Filter, inverter and vehicle

Abstract

The invention relates to a filter, an inverter and a vehicle, the filter comprises a connecting busbar, a magnetic ring and a capacitor, the connecting busbar is used for being electrically connected with an external electronic element, the magnetic ring sleeves part of the connecting busbar, the capacitor can be electrically connected with the connecting busbar, the capacitor comprises a first capacitor and a second capacitor, and the first capacitor and the second capacitor are electrically connected. The first capacitor can be matched with the magnetic ring to form a first differential-mode filter circuit, the second capacitor can be matched with the magnetic ring to form a second differential-mode filter circuit, and the frequency of differential-mode noise suppressed by the first differential-mode filter circuit is different from that of differential-mode noise suppressed by the second differential-mode filter circuit. According to the filter, the first capacitor and the second capacitor are arranged, the frequencies of suppressed noise are different, and a multi-stage and broadband noise absorption network is formed, so that the noise of different frequencies can be suppressed, the frequency of suppressing the noise can be widened, and applicable scenes can be increased.

Description

Technical Field

[0001] This disclosure relates to the field of vehicle manufacturing technology, and more particularly to a filter, an inverter, and a vehicle. Background Technology

[0002] In related technologies, filters cannot effectively suppress both high-frequency differential-mode noise and low-frequency differential-mode noise simultaneously in high-voltage DC applications, thus failing to meet usage requirements. Summary of the Invention

[0003] The purpose of this disclosure is to provide a filter, an inverter, and a vehicle to solve the problems in the aforementioned related technologies.

[0004] To achieve the above objectives, one aspect of this disclosure provides a filter comprising: A connecting busbar, which is used for electrical connection with external electronic components; Magnetic ring, the magnetic ring being sleeved on a portion of the connecting busbar A capacitor, wherein the capacitor is electrically connected to the connecting busbar; The capacitor includes a first capacitor and a second capacitor. The first capacitor can cooperate with the magnetic ring to form a first differential mode filter circuit, and the second capacitor can cooperate with the magnetic ring to form a second differential mode filter circuit. The frequency of differential mode noise suppressed by the first differential mode filter circuit and the frequency of differential mode noise suppressed by the second differential mode filter circuit are different. The first differential mode filter circuit is used to suppress intermediate frequency differential mode noise and high frequency differential mode noise, and the second differential mode filter circuit is used to suppress intermediate frequency differential mode noise and low frequency differential mode noise.

[0005] In the above technical solution, by setting two types of capacitors, namely the first capacitor and the second capacitor, which are respectively used in conjunction with the magnetic ring to form a differential mode filter circuit, noise suppression is achieved. Since the suppressed noise frequencies are different, a multi-level, wide-band noise absorption network is formed. This allows for the suppression of noise at different frequencies, which can broaden the frequency range of noise suppression and increase the applicable scenarios, especially in high-voltage DC system scenarios. This avoids the problems of large size and high cost that occur when using a single type of capacitor in order to broaden the coverage frequency band.

[0006] In some possible implementations, the first capacitor is configured as a surface-mount capacitor; The filter also includes a circuit board, the first capacitor is connected to the circuit board and electrically conductive, and the circuit board is electrically conductive to the connecting busbar.

[0007] With this setup, the surface-mount capacitor is small in size and does not take up too much space. It can suppress mid-frequency differential mode noise and high-frequency differential mode noise, while the circuit board can accommodate the installation of the first capacitor.

[0008] In some possible implementations, the filter further includes a housing, to which the magnetic ring, the connecting busbar, and the second capacitor are all connected, and the housing covers a portion of the connecting busbar; The circuit board is provided with a positioning part, which is connected to the housing for mounting and positioning the circuit board relative to the housing.

[0009] This design facilitates the positioning and assembly of the circuit board and the casing, ensuring electrical continuity between the circuit board and the connecting busbar.

[0010] In some possible implementations, the filter further includes an adapter sub-bar connected to the circuit board and to the connection busbar; The adapter sub-bar and the connecting busbar are integrally formed or welded together.

[0011] This configuration facilitates electrical connection with the connecting busbar, and the transition busbar provides support for the circuit board.

[0012] In some possible implementations, the second capacitor is configured as a leaded capacitor, the connecting busbar is provided with a connecting portion, the second capacitor is provided with a first lead and a second lead, and the first lead and the second lead are respectively connected to the connecting portion; The connecting busbar includes a positive busbar and a negative busbar. One end of the first lead and the second lead are connected to the second capacitor. The other end of the first lead is connected to the connection part of the positive busbar, and the other end of the second lead is connected to the connection part of the negative busbar.

[0013] With this configuration, leaded capacitors are low-cost, provide a robust connection, and can suppress low- to mid-frequency noise.

[0014] In some possible implementations, the second capacitor is configured as a leaded capacitor, the filter further includes an adapter sub-bar connected to the connecting busbar, the adapter sub-bar is provided with a connecting portion, and the second capacitor is provided with a first lead and a second lead, the first lead and the second lead being respectively connected to the connecting portion; The adapter sub-bar includes a positive sub-bar and a negative sub-bar. One end of the first lead and the second lead are connected to the second capacitor. The other end of the first lead is connected to the connection part of the positive sub-bar, and the other end of the second lead is connected to the connection part of the negative sub-bar.

[0015] By connecting the second capacitor to the adapter sub-bus, the structure of the connection busbar can be simplified, manufacturing difficulty can be reduced, and manufacturing costs can be lowered.

[0016] In some possible implementations, the filter further includes a third capacitor that is electrically connected to the connecting busbar and grounded, and the third capacitor can cooperate with the magnetic ring to form a common-mode filter circuit.

[0017] By setting it up in this way, common-mode noise is suppressed, thereby achieving the simultaneous suppression of both common-mode and differential-mode noise. This expands the application scenarios of the filter, meets the needs of different application scenarios, and improves the filtering effect.

