Die cutting waste discharge device and die cutting waste discharge method
By using the ejector pin and specific blade design of the die-cutting waste removal device, the waste material after die-cutting is directly ejected, solving the problem of difficult waste removal in the existing technology and achieving the effect of saving materials and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 上海昊佰智造精密电子股份有限公司
- Filing Date
- 2024-10-25
- Publication Date
- 2026-04-28
AI Technical Summary
In existing die-cutting technologies, waste removal is difficult, especially for thick materials and double-sided adhesive products, leading to material waste and increased labor costs. Furthermore, conventional waste removal methods are complex and have high equipment costs.
The die-cutting waste removal device includes a first feeding mechanism, a die-cutting mechanism, an upward waste removal mechanism, and a winding mechanism. It uses ejector pins to directly remove waste material after die-cutting, and the waste material falls into the trash can. Combined with specific blade edge die-cutting of the outer and inner frames, it saves auxiliary materials and improves waste removal efficiency.
It enables direct waste removal, saves auxiliary materials, reduces waste removal costs, improves waste removal efficiency, and solves the problem of difficult waste removal for thick materials and double-sided adhesive products.
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Figure CN121928634A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of die-cutting technology, and in particular to a die-cutting waste removal device and a die-cutting waste removal method. Background Technology
[0002] Waste removal from die-cutting machines refers to the process of separating excess material or waste from the product during die-cutting. Waste removal not only increases material costs but also labor and equipment costs. For example... Figures 1-2 As shown, the conventional waste removal method used in the die-cutting industry is to add a protective film to the bottom layer to remove the waste. The defects of this processing method include: (1) some thicker materials are not easy to remove and the waste will get stuck; (2) some double-sided adhesive products will stick back after passing through the machine rollers, making waste removal difficult; (3) it requires the addition of waste removal protective film and machine, which wastes materials and labor.
[0003] Patent publication number CN114571533A discloses a die for removing waste material from small circular holes. The die includes a matching upper die plate and a lower die plate. The upper die plate has at least one row of circular hole cutting edges and at least one row of circular hole ejector pins parallel to the cutting edges. The lower die plate has at least one row of discharge holes corresponding to the positions of the circular hole ejector pins. However, the circular hole ejector pins are located on the upper die plate, parallel to the cutting edges, and require a corresponding lower die plate, necessitating special customization. Furthermore, this design is unsuitable for complex die-cutting processes with multiple layers of cutting lines. Summary of the Invention
[0004] The purpose of this invention is to overcome the defects of the prior art by providing a die-cutting waste removal device and a die-cutting waste removal method, which removes waste immediately after die-cutting, saving auxiliary materials, improving waste removal efficiency, and reducing waste removal costs.
[0005] The objective of this invention can be achieved through the following technical solutions:
[0006] A die-cutting waste removal device includes a first feeding mechanism, a die-cutting mechanism, an upward waste removal mechanism, and a winding mechanism arranged sequentially along the material strip's travel direction.
[0007] The first feeding mechanism is used to input the material belt;
[0008] The die-cutting mechanism includes an ejector pin, a waste bin, a lower die base, an upper die base, and a cutting edge. Several cutting edges with different cutting depths are provided below the upper die base. The ejector pin is located on the side of the upper die base away from the first feeding mechanism. The waste bin is located below the lower die base. The cutting edge is used to die-cut the strip. After die-cutting, the strip is sent to the ejector pin to remove the waste material, which falls into the waste bin.
[0009] The upward lifting and waste discharge mechanism is used to collect and discharge the outer frame waste material after the material strip is die-cut;
[0010] The winding mechanism is used to wind up the processed material strip to obtain the product.
[0011] In one embodiment of the present invention, the material strip includes double-sided adhesive and release film bonded together from top to bottom, and the first feeding mechanism is used to input the double-sided adhesive and release film.
[0012] As a preferred technical solution, the release film is a PET release film.
[0013] In one embodiment of the present invention, the product includes an outer frame and an inner frame, and the waste material of the outer frame includes double-sided adhesive.
[0014] The ejector pin removes the inner frame waste, which includes double-sided adhesive and release film.
[0015] In one embodiment of the present invention, the position, shape, and number of the ejector pins correspond to the position, shape, and number of the inner frame.
