A packaging method and a packaging structure for a flexible thermoelectric element

By using a breathable fabric encapsulation structure and a directional moisture-wicking design, the problems of sweat expulsion and dynamic deformation in wearable thermoelectric devices are solved, improving the wearing comfort and mechanical stability of the devices and reducing manufacturing costs.

CN121908800BActive Publication Date: 2026-07-14HEBEI UNIVERSITY +1
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEBEI UNIVERSITY
Filing Date
2026-03-25
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

The dense packaging materials of existing wearable thermoelectric devices prevent sweat from being effectively expelled, affecting wearing comfort and reliability. Furthermore, traditional packaging methods are prone to solder joint cracking under dynamic deformation.

Method used

A breathable fabric encapsulation structure is adopted, and a continuous breathable channel is formed in the gap area of ​​the electrode layer through a discontinuous bonding method. Hydrophobic and hydrophilic areas are set on the encapsulation layer, combined with directional moisture-wicking areas, to form a point-like bonding and surface-like breathable encapsulation structure.

Benefits of technology

This allows for the smooth wicking of sweat, improves wearing comfort and the mechanical stability of the device, reduces manufacturing costs, and increases production efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121908800B_ABST
    Figure CN121908800B_ABST
Patent Text Reader

Abstract

The application discloses a packaging method and structure for a flexible thermoelectric element, and relates to the technical field of semiconductor device preparation.The packaging method comprises the following steps: preparing a thermoelectric series structure, wherein the thermoelectric series structure comprises an electrode layer, a P-type thermoelectric arm and an N-type thermoelectric arm; the electrode layer is composed of a plurality of metal electrodes; a cloth adhesive is coated on the outer surface of the electrode layer; a first packaging layer is attached to the outer side of the electrode layer of the thermoelectric series structure; a second packaging layer is attached to the outer side of the electrode layer of the thermoelectric series structure; finally, the packaging of the flexible thermoelectric element is completed after static pressure forming; the application adopts a non-continuous bonding structure of packaging cloth to package the thermoelectric element, and replaces traditional dense polymer packaging materials; by using the unique packaging mode of "point bonding and surface ventilation" between the packaging cloth and the device, the stability and comfort of the device structure are ensured.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Preparation method of telescopic flexible thermoelectric device

    CN116113302A

  • Flexible wearable temperature control fabric and preparation method thereof

    CN117617608A

  • Flexible thermoelectric fabric and manufacturing method thereof

    CN117822327A