[0018] In some possible implementations, the third capacitor is configured as a leaded capacitor, the connecting busbar is provided with a connecting portion, the third capacitor is provided with a third lead and a fourth lead, the third lead is connected to the connecting portion, and the fourth lead is used for grounding; The connecting busbar includes a positive busbar and a negative busbar. The number of third capacitors is at least two. Each third capacitor is provided with a third lead and a fourth lead. The third lead of at least one third capacitor is connected to the positive busbar, and the third lead of at least one third capacitor is connected to the negative busbar.

[0019] With this setup, leaded capacitors are low-cost, provide a robust connection, and can suppress common-mode noise through grounding.

[0020] In some possible implementations, the third capacitor is configured as a leaded capacitor, the filter further includes an adapter sub-bar connected to the connecting busbar, the adapter sub-bar is provided with a connecting portion, the third capacitor is provided with a third lead and a fourth lead, the third lead is connected to the connecting portion, and the fourth lead is used for grounding; The adapter sub-bar includes a positive sub-bar and a negative sub-bar. The number of third capacitors is at least two. Each third capacitor is provided with a third lead and a fourth lead. The third lead of at least one third capacitor is connected to the positive sub-bar, and the third lead of at least one third capacitor is connected to the negative sub-bar.

[0021] By connecting the third capacitor to the adapter sub-bus, the structure of the connection busbar can be simplified, reducing manufacturing difficulty and cost.

[0022] In some possible implementations, the magnetic ring includes a first magnetic ring and a second magnetic ring, both of which are sleeved on the connecting busbar. The first magnetic ring and the second magnetic ring are spaced apart. The capacitor is connected to the connecting busbar at a position between the first magnetic ring and the second magnetic ring. The first magnetic ring is configured as a differential mode magnetic ring, and the second magnetic ring is configured as a common mode magnetic ring.

[0023] This configuration facilitates the suppression of both common-mode and differential-mode noise, expanding the application scenarios of the filter.

[0024] In some possible implementations, the filter further includes a heat dissipation copper busbar, a portion of which is disposed between the second capacitor and the magnetic ring to transfer heat from the second capacitor and the magnetic ring to the heat dissipation copper busbar.

[0025] This configuration effectively increases the heat dissipation area, thereby improving the heat dissipation effect. It also allows for targeted heat dissipation of the second capacitor and the magnetic ring, thus improving the reliability of the second capacitor and the filter.

[0026] In some possible implementations, another portion of the heat dissipation copper busbar is disposed on one side of the second capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the second capacitor falls on the other portion of the heat dissipation copper busbar, so that at least a portion of the heat of the second capacitor can be transferred to the heat dissipation copper busbar.

[0027] This configuration enables two heat transfer paths, thereby improving heat dissipation.

[0028] In some possible implementations, the heat dissipation copper busbar includes a plate and a heat-absorbing part, the heat-absorbing part being connected to the plate, at least a portion of the heat-absorbing part being disposed between the second capacitor and the magnetic ring, and the plate being disposed on one side of the second capacitor.

[0029] This setup facilitates the arrangement of the heat dissipation copper busbars.

[0030] In some possible implementations, the heat-absorbing portion is connected to the edge of the plate, the heat-absorbing portion is close to the second capacitor, and is spaced apart from the second capacitor.

[0031] With this arrangement, the heat-absorbing part can extend at least partially between the second capacitor and the magnetic ring. The heat-absorbing part is located at the edge, so that the plate does not affect the arrangement of the second capacitor or the arrangement of the magnetic ring. At the same time, the spacing between the heat-absorbing part and the second capacitor and the magnetic ring will not affect the function of the second capacitor and the magnetic ring.

[0032] In some possible implementations, the heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the filter further includes a third capacitor, wherein the first heat-absorbing element corresponds to the second capacitor, and the second heat-absorbing element corresponds to the third capacitor.

[0033] This configuration allows for heat dissipation of the second and third capacitors, ensuring effective heat dissipation for different capacitors.

[0034] In some possible implementations, the first heat-absorbing element is configured as a plate, the first heat-absorbing element is angled to the plate, one side of the second capacitor faces the first heat-absorbing element, and the other side of the second capacitor faces the plate.

[0035] This design minimizes space requirements, facilitates insertion between the magnetic ring and the second capacitor, avoids interference with the magnetic ring and the second capacitor, and also facilitates space arrangement.

[0036] In some possible implementations, the second heat absorber includes a pin, one end of which is connected to the plate body, and the other end of which is provided with a connector. The third capacitor is provided with a fourth lead, which is connected to the connector, and one side of the third capacitor faces the plate body.

[0037] This configuration facilitates electrical conduction with the third capacitor and heat transfer.

[0038] In some possible implementations, the heat dissipation copper busbar is provided with a mounting part for connecting to a base, the heat dissipation copper busbar is used to transfer heat to the base, and the heat dissipation copper busbar is used to ground through the base.

[0039] This setup enables grounding, allowing heat to be transferred to the base, which facilitates heat dissipation and achieves a heat dissipation effect.

[0040] In some possible implementations, the low-frequency differential-mode noise has a frequency of 10 kHz to 100 kHz, the mid-frequency differential-mode noise has a frequency of 100 kHz to 10 MHz, and the high-frequency differential-mode noise has a frequency greater than 10 MHz.

[0041] By setting it up in this way, differential mode noise across the entire frequency band is suppressed, and the suppression bandwidth is greatly widened.

[0042] A second aspect of this disclosure also provides an inverter including the filter described above.

[0043] The above technical solution can achieve optimal filtering effect in a limited space through division of labor, avoiding the problem of large size caused by using a single type of capacitor to cover the entire frequency band, and also achieving high performance in a low-cost way to meet the requirements.

[0044] A third aspect of this disclosure also provides a vehicle that includes the filter described above, or includes the inverter described above.

[0045] The above technical solutions improve the reliability of vehicle use.