[0016] In one embodiment of the present invention, the cutting edge includes a first cutting edge and a second cutting edge. The first cutting edge is used to die-cut double-sided adhesive to obtain an outer frame, and the second cutting edge is used to die-cut double-sided adhesive and release film to obtain an inner frame.
[0017] In one embodiment of the present invention, the ejector pin and the blade are separated by a distance equal to that of one product.
[0018] In one embodiment of the present invention, a support is provided below the lower mold base, and a gap is provided between the support and the lower mold base, with the trash can located below the gap.
[0019] In one embodiment of the present invention, the first feeding mechanism includes a feeding roller and a feeding motor that is driven to it.
[0020] The lifting and waste discharge mechanism includes a first receiving roller and a first receiving motor that is connected to it in a transmission.
[0021] The winding mechanism includes a second take-up roller and a second take-up motor that is driven to drive it.
[0022] Furthermore, the present invention also provides a die-cutting waste removal method, wherein the die-cutting waste removal method is performed using the above-mentioned die-cutting waste removal device, and the specific steps are as follows:
[0023] S1. The first feeding mechanism feeds out double-sided tape and release film to obtain a strip of "double-sided tape and release film" that is bonded together from top to bottom;
[0024] S2. The strip is conveyed to the die-cutting mechanism station, and the strip is placed below the blade and above the lower die holder.
[0025] S3. The die-cutting mechanism operates, and the blades die-cut the strip to form the outer frame and inner frame.
[0026] S4. The die-cut strip is fed to the bottom of the ejector pin so that the position, shape and quantity of the ejector pin correspond to the inner frame. The ejector pin passes down through the inner frame and discharges the waste material of the inner frame into the trash can.
[0027] S5. The conveyor belt that removes the inner frame waste is conveyed to the lifting waste removal mechanism, which collects and discharges the outer frame waste.
[0028] S6. The winding mechanism winds up the processed material strip to obtain the product.
[0029] In one embodiment of the present invention, in step S3, the first blade die-cuts the double-sided adhesive to obtain an outer frame, and the second blade die-cuts the double-sided adhesive and release film to obtain an inner frame.
[0030] As a preferred technical solution, since the distance between the ejector pin and the cutting edge is equal to the distance of one product, the previous product discharges inner frame waste while the next product is being die-cut.
[0031] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0032] 1. This invention adds an ejector pin to the die-cutting mechanism, which pushes the waste material off from top to bottom when the machine moves up and down; the lower plate of the lower die base has a material leakage area, and the waste material falls directly into the trash can. This process can directly discharge the waste material, prevent the glue from sticking back, and save auxiliary materials.
[0033] 2. Using the die-cutting waste removal device provided by this invention helps to save waste removal auxiliary materials and reduce costs; at the same time, it effectively solves the problem of difficult waste removal for products such as foam and VHB glue. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the structure of a die-cutting waste removal device in the prior art;
[0035] Figure 2 This is a schematic diagram of the cutting depth of a die in the prior art.
[0036] Figure 3 This is a structural diagram of the product;
[0037] Figure 4 This is a schematic diagram of the structure of the die-cutting waste removal device provided by the present invention;
[0038] Figure 5 This is a schematic diagram of the die-cutting mechanism provided by the present invention;
[0039] Figure 6 A schematic diagram of the cutting depth of the die for the product provided by this invention.
[0040] Explanation of the attached drawing numbers: 1. Double-sided tape, 2. Release film, 3. Protective film, 4. First feeding mechanism, 5. Second feeding mechanism, 6. Die-cutting mechanism, 7. Outer frame waste, 8. Inner frame waste, 9. Protective film waste, 10. Upward waste removal mechanism, 11. Downward waste removal mechanism, 12. Rewinding mechanism, 13. Outer frame, 14. Inner frame, 15. Ejector pin, 16. Trash can, 17. Lower mold base, 18. Upper mold base, 19. Blade, 20. Product. Detailed Implementation
[0041] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.
[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0043] In the description of this invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0045] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features described herein can be combined with each other.
[0046] Example 1
[0047] See Figures 4 to 6This embodiment provides a die-cutting waste removal device, including a first feeding mechanism 4, a die-cutting mechanism 6, an upward waste removal mechanism 10, and a winding mechanism 12 arranged sequentially along the material strip's travel direction.
