Electrical routing system, method, semiconductor device, and storage medium

Abstract

This application discloses an electrical wiring system, method, semiconductor device, and storage medium, relating to the field of semiconductor device manufacturing technology. In this electrical wiring system, a main distribution board is electrically connected to a motion control module, and the main distribution board is provided with a main power input socket. Each sub-board module is respectively disposed in a corresponding functional component area, and each sub-board module is electrically connected to at least one load device in the corresponding functional component area. Each connecting cable is connected between the main distribution board and a corresponding sub-board module. The main distribution board is configured to receive an external power supply voltage through the main power input socket, and provide an external power supply voltage to the sub-board modules connected to each connecting cable according to the control commands issued by the motion control module. This application solves the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment manufacturing technology, and in particular to an electrical wiring system, method, semiconductor equipment, and storage medium. Background Technology

[0002] In the semiconductor equipment manufacturing field, especially in high-precision automated equipment such as probe stations, the reliability, maintainability, and assembly efficiency of the electrical wiring system directly affect the overall performance and manufacturing cost of the equipment.

[0003] The industry commonly uses a centralized electrical architecture. This architecture communicates with the industrial computer via a motion control card through a PCI / PCI-E bus, then connects to an adapter board or junction box via a large flat cable, and finally connects to various I / O (Input / Output) devices through distributed wiring harnesses. However, the existing centralized electrical architecture has significant technical drawbacks in practical applications. During the production and assembly phase, the process is complex. Because all wiring harnesses need to be centrally connected, modular parallel operations are impossible. A large number of wiring harnesses must be reserved, and manual marking and insertion are required, easily leading to misconnections and loose connections, affecting assembly efficiency and quality. During commissioning and maintenance, the dense wiring harnesses and lack of zoning indicators make fault location difficult, requiring troubleshooting from the central end segment by segment, which is time-consuming, labor-intensive, and increases downtime costs. Furthermore, centralized cable arrangement easily leads to congested cable trays, accelerated wear, and signal interference. Centralized power protection also makes local faults prone to propagation, resulting in low system reliability and poor scalability.

[0004] In other words, existing centralized electrical architectures suffer from technical problems such as low assembly efficiency, difficulty in fault location, and insufficient reliability due to the constraints of centralized wiring methods. Summary of the Invention

[0005] The main objective of this application is to provide an electrical wiring system, method, semiconductor device, and storage medium, which aims to solve the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods.

[0006] To achieve the above objectives, this application proposes an electrical wiring system, the electrical wiring system comprising: Motion control module; A main distribution board, which is electrically connected to the motion control module, and the main distribution board is provided with a main power input socket; Multiple sub-board modules are provided, each sub-board module is disposed in a corresponding functional component area, and each sub-board module is electrically connected to at least one load device in the corresponding functional component area. Multiple connecting cables, each connecting cable connecting the main distribution board to a corresponding sub-board module; wherein, The main distribution board is configured to connect to an external power supply voltage via the main power input socket, and to provide the external power supply voltage to the corresponding sub-board modules of each of the connecting cables according to the control commands issued by the motion control module.

[0007] In one embodiment, the main distribution board includes a main power protection module and branch power protection modules; The main power protection module is connected in series between the main power input socket and the branch power protection module, and the branch power protection module includes multiple branch power protection circuits; Each branch power protection circuit corresponds to one of the connecting cables, and each branch power protection circuit is connected between the main power protection module and the corresponding connecting cable.

[0008] In one embodiment, the main power protection module includes a first fuse, a switching transistor, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, and a first diode; The first end of the first fuse is electrically connected to the first end of the main power input socket, the second end of the first fuse is electrically connected to the first path terminal of the switching transistor, the first end of the first resistor is electrically connected to the second path terminal of the switching transistor and the first end of the first capacitor, the second end of the first resistor is electrically connected to the control terminal of the switching transistor and the first end of the second resistor, the second end of the second resistor is electrically connected to the second end of the main power input socket and the second end of the first capacitor, the first end of the first capacitor is connected to the power supply terminal, and the second end of the first capacitor is grounded. The first terminal of the second capacitor is electrically connected to the first terminal of the first capacitor and the first terminal of the third resistor, respectively. The first terminal of the third resistor is also electrically connected to the branch power protection module. The second terminal of the second capacitor is electrically connected to the second terminal of the first capacitor and the cathode of the first diode, respectively. The anode of the first diode is electrically connected to the second terminal of the third resistor.

[0009] In one embodiment, the branch power supply protection circuit includes a second fuse and a sub-board socket; The first end of the second fuse is electrically connected to the main power protection module, and the second end of the second fuse is electrically connected to the sub-board socket; The sub-board socket is configured to be electrically connected to the corresponding connection cable to establish an electrical connection path between the main power protection module and the corresponding sub-board module.

[0010] In one embodiment, the subboard module includes subboard wiring terminals, a status indicator unit, and a filtering unit; The subboard terminals are electrically connected to the subboard sockets connected to the corresponding connecting cables; The status indicator unit and the filter unit are respectively connected to the power supply terminal of the sub-board wiring terminal.

[0011] In one embodiment, the status indication unit includes a fourth resistor and a second diode. The first end of the fourth resistor is connected to the power supply terminal of the sub-board terminal block, the second end of the fourth resistor is electrically connected to the anode of the second diode, and the cathode of the second diode is grounded.

