Display substrate, preparation method thereof and display device

Abstract

The invention provides a display substrate. The display substrate comprises a substrate body; the driving circuit layer is located on the substrate; and a plurality of light-emitting devices located at one side, far away from the substrate, of the driving circuit layer, the light-emitting device comprises a first electrode which is positioned on one side, far away from the substrate, of the driving circuit layer and is electrically connected with the driving circuit layer, a light-emitting function part which is positioned on one side, far away from the substrate, of the first electrode, and a second electrode which is positioned on one side, far away from the substrate, of the light-emitting function part; the display substrate further comprises a reflecting layer, the reflecting layer comprises at least one reflecting part, and the reflecting part at least partially surrounds the side wall of the light-emitting function part and is spaced from the light-emitting device. The reflecting part is provided with a reflecting surface facing the light-emitting function part, and the substrate is provided with a first surface facing the driving circuit layer; and the inclination angle of at least one part of the reflecting surface relative to the first surface is basically equal to the inclination angle of the side wall of the light-emitting function part relative to the first surface.

Description

Display substrate, manufacturing method thereof and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display substrate, a manufacturing method thereof and a display device. BACKGROUND

[0002] Micro Light-Emitting Diode (Micro LED) is a light-emitting diode with a micron-level size. Since the size of the Micro LED is small, it can be used as a pixel on a display panel. A display substrate prepared by using the Micro LED can be referred to as a Micro LED display substrate. In the Micro LED product, the Micro LED technology is to miniaturize the size of the existing LED to less than 100 μm, which is about 1% of the size of the existing LED. Then, through a mass transfer technology, the micron-level Micro LED is transferred to a driving substrate, thereby forming various Micro LED displays with different sizes. How to improve the light extraction efficiency of the LED in the Micro LED display substrate is one of the important research topics for researchers.

[0003] The above information disclosed in this section is only for the purpose of understanding the background of the inventive concept of the present disclosure, and therefore, the above information can include information that does not constitute prior art.

[0004] SUMMARY

[0005] In one aspect, a display substrate is provided, comprising:

[0006] a substrate substrate;

[0007] a driving circuit layer on the substrate substrate; and

[0008] a plurality of light-emitting devices on a side of the driving circuit layer distal to the substrate substrate, the light-emitting device comprising a first electrode on a side of the driving circuit layer distal to the substrate substrate and electrically connected to the driving circuit layer, a light-emitting functional part on a side of the first electrode distal to the substrate substrate, and a second electrode on a side of the light-emitting functional part distal to the substrate substrate;

[0009] wherein the display substrate further comprises a reflective layer comprising at least one reflective part, the reflective part being at least partially disposed around a sidewall of the light-emitting functional part and spaced apart from the light-emitting device;

[0010] the reflective part has a reflective surface facing the light-emitting functional part, and the substrate substrate has a first surface facing the driving circuit layer; and

[0011] The inclination angle of at least one position of the reflection surface compared to the first surface is substantially equal to the inclination angle of the sidewall of the light-emitting functional part compared to the first surface.

[0012] According to some exemplary embodiments, the reflection surface comprises a curved surface of the reflection part protruding towards the adjacent light-emitting functional part, and a tangent plane of at least one position of the reflection surface is substantially parallel to the sidewall of the light-emitting functional part.

[0013] According to some exemplary embodiments, the reflection surface comprises a first sub-surface, a second sub-surface, and a third sub-surface, the second sub-surface is connected between the first sub-surface and the third sub-surface, the first sub-surface is located on a side of the second sub-surface close to the substrate, and the third sub-surface is located on a side of the second sub-surface away from the substrate.

[0014] The light-emitting functional part comprises a first semiconductor part, a light-emitting part located on a side of the first semiconductor part away from the substrate, and a second semiconductor part located on a side of the light-emitting part away from the substrate; and

[0015] A first end of the second sub-surface close to the substrate is substantially flush with a surface of the light-emitting part close to the substrate, a second end of the second sub-surface away from the substrate is substantially flush with a surface of the light-emitting part away from the substrate, and a tangent plane of at least one position of the second sub-surface is substantially parallel to the sidewall of the light-emitting functional part.

[0016] According to some exemplary embodiments, an acute angle formed by the tangent plane at the first end and the first surface is a first included angle, an acute angle formed by the tangent plane at the second end and the first surface is a second included angle, and an acute angle formed by the sidewall of the light-emitting functional part and the first surface is a third included angle.

[0017] Wherein, the first included angle is greater than or equal to the third included angle; and / or

[0018] The second included angle is less than or equal to the third included angle.

[0019] According to some exemplary embodiments, the acute angles of the tangent planes of the second sub-surface at different positions and the first surface decrease in a direction away from the substrate.

[0020] According to some exemplary embodiments, a cross-sectional shape of the reflection surface perpendicular to the first surface comprises a straight line, and the reflection surface is substantially parallel to the sidewall of the light-emitting functional part.

[0021] According to some exemplary embodiments, a cross-sectional shape of the light-emitting functional part perpendicular to the first surface is an inverted trapezoid.

[0022] According to some exemplary embodiments, the side of the reflecting portion away from the substrate is substantially flush with the side of the light-emitting functional portion away from the substrate.

[0023] The side of the reflecting portion away from the substrate is farther away from the substrate than the side of the light-emitting functional portion away from the substrate.

[0024] According to some exemplary embodiments, the distance between the side of the reflecting portion away from the substrate and the side of the light-emitting functional portion away from the substrate along a direction perpendicular to the first surface is a first distance, and the thickness of the light-emitting functional portion along a direction perpendicular to the first surface is a first thickness.

[0025] Wherein, 0.5 x the first thickness ≤ the first distance ≤ 2 x the first thickness.

[0026] According to some exemplary embodiments, the side of the reflecting portion close to the substrate is closer to the substrate than the side of the light-emitting functional portion close to the substrate.

[0027] According to some exemplary embodiments, the orthographic projection of the reflecting portion on the substrate is spaced apart from the orthographic projection of the light-emitting functional portion on the substrate.

[0028] According to some exemplary embodiments, the display substrate further comprises a first planarization layer on the side of the driving circuit layer away from the substrate, the first planarization layer has a plurality of openings therein, the plurality of light-emitting devices are located in the plurality of openings, and the light-emitting devices are spaced apart from the first planarization layer; and

[0029] Wherein, at least a portion of the reflecting portion is located on the sidewall of the first planarization layer at the opening, and at least a portion of the reflecting surface is substantially parallel to the sidewall of the first planarization layer at the opening.

[0030] According to some exemplary embodiments, the display substrate further comprises a plurality of bonding pads between the driving circuit layer and the plurality of light-emitting devices, and the first electrode of the light-emitting device is electrically connected to the driving circuit layer through the bonding pad; and

[0031] The display substrate further comprises at least one series electrode on the side of the first planarization layer away from the substrate, and in at least two adjacent light-emitting devices, the second electrode of one light-emitting device is electrically connected to the first electrode of another light-emitting device through the series electrode and the bonding pad.

[0032] According to some exemplary embodiments, at least a portion of the series electrode is directly connected with the bonding pad in the series electrode and the bonding pad that are electrically connected.

[0033] According to some exemplary embodiments, the first planarization layer further has a first via hole spaced apart from the opening, the first via hole exposing a portion of the bonding pad, and the series electrode is overlapped with the bonding pad through the first via hole.

[0034] According to some exemplary embodiments, the display substrate further comprises a second planarization layer between the first planarization layer and the series electrode, the second planarization layer has a second via hole and a third via hole spaced apart, the second via hole exposes a portion of the light emitting functional part, and a projection of the third via hole on the substrate substrate at least partially overlaps with a projection of the first via hole on the substrate substrate.

[0035] The second electrode is connected with the light emitting functional part through the second via hole; and

[0036] In the two electrically connected light emitting devices, the second electrode of one of the light emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with another of the light emitting devices through the third via hole and the first via hole.

[0037] According to some exemplary embodiments, the display substrate further comprises a second planarization layer between the first planarization layer and the series electrode, the second planarization layer comprises a plurality of spaced apart planarization parts, the planarization part has a fourth via hole, the fourth via hole exposes a portion of the light emitting functional part, and an outer contour of a projection of the planarization part on the substrate substrate surrounds an outer contour of a projection of the reflecting part on the substrate substrate.

[0038] The first planarization layer further has a fifth via hole spaced apart from the opening, a projection of the fifth via hole on the substrate substrate is located outside an outer contour of a projection of the planarization part on the substrate substrate, and the fifth via hole exposes a portion of the bonding pad.

[0039] The second electrode is connected with the light emitting functional part through the fourth via hole; and

[0040] In the two electrically connected light emitting devices, the second electrode of one of the light emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with another of the light emitting devices through the fifth via hole.

[0041] According to some exemplary embodiments, a geometric center of a normal projection of the light emitting functional part on the substrate substrate substantially coincides with a geometric center of a normal projection of the reflecting part surrounded by the light emitting functional part on the substrate substrate.

[0042] According to some exemplary embodiments, the display substrate further comprises a second planarization layer between the first planarization layer and the series electrode;

[0043] The second planarization layer has a sixth via and a seventh via arranged at intervals, a normal projection of the sixth via on the substrate substrate is located within a normal projection of the opening on the substrate substrate, the sixth via exposes a part of the bonding pad, and the seventh via exposes a part of the light emitting functional part;

[0044] The second electrode is connected with the light emitting functional part through the seventh via; and

[0045] In the two electrically connected light emitting devices, the second electrode of one of the light emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with another of the light emitting devices through the sixth via.

[0046] According to some exemplary embodiments, the display substrate further comprises a second planarization layer between the first planarization layer and the series electrode;

[0047] The second planarization layer comprises a plurality of planarization parts arranged at intervals, the planarization part has a fourth via exposing a part of the light emitting functional part, and an outer contour of a normal projection of the planarization part on the substrate substrate surrounds a normal projection of the light emitting functional part on the substrate substrate;

[0048] The second electrode is connected with the light emitting functional part through the fourth via; and

[0049] In the two electrically connected light emitting devices, the second electrode of one of the light emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with another of the light emitting devices through the sixth via.

[0050] At least a part of the series electrode covers a side of the reflecting part away from the first planarization layer.

[0051] According to some exemplary embodiments, the driving circuit layer comprises a conductive layer close to a side of the bonding pad, and the conductive layer comprises a bridge electrode; and

[0052] In the series electrode and the bonding pad electrically connected in phase, the series electrode is electrically connected with the bonding pad through the bridge electrode.

[0053] According to some exemplary embodiments, the first planarization layer further has an eighth via hole spaced apart from the opening, a projection of the eighth via hole on the substrate substrate is spaced apart from a projection of the bonding pad on the substrate substrate, and the eighth via hole exposes a portion of the bridge electrode, and the series electrode is connected to the bridge electrode through the eighth via hole.

[0054] According to some exemplary embodiments, the display substrate further comprises an auxiliary electrode, the auxiliary electrode is located on one side of the series electrode close to the substrate substrate or away from the substrate substrate, and the auxiliary electrode is electrically connected to the series electrode.

[0055] According to some exemplary embodiments, the material of the reflective layer comprises a metal material, and the auxiliary electrode is located on the reflective layer.

[0056] According to some exemplary embodiments, the display substrate further comprises a buffer layer, the buffer layer comprises a plurality of spaced apart buffer portions;

[0057] The buffer portion is located on the side of the light emitting functional portion away from the substrate substrate, and the surface of the buffer portion close to the substrate substrate is in contact with the surface of the light emitting functional portion away from the substrate substrate; and

[0058] The buffer portion has a twelfth via hole, and the second electrode is connected to the light emitting functional portion through the twelfth via hole.

[0059] According to some exemplary embodiments, the display substrate further comprises a passivation layer, the passivation layer comprises a plurality of spaced apart passivation portions; and

[0060] The passivation portion covers the sidewall of the light emitting functional portion and extends along the sidewall of the light emitting functional portion to the side away from the substrate substrate to be in contact with the buffer layer.

[0061] According to some exemplary embodiments, the side of the passivation portion away from the substrate substrate is farther away from the substrate substrate than the side of the buffer portion close to the substrate substrate, and the side of the passivation portion away from the substrate substrate is closer to the substrate substrate than the side of the buffer portion away from the substrate substrate.

[0062] According to some exemplary embodiments, in at least one of the buffer portion and the passivation portion connected to the buffer portion, the side of the buffer portion away from the substrate substrate has a first protruding portion, and the first protruding portion protrudes away from the twelfth via hole;

[0063] The passivation portion extends along the sidewall of the light-emitting functional portion to a side away from the substrate substrate to contact a side of the first protruding portion away from the substrate substrate; and

[0064] The passivation portion away from the substrate substrate side and the fourth protruding portion away from the substrate substrate side are substantially flush.

[0065] According to some exemplary embodiments, in at least one of the buffer portion and the passivation portion connected with the buffer portion, the buffer portion has a second protruding portion on a side away from the substrate substrate, the second protruding portion protrudes away from the twelfth via hole;

[0066] The passivation portion away from the substrate substrate side and the fourth protruding portion away from the substrate substrate side are substantially flush.

[0067] The third protruding portion away from the twelfth via hole side and the second protruding portion away from the twelfth via hole side are connected.

