System and method for two-phase immersion cooling

Abstract

An immersion cooling system includes an apparatus containing a heat transfer fluid comprising E-1, 1, 1, 2, 2, 5, 5, 6, 6, 6-decafluoro-3-hexene and an electronic device wherein the materials used in the apparatus and the electronic device are made of materials compatible with the heat transfer fluid. A method is also provided in which the immersion cooling system is used to cool an electronic device.

Description

Technical Field

[0001] This disclosure relates to systems and methods for two-phase immersion cooling, including materials suitable for use in such systems and methods. Background Technology

[0002] Two-phase immersion cooling (2PIC) is one of the emerging technologies for thermal management of high heat density IT equipment and power electronics. In these systems, the electronic components of IT equipment and power electronics are in direct contact with the heat transfer fluid, making the material compatibility and thermal stability of the components in contact with the heat transfer fluid critical. Particularly in 2PIC for servers, hardware reliability is directly related to: (1) the compatibility between the fluid and the information technology (IT) components or power electronics and (2) the thermal stability of the fluid in the presence of metals in the system.

[0003] The reaction of the heat transfer fluid in a 2PIC system can cause degradation of the materials used in the functional components of such systems. Degradation may generate impurities in the system and / or reduce the durability and / or reliability of such functional components, and / or cause the fluid to become contaminated with impurities as the impurities degrade.

[0004] Material compatibility in 2PIC can be subdivided into two groups: (1) primary compatibility due to changes in material properties and fluid contamination caused by direct interactions between the material and the fluid; and (2) secondary or material-to-material compatibility when the fluid acts as a carrier for transporting material extracted from one component to another. Some materials are incompatible with the heat transfer fluids used in 2PIC systems, meaning that in the presence of heat transfer fluids, or in the presence of heat transfer fluids with moisture and / or air, the material and fluid interact in a manner detrimental to the system's performance.

[0005] In addition, some heat transfer fluids have high global warming potential (GWP). New environmental regulations are prompting the industry to seek heat transfer fluids with low GWP.

[0006] Therefore, a 2PIC system is desired in which the heat transfer fluid is compatible with the materials in the system, and a method for cooling electronic devices within the 2PIC system is also desired. Summary of the Invention

[0007] The present invention relates to a 2PIC system in which the heat transfer fluid and materials are compatible in such a way as to enhance the performance of the 2PIC system for cooling electronic devices immersed therein.

[0008] In a first embodiment of the invention, an immersion cooling system is provided, the immersion cooling system comprising (i) an apparatus including: a housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; a condenser coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank connected to and connected to the main fluid tank. The system comprises: (i) a liquid communication, wherein a circulation pump is positioned within the buffer fluid tank, through which the fluid flows to and through a check valve; a filter, positioned downstream of the buffer fluid tank, through which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected by conduits; a cover, which covers the opening area of ​​the housing; and (ii) an electronic device located and at least partially immersed in the fluid within the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the conduits, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of materials compatible with the heat transfer fluid.

[0009] In another embodiment, a method for cooling an electronic device is provided. The method includes immersing the electronic device at least partially in a heat transfer fluid within an immersion cooling system; transferring heat from the electronic device by circulating the heat transfer fluid through the system; wherein the immersion cooling system includes (i) an apparatus comprising: a housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; a condenser coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank. A fluid tank is connected to and in liquid communication with the main fluid tank, wherein a circulation pump is positioned within the buffer fluid tank, through which the fluid flows to and through a check valve; a filter is positioned downstream of the buffer fluid tank, through which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected by piping; a cover covers the opening area of ​​the housing; and (ii) an electronic device located in and at least partially immersed in the fluid in the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the piping, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of materials compatible with the heat transfer fluid.

[0010] Other features and advantages of the invention will become apparent from the following more detailed description, taking into account the accompanying drawings which illustrate the principles of the invention by way of example. Attached Figure Description

[0011] Figure 1 This is a perspective view of an immersion cooling apparatus according to an embodiment of the system and method used in the present invention.

[0012] Figure 2 A perspective view of an electronic device. Detailed Implementation

[0013] Large computer server systems can perform massive workloads and generate significant amounts of heat during their operation. Most of this heat is generated by their operation. Partly due to the heat generated, these systems are typically mounted in a stacked configuration with large internal cooling fans and heatsinks. As the size and density of these systems increase, the thermal challenges become even greater, eventually exceeding the capacity of forced ventilation systems.