[0012] In one embodiment, the filtering unit includes a third capacitor, a fourth capacitor, and a fifth capacitor; The first terminal of the third capacitor is electrically connected to the power supply terminal of the sub-board wiring terminal, and the first terminal of the fourth capacitor is electrically connected to the first terminal of the third capacitor and the first terminal of the fifth capacitor. The second terminal of the third capacitor is grounded, and the second terminal of the fourth capacitor is electrically connected to the second terminal of the third capacitor and the second terminal of the fifth capacitor, respectively.

[0013] Furthermore, this application also provides an electrical wiring method, which is applied to the electrical wiring system described above, and the electrical wiring method includes: Connect the external power supply voltage through the main power input socket on the main distribution board; Based on the control command issued by the motion control module to the main distribution board, the main distribution board is enabled to provide the external power supply voltage to the corresponding sub-board modules of each connecting cable.

[0014] In addition, this application also provides a semiconductor device, which includes the electrical wiring system described above.

[0015] In addition, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the electrical wiring method described above.

[0016] The electrical wiring system provided in this application, by constructing a hierarchical connection topology of "motion control module - main distribution board - distributed sub-board modules," effectively overcomes the technical defects of existing centralized electrical architectures, which suffer from low assembly efficiency, difficulty in fault location, and insufficient reliability due to the constraints of centralized wiring methods. Specifically, compared to the centralized wiring method in traditional solutions where all I / O device harnesses must ultimately converge to a central adapter board / junction box, this application, by introducing a main distribution board and multiple sub-board modules corresponding to different functional component areas, reconstructs the original single centralized connection node into a distributed, modular star connection network. First, the electrical wiring of each functional component area can be completed and tested independently on the corresponding sub-board module in advance, realizing the parallel operation of electrical assembly and mechanical structure assembly. This completely avoids the problems of complicated procedures, low efficiency, and easy misconnection and loose connection caused by reserving a large number of harnesses and performing complex interlocking during the final assembly stage in the traditional method, significantly improving assembly efficiency and first-time success rate. Secondly, because each sub-board module clearly corresponds to the functional component area it serves in terms of physical space and electrical connection, a natural fault isolation and location boundary is formed. When a fault occurs in a functional component area, the troubleshooting scope can be quickly locked onto the corresponding sub-board module and its connection links, greatly simplifying the tedious process of troubleshooting segment by segment from a dense central cabling harness, achieving rapid fault location, and reducing equipment downtime and maintenance costs. Furthermore, distributed cabling shortens the power and signal paths to each load device, reducing the risks of cable tray congestion, cable wear, and signal crosstalk caused by parallel laying of long-distance, high-density cabling harnesses. At the same time, the structure of distributing external power voltage to each sub-board module via the main distribution board lays the physical foundation for implementing hierarchical, segmented power protection and refined management, effectively suppressing the spread of local faults, thereby improving the overall operational reliability and stability of the electrical cabling system. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the electrical wiring system of this application; Figure 2 This is a schematic diagram of the electrical architecture of the electrical wiring system involved in the embodiments of this application; Figure 3 This is a schematic diagram of the main distribution board involved in the embodiment of this application; Figure 4 This is a schematic diagram of the main distribution board circuit involved in the embodiment of this application; Figure 5 This is another circuit diagram of the main distribution board involved in the embodiment of this application; Figure 6 This is a schematic diagram of the electrical wiring system involved in the embodiments of this application; Figure 7This is a schematic diagram of the sub-board module circuit involved in the embodiments of this application; Figure 8 This is another circuit diagram of the electrical wiring system involved in the embodiments of this application; Figure 9 This is a schematic diagram of the installation of the first sub-board module involved in the embodiment of this application; Figure 10 This is a schematic diagram of the installation of the second sub-board module involved in the embodiments of this application; Figure 11 This is a schematic diagram of the installation of the third sub-board module involved in the embodiments of this application; Figure 12 This is a schematic diagram of the installation of the fourth sub-board module involved in the embodiments of this application; Figure 13 This is a schematic diagram of the hardware operating environment involved in the device in this application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0019] Reference numerals: 10, Motion control module; 20, Main distribution board; 30, Sub-board module; 40, Load device; L0, Connecting cable; 21, Main power protection module; 22, Branch power protection module; 221, Branch power protection circuit; F1, First fuse; F2, Second fuse; Q1, Switching transistor; R1, First resistor; R2, Second resistor; R3, Third resistor; R4, Fourth resistor; C1, First capacitor; C2, Second capacitor; C3, Third capacitor; C4, Fourth capacitor; C5, Fifth capacitor; D1, First diode; D2, Second diode; J1, Main power input socket; J2, Sub-board socket; J2', Sub-board terminal block; A10, First sub-board module; B10, Second sub-board module; C10, Third sub-board module; D10, Fourth sub-board module. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0021] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0022] In the semiconductor equipment manufacturing field, especially in high-precision automated equipment such as probe stations, the reliability, maintainability, and assembly efficiency of the electrical wiring system directly affect the overall performance and manufacturing cost of the equipment.