[0046] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0047] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the connection relationship between the adapter sub-bar and the connecting busbar according to one embodiment of this disclosure.

[0048] Figure 2 This is a structural schematic diagram showing the arrangement of the magnetic ring according to one embodiment of the present disclosure.

[0049] Figure 3 This is a schematic diagram of the connection relationship between the adapter sub-bar and the connecting busbar in another embodiment of this disclosure.

[0050] Figure 4 This is a schematic diagram of the connection relationship between the adapter bar, the first capacitor, and the circuit board in another embodiment of this disclosure.

[0051] Figure 5 This is a schematic diagram of the structure of a heat dissipation copper busbar according to one embodiment of the present disclosure.

[0052] Explanation of reference numerals in the attached figures 1. Connecting busbar; 11. Connecting part; 12. Positive busbar; 13. Negative busbar; 2. Magnetic ring; 21. First magnetic ring; 22. Second magnetic ring; 3. Capacitor; 31. First capacitor; 32. Second capacitor; 33. Third capacitor; 4. Copper heat dissipation busbar; 41. Plate body; 42. Heat absorption part; 421. First heat absorption element; 422. Second heat absorption element; 423. Connector; 44. Mounting part. 6. Lead wire; 61. First lead wire; 62. Second lead wire; 63. Third lead wire; 64. Fourth lead wire; 7. Transition sub-bar; 71. Positive sub-bar; 72. Negative sub-bar; 81. Circuit board; 82. Positioning part; 9. Step-up copper busbar. Detailed Implementation

[0053] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0054] In this disclosure, unless otherwise stated, "inner" and "outer" refer to the inner and outer parts of the relevant components. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can be a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0056] There are many types of filters, and LC filters are the most commonly used. They are composed of an inductor (L) and a capacitor (C). They utilize the difference in impedance characteristics of inductors and capacitors for signals of different frequencies to achieve selective filtering of signal frequencies.

[0057] In high-voltage DC applications, filters cannot effectively suppress both high-frequency and low-frequency differential-mode noise simultaneously, failing to meet usage requirements. Currently, some filters employ special lead capacitors with ultra-low ESL (such as feedthrough capacitors) to cover full-band noise suppression, but these are extremely costly, bulky, and complex to install, making them unsuitable for low-cost full-band noise suppression.

[0058] Therefore, such as Figures 1-5 As shown, one aspect of this disclosure provides a filter including a connecting busbar 1, a magnetic ring 2, and a capacitor 3.

[0059] The connecting busbar 1 is used for electrical conduction with external electronic components, the magnetic ring 2 is sleeved on part of the connecting busbar 1, and the capacitor 3 can conduct electricity with the connecting busbar 1.

[0060] The capacitor 3 includes a first capacitor 31 and a second capacitor 32. The first capacitor 31 can cooperate with the magnetic ring 2 to form a first differential mode filter circuit, and the second capacitor 32 can cooperate with the magnetic ring 2 to form a second differential mode filter circuit. The frequency of differential mode noise suppressed by the first differential mode filter circuit is different from the frequency of differential mode noise suppressed by the second differential mode filter circuit.

[0061] In the above technical solution, by setting two types of capacitors 3, namely the first capacitor 31 and the second capacitor 32, which are respectively used in conjunction with the magnetic ring 2 to form a differential mode filter circuit, noise suppression is achieved. Since the suppressed noise frequencies are different, a multi-level, wide-band noise absorption network is formed, which can suppress noise of different frequencies, thus broadening the frequency range of noise suppression and increasing the applicable scenarios, especially in high-voltage DC system scenarios. This avoids the problems of large size and high cost that occur when using a single type of capacitor 3 in order to broaden the coverage frequency band.

[0062] Optionally, in one embodiment of this disclosure, a first differential-mode filter circuit is used to suppress intermediate-frequency (IF) and high-frequency differential-mode noise, while a second differential-mode filter circuit is used to suppress IF and low-frequency differential-mode noise. This allows for the suppression of low-frequency, IF, and high-frequency differential-mode noise respectively, achieving full-band differential-mode noise suppression, significantly widening the suppression bandwidth, and effectively filtering differential-mode noise. It is understood that this filter primarily uses the second differential-mode filter circuit, with the first differential-mode filter circuit serving as a secondary component. The second differential-mode filter circuit suppresses IF and low-frequency differential-mode noise and is adept at handling high-energy noise, such as surges and large-current ripples. Meanwhile, IF and high-frequency differential-mode noise, which the second differential-mode filter circuit cannot suppress, is suppressed by the first differential-mode filter circuit. The first differential-mode filter circuit is adept at handling low-energy but high-frequency noise signals. The combination of these two circuits provides robustness against various types of noise interference.

[0063] The low-frequency differential-mode noise has a frequency of 10KHz-100KHz, the mid-frequency differential-mode noise has a frequency of 100KHz-10MHz, and the high-frequency differential-mode noise has a frequency greater than 10MHz.

[0064] Optionally, in one embodiment of this disclosure, the first capacitor 31 is configured as a surface-mount capacitor. The filter also includes a circuit board 81, to which the first capacitor 31 is connected and electrically conductive, and the circuit board 81 is electrically connected to the connecting busbar 1. The circuit board 81 enables the first capacitor 31 to be mounted and fixed, and to be electrically conductive, thus connecting the first capacitor 31 to the connecting busbar 1.

[0065] Among them, the surface-mount capacitor is small in size, does not take up too much space, and is easy to arrange. The first capacitor 31 can be fixed to the circuit board 81 by soldering, so that the first capacitor 31 and the circuit board 81 form an integral module structure, which facilitates assembly operations, improves the installation stability of the first capacitor 31, and can resist vibration and other impact loads, ensuring the overall service life and robustness of the entire filter.

[0066] In some examples, the surface-mount capacitors utilize multilayer ceramic capacitors 3, which have extremely low ESL and extremely high SRF, providing a localized, ultra-low impedance "pool" for these high-frequency currents, which helps suppress high-frequency noise such as switching ringing and electromagnetic radiation. Moreover, multilayer ceramic capacitors 3 are relatively inexpensive and do not significantly increase costs.