[0048] The first feeding mechanism 4 is used to input the material belt;
[0049] The die-cutting mechanism 6 includes an ejector pin 15, a waste bin 16, a lower die base 17, an upper die base 18, and a blade 19. Several blades 19 with different die-cutting depths are provided below the upper die base 18. The ejector pin 15 is located on the side of the upper die base 18 away from the first feeding mechanism 4. The waste bin 16 is located below the lower die base 17. The blades 19 are used to die-cut the strip. After die-cutting, the strip is sent to the ejector pin 15 to remove the waste material, and the waste material falls into the waste bin 16.
[0050] The upward waste discharge mechanism 10 is used to collect and discharge the outer frame waste 7 after the material strip is die-cut;
[0051] The winding mechanism 7 is used to wind up the processed material strip to obtain product 20.
[0052] In this embodiment, the material strip includes double-sided adhesive 1 and release film 2 bonded together from top to bottom, and the first feeding mechanism 4 is used to input the double-sided adhesive 1 and release film 2.
[0053] In this embodiment, the release film 2 is a PET release film.
[0054] In this embodiment, the product 20 includes an outer frame 13 and an inner frame 14, and the outer frame waste 7 includes double-sided adhesive 1.
[0055] The ejector pin 15 removes the waste material from the inner frame 14, which includes double-sided adhesive 1 and release film 2.
[0056] In this embodiment, the position, shape, and number of the ejector pins 15 correspond to the position, shape, and number of the inner frame 14.
[0057] In this embodiment, the blade 19 includes a first blade and a second blade. The first blade is used to die-cut the double-sided adhesive 1 to obtain the outer frame 13, and the second blade is used to die-cut the double-sided adhesive 1 and the release film 2 to obtain the inner frame 14.
[0058] In this embodiment, the distance between the ejector pin 15 and the blade 19 is equal to the distance of one product 20.
[0059] In this embodiment, a support is provided below the lower mold base 17, and a gap is provided between the support and the lower mold base 17, with the trash can 16 located below the gap.
[0060] In this embodiment, the first feeding mechanism 4 includes a feeding roller and a feeding motor that is connected to it in a driving manner;
[0061] The upward waste discharge mechanism 10 includes a first receiving roller and a first receiving motor that is connected to it in a transmission.
[0062] The winding mechanism 7 includes a second take-up roller and a second take-up motor that is connected to it for transmission.
[0063] Furthermore, the present invention also provides a die-cutting waste removal method, wherein the die-cutting waste removal method is performed using the above-mentioned die-cutting waste removal device, and the specific steps are as follows:
[0064] S1. The first feeding mechanism 4 feeds out double-sided tape 1 and release film 2 to obtain a material strip of "double-sided tape 1 and release film 2" bonded together from top to bottom;
[0065] S2. The strip is conveyed to the die-cutting mechanism 6 station, and the strip is placed below the blade 19 and above the lower die holder 17.
[0066] S3, the die-cutting mechanism 6 works, and the blade 19 performs die-cutting on the strip to form the outer frame 13 and the inner frame 14;
[0067] S4. The die-cut strip is fed to the bottom of the ejector pin 15 so that the position, shape and number of the ejector pin 15 correspond to the inner frame 14. The ejector pin 15 passes down through the inner frame 14 and discharges the waste material of the inner frame 14 into the trash can 16.
[0068] S5. The conveyor belt that discharges the waste material of the inner frame 14 is conveyed to the lifting waste discharge mechanism 10, and the waste material of the outer frame 7 is collected and discharged.
[0069] S6, the winding mechanism 7 winds up the processed material strip to obtain product 20.
[0070] In this embodiment, in step S3, the first blade die-cuts the double-sided adhesive 1 to obtain the outer frame 13, and the second blade die-cuts the double-sided adhesive 1 and the release film 2 to obtain the inner frame 14.
[0071] In this embodiment, since the ejector pin 15 and the blade 19 are separated by a distance equal to that of one product 20, the previous product 20 discharges waste material from the inner frame 14 while the next product 20 is being die-cut.