[0023] The industry commonly uses a centralized electrical architecture. This architecture communicates with the industrial computer via a motion control card through a PCI / PCI-E bus, then connects to an adapter board or junction box via a large cabling system, and finally connects to various I / O (Input / Output) devices through distributed wiring harnesses. However, the existing centralized electrical architecture has significant technical drawbacks in practical applications. During the production and assembly phase, the process is complex. Because all wiring harnesses need to be centrally connected, modular parallel operations are impossible. A large number of wiring harnesses must be reserved, and manual marking and insertion are required, easily leading to misconnections and loose connections, affecting assembly efficiency and quality. During debugging and maintenance, the dense wiring harnesses and lack of zoning indicators make fault location difficult, requiring troubleshooting from the central end segment by segment, which is time-consuming, labor-intensive, and increases downtime costs. Furthermore, centralized cable routing easily leads to congested cable trays, accelerated wear, and signal interference. Centralized power protection also makes local faults prone to propagation, resulting in low system reliability and poor scalability. In other words, the existing centralized electrical architecture suffers from low assembly efficiency, difficult fault location, and insufficient reliability due to the constraints of centralized cabling.

[0024] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art.

[0025] Therefore, based on the shortcomings of the above electrical wiring schemes, the electrical wiring method of this application is proposed. The solution of this application embodiment is as follows: This application reconstructs the original single centralized connection node into a distributed, modular star connection network by introducing a main distribution board and multiple sub-board modules corresponding to different functional component areas. First, the electrical wiring of each functional component area can be completed and tested independently on the corresponding sub-board module in advance, realizing the parallel operation of electrical assembly and mechanical structure assembly. This completely avoids the problems of complicated procedures, low efficiency, and easy misconnection and loose connection caused by reserving a large number of wire harnesses and performing complex interlocking in the final assembly stage in the traditional method, which significantly improves assembly efficiency and first-time success rate. Second, since each sub-board module clearly corresponds to the functional component area it serves in terms of physical space and electrical connection, a natural fault isolation and location boundary is formed. When a fault occurs in a certain functional component area, the troubleshooting scope can be quickly locked to the corresponding sub-board module and its connection link, which greatly simplifies the tedious process of troubleshooting segment by segment from the dense central wire harness, realizes rapid fault location, and reduces equipment downtime and maintenance costs. Furthermore, distributed cabling shortens the power and signal paths to each load device, reducing the risks of cable tray congestion, cable wear, and signal crosstalk caused by long-distance, high-density parallel cabling. Simultaneously, the structure of distributing external power voltage to each sub-module via the main distribution board lays the physical foundation for implementing hierarchical and segmented power protection and refined management, effectively suppressing the spread of local faults, thereby improving the overall reliability and stability of the electrical cabling system.

[0026] Based on this, embodiments of this application provide an electrical wiring system, referring to... Figure 1 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the electrical wiring system of this application.

[0027] Reference Figure 1 The electrical wiring system provided in this application includes: Motion control module 10.

[0028] In this embodiment, the motion control module 10 serves as the control center and command source for the entire electrical wiring system. Specifically, the motion control module 10 communicates with the host industrial computer via a high-speed bus (such as a PCI / PCI-E bus), receives the macroscopic device control program, parses the device control program into precise control commands, and simultaneously collects and processes status feedback signals from each load device 40. In other words, this application achieves centralized coordination and real-time control of all load devices 40 through the motion control module 10.

[0029] It should be noted that the motion control module 10 typically refers to a board (i.e., a motion control card) that integrates a dedicated motion control chip or processor. The motion control module 10 works in conjunction with an industrial computer via a standard bus. The control commands issued by the motion control module 10 include, but are not limited to, motion control signals for driving actuators such as motors, logic control signals for controlling the load device 40, and response signals that trigger the main distribution board 20 to perform power distribution operations.

[0030] In a specific embodiment, refer to Figure 2 The motion control module 10 is connected to the industrial computer via a high-speed bus (such as PCI / PCI-E bus) and establishes a direct electrical connection with the main distribution board 20 through a set of well-defined flatbed cables or wires.

[0031] The main distribution board 20 is electrically connected to the motion control module 10, and the main distribution board 20 is provided with a main power input socket J1.

[0032] In this embodiment, the main distribution board 20 serves as the power distribution and signal scheduling center of the electrical wiring system. Specifically, the main distribution board 20 safely connects to the external power supply voltage through the main power input socket J1, and in response to the control commands issued by the motion control module 10, distributes the external power supply voltage to the corresponding sub-board modules 30 via different connecting cables L0. In other words, this application replaces the centralized adapter board / junction box in the traditional architecture with the main distribution board 20, constructing a clearly hierarchical first-level distribution node, fundamentally changing the power and signal transmission topology, and laying a structural foundation for subsequent modular assembly, rapid fault location and isolation.

[0033] It should be noted that the main power input socket J1 usually refers to a terminal block or connector that can be connected to an industrial DC power supply such as 24V or 48V.

[0034] Multiple sub-board modules 30 are provided, each sub-board module 30 is disposed in a corresponding functional component area, and each sub-board module 30 is electrically connected to at least one load device 40 in the corresponding functional component area.

