High-toughness epoxy resin composite for electronic packaging and preparation method thereof

Abstract

This invention belongs to the field of polymer materials technology, specifically relating to a high-toughness epoxy resin composite material for electronic packaging and its preparation method. The epoxy resin composite material comprises the following raw materials in parts by weight: 12-18 parts modified epoxy resin, 3-7 parts curing agent, 1-3 parts MIL-53-AI, 0.05 parts silane coupling agent, 0.1 parts 2-methylimidazole, and 78 parts silica powder. By introducing flexible chains through the side-linking of single-terminal amino polyethers to the epoxy resin, the toughness and flowability of the modified epoxy resin are effectively improved. At the same time, it forms a macro- and micro-dual stress buffer network with the surface-treated MOF porous framework MIL-53-AI, which significantly improves the toughness and fatigue crack resistance of the electronic packaging composite material while ensuring high heat resistance.

Description

Technical Field

[0001] This invention belongs to the field of polymer materials technology, specifically relating to a high-toughness epoxy resin composite material for electronic packaging and its preparation method. Background Technology

[0002] As microelectronic packaging technology advances towards higher integration and higher power, stringent requirements are placed on the thermomechanical reliability of electronic packaging composite materials such as underfill adhesives. Epoxy resin is widely used as a packaging matrix due to its excellent insulation and adhesion properties; however, its high crosslinking density after curing leads to significant intrinsic brittleness. During semiconductor device operation or exposure to thermal shock, the significant difference in thermal expansion coefficients between the chip, packaging substrate, and resin matrix generates enormous thermomechanical shear stress within the package, easily causing resin layer cracking, interface debonding, and breakage of bottom conductive solder joints, severely limiting the yield and lifespan of electronic components. Existing technologies typically toughen epoxy resin by physically blending it with rubber elastomers or flexible polymers to address thermal stress concentration defects. However, these traditional material designs exhibit weak interfacial bonding and low crosslinking density between the matrix components, resulting in a significant decrease in heat resistance and high-temperature modulus. Furthermore, they can easily increase the viscosity of high-filler systems, disrupting the packaging process.

[0003] Therefore, there is an urgent need to develop a new type of epoxy resin composite material that combines high insulation, high heat resistance, and high toughness for use in the packaging process of precision and critical electronic devices. Summary of the Invention

[0004] To address the above issues, this invention provides a high-toughness epoxy resin composite material for electronic packaging and its preparation method. By introducing modified epoxy resin with active coordination side groups and combining it with a flexible MOF (metal-organic framework) material with a porous lattice structure, a dual polymer network structure interwoven with dynamic coordination bonds and resin bulk covalent bonds is constructed. This structure is used to solve the problem of epoxy resin thermal stress fatigue failure and the inability to effectively combine toughness and heat resistance in electronic packaging.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] This invention provides a high-toughness epoxy resin composite material for electronic packaging, the epoxy resin composite material comprising the following raw materials in parts by weight: 12-18 parts modified epoxy resin, 3-7 parts curing agent, 1-3 parts MIL-53-Al (MOF, metal-organic framework), 0.05 parts silane coupling agent, 0.1 parts 2-methylimidazole, and 78 parts silica powder.

[0007] Furthermore, the curing agent is selected from diethyltoluenediamine or 4,4'-diaminodiphenylmethane.

[0008] Further, the modified epoxy resin comprises the following raw materials: o-cresol epoxy resin, single-terminated amino polyether, IPTES (propyltriethoxysilane isocyanate), methyl isobutyl ketone and anhydrous ethanol, wherein the mass ratio of o-cresol epoxy resin, single-terminated amino polyether, IPTES, methyl isobutyl ketone and anhydrous ethanol is 100:15:2:40:1.

[0009] Furthermore, the modified epoxy resin is prepared as follows:

[0010] S1: Mix o-cresol epoxy resin and methyl isobutyl ketone, heat and stir at 80°C under nitrogen atmosphere to dissolve, and obtain resin solution;

[0011] S2: While stirring, slowly add mono-amino polyether to the resin solution, heat to 95℃ and reflux for 3 hours to obtain the reactant. The active primary amino group at the end of the mono-amino polyether undergoes a nucleophilic reaction with the epoxy group of the side chain of o-cresol epoxy resin, causing the epoxy ring to open and covalently linking the long and flexible polyether chain to the rigid resin backbone. At the same time, secondary hydroxyl groups are generated after ring opening. After the reaction is completed, the reactant is cooled to 70℃, IPTES is added to it, and the reaction is continued to be stirred for 2 hours. The isocyanate group in the IPTES molecule undergoes an addition reaction with the secondary hydroxyl group formed after the epoxy resin ring opening to form urethane, thereby consuming the originally highly polar and hygroscopic hydroxyl group to obtain the reaction solution.

