Multi-material composite component connected by high-entropy alloy dot matrix buffer layer and preparation method of multi-material composite component

Abstract

The invention belongs to the technical field of additive manufacturing, and particularly relates to a multi-material composite component connected by a high-entropy alloy dot matrix buffer layer and a preparation method. The multi-material composite component comprises at least two heterogeneous materials and a high-entropy alloy dot matrix buffer layer used for being connected with the heterogeneous materials. And the high-entropy alloy dot matrix buffer layer is formed by periodically arranging dot matrix unit cells with porous structures. The interface layer is prepared by adopting a high-entropy alloy material which is subjected to phase diagram simulation calculation and optimization design and combining with a controllable heat distribution process in additive manufacturing, and the generation of brittle intermetallic compounds is effectively avoided by regulating and controlling thermodynamic conditions in the solidification process while the high strength of the material is ensured through the synergistic strategy. The high-entropy alloy dot matrix transition layer is prepared from a high-entropy alloy material with excellent comprehensive performance, the porous structure of the high-entropy alloy dot matrix transition layer can effectively buffer deformation and release interface stress, and initiation of interface microcracks is fundamentally inhibited.

Description

Technical Field

[0001] This invention belongs to the field of additive manufacturing technology, specifically relating to a multi-material composite component with a high-entropy alloy lattice buffer layer and its preparation method. Background Technology

[0002] In modern high-end equipment manufacturing fields, such as aerospace, energy and power, precision instruments, and biomedicine, single materials often cannot meet the extreme requirements of structural components for comprehensive performance. Therefore, multi-material composite structures have emerged, combining two or more materials with vastly different properties (such as lightweight, high-strength titanium alloys, high-temperature resistant ceramics, high-thermal-conductivity metals, and corrosion-resistant polymers) at the microscopic or macroscopic scale to achieve design goals such as "lightweighting," "high-temperature resistance," "high strength," and "multifunctionality." For example, aero-engine blades combine ceramic matrix composites with high-temperature alloys to achieve a balance between heat resistance and toughness; electronic packaging requires connecting high-thermal-conductivity metals with low-thermal-expansion ceramics or substrates to manage thermal stress.

[0003] However, the successful application of multi-material structures faces the fundamental challenge of interfacial cracking. Heterogeneous materials differ inherently in their physical and chemical properties, primarily in two aspects: First, their coefficients of thermal expansion are mismatched. During temperature changes (such as high-temperature bonding in manufacturing or thermal cycling in service), the materials on either side of the interface contract or expand differently, generating significant residual thermal stress in the interfacial region. Second, their mechanical properties are mismatched, such as differences in elastic modulus, yield strength, and fracture toughness. This causes the interface to become a bottleneck for stress transmission and a discontinuous area of ​​deformation under external loads, easily leading to stress concentration. If these accumulated stresses cannot be effectively released or alleviated, microcracks will first form at interfacial defects (such as micropores and impurities). These cracks then propagate along the fragile interface, ultimately leading to component delamination, peeling, or even overall failure. Traditional solutions, such as adding a single-component intermediate layer or gradient layer, can partially alleviate the problem, but often due to their own performance limitations (such as brittleness and poor thermal stability) or insufficient compatibility with the materials on either side, they cannot completely solve the interfacial instability problem under complex and extreme conditions.

[0004] Therefore, developing a novel interface structure that can actively adapt, efficiently buffer and dissipate interface stress has become the key to breaking through the reliability bottleneck of multi-material structures. Summary of the Invention

[0005] The purpose of this invention is to provide a multi-material composite component formed by laser selective melting and integral forming of a high-entropy alloy lattice buffer layer and its preparation method. The high-entropy alloy porous structure effectively buffers deformation and releases interfacial stress, thereby suppressing the initiation of interfacial microcracks.

[0006] To achieve the above objectives, the present invention provides a multi-material composite component with a high-entropy alloy lattice buffer layer, comprising: at least two heterogeneous materials and a high-entropy alloy lattice buffer layer for connecting the heterogeneous materials; the high-entropy alloy lattice buffer layer is composed of periodically arranged lattice unit cells with a porous structure.

