Filter, inverter and vehicle

Abstract

The invention relates to a filter, an inverter and a vehicle, the filter comprises a connecting busbar, a first magnetic ring, a second magnetic ring and a capacitor, the connecting busbar is used for being electrically conducted with an external electronic element, the first magnetic ring sleeves a part of the connecting busbar, the second magnetic ring sleeves a part of the connecting busbar, and the capacitor is electrically connected with the first magnetic ring and the second magnetic ring. The capacitor can be electrically conducted with the connecting busbar, the first magnetic ring is a common-mode magnetic ring, the first magnetic ring can be matched with the capacitor to form a common-mode filter circuit, the second magnetic ring is a differential-mode magnetic ring, and the second magnetic ring can be matched with the capacitor to form a differential-mode filter circuit. According to the filter, common-mode noise and differential-mode noise are jointly suppressed, the filter can be applied to a high-voltage direct-current system, the first magnetic ring and the second magnetic ring are independent of each other and are designed in a split mode, and measurement of differential-mode inductance and impedance and measurement of common-mode inductance and impedance can be decoupled.

Description

Technical Field

[0001] This disclosure relates to the field of vehicle manufacturing technology, and more particularly to a filter, an inverter, and a vehicle. Background Technology

[0002] In related technologies, filters are mainly used to reduce common-mode noise, but they cannot filter differential-mode noise, which limits their application scenarios. Summary of the Invention

[0003] The purpose of this disclosure is to provide a filter, an inverter, and a vehicle to solve the problems in the aforementioned related technologies.

[0004] To achieve the above objectives, one aspect of this disclosure provides a filter comprising: A connecting busbar, which is used for electrical connection with external electronic components; A first magnetic ring is sleeved on a portion of the connecting busbar; A second magnetic ring is sleeved on a portion of the connecting busbar; A capacitor, wherein the capacitor is electrically connected to the connecting busbar; The first magnetic ring and the second magnetic ring are spaced apart in the extension direction of the connecting busbar. The first magnetic ring is a common-mode magnetic ring, which can cooperate with the capacitor to form a common-mode filter circuit. The second magnetic ring is a differential-mode magnetic ring, which can cooperate with the capacitor to form a differential-mode filter circuit. The connecting busbar includes a positive busbar and a negative busbar, and the number of the second magnetic rings is set to two, with the two second magnetic rings respectively sleeved on the positive busbar and the negative busbar.

[0005] In the above technical solution, the first magnetic ring is a common-mode magnetic ring, which, in conjunction with the capacitor, can suppress common-mode noise. The second magnetic ring is a differential-mode magnetic ring, which, in conjunction with the capacitor, can suppress differential-mode noise. This achieves simultaneous suppression of both common-mode and differential-mode noise, broadening the suppression bandwidth and enabling application in high-voltage DC systems. This expands the filter's application scenarios, meets the needs of different applications, and improves filtering performance. Furthermore, by setting the first and second magnetic rings as independent, separate designs, the measurement of differential-mode inductance and impedance is decoupled from the measurement of common-mode inductance and impedance. They do not interfere with each other, facilitating the determination of whether the failure is due to the first or second magnetic ring in failure analysis.

[0006] In some possible implementations, the connecting busbar includes a first arm and a second arm, one end of the first arm and one end of the second arm are connected and form an "L" shape, the first magnetic ring is sleeved on the first arm, and the second magnetic ring is sleeved on the second arm.

[0007] This design reduces the overall size and minimizes the space occupied.

[0008] In some possible implementations, the filter further includes a housing, to which the first magnetic ring, the second magnetic ring, the connecting busbar, and the capacitor are all connected. The housing covers a portion of the connecting busbar. The housing has a first receiving cavity and a second receiving cavity. The connecting busbar passes through the first receiving cavity and the second receiving cavity. A first adhesive portion is provided in the first receiving cavity. The first magnetic ring is disposed in the first receiving cavity and connected to the first adhesive portion. A second adhesive portion is provided in the second receiving cavity. The second magnetic ring is disposed in the second receiving cavity and connected to the second adhesive portion. The first magnetic ring and the second magnetic ring are respectively fixed to the first receiving cavity and the second receiving cavity by potting compound.

[0009] This arrangement facilitates the placement and fixation of the first and second magnetic rings, and also provides insulation.

[0010] In some possible implementations, the filter further includes a housing and a boost copper busbar connected to the housing.

[0011] With this setup, a large current can be supplied to charge the battery pack via the boost copper busbar in boost charging mode.

[0012] In some possible implementations, the housing is provided with a mounting portion, through which the housing is connected to the base; The assembly part includes an assembly hole and a bushing. The bushing is disposed in the assembly hole, and the housing can be connected to the base by fasteners passing through the bushing and the assembly hole.

[0013] This design facilitates the assembly and connection of the outer casing and the base.

[0014] In some possible implementations, the filter further includes a heat dissipation copper busbar, a portion of which is disposed between the capacitor and the first magnetic ring to transfer heat from the capacitor and the first magnetic ring to the heat dissipation copper busbar.

[0015] This design effectively increases the heat dissipation area, thereby improving heat dissipation performance. A portion of the heat dissipation copper busbar is positioned between the capacitor and the first magnetic ring, allowing heat from these components to be transferred to the busbar. The heat is then dissipated through the busbar, reducing the temperature around the capacitor and the first magnetic ring, thus achieving heat dissipation. This targeted approach to heat dissipation for the capacitor and the first magnetic ring improves the reliability of the capacitor and filter.

[0016] In some possible implementations, another portion of the heat dissipation copper busbar is disposed on one side of the capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the capacitor falls on the other portion of the heat dissipation copper busbar, so that at least a portion of the heat of the capacitor can be transferred to the heat dissipation copper busbar.