[0012] S3: Add anhydrous ethanol to the reaction solution to promote the formation of stable urethane bonds in the residual IPTES side chains, so as to prevent the free isocyanate groups from releasing carbon dioxide when they come into contact with water during the subsequent preparation of epoxy resin composites, which would damage the encapsulation effect of the composites. Then, remove methyl isobutyl ketone by vacuum distillation to obtain modified epoxy resin.

[0013] This invention also provides a method for preparing a high-toughness epoxy resin composite material for electronic packaging, the specific steps of which are as follows:

[0014] Step 1: Disperse silica powder and MIL-53-Al together in anhydrous ethanol and stir to obtain a slurry. Add silane coupling agent to the slurry. The methoxy group in the silane coupling agent condenses with the exposed hydroxyl groups of silica powder and MIL-53-Al to form a hydrogen bond network that is adsorbed on the surface of silica powder and MOF. Dry at 100℃ to obtain the pretreated filler.

[0015] Step 2: After heating the modified epoxy resin to 80°C to form a molten state, mix it with the pretreated filler to obtain a wet material. Transfer the wet material to a planetary vacuum mixer for high-shear mixing to promote the uniform dispersion of the filler in the resin and obtain a composite matrix adhesive.

[0016] Step 3: Mix the composite matrix adhesive with the curing agent and 2-methylimidazole, and vacuum stir to remove bubbles to obtain a high-toughness epoxy resin composite material for electronic packaging.

[0017] The beneficial effects achieved by this invention are as follows:

[0018] The high-toughness epoxy resin composite material provided by this invention uses single-terminated amino polyether to modify o-cresyl formaldehyde epoxy resin, effectively avoiding the risks of multidimensional crosslinking and gelation during the modification process. After the flexible polyether segments are introduced into the rigid resin skeleton, a significant internal plasticizing effect is generated, which effectively reduces the viscosity of the modified epoxy resin and improves its flowability in electronic packaging. At the same time, IPTES is used to react with the ring-opening generated hydroxyl groups to convert them into urethane, which reduces the polarity and water absorption of the system. Furthermore, silane groups are introduced into the resin side chain, providing active sites for subsequent interfacial coupling. To address the stress failure problem caused by the thermal expansion mismatch between electronic components such as chips and the substrate in electronic packaging, this application combines modified resin and flexible MOF material to form a synergistic energy absorption mechanism at both the macroscopic and microscopic levels. When subjected to thermal temperature changes, the flexible polyether segments in the resin matrix can absorb and dissipate part of the strain energy through conformational changes. At the same time, the unique porous lattice structure of MIL-53-Al provides a buffer space at the microscale. This synergistic effect of polymer segments and inorganic porous framework effectively alleviates local stress concentration within the system and delays the initiation and propagation of microcracks.

[0019] In addition, the surface activity of silica powder and MIL-53-Al is performed by using a silane coupling agent. The methoxy group of the coupling agent undergoes dehydration condensation with the hydroxyl group on the filler surface, which improves the surface polarity and dispersion state of the filler. In the final product application, the active epoxy group at its end can participate in the cross-linking reaction together with the resin network of the curing agent and the matrix, which effectively enhances the interfacial bonding force between the organic phase and the inorganic phase and reduces the risk of peeling and detachment of the filler interface under extreme temperatures. Attached Figure Description

[0020] Figure 1 The scanning electron microscope characterization results are for the epoxy resin composite materials prepared in Comparative Example 1 and Example 2;

[0021] Figure 2 The Fourier transform infrared spectral characterization results of the o-cresol formaldehyde epoxy resin before and after modification in Example 2 are shown below.

[0022] Figure 3 The mechanical properties of the epoxy resin composites prepared in Examples 1-4 and Comparative Examples 1-2 are as follows;

[0023] Figure 4 The results show the thermal stability of the epoxy resin composites prepared in Example 2 and Comparative Examples 1-2. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those familiar to those skilled in the art. Furthermore, any methods and materials similar to or equivalent to those described herein may be applied to this invention. The preferred embodiments and materials described herein are for illustrative purposes only and do not limit the scope of this application.