[0007] Furthermore, the lattice unit cell is a three-dimensional truss or octagonal lattice structure, including: a plate-like porous structure, a diamond-like lattice structure, a Primitive lattice structure, an i-wp lattice structure, a Gyroid lattice structure, and a Diamond lattice structure. The plate-like porous structure is a polyhedron composed of several porous plates arranged periodically. The type of the lattice unit cell is determined according to the load type of the multi-material composite component.

[0008] Furthermore, the side length of the lattice unit cell is 20-80 μm, and the volume fraction is 30%-60%.

[0009] Furthermore, the pore size of the lattice unit cell is 2-5 μm, and the thickness of the high-entropy alloy lattice buffer layer is 0.1-1 mm.

[0010] Furthermore, the heterogeneous material is selected from metals, ceramics, intermetallic compounds, or composite materials consisting of at least two of these; the metals include steel, copper, aluminum, titanium, nickel, tungsten, and their alloys.

[0011] A method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection includes the following steps: S1. Based on the load type of the multi-material composite component, the structure of the lattice unit cell of the high-entropy alloy lattice buffer layer is determined through finite element simulation. S2. Based on the composition of the heterogeneous materials in the multi-material composite component, the composition of the high-entropy alloy is determined by phase diagram calculation; S3. The first heterogeneous material is shaped according to the preset structure, and then high-entropy alloy pre-alloy powder is prepared according to the composition of the high-entropy alloy. Laser selective melting or electron beam melting technology is used to print the high-entropy alloy lattice buffer layer lattice unit cell structure on the surface of the shaped first heterogeneous material. S4. Next, the second heterogeneous material is formed on the surface of the printed high-entropy alloy lattice buffer layer according to the preset structure to obtain a multi-material composite component.

[0012] Furthermore, the laser power for printing is 200 W-400 W, the laser scanning speed is 500 mm / s-1100 mm / s, the powder layer thickness of the high-entropy alloy pre-alloyed powder is 0.03 mm-0.05 mm, and the scanning spacing is 0.09 mm-0.14 mm.

[0013] Furthermore, the structure of the unit cell of the high-entropy alloy lattice buffer layer is determined by the following method: Based on the load type and lightweight requirements of multi-material composite components, a three-dimensional lattice topology structure was initially selected as a candidate basic configuration. Through finite element simulation, the stress distribution characteristics of the selected three-dimensional lattice topology under interface load are analyzed, and its ability to absorb energy through cell buckling deformation and passivate stress concentration through pore structure to promote crack deflection is verified. By combining simulation results with specific interface geometry, the structural parameters of the lattice unit cell are optimized to maximize its stress buffering and crack suppression effects while meeting the requirements of load-bearing capacity and lightweight design.

[0014] Furthermore, the composition of the high-entropy alloy is determined by the following method: Based on the composition and physical property parameters of the heteromaterials on both sides of the interface, the phase diagram calculation method is used to perform thermodynamic simulation calculations on the selected multi-principal high-entropy alloy system. By systematically adjusting the atomic percentages of various main elements in high-entropy alloys, a stable composition window that can completely avoid the formation of brittle intermetallic compounds is calculated and precisely screened. Further gradient transition design calculations are performed on the high-entropy alloy composition to ensure that its thermal expansion coefficient and elastic modulus form a continuous or stepwise change with the heterogeneous materials on both sides, thereby reducing the residual stress at the interface at the composition level in advance and suppressing the tendency to crack.

[0015] Furthermore, the high-entropy alloy comprises at least four of the following: Al, Cu, Ti, Co, Cr, Fe, Ni, Mn, W, Hf, Zr, V, Nb, Mo, and Ta.

[0016] In summary, compared with the prior art, the above-described technical solutions conceived by this invention mainly possess the following technical advantages: 1. The high-entropy alloy lattice transition layer used in this invention has a unique porous three-dimensional structure. When its micro-cells are subjected to interfacial stress, they can undergo large-scale controllable deformation through mechanisms such as bending and buckling of rods. This efficiently absorbs and dissipates the deformation energy caused by the mismatch of thermal expansion coefficients or external loads, significantly buffers the concentration of interfacial stress, and fundamentally inhibits the initiation of interfacial microcracks.