[0067] Furthermore, by setting a second capacitor 32 to suppress low- and mid-frequency differential-mode noise, it is not necessary to use a surface-mount capacitor to overcome the DC bias effect. The surface-mount capacitor only needs to suppress low- and mid-frequency differential-mode noise, thus avoiding excessive cost investment.

[0068] Optionally, in one embodiment of this disclosure, the filter further includes a housing, and the magnetic ring 2, the connecting busbar 1 and the second capacitor 32 are all connected to the housing, with the housing covering part of the connecting busbar 1.

[0069] The connecting busbar 1 is encased in a housing, which provides protection and insulation. The housing can be made of plastic and wrapped around the connecting busbar 1 using a plastic coating process. A portion of the connecting busbar 1 extends beyond the housing to ensure electrical connection and conduction. The second capacitor 32 can also be encased in the housing, either through an insert molding process or by placing it in a slot within the housing and securing it with adhesive. The first capacitor 31 and the circuit board 81 can be housed within the housing. In some examples, the housing can be made of high-performance engineering plastic PPS+GF40.

[0070] The outer casing may have a receiving cavity for accommodating the magnetic ring 2. The magnetic ring 2 is fitted onto the connecting busbar 1 and placed within the receiving cavity. By injecting potting compound into the receiving cavity, and after the potting compound cures, the magnetic ring 2 is fixed and provides insulation. In some examples, the receiving cavity may be a groove, through which potting compound can be injected, and the magnetic ring 2 can also be inserted into the groove through the groove opening. In some examples, the potting compound may be silicone.

[0071] Optionally, the circuit board 81 is provided with a positioning part 82, which is connected to the housing for mounting and positioning the circuit board 81 relative to the housing. The positioning part 82 enables the circuit board 81 to be positioned and installed, facilitating its assembly onto the housing and maintaining consistent assembly. In some examples, the positioning part 82 can be a positioning hole, and a high-precision positioning pin can be provided on the housing. By inserting the high-precision positioning pin into the positioning hole, the circuit board 81 is mounted and positioned.

[0072] Optionally, in one embodiment of this disclosure, the outer casing is provided with an assembly part, and the outer casing is connected to the base through the assembly part. The assembly part allows the outer casing and the base to be connected and thus fixed together.

[0073] The assembly section includes an assembly hole and a bushing. The bushing is disposed within the assembly hole, and the housing can be connected to the base via fasteners passing through the bushing and the assembly hole. The fasteners passing through the bushing enable connection to the base. In some examples, the fasteners may be M4 screws. A threaded hole may be provided on the base. After the M4 screw passes through the bushing and the assembly hole, it is threaded into the threaded hole, thereby fixing the housing to the base.

[0074] Optionally, in one embodiment of this disclosure, the filter further includes a boost copper busbar 9, which is connected to the housing. By using the boost copper busbar 9, a large current can be supplied to charge the battery pack in boost charging mode, thereby improving integration.

[0075] Optionally, in one embodiment of this disclosure, the filter further includes a transition sub-bar 7, which is connected to the circuit board 81 and the connecting busbar 1. The transition sub-bar 7 enables electrical conduction between the circuit board 81 and the connecting busbar 1, and also provides support for the circuit board 81.

[0076] The adapter sub-bus 7 and the connecting bus 1 are integrally formed or welded together. In some examples, the adapter sub-bus 7 and the connecting bus 1 can be fixed by laser welding. The connecting sub-bus can be connected to the circuit board 81 by soldering. In addition, the first capacitor 31 is connected to the connecting sub-bus through the PCB board, so that the first capacitor 31 is close to the noise source, providing the shortest and least inductive discharge path for high-frequency noise, which can reduce the loop impedance and ensure that the impedance of the filter node to noise remains sufficiently low at extremely high frequencies.

[0077] Optionally, in one embodiment of this disclosure, the second capacitor 32 is configured as a leaded capacitor, the connecting busbar 1 is provided with a connecting portion 11, and the second capacitor 32 is provided with a first lead 61 and a second lead 62, which are respectively connected to the connecting portion 11. Thus, the second capacitor 32 achieves electrical conduction with the connecting busbar 1 through the cooperation of the first lead 61 and the second lead 62 with the connecting portion 11. In some examples, the first lead 61 and the second lead 62 of the second capacitor 32 are connected to the connecting portion 11 by resistance welding, which can have high mechanical strength, resist the stress caused by long-term vehicle vibration, and avoid the risk of breakage due to weld fatigue. In some examples, the connecting portion 11 can be a "harpoon"-like structure, which facilitates the fixing of the first lead 61 and the second lead 62, allowing the first lead 61 and the second lead 62 to be inserted into the groove of the connecting portion 11 and then fixed by resistance welding. In some examples, a cantilevered extension is provided on the connecting busbar 1, and the connecting part 11 is connected to the cantilevered extension, thereby accommodating the positions of the second capacitor 32 and the third capacitor 33, which facilitates the connection of the second capacitor 32 and the third capacitor 33 to the connecting part 11 via the lead wire 6.

[0078] Lead-wire capacitors offer advantages such as low cost and robust connections, but their high-frequency filtering performance is insufficient. Therefore, they are primarily used for mid-to-low frequency filtering, particularly handling the low-frequency, high-ripple current corresponding to the inverter's switching frequency and its low-order harmonics, preventing interference with other equipment. In some examples, lead-wire capacitors provide high voltage ratings for metallized polypropylene film capacitors 3, enabling applications in high-voltage scenarios, such as 800V or even higher systems. Their self-healing properties ensure that even partial breakdown will not cause catastrophic failure, meeting automotive-grade functional safety requirements. Therefore, this filter employs a low-cost, high-reliability second capacitor 32 to handle the majority of low-frequency noise, while using a low-cost, high-performance first capacitor 31 to precisely target high-frequency noise—a strategy that achieves optimal performance at the lowest cost.

