Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of Micro OLED devices, and discloses a display panel, a preparation method thereof and a display device, and the display panel comprises a driving substrate, an optical reflection layer and a filter layer which are arranged in a laminated manner. The driving substrate comprises pixel units arranged in an array; the optical reflecting layer comprises optical elements in one-to-one correspondence with the pixel units, reflecting films covering the outer sides of the optical elements and packaging media filled between the adjacent optical elements. The structure with the optical reflection layer is constructed between the driving substrate and the filter layer, the inherent optical crosstalk problem of the CF on Glass process is inhibited, the overall structural design and the preparation method are highly compatible with the existing CF on Glass process flow, and the method has the remarkable advantages of simple process and controllable cost.

Description

Technical Field

[0001] This invention belongs to the field of Micro OLED device technology, specifically relating to a display panel and its preparation method, and a display device; particularly relating to a Micro OLED device with an anti-color-crossing structure prepared using the CF on glass process. Background Technology

[0002] Silicon-based OLED display technology fabricates organic light-emitting diodes (OLEDs) on a single-crystal silicon chip, inheriting the advantages of OLED technology such as self-illumination, high contrast, and fast response. Simultaneously, relying on mature complementary metal-oxide-semiconductor (CMOS) technology, it achieves high-density integration of driving circuits and pixel units. This technology features small size, high resolution, and low power consumption, making it an ideal choice for near-eye display devices such as virtual reality (VR) and augmented reality (AR).

[0003] To achieve full-color display, Micro OLEDs need to be colorized. Currently, the mainstream technologies include two processes: color filter on wafer (CF on Wafer) and color filter on glass (CF on Glass). The CF on Wafer process uses a low-temperature photoresist, which is difficult and expensive to develop. The CF on Glass process fabricates the color filter array independently on a glass substrate and then bonds it to the light-emitting substrate, improving production yield and cost-effectiveness. However, because there is usually a gap or non-ideal optical interface between the color filter and the light-emitting pixels, severe crosstalk can easily occur, leading to decreased color purity and contrast, directly affecting the final display effect.

[0004] Therefore, there is an urgent need for a Micro OLED device structure and its fabrication scheme that can effectively suppress optical crosstalk while retaining the cost and yield advantages of CF on Glass technology. Summary of the Invention

[0005] The purpose of this invention is to provide a display panel, its manufacturing method, and a display device to solve the optical crosstalk problem caused by the optical gap between the filter layer and the light-emitting pixels in existing Micro OLED devices using CF onGlass technology, thereby achieving higher color purity and contrast display effects.

[0006] Based on the above concept, the technical solution adopted by this invention is as follows: According to a first aspect of the present invention, a display panel is provided, comprising stacked layers. Drive substrate; Optical reflective layer; and filter layer; The driving substrate includes pixel units arranged in an array; The optical reflective layer includes optical elements corresponding to each pixel unit, a reflective film covering the outside of the optical elements, and an encapsulation medium filling the spaces between adjacent optical elements.

[0007] In some embodiments, the optical element has a concave curved surface structure on the sides and a planar structure on the top and bottom.

[0008] In some embodiments, the optical element is made of a transparent material.

[0009] Optionally, the transparent material includes any one of optically transparent resin and optical adhesive.

[0010] In some embodiments, the reflective film is a high-reflectivity thin film.

[0011] Optionally, the material of the high-reflectivity film includes any one of aluminum oxide, silver oxide, and titanium oxide.

[0012] In some embodiments, the encapsulation medium is a light-absorbing material.

[0013] Optionally, the light-absorbing material includes any one of black ink, black photoresist, and carbon black.

[0014] In some embodiments, the display panel further includes a planarization layer, an bonding layer, and a glass cover; the planarization layer has three layers, including a first planarization layer, a second planarization layer, and a third planarization layer.

[0015] Furthermore, the first planarization layer is disposed between the top of the driving substrate and the optical reflection layer; The second planarization layer is disposed between the optical reflection layer and the filter layer; The third planarization layer is disposed between the filter layer and the glass cover plate; The bonding layer is disposed between the optical reflection layer and the second planarization layer.