[0017] 2. Numerous micropores in the structure can serve as natural stress relief zones and crack deflectors. When stress propagates to the pores, its tip effect is blunted, and the stress is redistributed and homogenized. When a propagating crack encounters a pore, it will bypass, bifurcate, or arrest, greatly extending the crack propagation path and consuming its driving energy. This effectively prevents the rapid penetration of cracks along the interface and significantly improves the fracture toughness of the interface.

[0018] 3. High-entropy alloy matrices, with their severe lattice distortion and flexible composition designability, not only possess high strength, high toughness and good thermal stability, but also can achieve continuous or gradient transitions in their physical properties between heterogeneous materials through composition design, actively reducing intrinsic stress caused by abrupt changes in physical properties, thus realizing "flexible connection" at the material level.

[0019] 4. Compared with traditional interface strengthening techniques (such as adding a brittle intermediate layer or complex surface treatment), this invention deeply integrates structural design and material design, and avoids the defects introduced by secondary connections through one-time additive manufacturing. This transition layer structure is functionally integrated, flexible in design, has high interface bonding strength, and good reliability, providing an innovative and efficient solution for the manufacturing of high-performance multi-material components in aerospace, energy equipment, and other fields. Attached Figure Description

[0020] Figure 1 This invention provides a high-entropy lattice buffer layer for suppressing multi-material interface cracking. Figure 2 This is a plate-shaped porous high-entropy transition layer along the (111) crystal plane at a steel-copper multi-material interface in an embodiment of the present invention; Figure 3 It is a high-entropy transition layer with a rod-shaped lattice and a diamond-like crystal structure in the embodiments of the present invention; Figure 4 It is the high-entropy transition layer of the Primitive lattice structure in the embodiments of the present invention; Figure 5 It is the high-entropy transition layer of the i-wp lattice structure in the embodiments of the present invention; Figure 6 It is the high-entropy transition layer of the Gyroid lattice structure in the embodiments of the present invention; Figure 7 It is the high-entropy transition layer of the Diamond lattice structure in the embodiments of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0022] Please see Figure 1The present invention provides a multi-material composite component with a high-entropy alloy lattice buffer layer, comprising: at least two heterogeneous materials and a high-entropy alloy lattice buffer layer for connecting the heterogeneous materials; the high-entropy alloy lattice buffer layer is composed of periodically arranged lattice unit cells with a porous structure.

[0023] The material of the high-entropy alloy lattice transition layer is composed of four or more main elements in near-equal atomic ratios. By adjusting the element composition, the key parameters such as thermal expansion coefficient and elastic modulus can be gradient transitioned between the two parent materials, thereby fundamentally reducing the interfacial stress.

[0024] The high-entropy alloy lattice interface layer possesses synergistic characteristics of high strength, crack suppression, energy absorption, impact resistance, and lightweight. The interface layer is made of high-entropy alloy material optimized by phase diagram simulation calculation, combined with a controllable heat distribution process in additive manufacturing. This synergistic strategy ensures high material strength while effectively avoiding the formation of brittle intermetallic compounds by controlling the thermodynamic conditions of the solidification process.

[0025] The lattice structure, with its unique porous topology, actively alters and homogenizes the stress distribution in the interface region through the controllable deformation of its micro-cells, efficiently dispersing concentrated interface stresses. Its members or cell walls can absorb and dissipate a large amount of energy under load through elastic buckling or plastic deformation, significantly buffering dynamic impacts and cyclic loads. Simultaneously, the pores within the lattice, acting as natural defects, effectively blunt crack tips, forcing crack propagation paths to deflect, bypass, or even arrest, thereby strongly inhibiting crack initiation and steady-state propagation. These synergistic mechanisms collectively endow the interface with excellent fracture toughness, fatigue resistance, and damage tolerance, fundamentally improving the connection reliability and overall service performance of multi-material structures.

[0026] This invention also provides a crack suppression method for suppressing multi-material interface cracking using the high-entropy lattice buffer layer described above. The preparation method mainly includes the following steps: Step 1: Use computer 3D modeling software to establish a 3D model of a high-entropy alloy lattice structure optimized by finite element simulation based on phase diagram calculation.