[0017] This configuration enables two heat transfer paths, thereby improving heat dissipation.

[0018] In some possible implementations, the heat dissipation copper busbar includes a plate and a heat-absorbing part, the heat-absorbing part being connected to the plate, at least a portion of the heat-absorbing part being disposed between the capacitor and the first magnetic ring, and the plate being disposed on one side of the capacitor.

[0019] This setup facilitates the arrangement of the heat dissipation copper busbars.

[0020] In some possible implementations, the heat-absorbing portion is connected to the edge of the plate, the heat-absorbing portion is close to the capacitor, and is spaced apart from the capacitor.

[0021] With this arrangement, the heat-absorbing part can extend at least partially between the capacitor and the first magnetic ring. The heat-absorbing part is located at the edge, so that the plate does not affect the arrangement of the capacitor or the arrangement of the first magnetic ring. At the same time, the spacing between the heat-absorbing part and the capacitor and the first magnetic ring will not affect the function of the capacitor and the first magnetic ring.

[0022] In some possible implementations, the heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the capacitor includes a first capacitor and a second capacitor, wherein the first heat-absorbing element corresponds to the first capacitor and the second heat-absorbing element corresponds to the second capacitor.

[0023] This configuration allows for heat dissipation of both the first and second capacitors, ensuring effective heat dissipation for different capacitors.

[0024] In some possible implementations, the first heat-absorbing element is configured as a plate, the first heat-absorbing element is angled to the plate, one side of the first capacitor faces the first heat-absorbing element, and the other side of the first capacitor faces the plate.

[0025] This design minimizes space requirements, facilitates insertion between the first magnetic ring and the first capacitor, avoids interference with the first magnetic ring and the first capacitor, and also facilitates space arrangement.

[0026] In some possible implementations, the second heat absorber includes a pin, one end of which is connected to the plate body, and the other end of which is provided with a connector. The second capacitor is provided with a fourth lead, which is connected to the connector, and one side of the second capacitor faces the plate body.

[0027] This configuration facilitates electrical conduction with the second capacitor and heat transfer.

[0028] In some possible implementations, the heat dissipation copper busbar is provided with a mounting part for connecting to a base, the heat dissipation copper busbar is used to transfer heat to the base, and the heat dissipation copper busbar is used to ground through the base.

[0029] This setup enables grounding, allowing heat to be transferred to the base, which facilitates heat dissipation and achieves a heat dissipation effect.

[0030] In some possible implementations, the connecting busbar is provided with a connecting portion, the capacitor is provided with a lead, and the lead is connected to the connecting portion; The capacitor includes a first capacitor and a second capacitor, the connecting busbar includes a positive busbar and a negative busbar, and the lead includes a first lead, a second lead, a third lead and a fourth lead; One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive busbar, and the other end of the second lead is connected to the connection part of the negative busbar. The number of the second capacitors is at least two, each of the second capacitors is provided with the third lead and the fourth lead, the third lead of at least one second capacitor is connected to the positive busbar, the third lead of at least one second capacitor is connected to the negative busbar, and the fourth lead of each second capacitor is connected to the heat dissipation copper busbar.

[0031] This configuration enables mutual electrical conduction and heat dissipation from the connecting busbars, providing two heat transfer paths and improving heat dissipation efficiency.

[0032] In some possible implementations, the filter further includes an adapter sub-bar that is integrally formed or welded to the connecting busbar.

[0033] This setup allows for electrical conduction with different components.

[0034] In some possible implementations, the adapter sub-bar is provided with a connecting portion, the capacitor is provided with a lead, and the lead is connected to the connecting portion; The capacitor includes a first capacitor and a second capacitor, the adapter sub-bar includes a positive sub-bar and a negative sub-bar, and the lead includes a first lead, a second lead, a third lead and a fourth lead; One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive electrode sub-array, and the other end of the second lead is connected to the connection part of the negative electrode sub-array. The number of the second capacitors is at least two, and each second capacitor is provided with the third lead and the fourth lead. The third lead of at least one second capacitor is connected to the positive sub-array, and the third lead of at least one second capacitor is connected to the negative sub-array.

[0035] This configuration enables mutual electrical conduction and heat dissipation for both the connecting busbar and the transition busbar, providing two heat transfer paths and improving heat dissipation.

[0036] A second aspect of this disclosure also provides an inverter including the filter described above.

[0037] The above technical solution can decouple the measurement of differential mode inductance and impedance from the measurement of common mode inductance and impedance, so that the two do not interfere with each other, which is helpful in determining whether the failure is of the first magnetic ring or the second magnetic ring in failure analysis.

[0038] A third aspect of this disclosure also provides a vehicle including the filter described above, or the inverter described above.

[0039] The above technical solutions improve the reliability and robustness of vehicle use.

[0040] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0041] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of a portion of the structure of a filter according to one embodiment of the present disclosure.

[0042] Figure 2 This is a schematic diagram showing the installation positions of the first and second magnetic rings according to one embodiment of this disclosure.

[0043] Figure 3This is a schematic diagram of the structure of a filter according to one embodiment of the present disclosure.

[0044] Figure 4 This is a schematic diagram of the installation state of a filter according to one embodiment of the present disclosure.

[0045] Figure 5 This is a schematic diagram of the connection relationship between the adapter bar and the capacitor according to one embodiment of this disclosure.

[0046] Figure 6 This is a schematic diagram of the structure of a heat dissipation copper busbar according to one embodiment of the present disclosure.