[0026] Unless otherwise specified, all methods used in the following examples are conventional. Unless otherwise specified, all materials used in the following examples are new materials purchased from the market, and all quantities are parts by weight. In the following examples and comparative examples, the o-crestyral epoxy resin used is model SQCN702, with an epoxy equivalent of 197-207 g / eq and a softening point of 70-77℃; the silica powder used is active silica powder, model HK112, with an average particle size of 5 μm, a hardness of 7, and a whiteness of 93; the single-terminated amino polyether used is Jeffamine M-600 or Jeffamine M-2005; the silane coupling agent used is KH-560 (γ-glycidyl etheroxypropyltrimethoxysilane) or A-186 (2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane); the MIL-53-Al product has CAS number 654061-20-8, a molecular weight of 208, and a vertical pore size of 0.8. nm × 1.3 nm, BET specific surface area 600-900 m 2 / g.

[0027] Example 1: This example provides a high-toughness epoxy resin composite material for electronic packaging. The epoxy resin composite material includes the following raw materials in parts by weight: 12 parts modified epoxy resin, 7 parts diethyltoluenediamine, 3 parts MIL-53-Al, 0.05 parts KH-560, 0.1 parts 2-methylimidazole, and 78 parts silica powder.

[0028] The modified epoxy resin comprises the following raw materials in parts by weight: 20 parts of o-cresol formaldehyde epoxy resin, 3 parts of Jeffamine M-600, 0.4 parts of IPTES, 8 parts of methyl isobutyl ketone, and 0.2 parts of anhydrous ethanol. The preparation method is as follows:

[0029] S1: Mix 20 parts of o-cresol epoxy resin and 8 parts of methyl isobutyl ketone, heat at 80°C and stir at 200 rpm for 30 min under nitrogen atmosphere to dissolve and obtain resin solution.

[0030] S2: Add 3 parts of Jeffamine M-600 slowly to the resin solution while stirring, heat to 95℃ and reflux for 3 hours to obtain the reactant. After the reaction is completed, cool the reactant to 70℃, add 0.4 parts of IPTES, and continue stirring for 2 hours to obtain the reaction solution.

[0031] S3: Add 0.2 parts of anhydrous ethanol to the reaction solution and continue stirring for 30 min to promote the formation of stable urethane bonds in the side chains of residual IPTES. Then, remove methyl isobutyl ketone by vacuum distillation at -0.09 MPa for 1 h to obtain modified epoxy resin.

[0032] This embodiment also provides a method for preparing a high-toughness epoxy resin composite material for electronic packaging, the specific steps of which are as follows:

[0033] Step 1: Take 78 parts of silica powder and 3 parts of MIL-53-Al and disperse them together in 20 parts of anhydrous ethanol. Stir at 300 rpm for 30 min to obtain a slurry. Add 0.05 parts of KH-560 to it and continue stirring and reacting for 1 h. Dry at 100℃ to obtain the pretreated filler.

[0034] Step 2: Take 12 parts of modified epoxy resin, heat it to 80℃ to form a molten state, and mix it with the pretreated filler at 100 rpm to obtain a wet material. Transfer the wet material to a planetary vacuum mixer for high shear mixing for 30 minutes at a revolution speed of 800 rpm and a rotation speed of 1500 rpm to promote the uniform dispersion of the filler in the resin and obtain a composite matrix adhesive.

[0035] Step 3: Mix the composite matrix adhesive with 7 parts of diethyltoluenediamine and 0.1 parts of 2-methylimidazole, and vacuum stir to remove bubbles to obtain a high-toughness epoxy resin composite material for electronic packaging.

[0036] Example 2: This example provides a high-toughness epoxy resin composite material for electronic packaging. The epoxy resin composite material includes the following raw materials in parts by weight: 15 parts modified epoxy resin, 5 parts diethyltoluenediamine, 2 parts MIL-53-Al, 0.05 parts KH-560, 0.1 parts 2-methylimidazole, and 78 parts silica powder.

[0037] The modified epoxy resin comprises the following raw materials in parts by weight: 40 parts of o-cresol formaldehyde epoxy resin, 6 parts of Jeffamine M-600, 0.8 parts of IPTES, 16 parts of methyl isobutyl ketone, and 0.4 parts of anhydrous ethanol. The preparation method is as follows:

[0038] S1: Mix 40 parts of o-cresol epoxy resin and 16 parts of methyl isobutyl ketone, heat at 80°C and stir at 200 rpm for 30 min under nitrogen atmosphere to dissolve and obtain resin solution.