[0016] In some embodiments, the absolute value of the refractive index difference between any two of the optical element, the planarization layer, and the bonding layer is less than 0.1.

[0017] According to a second aspect of the present invention, a method for manufacturing the display panel is provided, comprising the following steps: S1. A driving substrate having pixel units arranged in an array; S2. An optical element with a curved shape is formed on the driving substrate by dispensing and curing adhesive. S3. A reflective film covering the optical element is formed on the outer surface of the optical element; S4. Fill the space between adjacent optical elements with a light-absorbing encapsulation medium, and remove the optical elements and reflective film not covered by the encapsulation medium by etching. S5. A filter layer is formed on the glass cover plate, and the driving substrate from step S4 is aligned and bonded to the glass cover plate so that the optical reflection layer is located between the two, and the optical elements correspond one-to-one with the pixel units.

[0018] Furthermore, the bonding method in step S5 includes applying a bonding layer to the driving substrate, aligning and bonding it with the glass cover, and completing the bonding process by UV curing.

[0019] According to a third aspect of the present invention, a display device is provided, comprising a display panel as described in any of the preceding claims.

[0020] The beneficial effects of this invention are as follows: 1. This invention suppresses the inherent optical crosstalk problem of the CF onGlass architecture by constructing an optical reflective layer between the driving substrate and the filter layer. The concave curved surface structure on the side of the optical element works in conjunction with the high reflectivity film to guide the light emitted by each pixel unit to the corresponding filter unit, while the light-absorbing encapsulation medium filling between the optical elements effectively absorbs lateral stray light, improving the color purity and contrast of the display panel. The refractive index matching design between the optical layers further reduces the manufacturing difficulty and light loss.

[0021] 2. The overall structural design and fabrication method of this invention are highly compatible with existing CF on Glass processes, offering significant advantages such as simple processing and controllable costs. Optical components can be formed using mature, low-cost dispensing processes, and the reflective film and light-absorbing medium can be achieved using conventional coating and filling techniques, eliminating the need for complex semiconductor-level photolithography steps. Attached Figure Description

[0022] Figure 1 This is a structural diagram of a display panel according to the present invention; Figure 2 This is a structural diagram of another display panel of the present invention; Figure 3 This is a top view of another support structure for the display panel of the present invention; Figure 4 This is a flowchart illustrating the manufacturing process of a display panel according to the present invention; Figure 5 This is a structural diagram of the driving substrate of the present invention; Figure 6 This is a structural diagram of the driving substrate covered by the first planarization layer of the present invention; Figure 7 This is a structural diagram of the first intermediate substrate of the present invention; Figure 8 This is a structural diagram of the second intermediate substrate of the present invention; Figure 9 This is a structural diagram of the second intermediate substrate filled with the encapsulation medium of the present invention; Figure 10 This is a structural diagram of the third intermediate substrate of the present invention; Figure 11 This is a structural diagram of the glass cover and filter layer of the present invention; Figure 12 This is a schematic diagram of the bonding of the third intermediate substrate and the filter layer in this invention.

[0023] Figure label: Display panel 100, another display panel 200, driving substrate 110, optical reflective layer 120, optical element 121, encapsulation medium 123, filter layer 130, pixel unit 140, CMOS substrate 141, driving electrode 142, OLED layer 143, encapsulation layer 144, planarization layer 210, first planarization layer 211, second planarization layer 212, third planarization layer 213, bonding layer 220, glass cover 230, and support structure 240. Detailed Implementation

