Apparatus for processing substrate and method for processing substrate

Abstract

The present invention relates to an apparatus for processing a substrate and a method for processing a substrate. Provided is a technique for transporting a substrate by magnetic suspension while suppressing an increase in the occupied area of a device to be arranged. An apparatus for processing a substrate uses a substrate transport module, the substrate transport module comprising: a stage on which the substrate is placed; a traveling plate; and a second magnet having a repulsive force acting between the first magnet and the second magnet, the substrate transport module being configured so as to be capable of moving by magnetic suspension in a substrate transport chamber having a floor portion in which the first magnet is provided. The substrate conveying module is made to move upwards relative to a substrate processing chamber which is arranged on the upper surface side of the substrate conveying chamber and is provided with an opening part in the substrate conveying chamber, so that the objective table on which the substrate is loaded is inserted into the substrate processing chamber through the opening part. The opening is closed by the travel plate, and the substrate is processed in this state.

Description

[0001] This application is a divisional application of the application filed on August 12, 2021, with application number 202180050414.3 (PCT / JP2021 / 029759) and entitled "Apparatus and Method for Processing a Substrate". Technical Field

[0002] This disclosure relates to an apparatus for processing a substrate and a method for processing a substrate. Background Technology

[0003] For example, in an apparatus for processing a semiconductor wafer (hereinafter also referred to as a "wafer") that serves as a substrate, the wafer is transported between a carrier containing the wafer and a wafer processing chamber where the processing is performed. Various wafer transport mechanisms with different structures are used when transporting the wafer.

[0004] For example, Patent Document 1 describes a magnetic levitation conveying device including a conveying platform. Under the action of magnetic force from the magnetic poles, the conveying platform levitates and moves along the conveying path while maintaining a non-contact state relative to the track and partition, and conveys the transported objects such as semiconductor wafers.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 7-117849 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] This disclosure provides a technique for suppressing the increase in the occupied area of ​​the configured device and for transporting the substrate using magnetic levitation.

[0010] Solution for solving the problem

[0011] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0012] The apparatus for processing the substrate includes:

[0013] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0014] A substrate transport module includes: a stage for holding the substrate; a traveling plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by using magnetic levitation through the repulsive force.

[0015] A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through.

[0016] By moving the substrate transport module upward, the stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed by the traveling plate. The substrate is then processed in this state.

[0017] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0018] The apparatus for processing the substrate includes:

[0019] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0020] A substrate transport module includes: a stage for holding the substrate; a traveling plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by using magnetic levitation through the repulsive force.

[0021] Multiple substrate processing chambers are disposed on the upper surface side of the substrate transport chamber for processing the substrates. Each substrate processing chamber has an opening in the substrate transport chamber that allows at least a portion of the stage, in which the substrate is placed, to pass through.

[0022] By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state.

[0023] The substrate transport chamber is configured at a height such that other substrate transport modules can move below the substrate transport module when the stage is inserted into the substrate processing chamber.

[0024] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0025] The apparatus for processing the substrate includes:

[0026] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0027] A substrate transport module includes: a stage for holding the substrate; a traveling plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by using magnetic levitation through the repulsive force.

[0028] A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through.

[0029] By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state.

[0030] The substrate conveying module includes: a heating unit disposed on the stage for heating the substrate; and a heating power supply unit for supplying heating power to the heating unit.

[0031] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0032] The apparatus for processing the substrate includes:

[0033] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0034] A substrate transport module includes: a stage for holding the substrate; a traveling plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by using magnetic levitation through the repulsive force.

[0035] A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through.

[0036] By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state.

[0037] The substrate transport module has multiple lifting pins configured to protrude and retract freely relative to the mounting surface of the stage on which the substrate is placed, so as to transfer the substrate between the substrate and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

[0038] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0039] The apparatus for processing the substrate includes:

[0040] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0041] A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet that exerts a repulsive force with the first magnet, the substrate transport module being configured to move within the substrate transport chamber by magnetic levitation using the repulsive force; and

[0042] Multiple substrate processing chambers are disposed on the upper surface side of the substrate transport chamber for processing the substrates. Each substrate processing chamber has an opening of a size that allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through into the substrate transport chamber.

[0043] By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state.

[0044] The substrate transport chamber is configured such that other substrate transport modules can move to the side below the substrate transport module which is inserted into the substrate processing chamber.

[0045] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0046] The apparatus for processing the substrate includes:

[0047] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0048] A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet that exerts a repulsive force with the first magnet, the substrate transport module being configured to move within the substrate transport chamber by magnetic levitation using the repulsive force; and

[0049] A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the size of which allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through.

[0050] By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state.

[0051] The substrate conveying module includes: a heating unit for heating the substrate; and a heating power supply unit for supplying heating power to the heating unit.

[0052] The apparatus for processing a substrate disclosed herein is an apparatus for processing a substrate, wherein...

[0053] The apparatus for processing the substrate includes:

[0054] A substrate transport chamber having a ground surface portion equipped with a first magnet;

[0055] A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet that exerts a repulsive force with the first magnet, the substrate transport module being configured to move within the substrate transport chamber by magnetic levitation using the repulsive force; and

[0056] A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the size of which allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through.

[0057] By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state.

[0058] The substrate transport module has multiple lifting pins configured to protrude and retract freely relative to the mounting surface of the substrate, so as to transfer the substrate between the substrate transport module and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

[0059] The method for processing a substrate disclosed herein is a method for processing a substrate, wherein...