[0014] Two-phase immersion cooling is an emerging cooling technology targeting the high-performance cooling market, applied to high-performance server systems. It relies on the heat absorbed during the vaporization of the heat transfer fluid into a gas.

[0015] It has been found that certain heat transfer fluids used in immersion cooling interact with materials used in components of the immersion cooling system, potentially rendering these components ineffective. These components include housings, pumps, seals, and piping for circulating the heat transfer fluids, as well as materials used in the immersion unit and the electronic devices (such as, but not limited to, computer servers, batteries, or power electronics) cooled within that unit. For example, the fluid may react with the material by extracting substances from it and contaminating the fluid, and / or by degrading the material's physical properties. This can result in a loss of functionality, impacting system reliability and performance. Therefore, the selection of materials used in both the immersion unit and the electronic devices is crucial.

[0016] The present invention has been made in view of the foregoing circumstances, and its object is to enhance the performance of the system by providing an immersion cooling system comprising components made of specific materials. The performance of the system is improved through the selection of materials.

[0017] In a first embodiment of the invention, an immersion cooling system is provided, the immersion cooling system comprising (i) an apparatus including: a housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; a condenser coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank connected to and connected to the main fluid tank. The system comprises: (i) a liquid communication, wherein a circulation pump is positioned within the buffer fluid tank, through which the fluid flows to and through a check valve; a filter, positioned downstream of the buffer fluid tank, through which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected by conduits; a cover, which covers the opening area of ​​the housing; and (ii) an electronic device located and at least partially immersed in the fluid within the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the conduits, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of materials compatible with the heat transfer fluid.

[0018] In another embodiment of the invention, a method for cooling an electronic device is provided, the method comprising at least partially immersing the electronic device, which generates heat therefrom, in a heat transfer fluid within an immersion cooling system; transferring the heat generated from the electronic device by circulating the heat transfer fluid through the system; wherein the immersion cooling system comprises (i) an apparatus including: a housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; and a condenser coil positioned on the main fluid tank. The housing comprises: (i) a vapor space; a buffer fluid tank connected to and in liquid communication with the main fluid tank, wherein a circulation pump is located within the buffer fluid tank, through which the fluid flows to and through a check valve; a filter located downstream of the buffer fluid tank, through which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected by a pipe; a cover covering the opening area of ​​the housing; and (ii) an electronic device located and at least partially immersed in the fluid within the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the pipes, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of a material compatible with the heat transfer fluid.

[0019] In one embodiment, the buffer fluid tank, filter, circulation pump, and associated piping are located within the internal cavity of the housing. In another embodiment, the buffer fluid tank, filter, circulation pump, and associated piping are located outside the housing, but connected to and in liquid communication with the main fluid tank.

[0020] In the immersion cooling systems and methods disclosed herein, the materials used in the equipment (tanks, barriers, circulating pump check valves, filters, pipes, covers, and seals located inside and outside the housing) and electronic devices are made of materials compatible with the heat transfer fluid.

[0021] As used herein, "compatibility with heat transfer fluids" means that the performance of the material and / or electronic device remains unchanged over a period of at least one year, at least two years, or at least five years. Performance metrics include constant temperature of the electronic device, no signal loss in communication cables / connectors, no swelling of seals, no voltage drop, no increase in the acidity of the heat transfer fluid, no significant increase in non-volatile residues, no loss of system function, and no loss of component functionality. Examples of functional loss include, but are not limited to, circulation pump failure, cap seal failure and resulting fluid loss through evaporation, damage to plastic tubing and cable / wire insulation, and increased signal strength attenuation.

[0022] In one implementation, "compatibility with heat transfer fluids" can be determined by measuring the weight change of the material over a period of time. More specifically, in accelerated testing (following the test protocol listed in the example), the weight change of the material is less than 20%, or less than 15%, or less than 10%, or less than 5%. The term "weight change" includes both weight increase (positive weight change) and weight decrease (negative weight change).

