Display device and manufacturing method thereof

Abstract

The invention provides a display device and a manufacturing method thereof.The display device comprises a display panel and a cover plate which are arranged in a stacked mode, the display panel comprises a first plane area, a second plane area and a bending area connecting the first plane area and the second plane area, the first plane area is arranged close to the cover plate, and the second plane area is arranged close to the cover plate; a driving chip is arranged on one side, far away from the cover plate, of the second plane area; a flexible circuit board is arranged between the first plane area and the second plane area, the flexible circuit board is electrically connected with the second plane area, and a component and a connector are arranged on the side, away from the cover plate, of the flexible circuit board. According to the display device and the manufacturing method thereof, the structure is simple, manufacturing is convenient, the space utilization rate can be effectively increased, and the effect that a product is light and thin is achieved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device and a method for manufacturing the same. Background Technology

[0002] With the advent of smartphones, tablets, and many other electronic products, people's demands for the user experience and comfort of electronic products are also increasing. In recent years, the application of foldable products has become more and more common. However, the issue of the thickness and weight of foldable products has always been a major concern. Existing display devices usually bind flexible circuit boards to the display panel and then attach them to the metal layer on the back of the display panel. This results in a lot of wasted space. Some technologies use a reverse binding method for flexible circuit boards, which can reduce the horizontal space occupied, but increases the thickness of the product. Therefore, there is an urgent need for a display device with higher space utilization. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a display device and a method for manufacturing the same.

[0004] A first aspect of this application provides a display device, including a display panel and a cover plate stacked together. The display panel includes a first planar area, a second planar area, and a bent area connecting the first planar area and the second planar area. The first planar area is disposed close to the cover plate, and a driving chip is disposed on the side of the second planar area away from the cover plate. A flexible circuit board is disposed between the first planar area and the second planar area, and the flexible circuit board is electrically connected to the second planar area. Components and connectors are disposed on the side of the flexible circuit board away from the cover plate.

[0005] In some embodiments, the flexible circuit board has a first protrusion on the side away from the cover plate, and the components are spaced apart from the first protrusion.

[0006] In some embodiments, the side of the first protrusion away from the bending area is connected to a bending portion, the bending portion being electrically connected to the side of the second planar area away from the cover plate, and the bending direction of the bending portion being opposite to that of the bending area.

[0007] In some embodiments, the bent portion is electrically connected to the bottom of the first protrusion.

[0008] In some embodiments, a second protrusion is provided on the side of the first protrusion away from the cover plate, and the second protrusion is electrically connected to the side of the second planar region near the cover plate.

[0009] In some embodiments, an optical adhesive layer and a polarizer are stacked between the cover plate and the first planar region, with the polarizer disposed away from the cover plate; a first back film, an adhesive layer, and a metal layer are stacked sequentially between the first planar region and the flexible circuit board, with the metal layer disposed close to the flexible circuit board; and a back adhesive layer and a second back film are stacked between the flexible circuit board and the second planar region, with the back adhesive layer disposed close to the flexible circuit board.

[0010] In some embodiments, the metal layer and the flexible circuit board are spaced apart.

[0011] In some embodiments, the metal layer has a groove on the side away from the cover plate, the flexible circuit board is disposed in the groove, and an adhesive layer is provided between the flexible circuit board and the groove.

[0012] In some embodiments, the depth of the groove is less than or equal to half the thickness of the metal layer.

[0013] In some embodiments, the component is at least one and is located on both sides of the second planar region along the length direction, or on one side of the second planar region along the width direction.

[0014] In some embodiments, the connector is located on one side of the second planar region along its length, and the orthographic projection of the connector onto the cover plate is spaced apart from the orthographic projection of the first planar region onto the cover plate.

[0015] A second aspect of this application provides a method for manufacturing a display device, comprising forming a flexible circuit board between a first planar region and a second planar region of a display panel, forming components and connectors on the side of the flexible circuit board closer to the second planar region, forming a driver chip on the side of the second planar region away from the first planar region, and forming a cover plate on the side of the first planar region away from the second planar region.