[0068] According to some exemplary embodiments, in at least one of the buffer portion and the passivation portion connected with the buffer portion, the buffer portion has a fourth protruding portion on a side away from the substrate substrate, the fourth protruding portion protrudes away from the twelfth via hole, and the fourth protruding portion away from the twelfth via hole side is connected with the sidewall of the light-emitting functional portion;

[0069] The passivation portion extends along the sidewall of the light-emitting functional portion to a side away from the substrate substrate to contact a side of the first protruding portion away from the substrate substrate; and

[0070] The passivation portion away from the substrate substrate side and the fourth protruding portion away from the substrate substrate side are substantially flush.

[0071] In still another aspect, a preparation method of a display substrate is provided, the preparation method comprising:

[0072] forming a driving circuit layer on the substrate substrate, the substrate substrate having a first surface facing the driving circuit layer;

[0073] forming a plurality of light-emitting devices on a side of the driving circuit layer away from the substrate substrate, the light-emitting devices comprising a first electrode on a side of the driving circuit layer away from the substrate substrate and electrically connected with the driving circuit layer, a light-emitting functional portion on a side of the first electrode away from the substrate substrate, and a second electrode on a side of the light-emitting functional portion away from the substrate substrate; and

[0074] a reflective layer on a side of the drive circuit layer distal to the substrate, the reflective layer comprising at least one reflective portion disposed at least partially around sidewalls of the light emitting functional portions and spaced apart from the light emitting devices, the reflective portion having a reflective surface facing the light emitting functional portions, the reflective surface having at least one portion with an angle of inclination substantially equal to an angle of inclination of the sidewalls of the light emitting functional portions relative to the first surface.

[0075] According to some exemplary embodiments, the forming a plurality of light emitting devices on a side of the drive circuit layer distal to the substrate comprises:

[0076] providing an epitaxial wafer comprising an epitaxial substrate and an epitaxial layer on the epitaxial substrate;

[0077] forming a buffer film on a side of the epitaxial layer distal to the epitaxial substrate;

[0078] providing a carrier substrate, and forming an adhesive layer on the carrier substrate;

[0079] transferring the epitaxial layer on the epitaxial substrate and the buffer film to a side of the adhesive layer distal to the carrier substrate, such that the epitaxial layer is on a side of the buffer film distal to the adhesive layer;

[0080] performing a patterning process on the epitaxial layer to form a plurality of light emitting functional portions arranged in an array;

[0081] performing a defect repair process on sidewalls of the light emitting functional portions;

[0082] forming a plurality of first electrodes on a side of the light emitting functional portions distal to the carrier substrate;

[0083] performing a separation process on the adhesive layer to transfer the plurality of first electrodes, the light emitting functional portions, and the buffer film to a side of the drive circuit layer distal to the substrate, the plurality of first electrodes being electrically connected to the drive circuit layer;

[0084] forming a plurality of vias in the buffer film, the vias exposing a portion of the light emitting functional portions; and

[0085] forming a plurality of second electrodes on a side of the buffer film distal to the substrate, the plurality of second electrodes being connected to the plurality of light emitting functional portions through the plurality of vias.

[0086] In yet another aspect, a display device is provided, comprising the display substrate of any one of the above. BRIEF DESCRIPTION OF DRAWINGS

[0087] The features and advantages of the present disclosure will become more apparent from the detailed description of example embodiments thereof in conjunction with the accompanying drawings.

[0088] FIG. 1A schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0089] FIG. 1B schematically illustrates a plan view of a combination of a reflection portion and a light-emitting function portion in a display substrate according to some embodiments of the present disclosure.

[0090] FIG. 2A schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0091] FIG. 2B schematically illustrates an enlarged structural view of a region S in FIG. 2A.

[0092] FIG. 3 schematically illustrates a plan view of a display substrate according to some embodiments of the present disclosure.

[0093] FIG. 4 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0094] FIG. 5 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0095] FIG. 6 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0096] FIG. 7 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0097] FIG. 8 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0098] FIG. 9 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0099] FIG. 10 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0100] FIG. 11 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0101] FIG. 12 schematically illustrates a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0102] FIG. 13 schematically illustrates a flowchart of a method of manufacturing a display substrate according to some embodiments of the present disclosure.

[0103] FIGS. 14A-14G schematically illustrate process diagrams of forming a display substrate according to some embodiments of the present disclosure.

[0104] FIGS. 15A-15D schematically illustrate process diagrams of forming a display substrate according to some embodiments of the present disclosure.

[0105] FIGS. 16A-16C schematically illustrate process diagrams of forming a display substrate according to some embodiments of the present disclosure.

[0106] FIGS. 17A-17E schematically illustrate process diagrams of forming a display substrate according to some embodiments of the present disclosure.

[0107] FIGS. 18A-18F schematically illustrate process diagrams of forming a display substrate according to some embodiments of the present disclosure.

[0108] FIG. 19 schematically illustrates a flowchart of forming a light emitting device in a method of manufacturing a display substrate according to an embodiment of the present disclosure.

[0109] FIGS. 20A-20L schematically illustrate process diagrams of forming a light emitting device in a display substrate according to some embodiments of the present disclosure.

[0110] It should be noted that, for the purpose of clarity, the size of a layer, structure or region can be exaggerated or reduced in the drawings used to describe embodiments of the present disclosure, i.e., the drawings are not drawn to scale. DETAILED DESCRIPTION

[0111] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort fall within the scope of the present disclosure.

[0112] It should be noted that, in the drawings, the size and relative size of elements can be exaggerated for the purpose of clarity and / or description. Thus, the size and relative size of the elements are not necessarily limited to the size and relative size shown in the drawings. In the specification and drawings, the same or similar reference numerals indicate the same or similar parts.

[0113] When an element is described as being "on" another element, "connected to" another element, or "coupled to" another element, it can be directly on, directly connected to, or directly coupled to the other element, or intervening elements can be present. In contrast, when an element is described as being "directly on," "directly connected to," or "directly coupled to" another element, there are no intervening elements present. Other terms of description used herein, such as "between," "directly between," "adjacent to," "directly adjacent to," or "on" can be interpreted in a like fashion. In addition, the term "connected" can refer to physical or electrical connectivity, communicative connectivity, and / or fluidic connectivity. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted to include only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated items.

[0114] It should be noted that, although the terms "first," "second," etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. Rather, these terms are used only to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section. Thus, a first element, component, region, layer and / or section discussed below could be termed a second element, component, region, layer and / or section without departing from the teachings of the present disclosure.

[0115] Spatially relative terms, such as "on", "above", "left", "right", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device described is turned over, elements described as "below" or "under" other elements or features would then be oriented "above" the other elements or features. Likewise, if devices are turned over, elements described as "above" other elements or features would then be oriented "below" the other elements or features.

[0116] In this document, the terms“substantially,”“approximately,”“about,”“largely,” and other similar terms are used as terms of approximation, and not as terms of degree, and they are intended to account for the inherent deviations in a measurement or calculation that would be recognized by those of ordinary skill in the art. In view of process fluctuations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), etc.,“about” or“approximately,” as used herein includes the recited value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example,“about” can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the recited value.

[0117] It should be noted that, in this document, the expression“same layer” refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then patterning the film layer by a one-time patterning process using the same mask plate. Depending on the specific pattern, the one-time patterning process can include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. That is, the plurality of elements, components, structures and / or parts located in the“same layer” are composed of the same material and are formed by the same patterning process, and generally, the plurality of elements, components, structures and / or parts located in the“same layer” have substantially the same thickness.

[0118] It should be understood by those skilled in the art that, in this document, unless otherwise specified, the expression“height” or“thickness” refers to the dimension along the surface of each film layer disposed perpendicular to the display substrate, i.e., the dimension along the light output direction of the display substrate, or the dimension along the normal direction of the display device.

[0119] In this document, the expression“transistor” can be a triode, a thin film transistor or a field effect transistor or other devices with the same characteristics. In the embodiments of the present disclosure, in order to distinguish the two poles of the transistor other than the control pole, one of the poles is referred to as the first pole and the other is referred to as the second pole. In actual operation, when the transistor is a thin film transistor or a field effect transistor, the first pole can be the drain and the second pole can be the source, or the first pole can be the source and the second pole can be the drain.

[0120] FIG. 1A schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0121] Referring to FIG. 1A, the display substrate includes a substrate 100, a drive circuit layer 200, and a plurality of light emitting devices 300. The drive circuit layer 200 is located on the substrate 100 and includes a plurality of drive circuits. The plurality of light emitting devices 300 is located on the drive circuit layer 200, and the plurality of light emitting devices 300 is electrically connected to the plurality of drive circuits, respectively.

[0122] The light emitting device 300 includes a first electrode 310, a light emitting functional portion 320, and a second electrode 330. The first electrode 310 is located on a side of the driving circuit layer 200 distal from the substrate substrate 100 and is electrically connected with the driving circuit, the light emitting functional portion 320 is located on a side of the first electrode 310 distal from the substrate substrate 100, and the second electrode 330 is located on a side of the light emitting functional portion 320 distal from the substrate substrate 100.

[0123] The display substrate further includes a reflective layer 400 including at least one reflective portion 410 disposed at least partially around a sidewall of the light emitting functional portion 320 (i.e., a side surface where an imaginary extension of the light emitting functional portion 320 intersects the first surface 100a of the substrate substrate) and spaced apart from the light emitting device 300. The reflective portion 410 has a reflective surface 410a facing the light emitting functional portion 320, and the substrate substrate 100 has a first surface 100a facing the driving circuit layer 200. The reflective surface 410a has at least one portion having an inclination angle substantially equal to an inclination angle of the sidewall of the light emitting functional portion 320 with respect to the first surface 100a. It should be noted that the first surface 100a of the substrate substrate is a surface of the substrate substrate 100 facing the light emitting device 300, which is schematically shown as the upper surface of the substrate substrate 100 in FIG. 1A.

[0124] In the display substrate provided in the embodiments of the present disclosure, by disposing the reflective portion 410 outside the sidewall of the light emitting functional portion 320 and configuring the reflective portion 410, the inclination angle of at least one portion of the reflective surface 410a of the reflective portion 410 facing the light emitting functional portion 320 is equal to the inclination angle of the sidewall of the light emitting functional portion 320 with respect to the first surface 100a, which can effectively improve the light extraction efficiency of the light emitting device 300.

[0125] It should be noted that the "inclination angle of at least one portion of the reflective surface 410a with respect to the first surface 100a is substantially equal to the inclination angle of the sidewall of the light emitting functional portion 320 with respect to the first surface 100a" can be understood as: when the reflective surface 410a includes a plane, at least a portion of the plane of the reflective surface 410a is substantially parallel to the sidewall of the light emitting functional portion 320, and when the reflective surface 410a includes a curved surface, at least one portion of the reflective surface 410a has a tangent plane substantially parallel to the sidewall of the light emitting functional portion 320. The specific structure is described in detail below.

[0126] According to some exemplary embodiments, referring to FIG. 1A, the material of the reflective layer 400 can include a metal material having a high reflectivity, for example, the material of the reflective layer 400 can include silver or aluminum. Exemplarily, the reflective layer 400 can include a stacked structure of indium tin oxide / silver / indium tin oxide.

[0127] According to some exemplary embodiments, referring to FIG. 1A, the cross-sectional shape of the light-emitting functional portion 320 perpendicular to the first surface 100a is an inverted trapezoid, that is, along the light-emitting direction of the light-emitting device 300 (i.e., the direction in which the light-emitting device 300 is away from the first surface 100a), the area of the cross-section of the light-emitting functional portion 320 parallel to the first surface 100a increases successively, and through such a design, it is beneficial to achieve a higher light-emitting efficiency. At the same time, the reflecting surface 410a of the reflecting portion 410 has a cross-sectional shape perpendicular to the first surface 100a, which includes a straight line that is substantially parallel to the straight line formed by the cross-sectional shape of the sidewall of the adjacent light-emitting device 300, that is, the reflecting surface 410a is substantially parallel to the sidewall of the light-emitting functional portion 320. By arranging the reflecting surface 410a substantially parallel to the sidewall of the light-emitting functional portion 320 outside the light-emitting functional portion 320, the light-emitting efficiency of the light-emitting device 300 can be further increased.

[0128] It should be further noted that due to the influence of factors such as the precision of the patterning process, it is difficult for the reflecting surface 410a to be completely parallel to the sidewall of the light-emitting functional portion 320, and the substantially parallel between the reflecting surface 410a and the sidewall of the light-emitting functional portion 320 should be understood as the included angle between the reflecting surface 410a and the sidewall of the light-emitting functional portion 320 being less than or equal to 5°.

[0129] According to some exemplary embodiments, referring to FIG. 1A, the included angle between the sidewall of the light-emitting functional portion 320 and the first surface 100a of the substrate 100 can be marked as the included angle β. For example, the angle of the included angle β between the sidewall of the light-emitting functional portion 320 and the first surface 100a of the substrate 100 is 50°, 55°, 60°, 65°, or 70°, etc. The inventors have found that when the angle of the included angle β between the first side of the light-emitting functional portion 320 and the first surface 100a of the substrate 100 is within the range of 50°-70°, the light-emitting device 300 can have a larger light-emitting efficiency and a larger light-emitting area.

