New energy automobile control chip base stable in installation
By designing a new energy vehicle control chip base with a limiting mechanism, a heat conduction mechanism, and a heat dissipation mechanism, the problems of unstable installation and insufficient heat dissipation are solved, achieving stable installation and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN SHENGLING ELECTRONIC INFORMATION CO LTD
- Filing Date
- 2023-04-12
- Publication Date
- 2026-04-24
AI Technical Summary
The existing new energy vehicle control chip base is unstable during use and has insufficient heat dissipation, resulting in loose bolts and poor chip heat dissipation.
A new energy vehicle control chip base was designed, which includes a limiting mechanism, a heat conduction mechanism, and a heat dissipation mechanism. The limiting block and bolt are used to prevent loosening. Heat conduction plates and heat dissipation fins are used to improve heat dissipation. A fan blows air to dissipate heat. Combined with a detachable sealing structure, dust is prevented from entering.
This improves installation stability and heat dissipation, prevents bolts from loosening, enhances chip heat dissipation efficiency, and facilitates maintenance and repair.
Smart Images
Figure CN121925158A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of automotive control chip base technology, specifically a stable mounting base for new energy vehicle control chips. Background Technology
[0002] New energy vehicles refer to automobiles that use unconventional vehicle fuels as their power source and integrate advanced technologies in vehicle power control and drive, resulting in vehicles with advanced technical principles, new technologies, and new structures. New energy vehicles include pure electric vehicles, range-extended electric vehicles, hybrid electric vehicles, fuel cell electric vehicles, hydrogen engine vehicles, and other new energy vehicles. Pure electric vehicles represent the main development direction of new energy vehicles. Among these, the automotive control chip, as a core control component, plays a crucial role in the operation of new energy vehicles. A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing integrated circuits. It is very small and often part of computers or other electronic devices. A chip substrate is a support used to fix and connect the chip for use. Currently, new energy vehicle control chip substrates are typically installed using bolt connections. However, vibrations generated during vehicle operation can cause the bolts to loosen, affecting installation stability. Furthermore, the heat dissipation of the chip after installation is insufficient. Therefore, a more stable new energy vehicle control chip substrate needs to be designed. Summary of the Invention
[0003] The purpose of this invention is to provide a stable mounting base for new energy vehicle control chips in order to solve the problems mentioned in the background art.
[0004] To address the above problems, the present invention provides a technical solution:
[0005] A stable mounting base for a new energy vehicle control chip includes a mounting plate with a base in contact with it. The base has four evenly distributed mounting holes, and bolts are slidably connected inside the mounting holes. The bolts are connected to the mounting plate by screws. A mounting seat is fixedly connected to the base, and a chip is fixedly mounted inside the mounting seat. A limit mechanism is provided on the bolts, a heat conduction mechanism is provided on the chip, and a heat dissipation mechanism is provided on the base.
[0006] Preferably, the limiting mechanism includes a limiting block, a push block, a retaining groove, a connecting block, a connecting rod, a first spring, and a connecting seat. The limiting block is slidably connected inside the bolt. The push block is fixedly connected to the limiting block. The push block has a retaining groove and is slidably connected to the bolt. The connecting block is fixedly connected to the push block and contacts the base. The connecting rod is slidably connected inside the connecting block. The first spring is provided on the outside of the connecting rod. The connecting seat is fixedly connected to the connecting rod and contacts the mounting plate. The connecting seat is fixedly connected to the base. The push block is slidably connected to both the connecting seat and the base. The base and mounting plate can be connected and fixed by bolts, allowing the overall structure to be installed and used. The insertion of the limiting block into the bolts can limit the bolts, preventing them from rotating and thus preventing them from loosening from the mounting plate, improving the installation stability of the overall structure. When the bolts need to be disassembled, first engage the retaining groove, then move the push block horizontally. The push block drives the connecting block to move horizontally, and the connecting block slides along the connecting rod. The connecting block will compress the first spring, and at the same time, the push block drives the limiting block to move horizontally, causing the limiting block to separate from the bolt, thus allowing the bolts to be disassembled.
