High-flux X-ray chip batch detection method and system

By employing a capacitively coupled non-contact charge injection method, the problems of physical damage, high cost, and low efficiency in the testing of photon counting chips have been solved. This method enables high-throughput, low-cost synchronous testing of the entire array of pixels, improving the reliability and integrity of the test results.

CN121933908APending Publication Date: 2026-04-28SUZHOU GEDI PHOTON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU GEDI PHOTON TECH CO LTD
Filing Date
2026-01-27
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing technologies for testing photon counting chips suffer from problems such as physical damage, high cost, poor signal coupling quality, and low testing efficiency, making it difficult to meet the requirements of high throughput and high reliability.

Method used

A non-contact charge injection method based on capacitive coupling is adopted. A non-contact coupling structure is constructed through a conductive coupling layer and an insulating dielectric layer. A high-frequency narrow pulse voltage signal is used to simulate the charge pulse of the photon counting chip, so as to realize the synchronous testing of the entire array of pixels.

Benefits of technology

It enables non-destructive, low-cost, and efficient batch testing of photon counting chips, improves test throughput and consistency assessment capabilities, avoids physical damage and signal distortion, and enhances the reliability and integrity of test results.

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Abstract

The invention discloses a high-flux X-ray chip batch detection method and a high-flux X-ray chip batch detection system. The method comprises the following steps: constructing a non-contact coupling structure, and attaching a conductive coupling layer covered with an insulating dielectric layer to a to-be-tested chip bonding pad array to form an equivalent coupling capacitor; applying a pulse voltage signal with preset frequency and amplitude to the conductive coupling layer, and inducing displacement current for simulating a photon event on the chip bonding pad through capacitive coupling; the chip internal circuit processes the induced charges and outputs a counting result; and evaluating the function and consistency according to the counting result of each pixel unit. The corresponding system comprises a test substrate, a non-contact coupling assembly, a high-frequency signal generator and an upper computer. According to the invention, non-contact and high-efficiency chip batch function testing is realized, physical contact damage is avoided, photon events with different energy can be accurately simulated, and the method is suitable for rapid performance evaluation and screening of photon counting chips.
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