[0130] Based on the angle of the included angle β between the sidewall of the light-emitting functional portion 320 and the first surface 100a of the substrate 100, the inclination angle of the reflecting surface 410a is set, and the angle of the included angle γ between the reflecting surface 410a and the first surface 100a of the substrate 100 is 45°-75°, so that the reflecting surface 410a is substantially parallel to the sidewall of the light-emitting functional portion 320. For example, the angle of the included angle β between the sidewall of the light-emitting functional portion 320 and the first surface 100a of the substrate 100 is 60°, and the angle of the included angle γ between the reflecting surface 410a and the first surface 100a of the substrate 100 is 55°-65°.

[0131] According to some exemplary embodiments, referring to FIG. 1A, the light emitting device 300 can be a micro light emitting diode (Micro LED), and the light emitting functional part 320 includes a first semiconductor part 321 located on the first electrode 310, a light emitting part 322 located on a side of the first semiconductor part 321 away from the first electrode 310, and a second semiconductor part 323 located on a side of the light emitting part 322 away from the substrate 100.

[0132] For example, one of the first semiconductor part 321 and the second semiconductor part 323 is an N-type semiconductor part, and the other is a P-type semiconductor part. The material of the N-type semiconductor part can include N-type gallium nitride, and the material of the P-type semiconductor part can include P-type gallium nitride.

[0133] For example, the light emitting part 322 can include a multiple quantum well (MQW) structure, which can be a periodic structure in which gallium nitride (GaN) and indium gallium nitride (InGaN) are arranged alternately, but is not limited thereto.

[0134] FIG. 2A schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure. FIG. 2B schematically shows an enlarged structural view of the region S in FIG. 2A.

[0135] According to some exemplary embodiments, referring to FIG. 2A, the reflective surface 410a can include a curved surface of the reflective part 410 that protrudes toward the adjacent light emitting functional part 320, and a tangent plane of at least one position of the reflective surface 410a is substantially parallel to the sidewall of the light emitting functional part 320. Considering the difficulty in manufacturing the reflective surface 410a of the reflective part 410 to be substantially parallel to the sidewall of the light emitting functional part 320 and the high cost of manufacturing, the inventors have found through research that the reflective surface 410a can be provided to include a curved surface that protrudes toward the adjacent light emitting functional part 320, and the light emitting efficiency of the light emitting device 300 can still be effectively improved when the tangent plane of at least one position of the curved surface is substantially parallel to the sidewall of the light emitting functional part 320.

[0136] It is additionally explained that the tangent plane being substantially parallel to the sidewall of the light emitting functional part 320 should be understood as the included angle between the tangent plane and the sidewall of the light emitting functional part 320 being less than or equal to 5°.

[0137] According to some exemplary embodiments, in combination with reference to FIGS. 2A and 2B, the reflective surface 410a includes a first sub-surface 411a, a second sub-surface 412a, and a third sub-surface 413a, the second sub-surface 412a is connected between the first sub-surface 411a and the third sub-surface 413a, the first sub-surface 411a is located on the side of the second sub-surface 412a close to the substrate 100, and the third sub-surface 413a is located on the side of the second sub-surface 412a away from the substrate 100. The first end D1 of the second sub-surface 412a close to the substrate 100 is substantially flush with the surface of the light emitting part 322 close to the substrate 100, and the second end D2 of the second sub-surface 412a away from the substrate 100 is substantially flush with the surface of the light emitting part 322 away from the substrate 100. The second sub-surface 412a and the light emitting part 322 in the light emitting functional part 320 are substantially at the same height. The inventors have found through research that the inclination angle of the second sub-surface 412a is more critical to improving the light extraction efficiency of the light emitting device 300. Therefore, the tangent plane of at least one position of the second sub-surface 412a is arranged to be substantially parallel to the side wall of the light emitting functional part 320, which can effectively improve the light extraction efficiency of the light emitting device 300.

[0138] According to some exemplary embodiments, in combination with reference to FIGS. 2A and 2B, the tangent plane of the second sub-surface 412a at the first end D1 close to the substrate 100 forms an acute angle with the first surface 100a, and the acute angle is a first angle a1. The tangent plane of the second sub-surface 412a at the second end D2 away from the substrate 100 forms an acute angle with the first surface 100a, and the acute angle is a second angle a2. The side wall of the light emitting functional part 320 forms an acute angle with the first surface 100a, and the acute angle is a third angle b. By setting the bending degree of the reflective surface 410a, the first angle a1 is greater than or equal to the third angle b, and the second angle a2 is less than or equal to the third angle b. According to this setting, it can be ensured that the tangent plane of at least one position of the second sub-surface 412a is parallel to the side wall of the light emitting functional part 320, and the angle between the tangent plane of other positions of the second sub-surface 412a and the side wall of the light emitting functional part 320 is small, thereby effectively improving the light extraction efficiency of the light emitting device 300.

[0139] According to some exemplary embodiments, in combination with reference to FIGS. 2A and 2B, the angle of the acute angle between the tangent plane of each position of the second sub-surface 412a and the first surface 100a decreases in the direction away from the substrate 100.

[0140] According to some exemplary embodiments, referring to FIG. 1A, in order to ensure that the reflecting portion 410 can reflect more light emitted by the light emitting functional portion 320 from the side wall to be emitted from the light emitting surface of the light emitting device 300, the side surface of the reflecting portion 410 away from the substrate 100 can be substantially flush with the side surface of the light emitting functional portion 320 away from the substrate 100, or the side surface of the reflecting portion 410 away from the substrate 100 can be farther away from the substrate 100 than the side surface of the light emitting functional portion 320 away from the substrate 100.

[0141] For example, referring to FIG. 1A, the side surface of the reflecting portion 410 away from the substrate 100 can be substantially flush with the side surface of the light emitting functional portion 320 away from the substrate 100. It is to be understood that the side surface of the reflecting portion 410 away from the substrate 100 being substantially flush with the side surface of the light emitting functional portion 320 away from the substrate 100 means that the distance between the side surface of the reflecting portion 410 away from the substrate 100 and the side surface of the light emitting functional portion 320 away from the substrate 100 in the direction perpendicular to the first surface 100a is less than or equal to 0.5 μm.

[0142] For example, referring to FIG. 2A, the side surface of the reflecting portion 410 away from the substrate 100 can be farther away from the substrate 100 than the side surface of the light emitting functional portion 320 away from the substrate 100.

[0143] According to some exemplary embodiments, referring to FIG. 2A and FIG. 2B, the distance between the side surface of the reflecting portion 410 away from the substrate 100 and the side surface of the light emitting functional portion 320 away from the substrate 100 in the direction perpendicular to the first surface 100a is a first distance GAP1, and the thickness of the light emitting functional portion 320 in the direction perpendicular to the first surface 100a is a first thickness THK1, wherein 0.5 x the first thickness THK1≤ the first distance GAP1≤ 2 x the first thickness THK1. By setting the side surface of the reflecting portion 410 away from the substrate 100 to be farther away from the substrate 100 than the side surface of the light emitting functional portion 320 away from the substrate 100, and setting the distance between the side surface of the reflecting portion 410 away from the substrate 100 and the side surface of the light emitting functional portion 320 away from the substrate 100 in the direction perpendicular to the first surface 100a as mentioned above, it is more conducive to ensure that the tangent plane of at least one of the second sub-surfaces 412a is substantially parallel to the side wall of the light emitting functional portion 320.

[0144] For example, the first thickness THK1 of the light emitting functional portion 320 can be equal to the first distance GAP1 between the side surface of the reflecting portion 410 away from the substrate 100 and the side surface of the light emitting functional portion 320 away from the substrate 100. For example, the first thickness THK1 of the light emitting functional portion 320 can be about 2 μm, and the first distance GAP1 between the side surface of the reflecting portion 410 away from the substrate 100 and the side surface of the light emitting functional portion 320 away from the substrate 100 can be about 2 μm.

[0145] According to some exemplary embodiments, referring to FIG. 1A or FIG. 2A, in order to ensure that the reflecting portion 410 can reflect more light emitted by the light emitting functional portion 320 from the sidewall to be emitted from the light emitting surface of the light emitting device 300, the reflecting portion 410 is closer to the substrate 100 than the light emitting functional portion 320 is to the substrate 100.

[0146] FIG. 1B schematically shows a plan view of a combination of a reflecting portion and a light emitting functional portion in a display substrate according to some embodiments of the present disclosure.

[0147] According to some exemplary embodiments, referring to FIG. 1A and FIG. 1B, the orthographic projection of the reflecting portion 410 on the substrate 100 is spaced apart from the orthographic projection of the light emitting functional portion 320 on the substrate 100. The inventors have found through research that the orthographic projection of the reflecting portion 410 on the substrate 100 is set as close as possible to the orthographic projection of the light emitting functional portion 320 on the substrate 100, but when the orthographic projection of the reflecting portion 410 on the substrate 100 is spaced apart from the orthographic projection of the light emitting functional portion 320 on the substrate 100, the effect of improving the reflectivity of the light emitting device 300 is better.

[0148] For example, the shape of the orthographic projection of the light emitting functional portion 320 on the substrate can be rectangular (i.e., as shown in FIG. 1B), circular, hexagonal, etc.

[0149] According to some exemplary embodiments, referring to FIG. 1A or FIG. 2A, the display substrate further comprises a first planarization layer PLN1 on the side of the driving circuit layer 200 away from the substrate 100, the first planarization layer PLN1 has a plurality of openings KK therein, and a plurality of light emitting devices 300 are located in the plurality of openings KK, and the light emitting device 300 is spaced apart from the first planarization layer PLN1. At least a portion of the reflecting portion 410 is located on the sidewall of the first planarization layer PLN1 at the opening KK, and at least a portion of the reflecting surface 410a is substantially parallel to the sidewall of the first planarization layer PLN1 at the opening KK. That is, the shape of the reflecting surface 410a of the reflecting portion 410 depends on the shape of the opening KK in the first planarization layer PLN1, and the shape of the opening KK can be set accordingly according to the required shape of the reflecting surface 410a.

[0150] FIG. 3 schematically shows a plan view of a display substrate according to some embodiments of the present disclosure.

[0151] According to some exemplary embodiments, referring to FIG. 1A and FIG. 3, the display substrate further comprises a plurality of bonding pads PAD between the driving circuit layer 200 and the plurality of light emitting devices 300, the first electrode 310 of the light emitting device 300 is electrically connected to the driving circuit layer 200 through the bonding pad PAD. The display substrate further comprises at least one series electrode 510 on the side of the first planarization layer PLN1 away from the substrate 100, in the at least two light emitting devices 300, the second electrode 330 of one light emitting device 300 is electrically connected to the first electrode 310 of another light emitting device 300 through the series electrode 510 and the bonding pad PAD. By connecting the at least two light emitting devices 300 in series, high voltage driving of the light emitting device 300 can be achieved, which is conducive to reducing the power consumption of the display substrate.

[0152] According to some exemplary embodiments, referring to FIG. 1A, in the series electrode 510 and the bonding pad PAD that are electrically connected, at least a part of the series electrode 510 can be directly connected to the bonding pad PAD to achieve electrical connection.

[0153] According to some exemplary embodiments, referring to FIG. 1A, the first planarization layer PLN1 further has a first via V01 spaced apart from the opening KK, the orthographic projection of the first via V01 on the substrate 100 partially overlaps the orthographic projection of the bonding pad PAD on the substrate 100, the first via V01 exposes a part of the bonding pad PAD, and the series electrode 510 is overlapped with the bonding pad PAD through the first via V01.

[0154] For example, the material of the first planarization layer PLN1 includes an organic resin material, and the side of the first planarization layer PLN1 away from the substrate 100 can be substantially flush with the side of the light emitting functional part 320 away from the substrate 100.

[0155] For example, the thickness of the light emitting functional part 320 perpendicular to the first surface 100a can be 1.5-2 μm, the thickness of the first electrode 310 perpendicular to the first surface 100a can be 0-1 μm, the thickness of the bonding pad PAD perpendicular to the first surface 100a can be 0-2 μm, the thickness of the part of the first planarization layer PLN1 on the bonding pad PAD can be 2.5-3 μm, and the thickness of the first planarization layer PLN1 in other areas can be 4-5 μm.

[0156] According to some exemplary embodiments, referring to FIG. 1A, the display substrate further comprises a second planarization layer PLN2 between the first planarization layer PLN1 and the series electrode 510, which can be used to fill the gap between the light emitting device 300 and the reflective portion 410. The second planarization layer PLN2 has a second via hole V02 and a third via hole V03, which are arranged at intervals. The second via hole V02 exposes a part of the light emitting functional portion 320, and the third via hole V03 has a projection on the substrate substrate 100 that at least partially overlaps with the projection of the first via hole V01 on the substrate substrate 100, for example, the projection of the third via hole V03 on the substrate substrate 100 is located within the projection of the first via hole V01 on the substrate substrate 100. The second electrode 330 is connected to the light emitting functional portion 320 through the second via hole V02. In the two electrically connected light emitting devices 300, the second electrode 330 of one light emitting device 300 is electrically connected to one series electrode 510, and the series electrode 510 is overlapped with the bonding pad PAD electrically connected to the other light emitting device 300 through the third via hole V03 and the first via hole V01.