[0007] Preferably, the heat-conducting mechanism includes a heat-conducting plate, heat dissipation fins, a sealing gasket, an insert, a slider, a sliding rod, a fixing rod, a second spring, and a fixing block. The heat-conducting plate is in contact with the chip, and the heat-conducting plate is in contact with the mounting base. Multiple heat dissipation fins are fixedly connected to the chip. A sealing gasket is fixedly connected to the heat-conducting plate, and the sealing gasket is in contact with the mounting base. An insert is slidably connected inside the mounting base. A slider is fixedly connected to the insert and is slidably connected to the mounting base. A sliding rod is fixedly connected to the slider and is slidably connected to the heat-conducting plate. A fixing rod is fixedly connected to the sliding rod and is slidably connected to the heat-conducting plate. A second spring is provided inside the heat-conducting plate, and a fixing block is fixedly connected to the sliding rod and is slidably connected to the heat-conducting plate. The heat-conducting plate and heat sink fins effectively conduct heat to the chip. A sealing gasket seals the heat-conducting plate to the mounting base, preventing dust from entering the chip and improving heat dissipation. To remove the heat-conducting plate, the fixing block is pushed horizontally. This causes the fixing block to move the sliding rod horizontally, which in turn moves the fixing rod horizontally. The fixing rod compresses the second spring, simultaneously causing the sliding rod to move the slider horizontally, which in turn moves the insertion block horizontally, separating it from the mounting base. This allows for the removal of the heat-conducting plate and facilitates the inspection and maintenance of the internal chip.
[0008] Preferably, the heat dissipation mechanism includes a fan, a dovetail groove, a dovetail block, a filter plate, a positioning block, a pull block, a guide block, a guide rod, and a third spring. The fan is fixedly connected inside the base. The mounting plate has a dovetail groove inside. A dovetail block is slidably connected inside the dovetail groove. A filter plate is fixedly connected to the dovetail block. The filter plate is slidably connected to the mounting plate and contacts the base. A positioning block is slidably connected inside the filter plate. A pull block is fixedly connected to the positioning block. The pull block contacts both the base and the filter plate and is slidably connected to the mounting base. A guide block is fixedly connected to the pull block and is slidably connected to the mounting base. A guide rod is slidably connected inside the guide block and is fixedly connected to the mounting base. A third spring is provided on the outer side of the guide rod. When heat dissipation is required for the chip, the fan operates, drawing in external air and blowing it onto the chip to dissipate heat, further improving the chip's heat dissipation effect. The filter plate also prevents dust from entering. To disassemble the filter plate, first pull the pull block upwards. The pull block causes the guide block to slide along the guide rod, compressing the third spring. Simultaneously, the pull block moves the positioning block upwards, separating it from the filter plate. Then, move the filter plate horizontally, causing the dovetail block to slide horizontally out of the dovetail groove, allowing for easy disassembly and cleaning or replacement of the filter plate.
[0009] Preferably, one end of the first spring is fixedly connected to the connecting block, and the other end of the first spring is fixedly connected to the connecting seat. By designing the first spring, the force of the first spring can be applied to the connecting block.
[0010] Preferably, the heat-conducting plate and the heat dissipation fins are an integrated structure, and both the heat-conducting plate and the heat dissipation fins are made of aluminum alloy. By designing the heat-conducting plate and heat dissipation fins, heat conduction and heat dissipation of the chip can be achieved.
[0011] Preferably, one end of the second spring is fixedly connected to the fixed rod, and the other end of the second spring is fixedly connected to the heat-conducting plate. By designing the second spring, the force of the second spring can be applied to the fixed rod.
[0012] Preferably, one end of the third spring is fixedly connected to the guide block, and the other end of the third spring is fixedly connected to the mounting base. By designing the third spring, its force can be applied to the guide block.
[0013] The beneficial effects of this invention are as follows: This invention relates to a stable mounting base for new energy vehicle control chips, which features stable installation and good heat dissipation. In practical use, compared with traditional stable mounting bases for new energy vehicle control chips, this stable mounting base for new energy vehicle control chips has the following two beneficial effects:
[0014] First, by designing the bolts, the base and the mounting plate can be connected and fixed, thus allowing the overall structure to be installed and used. By inserting the limit block into the bolt, the bolt can be limited, preventing the bolt from rotating and thus preventing the bolt from loosening from the mounting plate, improving the installation stability of the overall structure. In addition, the limit block can be easily separated from the bolt, facilitating bolt disassembly.