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0025] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, the technical or scientific terms used in this application should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains. The words “a” or “one” and similar terms used in this application specification and claims do not indicate a limitation of quantity, but rather indicate the presence of at least one. “A plurality” means two or more. The words “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” covers the element or object listed following “comprising” or “including” and its equivalents, and does not exclude other elements or objects. The words “connected” or “linked” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The words “above” and / or “below” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0026] The technical concept of this invention includes: To achieve full-color display, Micro OLEDs require colorization. Currently, the mainstream technologies include two processes: CF on Wafer and CF on Glass. The CF on Wafer process directly fabricates the filter layer on the silicon substrate after OLED evaporation. Its advantage lies in its relatively relaxed alignment precision requirements and shorter process chain. However, this technology is limited by the high-temperature environment of subsequent OLED evaporation processes. The filter material must use high-temperature resistant "low-temperature photoresist," which is difficult and expensive to develop. Furthermore, it is difficult to rework the filter layer after fabrication, leading to a bottleneck in product yield improvement. In contrast, the CF on Glass process independently fabricates the color filter array on a glass substrate and then bonds it to the light-emitting substrate. This technology frees the selection of filter materials from the constraints of the evaporation process, allowing the use of commercially available, mature, and low-cost conventional high-temperature photoresists. The filter fabrication process is independent, supporting rework and improving production yield and cost-effectiveness. However, this technical approach has obvious shortcomings in optical performance: because there is usually a certain gap or non-ideal optical interface between the color filter and the light-emitting pixel, light from one pixel is easily diffused or reflected to the filter area of ​​adjacent pixels, resulting in a serious "optical crosstalk" phenomenon, which leads to a decrease in color purity and a reduction in contrast, directly affecting the final display effect.

[0027] This invention proposes an optical reflective layer structure between the driving substrate and the filter layer. This structure combines optical elements with curved surfaces and a high-reflectivity thin film to directionally converge and guide the light emitted by each pixel to the corresponding filter unit; at the same time, a light-absorbing encapsulating medium is filled between the optical elements to absorb stray light leaking from the side and suppress the generation of optical crosstalk.

[0028] Therefore, this solution solves the inherent optical crosstalk defect of the CF on Glass process without changing its advantages of low cost and high yield, thus providing a Micro OLED display panel solution that combines excellent display performance with economic feasibility.

[0029] This application provides a display panel, a method for manufacturing the same, and a display device, wherein the display panel comprises stacked layers. Driver substrate 110; Optical reflective layer 120; And filter layer 130; The driving substrate 110 includes pixel units 140 arranged in an array; The optical reflective layer 120 includes optical elements 121 corresponding to the pixel units 140, a reflective film 122 covering the outside of the optical elements, and an encapsulation medium 123 filling the spaces between adjacent optical elements.

[0030] This invention suppresses the inherent optical crosstalk problem of the CF on Glass architecture by constructing a structure with an optical reflective layer 120 between the driving substrate 110 and the filter layer 130. The concave curved surface structure on the side of the optical element 121 works in conjunction with the high reflectivity film to guide the light emitted from each pixel unit 140 to the corresponding filter unit, while the light-absorbing encapsulating medium 123 filled between the optical elements 121 effectively absorbs lateral stray light, improving the color purity and contrast of the display panel. The refractive index matching design between the optical layers further reduces the process difficulty and light loss; moreover, the overall structural design and fabrication method are highly compatible with the existing CF on Glass process flow, and have significant advantages such as simple process and controllable cost. The optical element 121 can be formed by a mature and low-cost dispensing process, and the reflective film 122 and the light-absorbing medium can also be realized by conventional coating and filling techniques, without the need for complex semiconductor-level photolithography steps.

[0031] The display panel manufacturing method described in this application includes the following steps: S1. A driving substrate having pixel units arranged in an array; S2. An optical element with a curved shape is formed on the driving substrate by dispensing and curing adhesive. S3. A reflective film covering the optical element is formed on the outer surface of the optical element; S4. Fill the space between adjacent optical elements with light-absorbing encapsulation material, and remove the optical elements and reflective film not covered by the encapsulation medium by etching; S5. A filter layer is formed on the glass cover plate, and the driving substrate from step S4 is aligned and bonded to the glass cover plate so that the optical reflection layer is located between the two, and the optical elements correspond one-to-one with the pixel units.

[0032] The display device described in this application includes the display panel as described above.

[0033] The following is in conjunction with the appendix Figures 1 to 12 This application provides a detailed description of the display panel, its manufacturing method, and the display device.

[0034] like Figure 1 As shown, this application provides a display panel 100, including a driving substrate 110, an optical reflective layer 120, and a filter layer 130; the driving substrate 110 includes pixel units 140 arranged in an array; the optical reflective layer 120 includes optical elements 121 corresponding to the pixel units 140, a reflective film 122 covering the outside of the optical elements, and an encapsulation medium 123 filling the spaces between adjacent optical elements.