[0047] Explanation of reference numerals in the attached figures 1. Connecting busbar; 11. Connecting part; 12. Positive busbar; 13. Negative busbar; 21. First magnetic ring; 22. Second magnetic ring; 3. Capacitor; 31. First capacitor; 32. Second capacitor; 4. Copper heat dissipation busbar; 41. Plate body; 42. Heat absorption part; 421. First heat absorption element; 422. Second heat absorption element; 423. Connector; 44. Mounting part. 5. Base; 6. Lead wire; 61. First lead wire; 62. Second lead wire; 63. Third lead wire; 64. Fourth lead wire; 7. Transition sub-bar; 71. Positive sub-bar; 72. Negative sub-bar; 8. Outer shell; 81. First receiving cavity; 82. Second receiving cavity; 9. Step-up copper busbar. Detailed Implementation

[0048] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0049] In this disclosure, unless otherwise stated, directional terms such as "upper" and "lower" are generally defined by the orientation of the accompanying drawings, and "inner" and "outer" refer to the inner and outer parts of the relevant components. Furthermore, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0050] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can be a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0051] There are many types of filters, and LC filters are the most commonly used. They are composed of an inductor (L) and a capacitor (C). They utilize the difference in impedance characteristics of inductors and capacitors for signals of different frequencies to achieve selective filtering of signal frequencies.

[0052] In related technologies, filters are mainly used to reduce common-mode noise, but they cannot filter differential-mode noise, which limits their application scenarios. Especially in high-voltage DC systems, both differential-mode and common-mode noise exist, making the suppression of these two types of noise paramount. Currently, integrated magnetic rings are used to suppress both differential-mode and common-mode noise. However, to meet the relevant performance requirements, the size of the magnetic ring and the copper busbar need to be relatively large, resulting in excessive costs and space requirements, thus limiting application scenarios.

[0053] Therefore, such as Figures 1-6 As shown, one aspect of this disclosure provides a filter, including a connecting busbar 1, a first magnetic ring 21, a second magnetic ring 22, and a capacitor 3.

[0054] The connecting busbar 1 is used for electrical conduction with external electronic components. The first magnetic ring 21 is sleeved on part of the connecting busbar 1, the second magnetic ring 22 is sleeved on part of the connecting busbar 1, and the capacitor 3 can be electrically connected to the connecting busbar 1.

[0055] The first magnetic ring 21 and the second magnetic ring 22 are spaced apart in the extension direction of the busbar 1. The first magnetic ring 21 is a common-mode magnetic ring and can cooperate with the capacitor 3 to form a common-mode filter circuit. The second magnetic ring 22 is a differential-mode magnetic ring and can cooperate with the capacitor 3 to form a differential-mode filter circuit.

[0056] In the above technical solution, the first magnetic ring 21 is a common-mode magnetic ring, which can work with the capacitor 3 to suppress common-mode noise. The second magnetic ring 22 is a differential-mode magnetic ring, which can work with the capacitor 3 to suppress differential-mode noise. This achieves simultaneous suppression of both common-mode and differential-mode noise, broadening the suppression bandwidth and allowing application in high-voltage DC systems. This expands the filter's application scenarios, meets the needs of different applications, and improves filtering performance. Furthermore, by designing the first magnetic ring 21 and the second magnetic ring 22 as independent, separate units, the measurement of differential-mode inductance and impedance is decoupled from the measurement of common-mode inductance and impedance. They do not interfere with each other, facilitating the determination of whether the failure is due to the first magnetic ring 21 or the second magnetic ring 22 in failure analysis.

[0057] Optionally, in one embodiment of this disclosure, the connecting busbar 1 includes a positive busbar 12 and a negative busbar 13, and the number of second magnetic rings 22 is set to two, with the two second magnetic rings 22 respectively fitted onto the positive busbar 12 and the negative busbar 13. This arrangement allows for the separate placement of the second magnetic rings 22, facilitating the suppression of differential-mode noise. In some examples, the second magnetic rings 22 are nanocrystalline magnetic rings, thus allowing for the placement of one second magnetic ring 22 on each of the positive busbar 12 and the negative busbar 13, without increasing the size of the second magnetic rings 22, while still meeting the bandwidth requirements for differential-mode noise suppression. The first magnetic ring 21 is also a nanocrystalline magnetic ring.

[0058] Optionally, in one embodiment of this disclosure, the connecting busbar 1 includes a first arm and a second arm, with one end of the first arm and one end of the second arm connected together in an "L" shape. A first magnetic ring 21 is sleeved on the first arm, and a second magnetic ring 22 is sleeved on the second arm. This arrangement allows for the separate placement of the first magnetic ring 21 and the second magnetic ring 22, while also improving structural compactness, reducing the overall structural size, and minimizing excessive space occupation.

[0059] Optionally, in one embodiment of this disclosure, the filter further includes a housing 8, with a first magnetic ring 21, a second magnetic ring 22, a connecting busbar 1, and a capacitor 3 all connected to the housing 8. The housing 8 covers a portion of the connecting busbar 1. The housing 8 is provided with a first receiving cavity 81 and a second receiving cavity 82. The connecting busbar 1 passes through the first receiving cavity 81 and the second receiving cavity 82. A first adhesive portion is provided in the first receiving cavity 81. The first magnetic ring 21 is disposed in the first receiving cavity 81 and connected to the first adhesive portion. A second adhesive portion is provided in the second receiving cavity 82. The second magnetic ring 22 is disposed in the second receiving cavity 82 and connected to the second adhesive portion. The first magnetic ring 21 and the second magnetic ring 22 are respectively fixed to the first receiving cavity 81 and the second receiving cavity 82 by potting compound.