[0060] The method for processing the substrate includes the following steps:

[0061] A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force.

[0062] Next, the substrate transport module is moved upward toward a plurality of substrate processing chambers, which are disposed on the upper surface side of the substrate transport chambers for processing the substrates and have openings that open toward the interior of the substrate transport chambers. The stage carrying the substrates is inserted into the substrate processing chambers through the openings, and the openings are closed using the traveling plate; and

[0063] The substrate is then processed within the substrate processing chamber.

[0064] The substrate transport chamber is configured at a height such that other substrate transport modules can move below the substrate transport module when the stage is inserted into the substrate processing chamber.

[0065] The method for processing a substrate disclosed herein is a method for processing a substrate, wherein...

[0066] The method for processing the substrate includes the following steps:

[0067] A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force.

[0068] Next, the substrate transport module is moved upward toward the substrate processing chamber, which is located on the upper surface of the substrate transport chamber to process the substrate and has an opening that opens toward the substrate transport chamber. The stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed by the traveling plate.

[0069] Subsequently, the substrate is heated using the heating unit of the stage provided in the substrate transport module, and the substrate is processed in the substrate processing chamber; and

[0070] The heating element is supplied with heating power by the thermoelectric supply unit provided in the substrate conveying module.

[0071] The method for processing a substrate disclosed herein is a method for processing a substrate, wherein...

[0072] The method for processing the substrate includes the following steps:

[0073] A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force.

[0074] Next, the substrate transport module is moved upward toward the substrate processing chamber, which is located on the upper surface of the substrate transport chamber for processing the substrate and has an opening that opens into the substrate transport chamber. The stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed using the traveling plate; and

[0075] The substrate is then processed within the substrate processing chamber.

[0076] The method for processing the substrate further includes the following steps: the substrate transport module uses a plurality of lifting pins configured to protrude freely into and out of the mounting surface of the substrate relative to the stage, to transfer the substrate between itself and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

[0077] The effects of the invention

[0078] According to this disclosure, it is possible to suppress the increase in the occupied area of ​​the configured device and to transport the substrate using magnetic levitation. Attached Figure Description

[0079] Figure 1 This is a top view of the wafer processing apparatus disclosed herein.

[0080] Figure 2 This is a longitudinal sectional side view of the wafer processing apparatus.

[0081] Figure 3 This is a longitudinal sectional front view of the wafer processing apparatus.

[0082] Figure 4 This is a schematic diagram of the ground section of the vacuum transport chamber and the wafer transport module.

[0083] Figure 5 This is an enlarged longitudinal sectional side view of the vacuum delivery chamber.

[0084] Figure 6 This is the first operational diagram of the wafer transport module.

[0085] Figure 7 This is the second operational diagram of the wafer transport module.

[0086] Figure 8 This is a first operational diagram of the wafer transport module in another embodiment.

[0087] Figure 9 This is a second operational diagram showing the operation of a wafer transport module according to another embodiment.

[0088] Figure 10 This is an explanatory diagram of an integrated wafer transport module. Detailed Implementation

[0089] The following is for reference Figures 1-3 The overall structure of the wafer processing apparatus 100, which is the apparatus for processing substrates in this embodiment, will be described.

[0090] exist Figures 1-3 A multi-chamber type wafer processing apparatus 100 is shown, comprising multiple wafer processing chambers 110 serving as substrate processing chambers for processing wafer W. For example... Figure 1 As shown, the wafer processing apparatus 100 includes a loading port 141, an atmospheric transport chamber 140, a loading interlock chamber 130, a vacuum transport chamber 120, and a plurality of wafer processing chambers 110. In the following description, the direction in which the loading port 141 is located will be referred to as the forward side.

[0091] In the wafer processing apparatus 100, the loading port 141, the atmospheric transport chamber 140, the loading interlock chamber 130, and the vacuum transport chamber 120 are arranged sequentially in the front-rear direction from the near-front side. In addition, a plurality of wafer processing chambers 110 are arranged on the upper surface side of the vacuum transport chamber 120.

[0092] The loading port 141 is configured as a mounting stage for holding a carrier C that accommodates a wafer W to be processed. As the carrier C, for example, a FOUP (Front Opening Unified Pod) can be used.

[0093] The atmospheric transport chamber 140 is equipped with an atmospheric pressure atmosphere, for example, forming a downward flow of clean air. Furthermore, a wafer transport mechanism (not shown) for transporting the wafer W is provided inside the atmospheric transport chamber 140. The wafer transport mechanism within the atmospheric transport chamber 140 transports the wafer W between the carrier C and the loading interlock chamber 130.

[0094] A loading interlock chamber 130 is located between a vacuum transport chamber 120 and an atmospheric transport chamber 140. The loading interlock chamber 130 has a stage 131 for holding the fed wafer W. The loading interlock chamber 130 is configured to switch between atmospheric pressure and vacuum atmospheres. The loading interlock chamber 130 and the atmospheric transport chamber 140 are connected via a gate valve 133. Furthermore, the loading interlock chamber 130 and the vacuum transport chamber 120 are connected via a gate valve 132. Moreover, a wafer transport mechanism 160 is provided in the loading interlock chamber 130 for transporting the wafer W between it and the vacuum transport chamber 120; its structure will be described later.