[0015] Secondly, by designing a heat-conducting plate and heat dissipation fins, the chip can be heat-conducted. The heat-conducting plate is sealed to the mounting base by a sealing gasket to prevent dust from entering the chip, thus improving the chip's heat dissipation effect. The heat-conducting plate is easy to disassemble and use. The fan design can also blow air to dissipate heat from the chip, further improving the chip's heat dissipation effect. The easily removable filter plate can also prevent dust from the outside air from entering. Attached Figure Description
[0016] For ease of explanation, the present invention will be described in detail below with reference to specific embodiments and accompanying drawings.
[0017] Figure 1 This is a perspective view of the overall structure of the present invention;
[0018] Figure 2 For the present invention Figure 1 A front sectional view;
[0019] Figure 3 For the present invention Figure 1 A partial structural side sectional view;
[0020] Figure 4 For the present invention Figure 2 Enlarged view of point A;
[0021] Figure 5 For the present invention Figure 2 Enlarged view of point B;
[0022] Figure 6 For the present invention Figure 3 Enlarged view of point C.
[0023] In the diagram: 1. Mounting plate; 2. Base; 3. Mounting hole; 4. Bolt; 5. Mounting seat; 6. Chip; 7. Limiting mechanism; 8. Heat conduction mechanism; 9. Heat dissipation mechanism; 71. Limiting block; 72. Push block; 73. Clip groove; 74. Connecting block; 75. Connecting rod; 76. First spring; 77. Connecting seat; 81. Heat conduction plate; 82. Heat dissipation fins; 83. Sealing gasket; 84. Insert block; 85. Slider; 86. Sliding rod; 87. Fixing rod; 88. Second spring; 89. Fixing block; 91. Fan; 92. Dovetail groove; 93. Dovetail block; 94. Filter plate; 95. Positioning block; 96. Pull block; 97. Guide block; 98. Guide rod; 99. Third spring. Detailed Implementation
[0024] like Figure 1-6 As shown, the specific implementation adopts the following technical solution:
[0025] Example:
[0026] A stable mounting base for a new energy vehicle control chip includes a mounting plate 1, a base 2 in contact with the mounting plate 1, four evenly distributed mounting holes 3 on the base 2, bolts 4 slidably connected inside the mounting holes 3, the bolts 4 being connected to the mounting plate 1 by screws, a mounting seat 5 fixedly connected to the base 2, a chip 6 fixedly mounted inside the mounting seat 5, a limit mechanism 7 provided on the bolts 4, a heat conduction mechanism 8 provided on the chip 6, and a heat dissipation mechanism 9 provided on the base 2.
[0027] The limiting mechanism 7 includes a limiting block 71, a push block 72, a retaining groove 73, a connecting block 74, a connecting rod 75, a first spring 76, and a connecting seat 77. The limiting block 71 is slidably connected inside the bolt 4. The push block 72 is fixedly connected to the limiting block 71. The push block 72 has a retaining groove 73 and is slidably connected to the bolt 4. The connecting block 74 is fixedly connected to the push block 72 and contacts the base 2. The connecting rod 75 is slidably connected inside the connecting block 74. The first spring 76 is provided on the outside of the connecting rod 75. The connecting seat 77 is fixedly connected to the connecting rod 75 and contacts the mounting plate 1. The connecting seat 77 is fixedly connected to the base 2. The push block 72 is slidably connected to both the connecting seat 77 and the base 2. The base 2 and the mounting plate 1 can be connected and fixed by the bolt 4, so that the whole structure can be installed and used. The bolt 4 can be limited by the insertion of the limiting block 71, which can prevent the bolt 4 from rotating and thus prevent the bolt 4 from loosening from the mounting plate 1, thereby improving the installation stability of the whole structure. When the bolt 4 needs to be disassembled, first fasten the retaining groove 73, and then move the push block 72 horizontally. The push block 72 drives the connecting block 74 to move horizontally. The connecting block 74 slides along the connecting rod 75 and will squeeze the first spring 76. At the same time, the push block 72 drives the limiting block 71 to move horizontally, so that the limiting block 71 separates from the bolt 4, and the bolt 4 can be disassembled.