[0027] Step 2: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the three-dimensional model described in Step 1 is printed using selective laser melting. The heat distribution of the molten pool is regulated by precisely controlling the laser energy input and scanning path, thereby avoiding the formation of brittle intermetallic compounds. The printing parameters are: laser power of 250W-400W, laser scanning speed of 700mm / s-1200mm / s, powder layer thickness of 0.03mm-0.05mm, and scanning spacing of 0.09mm-0.14mm.

[0028] Step 3: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by printing and the sample composed of heterogeneous parent material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load test, thereby inhibiting the initiation and propagation of interface cracks.

[0029] The high-entropy alloy composition is obtained through the following calculation steps: Step 1: Based on the chemical composition and key physical property parameters of the metal matrix materials on both sides of the interface, thermodynamic simulation calculations are performed on the selected multi-principal high-entropy alloy system using the CALPHAD (phase diagram calculation) method.

[0030] Step 2: By calculating and precisely screening the atomic percentages of various main elements such as Al, Cu, Ti, Co, Cr, Fe, Ni, Mn, W, Hf, Zr, V, Nb, Mo, and Ta, a stable composition window that can completely avoid the formation of brittle intermetallic compounds such as σ phase and Laves phase is selected.

[0031] Step 3: Based on the optimized composition, further perform gradient transition design calculations for the interface composition to ensure that the coefficient of thermal expansion and the modulus of elasticity change continuously or stepwise between the two parent materials, thereby reducing the residual stress at the interface in advance at the composition level and suppressing the tendency to crack.

[0032] The high-entropy transition layer lattice structure is selected and designed through the following steps: Step 1: Based on the main load forms and lightweight requirements of the multi-material interface, select a three-dimensional lattice topology with high specific strength, high energy absorption efficiency and good impact resistance, such as a three-dimensional truss, octagon, or Gyroid structure, as a candidate basic configuration.

[0033] Step 2: Analyze the stress distribution characteristics of the selected lattice structure under typical interface loads such as shear and tension through finite element simulation, and verify its ability to absorb energy through cell buckling deformation, passivate stress concentration through pore structure, and promote crack deflection.

[0034] Step 3: Combining simulation results with specific interface geometry, optimize the key parameters of the lattice unit cell (such as relative density, unit cell size, and support diameter) to maximize stress buffering and crack suppression effects while meeting load-bearing capacity and lightweight requirements, thus achieving synergy between structure and function.

[0035] The lattice has microscopic characteristics, with its unit cell size at the micrometer level, and has a relatively small impact on the macroscopic mechanical properties of the high-entropy lattice transition layer.

[0036] The present invention will be further described in detail below through specific embodiments.

[0037] Example 1 This example describes a plate-like porous high-entropy transition layer along the (111) crystal plane at a steel-copper multi-material interface. Please refer to [link to relevant documentation]. Figure 2 The multi-material combination is a steel-copper multi-material combination, including the following steps.

[0038] Step 1: Identify the problems at the steel-copper multi-material interface: The immiscibility of steel and copper leads to liquid cracks and solidification shrinkage cracks at the grain boundaries. To address the interface problem, a high-entropy pre-alloyed powder composition of FeCoNiCrCu was designed based on thermodynamic simulation. Using computer 3D modeling software, a 3D model of the high-entropy alloy lattice structure optimized by finite element simulation was established.

[0039] Step 2: During service, the steel-copper multi-material interface experiences isotropic loads and requires a lightweight load-bearing frame. The plate-like porous structure with the (111) crystal plane has advantages in multi-directional uniform load-bearing and high specific stiffness. Therefore, a plate-like porous high-entropy transition layer along the (111) crystal plane is selected. The lattice unit cell size is 40 μm (i.e., Figure 2 The side length of the outer cube of the plate-like porous structure is 4 μm, and the pore size is 50% by volume.

[0040] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the three-dimensional model described in Step 1 is printed using selective laser melting. By precisely controlling the laser energy input and scanning path to regulate the heat distribution of the molten pool, the generation of interface liquefaction cracks and solidification shrinkage cracks is avoided. The printing parameters are: laser power of 350 W-400 W, laser scanning speed of 500 mm / s-1100 mm / s, powder layer thickness of 0.03 mm-0.05 mm, and scanning spacing of 0.09 mm-0.14 mm.