[0095] The vacuum transport chamber 120 is depressurized to a vacuum atmosphere using a vacuum exhaust mechanism (not shown). Furthermore, a wafer transport module 20 for transporting wafers W between the stage 131 and each wafer processing chamber 110 is provided inside the vacuum transport chamber 120. The detailed structure of the wafer transport module 20 will be described later. The vacuum transport chamber 120 corresponds to the substrate transport chamber of this embodiment.

[0096] like Figures 1-3 As shown, the vacuum transport chamber 120 is constructed from a shell that is relatively long in the front-to-back direction and rectangular when viewed from above. In the wafer processing apparatus 100 of this example, a total of eight wafer processing chambers 110 are provided on the upper surface of the vacuum transport chamber 120. These wafer processing chambers 110 are arranged in two rows, left and right, with four chambers in each row when viewed from the front.

[0097] Each wafer processing chamber 110 utilizes a vacuum exhaust mechanism (not shown) to reduce pressure to a vacuum atmosphere, and performs prescribed processing on the wafer W within it. Examples of processing performed on the wafer W include etching, film deposition, cleaning, and ashing. When processing gas is used for processing the wafer W, the wafer processing chamber 110 is equipped with a processing gas supply unit 112 consisting of spray heads, etc. Figure 2 , Figure 3 ).

[0098] Furthermore, a circular opening 111 is formed on the lower surface of each wafer processing chamber 110 at the location where it connects to the upper surface of the vacuum transport chamber 120. This opening penetrates the top of the vacuum transport chamber 120 and communicates with the internal space of the vacuum transport chamber 120. On the other hand, no gate valve or similar device for opening and closing this opening 111 is provided between each wafer processing chamber 110 and the vacuum transport chamber 120. The wafer processing chamber 110 corresponds to the substrate processing chamber of this embodiment.

[0099] In the wafer processing apparatus 100 with the above-described general structure, the wafer transport module 20 is configured to move within the vacuum transport chamber 120 using magnetic levitation. Furthermore, the wafer transport module 20 not only performs the transport of the wafer W, but also has the following function: during the processing of the wafer W, it is connected to the wafer processing chamber 110 and supports the wafer W fed into the wafer processing chamber 110.

[0100] The following describes in detail the structure of the equipment related to the transport and processing of wafer W using wafer transport module 20.

[0101] like Figure 2 , Figure 3 As shown, the wafer transport module 20 includes: a stage 21 on which a wafer W is placed; and a travel plate 22 disposed on the lower side of the stage 21.

[0102] For example, the stage 21 is formed as a flat circular plate, and its upper surface serves as a mounting surface for placing the wafer W, which is the object to be transported and processed. The diameter of the stage 21 is smaller than the diameter of the opening 111 formed on the wafer processing chamber 110 side, so that the stage 21 can be inserted into the interior of the wafer processing chamber 110 through the opening 111.

[0103] In addition, as long as the diameter of the opening 111 is larger than the diameter of the wafer W, and as long as a portion of the stage 21 on which the wafer W is placed is of a size that can be inserted into the opening 111.

[0104] like Figure 6 As shown, a heating unit 31 may also be provided inside the stage 21 to heat the wafer W placed on the stage 21 during processing. The heating unit 31 is powered by a battery 32, which is a heating power supply unit provided in the wafer transport module 20, thereby heating the stage 21.

[0105] For example, battery 32 uses a power supply control unit (not shown) provided in wafer transport module 20 to control the increase, decrease, supply, and stop of power supplied to heating unit 31. Alternatively, the power supply control unit may be configured to obtain control signals for power supply control via wireless communication with control unit 150 (described later).

[0106] Alternatively, when heating the wafer W is performed by installing a heating lamp or LED (light emitting diode) on the wafer processing chamber 110 side, the heating unit 31 inside the stage 21 may not be required.

[0107] For example, a circular travel plate 22 is provided on the lower side of the stage 21, which is arranged to support the stage 21 from the lower surface. The diameter of the travel plate 22 is configured to be larger than the diameter of the stage 21, and it is able to close the opening 111 of the wafer processing chamber 110.

[0108] An O-ring 23 is provided on the upper surface of the travel plate 22 in such a way that it surrounds the stage 21 (the opening 111 on the wafer processing chamber 110 side). The O-ring 23 serves to keep the wafer processing chamber 110 airtight when the travel plate 22 closes the opening 111.

[0109] Moreover, such as Figure 6 As shown in the enlarged view, an alignment pin 33 may also be provided on the upper surface of the travel plate 22. In this case, the wafer transport module 20 is aligned by inserting the alignment pin 33 into the alignment hole 34 provided on the top surface side of the vacuum transport chamber 120, and then the stage 21 is inserted into the wafer processing chamber 110. Through this alignment, the wafer W can be processed at the pre-set correct position.

[0110] Furthermore, the travel plate 22 is not limited to an example of being composed of a plate-shaped member that supports the platform 21 from its lower surface. For example, the travel plate 22 may also be composed of an annular member that extends from the lower side peripheral surface of the platform 21 into a flange shape.

[0111] like Figure 4 As schematically shown, a plurality of ground-side coils 15 are arranged within the ground surface 10 of the vacuum delivery chamber 120. The ground-side coils 15 generate a magnetic field by being powered by a power supply unit (not shown). From this viewpoint, the ground-side coils 15 correspond to the first magnet of this embodiment.