[0028] The heat-conducting mechanism 8 includes a heat-conducting plate 81, heat dissipation fins 82, a sealing gasket 83, an insert block 84, a slider 85, a slide rod 86, a fixing rod 87, a second spring 88, and a fixing block 89. The heat-conducting plate 81 contacts the chip 6 and is in contact with the mounting base 5. Multiple heat dissipation fins 82 are fixedly connected to the chip 6. A sealing gasket 83 is fixedly connected to the heat-conducting plate 81 and is in contact with the mounting base 5. The mounting base 5 has internal sliding connections... An insert block 84 is provided, on which a slider 85 is fixedly connected. The slider 85 is slidably connected to the mounting base 5. A slide rod 86 is fixedly connected to the slider 85. The slide rod 86 is slidably connected to the heat-conducting plate 81. A fixing rod 87 is fixedly connected to the slide rod 86. The fixing rod 87 is slidably connected to the heat-conducting plate 81. A second spring 88 is provided inside the heat-conducting plate 81. A fixing block 89 is fixedly connected to the slide rod 86. The fixing block 89 is slidably connected to the heat-conducting plate 81. The heat-conducting plate 81 and heat dissipation fins 82 provide heat conduction for the chip 6. The sealing gasket 83 seals the heat-conducting plate 81 and the mounting base 5, preventing dust from entering the chip 6 and improving the heat dissipation effect of the chip 6. When it is necessary to disassemble the heat-conducting plate 81, the fixing block 89 is pushed horizontally. The fixing block 89 drives the sliding rod 86 to move horizontally. The sliding rod 86 drives the fixing rod 87 to move horizontally. The fixing rod 87 will compress the second spring 88. At the same time, the sliding rod 86 drives the slider 85 to move horizontally. The slider 85 drives the insertion block 84 to move horizontally, so that the insertion block 84 is separated from the mounting base 5, and the heat-conducting plate 81 can be disassembled for easy inspection and maintenance of the internal chip 6.
[0029] The heat dissipation mechanism 9 includes a fan 91, a dovetail groove 92, a dovetail block 93, a filter plate 94, a positioning block 95, a pull block 96, a guide block 97, a guide rod 98, and a third spring 99. The fan 91 is fixedly connected inside the base 2. The mounting plate 1 has a dovetail groove 92 inside, and a dovetail block 93 is slidably connected inside the dovetail groove 92. A filter plate 94 is fixedly connected to the dovetail block 93, and the filter plate 94 is slidably connected to the mounting plate 1. The filter plate 94 is also connected to the base. 2. A positioning block 95 is slidably connected inside the filter plate 94. A pull block 96 is fixedly connected to the positioning block 95. The pull block 96 contacts the base 2 and the filter plate 94 respectively. The pull block 96 is slidably connected to the mounting base 5. A guide block 97 is fixedly connected to the pull block 96. The guide block 97 is slidably connected to the mounting base 5. A guide rod 98 is slidably connected inside the guide block 97. The guide rod 98 is fixedly connected to the mounting base 5. A third spring 99 is provided on the outer side of the guide rod 98. When heat dissipation is required for chip 6, fan 91 operates, drawing in external air and blowing it onto chip 6, thus achieving heat dissipation and further improving the heat dissipation effect. The filter plate 94 also prevents dust from entering. To disassemble the filter plate 94, first pull the pull block 96 upwards. The pull block 96 drives the guide block 97 to slide along the guide rod 98, which in turn compresses the third spring 99. Simultaneously, the pull block 96 moves the positioning block 95 upwards, separating it from the filter plate 94. Then, move the filter plate 94 horizontally, causing the dovetail block 93 to slide horizontally out of the dovetail groove 92, allowing for easy disassembly and cleaning or replacement of the filter plate 94.