[0060] The connecting busbar 1 is encased in the outer shell 8, which provides protection and insulation. The outer shell 8 can be made of plastic and is injection molded onto the connecting busbar 1. A portion of the connecting busbar 1 extends beyond the outer shell 8, enabling electrical connection and ensuring electrical conductivity.

[0061] The first receiving cavity 81 can accommodate the first magnetic ring 21. It is understood that the first magnetic ring 21 is fitted onto the connecting busbar 1 and placed within the first receiving cavity 81. By injecting potting compound into the first receiving cavity 81, and after the potting compound cures, the first magnetic ring 21 can be fixed and an insulating effect can be achieved. In some examples, the first receiving cavity 81 can be a groove, through which potting compound can be injected, and the first magnetic ring 21 can also be inserted into the groove through its opening.

[0062] The second receiving cavity 82 can accommodate the second magnetic ring 22. It is understood that the second magnetic ring 22 is fitted onto the connecting busbar 1 and placed within the second receiving cavity 82. By injecting potting compound into the second receiving cavity 82, and after the potting compound cures, the second magnetic ring 22 can be fixed and an insulating effect can be achieved. In some examples, the second receiving cavity 82 can be a groove, through which potting compound can be injected, and the second magnetic ring 22 can also be inserted into the groove through the groove opening. In some examples, the potting compound can be silicone.

[0063] Optionally, in one embodiment of this disclosure, the filter further includes a housing 8 and a boost copper busbar 9, the boost copper busbar 9 being connected to the housing 8. By using the boost copper busbar 9, a large current can be supplied to charge the battery pack via the boost charging mode, thereby improving integration.

[0064] Optionally, in one embodiment of this disclosure, the outer casing 8 is provided with an assembly part, and the outer casing 8 is connected to the base 5 through the assembly part. The assembly part allows the outer casing 8 and the base 5 to be connected and fixed together. It should be noted that the specific structure of the base 5 can be configured as needed; this is a simplified schematic structure.

[0065] The assembly section includes an assembly hole and a bushing. The bushing is disposed within the assembly hole, and the housing 8 can be connected to the base 5 via a fastener passing through the bushing and the assembly hole. The fastener passing through the bushing enables the connection to the base 5. In some examples, the fastener can be an M4 screw, and a threaded hole can be provided on the base 5. After the M4 screw passes through the bushing and the assembly hole, it is threaded into the threaded hole, thereby connecting and fixing the housing 8 to the base 5.

[0066] Optionally, in one embodiment of this disclosure, the filter further includes a heat dissipation copper busbar 4. A portion of the heat dissipation copper busbar 4 is disposed between the capacitor 3 and the first magnetic ring 21, so that the heat from the capacitor 3 and the first magnetic ring 21 can be transferred to the heat dissipation copper busbar 4. The heat dissipation copper busbar 4 effectively increases the heat dissipation area, thereby improving the heat dissipation effect. The placement of a portion of the heat dissipation copper busbar 4 between the capacitor 3 and the first magnetic ring 21 allows the heat from the capacitor 3 and the first magnetic ring 21 to be transferred to the heat dissipation copper busbar 4, and then the heat is dissipated through the heat transfer of the heat dissipation copper busbar 4, thereby reducing the temperature of the environment around the capacitor 3 and the first magnetic ring 21, achieving a heat dissipation effect. This allows for targeted heat dissipation of the capacitor 3 and the first magnetic ring 21, improving the reliability of the capacitor 3 and the filter. Furthermore, the portion of the heat dissipation copper busbar 4 between the capacitor 3 and the first magnetic ring 21 also provides thermal insulation for the capacitor 3 and the first magnetic ring 21, preventing the heat from the capacitor 3 and the first magnetic ring 21 from affecting each other. This filter can handle the "noise" caused by ripple current under high current and high heat source conditions, and can also effectively dissipate heat, ensuring the stability and service life of the filter.

[0067] Optionally, in one embodiment of this disclosure, another part of the heat dissipation copper busbar 4 is disposed on one side of the capacitor 3, and in a direction perpendicular to the heat dissipation copper busbar 4, the projection of the capacitor 3 falls on the other part of the heat dissipation copper busbar 4, so that at least part of the heat of the capacitor 3 can be transferred to the heat dissipation copper busbar 4.

[0068] It is understandable that capacitor 3 and another part of the heat sink 4 are also positioned opposite each other. This relative positioning allows the heat from capacitor 3 to be directly transferred to the heat sink 4, increasing the area over which heat is transferred from capacitor 3 to the heat sink 4, thus improving the heat dissipation effect of capacitor 3. Therefore, some of the heat from capacitor 3 can be transferred to the heat sink 4 via one part of the heat sink 4, and some heat can be transferred to the heat sink 4 via the other part, achieving two heat transfer paths and thus improving the heat dissipation effect.

[0069] It should be noted that the projection perpendicular to the heat sink 4 means that the projection of capacitor 3 falls on the heat sink 4 along the direction perpendicular to its surface. In other words, the projection of capacitor 3 at least partially overlaps with the heat sink 4, thus ensuring that heat is transferred from capacitor 3 to the heat sink 4. The projection of capacitor 3 falling on the heat sink 4 can be either completely or partially overlapping. In some examples, capacitor 3 is located above or below another part of the heat sink 4, and vertically, capacitor 3 is directly opposite this other part of the heat sink 4.

[0070] Optionally, in one embodiment of this disclosure, the heat dissipation copper busbar 4 includes a plate 41 and a heat-absorbing part 42, the heat-absorbing part 42 being connected to the plate 41, at least a portion of the heat-absorbing part 42 being disposed between the capacitor 3 and the first magnetic ring 21, and the plate 41 being disposed on one side of the capacitor 3. A portion of the heat from the capacitor 3 is transferred to the plate 41 through the heat-absorbing part 42, while another portion of the heat from the capacitor 3 is directly transferred to the plate 41.