[0112] On the other hand, multiple module-side coils 35 are also arranged inside the wafer transport module 20. These module-side coils 35 exert a repulsive force with the magnetic field generated by the ground-side coils 15. This repulsive force enables the wafer transport module 20 to be magnetically levitated relative to the ground surface 10. Furthermore, by adjusting the strength and position of the magnetic field generated by the ground-side coils 15, the wafer transport module 20 can be moved in a desired direction on the ground surface 10, the levitation amount can be adjusted, and the orientation of the wafer transport module 20 can be adjusted. Alternatively, a permanent magnet can be auxiliaryly arranged inside the wafer transport module 20 along with the multiple module-side coils 35.

[0113] The module-side coil 35 provided in the wafer transport module 20 corresponds to the second magnet in this embodiment. The module-side coil 35 is powered by a battery 32, which serves as a magnet power supply unit, located within the wafer transport module 20, and functions as an electromagnet. For ease of illustration, in... Figure 6 , Figure 7 In this configuration, power is supplied to the module-side coil 35 using a component shared with the battery 32 that supplies power to the heating unit 31. Alternatively, unlike this example, the heating power supply unit and the magnet power supply unit may be composed of different batteries 32.

[0114] Alternatively, instead of the module-side coil 35, a second magnet can be formed by simply setting a permanent magnet within the wafer transport module 20.

[0115] For example, each module-side coil 35 can be controlled by a power supply control unit (not shown) provided within the wafer transport module 20 to increase, decrease, supply, and stop the power supplied to it. Alternatively, the power supply control unit can be configured to acquire control signals for power supply control via wireless communication with the control unit 150 described later.

[0116] In addition, within the vacuum transport chamber 120, a plurality of lifting mechanisms 4 are provided corresponding to each wafer processing chamber 110 for performing the action of inserting the stage 21 into the wafer processing chamber 110 through the opening 111.

[0117] like Figure 2 , Figure 3 As shown, the lifting mechanism 4 includes: a support plate 41 that supports the wafer transport module 20 from the bottom side; a base portion 45 disposed on the lower surface side of the ground portion 10 and including a slider 44 that moves up and down along a track not shown; and a support portion 42 that supports the support plate 41 and passes through the vacuum transport chamber 120 and is connected to the slider 44.

[0118] By moving the wafer transport module 20 onto the support plate 41, the slider 44 is moved upward, thereby lifting the wafer transport module 20 supported by the support plate 41 toward the wafer processing chamber 110.

[0119] Furthermore, a flexible bellows 43 is provided between the lower surface of the ground surface 10 and the upper surface of the sliding member 44, surrounding the support portion 42 that penetrates the ground surface 10. This bellows 43 suppresses the entry of gases from the external atmosphere, keeping the interior of the vacuum delivery chamber 120 airtight.

[0120] Here, as Figure 2 , Figure 3 As shown, the internal space of the vacuum transport chamber 120 is configured with the following height dimension: when the support plate 41 is raised and the stage 21 is inserted into the wafer processing chamber 110, other wafer transport modules 20 can be moved on its lower side.

[0121] In addition, such as Figure 1 , Figure 2 As shown, for example, a cleaning chamber 123 is connected to the rear end of the vacuum transport chamber 120 via a gate valve 124. The cleaning chamber 123 is structured to accommodate the wafer transport module 20. Furthermore, the wafer transport module 20, which has reaction products or the like attached to the stage 21 during wafer W processing, is moved into the cleaning chamber 123, and cleaning gas is supplied toward the stage 21. As a result, cleaning to remove reaction products is performed. Alternatively, instead of the cleaning chamber 123, a wafer transport module replacement chamber or a stage replacement chamber that stores multiple wafer transport modules 20 and stages 21 may be connected to the vacuum transport chamber 120.

[0122] Furthermore, a locking module 50 is provided inside the vacuum transport chamber 120. This locking module 50 is used to close the opening 111 of the wafer processing chamber 110 during periods when wafer W is not being processed. The locking module 50 is configured similarly to the wafer transport module 20 described above, except that it does not have a stage 21. That is, the locking module 50 includes a module-side coil 35 within the travel plate 22, and is magnetically levitated by the repulsive force acting between it and the ground-side coil 15 of the ground surface 10, thus enabling it to move within the vacuum transport chamber 120.

[0123] The locking module 50 moves upward using the lifting mechanism 4 described above, and the traveling plate 22 abuts against the top surface of the opening 111 of the wafer processing chamber 110 in the vacuum transport chamber 120, thereby locking the opening 111. Alternatively, the O-ring 23 and alignment pin 33 described above can be provided on the upper surface of the traveling plate 22.

[0124] Alternatively, the number of locking modules 50 disposed in the vacuum transport chamber 120 may be less than the number of wafer processing chambers 110 disposed on the upper surface side of the vacuum transport chamber 120. If a wafer processing chamber 110 that has not been processed for wafer W is generated in the wafer W processing schedule, it is sufficient to provide a sufficient number of locking modules 50 to close the opening 111 of that wafer processing chamber 110.

[0125] In addition, such as Figure 1 As shown, for example, a retraction chamber 121 could be connected to the rear end of the vacuum delivery chamber 120 to retract the locking module 50 during periods when it is not in use. The retraction chamber 121 only needs to have space to accommodate the retracted locking module 50; its structure is not particularly limited. Furthermore, the internal spaces of the retraction chamber 121 and the vacuum delivery chamber 120 can always be in communication; the ability to separate their internal spaces using a gate valve or similar device is not a necessary element.