[0079] The connecting busbar 1 includes a positive busbar 12 and a negative busbar 13. One end of the first lead 61 and the second lead 62 are connected to the second capacitor 32, and the other end of the first lead 61 is connected to the connection part 11 of the positive busbar 12. The other end of the second lead 62 is connected to the connection part 11 of the negative busbar 13. Through the first lead 61 and the second lead 62, the positive busbar 12 and the negative busbar 13 are electrically connected to the second capacitor 32. Simultaneously, the heat from the positive busbar 12 and the negative busbar 13 can also be transferred to the second capacitor 32 through the first lead 61 and the second lead 62, and then transferred to the heat dissipation copper busbar 4 for heat dissipation.

[0080] Optionally, in one embodiment of this disclosure, the filter further includes a third capacitor 33, which is electrically connected to the connecting busbar 1 and grounded. The third capacitor 33 can cooperate with the magnetic ring 2 to form a common-mode filter circuit. This common-mode filter circuit suppresses common-mode noise, thereby achieving simultaneous suppression of both common-mode and differential-mode noise. This allows for application in high-voltage DC systems, expanding the filter's application scenarios, meeting the needs of different application scenarios, and improving the filtering effect.

[0081] In some examples, the magnetic ring 2 may include a first magnetic ring 21 and a second magnetic ring 22. The first magnetic ring 21 is a common-mode magnetic ring 2, and the second magnetic ring 22 is a differential-mode magnetic ring 2. These two are independently designed as separate units, which decouples the measurement of differential-mode inductance and impedance from the measurement of common-mode inductance and impedance, preventing interference between them. This facilitates the determination of whether the failure is due to the first magnetic ring 21 or the second magnetic ring 22 during failure analysis. There are two second magnetic rings 22, respectively fitted onto the positive busbar 12 and the negative busbar 13. The third capacitor 33 can be encased in a housing, either through an insert injection molding process or by placing the third capacitor 33 in a slot within the housing and securing it with adhesive.

[0082] Optionally, in one embodiment of this disclosure, the third capacitor 33 is configured as a leaded capacitor, the connecting busbar 1 is provided with a connecting portion 11, the third capacitor 33 is provided with a third lead 63 and a fourth lead 64, the third lead 63 is connected to the connecting portion 11, and the fourth lead 64 is used for grounding. Thus, the third capacitor 33 achieves electrical conduction with the connecting busbar 1 through the cooperation of the third lead 63 and the connecting portion 11. In some examples, the third lead 63 of the third capacitor 33 is connected to the connecting portion 11 by resistance welding, which can have high mechanical strength, resist the stress caused by long-term vehicle vibration, and avoid the risk of breakage due to weld fatigue. In some examples, the connecting portion 11 can be a "harpoon"-like structure, which facilitates the fixing of the third lead 63, allowing the third lead 63 to be inserted into the groove of the connecting portion 11, and then fixed by resistance welding.

[0083] The connecting busbar 1 includes a positive busbar 12 and a negative busbar 13. There are at least two third capacitors 33, each with a third lead 63 and a fourth lead 64. At least one third capacitor 33 has its third lead 63 connected to the positive busbar 12, and at least one third capacitor 33 has its third lead 63 connected to the negative busbar 13. The two third capacitors 33 can be electrically connected to the positive busbar 12 and the negative busbar 13 respectively and grounded, thereby suppressing common-mode noise.

[0084] Optionally, in another embodiment of this disclosure, the second capacitor 32 is configured as a leaded capacitor, and the filter further includes an adapter sub-bar 7 connected to the connecting busbar 1. The adapter sub-bar 7 is provided with a connecting portion 11, and the second capacitor 32 is provided with a first lead 61 and a second lead 62. The first lead 61 and the second lead 62 are respectively connected to the connecting portion 11, and the first capacitor 31 is close to the connecting portion 11. It is understood that the connecting portion 11 is provided on the adapter sub-bar 7, thereby realizing the electrical conduction between the second capacitor 32 and the adapter sub-bar 7, while the adapter sub-bar 7 is connected to and electrically conducts with the connecting busbar 1. In some examples, the first lead 61 and the second lead 62 of the second capacitor 32 are connected to the connecting portion 11 by a resistance welding process, which can have high mechanical strength, resist the stress caused by long-term vehicle vibration, and avoid the risk of breakage due to weld fatigue. In some examples, the connecting part 11 can be a "harpoon" structure, which can facilitate the fixing of the first lead 61 and the second lead 62, and facilitate the first lead 61 and the second lead 62 to be inserted into the groove of the connecting part 11, and then fixed by resistance welding.

[0085] Lead-wire capacitors offer advantages such as low cost and robust connections, but their high-frequency filtering performance is insufficient. Therefore, they are primarily used for mid-to-low frequency filtering, particularly handling the low-frequency, high-ripple current corresponding to the inverter's switching frequency and its low-order harmonics, preventing interference with other equipment. In some examples, lead-wire capacitors provide high voltage ratings for metallized polypropylene film capacitors 3, enabling applications in high-voltage scenarios, such as 800V or even higher systems. Their self-healing properties ensure that even partial breakdown will not cause catastrophic failure, meeting automotive-grade functional safety requirements. Therefore, this filter employs a low-cost, high-reliability second capacitor 32 to handle the majority of low-frequency noise, while using a low-cost, high-performance first capacitor 31 to precisely target high-frequency noise—a strategy that achieves optimal performance at the lowest cost.