[0072] Comparative Example 1
[0073] See Figures 1 to 2 This comparative example provides a die-cutting waste removal device, including a first feeding mechanism 4, a second feeding mechanism 5, a die-cutting mechanism 6, an upward waste removal mechanism 10, a downward waste removal mechanism 11, and a winding mechanism 12 arranged sequentially along the material strip's travel direction.
[0074] The first feeding mechanism 4 and the second feeding mechanism 5 are used to input the material belt;
[0075] The die-cutting mechanism 6 includes a lower die base 17, an upper die base 18, and a blade 19. Several blades 19 with different die-cutting depths are provided below the upper die base 18. The blades 19 are used for die-cutting material strips.
[0076] The upward waste discharge mechanism 10 is used to collect and discharge the outer frame waste 7 after the material strip is die-cut;
[0077] The pull-down waste discharge mechanism 11 is used to collect and discharge the inner frame waste 8 and protective film waste 9 after the material strip is die-cut;
[0078] The winding mechanism 7 is used to wind up the processed material strip to obtain product 20.
[0079] In this comparative example, the material tape includes double-sided adhesive 1, release film 2, and protective film 3, which are bonded together from top to bottom.
[0080] The first feeding mechanism 4 is used to input double-sided adhesive 1 and release film 2.
[0081] The second feeding mechanism 5 is used to feed the protective film 3.
[0082] In this comparative example, the release film 2 is a PET release film.
[0083] In this comparative example, the product 20 includes an outer frame 13 and an inner frame 14. The outer frame waste 7 includes double-sided adhesive 1, and the inner frame waste 14 includes double-sided adhesive 1 and release film 2.
[0084] In this comparative example, the blade 19 includes a first blade and a second blade. The first blade is used to die-cut the double-sided adhesive 1 to obtain the outer frame 13, and the second blade is used to die-cut the double-sided adhesive 1 and the release film 2 to obtain the inner frame 14.
[0085] In this comparative example, a support is provided below the lower mold base 17.
[0086] In this comparative example, the first feeding mechanism 4 includes a first feeding roller and a first feeding motor that is driven to it.
[0087] The second feeding mechanism 5 includes a second feeding roller and a second feeding motor that is driven to it;
[0088] The upward waste discharge mechanism 10 includes a first receiving roller and a first receiving motor that is connected to it in a transmission.
[0089] The pull-down waste discharge mechanism 11 includes a third receiving roller and a third receiving motor that is connected to it for transmission.
[0090] The winding mechanism 7 includes a second take-up roller and a second take-up motor that is connected to it for transmission.
[0091] Furthermore, this comparative example also provides a die-cutting waste removal method, which employs the aforementioned die-cutting waste removal device, and the specific steps are as follows:
[0092] S1. The first feeding mechanism 4 feeds out double-sided tape 1 and release film 2, and the second feeding mechanism 5 feeds out protective film 3, resulting in a material strip of "double-sided tape 1, release film 2 and protective film 3" bonded together from top to bottom;
[0093] S2. The strip is conveyed to the die-cutting mechanism 6 station, and the strip is placed below the blade 19 and above the lower die holder 17.
[0094] S3, the die-cutting mechanism 6 works, and the blade 19 performs die-cutting on the strip to form the outer frame 13 and the inner frame 14;
[0095] S4. The material belt is conveyed to the upper lifting and waste discharge mechanism 10, which collects and discharges the outer frame waste material 7.
[0096] S5. The material belt is conveyed to the pull-down waste discharge mechanism 11, which collects and discharges the inner frame waste 8 and the protective film waste 9.
[0097] S6, the winding mechanism 7 winds up the processed material strip to obtain product 20.
[0098] In this comparative example, in step S3, the first blade die-cuts the double-sided adhesive 1 to obtain the outer frame 13, and the second blade die-cuts the double-sided adhesive 1 and the release film 2 to obtain the inner frame 14.
[0099] The waste discharge device has a complex structure, requiring a pull-down waste discharge mechanism 11 and a second feeding mechanism 5, which increases equipment and time costs. It also requires the addition of a protective film 3, increasing the cost of auxiliary materials. Furthermore, it increases the probability of adhesive products experiencing back-sticking, overflowing, and pulling defects, resulting in a relatively low product qualification rate.
[0100] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.