[0126] Next, refer to Figure 2 , Figure 5The mechanism for transferring wafer W between the loading interlock chamber 130 and the loading interlock chamber 130 will be described. For example, a wafer transport mechanism 160 is provided at the top of the loading interlock chamber 130 for transporting wafer W between the stage 131 inside the loading interlock chamber 130 and the stage 21 on the wafer transport module 20 side.

[0127] like Figure 2 As shown, the wafer transport mechanism 160 in this example includes: an arm 162 configured to rotate freely, rise freely, and extend freely about a central axis; and an end effector 163 disposed at the top end of the arm 162. A Bernoulli holding disk 161 is provided on the lower surface of the end effector 163, which is capable of lifting and transporting the wafer W in a non-contact state.

[0128] Alternatively, an edge clamp (not shown) can be provided in the end effector 163 instead of the Bernoulli holding disk 161, and the wafer W can be transported while being clamped and held by the edge clamp against the side of the wafer W. The wafer transport mechanism 160 is equivalent to the substrate transport mechanism provided outside the vacuum transport chamber 120.

[0129] On the other hand, such as Figure 5 As shown, the wafer transport module 20 has a stage 21 equipped with a plurality of lifting pins 241 configured to protrude freely into and out of the upper surface of the stage 21, which serves as a mounting surface, for transferring wafers W between the stage 21 and the wafer transport mechanism 160. A lifting mechanism is provided within the stage 21 to raise and lower the lifting pins 241, thereby performing the protrusion and insertion action.

[0130] The lifting mechanism of the lifting pin 241 includes a lifting coil 242, which serves as a third magnet. This lifting coil 242 exerts a repulsive force with the magnetic field generated by the aforementioned ground-side coil 15 located on the ground surface 10. Furthermore, by changing the levitation amount of the magnetic levitation utilizing this repulsive force, the lifting pin 241 moves up and down. Through this action, the lifting pin 241 protrudes and retracts relative to the stage 21, facilitating the transfer of the wafer W between the stage 21 and the wafer transport mechanism 160. The stage 21 is equipped with a battery (not shown) that supplies power to the lifting coil 242, and a power supply control unit that controls the power supply, similar to the case of the module-side coil 35 described above.

[0131] Furthermore, the method for achieving the lifting action of the lifting pin 241 is not limited to the use of magnetic levitation. For example, a mechanical lifting mechanism can be installed inside the platform 21, and the lifting pin 241 can be raised and lowered using a motor or the like.

[0132] The wafer processing apparatus 100 with the above structure includes a control unit 150 that controls various components such as the ground-side coils 15, the lifting mechanism 4, and the wafer processing chamber 110. The control unit 150 is a computer comprising a CPU and a storage unit, and controls the various components of the ground-side coils 10. The storage unit stores a program containing a set of steps (instructions) for controlling the operation of the wafer transport module 20 and the wafer processing chamber 110. This program is stored, for example, on a storage medium such as a hard disk, optical disk, magneto-optical disk, or memory card, and loaded into the computer from there.

[0133] Next, an example of the operation of the wafer processing apparatus 100 will be described. First, when the carrier C containing the wafer W to be processed is placed in the loading port 141, the wafer W is removed from the carrier C using a wafer transport mechanism (not shown) within the atmospheric transport chamber 140. Next, when the gate valve 133 is opened, the wafer transport mechanism enters the loading interlock chamber 130 and places the wafer W on the stage 131. Afterward, when the wafer transport mechanism retracts from the loading interlock chamber 130, the gate valve 133 is closed, switching the atmosphere within the loading interlock chamber 130 from atmospheric pressure to a vacuum atmosphere.

[0134] After a vacuum atmosphere is created within the loading interlock chamber 130, the gate valve 132 is opened, and the wafer W is transported into the vacuum transport chamber 120 using the wafer transport mechanism 160. Inside the vacuum transport chamber 120, near the connection point of the loading interlock chamber 130, a wafer transport module 20 stands by. Then, using the magnetic field generated by the ground-side coil 15 located on the ground surface 10, the lifting pin 241 is raised using magnetic levitation. At this time, the module-side coil 35 is disconnected to avoid being affected by the magnetic field generated to perform the lifting action of the lifting pin 241. Therefore, the wafer transport module 20 is placed on the upper surface of the ground surface 10 of the vacuum transport chamber 120.

[0135] Through the aforementioned actions, the top end of the lifting pin 241 protrudes to a position above the mounting surface of the wafer W, transferring the wafer W from the wafer transport mechanism 160 to the lifting pin 241. Then, the lifting pin 241 is lowered, transferring the wafer W from the lifting pin 241 to the stage 21, thereby placing the wafer W on the designated mounting surface. Then, as the wafer transport mechanism 160 retracts from the vacuum transport chamber 120, the gate valve 132 is closed.

[0136] Furthermore, when using the method of lifting the wafer W by bringing the Bernoulli holding disk 161 close to the upper surface of the wafer W, the transfer of the wafer W by means of the lifting pin 241 is not a necessary element. Alternatively, the transfer of the wafer W can be performed directly between the wafer transport mechanism 160 and the mounting surface of the stage 21.