[0016] As can be seen from the above description, this application provides a display device and its manufacturing method. The display device includes a display panel and a cover plate stacked together. The display panel includes a first planar area, a second planar area, and a bending area connecting the first and second planar areas. The first planar area is located close to the cover plate, and a driving chip is located on the side of the second planar area away from the cover plate. A flexible circuit board is provided between the first and second planar areas, and the flexible circuit board is electrically connected to the second planar area. Components and connectors are located on the side of the flexible circuit board away from the cover plate. By placing the flexible circuit board between the first and second planar areas, the support structure in the traditional design can be replaced, saving materials without increasing the product thickness, and reducing the lateral space occupied, greatly improving space utilization and avoiding the problem of limited battery space in the product. This display device and its manufacturing method have a simple structure, are easy to manufacture, and can effectively improve space utilization, achieving a thin and light product effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a cross-sectional structure of a display device in the related art;

[0019] Figure 2 for Figure 1 Top view of the display device;

[0020] Figure 3 This is a schematic cross-sectional view of the first display device in the embodiments of this application;

[0021] Figure 4 for Figure 3 Top view of the display device;

[0022] Figure 5 This is a top view of the second display device in the embodiments of this application;

[0023] Figure 6 This is a schematic cross-sectional view of the third display device in the embodiments of this application;

[0024] Figure 7 This is a schematic cross-sectional view of the fourth display device in the embodiments of this application.

[0025] Reference numerals: 1. Cover plate; 2. Optical adhesive layer; 3. Polarizing film; 4. Display panel; 4-1. First planar area; 4-2. Second planar area; 4-3. Bending area; 5. First back film; 6. Adhesive layer; 7. Metal layer; 7-1. Groove; 8. Backing adhesive layer; 9. Flexible circuit board; 9-1. First protrusion; 9-2. Bending part; 9-3. Second protrusion; 10. Component; 11. Driver chip; 12. Support; 13. Connector; 14. Second back film. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0027] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] With the advent of smartphones, tablets, and many other electronic products, people's demands for the user experience and comfort of electronic products are also increasing. In recent years, the application of foldable products has become more and more common. However, the issue of the thickness and weight of foldable products has always been a major concern. Existing display devices usually bind flexible circuit boards to the display panel and then attach them to the metal layer on the back of the display panel. This results in a lot of wasted space. Some technologies use a reverse binding method for flexible circuit boards, which can reduce the horizontal space occupied, but increases the thickness of the product. Therefore, there is an urgent need for a display device with higher space utilization.

[0029] In the process of developing this application, it was discovered that the cross-sectional schematic diagram of existing display devices is as follows: Figure 1As shown, the display includes a cover plate 1, an optical adhesive layer 2 (OCA), a polarizer 3, and a display panel 4, all stacked together. The display panel 4 includes a first planar region 4-1, a bending region 4-3, and a second planar region 4-2. A first back film 5, an adhesive layer 6, a metal layer 7 (BKT), a support member 12, and a second back film 14 are sequentially stacked between the first planar region 4-1 and the second planar region 4-2. One end of a flexible circuit board 9 (FPC) is bonded to the far end of the second planar region 4-2, and the other end is attached to the metal layer 7 via the adhesive layer 8. Figure 2 The top view of the display device is shown, and it can be seen that the flexible circuit board 9 occupies a large proportion of the horizontal area, resulting in very low space utilization.

[0030] The following describes specific embodiments in conjunction with... Figures 3 to 7 The technical solution of this application will be described in detail below.

[0031] Some embodiments of this application provide a display device, such as... Figure 3 and Figure 4 As shown, the display panel 4 and cover plate 1 are stacked together. The display panel 4 includes a first planar area 4-1, a second planar area 4-2, and a bending area 4-3 connecting the first planar area 4-1 and the second planar area 4-2. The first planar area 4-1 is located close to the cover plate 1, and a driver chip 11 is provided on the side of the second planar area 4-2 away from the cover plate 1. A flexible circuit board 9 is provided between the first planar area 4-1 and the second planar area 4-2. The flexible circuit board 9 is electrically connected to the second planar area 4-2. Components 10 and connectors 13 are provided on the side of the flexible circuit board 9 away from the cover plate 1.