[0035] In this embodiment, the pixel unit 140 includes a CMOS substrate 141, a driving electrode 142, an OLED layer 143, and an encapsulation layer 144. The CMOS substrate 141 includes pre-fabricated transistors, capacitors, metal interconnects, and other driving circuitry, responsible for receiving display signals and generating current to drive the OLED layer 143 to emit light. The driving electrode 142, located on the CMOS substrate 141, serves as the anode and is formed from a highly reflective metal layer, possessing both conductive and reflective functions. The OLED layer 143 is fabricated on the driving electrode 142, and this layer is a stacked structure of an OLED device capable of emitting white light. The encapsulation layer 144 covers the OLED layer 143, serving to isolate it from water and oxygen and protect the organic light-emitting material of the OLED layer 143. This encapsulation layer 144 is typically an inorganic / organic multilayer thin-film encapsulation structure, with a flat upper surface, providing a foundation for the subsequent fabrication of optical structures.

[0036] In this embodiment, the optical reflective layer 120 is disposed above the driving substrate 110. The optical reflective layer 120, through the cooperation between the optical element 121, the reflective film 122 and the encapsulation medium 123 disposed above the pixel unit 140, focuses the scattered light emitted from the driving substrate 110 and reflects the light upward, preventing some light from entering the adjacent pixel unit 140 and causing crosstalk.

[0037] Furthermore, since the light path angle is larger when incident on a concave surface, in order to achieve the effect of receiving light rays at large angles, the optical element 121 in this embodiment has a concave curved surface structure on its sides and a planar structure on its top and bottom. The optical element 121 is made of a transparent material, which includes any one of optically transparent resin and optical adhesive. In this embodiment, optically transparent resin is used as a representative example for detailed explanation. Optically transparent resin has high transmittance (typically >95%) and low haze in the visible light band, ensuring that light emitted from the OLED layer can pass through efficiently with low internal light loss. Moreover, optically transparent resin is typically a liquid prepolymer that can be directly deposited on designated locations on the driving substrate 110 via a dispensing process.

[0038] A high-reflectivity thin film is deposited on the outer side of the optical element 121 as a reflective film 122. The material of the high-reflectivity thin film includes any one of aluminum oxide, silver oxide, and titanium oxide. In this embodiment, aluminum oxide is used as a representative example for detailed explanation. When light shines from a resin material with a lower refractive index to an aluminum oxide thin film with a higher refractive index, Fresnel reflection occurs at the interface between the two, thereby guiding the light rays that might have escaped laterally or obliquely into a direction perpendicular to the substrate.

[0039] In this embodiment, the encapsulation medium 123 is a light-absorbing material, which includes any one of black ink, black photoresist and carbon black. In this embodiment, black ink is used as a representative example for detailed explanation. The black ink is filled on the outside of the reflective film 122 to absorb the light that escapes from the reflective film 122 during the reflection process, and further prevents the light generated in the OLED layer 143 of the driving substrate 110 from passing through the reflective film 122 into the adjacent optical element 121.

[0040] In this embodiment, the filter layer 130 includes a filter film 131 corresponding to each pixel unit 140. The light emitted by the OLED layer 143 of the driving substrate 110 enters the filter film 131 after being reflected by the optical reflection layer 120, and emits a spectrum of the corresponding color.

[0041] like Figure 2 As shown, this application provides another display panel 200, the structure of which is substantially the same as that of the display panel 100, except that it further includes a planarization layer 210, an adhesive layer 220 and a glass cover plate 230.

[0042] In this embodiment, the planarization layer 210 is used to provide a globally flat and smooth process interface. The planarization layer 210 includes three layers: a first planarization layer 211, a second planarization layer 212, and a third planarization layer 213. The first planarization layer 211 is disposed between the top of the driving substrate 110 and the optical reflection layer 120; the second planarization layer 212 is disposed between the optical reflection layer 120 and the filter layer 130; and the third planarization layer 213 is disposed between the filter layer 130 and the glass cover plate 230.