[0157] For example, the second electrode 330 and the series electrode 510 are connected as an integral structure, and the second electrode 330 and the series electrode 510 can be formed by the same film forming process and patterning process. The second electrode 330 and the series electrode 510 have no clear boundary, and the part that has projection overlap with the light emitting functional portion 320 can be regarded as the second electrode 330, and the remaining part can be regarded as the series electrode 510.

[0158] According to some exemplary embodiments, referring to FIG. 1A, the display substrate further comprises a packaging layer 520 for covering a part of the surface of the light emitting functional portion 320 to achieve packaging of the light emitting functional portion 320. And the packaging layer 520 is located between the bonding pad PAD and the first planarization layer PLN1, the second via hole V02 is arranged through the second planarization layer PLN2 and the packaging layer 520 and exposes a part of the light emitting functional portion 320, and the third via hole V03 is arranged through the second planarization layer PLN2 and the packaging layer 520 and exposes a part of the bonding pad PAD.

[0159] For example, the material of the packaging layer 520 can include at least one of silicon nitride and silicon oxide, and the thickness of the packaging layer 520 can be 3000-10000 angstroms.

[0160] According to some exemplary embodiments, referring to FIG. 1A, the display substrate further comprises a third planarization layer PLN3 located on the side of the second planarization layer PLN2 away from the substrate 100, the third planarization layer PLN3 is used to fill the uneven area existing in the second planarization layer PLN2, and the side of the third planarization layer PLN3 away from the substrate 100 has better flatness, which is beneficial to the preparation of other structures (for example, the quantum dot color film layer) located on the side of the third planarization layer PLN3 away from the substrate 100.

[0161] For example, the material of the third planarization layer PLN3 includes an organic resin material, and the thickness of the third planarization layer PLN3 is 1-3 μm.

[0162] FIG. 4 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0163] According to some exemplary embodiments, referring to FIG. 4, the display substrate further comprises a second planarization layer PLN2 located between the first planarization layer PLN1 and the series electrode 510, the second planarization layer PLN2 comprises a plurality of spaced-apart planarization portions 530, the outer contour of the orthographic projection of the planarization portion 530 on the substrate 100 surrounds the outer contour of the orthographic projection of the reflecting portion 410 on the substrate 100, and the planarization portion 530 can be used to fill the gap between the light emitting device 300 and the reflecting portion 410. The planarization portion 530 has a fourth via V04, the fourth via V04 exposes a part of the light emitting functional portion 320, and the second electrode 330 is connected to the light emitting functional portion 320 through the fourth via V04.

[0164] The first planarization layer PLN1 further has a fifth via V05 spaced apart from the opening KK, the orthographic projection of the fifth via V05 on the substrate 100 is located outside the outer contour of the orthographic projection of the planarization portion 530 on the substrate 100, and the fifth via V05 exposes a part of the bonding pad PAD. In the two electrically connected light emitting devices 300, the second electrode 330 of one light emitting device 300 is electrically connected to one series electrode 510, and the series electrode 510 is overlapped with the bonding pad PAD electrically connected to the other light emitting device 300 through the fifth via V05.

[0165] In the display substrate provided in the embodiments of the present disclosure, the fifth via V05 through which the series electrode 510 is connected to the bonding pad PAD has a relatively small depth in the direction perpendicular to the first surface 100a, which is beneficial to improving the film coverage of the series electrode 510 in the fifth via V05, so that the resistance of the series electrode 510 in the fifth via V05 can be reduced.

[0166] According to some exemplary embodiments, referring to FIG. 4, the display substrate further comprises an encapsulation layer 520 for covering a portion of the surface of the light-emitting functional part 320 to achieve encapsulation of the light-emitting functional part 320. The encapsulation layer 520 is located between the bonding pad PAD and the first planarization layer PLN1, the fourth via V04 is disposed through the second planarization layer PLN2 and the encapsulation layer 520 and exposes a portion of the light-emitting functional part 320, and the fifth via V05 is disposed through the first planarization layer PLN1 and the encapsulation layer 520 and exposes a portion of the bonding pad PAD.

[0167] According to some exemplary embodiments, referring to FIGS. 1A and 1B, the geometric center P1 of the orthographic projection (the rectangle labeled as H1 in FIG. 1B) of the light-emitting functional part 320 on the substrate 100 substantially coincides with the geometric center P2 of the inner edge of the orthographic projection of the reflecting part 410 on the substrate 100 (the rectangle labeled as H2 in FIG. 1B), that is, the light-emitting functional part 320 is located at the center of the annular reflecting part 410, which is beneficial to more uniformly reflecting the light emitted from the light-emitting functional part 320 in various directions of the sidewall.

[0168] FIG. 5 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0169] According to some exemplary embodiments, referring to FIG. 5, the display substrate further comprises a second planarization layer PLN2 located between the first planarization layer PLN1 and the series electrode 510, and the second planarization layer PLN2 has a sixth via V06 and a seventh via V07 arranged at intervals. The orthographic projection of the sixth via V06 on the substrate 100 is located within the orthographic projection of the opening KK on the substrate 100, and the sixth via V06 exposes a portion of the bonding pad PAD. The orthographic projection of the seventh via V07 on the substrate 100 is located within the orthographic projection of the opening KK on the substrate 100, and the seventh via V07 exposes a portion of the light-emitting functional part 320, and the second electrode 330 is connected to the light-emitting functional part 320 through the seventh via V07. In the two electrically connected light-emitting devices 300, the second electrode 330 of one light-emitting device 300 is electrically connected to one series electrode 510, and the series electrode 510 is overlapped with the bonding pad PAD electrically connected to another light-emitting device 300 through the sixth via V06.

[0170] The inventors have found that, because the first planarization layer PLN1 has a relatively large thickness, when a via is also provided in the first planarization layer PLN1 adjacent to the opening KK, the spacing between the opening KK and the adjacent via cannot be too small. When it is difficult to ensure the spacing between the opening KK and the adjacent via in order to meet the requirement of higher resolution, the area between the opening KK and the adjacent via will also be partially exposed due to the diffraction effect of light during exposure, which will cause the thickness to decrease, and thus affect the shape of the reflective portion 410 at the opening KK of the first planarization layer PLN1.

[0171] To improve this problem, in the display substrate provided in the embodiments of the present disclosure, the opening KK in the first planarization layer PLN1 is set to be slightly larger, and the portion where the series electrode 510 is connected to the bonding pad PAD is directly placed in the opening KK, and a via (i.e., the first via V01 shown in FIG. 1A or the fifth via V05 shown in FIG. 4) for connecting the series electrode 510 to the bonding pad PAD is no longer required in the first planarization layer PLN1, so that the process difficulty of forming the first planarization layer PLN1 can be reduced, and the sidewall shape of the first planarization layer PLN1 at the opening KK can be improved.

[0172] FIG. 6 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0173] According to some exemplary embodiments, referring to FIG. 6, the display substrate further includes a second planarization layer PLN2 between the first planarization layer PLN1 and the series electrode 510, the second planarization layer PLN2 includes a plurality of spaced-apart planarization portions 530, the outer contour of the planarization portions 530 in the orthographic projection on the substrate 100 surrounds the orthographic projection of the light-emitting functional portion 320 on the substrate 100, the planarization portions 530 have a fourth via V04, the fourth via V04 exposes a portion of the light-emitting functional portion 320, and the second electrode 330 is connected to the light-emitting functional portion 320 through the fourth via V04.

[0174] The encapsulation layer 520 has a tenth via V10, the orthographic projection of the tenth via V10 on the substrate 100 is located within the orthographic projection of the opening KK on the substrate 100, and the orthographic projection of the tenth via V10 on the substrate 100 is spaced apart from the orthographic projection of the planarization portion 530 on the substrate 100, and the tenth via V10 exposes a portion of the bonding pad PAD. In the two electrically connected light-emitting devices 300, the second electrode 330 of one light-emitting device 300 is electrically connected to one series electrode 510, and the series electrode 510 is overlapped with the bonding pad PAD electrically connected to the other light-emitting device 300 through the opening KK and the tenth via V10 located in the opening KK.

[0175] The series electrode 510 extends from the side of the substrate 100 away from the first planarization layer PLN1 to the side of the reflective portion 410 away from the substrate 100, then extends from the side of the reflective portion 410 away from the substrate 100 to the side of the reflective portion 410 close to the substrate 100, and finally extends to the side of the packaging layer 520 away from the substrate 100 and is electrically connected to the bonding pad PAD through the tenth via V10. Since the planarization portion 530 only covers part of the reflective portion 410, at least part of the series electrode 510 covers the side of the reflective portion 410 away from the first planarization layer PLN1. Since the reflective portion 410 includes a metal material, the direct connection between the reflective portion 410 and the series electrode 510 can effectively reduce the resistance of the series electrode 510, thereby effectively alleviating the current attenuation effect in the series electrode 510 and improving the brightness of the light-emitting device 300.

[0176] FIG. 7 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0177] According to some exemplary embodiments, referring to FIG. 7, the driving circuit layer 200 includes a conductive layer close to the side of the bonding pad PAD, and the conductive layer includes a bridge electrode 210. In the series electrode 510 and the bonding pad PAD that are electrically connected, the series electrode 510 is electrically connected to the bonding pad PAD through the bridge electrode 210.

[0178] The conductive layer and the bonding pad PAD are further provided with an insulating layer PV, and the insulating layer PV includes an eleventh via V11. The bonding pad PAD is electrically connected to the bridge electrode 210 through the eleventh via V11. The first planarization layer PLN1, the packaging layer 520, and the insulating layer PV are further provided with an eighth via V08. The eighth via V08 is spaced apart from the opening KK, and the orthographic projection of the eighth via V08 on the substrate 100 is spaced apart from the orthographic projection of the bonding pad PAD on the substrate 100. The eighth via V08 exposes part of the bridge electrode 210, and the series electrode 510 is overlapped with the bridge electrode 210 through the eighth via V08. That is, the two ends of the bridge electrode 210 are respectively electrically connected to the series electrode 510 and the bonding pad PAD, thereby indirectly achieving the electrical connection between the series electrode 510 and the bonding pad PAD. Since the series electrode 510 is not directly connected to the bonding pad PAD, but is connected to the bridge electrode 210 through the eighth via V08, the position of the eighth via V08 does not need to be limited by the bonding pad PAD, so that the distance between the eighth via V08 and the adjacent opening KK can be set to be larger, thereby reducing the process difficulty of forming the first planarization layer PLN1 and improving the sidewall shape of the first planarization layer PLN1 at the opening KK.

[0179] It is further illustrated that the driving circuit layer 200 can include multiple conductive layers, and the conductive layer provided with the bridge electrode 210 can be the conductive layer closest to the bonding pad PAD, so that the depth of the eighth via V08 connecting the series electrode 510 and the bridge electrode 210 can be reduced.

[0180] For example, the insulating layer PV between the conductive layer and the bonding pad PAD can include an inorganic passivation layer on the conductive layer and a fourth planarization layer on the side of the inorganic passivation layer away from the conductive layer.

[0181] FIG. 8 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0182] According to some exemplary embodiments, referring to FIG. 8, the display substrate further includes an auxiliary electrode 420 on the side of the series electrode 510 close to or away from the substrate 100, and the auxiliary electrode 420 is electrically connected to the series electrode 510. The auxiliary electrode 420 includes a metal material with high conductivity, the material of the series electrode 510 includes a transparent conductive material (for example, which can include indium tin oxide), and the resistivity of the material of the auxiliary electrode 420 is less than the resistivity of the material of the series electrode 510. After connecting the auxiliary electrode 420 to the series electrode 510, the resistance of the series electrode 510 can be effectively reduced, thereby effectively alleviating the current attenuation effect in the series electrode 510 and improving the brightness of the light emitting device 300.

[0183] According to some exemplary embodiments, referring to FIG. 8, the auxiliary electrode 420 is located between the first planarization layer PLN1 and the second planarization layer PLN2, the second planarization layer PLN2 has a ninth via V09, the ninth via V09 exposes a part of the auxiliary electrode 420, and the series electrode 510 is electrically connected to the auxiliary electrode 420 through the ninth via V09.

[0184] FIG. 9 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0185] According to some exemplary embodiments, referring to FIG. 9, the second planarization layer PLN2 includes a plurality of planarization portions 530, and a normal projection of at least a portion of the auxiliary electrode 420 on the substrate 100 is spaced apart from a normal projection of the planarization portion 530 on the substrate 100, that is, the at least a portion of the auxiliary electrode 420 is not covered by the planarization portion 530, the portion of the auxiliary electrode 420 not covered by the planarization portion 530 is located between the series electrode 510 and the first planarization layer PLN1, the portion of the auxiliary electrode 420 not covered by the planarization portion 530 in the side surface away from the substrate 100 is directly connected to the side surface of the series electrode 510 close to the substrate 100, and the auxiliary electrode 420 has a larger contact area with the series electrode 510, which is more conducive to improving the current attenuation effect in the series electrode 510.

[0186] According to some exemplary embodiments, referring to FIG. 8 or FIG. 9, the material of the reflective layer 400 includes a metal material, and the auxiliary electrode 420 is located in the reflective layer 400, that is, the auxiliary electrode 420 and the reflective portion 410 are formed by the same film forming process and patterning process, which can simplify the preparation process of the display substrate.