[0032] like Figure 3 As shown, the display device includes a display panel 4 and a cover plate 1. The cover plate 1 is, for example, a glass plate, used to cover the display panel 4 for protection. The display panel 4 is, for example, an OLED flexible panel, used to display images. Typically, the size of the cover plate 1 is larger than the size of the display panel 4.

[0033] The display panel 4 includes a first planar area 4-1, a second planar area 4-2, and a bending area 4-3 connecting the first planar area 4-1 and the second planar area 4-2. The first planar area 4-1 is the display area, used to display images; the second planar area 4-2 is a non-display area, where a driver chip 11 can be installed, a flexible circuit board 9 can be connected, etc., for circuit control; the bending area 4-3 connects the first planar area 4-1 and the second planar area 4-2, and is used to bend the second planar area 4-2 to the back of the first planar area 4-1 to achieve a narrow bezel effect.

[0034] A flexible circuit board 9 is provided between the first planar region 4-1 and the second planar region 4-2. The flexible circuit board 9 can generally be composed of two, three, four, or six sub-layers connected by vias to adjust the thickness of the flexible circuit board 9. Figure 4 As shown, the flexible circuit board 9 is also provided with components 10 and connectors 13. Components 10 can be copper leakage areas, capacitor and resistor areas (blocks), piano covers, timing controllers (t-con), non-volatile memory (flash), shielding covers, etc., and the second plane area 4-2 is provided with a driver chip 11.

[0035] By placing the flexible circuit board 9 between the first plane region 4-1 and the second plane region 4-2, the support member 12 structure in the traditional design can be replaced, saving materials without increasing the product thickness, while also reducing the lateral space occupation, greatly improving space utilization and avoiding the problem of limited battery space in the product. In addition, from a process perspective, the reverse setting of the flexible circuit board 9 replaces the setting of the support member 12 without increasing the manufacturing process.

[0036] For example Figure 3 The display device shown includes a first back film 5 and a second back film 14 between the first planar region 4-1 and the second planar region 4-2. The back film protects the display panel 4 and balances stress. Adhesive layers 8 are provided on both the top and bottom sides of the flexible circuit board 9 to adhere it between the first planar region 4-1 and the second planar region 4-2. The thickness of the flexible circuit board 9 can be adjusted according to the minimum bending angle of the bending region 4-3. For example, at the minimum bending angle, the distance between the first planar region 4-1 and the second planar region 4-2 is 0.25mm, the thickness of the metal layer 7 is typically 0.12mm or 0.15mm, the remaining thickness after removing the back film is approximately 0.37mm, the thickness of the adhesive layer 8 is approximately 0.05mm, and the thickness of the two sub-layers of the flexible circuit board 9 is 0.13mm. Therefore, this design can be achieved by setting two sub-layers of the flexible circuit board 9.

[0037] The display device can be a product or component with display function, such as a mobile phone, tablet computer, laptop computer, digital camera, or navigator. The display device and its manufacturing method are simple in structure and easy to manufacture, which can effectively improve space utilization and achieve the effect of thin and light products.

[0038] In some embodiments, such as Figure 3 As shown, the flexible circuit board 9 has a first protrusion 9-1 on the side away from the cover plate 1, and the component 10 is spaced apart from the first protrusion 9-1.

[0039] like Figure 3As shown, the flexible circuit board 9 has a first protrusion 9-1. The first protrusion 9-1 can be obtained by etching the flexible circuit board 9 with multiple sub-layers, and the specific details are not limited. The flexible circuit board 9 outside the first protrusion 9-1 can form a slot-shaped space to accommodate the components 10 and the connector 13. This slot-shaped space is not covered by the second plane area 4-2, which further improves the space utilization rate. By setting the first protrusion 9-1 to support the second plane area 4-2, the minimum bending angle of the bending area 4-3 is ensured, and the material usage of the flexible circuit board 9 is reduced, saving costs.

[0040] In some embodiments, such as Figure 3 As shown, the first protrusion 9-1 is connected to a bending portion 9-2 on the side away from the bending area 4-3. The bending portion 9-2 is electrically connected to the side of the second planar area 4-2 away from the cover plate 1. The bending direction of the bending portion 9-2 is opposite to that of the bending area 4-3.