[0039] S2: Add 6 parts of Jeffamine M-600 slowly to the resin solution while stirring, heat to 95℃ and reflux for 3 hours to obtain the reactant. After the reaction is completed, cool the reactant to 70℃, add 0.8 parts of IPTES, and continue stirring for 2 hours to obtain the reaction solution.

[0040] S3: Add 0.4 parts of anhydrous ethanol to the reaction solution and continue stirring for 30 min to promote the formation of stable urethane bonds in the side chains of residual IPTES. Then, remove methyl isobutyl ketone by vacuum distillation at -0.09 MPa for 1 h to obtain modified epoxy resin.

[0041] This embodiment also provides a method for preparing a high-toughness epoxy resin composite material for electronic packaging, the specific steps of which are as follows:

[0042] Step 1: Take 78 parts of silica powder and 2 parts of MIL-53-Al and disperse them together in 20 parts of anhydrous ethanol. Stir at 300 rpm for 30 min to obtain a slurry. Add 0.05 parts of KH-560 to it and continue stirring and reacting for 1 h. Dry at 100℃ to obtain the pretreated filler.

[0043] Step 2: Take 15 parts of modified epoxy resin, heat it to 80°C to form a molten state, and mix it with the pretreated filler at 100 rpm to obtain a wet material. Transfer the wet material to a planetary vacuum mixer for high shear mixing for 30 minutes at a revolution speed of 800 rpm and a rotation speed of 1500 rpm to promote the uniform dispersion of the filler in the resin and obtain a composite matrix adhesive.

[0044] Step 3: Mix the composite matrix adhesive with 5 parts of diethyltoluenediamine and 0.1 parts of 2-methylimidazole, and vacuum stir to remove bubbles to obtain a high-toughness epoxy resin composite material for electronic packaging.

[0045] Example 3: This example provides a high-toughness epoxy resin composite material for electronic packaging. The epoxy resin composite material comprises the following raw materials in parts by weight: 18 parts modified epoxy resin, 3 parts 4,4'-diaminodiphenylmethane, 1 part MIL-53-Al, 0.05 parts A-186, 0.1 parts 2-methylimidazole, and 78 parts silica powder.

[0046] The modified epoxy resin comprises the following raw materials in parts by weight: 40 parts of o-cresol formaldehyde epoxy resin, 6 parts of Jeffamine M-600, 0.8 parts of IPTES, 16 parts of methyl isobutyl ketone, and 0.4 parts of anhydrous ethanol. The preparation method is as follows:

[0047] S1: Mix 40 parts of o-cresol epoxy resin and 16 parts of methyl isobutyl ketone, heat at 80°C and stir at 200 rpm for 30 min under nitrogen atmosphere to dissolve and obtain resin solution.

[0048] S2: Add 6 parts of Jeffamine M-600 slowly to the resin solution while stirring, heat to 95℃ and reflux for 3 hours to obtain the reactant. After the reaction is completed, cool the reactant to 70℃, add 0.8 parts of IPTES, and continue stirring for 2 hours to obtain the reaction solution.

[0049] S3: Add 0.4 parts of anhydrous ethanol to the reaction solution and continue stirring for 30 min to promote the formation of stable urethane bonds in the side chains of residual IPTES. Then, remove methyl isobutyl ketone by vacuum distillation at -0.09 MPa for 1 h to obtain modified epoxy resin.

[0050] This embodiment also provides a method for preparing a high-toughness epoxy resin composite material for electronic packaging, the specific steps of which are as follows:

[0051] Step 1: Take 78 parts of silica powder and 1 part of MIL-53-Al and disperse them together in 20 parts of anhydrous ethanol. Stir at 300 rpm for 30 min to obtain a slurry. Add 0.05 parts of A-186 to it and continue stirring and reacting for 1 h. Dry at 100℃ to obtain the pretreated filler.

[0052] Step 2: Take 18 parts of modified epoxy resin, heat it to 80℃ to form a molten state, and mix it with the pretreated filler at 100 rpm to obtain a wet material. Transfer the wet material to a planetary vacuum mixer for high shear mixing for 30 minutes at a revolution speed of 800 rpm and a rotation speed of 1500 rpm to promote the uniform dispersion of the filler in the resin and obtain a composite matrix adhesive.