Claims
1. A die-cutting waste discharge device, characterized in that, It includes a first feeding mechanism (4), a die-cutting mechanism (6), an upward waste discharge mechanism (10), and a winding mechanism (12) arranged sequentially along the material belt travel direction. The first feeding mechanism (4) is used to input the material belt; The die-cutting mechanism (6) includes an ejector pin (15), a waste bin (16), a lower die base (17), an upper die base (18), and a blade (19). The upper die base (18) is provided with several blades (19) with different die-cutting depths. The ejector pin (15) is located on the side of the upper die base (18) away from the first feeding mechanism (4). The waste bin (16) is located below the lower die base (17). The blade (19) is used to die-cut the strip. After die-cutting, the strip is sent to the ejector pin (15) to remove the waste material, and the waste material falls into the waste bin (16). The upward waste discharge mechanism (10) is used to collect and discharge the outer frame waste (7) after the material strip is die-cut; The winding mechanism (7) is used to wind up the processed material strip to obtain the product (20).
2. The die-cutting waste removal device according to claim 1, characterized in that, The material strip includes double-sided adhesive (1) and release film (2) bonded together from top to bottom, and the first feeding mechanism (4) is used to input the double-sided adhesive (1) and release film (2).
3. The die-cutting waste removal device according to claim 2, characterized in that, The product (20) includes an outer frame (13) and an inner frame (14), and the outer frame waste (7) includes double-sided adhesive (1). The ejector pin (15) removes the waste material of the inner frame (14), which includes double-sided tape (1) and release film (2).
4. The die-cutting waste removal device according to claim 3, characterized in that, The position, shape, and number of the ejector pins (15) correspond to the position, shape, and number of the inner frame (14).
5. A die-cutting waste removal device according to claim 3, characterized in that, The blade (19) includes a first blade and a second blade. The first blade is used to die-cut the double-sided adhesive (1) to obtain an outer frame (13), and the second blade is used to die-cut the double-sided adhesive (1) and the release film (2) to obtain an inner frame (14).
6. The die-cutting waste removal device according to claim 1, characterized in that, The distance between the ejector pin (15) and the blade (19) is equal to the distance of one product (20) in the material belt.
7. The die-cutting waste removal device according to claim 1, characterized in that, A support is provided below the lower mold base (17), and a gap is provided between the support and the lower mold base (17), with the trash can (16) located below the gap.
8. The die-cutting waste removal device according to claim 1, characterized in that, The first feeding mechanism (4) includes a feeding roller and a feeding motor connected to it in a transmission manner; The upward waste discharge mechanism (10) includes a first receiving roller and a first receiving motor connected to it in a transmission manner; The winding mechanism (7) includes a second winding roller and a second winding motor that is connected to it for transmission.
9. A method for waste removal during die-cutting, characterized in that, The die-cutting waste removal method is performed using the die-cutting waste removal device as described in any one of claims 1 to 8, and the specific steps are as follows: S1. The first feeding mechanism (4) feeds out double-sided tape (1) and release film (2) to obtain a strip of "double-sided tape (1) and release film (2)" bonded together from top to bottom; S2. The strip is conveyed to the die-cutting mechanism (6) station, and the strip is placed below the blade (19) and above the lower die base (17); S3, the die-cutting mechanism (6) works, and the blade (19) die-cuts the strip to form the outer frame (13) and the inner frame (14); S4. The die-cut strip is fed to the bottom of the ejector pin (15) so that the position, shape and number of the ejector pin (15) correspond to the inner frame (14). The ejector pin (15) passes down through the inner frame (14) and discharges the waste material of the inner frame (14) into the trash can (16). S5. The conveyor belt that removes the waste material from the inner frame (14) is conveyed to the lifting waste removal mechanism (10) to collect and remove the waste material from the outer frame (7). S6. The winding mechanism (7) winds up the processed material strip to obtain the product (20).
10. A die-cutting waste removal method according to claim 9, characterized in that, In step S3, the first blade die-cuts the double-sided adhesive (1) to obtain the outer frame (13), and the second blade die-cuts the double-sided adhesive (1) and the release film (2) to obtain the inner frame (14).
Citation Information
Patent Citations
Cutting die for discharging small round hole waste
CN114571533A