[0041] like Figure 3 As shown, the first protrusion 9-1 and the second planar region 4-2 are connected by a bending portion 9-2. The bending portion 9-2 can be one of the sub-layers of the flexible circuit board 9. One end of the bending portion 9-2 is connected to the far end of the second planar region 4-2. The second planar region 4-2 has PIN pins on the side away from the cover plate 1 for connection. The other end of the bending portion 9-2 is connected to the side of the first protrusion 9-1. The bending portion 9-2 is located between the first protrusion 9-1 and the component 10, thereby realizing a simple connection between the second planar region 4-2 and the flexible circuit board 9.

[0042] In some embodiments, such as Figure 3 As shown, the bent portion 9-2 is electrically connected to the bottom of the first protrusion 9-1.

[0043] The bending portion 9-2 is electrically connected to the bottom of the first protrusion 9-1. The bending radius of the bending portion 9-2 is increased as much as possible to prevent the bending portion 9-2 from breaking. A sublayer substrate with strong flexibility and thin thickness can be selected as the material of the flexible circuit board 9.

[0044] In some embodiments, such as Figure 6 and Figure 7 As shown, a second protrusion 9-3 is provided on the side of the first protrusion 9-1 away from the cover plate 1. The second protrusion 9-3 is spaced apart from the adhesive layer 8 and the second back film 14. The second protrusion 9-3 is electrically connected to the side of the second planar area 4-2 near the cover plate 1.

[0045] like Figure 6As shown, the first protrusion 9-1 has a second protrusion 9-3, which can be obtained by etching a flexible circuit board 9 with multiple sub-layers. The specific method is not limited. The second protrusion 9-3 is also covered by the second planar area 4-2, and it changes the traditional connection method. PIN pins are set on the second protrusion 9-3. In addition, PIN pins are also set on the far end of the second planar area 4-2, on the side near the cover plate 1. In this way, the second planar area 4-2 and the second protrusion 9-3 can be directly electrically connected, realizing the electrical connection between the flexible circuit board 9 and the second planar area 4-2, replacing the method of using the bending part 9-2. This can greatly save lateral space, allowing the components 10 to be closer to the second planar area 4-2, saving material costs and improving space utilization. The second protrusion 9-3 is set at intervals with the backing adhesive layer 8 and the second back film 14, respectively, without affecting the adhesion between the flexible circuit board 9 and the second planar area 4-2, or the protection of the second planar area 4-2.

[0046] In some embodiments, such as Figure 3 As shown, an optical adhesive layer 2 and a polarizer 3 are stacked between the cover plate 1 and the first planar area 4-1, with the polarizer 3 disposed away from the cover plate 1; a metal layer 7 is disposed on the side of the adhesive layer 6 away from the cover plate 1.

[0047] like Figure 3 As shown, the optical adhesive layer 2 is used to bond the cover plate 1 and the polarizer 3. In the folded display device, the low-modulus optical adhesive layer 2 can reduce the stress between the layers and prevent peeling during module bending. The polarizer 3 prevents ambient light from interfering with the display effect. The polarizer 3 contains adhesive and is used to bond to the display panel 4, or it can be integrated into the display panel 4. The metal layer 7 provides support for the flexible module and can be made of materials such as titanium alloy, aluminum alloy, or stainless steel (SUS) to ensure the flatness of the display panel 4.

[0048] In some embodiments, such as Figure 7 As shown, the metal layer 7 and the flexible circuit board 9 are spaced apart.

[0049] When the adhesive layer 6 bonded to the metal layer 7 has sufficient strength, the metal layer 7 can be removed directly at the location of the corresponding flexible circuit board 9, leaving only the metal layer 7 outside the flexible circuit board 9. This can further reduce the product thickness and improve space utilization. While keeping the minimum bending angle of the bending area 4-3 unchanged, the material usage of the flexible circuit board 9 can be increased to provide more space for wiring, or the number of lateral flexible circuit boards 9 can be further reduced to improve space utilization. In addition, because the adhesive layer 6 and the flexible circuit board 9 are directly bonded, this design can also reduce the use of one layer of back adhesive 8, saving material and process costs.