[0023] Sealing components are provided in circulating pumps, check valves, and filters. These sealing components are made of elastomeric or fluorinated elastomer materials compatible with the heat transfer fluid. Such materials are selected from the group consisting of: chloroprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluorinated polymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

[0024] Piping can be made of metal-based or polymeric materials compatible with heat transfer fluids. Polymeric materials can be selected from the group consisting of: nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone resin, polystyrene, and polyesters (including but not limited to polyethylene terephthalate (PET)). Metal-based materials can include one or more of aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0025] In this invention, the immersion cooling system and method are also compatible with the metals used in the electronic devices and / or components (pumps, filters, check valves) located within the system's housing. The metal components may be selected from one or more of aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0026] Electronic devices include, or may be selected from, the group consisting of: high-capacity energy storage devices, data center servers, insulated-gate bipolar transistor (IGBT) devices, telecommunications infrastructure, military electronics, televisions (TVs), mobile phones, monitors, drones, automotive batteries, electric power systems (including but not limited to electric vehicles (EVs)), power electronics, avionics, power devices, and displays. In one embodiment, the electronic device is a high-capacity energy storage device. In one embodiment, the electronic device is one or more data center or computer servers. In one embodiment, the electronic device is an insulated-gate bipolar transistor (IGBT) device.

[0027] In one embodiment, the electronic device includes telecommunications infrastructure. In one embodiment, the electronic device includes military electronics. In one embodiment, the electronic device includes a television set. In one embodiment, the electronic device includes a mobile phone. In one embodiment, the electronic device includes a monitor. In one embodiment, the electronic device includes a drone. In one embodiment, the electronic device includes a car battery. In one embodiment, the electronic device includes an electric power system. In one embodiment, the electronic device includes an electric power system for an electric vehicle. In one embodiment, the electronic device includes power electronics. In one embodiment, the electronic device includes avionics. In one embodiment, the electronic device includes a power device. In one embodiment, the electronic device includes a display. Attached Figure Description

[0028] Figure 1 This is a perspective view of one embodiment of the immersion cooling device of the present invention. The immersion cooling system includes a housing defining an internal cavity. The housing may be made of: stainless steel or galvanized steel or aluminum or plastic or composite material or natural source material or wood or wood products or ceramic.

[0029] An opening (not shown) is present at the top of the housing, which is covered by a cap during system operation. The cap is attached to the housing via an O-ring seal. The O-ring enhances the cap's barrier against fluid flow from inside the housing to the atmosphere. The O-ring is made of the following: neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

[0030] Alternatively, the buffer tank, filter, circulation pump, and plastic tubing can be placed outside the housing of the main tank, but still connected to and in liquid communication with the main fluid tank.

[0031] When removed, the cover further allows access to components of the immersion cooling system within the housing. The condition of heat transfer fluids, pumps, valves and circulation pumps, as well as electronic devices, can be monitored periodically as needed or removed for maintenance.

[0032] The main fluid tank and buffer fluid tank are located within the shell, each containing a heat transfer fluid, wherein the fluid is E-HFO-153-10mczz. A barrier separates the main fluid tank from the buffer fluid tank. The barrier can be made of: stainless steel or galvanized steel or aluminum or plastic or composite material or natural product or wood or wood products or ceramic. The liquid level above the barrier allows fluid to overflow across the barrier, such as... Figure 1 The curved arrow indicates this. The vapor space is positioned above the liquid level, which spans the area of ​​the cavity across the shell where the main fluid tank and buffer fluid tank are located.

[0033] A circulating pump is positioned within and near the lower end of a barrier fluid tank. During operation of the immersion cooling system, as in the method disclosed herein, the circulating pump uses a motor (not shown) located within the pump to circulate fluid between and across a buffer fluid tank and a main fluid tank. An O-ring seal is shown within the pump, providing a barrier between the low-pressure and high-pressure compartments of the pump. The O-ring is made of the following: neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

[0034] Heat transfer fluid flows into and out of the circulation pump through conduits. In one embodiment, the conduits comprise a polymer material selected from the group consisting of: nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone resin, polystyrene, and polyester (including but not limited to polyethylene terephthalate (PET)). In one embodiment, the conduits comprise a metal-based material selected from the group consisting of: aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0035] The heat transfer fluid flows in from the circulating pump through a pipe and through a check valve, and from the check valve through a pipe to a filter located above the liquid level. An O-ring seal is located within the check valve, providing isolation between the upstream and downstream sides of the valve when the check valve is in the closed position. The O-ring is made from the following: neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

[0036] The heat transfer fluid flows from the filter into the vapor space through pipes and downwards to the main fluid tank. An O-ring seal is located inside the filter, providing a barrier between the internal filter chamber and the outside of the filter housing. The O-ring is made from the following: neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

[0037] Despite Figure 1 Although not shown, the electronic device is at least partially immersed in the heat transfer fluid within the main fluid tank.