[0043] In this embodiment, the bonding layer 220 is disposed between the optical reflective layer 120 and the second planarization layer 212. The bonding layer 220 serves as an adhesive medium, firmly bonding the driving substrate 110 portion with the completed optical reflective layer 120 structure to the glass cover plate 230 portion with the prepared filter layer 130, forming a complete display panel stack structure. Furthermore, the absolute value of the refractive index difference between the planarization layer 210, the bonding layer 220, and the optical element 121 is less than 0.1, reducing cumulative Fresnel reflection when light passes through the multilayer structure, thereby improving the overall light transmission efficiency from the pixel unit 140 to the filter layer 130.

[0044] Furthermore, such as Figure 3 As shown, another display panel 200 is provided with a ring of support structure 240 around its periphery, which serves to support the glass cover 230 and the driving substrate 110 during bonding, and prevent the optical reflective layer 120 from being damaged by force during the bonding process.

[0045] This application provides a method for manufacturing a display panel, the process flow diagram of which is shown below. Figure 4 As shown, it includes steps S1 to S5.

[0046] S1. A driving substrate 110 with pixel units 140 arranged in an array is provided; the structure of the driving substrate 110 in this step is as follows: Figure 5 As shown.

[0047] Specifically, the driving substrate 110 in step S1 includes at least the smallest light-emitting unit, and in order to ensure the flatness of the structure above the driving substrate 110, a first planarization layer 211 is deposited on the upper surface of the driving substrate 110 before step S2, such as... Figure 6 As shown.

[0048] S2. An optical element 121 with a curved shape is formed on the driving substrate 110 by dispensing and curing adhesive; the structure of the first intermediate substrate 111 obtained after this step is as follows: Figure 7 As shown.

[0049] Specifically, before the optical element 121 is fabricated, a support structure 240 is formed by applying a frame adhesive around the driving substrate 110. The support structure 240 is commonly made of epoxy resin and is used to prevent pressure damage during the bonding of the filter layer 130. The optical element 121 in step S2 is formed by a dispensing process on the driving substrate 110, with dispensing corresponding to each pixel unit. After UV curing, a spherical optical element 121 is obtained.

[0050] S3. A reflective film 122 covering the optical element is formed on the outer surface of the optical element 121; the structure of the second intermediate substrate 112 obtained after this step is as follows: Figure 8 As shown.

[0051] Specifically, the reflective film 122 is formed by atomic deposition, ultimately depositing a high-reflectivity thin film material uniformly and without pores on the entire outer surface of the optical element 121 and in the gap region between two adjacent optical elements. This full-coverage structure lays the foundation for the next step of selectively filling the light-absorbing encapsulation medium and removing redundant film layers.

[0052] S4. Fill the space between adjacent optical elements 121 with light-absorbing encapsulation medium 123. The structural diagram after filling the encapsulation medium 123 is shown in the figure. Figure 9 The optical element 121 and reflective film 122 not covered by the encapsulation medium 123 are removed by etching; the structure of the third intermediate substrate 113 obtained after this step is as follows: Figure 10 As shown; S5. A filter layer 130 is formed on the glass cover plate 230, the structure of which is as follows: Figure 11 As shown; in step S4, the third intermediate substrate 113 is aligned and bonded to the glass cover plate 230, such that the optical reflective layer 120 is located between them, and the optical elements 121 correspond one-to-one with the pixel units 140. The structure of the other display panel 200 obtained after this step is as follows. Figure 2 As shown.

[0053] Furthermore, in step S5, when forming the filter layer 130 on the glass cover plate 230, a second planarization layer 212 and a third planarization layer 213 are deposited at the bottom of the filter layer 130 and between the filter layer 130 and the glass cover plate 230.

[0054] When the third intermediate substrate 113 is aligned and bonded to the glass cover plate 230 with the filter layer 130, an bonding layer 220 is coated on the third intermediate substrate 113, such as... Figure 12 As shown, after bonding, the third intermediate substrate 113 and the glass cover plate 230 are bonded together by UV curing, completing the bonding process and forming the final other display panel 200.

[0055] The display device mentioned in this application includes another display panel 200 as described above.