[0041] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0042] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0043] Example 2 This example illustrates a high-entropy transition layer with a rod-shaped lattice structure mimicking a diamond crystal. Please refer to [link to relevant documentation]. Figure 3 The multi-material is a combination of titanium and aluminum materials, including the following steps.

[0044] Step 1: Identify the problems at the titanium-aluminum multi-material interface: The physical properties of titanium and aluminum differ too much, and the interface produces a continuous brittle phase, making the interface extremely prone to cracking. To address the interface problem, a high-entropy pre-alloyed powder composition design based on thermodynamic simulation was carried out as CoCrCuV. Using computer 3D modeling software, a 3D model of the high-entropy alloy lattice structure optimized by finite element simulation was established.

[0045] Step 2: The titanium-aluminum multimaterial interface exhibits significant differences in physical properties, making it prone to interfacial cracking. Furthermore, titanium-aluminum multimaterials are widely used in the aerospace field, operating in harsh environments, requiring a high-entropy lattice interface with multidirectional uniform load-bearing capacity and high specific stiffness. Therefore, a diamond-like lattice structure with a high-entropy interface is selected, featuring a lattice unit cell size of 40 μm and a volume fraction of 60%.

[0046] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the 3D model described in Step 1 is printed using selective laser melting. By precisely controlling the laser energy input and scanning path to regulate the heat distribution of the molten pool, the formation of brittle intermetallic compounds and interface stress concentration due to the difference in physical properties between titanium and aluminum are avoided. The printing parameters are: laser power of 320 W-375 W, laser scanning speed of 620 mm / s-920 mm / s, powder layer thickness of 0.03 mm-0.05 mm, and scanning spacing of 0.09 mm-0.14 mm.

[0047] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0048] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0049] Example 3 This example illustrates a high-entropy transition layer with a Primitive lattice structure. (See also: [link to example]) Figure 4 The multi-material is a combination of nickel-titanium and titanium multi-materials, including the following steps.

[0050] Step 1: Identify the problems at the interface between nickel-titanium and titanium: The physical properties of nickel-titanium and titanium are too different, and the interface produces a continuous brittle phase, which makes the interface very prone to cracking. To address the interface problem, a high-entropy pre-alloyed powder composition design based on thermodynamic simulation is carried out. The composition is designed as FeCoNiCrCu1.5. Using computer 3D modeling software, a 3D model of the high-entropy alloy lattice structure optimized by finite element simulation is established.

[0051] Step 2: The titanium and nickel-titanium multimaterials are mainly used for directional loads, and the load direction is consistent with the direction of the rod. Therefore, Primitive lattice is selected. The lattice unit cell size is 40 μm and the volume fraction is 60%.

[0052] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the three-dimensional model described in Step 1 is printed using selective laser melting. By precisely controlling the laser energy input and scanning path to regulate the heat distribution of the molten pool, the formation of brittle intermetallic compounds and interface stress concentration due to the difference in physical properties between titanium and aluminum are avoided. The printing parameters are: laser power of 275 W-355 W, laser scanning speed of 800 mm / s-1100 mm / s, powder layer thickness of 0.03 mm-0.05 mm, and scanning spacing of 0.09 mm-0.14 mm.

[0053] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0054] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0055] Example 4 This example illustrates a high-entropy transition layer with an i-wp lattice structure. Please refer to [link / reference]. Figure 5 The multi-material is a combination of titanium and tungsten materials, and includes the following steps.

[0056] Step 1: Identify the problems at the titanium and tungsten multi-material interface: The large difference in physical properties between titanium and tungsten makes the interface prone to cracking. To address the interface problem, a high-entropy pre-alloyed powder composition of TiNbZrV was designed based on thermodynamic simulation. Using computer 3D modeling software, a 3D model of the high-entropy alloy lattice structure optimized by phase diagram calculation and finite element simulation was established.

[0057] Step 2: The titanium-tungsten multi-material interface mainly bears shear and complex combined loads, requiring a balance between high stiffness and good energy absorption, excellent stiffness-to-weight ratio and shear and buckling resistance. Therefore, a high-entropy transition layer with a -wp lattice structure is selected, with a lattice unit cell size of 40 μm and a volume fraction of 50%.