[0038] Figure 2 This is a perspective view of a server board, which can be an apparatus in the system and method of the present invention.

[0039] exist Figure 2 The system includes a power supply unit (“PSU”), a graphics processing unit (“GPU”), and a central processing unit (“CPU”). These units are interconnected and provide cross-device communication. The motherboard provides connectivity for the entire server. As shown, but not to be limited by, the motherboard has two RAM (memory) slots through which the processing units access system and program information. Cables connect the system components to the PSU. Arrows indicate communication links between the server's components.

[0040] The materials used in the disclosed immersion cooling systems and methods need to be compatible with the heat transfer fluid. Fluid-material interactions may be due to:

[0041] Extraction: When a fluid extracts compounds from plastics and elastomers (such as plasticizers). This can lead to shrinkage, hardening, and fluid contamination of the material.

[0042] Absorption: When a fluid is absorbed by a material, it causes an increase in weight, swelling, and potential softening.

[0043] The present invention provides an immersion cooling system and method that overcomes problems concerning sensitive components by using a compatible combination of heat transfer fluids and materials.

[0044] In one embodiment, the heat transfer fluid is compatible with the O-ring seal between the cap and the housing. Failure of compatibility between the heat transfer fluid and the cap O-ring can lead to fluid loss / vapor leakage. Suitable materials for the O-ring seal include elastomers and fluoropolymers. For example, EPDM and fluoropolymers, such as those sold under the "Viton" trademark.

[0045] In one implementation, the heat transfer fluid is compatible with the pipe / pipe material. Failure to achieve compatibility between the heat transfer fluid and the pipe / pipe material can lead to cracking and fluid loss or potential circulation / filtration failure, and thus contamination buildup within the system. Suitable pipe / pipe materials include, for example, silicone resins and polypropylene.

[0046] In one implementation, the heat transfer fluid is compatible with the check valve O-ring. Failure to achieve compatibility between the heat transfer fluid and the check valve O-ring can lead to check valve failure and pumping problems and / or circulation losses / clogging. Suitable materials for check valve O-rings include elastomers and fluoropolymers. Examples include EPDM and fluoropolymers, such as those sold under the "Viton" trademark, as well as nitrile rubber, including butadiene rubber (acrylonitrile butadiene rubber or NBR).

[0047] In one embodiment, the heat transfer fluid is compatible with the pump seals. These seals can be O-rings or gaskets. Failure of compatibility between the heat transfer fluid and the pump seals can lead to pump failure. Suitable materials for pump seals include elastomers and fluoropolymers. Examples include EPDM and fluoropolymers, such as those sold under the "Viton" trademark, as well as nitrile rubber, including butadiene rubber (acrylonitrile butadiene rubber or NBR).

[0048] In one implementation, the heat transfer fluid is compatible with the O-rings present in the filter. Failure of compatibility between the heat transfer fluid and the filter O-rings may result in a reduction in filtration efficiency. Suitable materials for pump seals include elastomers and fluoropolymers. For example, EPDM and fluoropolymers, such as those sold under the "Viton" trademark.

[0049] When these compatibility issues arise between the heat transfer fluid and the materials of the immersion cooling system, there may be a consequent decrease in the purity of the fluid, which could have adverse effects (e.g., deterioration of dielectric properties, system stability, and the formation of deposits within the system).

[0050] When electronic devices include high-capacity energy storage devices or data center servers, additional problems may arise, which are addressed by the immersion cooling system and method of the present invention.

[0051] In one embodiment, the electronic device includes a cable, and the heat transfer fluid is compatible with the cable within the electronic device. Failure of compatibility between the heat transfer fluid and the cable can lead to fluid contamination and further to loss and cracking of the conductor insulation. It can also affect the dielectric properties of the cable sheath and result in a reduction in signal strength and / or the likelihood of signal interference. These can further lead to other adverse effects on performance. Materials suitable for cables in electronic devices include, for example, PVC, LDPE, fluorinated ethylene propylene copolymer (FEP), polyether ether ketone (PEEK), or low-smoke halogen-free materials.