[0137] After the wafer W is handed over to the wafer transport module 20, the module-side coil 35 of the wafer transport module 20 is turned on, and the wafer transport module 20 is moved toward the wafer processing chamber 110 where the wafer W is processed by magnetic levitation.

[0138] In the wafer processing chamber 110, which serves as the destination for wafer W, when processing of wafer W is being performed following processing of other wafer W, the support plate 41 of the lifting mechanism 4 is lowered, and the other wafer transport module 20 used for the previous wafer W processing is removed from the wafer processing chamber 110. The other wafer transport module 20 transports the processed wafer W to the handover position where it connects with the loading interlock chamber 130.

[0139] Furthermore, in the wafer processing chamber 110, which serves as the destination for transporting wafer W, in a standby state where no previous processing of wafer W has been performed, the support plate 41 is lowered, and the latching module 50 is removed from the wafer processing chamber 110. The latching module 50 is then moved to the retraction chamber 121.

[0140] Through these actions, the wafer transport module 20 and the locking module 50 of the closed opening 111 are removed, and the wafer processing chamber 110 is able to receive a new wafer W.

[0141] On the other hand, the wafer transport module 20, which receives the new wafer W, moves from the position where the wafer W is received in the self-loading interlock chamber 130 to the lower side of the wafer processing chamber 110 where the wafer W is processed. Then, it stops at a predetermined position on the support plate 41, adjusts its orientation, and then disconnects the module-side coil 35. As a result, the magnetic levitation state is released, and the wafer transport module 20 is placed on the support plate 41.

[0142] After that, as Figure 6 As shown, the support plate 41 is raised, and the stage 21 is inserted into the wafer processing chamber 110, thereby feeding the wafer W into the wafer processing chamber 110. Accompanying this action, the traveling plate 22 closes the opening 111 of the wafer processing chamber 110, forming an airtight processing space within the wafer processing chamber 110. Figure 7 ).

[0143] After the wafer W is fed in, the stage 21 heats the wafer W to a preset temperature, and processing gas is supplied to the wafer processing chamber 110 from the processing gas supply unit 112. In this way, the desired processing is performed on the wafer W.

[0144] After processing wafer W for a preset period, heating of wafer W is stopped, and the supply of processing gas is also stopped. Alternatively, cooling gas may be supplied to wafer processing chamber 110 as needed to cool wafer W. Afterward, support plate 41 is lowered, and wafer W is removed from wafer processing chamber 110.

[0145] Alternatively, another wafer transport module 20 can be used to feed the next wafer W into the wafer processing chamber 110 after the wafer W has been delivered, and then perform processing. Alternatively, it can be in a standby state where the opening 111 is locked using the latch module 50. Alternatively, cleaning can be performed inside the wafer processing chamber 110 while in standby mode.

[0146] On the other hand, after the support plate 41 descends to the ground surface 10, the wafer transfer module 20 activates the module-side coil 35 and moves using magnetic levitation to the transfer position for transferring the wafer W to the loading interlock chamber 130. Then, the processed wafer W is transferred to the loading interlock chamber 130 and the atmospheric transfer chamber 140 in the reverse order of its initial loading, and then fed into the carrier C used to hold the processed wafer W.

[0147] After the processed wafer W is transferred to the loading interlock chamber 130, the wafer transport module 20 moves to the cleaning chamber 123 after each processing of wafer W or after a predetermined number of processing cycles. In the cleaning chamber 123, cleaning is performed to remove reaction products and other contaminants, bringing the stage 21 to a clean state. The wafer transport module 20 then moves to the vacuum transport chamber 120 to perform wafer W transport again.

[0148] According to the wafer processing apparatus 100 of this embodiment, a wafer processing chamber 110 is provided on the upper surface side of the vacuum transport chamber 120. Therefore, for example, compared with the case where the wafer processing chamber 110 is connected to the side of the vacuum transport chamber 120, the increase in the occupied area of ​​the wafer processing apparatus 100 can be suppressed.

[0149] Furthermore, magnetic levitation is used to transport the wafer W. Therefore, compared with the case where a telescopic arm type wafer transport mechanism is installed in the vacuum transport chamber 120 to transport the wafer W in and out, the increase in the area occupied by the vacuum transport chamber 120 and its size can be suppressed.

[0150] Furthermore, in this embodiment, the stage 21 is mounted on the wafer transport module 20, which moves freely using magnetic levitation. Therefore, compared to the case where the stage 21 is fixedly mounted inside the wafer processing chamber 110, the stage 21 can be cleaned separately using the cleanroom 123. As a result, the stage 21, which is in direct contact with the wafer W, is always kept clean, and the generation of contamination on the wafer W due to the generation of particles, etc., can be suppressed.

[0151] Here, the upward movement of the wafer transport module 20 when the stage 21 is inserted into the wafer processing chamber 110 is not limited to the example using the lifting mechanism 4 as described above. For example, it could also be, as... Figure 8 As shown, by increasing the levitation amount of the magnetic levitation, the wafer transport module 20 is moved upward.

[0152] At this time, as described above, after the stage 21 is inserted into the wafer processing chamber 110, the module-side coil 35 of the wafer transport module 20 is disconnected to avoid the influence of the magnetic field of the ground-side coil 15. On the other hand, when the wafer transport module 20 is moved upward using magnetic levitation, if the module-side coil 35 is disconnected, the wafer transport module 20 will fall. Therefore, it is also possible that, as Figure 8 , Figure 9 As shown, a support mechanism 36 is provided on the top surface of the vacuum transport chamber 120 to support the wafer transport module 20.

