixel units (220) is a regular hexagon.

6. The display device according to claim 1, characterized in that, Each of the blue light pixel units (210) is located on a first plane (410), each of the green light pixel units (220) is located on a second plane (420), and each of the red light pixel units (230) is located on a third plane (430). The first plane (410), the second plane (420), and the third plane (430) are spaced apart from each other, and the first plane (410), the second plane (420), and the third plane (430) are all parallel to the driving backplate (10).

7. The display device according to claim 6, characterized in that, The distance between the first plane (410) and the drive backplate (10), the distance between the second plane (420) and the drive backplate (10), and the distance between the third plane (430) and the drive backplate (10) increase sequentially.

8. The display device according to claim 7, characterized in that, The distance between the first plane (410) and the second plane (420) is equal to the distance between the second plane (420) and the third plane (430).

9. A method for manufacturing a display device, characterized in that, The preparation method is used to prepare the display device according to any one of claims 1 to 8, and the preparation method includes: Provide a drive backplane (10); Blue light pixel unit (210), green light pixel unit (220) and red light pixel unit (230) are sequentially fabricated on one side of the driving back plate (10). On a cross section parallel to the driving back plate (10), the cross-sectional area of ​​the red light pixel unit (230) is larger than that of the blue light pixel unit (210) and the green light pixel unit (220). On a direction perpendicular to the driving back plate (10), the blue light pixel unit (210), the green light pixel unit (220) and the red light pixel unit (230) are arranged alternately.

10. The preparation method according to claim 9, characterized in that, The preparation method further includes: On a cross section parallel to the drive backplate (10), the cross-sectional area of ​​the red light pixel unit (230) is 1.5 to 2.5 times the cross-sectional area of ​​the blue light pixel unit (210) or the green light pixel unit (220).

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