[0052] In one embodiment, the electronic device includes a capacitor, and the heat transfer fluid is compatible with the capacitor's material. Failure to achieve compatibility between the heat transfer fluid and the capacitor can lead to capacitor breakage and loss of functionality. Other issues include fluid contamination. Suitable materials for the capacitor include elastomers and fluorinated elastomers, including EPDM.

[0053] In one embodiment, the electronic device includes a connector, and the heat transfer fluid is compatible with the connector material. The connector is essential for maintaining contact between execution components (e.g., GPU, motherboard). Failure of compatibility between the heat transfer fluid and the connector can result in broken or lost contacts, or reduced / loosener mating contacts, and an overall loss of functionality of the electronic device. Suitable materials for the capacitor include elastomers and fluoropolymers, including polypropylene.

[0054] In one embodiment, the electronic device includes a battery seal, and the heat transfer fluid is compatible with the battery seal. Failure to achieve compatibility between the heat transfer fluid and the battery seal may result in leakage of battery materials and power loss in the electronic device. Suitable materials for the battery include silicone, polyurethane, or PET.

[0055] Based on the foregoing, the immersion cooling system and method disclosed herein provide excellent operational performance and long-term stability.

[0056] Example

[0057] Both the materials and the heat transfer fluids used in the immersion cooling system and method disclosed herein were tested.

[0058] Material compatibility and thermal stability tests were performed by exposing the material to E-HFO-153-10mczz. The following tests were conducted:

[0059] Example 1. Sealing tube test: Plastic and elastomer were immersed in a sealing tube at 80°C for 2 weeks. .

[0060] The results for the sealed tube tests are provided in Table 1. Me% is the mass % extracted, and Ma% is the mass % absorbed, calculated by the following formula. Me% = NVR (Non-Volatile Residue). In the formula, MF f is the final mass of the material tested after the fluid has evaporated, MF i is the initial mass of the material tested before the fluid has evaporated, M i is the initial mass of the material tested; and Me is the mass of the material extracted by the fluid. Me% is the mass % extracted, meaning the percentage of the mass of the material extracted by the fluid relative to the initial mass of the material tested. Ma% is the mass % absorbed, meaning the percentage of the mass of the fluid absorbed by the material relative to the initial mass of the material tested. The fluid tested was E-HFO-153-10mczz.

[0061]

[0062]

[0063] As can be seen from Table 1, E-HFO-153-10mczz is compatible with the materials tested.

[0064] Example 2. Soxhlet extraction: Plastics and elastomers were exposed to a fluid in a Soxhlet extractor for 48 hours. .

[0065] The results for the Soxhlet extraction are provided in Table 2.

[0066]

[0067] As can be seen from Table 2, E-HFO-153-10mczz is compatible with the materials tested.

[0068] Example 3

[0069] Thermal stability: The metals (Al, Cu, and carbon steel) were exposed to the liquid and vapor of the heat transfer fluid in a sealed tube at 175 °C for 1 week with and without air and moisture. The fluoride and chloride ion concentrations and acidity were estimated. (<MDL indicates the method for less than the detection limit.)

[0070] The results for the tests are provided in Table 3.

[0071]

[0072] As can be seen from Table 3, E-HFO-153-10mczz is compatible with the metals tested.

[0073] Example 4

[0074] Compared to commercial fluid Novec, which performs Soxhlet extraction and thermal stability tests. ™ Compare with 649 (dodecano-2-methylpentane-3-one, (CF3CF2C(O)CF(CF3)2).

[0075] The Soxhlet extraction test was performed in the same manner as in Example 2 above. Table 4 provides the results.

[0076]

[0077] As shown in Table 4, E-HFO-153-10mczz is compatible with the tested materials and, in addition to its compatibility with pipes, also demonstrates superior performance compared to Novec. ® 649 offers better compatibility. It should be noted that the compatibility of E-HFO-153-10mczz with pipes remains within acceptable limits.

[0078] The thermal stability test was slightly modified from Example 3, specifically by exposing the metals (Al, Cu, and carbon steel) to the liquid and vapor of the heat transfer fluid in a sealed tube at 150°C for one week, with and without air and moisture. The results are shown in Table 5.

[0079]

[0080] As can be seen from Table 5, E-HFO-153-10mczz shows a higher performance than Novec. ™ 649 offers better compatibility with tested metals.