[0086] The adapter sub-bar 7 includes a positive sub-bar 71 and a negative sub-bar 72. One end of the first lead 61 and the second lead 62 are connected to the second capacitor 32, and the other end of the first lead 61 is connected to the connection part 11 of the positive sub-bar 71, and the other end of the second lead 62 is connected to the connection part 11 of the negative sub-bar 72. Through the first lead 61 and the second lead 62, the positive sub-bar 71 and the negative sub-bar 72 are electrically connected to the second capacitor 32. Simultaneously, the heat from the positive sub-bar 71 and the negative sub-bar 72 can also be transferred to the second capacitor 32 through the first lead 61 and the second lead 62, and then transferred to the heat dissipation copper busbar 4 for heat dissipation.

[0087] Optionally, in one embodiment of this disclosure, the third capacitor 33 is configured as a leaded capacitor, and the filter further includes an adapter sub-bar 7 connected to the connecting busbar 1. The adapter sub-bar 7 is provided with a connecting portion 11, and the third capacitor 33 is provided with a third lead 63 and a fourth lead 64. The third lead 63 is connected to the connecting portion 11, and the fourth lead 64 is used for grounding. The third capacitor 33 is connected to the connecting portion 11 via the third lead 63, thereby achieving electrical conduction with the adapter sub-bar 7.

[0088] The adapter sub-bar 7 includes a positive sub-bar 71 and a negative sub-bar 72. There are at least two third capacitors 33, each with a third lead 63 and a fourth lead 64. At least one third capacitor 33 has its third lead 63 connected to the positive sub-bar 71, and at least one third capacitor 33 has its third lead 63 connected to the negative sub-bar 72. The two third capacitors 33 can respectively conduct electricity to the positive sub-bar 71 and the negative sub-bar 72 and ground them, thereby suppressing common-mode noise.

[0089] Optionally, in one embodiment of this disclosure, the magnetic ring 2 includes a first magnetic ring 21 and a second magnetic ring 22. Both the first magnetic ring 21 and the second magnetic ring 22 are sleeved on the connecting busbar 1, with the first magnetic ring 21 and the second magnetic ring 22 spaced apart. A capacitor 3 is connected to the connecting busbar 1 at the position between the first magnetic ring 21 and the second magnetic ring 22. The first magnetic ring 21 is configured as a differential-mode magnetic ring, and the second magnetic ring 22 is configured as a common-mode magnetic ring. This configuration facilitates the simultaneous suppression of both common-mode and differential-mode noise, expanding the application scenarios of the filter.

[0090] Optionally, in one embodiment of this disclosure, the filter further includes a heat dissipation copper busbar 4. A portion of the heat dissipation copper busbar 4 is disposed between the second capacitor 32 and the magnetic ring 2, so that the heat from the second capacitor 32 and the magnetic ring 2 can be transferred to the heat dissipation copper busbar 4. The heat dissipation copper busbar 4 effectively increases the heat dissipation area, thereby improving the heat dissipation effect. The placement of a portion of the heat dissipation copper busbar 4 between the second capacitor 32 and the magnetic ring 2 allows the heat from the second capacitor 32 and the magnetic ring 2 to be transferred to the heat dissipation copper busbar 4, and then the heat is dissipated through the heat transfer of the heat dissipation copper busbar 4, thereby reducing the temperature of the environment around the second capacitor 32 and the magnetic ring 2, achieving a heat dissipation effect. This allows for targeted heat dissipation of the second capacitor 32 and the magnetic ring 2, improving the reliability of the second capacitor 32 and the filter. Furthermore, the portion of the heat dissipation copper busbar 4 between the second capacitor 32 and the magnetic ring 2 also provides thermal insulation for the second capacitor 32 and the magnetic ring 2, preventing the heat from the second capacitor 32 and the magnetic ring 2 from affecting each other. In some examples, a portion of the heat dissipation copper busbar 4 is disposed between the second capacitor 32 and the first magnetic ring 21. This filter can handle the "noise" caused by ripple current under high current and high heat source conditions, and can also effectively dissipate heat, ensuring the stability and service life of the filter.

[0091] Optionally, in one embodiment of this disclosure, another part of the heat dissipation copper busbar 4 is disposed on one side of the second capacitor 32, and in a direction perpendicular to the heat dissipation copper busbar 4, the projection of the second capacitor 32 falls on the other part of the heat dissipation copper busbar 4, so that at least part of the heat of the second capacitor 32 can be transferred to the heat dissipation copper busbar 4.

[0092] Understandably, the second capacitor 32 is also positioned opposite to another part of the heat sink 4. This relative positioning allows the heat from the second capacitor 32 to be directly transferred to the heat sink 4, increasing the area over which heat is transferred from the second capacitor 32 to the heat sink 4, thus improving the heat dissipation effect of the second capacitor 32. Therefore, a portion of the heat from the second capacitor 32 can be transferred to the heat sink 4 via one part of the heat sink 4, and another portion can be transferred to the heat sink 4 via the other part, creating two heat transfer paths and improving the overall heat dissipation effect.

[0093] It should be noted that the projection perpendicular to the heat sink copper busbar 4 means that the projection of the second capacitor 32 falls on the heat sink copper busbar 4 along the direction perpendicular to its surface. In other words, the projection of the second capacitor 32 at least partially overlaps with the heat sink copper busbar 4, thus ensuring that heat is transferred from the second capacitor 32 to the heat sink copper busbar 4. The projection of the second capacitor 32 falling on the heat sink copper busbar 4 can be completely or partially overlapping. In some examples, the second capacitor 32 is located above or below another part of the heat sink copper busbar 4, and vertically, the second capacitor 32 is directly opposite the other part of the heat sink copper busbar 4.

[0094] Optionally, in one embodiment of this disclosure, the heat dissipation copper busbar 4 includes a plate 41 and a heat absorption part 42, the heat absorption part 42 and the plate 41 are connected, at least a portion of the heat absorption part 42 is disposed between the second capacitor 32 and the magnetic ring 2, and the plate 41 is disposed on one side of the second capacitor 32.