[0030] One end of the first spring 76 is fixedly connected to the connecting block 74, and the other end of the first spring 76 is fixedly connected to the connecting seat 77. By designing the first spring 76, the force of the first spring 76 can be applied to the connecting block 74.
[0031] The heat-conducting plate 81 and the heat dissipation fins 82 are an integral structure, and both are made of aluminum alloy. By designing the heat-conducting plate 81 and the heat dissipation fins 82, heat conduction and dissipation of the chip 6 can be achieved.
[0032] One end of the second spring 88 is fixedly connected to the fixed rod 87, and the other end of the second spring 88 is fixedly connected to the heat-conducting plate 81. By designing the second spring 88, the force of the second spring 88 can be applied to the fixed rod 87.
[0033] One end of the third spring 99 is fixedly connected to the guide block 97, and the other end of the third spring 99 is fixedly connected to the mounting base 5. The third spring 99 is designed so that its force can act on the guide block 97.
[0034] The invention is used as follows: In use, the base 2 and the mounting plate 1 can be connected and fixed by the bolt 4, so that the overall structure can be installed and used. The bolt 4 can be limited by the insertion of the limiting block 71, which can prevent the bolt 4 from rotating and thus prevent the bolt 4 from loosening from the mounting plate 1, thereby improving the installation stability of the overall structure. When the bolt 4 needs to be disassembled, first fasten the retaining groove 73, and then move the push block 72 horizontally. The push block 72 drives the connecting block 74 to move horizontally. The connecting block 74 slides along the connecting rod 75 and squeezes the first spring 76. At the same time, the push block 72 drives the limiting block 71 to move horizontally, so that the limiting block 71 separates from the bolt 4, and the bolt 4 can be disassembled. The heat-conducting plate 81 and heat dissipation fins 82 provide heat conduction for the chip 6. The sealing gasket 83 seals the heat-conducting plate 81 and the mounting base 5, preventing dust from entering the chip 6 and improving the heat dissipation effect of the chip 6. When it is necessary to disassemble the heat-conducting plate 81, the fixing block 89 is pushed horizontally. The fixing block 89 drives the sliding rod 86 to move horizontally. The sliding rod 86 drives the fixing rod 87 to move horizontally. The fixing rod 87 will compress the second spring 88. At the same time, the sliding rod 86 drives the slider 85 to move horizontally. The slider 85 drives the insertion block 84 to move horizontally, so that the insertion block 84 is separated from the mounting base 5, and the heat-conducting plate 81 can be disassembled for easy inspection and maintenance of the internal chip 6. When heat dissipation is required for chip 6, fan 91 operates, drawing in external air and blowing it onto chip 6, thus achieving heat dissipation and further improving the heat dissipation effect. The filter plate 94 also prevents dust from entering. To disassemble the filter plate 94, first pull the pull block 96 upwards. The pull block 96 drives the guide block 97 to slide along the guide rod 98, which in turn compresses the third spring 99. Simultaneously, the pull block 96 moves the positioning block 95 upwards, separating it from the filter plate 94. Then, move the filter plate 94 horizontally, causing the dovetail block 93 to slide horizontally out of the dovetail groove 92, allowing for easy disassembly and cleaning or replacement of the filter plate 94.
[0035] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.
Claims
1. A stable mounting base for a new energy vehicle control chip, comprising a mounting plate (1), characterized in that: The mounting plate (1) is in contact with a base (2), and the base (2) has four evenly distributed mounting holes (3). Bolts (4) are slidably connected inside the mounting holes (3). The bolts (4) are connected to the mounting plate (1) by screws. A mounting seat (5) is fixedly connected to the base (2). A chip (6) is fixedly installed inside the mounting seat (5). A limit mechanism (7) is provided on the bolts (4). A heat conduction mechanism (8) is provided on the chip (6). A heat dissipation mechanism (9) is provided on the base (2).