[0081] Although the invention has been described with reference to one or more embodiments, those skilled in the art will understand that various changes can be made and elements can be substituted with equivalents without departing from the scope of the invention. Furthermore, various modifications can be made to suit particular situations or materials to the teachings of the invention without departing from its essential scope. Therefore, the invention is not intended to be limited to the specific embodiments disclosed as the best intended mode for carrying out the invention, but rather the invention will include all embodiments falling within the scope of the appended claims. Moreover, all numerical values ​​identified in the specific embodiments are to be interpreted as if precise and approximate values ​​were explicitly identified.

Claims

1. An immersion cooling system, the immersion cooling system comprising (i) an apparatus, the apparatus comprising: A housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; a condenser coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank connected to and in liquid communication with the main fluid tank, wherein a circulation pump is positioned within the buffer fluid tank, through which the fluid flows and passes through a check valve; A filter, positioned downstream of the buffer fluid tank, into which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected via piping; a cover, covering the opening area of ​​the housing; and (ii) an electronic device located and at least partially immersed in the fluid in the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the piping, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of materials compatible with the heat transfer fluid.

2. The immersion cooling system according to claim 1, wherein sealing components are provided in the circulating pump, the check valve and the filter, the sealing components being made of an elastomeric material or a fluorinated elastomeric material compatible with the heat transfer fluid.

3. The immersion cooling system according to claim 2, wherein the sealing component is made of an elastomer or fluorinated elastomer material selected from the group consisting of: chloroprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluorinated polymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

4. The immersion cooling system according to any one of claims 1 to 3, wherein the conduit comprises a polymer material selected from the group consisting of: nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone resin, polystyrene, polyester (including but not limited to polyethylene terephthalate (PET)).

5. The immersion cooling system of claim 4, wherein the conduit comprises silicone resin or polypropylene.

6. The immersion cooling system according to any one of claims 1 to 5, wherein the electronic device comprises or is selected from the group consisting of: high-capacity energy storage devices, data center servers, insulated gate bipolar transistor (IGBT) devices, telecommunications infrastructure, military electronic devices, televisions (TV), mobile phones, monitors, unmanned aerial vehicles, automotive batteries, power systems for electric vehicles (EVs), power electronic devices, avionics devices, power devices, and displays.

7. The immersion cooling system according to any one of claims 1 to 6, wherein the O-ring seal between the cover and the housing comprises an elastomer selected from EPDM and fluoroelastomers or a fluoroelastomer.

8. The immersion cooling system according to any one of claims 1 to 7, wherein the heat transfer fluid is compatible with a check valve O-ring, and the check valve O-ring comprises an elastomer or a fluorinated elastomer.

9. The immersion cooling system of claim 8, wherein the check valve O-ring comprises EPDM, a fluoropolymer, or nitrile rubber.

10. The immersion cooling system according to any one of claims 1 to 9, wherein the heat transfer fluid is compatible with a pump seal, wherein the seal is an O-ring or a gasket.

11. The immersion cooling system of claim 10, wherein the seal comprises EPDM, a fluoroelastomer, or nitrile rubber.

12. The immersion cooling system according to any one of claims 1 to 11, wherein the system includes a filter having an O-ring, and the heat transfer fluid is compatible with the filter O-ring, and the filter O-ring comprises an elastomer or a fluorinated elastomer.

13. The immersion cooling system according to any one of claims 1 to 12, wherein the electronic device comprises a high-capacity energy storage device or a data center server.

14. The immersion cooling system of claim 13, wherein the electronic device includes cables, and the heat transfer fluid is compatible with the cables within the electronic device.

15. The immersion cooling system of claim 14, wherein the cable comprises PVC, LDPE, fluorinated ethylene propylene copolymer (FEP), polyether ether ketone (PEEK), or a low-smoke halogen-free material.

16. The immersion cooling system of claim 13, wherein the electronic device includes a capacitor, and the heat transfer fluid is compatible with the capacitor within the electronic device.

17. The immersion cooling system of claim 16, wherein the capacitor comprises an elastomer and a fluorinated elastomer.

18. The immersion cooling system of claim 13, wherein the electronic device includes a connector, and the heat transfer fluid is compatible with the material of the connector within the electronic device.

19. The immersion cooling system of claim 18, wherein the connector comprises an elastomer and a fluorinated elastomer.

20. The immersion cooling system of claim 18, wherein the connector comprises polypropylene.

21. The immersion cooling system of claim 13, wherein the electronic device includes a battery seal, and the heat transfer fluid is compatible with the battery seal.