[0071] The plate 41 serves as the main structure and is used for heat conduction. The area of ​​the plate 41 can be set relatively large to facilitate heat transfer. The heat transfer rate is directly proportional to the heat dissipation area; as the area of ​​the plate 41 increases, the heat transfer rate also increases, thus accelerating heat transfer and improving the heat dissipation effect. The plate 41 is positioned on one side of the capacitor 3, allowing the heat from the capacitor 3 to be directly transferred to the plate 41, and then dissipated outwards through the plate 41, achieving heat dissipation.

[0072] The heat-absorbing part 42 is at least partially located between the capacitor 3 and the first magnetic ring 21, and is capable of absorbing heat. This allows the heat from the capacitor 3 and the first magnetic ring 21 to be transferred to the heat-absorbing part 42, and then to the plate 41, where it is dissipated outwards, thus achieving heat dissipation. In some examples, the heat-absorbing part 42 is integrally formed with the plate 41.

[0073] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 is connected to the edge of the plate 41, close to the capacitor 3, and spaced apart from the capacitor 3. This arrangement allows the heat-absorbing part 42 to extend between the capacitor 3 and the first magnetic ring 21. The position of the heat-absorbing part 42 at the edge ensures that the plate 41 does not affect the arrangement of the capacitor 3 or the first magnetic ring 21. Furthermore, the spaced arrangement of the heat-absorbing part 42 with the capacitor 3 and the first magnetic ring 21 does not affect the function of the capacitor 3 and the first magnetic ring 21, nor does it affect the connection between the outer casing 8 and the heat-absorbing part 42, the capacitor 3, and the first magnetic ring 21. One end of the heat-absorbing part 42 is connected to the side of the edge of the plate 41, thereby positioning the capacitor 3 close to the edge of the plate 41, allowing the capacitor 3 to transfer heat to the heat-absorbing part 42 and the plate 41.

[0074] Optionally, in one embodiment of this disclosure, the projection of the capacitor 3 is set as a first projection in the direction perpendicular to the plate 41, and the projection of the plate 41 is set as a second projection, wherein the ratio of the area of ​​the second projection to the area of ​​the first projection is greater than or equal to 2. This arrangement increases the heat-conducting area of ​​the plate 41, thereby improving the heat conduction of the plate 41 and ultimately enhancing the heat dissipation effect.

[0075] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 includes a first heat-absorbing element 421 and a second heat-absorbing element 422, and the capacitor 3 includes a first capacitor 31 and a second capacitor 32. The first heat-absorbing element 421 corresponds to the first capacitor 31, and the second heat-absorbing element 422 corresponds to the second capacitor 32.

[0076] The first heat-absorbing element 421 corresponds to the first capacitor 31, allowing heat from the first capacitor 31 to be transferred to the first heat-absorbing element 421, and then to the plate 41. The first heat-absorbing element 421 is positioned between the first capacitor 31 and the first magnetic ring 21, with the two elements spaced apart. The second heat-absorbing element 422 corresponds to the second capacitor 32, allowing heat from the second capacitor 32 to be transferred to the second heat-absorbing element 422, and then to the plate 41. This arrangement provides two heat transfer paths, enabling heat dissipation for both the first capacitor 31 and the second capacitor 32, ensuring effective heat dissipation for different capacitors 3. Both the first capacitor 31 and the second capacitor 32 are safety capacitors 3; the first capacitor 31 can be an X-type capacitor 3, and the second capacitor 32 can be a Y-type capacitor 3. It should be noted that the capacitance values ​​of the first capacitor 31 and the second capacitor 32 can be set as needed, without further restrictions. Therefore, the first magnetic ring 21 can cooperate with the second capacitor 32 to form a common-mode filter circuit, and the second magnetic ring 22 can cooperate with the first capacitor 31 to form a differential-mode filter circuit.

[0077] Optionally, in one embodiment of this disclosure, the first heat-absorbing element 421 is configured as a plate, the first heat-absorbing element 421 is angled to the plate body 41, one side of the first capacitor 31 faces the first heat-absorbing element 421, and the other side of the first capacitor 31 faces the plate body 41.

[0078] The first heat-absorbing element 421 is designed as a plate, which occupies little space and allows it to easily extend between the first magnetic ring 21 and the first capacitor 31, avoiding interference with them. This also facilitates spatial arrangement and avoids excessive space occupation. Furthermore, the plate shape of the first heat-absorbing element 421 allows one side to face the first capacitor 31 and the other side to face the first magnetic ring 21, creating a face-to-face arrangement. This increases the heat absorption area, facilitating the transfer of heat from the first capacitor 31 and the first magnetic ring 21 to the first heat-absorbing element 421, resulting in better heat dissipation.

[0079] In this design, the first heat-absorbing element 421 is angled to the plate 41, allowing the first capacitor 31 to be positioned between the first heat-absorbing element 421 and the plate 41. This allows the first capacitor 31 to face both the first heat-absorbing element 421 and the plate 41, enabling heat transfer to both elements and increasing the heat transfer area, thus improving heat dissipation. In some examples, the angle between the first heat-absorbing element 421 and the plate 41 is 90°, and the first heat-absorbing element 421 is perpendicular to the plate 41. Of course, in other examples, the angle between the first heat-absorbing element 421 and the plate 41 can be other angles.

[0080] Optionally, in another embodiment of this disclosure, the first heat absorber 421 is configured as fins, and the first heat absorber 421 is angled to the plate 41. One side of the first capacitor 31 faces the first heat absorber 421, and the other side of the first capacitor 31 faces the plate 41. By configuring the first heat absorber 421 as fins, the heat transfer area can be increased, heat transfer can be improved, and thus the heat dissipation effect can be improved.