[0035] In this embodiment, multiple sub-board modules 30 serve as distributed execution and acquisition terminals for the electrical wiring system. Specifically, each sub-board module 30 is installed adjacent to the corresponding functional component area according to the physical layout of the device's functional components. This centralizes the wiring harnesses of numerous load devices 40 that were originally scattered and connected to the central junction box onto the corresponding sub-board module 30. In other words, by deploying multiple sub-board modules 30, this application simplifies the traditionally large and complex global wiring harness into several standardized connecting cables L0 and locally organized short wiring harnesses, achieving localization and modularization of electrical connections. This greatly simplifies the assembly process and naturally limits the impact of faults to a local area.

[0036] It should be noted that the load devices 40 include, but are not limited to, limit sensors, photoelectric switches, solenoid valves, relays, indicator lights, and all other input / output devices that need to be connected to the control system. One sub-board module 30 can centrally manage multiple load devices 40 within a functional component area.

[0037] Multiple connecting cables L0 are provided, each connecting cable L0 connecting between the main distribution board 20 and a corresponding sub-board module 30; wherein, the main distribution board 20 is configured to connect to an external power supply voltage through the main power input socket J1, and provide the external power supply voltage to the sub-board module 30 connected to each connecting cable L0 according to the control command issued by the motion control module 10.

[0038] In this embodiment, multiple connecting cables L0 serve as standardized electrical pathways connecting the main distribution board 20 and each sub-board module 30. Specifically, each connecting cable L0 corresponds to connecting an output interface (i.e., sub-board socket J2) on the main distribution board 20 to an input interface (i.e., sub-board terminal J2') of a sub-board module 30, carrying all the power and bidirectional signals (control commands downlink, status feedback signals uplink) required by the area where the sub-board module 30 is located. In other words, by using predefined standardized connecting cables L0, this application replaces a large number of non-standard, discrete, and scattered wire harnesses in the traditional architecture, making the connection between the main distribution board 20 and each functional area standardized, simple, and reliable, greatly reducing wiring errors during assembly, and facilitating module replacement during subsequent maintenance.

[0039] It should be noted that the connecting cable L0 is typically a multi-core shielded ribbon cable or cable, and the number of cores in the connecting cable L0 is determined according to the power and signal requirements of the corresponding sub-board module 30. For components that require frequent movement (such as the plate support), the connecting cable L0 must be a highly flexible model to meet the service life requirements of long-term bending.

[0040] The load device 40 can be understood as an input / output device, such as a limit sensor, relay, solenoid valve, and photoelectric switch.

[0041] Furthermore, in some feasible embodiments, reference is made to Figure 3 The main distribution board 20 includes a main power protection module 21 and a branch power protection module 22. The main power protection module 21 is connected in series between the main power input socket J1 and the branch power protection module 22. The branch power protection module 22 includes multiple branch power protection circuits 221. Each branch power protection circuit 221 corresponds to a connecting cable L0, and each branch power protection circuit 221 is connected between the main power protection module 21 and the corresponding connecting cable L0.

[0042] In this embodiment, the main distribution board 20, as the core power distribution and dispatch hub of the entire electrical wiring system, integrates the main power protection module 21 and the branch power protection module 22, constructing a hierarchical power management and fault protection system. Specifically, the main power protection module 21, as the first level of protection, is directly connected in series on the input circuit of the external power supply voltage, providing basic overcurrent and short-circuit protection for the entire main distribution board 20; the branch power protection module 22, as the second level of fine protection, contains multiple independent branch power protection circuits 221, which are respectively connected in series to each power path of the connecting cable L0 leading to the sub-board module 30; that is, by setting up a two-level linkage main power protection module 21 and branch power protection module 22 in the main distribution board 20, this application achieves hierarchical isolation and precise location of power faults. When a partial short circuit or severe overload occurs in a sub-board module 30 or its connected load device 40, the corresponding branch protection circuit will take priority to cut off the power supply to the faulty branch, thereby strictly limiting the impact of the fault to a local area. This effectively prevents the problem of "one point of fault, paralysis of the whole line" in traditional centralized protection, and greatly improves the overall availability and reliability of the electrical wiring system.

[0043] Furthermore, in some other feasible embodiments, reference is made to... Figure 4The main power protection module 21 includes a first fuse F1, a switching transistor Q1, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, and a first diode D1. The first end of the first fuse F1 is electrically connected to the first end of the main power input socket J1, and the second end of the first fuse F1 is electrically connected to the first path terminal of the switching transistor Q1. The first end of the first resistor R1 is electrically connected to the second path terminal of the switching transistor Q1 and the first end of the first capacitor C1, respectively. The second end of the first resistor R1 is electrically connected to the control terminal of the switching transistor Q1 and the first end of the second resistor R2, respectively. The second end of the second resistor R2 is electrically connected to the second end of the main power input socket J1 and the second end of the first capacitor C1. The first end of the first capacitor C1 is connected to the power supply terminal, and the second end of the first capacitor C1 is grounded. The first end of the second capacitor C2 is electrically connected to the first end of the first capacitor C1 and the first end of the third resistor R3. The first end of the third resistor R3 is also electrically connected to the branch power protection module 22. The second end of the second capacitor C2 is electrically connected to the cathode of the first diode D1, and the anode of the first diode D1 is electrically connected to the second end of the third resistor R3.