[0095] The plate 41 serves as the main structure and is used for heat conduction. The area of ​​the plate 41 can be set relatively large to facilitate heat transfer. The heat transfer rate is directly proportional to the heat dissipation area; as the area of ​​the plate 41 increases, the heat transfer rate also increases, thus accelerating heat transfer and improving the heat dissipation effect. The plate 41 is positioned on one side of the second capacitor 32, allowing the heat from the second capacitor 32 to be directly transferred to the plate 41, and then dissipated outwards through the plate 41, achieving heat dissipation.

[0096] The heat-absorbing part 42 is at least partially located between the second capacitor 32 and the magnetic ring 2, and is capable of absorbing heat. This allows the heat from the second capacitor 32 and the magnetic ring 2 to be transferred to the heat-absorbing part 42, and then to the plate body 41, where it is dissipated outwards, thus achieving heat dissipation. In some examples, the heat-absorbing part 42 is integrally formed with the plate body 41.

[0097] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 is connected to the edge of the plate 41, and the heat-absorbing part 42 is close to and spaced apart from the second capacitor 32. This arrangement allows the heat-absorbing part 42 to extend between the second capacitor 32 and the magnetic ring 2. The position of the heat-absorbing part 42 at the edge ensures that the plate 41 does not affect the arrangement of the second capacitor 32 or the magnetic ring 2. Furthermore, the spaced arrangement of the heat-absorbing part 42 with the second capacitor 32 and the magnetic ring 2 does not affect their functionality. One end of the heat-absorbing part 42 is connected to the side of the edge of the plate 41, thus placing the second capacitor 32 close to the edge of the plate 41, enabling the second capacitor 32 to transfer heat to the heat-absorbing part 42 and the plate 41.

[0098] Optionally, in one embodiment of this disclosure, in a direction perpendicular to the plate 41, the projection of the second capacitor 32 is set as the first projection, and the projection of the plate 41 is set as the second projection, wherein the ratio of the area of ​​the second projection to the area of ​​the first projection is greater than or equal to 2. This arrangement increases the heat-conducting area of ​​the plate 41, thereby improving the heat conduction of the plate 41 and ultimately enhancing the heat dissipation effect.

[0099] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 includes a first heat-absorbing element 421 and a second heat-absorbing element 422, and the filter further includes a third capacitor 33. The first heat-absorbing element 421 corresponds to the second capacitor 32, and the second heat-absorbing element 422 corresponds to the third capacitor 33.

[0100] The first heat-absorbing element 421 corresponds to the second capacitor 32, allowing heat from the second capacitor 32 to be transferred to the first heat-absorbing element 421, and then to the plate 41. The first heat-absorbing element 421 is positioned between the second capacitor 32 and the magnetic ring 2, with the two elements spaced apart. The second heat-absorbing element 422 corresponds to the third capacitor 33, allowing heat from the third capacitor 33 to be transferred to the second heat-absorbing element 422, and then to the plate 41. This arrangement provides two heat transfer paths, enabling heat dissipation for both the second capacitor 32 and the third capacitor 33, ensuring effective heat dissipation for different capacitors 3. All three capacitors 33 are safety capacitors 3; the first and second capacitors 31 and 32 can be X-type capacitors 3, and the third capacitor 33 can be Y-type capacitors 3. It should be noted that the capacitance values ​​of the first, second, and third capacitors 33 can be set as needed, without further restrictions.

[0101] Optionally, in one embodiment of this disclosure, the first heat-absorbing element 421 is configured as a plate, the first heat-absorbing element 421 is angled to the plate body 41, one side of the second capacitor 32 faces the first heat-absorbing element 421, and the other side of the second capacitor 32 faces the plate body 41.

[0102] The first heat-absorbing element 421 is designed as a plate, which occupies little space and allows it to easily extend between the magnetic ring 2 and the second capacitor 32, avoiding interference with the magnetic ring 2 and the second capacitor 32. This also facilitates spatial arrangement and avoids excessive space occupation. Furthermore, the plate shape of the first heat-absorbing element 421 allows one side to face the second capacitor 32 and the other side to face the magnetic ring 2, creating a face-to-face arrangement. This increases the heat absorption area, facilitating the transfer of heat from the second capacitor 32 and the magnetic ring 2 to the first heat-absorbing element 421, resulting in better heat dissipation.

[0103] In this design, the first heat-absorbing element 421 is angled to the plate 41, allowing the second capacitor 32 to be positioned between the first heat-absorbing element 421 and the plate 41. This allows the second capacitor 32 to face both the first heat-absorbing element 421 and the plate 41, enabling heat transfer to both elements and increasing the heat transfer area, thus improving heat dissipation. In some examples, the angle between the first heat-absorbing element 421 and the plate 41 is 90°, and the first heat-absorbing element 421 is perpendicular to the plate 41. Of course, in other examples, the angle between the first heat-absorbing element 421 and the plate 41 can be other angles.

[0104] Optionally, in another embodiment of this disclosure, the first heat absorber 421 is configured as fins, and the first heat absorber 421 is angled to the plate 41. One side of the second capacitor 32 faces the first heat absorber 421, and the other side of the second capacitor 32 faces the plate 41. By configuring the first heat absorber 421 as fins, the heat transfer area can be increased, heat transfer can be improved, and thus the heat dissipation effect can be improved.

[0105] Optionally, in one embodiment of this disclosure, the second heat-absorbing element 422 includes a pin, one end of which is connected to the plate 41, and the other end of which is provided with a connector 423. The third capacitor 33 is provided with a fourth lead 64, which is connected to the connector 423. One side of the third capacitor 33 faces the plate 41.

[0106] The pins are extended structures and can be integrally formed with the board body 41. These pins facilitate the connection of the third capacitor 33 to the pin connector 423 via the fourth lead 64, enabling electrical conduction. Furthermore, heat from the third capacitor 33 can be transferred to the pins via the fourth lead 64, and then to the board body 41, thus achieving heat transfer. Heat from electronic components connected to the third capacitor 33 can be transferred to the third capacitor 33, and then to the board body 41, thereby dissipating heat. In some examples, the pins are connected to the side edge of the board body 41 to facilitate the placement of the third capacitor 33. The pins are angled relative to the board body 41, with the angle between the pins and the board body 41 being 90°, and the pins are perpendicular to the board body 41. Of course, in other examples, the angle between the pins and the board body 41 can be other angles.