[0081] Optionally, in one embodiment of this disclosure, the second heat-absorbing element 422 includes a pin, one end of which is connected to the plate 41, and the other end of which is provided with a connector 423. The second capacitor 32 is provided with a fourth lead 64, which is connected to the connector 423. One side of the second capacitor 32 faces the plate 41.

[0082] The pins are extended structures and can be integrally formed with the board body 41. These pins facilitate the connection of the second capacitor 32 to the pin connector 423 via the fourth lead 64, enabling electrical conduction. Furthermore, heat from the second capacitor 32 can be transferred to the pins via the fourth lead 64, and then to the board body 41, thus achieving heat transfer. Heat from electronic components connected to the second capacitor 32 can be transferred to the second capacitor 32, and then to the board body 41, thereby dissipating heat. In some examples, the pins are connected to the side edge of the board body 41 to facilitate the placement of the second capacitor 32. The pins are angled relative to the board body 41, with the angle between the pins and the board body 41 being 90°, and the pins are perpendicular to the board body 41. Of course, in other examples, the angle between the pins and the board body 41 can be other angles.

[0083] In addition, one side of the second capacitor 32 faces the board 41, allowing the heat from the second capacitor 32 to be directly transferred to the board 41 for heat dissipation. Thus, the second capacitor 32 can achieve heat transfer through two paths: the heat from the second capacitor 32 can be transferred to the board 41 through the fourth lead 64 and the pins, or it can be transferred directly to the board 41.

[0084] In some examples, connector 423 may be a groove formed at the end of the pin away from the plate 41, so that the pin forms a "harpoon"-like structure, which can facilitate the fixing of the fourth lead 64, so that the fourth lead 64 can be soldered to the pin.

[0085] Optionally, in one embodiment of this disclosure, the heat dissipation copper busbar 4 is provided with a mounting part 44 for connection to the base 5. The heat dissipation copper busbar 4 is used to transfer heat to the base 5 and is grounded through the base 5. Grounding through the base 5 facilitates heat dissipation, thereby achieving a heat dissipation function. This allows the heat dissipation copper busbar 4 to integrate multiple functions such as heat dissipation, grounding, electrical conduction, and installation, thereby reducing the arrangement of related components and saving costs.

[0086] In some examples, the mounting part 44 can be a through hole formed on the plate 41 of the heat dissipation copper busbar 4. A threaded post is provided on the base 5, and a threaded hole is provided inside the threaded post. The threaded hole communicates with the through hole, allowing a screw to pass through the through hole and engage with the threaded hole, thus mounting the heat dissipation copper busbar 4 on the base 5 for grounding and heat transfer. In other examples, the mounting part 44 can be a welding head, which can be welded to the base 5 for fixation.

[0087] Optionally, in one embodiment of this disclosure, the connecting busbar 1 is provided with a connecting portion 11, and the capacitor 3 is provided with a lead 6, which is connected to the connecting portion 11. This enables electrical conduction between the connecting busbar 1 and the capacitor 3, and the heat from the connecting busbar 1 can be transferred to the capacitor 3 via the lead 6, and then to the heat dissipation copper busbar 4 via the capacitor 3, thus achieving heat dissipation for the connecting busbar 1. In some examples, the connecting busbar 1 is provided with a cantilevered extension, and the connecting portion 11 is connected to the cantilevered extension, thereby accommodating the positions of the first capacitor 31 and the second capacitor 32, facilitating the connection of the first capacitor 31 and the second capacitor 32 to the connecting portion 11 via the lead 6.

[0088] The capacitor 3 includes a first capacitor 31 and a second capacitor 32. The connecting busbar 1 includes a positive busbar 12 and a negative busbar 13. The lead wire 6 includes a first lead wire 61, a second lead wire 62, a third lead wire 63 and a fourth lead wire 64.

[0089] One end of the first lead 61 and the second lead 62 are connected to the first capacitor 31, and the other end of the first lead 61 is connected to the connection part 11 of the positive busbar 12. The other end of the second lead 62 is connected to the connection part 11 of the negative busbar 13. Through the first lead 61 and the second lead 62, the positive busbar 12 and the negative busbar 13 are electrically connected to the first capacitor 31. At the same time, the heat from the positive busbar 12 and the negative busbar 13 can also be transferred to the first capacitor 31 through the first lead 61 and the second lead 62, and then transferred to the heat dissipation copper busbar 4 through the first capacitor 31.

[0090] The number of second capacitors 32 is at least two. Each second capacitor 32 is provided with a third lead 63 and a fourth lead 64. The third lead 63 of at least one second capacitor 32 is connected to the positive busbar 12, the third lead 63 of at least one second capacitor 32 is connected to the negative busbar 13, and the fourth lead 64 of each second capacitor 32 is connected to the heat dissipation copper busbar 4.

[0091] The system utilizes the third lead 63 and the fourth lead 64 to electrically connect the positive busbar 12 and the negative busbar 13 to the two second capacitors 32, respectively. Then, the two second capacitors 32 are electrically connected to the heat dissipation copper busbar 4 to achieve grounding. The heat from the positive busbar 12 and the negative busbar 13 can also be transferred to the second capacitors 32 through the third lead 63, and then to the heat dissipation copper busbar 4 through the second capacitors 32 and the fourth lead 64, thus achieving heat dissipation.