[0187] FIG. 10 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure. In FIG. 10, only part of the structure in the display substrate is shown for the purpose of more clearly showing the structure of the buffer layer and the passivation layer, and the aforementioned reflective portion and other structures are omitted, but the display substrate provided by the embodiments of the present disclosure can also include the aforementioned structures, and the arrangement manner of these structures can refer to the aforementioned embodiments, and the embodiments of the present disclosure will not be described here again.

[0188] According to some exemplary embodiments, referring to FIG. 10, the display substrate further includes a buffer layer 540, the buffer layer 540 includes a plurality of buffer portions 541 arranged at intervals, the buffer portion 541 is located on a side of the light emitting functional portion 320 away from the substrate 100, a surface of the buffer portion 541 close to the substrate 100 is in contact with a surface of the light emitting functional portion 320 away from the substrate 100, the buffer portion 541 has a twelfth via hole V12, and the second electrode 330 is connected to the light emitting functional portion 320 through the twelfth via hole V12. The buffer layer 540 is used to protect the glue layer on the carrier substrate during the preparation process of the display substrate, so as to avoid the problem that the light emitting functional portion 320 falls off from the carrier substrate due to damage to the glue layer during the defect repair process of the sidewall of the light emitting functional portion 320, and the specific improvement principle will be described in the embodiments of the preparation method described later.

[0189] According to some exemplary embodiments, referring to FIG. 10, the display substrate further comprises a passivation layer 550, the passivation layer 550 comprises a plurality of passivation portions 551 arranged at intervals, the passivation portions 551 cover the sidewalls of the light-emitting functional portions 320, and are used to passivate the sidewalls of the light-emitting functional portions 320 and extend along the sidewalls of the light-emitting functional portions 320 to the side away from the substrate 100 to contact the buffer layer 540. The passivation portions 551 have a thirteenth via V13 on the side of the light-emitting functional portions 320 close to the substrate 100, the thirteenth via V13 exposes a part of the light-emitting functional portions 320, and the first electrode 310 is connected to the light-emitting functional portions 320 through the thirteenth via V13.

[0190] For example, the material of the passivation layer 550 comprises silicon oxide or aluminum oxide, and the thickness of the passivation layer 550 is 1000 angstroms-5000 angstroms.

[0191] According to some exemplary embodiments, the side of the passivation portion 551 away from the substrate 100 is farther away from the substrate 100 than the side of the buffer portion 541 close to the substrate 100, and the side of the passivation portion 551 away from the substrate 100 is closer to the substrate 100 than the side of the buffer portion 541 away from the substrate 100. Since the buffer layer 540 will be etched to a certain extent when the plurality of light-emitting functional portions 320 are patterned, the side of the passivation portion 551 away from the substrate 100 will be located between the side of the buffer portion 541 close to the substrate 100 and the side of the buffer portion 541 away from the substrate 100. The specific forming process is described in the embodiment of the preparation method described below.

[0192] According to some exemplary embodiments, referring to FIG. 10, in at least one buffer portion 541 and the passivation portion 551 connected to the buffer portion 541, the side of the buffer portion 541 away from the substrate 100 has a first protruding portion T1, the first protruding portion T1 protrudes away from the twelfth via V12, and the side of the first protruding portion T1 away from the substrate 100 is flush with the side of the buffer portion 541 away from the substrate 100. The passivation portion 551 extends along the sidewall of the light-emitting functional portion 320 to the side away from the substrate 100 to contact the side of the first protruding portion T1 close to the substrate 100, and the side of the passivation portion 551 away from the sidewall of the light-emitting functional portion 320 is connected to the side of the first protruding portion T1 away from the twelfth via V12. The forming process of the passivation portion 551 and the buffer portion 541 is described in the embodiment of the preparation method described below.

[0193] FIG. 11 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0194] According to some exemplary embodiments, referring to FIG. 11, in at least one buffer portion 541 and the passivation portion 551 connected with the buffer portion 541, the second protruding portion T2 is formed on the side of the buffer portion 541 away from the substrate 100, the second protruding portion T2 protrudes in a direction away from the twelfth via V12, and the side of the second protruding portion T2 away from the substrate 100 is flush with the side of the buffer portion 541 away from the substrate 100. The third protruding portion T3 is formed on the side of the passivation portion 551 away from the substrate 100, the third protruding portion T3 protrudes in a direction away from the twelfth via V12, the side of the third protruding portion T3 away from the substrate 100 is in contact with the side of the second protruding portion T2 close to the substrate 100, and the side of the third protruding portion T3 away from the twelfth via V12 is connected with the side of the second protruding portion T2 away from the twelfth via V12.

[0195] FIG. 12 schematically shows a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0196] According to some exemplary embodiments, referring to FIG. 12, in at least one buffer portion 541 and the passivation portion 551 connected with the buffer portion 541, the fourth protruding portion T4 is formed on the side of the buffer portion 541 close to the substrate 100, the fourth protruding portion T4 protrudes in a direction away from the twelfth via V12, the side of the fourth protruding portion T4 away from the twelfth via V12 is connected with the sidewall of the light-emitting functional portion 320, and the side of the fourth protruding portion T4 close to the substrate 100 is flush with the side of the buffer portion 541 close to the substrate 100. The passivation portion 551 extends along the sidewall of the light-emitting functional portion 320 to the side away from the substrate 100 and is in contact with the fourth protruding portion T4, and the side of the passivation portion 551 away from the substrate 100 is substantially flush with the side of the fourth protruding portion T4 away from the substrate 100.

[0197] It should be understood that in the display substrate provided by the embodiments of the present disclosure, due to the influence of the patterning process for forming the buffer portion 541 and the passivation portion 551, the structures shown in FIGS. 10, 11 and 12 may exist simultaneously in the display panel, for example, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 10, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 11, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 12, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 10 on one side and the structure shown in FIG. 11 on the other side, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 10 on one side and the structure shown in FIG. 12 on the other side, or some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 11 on one side and the structure shown in FIG. 12 on the other side. The processes and principles for forming the foregoing structures are described in detail in the embodiments of the preparation method described below.

[0198] FIG. 13 schematically shows a flow chart of a preparation method of a display substrate according to an embodiment of the present disclosure.

[0199] According to some exemplary embodiments, with reference to FIG. 13, the preparation method of the display substrate includes steps S10-S30.

[0200] In step S10, a driving circuit layer is formed on a substrate substrate, the substrate substrate has a first surface facing the driving circuit layer.

[0201] In step S20, a plurality of light emitting devices are formed on a side of the driving circuit layer away from the substrate substrate, the light emitting device includes a first electrode located on the side of the driving circuit layer away from the substrate substrate and electrically connected with the driving circuit layer, a light emitting functional part located on a side of the first electrode away from the substrate substrate, and a second electrode located on a side of the light emitting functional part away from the substrate substrate.

[0202] In step S30, a reflective layer is formed on the side of the driving circuit layer away from the substrate substrate, the reflective layer includes at least one reflective part, the reflective part is at least partially arranged around a sidewall of the light emitting functional part and spaced apart from the light emitting device, the reflective part has a reflective surface facing the light emitting functional part, and the reflective surface has an inclination angle with respect to the first surface substantially equal to an inclination angle of the sidewall of the light emitting functional part with respect to the first surface.

[0203] FIGS. 14A-14G schematically show a forming process diagram of a display substrate according to some embodiments of the present disclosure.

[0204] Referring to FIG. 14A, a driving circuit layer 200 is formed on a substrate substrate 100, the driving circuit layer 200 includes a plurality of driving circuits. An insulating layer PV is formed on a side of the driving circuit layer 200 away from the substrate substrate 100, the insulating layer PV can include an inorganic passivation layer located on the side of the driving circuit layer 200 away from the substrate substrate 100 and a fourth planarization layer located on a side of the inorganic passivation layer away from the substrate substrate 100, and the insulating layer PV includes an eleventh via V11. A plurality of spaced bonding pads PAD are formed on a side of the plurality of bonding pads PAD away from the substrate substrate 100, the bonding pads PAD are electrically connected with the driving circuit through the eleventh via V11. A plurality of first electrodes 310 are formed on a side of the plurality of first electrodes 310 away from the substrate substrate 100, and a plurality of light emitting functional parts 320 are formed on a side of the plurality of light emitting functional parts 320 away from the substrate substrate 100.

[0205] Referring to FIG. 14B, an encapsulation film 520L is formed on a side of the plurality of light emitting functional parts 320 away from the substrate substrate 100, the encapsulation film 520L covers a side of the light emitting functional part 320 away from the substrate substrate 100, a part of a side of the light emitting functional part 320 close to the substrate substrate 100 not covered by the first electrode 310, and a sidewall of the light emitting functional part 320.

[0206] For example, the material of the encapsulation film 520L includes at least one of silicon nitride and silicon oxide, and the thickness of the encapsulation film 520L is 3000 angstroms-10000 angstroms.

[0207] Referring to FIG. 14C, a first planarization layer PLN1 is formed on the side of the encapsulation film 520L away from the substrate 100, and the first planarization layer PLN1 has an opening KK and a first via V01. The light emitting functional part 320 is located in the opening KK, and the sidewall of the first planarization layer PLN1 at the opening KK is substantially parallel to the sidewall of the light emitting functional part 320. The first via V01 is disposed adjacent to the opening KK, and the orthographic projection of the first via V01 on the substrate 100 partially overlaps the orthographic projection of the bonding pad PAD on the substrate 100.

[0208] Referring to FIG. 14D, a reflective layer 400 is formed on the side of the first planarization layer PLN1 away from the substrate 100, and the reflective layer 400 includes a reflective part 410. At least a portion of the reflective part 410 is located on the sidewall of the first planarization layer PLN1 at the opening KK, the reflective part 410 is disposed around the sidewall of the light emitting functional part 320 and is spaced apart from the light emitting functional part 320, and the reflective part 410 has a reflective surface 410a facing the light emitting functional part 320. At least a portion of the reflective surface 410a is substantially parallel to the sidewall of the adjacent light emitting functional part 320.

[0209] Referring to FIG. 14D and FIG. 14E, a second planarization layer PLN2 is formed on the side of the first planarization layer PLN1 away from the substrate 100, and the second planarization layer PLN2 has a second via V02 and a third via V03. The orthographic projection of the second via V02 on the substrate 100 is located within the orthographic projection of the light emitting functional part 320 on the substrate 100, and the orthographic projection of the third via V03 on the substrate 100 is located within the orthographic projection of the first via V01 on the substrate 100. Further, the encapsulation film 520L is etched by taking the second planarization layer PLN2 as a mask, so that the second via V02 and the third via V03 further penetrate the encapsulation film 520L, that is, the encapsulation layer 520 is formed, the second via V02 exposes a portion of the light emitting functional part 320, and the third via V03 exposes a portion of the bonding pad PAD.

[0210] Referring to FIG. 14F, a second electrode 330 and a series electrode 510 are formed on the side of the second planarization layer PLN2 away from the substrate 100, and the second electrode 330 is connected to the light emitting functional part 320 through the second via V02. One end of the series electrode 510 is electrically connected to the second electrode 330 of one light emitting device 300, and the other end is electrically connected to the bonding pad PAD electrically connected to the first electrode 310 of another light emitting device 300 through the third via V03.

[0211] For example, the second electrode 330 and the series electrode 510 are connected as an integrated structure, and the second electrode 330 and the series electrode 510 can be formed by the same film forming process and patterning process. The material of the second electrode 330 and the series electrode 510 can include a transparent conductive material, and the thickness of the second electrode 330 and the series electrode 510 is 300 angstroms-1500 angstroms. Illustratively, the material of the second electrode 330 and the series electrode 510 can include indium tin oxide or indium zinc oxide.

[0212] Referring to FIG. 14G, a third planarization layer PLN3 is formed on the side of the series electrode 510 away from the substrate substrate 100.

[0213] FIGS. 15A-15D schematically show a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0214] With reference to FIGS. 14C and 15A, a reflective layer 400 is formed on the side of the first planarization layer PLN1 away from the substrate substrate 100, the reflective layer 400 including a reflective portion 410 and an auxiliary electrode 420. At least a portion of the reflective portion 410 is located on the sidewall of the first planarization layer PLN1 at the opening KK, the reflective portion 410 is disposed around the sidewall of the light emitting functional portion 320 and spaced apart from the light emitting device 300, the reflective portion 410 has a reflective surface 410a facing the light emitting functional portion 320, at least a portion of the reflective surface 410a is substantially parallel to the sidewall of the adjacent light emitting functional portion 320, and the auxiliary electrode 420 is located on the side of the first planarization layer PLN1 away from the substrate substrate 100.