[0044] In this embodiment, refer to Figure 4The main power protection module 21, through an integrated circuit consisting of a first fuse F1, a switching transistor Q1, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, and a first diode D1, achieves intelligent monitoring, multiple protections, and stable output of the input power supply (i.e., external power voltage). Specifically, the external power voltage is connected to the main power input socket J1 and then output to the main power protection module 21. This main power protection module 21 is not a simple series connection of fuses, but rather constructs an active protection network with detection, control, and buffering functions. The first fuse F1 provides basic overcurrent protection; the switching transistor Q1, driven by the control terminal signal, acts as a controlled electronic switch, enabling rapid switching; the first resistor R1 and the second resistor R2 form a voltage divider and current limiting network, used to set the turn-on threshold and operating point of the switching transistor Q1; the first capacitor C1 and the second capacitor C2 serve as power decoupling, noise filtering, and buffering functions; and the first diode D1 is used to prevent reverse voltage or provide transient voltage clamping. When the input external power supply voltage is normal, the main power protection module 21 can stably transmit power; when an abnormal external power supply voltage is detected (such as overcurrent or input terminal abnormality), it can quickly cut off the main circuit by turning off the switching transistor Q1, and avoid voltage spikes by combining the buffering effect of the first capacitor C1 and the second capacitor C2. Thus, while providing faster and more reliable protection than a single fuse, it provides a clean, stable and controlled main power supply for the downstream branch power protection module 22 and the entire system.

[0045] It should be noted that the switch Q1 usually refers to a metal-oxide-semiconductor field-effect transistor (such as a P-type MOS transistor). The first and second access terminals of the switch Q1 correspond to the source and drain, respectively, and the control terminal of the switch Q1 corresponds to the gate.

[0046] The first capacitor, C1, is typically a large-value electrolytic or tantalum capacitor used for low-frequency filtering and energy buffering. The second capacitor, C2, is typically a small-value ceramic capacitor used for high-frequency noise filtering.

[0047] Furthermore, in some feasible embodiments, reference is made to Figure 5 The branch power protection circuit 221 includes a second fuse F2 and a sub-board socket J2; the first end of the second fuse F2 is electrically connected to the main power protection module 21, and the second end of the second fuse F2 is electrically connected to the sub-board socket J2; the sub-board socket J2 is configured to be electrically connected to the corresponding connecting cable L0 to establish an electrical connection path between the main power protection module 21 and the corresponding sub-board module 30.

[0048] In this embodiment, the branch power protection circuit 221 achieves independent, precise protection and standardized, rapid connection for each power branch leading to the sub-board module 30 by connecting the second fuse F2 in series with the sub-board socket J2. Specifically, each second fuse F2 is independently connected in series in its corresponding power branch, and the rated value of the second fuse F2 can be specifically selected according to the power consumption of the downstream sub-board module 30 and its connected load device 40. The output terminal of the second fuse F2 is directly connected to the sub-board socket J2 used for docking the connection cable L0, so that when any sub-board module 30 or its load circuit experiences a short circuit or overcurrent fault, only the second fuse F2 of the corresponding branch power protection circuit 221 will be triggered (e.g., disconnection or a sharp increase in impedance), thereby strictly isolating the fault within this branch. This effectively prevents the risk of the fault spreading to the upper level (main power protection module 21) or to the same level (other normal branches), achieving point-to-point fault isolation. Meanwhile, the standardized daughterboard socket J2 design makes the insertion and removal of the connecting cable L0 simple, reliable and prevents misinsertion, greatly simplifying the wiring work in production assembly and subsequent maintenance.

[0049] It should be noted that the second fuse F2 can be a PTC resettable fuse. When an overcurrent occurs, the impedance of the second fuse F2 increases sharply to limit the current. Once the fault is cleared and the circuit cools down, it automatically returns to a low impedance state, requiring no manual replacement. This makes it particularly suitable for industrial equipment requiring high availability and ease of maintenance. Of course, a disposable traditional fuse can also be selected depending on cost and maintenance strategy.

[0050] The daughterboard connector J2 refers to a standard electrical connector, typically a multi-pin design, including power (e.g., 24V, GND) pins and a certain number of signal pins. The daughterboard connector J2 is configured to electrically connect with the corresponding connecting cable L0, meaning that the plug end of the connecting cable L0 has a matching interface. The two can be plugged together to quickly establish a reliable electrical and mechanical connection, which is a key physical interface for realizing distributed and modular assembly.

[0051] In a specific embodiment, the branch power supply protection module 22 may include multiple parallel branch protection circuits (e.g., Figure 6 The diagram shows the first branch protection circuit, the second branch protection circuit, the third branch protection circuit, and the fourth branch protection circuit, to achieve multiple independent outputs. Furthermore, in addition to the branch protection circuit for connecting to the daughterboard module 30, the branch power protection module 22 can also integrate... Figure 6The sensor terminal J3 and the third fuse F3 shown are illustrated. The sensor terminal J3 is typically a multi-pin (e.g., 8-pin) connector used to directly connect the power and signal lines of an external sensor. The third fuse F3 (specification, for example, 30V 0.35A) is specifically connected in series in the power path leading to the sensor terminal J3, thus creating a fine protection branch with a lower rated current, independent of the main power supply circuit of the daughterboard module 30. When an independent sensor directly connected to the sensor terminal J3 experiences a short circuit or other fault, the third fuse F3, with its extremely low rated current, will quickly activate and cut off the power supply to that independent sensor. This strictly limits the impact of the fault to the independent sensor circuit itself, effectively preventing the second fuse F2 of the branch power protection module 22 from malfunctioning due to the fault of a single independent sensor. This ensures accurate fault location and minimal isolation, prevents unexpected power outages in non-faulty parts, and significantly improves the system's local fault tolerance and overall operational continuity.