[0092] Therefore, the heat transfer path between the positive busbar 12 and the negative busbar 13 can be transferred to the first capacitor 31 via the first lead 61 and the second lead 62, and then to the heat dissipation copper busbar 4 via the first capacitor 31. Alternatively, it can be transferred to the second capacitor 32 via the third lead 63, and then to the heat dissipation copper busbar 4 via the second capacitor 32 and the fourth lead 64. Since the first magnetic ring 21 is fitted onto the positive busbar 12 and the negative busbar 13, the heat from the first magnetic ring 21 can also be transferred to the positive busbar 12 and the negative busbar 13, and then to the heat dissipation copper busbar 4 via the aforementioned heat transfer path. Furthermore, the heat from the first magnetic ring 21 can also be directly transferred to the first heat-absorbing element 421, and then to the plate 41 via the first heat-absorbing element 421.

[0093] Optionally, in one embodiment of this disclosure, the filter further includes an adapter sub-bar 7, which is integrally formed or welded to the connecting busbar 1. Electrical connection with different components can be achieved through the connecting busbar 1 and the adapter sub-bar 7, and relevant components can be arranged as needed.

[0094] Optionally, in one embodiment of this disclosure, the adapter sub-bus 7 is provided with a connecting part 11, and the capacitor 3 is provided with a lead 6, which is connected to the connecting part 11. This enables electrical conduction between the adapter sub-bus 7 and the capacitor 3. Heat from the adapter sub-bus 7 can also be transferred to the capacitor 3 via the lead 6, and then to the heat dissipation copper busbar 4 via the capacitor 3, thus dissipating heat from the adapter sub-bus 7. Heat from the connecting busbar 1 can also be transferred to the adapter sub-bus 7, thus dissipating heat from the connecting busbar 1.

[0095] The capacitor 3 includes a first capacitor 31 and a second capacitor 32, the adapter bar 7 includes a positive electrode bar 71 and a negative electrode bar 72, and the lead 6 includes a first lead 61, a second lead 62, a third lead 63 and a fourth lead 64.

[0096] One end of the first lead 61 and the second lead 62 are connected to the first capacitor 31, and the other end of the first lead 61 is connected to the connection part 11 of the positive electrode sub-array 71. The other end of the second lead 62 is connected to the connection part 11 of the negative electrode sub-array 72. Through the first lead 61 and the second lead 62, the positive electrode sub-array 71 and the negative electrode sub-array 72 are electrically connected to the first capacitor 31. At the same time, the heat from the positive electrode sub-array 71 and the negative electrode sub-array 72 can also be transferred to the first capacitor 31 through the first lead 61 and the second lead 62, and then transferred to the heat dissipation copper busbar 4 through the first capacitor 31.

[0097] The number of second capacitors 32 is at least two. Each second capacitor 32 is provided with a third lead 63 and a fourth lead 64. The third lead 63 of at least one second capacitor 32 is connected to the positive electrode sub-bar 71, the third lead 63 of at least one second capacitor 32 is connected to the negative electrode sub-bar 72, and the fourth lead 64 of each second capacitor 32 is connected to the heat dissipation copper busbar 4.

[0098] The third lead 63 and the fourth lead 64 connect the positive sub-branch 71 and the negative sub-branch 72 to the two second capacitors 32, respectively. The two second capacitors 32 are then connected to the heat dissipation copper busbar 4 for grounding. Heat from the positive and negative sub-branch 71 and 72 is transferred to the second capacitors 32 via the third lead 63, and then to the heat dissipation copper busbar 4 via the second capacitors 32 and the fourth lead 64, thus achieving heat dissipation. Heat from the connecting busbar 1 is transferred to the adapter sub-branch 7, achieving heat dissipation for the connecting busbar 1. In some examples, the connecting part 11 can be a harpoon-like structure, which facilitates the fixing of the first lead 61, the second lead 62, the third lead 63, and the fourth lead 64.

[0099] Therefore, the heat transfer path between the positive terminal busbar 71 and the negative terminal busbar 72 can be transferred to the first capacitor 31 via the first lead 61 and the second lead 62, and then to the heat dissipation copper busbar 4 via the first capacitor 31. Alternatively, it can be transferred to the second capacitor 32 via the third lead 63, and then to the heat dissipation copper busbar 4 via the second capacitor 32 and the fourth lead 64. Since the first magnetic ring 21 and the second magnetic ring 22 are fitted onto the positive terminal busbar 12 and the negative terminal busbar 13, the heat from the first magnetic ring 21 and the second magnetic ring 22 can also be transferred to the positive terminal busbar 12 and the negative terminal busbar 13, and then to the heat dissipation copper busbar 4 via the aforementioned heat transfer path.

[0100] This filter can be applied to on-board chargers and DC-DC converters for new energy vehicles, as well as to solar inverters and wind power generation systems, industrial high-voltage DC power supplies, communication base station power supplies, and so on.

[0101] The second aspect of this disclosure also provides an inverter including the aforementioned filter. This inverter decouples the measurement of differential-mode inductance and impedance from the measurement of common-mode inductance and impedance, preventing interference between the two. This facilitates fault analysis in determining whether the failure is due to the first magnetic ring 21 or the second magnetic ring 22. It also enables targeted heat dissipation of capacitor 3, thereby improving the overall reliability and lifespan of the inverter. This inverter is suitable for high power density and can handle the "noise" effect caused by ripple current under high current and high heat sources, while effectively dissipating heat to maintain inverter stability and extend its lifespan.

[0102] A third aspect of this disclosure also provides a vehicle including the aforementioned filter or inverter. This improves vehicle reliability and reduces the probability of malfunctions.