[0050] In some embodiments, such as Figure 3 and Figure 6 As shown, the metal layer 7 has a groove 7-1 on the side away from the cover plate 1, the flexible circuit board 9 is disposed in the groove 7-1, and an adhesive layer 8 is provided between the flexible circuit board 9 and the groove 7-1.

[0051] like Figure 3 As shown, a groove 7-1 is provided on the metal layer 7, which can be formed by etching process. The groove 7-1 is set to correspond to the flexible circuit board 9 and is used to accommodate the flexible circuit board 9, which can further reduce the thickness of the product. At the same time, because the metal layer 7 is completely attached to the first plane area 4-1, flatness can be ensured and problems such as film printing and color difference can be avoided.

[0052] In some embodiments, such as Figure 3 and Figure 6 As shown, the depth of the groove 7-1 is less than or equal to half the thickness of the metal layer 7.

[0053] like Figure 3 As shown, the depth of the groove 7-1 is less than or equal to half the thickness of the metal layer 7, for example, 1 / 4 of the thickness of the metal layer 7. No specific limit is imposed, otherwise the etching process will be difficult to achieve.

[0054] In some embodiments, such as Figure 4 and Figure 5 As shown, the component 10 is at least one, located on both sides of the second planar region 4-2 along the length direction, or on one side of the second planar region 4-2 along the width direction.

[0055] like Figure 5 As shown in the figure, direction L is the length direction of the second planar region 4-2, and the width direction is perpendicular to the length direction. Components 10 can be placed on both sides of the second planar region 4-2 along the length direction to improve space utilization. When space is insufficient, such as... Figure 4 As shown, components 10 can also be set on one side of the second plane area 4-2 along the width direction.

[0056] In some embodiments, such as Figure 4 and Figure 5 As shown, the connector 13 is located on one side of the second plane area 4-2 along the length direction, and the orthographic projection of the connector 13 on the cover plate 1 is spaced apart from the orthographic projection of the first plane area 4-1 on the cover plate 1.

[0057] like Figure 4 As shown, connector 13 can be set on one side of the second plane area 4-2 along the length direction and spaced apart from the first plane area 4-1. Connector 13 can be connected to power supply, etc., to further improve space utilization.

[0058] In some embodiments, the display panel 4 includes: a thin-film encapsulation layer disposed on the outermost layer of the display panel 4, used to block external dust and moisture, etc., to prevent external dust and moisture from affecting the internal film layers; a thin-film transistor array layer disposed on one side of the thin-film encapsulation layer; and an OLED device layer disposed on the side of the thin-film transistor array layer away from the thin-film encapsulation layer, including multiple OLED display devices. Each OLED display device includes an anode layer, a cathode layer, a light-emitting functional layer, an electron transport layer, a hole transport layer, and a hole injection layer. The anode layer is electrically connected to the drain of the thin-film transistor array layer. The cathode layer is made of a low work function material, which can improve the efficiency of electron injection and reduce the Joule heat generated during OLED operation, thereby improving the device lifespan.

[0059] The light-emitting functional layer is used for emitting light. Multiple light-emitting layers are set to improve the brightness of the OLED device. The light-emitting layer may include a host material and a guest material doped in the host material. The doping ratio of the guest material in the light-emitting layer is 1% to 20%. Within this doping ratio range, on the one hand, the host material of the light-emitting layer can effectively transfer exciton energy to the guest material to excite the guest material to emit light; on the other hand, the host material "dilutes" the guest material, effectively improving fluorescence quenching caused by intermolecular collisions and energy collisions in the guest material, thus improving luminous efficiency and device lifetime. In an exemplary embodiment, the doping ratio refers to the ratio of the mass of the guest material to the mass of the light-emitting layer, i.e., mass percentage. In an exemplary embodiment, the host material and the guest material can be deposited together using a multi-source evaporation process, so that the host material and the guest material are uniformly dispersed in the light-emitting layer 3-1. The doping ratio can be controlled by controlling the evaporation rate of the guest material or by controlling the ratio of the evaporation rates of the host material and the guest material during the evaporation process.