[0215] With reference to FIGS. 15A and 15B, a second planarization layer PLN2 is formed on the side of the first planarization layer PLN1 away from the substrate substrate 100, the second planarization layer PLN2 having a second via hole V02, a third via hole V03, and a ninth via hole V09. The ninth via hole V09 exposes a portion of the auxiliary electrode 420, the second via hole V02 has a projection on the substrate substrate 100 within the projection of the light emitting functional portion 320 on the substrate substrate 100, and the third via hole V03 has a projection on the substrate substrate 100 within the projection of the first via hole V01 on the substrate substrate 100. Taking the second planarization layer PLN2 as a mask, the encapsulation film 520L is etched, so that the second via hole V02 and the third via hole V03 further penetrate the encapsulation film 520L, that is, an encapsulation layer 520 is formed, the second via hole V02 exposes a portion of the light emitting functional portion 320, and the third via hole V03 exposes a portion of the bonding pad PAD.

[0216] Referring to FIG. 15C, the second electrode 330 and the series electrode 510 are formed on the side of the second planarization layer PLN2 away from the substrate 100, the second electrode 330 being connected to the light emitting functional part 320 through the second via V02. One end of the series electrode 510 is electrically connected to the second electrode 330 of one light emitting device 300, and the other end is electrically connected to the bonding pad PAD electrically connected to the first electrode 310 of another light emitting device 300 through the third via V03, and the series electrode 510 is also electrically connected to the auxiliary electrode 420 through the ninth via V09.

[0217] Referring to FIG. 15D, the third planarization layer PLN3 is formed on the side of the series electrode 510 away from the substrate 100.

[0218] FIGS. 16A-16C schematically show a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0219] Referring to FIG. 16A, the second planarization layer PLN2 is formed on the side of the first planarization layer PLN1 away from the substrate 100, the second planarization layer PLN2 including a plurality of spaced-apart planarization parts 530, the planarization parts 530 having an outer contour in orthographic projection on the substrate 100 that surrounds an outer contour in orthographic projection on the substrate 100 of the reflecting part 410, the planarization parts 530 being configured to fill the gap between the light emitting device 300 and the reflecting part 410. The planarization parts 530 have fourth vias V04, the fourth vias V04 having an orthographic projection on the substrate 100 that is within an orthographic projection on the substrate 100 of the light emitting functional part 320.

[0220] In combination with reference to FIG. 16A and FIG. 16B, the encapsulation film 520L is etched using the first planarization layer PLN1 and the second planarization layer PLN2 as a mask, so that the fourth via V04 and the fifth via V05 further penetrate the encapsulation film 520L, i.e., the encapsulation layer 520 is formed, the fourth via V04 exposing a portion of the light emitting functional part 320, and the fifth via V05 exposing a portion of the bonding pad PAD. The second electrode 330 and the series electrode 510 are formed on the side of the second planarization layer PLN2 away from the substrate 100, the second electrode 330 being connected to the light emitting functional part 320 through the fourth via V04. One end of the series electrode 510 is electrically connected to the second electrode 330 of one light emitting device 300, and the other end is electrically connected to the bonding pad PAD electrically connected to the first electrode 310 of another light emitting device 300 through the fifth via V05.

[0221] Referring to FIG. 16C, the third planarization layer PLN3 is formed on the side of the series electrode 510 away from the substrate 100.

[0222] FIGS. 17A-17E schematically show a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0223] Referring to FIG. 17A, a first planarization layer PLN1 is formed on a side of the encapsulation film 520L away from the substrate 100, the first planarization layer PLN1 has an opening KK. The light emitting functional part 320 is located in the opening KK, and the sidewall of the first planarization layer PLN1 at the opening KK is substantially parallel to the sidewall of the light emitting functional part 320.

[0224] Referring to FIG. 17B, a reflective layer 400 is formed on a side of the first planarization layer PLN1 away from the substrate 100, the reflective layer 400 includes a reflective part 410, at least a portion of the reflective part 410 is located on the sidewall of the first planarization layer PLN1 at the opening KK, the reflective part 410 is arranged around the sidewall of the light emitting functional part 320 and spaced apart from the light emitting functional part 320, and the reflective part 410 has a reflective surface 410a facing the light emitting functional part 320, at least a portion of the reflective surface 410a is substantially parallel to the sidewall of the adjacent light emitting functional part 320.

[0225] Referring to FIGS. 17B and 17C, a second planarization layer PLN2 is formed on a side of the first planarization layer PLN1 away from the substrate 100, the second planarization layer PLN2 has a sixth via V06 and a seventh via V07. The seventh via V07 has a projection on the substrate 100 within the projection of the light emitting functional part 320 on the substrate 100, the sixth via V06 has a projection on the substrate 100 within the projection of the opening KK on the substrate 100, and the sixth via V06 has a projection on the substrate 100 within the projection of the bonding pad PAD on the substrate 100. The encapsulation film 520L is etched with the second planarization layer PLN2 as a mask, so that the sixth via V06 and the seventh via V07 further penetrate the encapsulation film 520L, that is, the encapsulation layer 520 is formed, the seventh via V07 exposes a portion of the light emitting functional part 320, and the sixth via V06 exposes a portion of the bonding pad PAD.

[0226] Referring to FIG. 17D, a second electrode 330 and a series electrode 510 are formed on a side of the second planarization layer PLN2 away from the substrate 100, the second electrode 330 is connected to the light emitting functional part 320 through the seventh via V07. One end of the series electrode 510 is electrically connected to the second electrode 330 of one light emitting device 300, and the other end is electrically connected to the bonding pad PAD electrically connected to the first electrode 310 of another light emitting device 300 through the sixth via V06.

[0227] Referring to FIG. 17E, a third planarization layer PLN3 is formed on a side of the series electrode 510 away from the substrate 100.

[0228] FIGS. 18A-18F schematically illustrate a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0229] Referring to FIG. 18A, a drive circuit layer 200 is formed on a substrate 100, the drive circuit layer 200 includes a plurality of drive circuits, the drive circuit layer 200 includes a plurality of conductive layers, a bridge electrode 210 is further included in the conductive layer farthest from the substrate 100, and the bridge electrode 210 is electrically connected with the drive circuit. An insulating layer PV is formed on a side of the drive circuit layer 200 far from the substrate 100, the insulating layer PV can include an inorganic passivation layer on the side of the drive circuit layer 200 far from the substrate 100 and a fourth planarization layer on the side of the inorganic passivation layer far from the substrate 100, and the insulating layer PV includes an eleventh via V11, the eleventh via V11 exposes a portion of the bridge electrode 210. A bonding pad PAD is formed on a side of the insulating layer PV far from the substrate 100, the bonding pad PAD is electrically connected with the series electrode 510 through the eleventh via V11. A first electrode 310 is formed on a side of the bonding pad PAD far from the substrate 100, and a light emitting functional part 320 is formed on a side of the first electrode 310 far from the substrate 100. An encapsulation film 520L is formed on a side of the light emitting functional part 320 far from the substrate 100, the encapsulation film 520L covers the side of the light emitting functional part 320 far from the substrate 100, the portion of the light emitting functional part 320 close to the substrate 100 which is not covered by the first electrode 310, and the sidewall of the light emitting functional part 320.

[0230] Referring to FIG. 18B, a first planarization layer PLN1 is formed on a side of the encapsulation film 520L far from the substrate 100, the first planarization layer PLN1 has an opening KK and an eighth via V08. The light emitting functional part 320 is located in the opening KK, and the sidewall of the first planarization layer PLN1 at the opening KK is substantially parallel to the sidewall of the light emitting functional part 320. The eighth via V08 is disposed adjacent to the opening KK, and the orthographic projection of the eighth via V08 on the substrate 100 is spaced apart from the orthographic projection of the bonding pad PAD on the substrate 100.

[0231] Referring to FIG. 18C, a reflective layer 400 is formed on a side of the first planarization layer PLN1 far from the substrate 100, the reflective layer 400 includes a reflective part 410, at least a portion of the reflective part 410 is located on the sidewall of the first planarization layer PLN1 at the opening KK, the reflective part 410 is disposed around the sidewall of the light emitting functional part 320 and is spaced apart from the light emitting device 300, and the reflective part 410 has a reflective surface 410a facing the light emitting functional part 320, at least a portion of the reflective surface 410a is substantially parallel to the sidewall of the adjacent light emitting functional part 320.

[0232] With reference to FIGS. 18C and 18D, a second planarization layer PLN2 is formed on the side of the first planarization layer PLN1 away from the substrate 100, and the second planarization layer PLN2 includes a plurality of spaced-apart planarization portions 530, the outer contour of the planarization portions 530 in the orthographic projection on the substrate 100 surrounds the outer contour of the reflective portion 410 in the orthographic projection on the substrate 100, and the planarization portions 530 can be used to fill the gap between the light emitting device 300 and the reflective portion 410. The planarization portions 530 have fourth vias V04, the orthographic projection of the fourth vias V04 on the substrate 100 is within the orthographic projection of the light emitting functional portion 320 on the substrate 100. The encapsulation film 520L is etched using the first planarization layer PLN1 and the second planarization layer PLN2 as masks, so that the fourth vias V04 further penetrate the encapsulation film 520L, and so that the eighth vias V08 further penetrate the encapsulation film 520L and the insulating layer PV, i.e., an encapsulation layer 520 is formed, the fourth vias V04 expose a portion of the light emitting functional portion 320, and the eighth vias V08 expose a portion of the bridge electrode 210.

[0233] With reference to FIG. 18E, a second electrode 330 and a series electrode 510 are further formed on the side of the second planarization layer PLN2 away from the substrate 100, and the second electrode 330 is connected to the light emitting functional portion 320 through the fourth vias V04. One end of the series electrode 510 is electrically connected to the second electrode 330 of one light emitting device 300, and the other end is electrically connected to the bridge electrode 210 through the eighth vias V08, and the bridge electrode 210 is electrically connected to the bonding pad PAD electrically connected to the first electrode 310 of another light emitting device 300.

[0234] With reference to FIG. 18F, a third planarization layer PLN3 is formed on the side of the series electrode 510 away from the substrate 100.

[0235] FIG. 19 schematically shows a flowchart of forming a light emitting device in a preparation method of a display substrate according to an embodiment of the present disclosure.

[0236] According to some exemplary embodiments, with reference to FIG. 19, forming a plurality of light emitting devices on the side of the driving circuit layer away from the substrate 100 can include the following steps S201-S210.

[0237] In step S201, an epitaxial wafer is provided, and the epitaxial wafer includes an epitaxial substrate and an epitaxial layer on the epitaxial substrate.

[0238] In step S202, a buffer film is formed on the side of the epitaxial layer away from the epitaxial substrate.

[0239] In step S203, a carrier substrate is provided, and a glue layer is formed on the carrier substrate.

[0240] In step S204, the epitaxial layer and the buffer film located on the epitaxial substrate are transferred to the side of the adhesive layer away from the middle carrier substrate, so that the epitaxial layer is located on the side of the buffer film away from the adhesive layer.

[0241] In step S205, a patterning process is performed on the epitaxial layer to form a plurality of light-emitting functional parts arranged at intervals.

[0242] In step S206, a defect repair process is performed on the sidewall of the light-emitting functional part.

[0243] In step S207, a plurality of first electrodes are formed on the side of the plurality of light-emitting functional parts away from the middle carrier substrate.

[0244] In step S208, a dissociation process is performed on the adhesive layer to transfer the plurality of first electrodes, the plurality of light-emitting functional parts, and the buffer film to the side of the driving circuit layer away from the substrate substrate, and the plurality of first electrodes are electrically connected to the driving circuit layer.

[0245] In step S209, a plurality of vias are formed in the buffer film, and the vias expose a part of the light-emitting functional part.

[0246] In step S210, a plurality of second electrodes are formed on the side of the buffer film away from the substrate substrate, and the plurality of second electrodes are connected to the plurality of light-emitting functional parts through the plurality of vias.

[0247] FIGS. 20A-20L schematically show a process diagram of forming a light-emitting device in a display substrate according to some embodiments of the present disclosure.

[0248] Referring to FIG. 20A, an epitaxial wafer 600 is provided, which includes an epitaxial substrate 610, an epitaxial buffer layer 620 located on the epitaxial substrate 610, and an epitaxial layer 630 located on the epitaxial buffer layer 620, and a buffer film 540L is formed on the side of the epitaxial layer 630 away from the epitaxial substrate 610.

[0249] For example, the material of the buffer film 540L includes at least one of silicon oxide, silicon nitride, and silicon oxynitride, and the thickness of the buffer film 540L is greater than or equal to 1000 angstroms.

[0250] Referring to FIGS. 20A and 20B, a middle carrier substrate 710 is provided, and an adhesive layer is formed on the middle carrier substrate 710, which includes a sticky adhesive layer 720 located on the middle carrier substrate 710 and a dissociation adhesive layer 730 located on the side of the sticky adhesive layer 720 away from the middle carrier substrate 710. The epitaxial wafer 600 with the buffer film 540L is attached to the adhesive layer, and one side of the buffer film 540L is attached to the dissociation adhesive layer 730. Then, the epitaxial substrate 610 and the epitaxial buffer layer 620 are removed, so that the side of the epitaxial layer 630 away from the middle carrier substrate 710 is exposed.

[0251] For example, the middle substrate 710 can be a glass substrate.

[0252] For example, the thickness of the adhesive layer 720 is greater than the thickness of the dissociation layer 730, the thickness of the adhesive layer 720 is 20-100 μm, and the thickness of the dissociation layer 730 is 1-3 μm. In this way, the interface of the separation during the laser dissociation is the interface between the dissociation layer 730 and the adhesive layer 720, and the organic film layer that can be left on the light-emitting functional part 320 is only the dissociation layer 730, which can be easily removed.