[0058] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the 3D model described in Step 1 is printed using selective laser melting. The heat distribution of the molten pool is controlled by precisely regulating the laser energy input and scanning path, thereby avoiding interface stress concentration caused by the difference in physical properties between titanium and aluminum. The printing parameters are: laser power 400 W-475 W, laser scanning speed 600 mm / s-800 mm / s, powder layer thickness 0.03 mm-0.05 mm, and scanning spacing 0.09 mm-0.14 mm.

[0059] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0060] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0061] Example 5 This example demonstrates a high-entropy transition layer with a Gyroid lattice structure. Please refer to [link / reference]. Figure 6 The multi-material is a combination of titanium and nickel, and includes the following steps.

[0062] Step 1: Identify the problems at the titanium-nickel multi-material interface: The physical properties of titanium and nickel differ too much, and the interface produces a continuous brittle phase, making the interface extremely prone to cracking. To address the interface problem, a high-entropy pre-alloyed powder composition design based on thermodynamic simulation was carried out as CoCrNiCuV0.2. Using computer 3D modeling software, a 3D model of the high-entropy alloy lattice structure optimized by finite element simulation was established.

[0063] Step 2: The titanium and nickel multi-material interface faces highly complex multiaxial random loads and has high requirements for fatigue life, requiring excellent isotropy, high specific strength / specific stiffness and fatigue performance. Therefore, a high-entropy transition layer with a Gyroid lattice structure is selected, with a lattice unit cell size of 40 μm and a volume fraction of 50%.

[0064] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the three-dimensional model described in Step 1 is printed using selective laser melting. By precisely controlling the laser energy input and scanning path to regulate the heat distribution of the molten pool, the formation of brittle intermetallic compounds and interface stress concentration due to the difference in physical properties between titanium and nickel are avoided. The printing parameters are: laser power of 300 W-350 W, laser scanning speed of 800 mm / s-1100 mm / s, powder layer thickness of 0.03 mm-0.05 mm, and scanning spacing of 0.09 mm-0.14 mm.

[0065] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0066] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0067] Example 6 This example illustrates a high-entropy transition layer with a Diamond lattice structure. Please refer to [link / reference]. Figure 7 The multi-material is a combination of titanium and tungsten materials, and includes the following steps.

[0068] Step 1: Identify the problems at the interface between steel and tungsten materials: The physical properties of steel and tungsten are too different, and a continuous brittle phase is generated at the interface, which makes the interface very prone to cracking. To address the interface problem, a high-entropy pre-alloyed powder composition design based on thermodynamic simulation was carried out as NbMoTaWV. A three-dimensional model of the high-entropy alloy lattice structure optimized by finite element simulation was established using computer three-dimensional modeling software.

[0069] Step 2: The titanium-tungsten multi-material interface requires efficient impact energy absorption and an extremely high stiffness-to-weight ratio. Therefore, a high-entropy transition layer with a Diamond lattice structure is selected, with a lattice unit cell size of 40 μm and a volume fraction of 50%.

[0070] Step 3: Using high-entropy alloy pre-alloyed powder designed based on phase diagram calculations, the three-dimensional model described in Step 1 is printed using selective laser melting. By precisely controlling the laser energy input and scanning path to regulate the heat distribution of the molten pool, the formation of brittle intermetallic compounds and interface stress concentration due to differences in the physical properties of steel and tungsten are avoided. The printing parameters are: laser power of 375 W-425 W, laser scanning speed of 650 mm / s-850 mm / s, powder layer thickness of 0.03 mm-0.05 mm, and scanning spacing of 0.09 mm-0.14 mm.

[0071] Step 4: Conduct an interface performance verification experiment on the high-entropy alloy lattice interface layer obtained by laser selective melting printing and the sample composed of a heterogeneous base material; the experiment verifies the ability of the lattice structure to absorb energy, release and homogenize interface stress through porous deformation by shear or tensile load testing, thereby inhibiting the initiation and propagation of interface cracks.

[0072] This high-entropy alloy lattice structure is not only used for crack suppression at the interface of dissimilar materials in the embodiments.