[0052] Furthermore, in some other feasible embodiments, the sub-board module 30 includes a sub-board terminal block J2', a status indicator unit, and a filtering unit; the sub-board terminal block J2' is electrically connected to the sub-board socket J2 connected to the corresponding connecting cable L0; the status indicator unit and the filtering unit are respectively connected to the power supply terminal of the sub-board terminal block J2'.

[0053] In this embodiment, refer to Figure 7 The sub-board module 30 integrates sub-board terminals J2' corresponding to each sub-board socket J2, a status indicator unit (i.e., the fourth resistor R4 and the second diode D2), and a filtering unit (i.e., the third capacitor C3, the fourth capacitor C4, and the fifth capacitor C5) to achieve efficient management, status visualization, and power quality optimization of the load device 40. Specifically, the sub-board terminal J2' serves as the connection interface with the corresponding sub-board socket J2 in the main distribution board 20. It receives the external power supply voltage transmitted through the main distribution board 20 via the connection cable L0 and supplies it to the connected load device 40. The status indicator unit connected to the power supply terminal J2' provides real-time and intuitive indication of the power supply status of the external power supply voltage connected to the sub-board module 30, i.e., intuitively displays whether the power supply of the load device 40 connected to the sub-board module 30 is normal. At the same time, the filtering unit filters out high-frequency and low-frequency noise from the input external power supply voltage, providing a stable and clean local power supply for the load device 40.

[0054] It should be noted that multiple daughterboard modules 30 may include Figure 8 The first sub-board module A1030, the second sub-board module B1030, the third sub-board module C1030, and the fourth sub-board module D1030 are shown.

[0055] Furthermore, in some feasible embodiments, the status indication unit includes a fourth resistor R4 and a second diode D2. The first end of the fourth resistor R4 is connected to the power supply terminal of the sub-board terminal J2', the second end of the fourth resistor R4 is electrically connected to the anode of the second diode D2, and the cathode of the second diode D2 is grounded.

[0056] In this embodiment, the status indication unit, composed of a fourth resistor R4 and a second diode D2, achieves low-cost, high-reliability visual indication of the power status of the daughterboard module 30. Specifically, refer to... Figure 7 The first end of the fourth resistor R4 is connected to the power supply terminal of the sub-board terminal J2', and the second end of the fourth resistor R4 is electrically connected to the anode of the second diode D2, while the cathode of the second diode D2 is grounded. When the sub-board terminal J2' receives normal power from the main distribution board 20, current flows through the fourth resistor R4 and the second diode D2, driving the second diode D2 to emit light, thus visually indicating that the sub-board module 30 has been successfully powered on and the power path is unobstructed. In other words, this application converts the electrical status into a visible light signal by setting a status indicator unit, enabling equipment assembly or maintenance personnel to confirm whether the power supply to the functional area has been established within seconds, without the need for any instrument measurements, thus achieving rapid fault location.

[0057] Furthermore, in some other feasible embodiments, the filtering unit includes a third capacitor C3, a fourth capacitor C4, and a fifth capacitor C5; the first end of the third capacitor C3 is electrically connected to the power supply terminal of the sub-board terminal J2', and the first end of the fourth capacitor C4 is electrically connected to the first end of both the third capacitor C3 and the fifth capacitor C5; the second end of the third capacitor C3 is grounded, and the second end of the fourth capacitor C4 is electrically connected to the second end of both the third capacitor C3 and the fifth capacitor C5.

[0058] In this embodiment, the filtering unit provides a wide-bandwidth, low-impedance power noise suppression channel for the sub-board module 30 and its load device 40 through a parallel network consisting of the third capacitor C3, the fourth capacitor C4 and the fifth capacitor C5, which significantly improves the local power supply quality.

[0059] Specifically, the third capacitor C3, the fourth capacitor C4, and the fifth capacitor C5 are designed with different capacitance values ​​and complementary frequency characteristics, and are connected in parallel between the power input terminal and ground of the daughterboard module 30. Since capacitors of different capacitance values ​​have different impedances to noise at different frequencies, the smaller fifth capacitor C5 is good at filtering high-frequency noise (such as spikes generated by switching power supplies and crosstalk in digital circuits), the larger third capacitor C3 is good at absorbing low-frequency fluctuations (such as voltage drops caused by sudden changes in the load device 40), and the middle-capacity fourth capacitor C4 covers the mid-frequency range. When connected in parallel, they effectively establish a low-impedance path from low to high frequencies between the power supply and ground, effectively bypassing interference signals of various frequencies coupled on the transmission line or generated by the load device 40 to ground. This ensures that the logic circuits and sensitive devices on the daughterboard module 30 receive a smooth and stable DC voltage. This is crucial for ensuring the accuracy of the limit sensor signal and preventing malfunctions of the solenoid valve, and is a key measure to improve the overall anti-interference capability and operational stability of the system from the electrical terminal level.