[0253] In combination with FIGS. 20B and 20C, the epitaxial layer 630 is patterned to form a plurality of light-emitting functional parts 320 arranged at intervals, and the sidewalls of the formed light-emitting functional parts 320 are subjected to a defect repair process.

[0254] For example, the photoresist layer is etched on the epitaxial layer 630 using a dry etching process, and the process gas used in the dry etching process can include Cl2 or BCl3, etc. During the etching of the epitaxial layer 630, the buffer film 540L located on the lower side of the epitaxial layer 630 will be etched to a certain extent, that is, a groove between adjacent light-emitting functional parts 320 is formed in the buffer film 540L, that is, the buffer film 540L includes a first part 540M located on the side of the light-emitting functional part 320 close to the middle substrate 710 and a second part 540N located between adjacent light-emitting functional parts 320, and the thickness of the second part 540N is less than the thickness of the first part 540M.

[0255] For example, the step of subjecting the sidewalls of the formed light-emitting functional parts 320 to a defect repair process can include immersing the sidewalls of the light-emitting functional parts 320 in an alkali solution. For example, the alkali solution can include a tetramethylammonium hydroxide (TMAH) solution with a concentration of 2.38 wt%. Due to the addition of the buffer film 540L, the buffer film 540L can act as a barrier structure to prevent the alkali solution from contacting the dissociation layer 730 during the alkali immersion process, thereby avoiding the problem of chemical reaction between the alkali solution and the dissociation layer 730 causing the dissociation layer 730 to be decomposed.

[0256] It is further noted that the inventors have found that if the buffer film 540L is not provided, the contact between the alkali solution and the dissociation layer 730 will cause the dissociation layer 730 to be partially ineffective, and the width of the ineffective area of the dissociation layer 730 can reach hundreds of microns, which is much larger than the size of the light-emitting functional part 320, thereby causing a part of the light-emitting functional part 320 to fall off from the middle substrate 710. However, if the alkali solution is not used for defect repair of the sidewalls of the light-emitting functional part 320 in order to avoid this problem, the light-emitting efficiency of the light-emitting device 300 will be greatly reduced.

[0257] Referring to FIG. 20D, a passivation film 550L is formed on the side of the plurality of light emitting functional units 320 away from the carrier substrate 710, the passivation film 550L covering the sidewalls of the light emitting functional units 320, the side of the light emitting functional units 320 away from the carrier substrate 710, and a second portion 540N of the buffer film 540L.

[0258] For example, the material of the passivation film 550L includes silicon oxide or aluminum oxide, and the thickness of the passivation film 550L is 1000 angstroms-5000 angstroms.

[0259] Referring to FIG. 20E, a fourteenth via V14 is formed in the passivation film 550L, the fourteenth via V14 exposing a portion of the light emitting functional units 320, and a first electrode 310 is formed on the side of the passivation film 550L away from the carrier substrate 710, the first electrode 310 being connected to the light emitting functional units 320 through the fourteenth via V14.

[0260] Referring to FIG. 20F, a photoresist layer PR is formed on the side of the first electrode 310 away from the carrier substrate 710, the photoresist layer PR including a plurality of photoresist units PR1 arranged at intervals, the orthographic projections of the plurality of photoresist units PR1 on the carrier substrate 710 respectively covering the orthographic projections of the plurality of light emitting functional units 320 on the carrier substrate 710, and the edges of the orthographic projections of the photoresist units PR1 on the carrier substrate 710 being spaced apart from the edges of the orthographic projections of the light emitting functional units 320 on the carrier substrate 710 by a distance greater than or equal to a predetermined distance.

[0261] Referring to FIGS. 20F and 20G, the passivation film 550L and the buffer film 540L are etched under the shielding of the photoresist units PR1, obtaining a plurality of passivation units 551 and buffer units 541 arranged at intervals. The etching process is a wet etching process, for example, a hydrofluoric acid solution with a concentration greater than or equal to 2.3 wt% is used to etch the passivation film 550L and the buffer film 540L. The isotropy of the wet etching process causes the edges of the passivation units 551 and the buffer units 541 obtained by etching to be recessed inward compared to the edges of the photoresist units PR1, so that by comprehensively adjusting the distance by which the edges of the photoresist units PR1 protrude compared to the edges of the light emitting functional units 320 and the parameters of the wet etching process, the passivation units 551 and the buffer units 541 formed have smooth sidewalls.

[0262] For example, referring to FIG. 20G, the buffer portion 541 has a first protruding portion T1 on the side close to the carrier substrate 710, the first protruding portion T1 is on the side close to the carrier substrate 710 of the dissociation adhesive layer 730, and the first protruding portion T1 protrudes towards the adjacent buffer portion 541. The passivation portion 551 extends along the sidewall of the light emitting functional portion 320 to the side close to the carrier substrate 710 and contacts the side of the first protruding portion T1 away from the carrier substrate 710, and the side of the passivation portion 551 away from the sidewall of the light emitting functional portion 320 is connected to the side of the first protruding portion T1 close to the adjacent buffer portion 541.

[0263] It should be understood that due to the precision of the exposure process, the position of the photoresist portion PR1 formed may have a certain deviation, therefore, the buffer portion 541 and the passivation portion 551 obtained by the wet etching process also form the structure shown in FIG. 20H or FIG. 20I.

[0264] For example, referring to FIG. 20H, the buffer portion 541 has a second protruding portion T2 on the side close to the carrier substrate 710, the second protruding portion T2 is on the side close to the carrier substrate 710 of the dissociation adhesive layer 730, and the second protruding portion T2 protrudes towards the adjacent buffer portion 541. The passivation portion 551 has a third protruding portion T3 on the side close to the carrier substrate 710, the third protruding portion T3 protrudes towards the adjacent passivation portion 551, the side of the third protruding portion T3 close to the carrier substrate 710 contacts the side of the second protruding portion T2 away from the carrier substrate 710, and the side of the third protruding portion T3 close to the adjacent passivation portion 551 is connected to the side of the second protruding portion T2 close to the adjacent buffer portion 541.

[0265] For another example, referring to FIG. 20I, the buffer portion 541 has a fourth protruding portion T4 on the side away from the carrier substrate 710, the fourth protruding portion T4 contacts the side of the light emitting functional portion 320 close to the carrier substrate 710 away from the carrier substrate 710, the fourth protruding portion T4 protrudes towards the adjacent buffer portion 541, and the side of the fourth protruding portion T4 close to the adjacent buffer portion 541 is connected to the sidewall of the light emitting functional portion 320. The passivation portion 551 extends along the sidewall of the light emitting functional portion 320 to the side close to the carrier substrate 710 and contacts the fourth protruding portion T4, and the side of the passivation portion 551 close to the carrier substrate 710 is substantially flush with the side of the fourth protruding portion T4 close to the carrier substrate 710.

[0266] It is to be noted that the structures shown in FIGS. 20G, 20H and 20I can exist simultaneously in the plurality of buffer portions 541 and the plurality of passivation portions 551, for example, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20G, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20H, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20I, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20G on one side and the structure shown in FIG. 20H on the other side, some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20G on one side and the structure shown in FIG. 20I on the other side, or some buffer portions 541 and passivation portions 551 have the structure shown in FIG. 20H on one side and the structure shown in FIG. 20I on the other side.

[0267] The inventors have found that if the buffer film 540L and the passivation film 550L are etched by a dry etching process, the edges of the buffer portions 541 and the passivation portions 551 are generally flush with the edges of the photoresist portion PR1. However, due to the alignment accuracy of the exposure process (e.g., greater than or equal to 0.6 μm), the edges of the photoresist portion PR1 cannot be completely aligned with the edges of the light emitting functional portion 320. In order to ensure that the photoresist portion PR1 completely covers the light emitting functional portion 320, the edges of the photoresist portion PR1 should be at least 0.6 μm outwardly protruding compared to the edges of the light emitting functional portion 320. Therefore, the buffer portions 541 and the passivation portions 551 formed by etching have a structure similar to that shown in FIG. 20H, and the buffer portions 541 and the passivation portions 551 have a protruding distance of greater than or equal to 0.6 μm (which is much greater than the protruding distance of the buffer portions 541 and the passivation portions 551 formed by the wet etching process described above). Furthermore, considering the alignment deviation of the exposure process, the protruding distance can be up to 1.2 μm. If the light emitting functional portion 320 having this structure is reversely bonded to the drive circuit layer 200, a structure similar to a "roof" is formed, which can greatly affect the encapsulation effect of the encapsulation layer 520 formed subsequently, and there is a risk of encapsulation failure.

[0268] In the preparation method provided in the embodiments of the present disclosure, first, the width of the photoresist part PR1 is increased, so that the edge of the photoresist part PR1 protrudes from the edge of the light-emitting functional part 320 by a predetermined distance. The predetermined distance can be set according to the exposure process alignment accuracy and the lateral etching width of the wet etching process. For example, the exposure process alignment accuracy is 0.6 μm, the minimum lateral etching width of the wet etching process is 1.5 μm, and the predetermined distance can be set to 2.1 μm. Then, the wet etching process parameters are adjusted again, so that the edges of the buffer part 541 and the passivation part 551 formed by etching are as close to the edge of the light-emitting functional part 320 as possible. Even if the structure shown in FIG. 20H is still formed, the distance by which the edges of the buffer part 541 and the passivation part 551 protrude from the edge of the light-emitting functional part 320 is smaller, and the influence on the packaging effect is smaller.

[0269] With reference to FIGS. 20G and 20J, the photoresist part PR1 is removed, and the dissociation of the dissociation adhesive layer 730 is processed, for example, the dissociation of the dissociation adhesive layer 730 can be achieved by laser irradiation, so as to transfer the plurality of first electrodes 310, the plurality of light-emitting functional parts 320, the buffer part 541 and the passivation part 551 to the side of the driving circuit layer 200 away from the substrate 100, the plurality of first electrodes 310 are respectively electrically connected to the plurality of bonding pads PAD on the driving circuit layer 200, and the packaging film 520L is formed on the side of the buffer part 541 away from the substrate 100.

[0270] With reference to FIGS. 20J and 20K, a planarization layer PLN is formed on the side of the packaging film 520L away from the substrate 100, the planarization layer PLN has a fifteenth via V15, and the orthographic projection of the fifteenth via V15 on the substrate 100 partially overlaps the orthographic projection of the light-emitting functional part 320 on the substrate 100. The buffer part 541 is etched with the planarization layer PLN as a mask, so that the fifteenth via V15 penetrates the buffer part 541, that is, the fifteenth via V15 exposes a part of the light-emitting functional part 320.

[0271] Referring to FIG. 20L, a second electrode 330 is formed on the side of the planarization layer away from the substrate 100, and the second electrode 330 is connected to the light-emitting functional part 320 through the fifteenth via V15.

[0272] It should be understood that the planarization layer PLN shown in FIG. 20K is the second planarization layer PLN2 described in the foregoing embodiments. The structure of the planarization layer PLN can be the structure of the second planarization layer PLN2 shown in any one of the foregoing embodiments. This embodiment focuses on the preparation process of the light emitting device 300, and the formation process of other structures in the display substrate is partially omitted. For example, the formation process of the first planarization layer, the reflective layer, and the series electrode, and the like is omitted, and the formation steps of the foregoing structures can refer to other embodiments of the present disclosure.

[0273] At least some embodiments of the present disclosure also provide a display device including the display substrate as described above. The display device can include any device or product having a display function. For example, the display device can be a smart phone, a mobile phone, an electronic book reader, a desktop PC (personal computer), a laptop PC, a netbook PC, a PDA (personal digital assistant), a PMP (portable multimedia player), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, electronic accessories, electronic tattoos, or a smart watch), a television, or the like.