[0056] Based on the core concept proposed in this invention, those skilled in the art will understand that the scope of protection of this invention is not limited to the specific structural details and preparation parameters of the CF on Glass process explicitly described in the above embodiments.

[0057] If the core of the technical solution is to provide a functional layer between the driving substrate containing the pixel array and the color filter layer, which includes an optical structure corresponding to the pixel and used for light guiding, a reflective layer covering the optical structure, and a light-absorbing medium filling the gap, in order to solve the optical crosstalk problem, then the technical solution falls within the protection scope of this invention.

[0058] Specifically, regardless of whether the specific three-dimensional shape of the optical structure is a concave surface, a frustum, or other freeform surface, and regardless of whether it uses optical resin, optical adhesive, or other transparent media; regardless of whether the reflective layer is a single layer of alumina, silver film, or a multilayer distributed Bragg mirror composed of multiple media, or whether its preparation method uses ALD, PVD, or other coating technologies; regardless of whether the light-absorbing medium is black photoresist, ink, or other composite materials; regardless of how the specific number and materials of the planarization layer and bonding layer are set, such as omitting a certain planarization layer or using different refractive index matching schemes; and regardless of how the specific implementation sequence or details of the preparation process steps are adjusted, such as using chemical mechanical polishing instead of etching for planarization, or adjusting the bonding and curing method.

[0059] Any design that employs the basic concept of introducing an integrated optical reflective layer that combines "light guiding and light blocking" into the pixel optical path to suppress inter-pixel crosstalk in the CF on Glass architecture by physically constraining and guiding light should be considered an equivalent transformation or simple extension of this invention. This design concept, by actively shaping and controlling pixel emission before filtering, fundamentally improves display optical performance and should be covered by the patent scope of this invention.

[0060] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0061] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A display panel, characterized in that, Including stacked settings Drive substrate; Optical reflective layer; and filter layer; The driving substrate includes pixel units arranged in an array; The optical reflective layer includes optical elements corresponding to each pixel unit, a reflective film covering the outside of the optical elements, and an encapsulation medium filling the spaces between adjacent optical elements.

2. A display panel according to claim 1, characterized in that, The optical element has a concave curved surface structure on the side and a planar structure on the top and bottom.

3. A display panel according to claim 1, characterized in that, The optical element is made of a transparent material, which includes any one of optically transparent resin and optical adhesive.

4. A display panel according to claim 1, characterized in that, The reflective film is a high-reflectivity film; the material of the high-reflectivity film includes any one of aluminum oxide, silver oxide, and titanium oxide.

5. A display panel according to claim 1, characterized in that, The encapsulation medium is a light-absorbing material; the light-absorbing material includes any one of black ink, black photoresist, and carbon black.

6. A display panel according to claim 1, characterized in that, It also includes a planarization layer, an adhesive layer, and a glass cover plate; The planarization layer has three layers, including a first planarization layer, a second planarization layer, and a third planarization layer; The first planarization layer is disposed between the top of the driving substrate and the optical reflection layer; The second planarization layer is disposed between the optical reflection layer and the filter layer; The third planarization layer is disposed between the filter layer and the glass cover plate; The bonding layer is disposed between the optical reflection layer and the second planarization layer.

7. A display panel according to claim 6, characterized in that, The absolute value of the refractive index difference between any two of the optical element, the planarization layer, and the bonding layer is less than 0.

1.

8. A method for preparing a display panel as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. A driving substrate having pixel units arranged in an array; S2. An optical element with a curved shape is formed on the driving substrate by dispensing and curing adhesive. S3. A reflective film covering the optical element is formed on the outer surface of the optical element; S4. Fill the space between adjacent optical elements with a light-absorbing encapsulation medium, and remove the optical elements and reflective film not covered by the encapsulation medium by etching. S5. A filter layer is formed on the glass cover plate, and the driving substrate from step S4 is aligned and bonded to the glass cover plate so that the optical reflection layer is located between the two, and the optical elements correspond one-to-one with the pixel units.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The bonding method in step S5 includes applying a bonding layer to the driving substrate, aligning and bonding it with the glass cover, and completing the bonding process by UV curing.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-7.

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