[0153] The support mechanism 36 is provided with a support position that supports the travel plate 22 from the lower surface side when the stage 21 is inserted into the wafer processing chamber 110. Figure 9 The position shown) and the retreat position from that support position ( Figure 8 A support member 361 that can move freely between the positions shown. Figure 9 In the example shown, the support member 361 enters the notch 362 formed on the lower surface of the travel plate 22, and supports the travel plate 22 from the lower surface side. Alternatively, the structure could be configured such that the function of the support mechanism 36 is located on the wafer transport module 20 side.

[0154] In addition, Figure 2 , Figure 3 In the embodiments shown above, the wafer transport module 20 has the following structure: a circular plate-shaped traveling plate 22 with a diameter larger than that of the stage 21 is disposed on the lower side of the circular plate-shaped stage 21.

[0155] In contrast, for example, the wafer transport module 20a can be constructed by forming the stage 21 and the travel plate 22 as a single unit. In this case, "formed as a single unit" means that it is possible to illustrate the case where the wafer transport module 20a is constructed as a whole without distinguishing between the stage 21 and the travel plate 22.

[0156] In this case, it could also be, such as Figure 10As shown, an O-ring 23 is provided on the upper surface of the wafer transport module 20a. On the other hand, a recess is provided on the lower surface of the opening 111 on the wafer processing chamber 110 side, allowing the upper part of the wafer transport module 20a to be inserted. By inserting the upper part of the wafer transport module 20a into the recess that constitutes part of the wafer processing chamber 110, the O-ring 23 provided on the upper surface of the wafer transport module 20a abuts against the upper surface of the recess, thereby maintaining the wafer processing chamber 110 as airtight.

[0157] Furthermore, the number and arrangement of the wafer processing chambers 110 disposed on the upper surface of the vacuum transport chamber 120 are not limited to... Figures 1-3 The example shown is an example of this. Alternatively, the number of wafer processing chambers 110 can be increased or decreased as needed. For example, the case where only one wafer processing chamber 110 is provided on the upper surface of the vacuum transport chamber 120 is also included in the technology of this disclosure.

[0158] Furthermore, the configuration of the vacuum delivery chamber 120 is not limited to, for example... Figure 1 As shown, the long side of the rectangular vacuum delivery chamber 120 is arranged in the front-to-back direction. For example, when viewed from the loading port 141 side, the long side of the vacuum delivery chamber 120 may be arranged in the left-to-right direction.

[0159] Furthermore, the planar shape of the vacuum transfer chamber 120 can be varied depending on the shape of the area where the wafer processing apparatus 100 is configured. For example, it can be a square, a polygon with more than one pentagon, a circle, or an ellipse.

[0160] In addition, the substrate transport chamber used by the wafer transport module 20 to transport the wafer W to the wafer processing chamber 110 is not limited to a vacuum transport chamber 120 with an internal vacuum atmosphere. The wafer transport module 20 of this disclosure can also be applied to wafer processing apparatuses with a structure in which the wafer processing chamber 110 is located on the upper surface of the substrate transport chamber with an internal atmospheric pressure atmosphere. In this case, providing a loading interlock chamber 130 in the wafer processing apparatus is not necessary, and the wafer W taken from the carrier C to the atmospheric transport chamber 140 can be directly fed into the substrate transport chamber.

[0161] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0162] Explanation of reference numerals in the attached figures

[0163] C. Carrier; W. Wafer; 10. Ground surface; 15. Ground-side coil; 100. Wafer processing unit; 110. Wafer processing chamber; 111. Opening; 120. Vacuum transport chamber; 20. Wafer transport module; 21. Stage; 22. Traveling plate.

Claims

1. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate conveying module includes: a stage for holding the substrate; and a traveling plate disposed on the lower side of the stage. and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and Multiple substrate processing chambers are disposed on the upper surface side of the substrate transport chamber for processing the substrates. Each substrate processing chamber has an opening in the substrate transport chamber that allows at least a portion of the stage, in which the substrate is placed, to pass through. By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state. The substrate transport chamber is configured at a height such that other substrate transport modules can move below the substrate transport module when the stage is inserted into the substrate processing chamber.

2. The apparatus for processing a substrate according to claim 1, wherein, The substrate transport chamber is equipped with multiple substrate transport modules used for processing the substrates in the substrate processing chamber.

3. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate conveying module includes: a stage for holding the substrate; and a traveling plate disposed on the lower side of the stage. and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through. By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state. The substrate conveying module includes: a heating unit disposed on the stage for heating the substrate; and a heating power supply unit for supplying heating power to the heating unit.

4. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate conveying module includes: a stage for holding the substrate; and a traveling plate disposed on the lower side of the stage. and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through. By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state. The substrate transport module has multiple lifting pins configured to protrude and retract freely relative to the mounting surface of the stage on which the substrate is placed, so as to transfer the substrate between the substrate and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

5. The apparatus for processing a substrate according to claim 4, wherein, The lifting pin has a third magnet that exerts a repulsive force with the first magnet, and is configured to move up and down freely by using magnetic levitation through the repulsive force.