[0073] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A multi-material composite component with a high-entropy alloy lattice buffer layer connection, characterized in that, include: At least two heterogeneous materials and a high-entropy alloy lattice buffer layer for connecting the heterogeneous materials; the high-entropy alloy lattice buffer layer is composed of periodically arranged lattice unit cells with a porous structure.

2. The multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 1, characterized in that, The lattice unit cell includes one of the following: plate-like porous structure, diamond-like lattice structure, Primitive lattice structure, i-wp lattice structure, Gyroid lattice structure, and Diamond lattice structure. The plate-like porous structure is a polyhedron composed of several porous plates arranged periodically. The type of lattice unit cell is determined according to the load type of the multi-material composite component.

3. The multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 2, characterized in that, The lattice unit cell has a side length of 20-80 μm and a volume fraction of 30%-60%.

4. The multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 2, characterized in that, The pore size of the lattice unit cell is 2-5 μm, and the thickness of the high-entropy alloy lattice buffer layer is 0.1-1 mm.

5. The multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 1, characterized in that, The heterogeneous material is selected from metals, ceramics, intermetallic compounds, or composite materials consisting of at least two of these; the metals include steel, copper, aluminum, titanium, nickel, tungsten, and their alloys.

6. A method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection as described in any one of claims 1-5, characterized in that, Includes the following steps: S1. Based on the load type of the multi-material composite component, the structure of the lattice unit cell of the high-entropy alloy lattice buffer layer is determined through finite element simulation. S2. Based on the composition of the heterogeneous materials in the multi-material composite component, the composition of the high-entropy alloy is determined by phase diagram calculation; S3. The first heterogeneous material is shaped according to the preset structure, and then high-entropy alloy pre-alloy powder is prepared according to the composition of the high-entropy alloy. Laser selective melting is used to print the high-entropy alloy lattice buffer layer lattice unit cell structure on the surface of the shaped first heterogeneous material. S4. Next, the second heterogeneous material is formed on the surface of the printed high-entropy alloy lattice buffer layer according to the preset structure to obtain a multi-material composite component.

7. The method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 6, characterized in that, The laser power for printing is 200 W-400 W, the laser scanning speed is 500 mm / s-1100 mm / s, the powder layer thickness of the high-entropy alloy pre-alloyed powder is 0.03 mm-0.05 mm, and the scanning spacing is 0.09 mm-0.14 mm.

8. The method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 6, characterized in that, The structure of the unit cell of the high-entropy alloy lattice buffer layer was determined by the following method: Based on the load type and lightweight requirements of multi-material composite components, a three-dimensional lattice topology structure was initially selected as a candidate basic configuration. Through finite element simulation, the stress distribution characteristics of the selected three-dimensional lattice topology under interface load are analyzed, and its ability to absorb energy through cell buckling deformation and passivate stress concentration through pore structure to promote crack deflection is verified. By combining simulation results with specific interface geometry, the structural parameters of the lattice unit cell are optimized to maximize its stress buffering and crack suppression effects while meeting the requirements of load-bearing capacity and lightweight design.

9. The method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 6, characterized in that, The composition of the high-entropy alloy was determined by the following method: Based on the composition and physical properties of the heteromaterials on both sides of the interface, the phase diagram calculation method is used to perform thermodynamic simulation calculations on the selected multi-principal high-entropy alloy system to suppress or disperse the precipitation of brittle phases at the multi-material interface and adjust the stress distribution at the multi-material interface. By systematically adjusting the atomic percentages of various main elements in high-entropy alloys, a stable composition window that can completely avoid the formation of brittle intermetallic compounds is calculated and precisely screened. Further gradient transition design calculations are performed on the high-entropy alloy composition to ensure that its thermal expansion coefficient and elastic modulus form a continuous or stepwise change with the heterogeneous materials on both sides, thereby reducing the residual stress at the interface at the composition level in advance and suppressing the tendency to crack.

10. The method for preparing a multi-material composite component with a high-entropy alloy lattice buffer layer connection according to claim 6, characterized in that, The high-entropy alloy comprises at least four of the following: Al, Cu, Ti, Co, Cr, Fe, Ni, Mn, W, Hf, Zr, V, Nb, Mo, and Ta.

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