22. A method for cooling an electronic device, the method comprising immersing, at least partially, the electronic device, from which heat is generated, in a heat transfer fluid within an immersion cooling system; and transferring the heat generated from the electronic device by circulating the heat transfer fluid through the system. The immersion cooling system includes (i) a device comprising: A housing defining an internal cavity and a main fluid tank positioned within the housing, the main fluid tank containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid level for fluid extending across the tank; a vapor space within the internal cavity of the housing above the liquid level; a condenser coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank connected to and in liquid communication with the main fluid tank, wherein a circulation pump is positioned within the buffer fluid tank, through which the fluid flows and passes through a check valve; A filter, positioned downstream of the buffer fluid tank, into which the fluid flows from the check valve, wherein the circulation pump, the check valve, and the filter are each connected via piping; a cover, covering the opening area of ​​the housing; and (ii) an electronic device located and at least partially immersed in the fluid in the main fluid tank, wherein the materials used in the tank, the circulation pump check valve, the filter, the piping, the cover, and the seals located inside and outside the housing, as well as the electronic device, are made of materials compatible with the heat transfer fluid.

23. The method of claim 22, wherein a sealing component is provided in the circulating pump, the check valve, and the filter, the sealing component being made of an elastomeric material or a fluorinated elastomeric material compatible with the heat transfer fluid.

24. The method of claim 23, wherein the sealing component is made of an elastomeric material or a fluorinated elastomer material selected from the group consisting of: chloroprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosiloxanes, nitrile rubber, natural rubber, silicone rubber, ethylene vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton). ™ FKM fluorinated elastomer).

25. The method according to any one of claims 22 to 24, wherein the conduit comprises a polymeric material selected from the group consisting of: nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone resin, polystyrene, and polyester (including but not limited to polyethylene terephthalate (PET)).

26. The method of claim 25, wherein the conduit comprises silicone resin or polypropylene.

27. The method according to any one of claims 22 to 26, wherein the electronic device comprises or is selected from the group consisting of: high-capacity energy storage devices, data center servers, insulated-gate bipolar transistor (IGBT) devices, telecommunications infrastructure, military electronic devices, television sets (TV), mobile phones, monitors, unmanned aerial vehicles, automotive batteries, electric power systems, power electronic devices, avionics devices, power devices, and displays.

28. The method according to any one of claims 22 to 27, wherein the O-ring seal between the cover and the housing comprises an elastomer selected from EPDM and fluoroelastomers or a fluoroelastomer.

29. The method according to any one of claims 22 to 28, wherein the heat transfer fluid is compatible with a check valve O-ring, and the check valve O-ring comprises an elastomer or a fluorinated elastomer.

30. The method of claim 29, wherein the check valve O-ring comprises EPDM, a fluoropolymer, or nitrile rubber.

31. The method according to any one of claims 22 to 30, wherein the heat transfer fluid is compatible with a pump seal, wherein the seal is an O-ring or a gasket.

32. The method of claim 31, wherein the seal comprises EPDM, a fluoroelastomer, or nitrile rubber.

33. The method according to any one of claims 22 to 32, wherein the system includes a filter having an O-ring, and the heat transfer fluid is compatible with the filter O-ring, and the filter O-ring comprises an elastomer or a fluorinated elastomer.

34. The method according to any one of claims 22 to 33, wherein the electronic device comprises a high-capacity energy storage device or a data center server.

35. The method of claim 34, wherein the electronic device includes a cable, and the heat transfer fluid is compatible with the cable within the electronic device.

36. The method of claim 35, wherein the cable comprises PVC, LDPE, fluorinated ethylene propylene copolymer (FEP), polyether ether ketone (PEEK), or a low-smoke halogen-free material.

37. The method of claim 34, wherein the electronic device includes a capacitor, and the heat transfer fluid is compatible with the capacitor within the electronic device.

38. The immersion cooling system of claim 37, wherein the capacitor comprises an elastomer and a fluorinated elastomer.

39. The method of claim 34, wherein the electronic device includes a connector, and the heat transfer fluid is compatible with the material of the connector within the electronic device.

40. The method of claim 39, wherein the connector comprises an elastomer and a fluorinated elastomer.

41. The method of claim 40, wherein the connector comprises polypropylene.

42. The method of claim 34, wherein the electronic device includes a battery seal, and the heat transfer fluid is compatible with the battery seal.

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