[0060] In another embodiment, the main power input socket J1 of the main distribution board 20 is the power input terminal of the main distribution board 20, which can be powered by a 24V switching power supply. The external power supply connected to the main power input socket J1 is routed through the main distribution board 20 to each sub-board module 30 to power the I / O devices (i.e., load devices 40) of the entire semiconductor equipment. For hierarchical and segmented protection and fault isolation, a main power protection module 21 with a 2.6A PTC self-resetting fuse is connected in series with the main power input socket J1; and in each branch power protection circuit 221 electrically connected to the sub-board module 30, a PTC self-resetting fuse of appropriate specification is connected in series according to the load condition of the sub-board module 30. When an I / O device experiences an overload / short circuit during production, only the power supply to that sub-board module 30 will be disconnected first.

[0061] To facilitate quick fault location by debugging and maintenance personnel, power indicator lights are installed on the main distribution board 20 and each sub-module 30 (i.e., the main distribution board 20 is equipped with a first diode D1, and the sub-module 30 is equipped with a second diode D2). Operators can quickly determine the approximate location of the electrical fault by observing the on / off state of the power indicator lights. For example, if the power indicator light on the main distribution board 20 is normal, but the power indicator light on the first sub-module is faulty, the electrical fault can be directly located to the first sub-module.

[0062] In yet another embodiment, reference is made to... Figure 9The first daughterboard module A1030 is installed on the panel inside the semiconductor equipment. It has 10 input interfaces and 3 output interfaces, which can meet all the electrical function wiring of the probe station panel, such as the cylinder limit sensors for the CCD (Charge-Coupled Device) up, down, left and right, the origin limit of the probe station pin seat, and the solenoid valve for controlling the cylinder.

[0063] The installation location of the second daughterboard module B1030 is as follows: Figures 9 to 10 As shown, this is the final stage in the assembly process, with 7 input and 9 output interfaces. These interfaces support control of the three-color alarm light, the large / small / vacuum breaking solenoid valves of the plate-bearing stage, the brush motor, the LED strip, Y-axis positive and negative origin limit input signals, the main unit's total air pressure sensor input signal, the plate-bearing stage's total vacuum sensor input signal, the safety door positioning detection signal, the emergency stop signal, and the integrating sphere grounding. While not all sensors are mounted on the outer casing, they are all located near their designated mounting positions, and their integration facilitates maintenance.

[0064] The installation location of the third daughterboard module C1030 is... Figure 11 The area at the bottom of the back of the machine shown is controlled by a solenoid valve, which is subject to significant interference. This valve controls whether the solenoid valve is energized to control the cylinder's movement, thereby enabling the CCD to move up, down, left, right, forward, backward, purge nitrogen, and clean the needle.

[0065] The installation location of the fourth daughterboard module D1030 is as follows: Figure 12 As shown, the probe station, mounted on the motor-controlled mounting platform 100, is a core component and includes limit signals for the X-axis and rotary axis. Due to frequent movement, the connection cable between the fourth sub-board module D1030 and the main distribution board 20 needs to be routed via a cable chain. The cable must be able to withstand 500W~1000W bends. This type of cable is relatively expensive. If a distributed wiring board approach is used, only the quality of the connection cable between the fourth sub-board module D1030 and the main distribution board 20 needs to be carefully controlled to meet the design requirements, without requiring high-quality cables for every electrical component connection on the mounting platform.

[0066] Furthermore, based on the first embodiment of the electrical wiring system of this application, a second embodiment of the electrical wiring method of this application is proposed. The electrical wiring method is applied to the electrical wiring system described above, and the electrical wiring method includes steps S10 to S20.

[0067] Step S10: Connect the external power supply voltage through the main power input socket J1 of the main distribution board 20; Step S20: Based on the control command issued by the motion control module 10 to the main distribution board 20, enable the main distribution board 20 to provide the external power supply voltage to the sub-board modules 30 connected to each connecting cable L0.

[0068] In this embodiment, the main distribution board 20 is safely connected to the external power supply voltage through the main power input socket J1, and in response to the control commands issued by the motion control module 10, distributes the external power supply voltage to the corresponding sub-board modules 30 via different connecting cables L0. In other words, this application replaces the centralized adapter board / junction box in the traditional architecture with the main distribution board 20, constructing a clear hierarchical first-level distribution node, fundamentally changing the power and signal transmission topology, and laying a structural foundation for subsequent modular assembly, rapid fault location and isolation.

[0069] In addition, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the electrical wiring method described above.

[0070] This application provides a semiconductor device, which includes the electrical routing system semiconductor device described above. The semiconductor device may further include: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the electrical routing method in Embodiment 1 above.

[0071] The following is for reference. Figure 13 The diagram illustrates a structural schematic of a semiconductor device suitable for implementing embodiments of this application. The semiconductor device in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 13 The semiconductor device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments of this application.

[0072] like Figure 13As shown, the semiconductor device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.) that can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the semiconductor device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows the semiconductor device to communicate wirelessly or wiredly with other devices to exchange data. Although the figure shows a semiconductor device with various devices, it should be understood that it is not required to implement or possess all of the devices shown. More or fewer devices may be implemented or possessed alternatively.

[0073] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0074] The semiconductor device provided in this application, employing the electrical wiring method described in the above embodiments, can solve the technical problem of how to automate the monitoring of brushing behavior to improve the user's brushing behavior without interfering with the normal brushing process. Compared with the prior art, the beneficial effects of the semiconductor device provided in this application are the same as those of the electrical wiring method provided in the above embodiments, and other technical features of this semiconductor device are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0075] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0076] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0077] This application provides a medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the electrical wiring method in the above embodiments.