[0053] Step 3: Mix the composite matrix adhesive with 3 parts of 4,4'-diaminodiphenylmethane and 0.1 parts of 2-methylimidazole, and vacuum stir to remove bubbles to obtain a high-toughness epoxy resin composite material for electronic packaging.

[0054] Example 4: This example provides a high-toughness epoxy resin composite material for electronic packaging. The epoxy resin composite material comprises the following raw materials in parts by weight: 14 parts modified epoxy resin, 6 parts 4,4'-diaminodiphenylmethane, 2 parts MIL-53-Al, 0.05 parts A-186, 0.1 parts 2-methylimidazole, and 78 parts silica powder.

[0055] The modified epoxy resin comprises the following raw materials in parts by weight: 40 parts of o-cresol formaldehyde epoxy resin, 6 parts of Jeffamine M-2005, 0.8 parts of IPTES, 16 parts of methyl isobutyl ketone, and 0.4 parts of anhydrous ethanol. The preparation method is as follows:

[0056] S1: Mix 40 parts of o-cresol epoxy resin and 16 parts of methyl isobutyl ketone, heat at 80°C and stir at 200 rpm for 30 min under nitrogen atmosphere to dissolve and obtain resin solution.

[0057] S2: Add 6 parts of Jeffamine M-2005 slowly to the resin solution while stirring, heat to 95℃ and reflux for 3 h to obtain the reactant. After the reaction is completed, cool the reactant to 70℃, add 0.8 parts of IPTES, and continue stirring for 2 h to obtain the reaction solution.

[0058] S3: Add 0.4 parts of anhydrous ethanol to the reaction solution and continue stirring for 30 min to promote the formation of stable urethane bonds in the side chains of residual IPTES. Then, remove methyl isobutyl ketone by vacuum distillation at -0.09 MPa for 1 h to obtain modified epoxy resin.

[0059] This embodiment also provides a method for preparing a high-toughness epoxy resin composite material for electronic packaging, the specific steps of which are as follows:

[0060] Step 1: Take 78 parts of silica powder and 2 parts of MIL-53-Al and disperse them together in 20 parts of anhydrous ethanol. Stir at 300 rpm for 30 min to obtain a slurry. Add 0.05 parts of A-186 to it and continue stirring and reacting for 1 h. Dry at 100℃ to obtain the pretreated filler.

[0061] Step 2: Take 14 parts of modified epoxy resin, heat it to 80℃ to form a molten state, and mix it with the pretreated filler at 100 rpm to obtain a wet material. Transfer the wet material to a planetary vacuum mixer for high shear mixing for 30 minutes at a revolution speed of 800 rpm and a rotation speed of 1500 rpm to promote the uniform dispersion of the filler in the resin and obtain a composite matrix adhesive.

[0062] Step 3: Mix the composite matrix adhesive with 6 parts of 4,4'-diaminodiphenylmethane and 0.1 parts of 2-methylimidazole, and degas under vacuum to obtain a high-toughness epoxy resin composite material for electronic packaging.

[0063] Comparative Example 1: The difference from Example 2 is that the epoxy resin was not modified. An epoxy resin composite material was prepared using the same weight of o-cresol epoxy resin. The rest of the process was the same as in Example 2.

[0064] Comparative Example 2: The difference from Example 2 is that MIL-53-Al was not added; the rest is the same as Example 2.

[0065] Morphological examination: The microstructure of the flexural fracture surfaces of the epoxy resin composites prepared in Example 2 and Comparative Example 1 after curing was examined using a ZEISS Sigma 300 scanning electron microscope. The surfaces were then sputter-coated with gold at an accelerating voltage of 15 kV. The results are shown in [Figure number missing]. Figure 1 .

[0066] FTIR Fourier Transform Spectroscopy Characterization: The molecular structure of the epoxy resin before and after modification in Example 2 was characterized using Fourier Transform Infrared Spectroscopy, with an infrared scanning wavenumber range of 500-4000 cm⁻¹. -1 The resolution is 5 cm. -1 The results are shown Figure 2 .