[0103] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0104] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0105] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A filter, characterized in that, include: A connecting busbar, which is used for electrical connection with external electronic components; A first magnetic ring is sleeved on a portion of the connecting busbar; A second magnetic ring is sleeved on a portion of the connecting busbar; A capacitor, wherein the capacitor is electrically connected to the connecting busbar; The first magnetic ring and the second magnetic ring are spaced apart in the extension direction of the connecting busbar. The first magnetic ring is a common-mode magnetic ring, which can cooperate with the capacitor to form a common-mode filter circuit. The second magnetic ring is a differential-mode magnetic ring, which can cooperate with the capacitor to form a differential-mode filter circuit. The connecting busbar includes a positive busbar and a negative busbar, and the number of the second magnetic rings is set to two, with the two second magnetic rings respectively sleeved on the positive busbar and the negative busbar.

2. The filter according to claim 1, characterized in that, The connecting busbar includes a first arm and a second arm. One end of the first arm and one end of the second arm are connected and form an "L" shape. The first magnetic ring is sleeved on the first arm and the second magnetic ring is sleeved on the second arm.

3. The filter according to claim 1, characterized in that, The filter further includes a housing, to which the first magnetic ring, the second magnetic ring, the connecting busbar, and the capacitor are all connected. The housing covers a portion of the connecting busbar. The housing has a first receiving cavity and a second receiving cavity. The connecting busbar passes through the first receiving cavity and the second receiving cavity. A first adhesive portion is provided in the first receiving cavity. The first magnetic ring is disposed in the first receiving cavity and connected to the first adhesive portion. A second adhesive portion is provided in the second receiving cavity. The second magnetic ring is disposed in the second receiving cavity and connected to the second adhesive portion. The first magnetic ring and the second magnetic ring are respectively fixed to the first receiving cavity and the second receiving cavity by potting compound.

4. The filter according to claim 1, characterized in that, The filter also includes a housing and a boost copper busbar connected to the housing.

5. The filter according to claim 3, characterized in that, The outer shell is provided with an assembly part, and the outer shell is connected to the base through the assembly part; The assembly part includes an assembly hole and a bushing. The bushing is disposed in the assembly hole, and the housing can be connected to the base by fasteners passing through the bushing and the assembly hole.

6. The filter according to any one of claims 1-5, characterized in that, The filter further includes a heat dissipation copper busbar, a portion of which is disposed between the capacitor and the first magnetic ring, so that the heat from the capacitor and the first magnetic ring is transferred to the heat dissipation copper busbar.

7. The filter according to claim 6, characterized in that, Another part of the heat dissipation copper busbar is disposed on one side of the capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the capacitor falls on the other part of the heat dissipation copper busbar, so that at least part of the heat of the capacitor can be transferred to the heat dissipation copper busbar.

8. The filter according to claim 7, characterized in that, The heat dissipation copper busbar includes a plate and a heat absorption part. The heat absorption part is connected to the plate. At least a portion of the heat absorption part is disposed between the capacitor and the first magnetic ring. The plate is disposed on one side of the capacitor.

9. The filter according to claim 8, characterized in that, The heat-absorbing part is connected to the edge of the plate, and the heat-absorbing part is close to the capacitor and spaced apart from the capacitor.

10. The filter according to claim 8, characterized in that, The heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the capacitor includes a first capacitor and a second capacitor. The first heat-absorbing element corresponds to the first capacitor, and the second heat-absorbing element corresponds to the second capacitor.

11. The filter according to claim 10, characterized in that, The first heat-absorbing element is plate-shaped and is angled to the plate. One side of the first capacitor faces the first heat-absorbing element, and the other side of the first capacitor faces the plate.

12. The filter according to claim 10, characterized in that, The second heat-absorbing element includes a pin, one end of which is connected to the plate body, and the other end of which is provided with a connector. The second capacitor is provided with a fourth lead, which is connected to the connector. One side of the second capacitor faces the plate body.

13. The filter according to claim 6, characterized in that, The heat dissipation copper busbar is provided with a mounting part for connecting to the base. The heat dissipation copper busbar is used to transfer heat to the base and is grounded through the base.

14. The filter according to claim 6, characterized in that, The connecting busbar is provided with a connecting part, and the capacitor is provided with a lead wire, which is connected to the connecting part; The capacitor includes a first capacitor and a second capacitor, the connecting busbar includes a positive busbar and a negative busbar, and the lead includes a first lead, a second lead, a third lead and a fourth lead; One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive busbar, and the other end of the second lead is connected to the connection part of the negative busbar. The number of the second capacitors is at least two, each of the second capacitors is provided with the third lead and the fourth lead, the third lead of at least one second capacitor is connected to the positive busbar, the third lead of at least one second capacitor is connected to the negative busbar, and the fourth lead of each second capacitor is connected to the heat dissipation copper busbar.

15. The filter according to any one of claims 1-5, characterized in that, The filter also includes an adapter sub-bar, which is integrally formed or welded to the connecting busbar.

16. The filter according to claim 15, characterized in that, The adapter sub-bar is provided with a connecting part, and the capacitor is provided with a lead wire, which is connected to the connecting part; The capacitor includes a first capacitor and a second capacitor, the adapter sub-bar includes a positive sub-bar and a negative sub-bar, and the lead includes a first lead, a second lead, a third lead and a fourth lead; One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive electrode sub-array, and the other end of the second lead is connected to the connection part of the negative electrode sub-array. The number of the second capacitors is at least two, and each second capacitor is provided with the third lead and the fourth lead. The third lead of at least one second capacitor is connected to the positive sub-array, and the third lead of at least one second capacitor is connected to the negative sub-array.

17. An inverter, characterized in that, Includes the filter as described in any one of claims 1-16.

18. A vehicle, characterized in that, Includes the filter as described in any one of claims 1-16, or the inverter as described in claim 17.

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