2. The new energy vehicle control chip base with stable installation according to claim 1, characterized in that: The limiting mechanism (7) includes a limiting block (71), a push block (72), a retaining groove (73), a connecting block (74), a connecting rod (75), a first spring (76), and a connecting seat (77). The limiting block (71) is slidably connected inside the bolt (4). The push block (72) is fixedly connected to the limiting block (71). The push block (72) has a retaining groove (73) on it. The push block (72) is slidably connected to the bolt (4). The connecting rod (75) is fixedly connected to the push block (76). The connecting block (74) contacts the base (2). A connecting rod (75) is slidably connected inside the connecting block (74). A first spring (76) is provided on the outside of the connecting rod (75). A connecting seat (77) is fixedly connected to the connecting rod (75). The connecting seat (77) contacts the mounting plate (1). The connecting seat (77) is fixedly connected to the base (2). The push block (72) is slidably connected to the connecting seat (77) and the base (2) respectively.
3. The new energy vehicle control chip base with stable installation according to claim 1, characterized in that: The heat conduction mechanism (8) includes a heat conduction plate (81), heat dissipation fins (82), a sealing gasket (83), an insert (84), a slider (85), a slide rod (86), a fixing rod (87), a second spring (88), and a fixing block (89). The heat conduction plate (81) is in contact with the chip (6), and the heat conduction plate (81) is in contact with the mounting base (5). Multiple heat dissipation fins (82) are fixedly connected to the chip (6). A sealing gasket (83) is fixedly connected to the heat conduction plate (81), and the sealing gasket (83) is in contact with the mounting base (5). The mounting base (5) has a sliding connection inside. Insert (84), on which a slider (85) is fixedly connected, the slider (85) is slidably connected to the mounting base (5), a slide rod (86) is fixedly connected to the slider (85), the slide rod (86) is slidably connected to the heat-conducting plate (81), a fixing rod (87) is fixedly connected to the slide rod (86), the fixing rod (87) is slidably connected to the heat-conducting plate (81), a second spring (88) is provided inside the heat-conducting plate (81), a fixing block (89) is fixedly connected to the slide rod (86), and the fixing block (89) is slidably connected to the heat-conducting plate (81).
4. The new energy vehicle control chip base with stable installation according to claim 1, characterized in that: The heat dissipation mechanism (9) includes a fan (91), a dovetail groove (92), a dovetail block (93), a filter plate (94), a positioning block (95), a pull block (96), a guide block (97), a guide rod (98), and a third spring (99). The fan (91) is fixedly connected inside the base (2). The dovetail groove (92) is opened inside the mounting plate (1). The dovetail block (93) is slidably connected inside the dovetail groove (92). The filter plate (94) is fixedly connected to the dovetail block (93). The filter plate (94) is slidably connected to the mounting plate (1). The filter plate (94) is connected to the base (95). 2) Contact, a positioning block (95) is slidably connected inside the filter plate (94), a pull block (96) is fixedly connected on the positioning block (95), the pull block (96) is in contact with the base (2) and the filter plate (94) respectively, the pull block (96) is slidably connected to the mounting base (5), a guide block (97) is fixedly connected on the pull block (96), the guide block (97) is slidably connected to the mounting base (5), a guide rod (98) is slidably connected inside the guide block (97), the guide rod (98) is fixedly connected to the mounting base (5), and a third spring (99) is provided on the outside of the guide rod (98).
5. A stable mounting base for a new energy vehicle control chip according to claim 2, characterized in that: One end of the first spring (76) is fixedly connected to the connecting block (74), and the other end of the first spring (76) is fixedly connected to the connecting seat (77).
6. A stable mounting base for a new energy vehicle control chip according to claim 2, characterized in that: One end of the first spring (76) is fixedly connected to the connecting block (74), and the other end of the first spring (76) is fixedly connected to the connecting seat (77).
7. A stable mounting base for a new energy vehicle control chip according to claim 3, characterized in that: One end of the second spring (88) is fixedly connected to the fixing rod (87), and the other end of the second spring (88) is fixedly connected to the heat-conducting plate (81).
8. A stable mounting base for a new energy vehicle control chip according to claim 4, characterized in that: One end of the third spring (99) is fixedly connected to the guide block (97), and the other end of the third spring (99) is fixedly connected to the mounting base (5).