6. The apparatus for processing a substrate according to any one of claims 1 to 5, wherein, The upward movement of the substrate conveying module is implemented using a lifting mechanism, which has a support plate that supports the traveling plate from the lower surface side and is configured to be freely movable.

7. The apparatus for processing a substrate according to any one of claims 1 to 5, wherein, The upward movement of the substrate transport module is achieved using magnetic levitation.

8. The apparatus for processing a substrate according to claim 3 or 4, wherein, A plurality of substrate processing chambers are provided on the upper surface side of the substrate transport chamber, and a plurality of substrate transport modules for processing the substrates in the plurality of substrate processing chambers are provided in the substrate transport chamber.

9. The apparatus for processing a substrate according to claim 2 or 8, wherein, A locking module is provided in the substrate transport chamber. The locking module includes the traveling plate and the second magnet and is configured to move within the substrate transport chamber. On the other hand, the locking module does not include the stage and is used to close the opening during the period when the substrate is not being processed by using the traveling plate.

10. The apparatus for processing a substrate according to claim 9, wherein, The substrate transport chamber is connected to a retraction chamber that allows the locking module to retract during periods when it is not in use.

11. The apparatus for processing a substrate according to any one of claims 1 to 10, wherein, The second magnet is composed of an electromagnet, and the substrate transport module includes: a magnet power supply unit for supplying power to the second magnet; and a power supply control unit for stopping the supply of power to the second magnet during the period when the stage is inserted into the substrate processing chamber, so as to avoid the influence of the first magnet.

12. The apparatus for processing a substrate according to any one of claims 1 to 11, wherein, The substrate transport chamber is connected to the stage for cleaning the substrate transport module in the substrate transport chamber.

13. The apparatus for processing a substrate according to any one of claims 1 to 11, wherein, A replacement chamber for replacing the substrate transport module and / or the stage is connected to the substrate transport chamber.

14. The apparatus for processing a substrate according to any one of claims 1 to 13, wherein, The substrate is transported in the substrate transport chamber under a vacuum atmosphere, and the substrate is processed in the substrate processing chamber under a vacuum atmosphere. A loading interlock chamber is connected to the substrate transport chamber, which is configured to switch freely between atmospheric pressure and vacuum atmosphere, and the substrate is fed in and out through the loading interlock chamber.

15. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and Multiple substrate processing chambers are disposed on the upper surface side of the substrate transport chamber for processing the substrates. Each substrate processing chamber has an opening of a size that allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through into the substrate transport chamber. By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state. The substrate transport chamber is configured such that other substrate transport modules can move to the side below the substrate transport module which is inserted into the substrate processing chamber.

16. The apparatus for processing a substrate according to claim 15, wherein, The substrate transport chamber is equipped with multiple substrate transport modules used for processing the substrates in the substrate processing chamber.

17. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the size of which allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through. By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state. The substrate conveying module includes: a heating unit for heating the substrate; and a heating power supply unit for supplying heating power to the heating unit.

18. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the size of which allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through. By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state. The substrate transport module has multiple lifting pins configured to protrude and retract freely relative to the mounting surface of the substrate, so as to transfer the substrate between the substrate transport module and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

19. The apparatus for processing a substrate according to claim 18, wherein, The lifting pin has a third magnet that exerts a repulsive force with the first magnet, and is configured to move up and down freely by using magnetic levitation through the repulsive force.

20. A method for processing a substrate, wherein, The method for processing the substrate includes the following steps: A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force. Next, the substrate transport module is moved upward toward a plurality of substrate processing chambers, which are disposed on the upper surface side of the substrate transport chambers for processing the substrates and have openings that open toward the interior of the substrate transport chambers. The stage carrying the substrates is inserted into the substrate processing chambers through the openings, and the openings are closed using the traveling plate; and The substrate is then processed within the substrate processing chamber. The substrate transport chamber is configured at a height such that other substrate transport modules can move below the substrate transport module when the stage is inserted into the substrate processing chamber.

21. The method for processing a substrate according to claim 20, wherein, The substrate transport chamber is equipped with multiple substrate transport modules used for processing the substrates in the substrate processing chamber.

22. A method for processing a substrate, wherein, The method for processing the substrate includes the following steps: A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force. Next, the substrate transport module is moved upward toward the substrate processing chamber, which is located on the upper surface of the substrate transport chamber to process the substrate and has an opening that opens toward the substrate transport chamber. The stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed by the traveling plate. Subsequently, the substrate is heated using the heating unit of the stage provided in the substrate transport module, and the substrate is processed in the substrate processing chamber; and The heating element is supplied with heating power by the thermoelectric supply unit provided in the substrate conveying module.

23. A method for processing a substrate, wherein, The method for processing the substrate includes the following steps: A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force. Next, the substrate transport module is moved upward toward the substrate processing chamber, which is located on the upper surface of the substrate transport chamber for processing the substrate and has an opening that opens into the substrate transport chamber. The stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed using the traveling plate; and The substrate is then processed within the substrate processing chamber. The method for processing the substrate further includes the following steps: the substrate transport module uses a plurality of lifting pins configured to protrude freely into and out of the mounting surface of the substrate relative to the stage, to transfer the substrate between itself and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

24. The method for processing a substrate according to claim 23, wherein, The lifting pin has a third magnet that exerts a repulsive force with the first magnet. In the process of transferring the substrate, the lifting pin is raised and lowered by using magnetic levitation with the repulsive force.

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