[0078] The computer storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of the medium may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0079] The aforementioned medium may be included in a semiconductor device; or it may exist independently without being assembled into a semiconductor device.

[0080] The aforementioned medium carries one or more programs, which, when executed by a semiconductor device, cause the semiconductor device to perform the following electrical routing operations: Connect the external power supply voltage through the main power input socket on the main distribution board; Based on the control command issued by the motion control module to the main distribution board, the main distribution board is enabled to provide the external power supply voltage to the corresponding sub-board modules of each connecting cable.

[0081] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0082] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0083] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0084] The computer storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the above-described electrical wiring method, thus solving the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods. Compared with the prior art, the beneficial effects of the computer storage medium provided in this application are the same as those of the electrical wiring method provided in the above embodiments, and will not be repeated here.

[0085] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the electrical wiring method described above.

[0086] The computer program product provided in this application solves the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the electrical wiring method provided in the above embodiments, and will not be repeated here.

[0087] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. An electrical routing system, characterized by, The electrical wiring system includes: Motion control module; A main distribution board, which is electrically connected to the motion control module, and the main distribution board is provided with a main power input socket; Multiple sub-board modules are provided, each sub-board module is disposed in a corresponding functional component area, and each sub-board module is electrically connected to at least one load device in the corresponding functional component area. Multiple connecting cables, each connecting cable connecting the main distribution board to a corresponding sub-board module; wherein, The main distribution board is configured to connect to an external power supply voltage via the main power input socket, and to provide the external power supply voltage to the corresponding sub-board modules of each of the connecting cables according to the control commands issued by the motion control module.

2. The electrical routing system of claim 1, wherein, The main distribution board includes a main power protection module and branch power protection modules; The main power protection module is connected in series between the main power input socket and the branch power protection module, and the branch power protection module includes multiple branch power protection circuits; Each branch power protection circuit corresponds to one of the connecting cables, and each branch power protection circuit is connected between the main power protection module and the corresponding connecting cable.

3. The electrical routing system of claim 2, wherein, The main power protection module includes a first fuse, a switching transistor, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, and a first diode; The first end of the first fuse is electrically connected to the first end of the main power input socket, the second end of the first fuse is electrically connected to the first path terminal of the switching transistor, the first end of the first resistor is electrically connected to the second path terminal of the switching transistor and the first end of the first capacitor, the second end of the first resistor is electrically connected to the control terminal of the switching transistor and the first end of the second resistor, the second end of the second resistor is electrically connected to the second end of the main power input socket and the second end of the first capacitor, the first end of the first capacitor is connected to the power supply terminal, and the second end of the first capacitor is grounded. The first terminal of the second capacitor is electrically connected to the first terminal of the first capacitor and the first terminal of the third resistor, respectively. The first terminal of the third resistor is also electrically connected to the branch power protection module. The second terminal of the second capacitor is electrically connected to the second terminal of the first capacitor and the cathode of the first diode, respectively. The anode of the first diode is electrically connected to the second terminal of the third resistor.

4. The electrical routing system of claim 2, wherein, The branch power supply protection circuit includes a second fuse and a sub-board socket; The first end of the second fuse is electrically connected to the main power protection module, and the second end of the second fuse is electrically connected to the sub-board socket; The sub-board socket is configured to be electrically connected to the corresponding connection cable to establish an electrical connection path between the main power protection module and the corresponding sub-board module.

5. The electrical wiring system as described in claim 4, characterized in that, The sub-board module includes sub-board wiring terminals, a status indicator unit, and a filtering unit; The subboard terminals are electrically connected to the subboard sockets connected to the corresponding connecting cables; The status indicator unit and the filter unit are respectively connected to the power supply terminal of the sub-board wiring terminal.

6. The electrical wiring system as described in claim 5, characterized in that, The status indication unit includes a fourth resistor and a second diode. The first end of the fourth resistor is connected to the power supply terminal of the sub-board terminal block, and the second end of the fourth resistor is electrically connected to the anode of the second diode. The cathode of the second diode is grounded.

7. The electrical wiring system as described in claim 5, characterized in that, The filtering unit includes a third capacitor, a fourth capacitor, and a fifth capacitor; The first terminal of the third capacitor is electrically connected to the power supply terminal of the sub-board wiring terminal, and the first terminal of the fourth capacitor is electrically connected to the first terminal of the third capacitor and the first terminal of the fifth capacitor. The second terminal of the third capacitor is grounded, and the second terminal of the fourth capacitor is electrically connected to the second terminal of the third capacitor and the second terminal of the fifth capacitor, respectively.

8. An electrical wiring method, characterized in that, The electrical wiring method is applied to the electrical wiring system according to any one of claims 1 to 7, wherein the electrical wiring method comprises: Connect the external power supply voltage through the main power input socket on the main distribution board; Based on the control command issued by the motion control module to the main distribution board, the main distribution board is enabled to provide the external power supply voltage to the corresponding sub-board modules of each connecting cable.

9. A semiconductor device, characterized in that, The semiconductor device includes the electrical wiring system as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer storage medium stores a computer program, which, when executed by a processor, implements the steps of the electrical wiring method as described in claim 8.

Images