[0060] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0061] In the embodiments of this application, "film" and "layer" can be interchanged. For example, sometimes "conductive layer" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer". The scale of the drawings in the embodiments of this application can be used as a reference in actual processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer can be adjusted according to actual needs. The number of pixels in the array substrate and the number of sub-pixels in each pixel are not limited to the quantities shown in the figures. The drawings described in the embodiments of this application are only structural schematic diagrams, and one method in the embodiments of this application is not limited to the shapes or values ​​shown in the drawings.

[0062] In the embodiments of this application, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined, but can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, curved edges, and other deformations.

[0063] Furthermore, given that details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that embodiments of this application may be practiced without these details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0064] In some embodiments of this application, a method for manufacturing a display device is provided, comprising forming a flexible circuit board 9 between a first planar region 4-1 and a second planar region 4-2 of a display panel 4, forming components 10 and connectors 13 on the side of the flexible circuit board 9 near the second planar region 4-2, forming a driver chip 11 on the side of the second planar region 4-2 away from the first planar region 4-1, and forming a cover plate 1 on the side of the first planar region 4-1 away from the second planar region 4-2.

[0065] In some embodiments, the flexible circuit board 9 may first be attached to the first planar region 4-1, and then connected to the second planar region 4-2 through the bending portion 9-2, or connected to the second planar region 4-2 through the second protrusion 9-3.

[0066] The "patterning process" described in this application includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; and etching can be performed using any one or more of dry and wet etching, without limitation.

[0067] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0068] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, well-known power / ground connections to other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be illustrated in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application may be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0069] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. The embodiments of this application are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display device, characterized in that, The device includes a display panel and a cover plate stacked together. The display panel includes a first planar area, a second planar area, and a bent area connecting the first planar area and the second planar area. The first planar area is disposed close to the cover plate, and a driver chip is disposed on the side of the second planar area away from the cover plate. A flexible circuit board is provided between the first planar area and the second planar area. The flexible circuit board and the second planar area are electrically connected. Components and connectors are provided on the side of the flexible circuit board away from the cover plate.

2. The display device according to claim 1, characterized in that, The flexible circuit board has a first protrusion on the side away from the cover plate, and the components are spaced apart from the first protrusion.

3. The display device according to claim 2, characterized in that, The first protrusion has a bending portion connected to the side away from the bending area. The bending portion is electrically connected to the side of the second planar area away from the cover plate. The bending direction of the bending portion is opposite to that of the bending area.

4. The display device according to claim 3, characterized in that, The bent portion is electrically connected to the bottom of the first protrusion.

5. The display device according to claim 2, characterized in that, A second protrusion is provided on the side of the first protrusion away from the cover plate, and the second protrusion is electrically connected to the side of the second planar area near the cover plate.

6. The display device according to claim 1, characterized in that, An optical adhesive layer and a polarizer are stacked between the cover plate and the first planar area, with the polarizer disposed away from the cover plate; a first back film, an adhesive layer, and a metal layer are stacked sequentially between the first planar area and the flexible circuit board, with the metal layer disposed close to the flexible circuit board; a back adhesive layer and a second back film are stacked between the flexible circuit board and the second planar area, with the back adhesive layer disposed close to the flexible circuit board.

7. The display device according to claim 6, characterized in that, The metal layer and the flexible circuit board are spaced apart.

8. The display device according to claim 6, characterized in that, The metal layer has a groove on the side away from the cover plate, the flexible circuit board is disposed in the groove, and an adhesive layer is provided between the flexible circuit board and the groove.

9. The display device according to claim 8, characterized in that, The depth of the groove is less than or equal to half the thickness of the metal layer.

10. The display device according to claim 1, characterized in that, The component is at least one and is located on both sides of the second planar region along the length direction, or on one side of the second planar region along the width direction.

11. The display device according to claim 1, characterized in that, The connector is located on one side of the second planar region along its length, and the orthographic projection of the connector on the cover plate is spaced apart from the orthographic projection of the first planar region on the cover plate.

12. A method for manufacturing a display device, characterized in that, The method includes forming a flexible circuit board between a first planar region and a second planar region of a display panel, forming components and connectors on the side of the flexible circuit board closer to the second planar region, forming a driver chip on the side of the second planar region away from the first planar region, and forming a cover plate on the side of the first planar region away from the second planar region.

Images