[0067] Mechanical property evaluation: The tensile properties of the epoxy resin composites prepared in Examples 1-4 and Comparative Examples 1-2 were tested using a universal tensile testing machine. Each sample was prepared into a cured dumbbell shape and subjected to tensile testing at room temperature at a rate of 2 mm / min. The tensile strength and elongation at break were evaluated. The results are shown in [Figure number missing]. Figure 3 ;

[0068] Thermogravimetric analysis: The epoxy resin composites prepared in Example 2 and Comparative Examples 1-2 were analyzed using an SDT Q600 thermogravimetric analyzer. The heating rate was 10℃ / min, and the temperature ranged from 25 to 1000℃. The results are shown in the figure. Figure 4 .

[0069] Figure 1The results showed that the epoxy resin composite material prepared in Comparative Example 1 without modification had a smooth bending fracture surface, exhibiting a typical brittle fracture morphology, indicating that its ability to resist crack propagation was weak. In contrast, the modified epoxy resin composite material prepared in Example 2 had a rough and irregular fracture surface with many fine ripples and cracks, which is a clear characteristic of enhanced toughness. When the material is bent to a greater degree, the interfacial bonding force between the modified epoxy resin and the MOF material is stronger, and the crack resistance is enhanced.

[0070] Figure 2 The results showed that after epoxy resin modification, 3400 cm -1 The peak intensity increases at ~910 cm⁻¹, indicating a secondary hydroxyl stretching vibration peak. -1 The characteristic peak at 1720 cm⁻¹ changes significantly, with a relative decrease or disappearance in intensity, indicating that some epoxy groups are consumed for grafting flexible chains. -1 The appearance of a strong absorption peak at this point is a characteristic peak of carbonyl stretching vibration, which originates from the urethane bond formed by the addition reaction of the isocyanate group of IPTES with the hydroxyl group or ethanol, indicating that the grafting modification was successful.

[0071] Figure 3 The results showed that the tensile strength and elongation at break of the composite materials prepared by adding modified epoxy resin and MOF material in Examples 1-4 were significantly improved compared with Comparative Example 1 and Comparative Example 2, indicating that modified epoxy resin and surface-treated MOF material have a positive effect on improving the toughness and strength of composite materials.

[0072] Figure 4 The results showed that within the temperature range of 350-450℃, the thermal weight loss of Example 2, Comparative Example 2 and Comparative Example 1 gradually increased, indicating that the epoxy resin composite material prepared in Example 2 has excellent thermodynamic properties and can still maintain the stability of material molecules at high temperatures.

[0073] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0074] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention. The actual application is not limited to this. In conclusion, if those skilled in the art are inspired by this description and design similar methods and embodiments without departing from the spirit of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A high-toughness epoxy resin composite material for electronic packaging, characterized in that, The epoxy resin composite material comprises the following raw materials in parts by weight: 12-18 parts modified epoxy resin, 3-7 parts curing agent, 1-3 parts MIL-53-Al, 0.05 parts silane coupling agent, 0.1 parts 2-methylimidazole, and 78 parts silica powder; The modified epoxy resin comprises raw materials in the following mass ratio: o-cresol epoxy resin: mono-amino-terminated polyether: IPTES: methyl isobutyl ketone: anhydrous ethanol = 100:15:2:40:

1. The preparation method of the modified epoxy resin is as follows: S1: Mix and dissolve o-cresol epoxy resin and methyl isobutyl ketone to obtain a resin solution; S2: Add a single-terminated amino polyether to the resin solution to react and obtain the reactant. After the reaction is complete, add IPTES to continue the reaction and obtain the reaction solution. S3: After adding anhydrous ethanol to the reaction solution, the mixture is distilled under reduced pressure to obtain the modified epoxy resin.

2. The high-toughness epoxy resin composite material for electronic packaging according to claim 1, characterized in that, The curing agent is selected from diethyltoluenediamine or 4,4'-diaminodiphenylmethane.

3. A method for preparing a high-toughness epoxy resin composite material for electronic packaging according to any one of claims 1-2, characterized in that, The specific steps are as follows: Step 1: Disperse silica powder and MIL-53-Al together to obtain a slurry, add silane coupling agent to it, and dry it to obtain a pretreated filler; Step 2: After heating and melting the modified epoxy resin, mix it with the pretreated filler to obtain a wet material. The wet material is then subjected to high-shear mixing to obtain a composite matrix adhesive. Step 3: Mix the composite matrix adhesive with the curing agent and 2-methylimidazole, and degas to obtain a high-toughness epoxy resin composite material for electronic packaging.

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