[0274] It should be understood that the display panel and the display device according to the embodiments of the present disclosure have all the features and advantages of the display substrate described above, and specific reference can be made to the description above, which will not be repeated here. Although some embodiments of the general inventive concept of the present disclosure have been shown and described, those of ordinary skill in the art will understand that changes can be made in these embodiments without departing from the principles and spirit of the general inventive concept, and the scope of the present disclosure is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate comprises: a substrate substrate; a driving circuit layer on the substrate substrate; and a plurality of light emitting devices on a side of the driving circuit layer away from the substrate substrate, the light emitting device comprising a first electrode on a side of the driving circuit layer away from the substrate substrate and electrically connected to the driving circuit layer, a light emitting functional part on a side of the first electrode away from the substrate substrate, and a second electrode on a side of the light emitting functional part away from the substrate substrate; wherein the display substrate further comprises a reflective layer, the reflective layer comprising at least one reflective part, the reflective part being at least partially disposed around the sidewall of the light emitting functional part and spaced apart from the light emitting device; the reflective part has a reflective surface facing the light emitting functional part, and the substrate substrate has a first surface facing the driving circuit layer; and the inclination angle of at least one of the reflective surface compared to the first surface is substantially equal to the inclination angle of the sidewall of the light emitting functional part compared to the first surface. 2.The display substrate of claim 1, wherein, The reflective surface comprises a curved surface of the reflective part protruding towards the adjacent light emitting functional part, and the tangent plane of at least one of the reflective surface is substantially parallel to the sidewall of the light emitting functional part. 3.The display substrate of claim 2, wherein, The reflective surface comprises a first sub-surface, a second sub-surface and a third sub-surface, the second sub-surface being connected between the first sub-surface and the third sub-surface, the first sub-surface being on a side of the second sub-surface close to the substrate substrate, and the third sub-surface being on a side of the second sub-surface away from the substrate substrate; The light emitting functional part comprises a first semiconductor part, a light emitting part on a side of the first semiconductor part away from the substrate substrate, and a second semiconductor part on a side of the light emitting part away from the substrate substrate; and the first end of the second sub-surface close to the substrate substrate is substantially flush with the surface of the light emitting part close to the substrate substrate, and the second end of the second sub-surface away from the substrate substrate is substantially flush with the surface of the light emitting part away from the substrate substrate, and the tangent plane of at least one of the second sub-surface is substantially parallel to the sidewall of the light emitting functional part. The tangent plane at the first end forms an acute angle with the first surface, the tangent plane at the second end forms an acute angle with the first surface, and the sidewall of the light emitting functional part forms an acute angle with the first surface; wherein the first angle is greater than or equal to the third angle; and / or 4.The display substrate of claim 3, wherein, the second angle is less than or equal to the third angle. The tangent plane of the second sub-surface at each point in the direction away from the substrate substrate forms an acute angle with the first surface, and the angle of the acute angle decreases along the direction away from the substrate substrate. The cross-sectional shape of the reflective surface perpendicular to the first surface comprises a straight line, and the reflective surface is substantially parallel to the sidewall of the light emitting functional part. 5.The display substrate according to claim 3 or 4, wherein, The cross-sectional shape of the light emitting functional part perpendicular to the first surface is an inverted trapezoid. 6.The display substrate of claim 1, wherein, The side of the reflective part away from the substrate substrate is substantially flush with the side of the light emitting functional part away from the substrate substrate; or 7.The display substrate according to any one of claims 1-6, wherein, ​ 8.The display substrate according to any one of claims 1-7, wherein, ​ The side of the reflective portion away from the substrate is farther away from the substrate than the side of the light-emitting functional portion away from the substrate. 9.The display substrate of claim 8, wherein, The distance between the side of the reflective portion away from the substrate and the side of the light-emitting functional portion away from the substrate in a direction perpendicular to the first surface is a first distance, and the thickness of the light-emitting functional portion in a direction perpendicular to the first surface is a first thickness. 0.5*first thickness≤first distance≤2*first thickness. 10.The display substrate according to any one of claims 1-9, wherein, The side of the reflective portion close to the substrate is closer to the substrate than the side of the light-emitting functional portion close to the substrate. 11.The display substrate according to any one of claims 1-10, wherein, The orthographic projection of the reflective portion on the substrate is spaced apart from the orthographic projection of the light-emitting functional portion on the substrate. 12.The display substrate according to any one of claims 1-11, wherein, The display substrate further comprises a first planarization layer on the side of the driving circuit layer away from the substrate, the first planarization layer has a plurality of openings therein, the plurality of light-emitting devices are located in the plurality of openings, and the light-emitting devices are spaced apart from the first planarization layer; The display substrate further comprises a plurality of bonding pads between the driving circuit layer and the plurality of light-emitting devices, and the first electrode of the light-emitting device is electrically connected to the driving circuit layer through the bonding pad. The display substrate further comprises at least one series electrode on the side of the first planarization layer away from the substrate, and in at least two adjacent light-emitting devices, the second electrode of one light-emitting device is electrically connected to the first electrode of another light-emitting device through the series electrode and the bonding pad. 13.The display substrate of claim 12, wherein, In the series electrode and the bonding pad that are electrically connected, at least a part of the series electrode is directly connected to the bonding pad. The first planarization layer further has a first via hole spaced apart from the opening, the first via hole exposes a part of the bonding pad, and the series electrode is overlapped with the bonding pad through the first via hole. 14.The display substrate of claim 13, wherein, The display substrate further comprises a second planarization layer between the first planarization layer and the series electrode, the second planarization layer has a second via hole and a third via hole spaced apart, the second via hole exposes a part of the light-emitting functional portion, and the orthographic projection of the third via hole on the substrate at least partially overlaps with the orthographic projection of the first via hole on the substrate. 15.The display substrate of claim 14, wherein, The second electrode is connected to the light-emitting functional portion through the second via hole. 16.The display substrate of claim 15, wherein, In the two light-emitting devices that are electrically connected, the second electrode of one light-emitting device is electrically connected to one series electrode, and the series electrode is overlapped with the bonding pad electrically connected to another light-emitting device through the third via hole and the first via hole. ​ ​ ​ ​ 17.The display substrate of claim 15, wherein, The display substrate further comprises a second planarization layer between the first planarization layer and the series electrode, the second planarization layer comprises a plurality of spaced-apart planarization portions, the planarization portions have fourth via holes, the fourth via holes expose a part of the light-emitting functional portion, the outer contour of the orthographic projection of the planarization portions on the substrate substrate surrounds the outer contour of the orthographic projection of the reflecting portion on the substrate substrate; The first planarization layer further has a fifth via hole spaced apart from the opening, the orthographic projection of the fifth via hole on the substrate substrate is located outside the outer contour of the orthographic projection of the planarization portion on the substrate substrate, the fifth via hole exposes a part of the bonding pad; The second electrode is connected with the light-emitting functional portion through the fourth via hole; And In the two electrically connected light-emitting devices, the second electrode of one of the light-emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with the other light-emitting device through the fifth via hole. 18.The display substrate of any one of claims 15-17, wherein, The geometric center of the orthographic projection of the light-emitting functional portion on the substrate substrate substantially coincides with the geometric center of the orthographic projection of the reflecting portion surrounded by the light-emitting functional portion on the substrate substrate.

19. The display substrate of claim 14, wherein, The display substrate further comprises a second planarization layer between the first planarization layer and the series electrode; The second planarization layer has a sixth via hole and a seventh via hole spaced apart, the orthographic projection of the sixth via hole on the substrate substrate is located within the orthographic projection of the opening on the substrate substrate, the sixth via hole exposes a part of the bonding pad, and the seventh via hole exposes a part of the light-emitting functional portion; The second electrode is connected with the light-emitting functional portion through the seventh via hole; And In the two electrically connected light-emitting devices, the second electrode of one of the light-emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with the other light-emitting device through the sixth via hole. 20.The display substrate of claim 14, wherein, The display substrate further comprises a second planarization layer between the first planarization layer and the series electrode; The second planarization layer comprises a plurality of spaced-apart planarization portions, the planarization portions have fourth via holes, the fourth via holes expose a part of the light-emitting functional portion, the outer contour of the orthographic projection of the planarization portions on the substrate substrate surrounds the orthographic projection of the light-emitting functional portion on the substrate substrate; The second electrode is connected with the light-emitting functional portion through the fourth via hole; And In the two electrically connected light-emitting devices, the second electrode of one of the light-emitting devices is electrically connected with one of the series electrodes, and the series electrode is overlapped with the bonding pad electrically connected with the other light-emitting device through the opening; At least a part of the series electrode is covered on the side of the reflecting portion away from the first planarization layer.

21. The display substrate of claim 13, wherein, The driving circuit layer comprises a conductive layer close to one side of the bonding pad, the conductive layer comprises a bridging electrode; and In the series electrode and the bonding pad that are electrically connected, the series electrode is electrically connected with the bonding pad through the bridging electrode.

22. The display substrate of claim 21, wherein, The first planarization layer further has an eighth via hole spaced from the opening, a projection of the eighth via hole on the substrate substrate is spaced from a projection of the bonding pad on the substrate substrate, and the eighth via hole exposes a portion of the bridge electrode, and the series electrode is connected to the bridge electrode through the eighth via hole.

23. The display substrate of any of claims 13-22, wherein, The display substrate further comprises an auxiliary electrode, the auxiliary electrode is located on one side of the series electrode close to the substrate substrate or away from the substrate substrate, and the auxiliary electrode is electrically connected to the series electrode.

24. The display substrate of claim 23, wherein, The material of the reflective layer comprises a metal material, and the auxiliary electrode is located on the reflective layer. 25.The display substrate according to any one of claims 1-24, wherein, The display substrate further comprises a buffer layer, and the buffer layer comprises a plurality of spaced buffer portions. The buffer portion is located on one side of the light-emitting functional portion away from the substrate substrate, and a surface of the buffer portion close to the substrate substrate is in contact with a surface of the light-emitting functional portion away from the substrate substrate. The buffer portion has a twelfth via hole, and the second electrode is connected to the light-emitting functional portion through the twelfth via hole. The display substrate further comprises a passivation layer, and the passivation layer comprises a plurality of spaced passivation portions; and 26. The display substrate of claim 25, wherein, The passivation portion covers the sidewall of the light-emitting functional portion and extends to the side away from the substrate substrate along the sidewall of the light-emitting functional portion to contact the buffer layer. The side of the passivation portion away from the substrate substrate is farther away from the substrate substrate than the side of the buffer portion close to the substrate substrate, and the side of the passivation portion away from the substrate substrate is closer to the substrate substrate than the side of the buffer portion away from the substrate substrate. 27.The display substrate of claim 26, wherein, In at least one of the buffer portion and the passivation portion connected to the buffer portion, the side of the buffer portion away from the substrate substrate has a first protruding portion protruding away from the twelfth via hole; 28.The display substrate according to claim 26 or 27, wherein The passivation portion extends to the side of the first protruding portion close to the substrate substrate along the sidewall of the light-emitting functional portion away from the substrate substrate; And The side of the passivation portion away from the sidewall of the light-emitting functional portion is connected to the side of the first protruding portion away from the twelfth via hole. In at least one of the buffer portion and the passivation portion connected to the buffer portion, the side of the buffer portion away from the substrate substrate has a second protruding portion protruding away from the twelfth via hole; 29.The display substrate of claim 26 or 27, wherein, The side of the passivation portion away from the substrate substrate has a third protruding portion protruding away from the twelfth via hole, and the side of the third protruding portion away from the substrate substrate is in contact with the side of the second protruding portion close to the substrate substrate; And The side of the third protruding portion away from the twelfth via hole is connected to the side of the second protruding portion away from the twelfth via hole. ​ ​ 30.The display substrate of claim 26 or 27, wherein, In at least one of the buffer portion and the passivation portion connected with the buffer portion, the buffer portion has a fourth protruding portion on a side close to the substrate, the fourth protruding portion protrudes away from the twelfth via hole, and a side of the fourth protruding portion away from the substrate is connected with a side wall of the light-emitting functional portion; The passivation portion extends along the side wall of the light-emitting functional portion to a side away from the substrate and contacts the fourth protruding portion; and The side of the passivation portion away from the substrate is substantially flush with the side of the fourth protruding portion away from the substrate.

31. A method for manufacturing a display substrate, wherein The preparation method comprises: forming a driving circuit layer on the substrate, the substrate having a first surface facing the driving circuit layer; forming a plurality of light-emitting devices on a side of the driving circuit layer away from the substrate, the light-emitting devices comprising a first electrode on a side of the driving circuit layer away from the substrate and electrically connected with the driving circuit layer, a light-emitting functional portion on a side of the first electrode away from the substrate, and a second electrode on a side of the light-emitting functional portion away from the substrate; and forming a reflective layer on a side of the driving circuit layer away from the substrate, the reflective layer comprising at least one reflective portion, the reflective portion being at least partially arranged around the side wall of the light-emitting functional portion and spaced apart from the light-emitting devices, the reflective portion having a reflective surface facing the light-emitting functional portion, at least one part of the reflective surface having an inclination angle substantially equal to an inclination angle of the side wall of the light-emitting functional portion relative to the first surface.

32. The method of manufacturing according to claim 31, wherein, The forming of the plurality of light-emitting devices on a side of the driving circuit layer away from the substrate comprises: providing an epitaxial wafer, the epitaxial wafer comprising an epitaxial substrate and an epitaxial layer on the epitaxial substrate; forming a buffer film on a side of the epitaxial layer away from the epitaxial substrate; providing a carrier substrate, and forming an adhesive layer on the carrier substrate; transferring the epitaxial layer and the buffer film on the epitaxial substrate to a side of the adhesive layer away from the carrier substrate, so that the epitaxial layer is on a side of the buffer film away from the adhesive layer; performing a patterning process on the epitaxial layer to form a plurality of light-emitting functional portions arranged at intervals; performing a defect repair process on the side wall of the light-emitting functional portion; forming a plurality of first electrodes on a side of the plurality of light-emitting functional portions away from the carrier substrate; performing a dissociation process on the adhesive layer to transfer the plurality of first electrodes, the plurality of light-emitting functional portions, and the buffer film to a side of the driving circuit layer away from the substrate, the plurality of first electrodes being electrically connected with the driving circuit layer; forming a plurality of via holes in the buffer film, the via holes exposing a part of the light-emitting functional portion; and forming a plurality of second electrodes on a side of the buffer film away from the substrate, the plurality of second electrodes being connected with the plurality of light-emitting functional portions through the plurality of via holes. The display device comprises the display substrate according to any one of claims 1-30.

33. A display device comprising: ​

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