[0107] In addition, one side of the third capacitor 33 faces the board 41, allowing the heat from the third capacitor 33 to be directly transferred to the board 41 for heat dissipation. Thus, the third capacitor 33 can achieve heat transfer through two paths: the heat from the third capacitor 33 can be transferred to the board 41 through the fourth lead 64 and the pins, or it can be transferred directly to the board 41.

[0108] In some examples, connector 423 may be a groove formed at the end of the pin away from the plate 41, so that the pin forms a "harpoon"-like structure, which can facilitate the fixing of the fourth lead 64, so that the fourth lead 64 can be soldered to the pin.

[0109] Optionally, in one embodiment of this disclosure, the heat dissipation copper busbar 4 is provided with a mounting part 44 for connecting to a base. The heat dissipation copper busbar 4 is used to transfer heat to the base and is grounded through the base. Grounding through the base allows heat to be transferred to the base, which facilitates heat dissipation and achieves a heat dissipation effect. This makes the heat dissipation copper busbar 4 integrate multiple functions such as heat dissipation, grounding, electrical conduction, and installation and fixation, thereby reducing the arrangement of related components and saving costs.

[0110] In some examples, the mounting part 44 can be a through hole formed on the plate 41 of the heat dissipation copper busbar 4. A threaded post is provided on the base, and a threaded hole is provided in the threaded post. The threaded hole is connected to the through hole, and a screw can be passed through the through hole and threaded into the threaded hole to install the heat dissipation copper busbar 4 on the base, so as to achieve grounding and heat transfer. In other examples, the mounting part 44 can be a welding head, which can be welded to the base for fixation.

[0111] The heat transfer path between the positive busbar 12 and the negative busbar 13 can be via the first lead 61 and the second lead 62 to the first capacitor 31, and then via the first capacitor 31 to the heat dissipation copper busbar 4. Alternatively, it can be via the third lead 63 to the second capacitor 32, and then via the second capacitor 32 and the fourth lead 64 to the heat dissipation copper busbar 4. The first magnetic ring 21 is fitted onto the positive busbar 12 and the negative busbar 13, so the heat from the first magnetic ring 21 can also be transferred to the positive busbar 12 and the negative busbar 13, and then via the aforementioned heat transfer path to the heat dissipation copper busbar 4. Furthermore, the heat from the first magnetic ring 21 can also be directly transferred to the first heat-absorbing element 421, and then via the first heat-absorbing element 421 to the plate 41.

[0112] This filter can be applied to on-board chargers and DC-DC converters for new energy vehicles, as well as solar inverters, wind power generation systems, industrial high-voltage DC power supplies, and communication base station power supplies. Through the arrangement of the first capacitor 31 and the second capacitor 32, this filter addresses five major contradictions: frequency band, impedance, current, parasitics, and redundancy. It leverages strengths and avoids weaknesses to construct a high-performance, highly reliable filter network across the entire frequency band. This forms a multi-stage, multi-zero, low-impedance loop, segmenting and short-circuiting wideband noise components back to the source. Simultaneously, high-frequency energy is dissipated within the capacitor array 3, preventing further propagation to the load. Furthermore, the arrangement of the first capacitor 31, the second capacitor 32, and the third capacitor 33 reduces the energy borne by each individual capacitor 3, benefiting its lifespan and temperature rise. Additionally, the filtering effect can be further improved by connecting capacitors 3 of different capacitance values ​​in parallel.

[0113] A second aspect of this disclosure also provides an inverter including the filter described above.

[0114] The inverter's switching transistors switch at extremely high frequencies (e.g., 10kHz-50kHz) across hundreds of volts, generating huge voltage and current change rates. This induces broadband electromagnetic noise ranging from the fundamental frequency to hundreds of MHz. Therefore, during inverter operation, the DC link capacitor 3 needs to filter ripple currents of different frequencies. The low-frequency, high-ripple current corresponding to the inverter's switching frequency and its lower harmonics can be suppressed by the second capacitor 32. The switching transistors turn on and off within nanoseconds, generating extremely high dv / dt, which can induce oscillations and noise up to hundreds of MHz. This can be suppressed by the first capacitor 31. This achieves low impedance across the entire frequency range from kHz to GHz, ensuring efficient and low-noise operation of the inverter and meeting automotive EMC standards. The second capacitor 32 has high reliability, bearing the main electrical and mechanical stresses, while the first capacitor 31 operates in a protected local environment, significantly improving the overall mean time between failures (MTBF) of the system. This inverter achieves optimal filtering performance within a limited space through division of labor, avoiding the bulky size problem caused by using a single type of capacitor to cover the entire frequency band. It also achieves high performance in a low-cost manner to meet the requirements.

[0115] A third aspect of this disclosure also provides a vehicle that includes the filter described above, or includes the inverter described above.

[0116] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0117] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0118] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A filter, characterized in that, include: A connecting busbar, which is used for electrical connection with external electronic components; Magnetic ring, the magnetic ring being sleeved on a portion of the connecting busbar A capacitor, wherein the capacitor is electrically connected to the connecting busbar; The capacitor includes a first capacitor and a second capacitor. The first capacitor can cooperate with the magnetic ring to form a first differential mode filter circuit, and the second capacitor can cooperate with the magnetic ring to form a second differential mode filter circuit. The frequency of differential mode noise suppressed by the first differential mode filter circuit and the frequency of differential mode noise suppressed by the second differential mode filter circuit are different. The first differential mode filter circuit is used to suppress intermediate frequency differential mode noise and high frequency differential mode noise, and the second differential mode filter circuit is used to suppress intermediate frequency differential mode noise and low frequency differential mode noise.

2. The filter according to claim 1, characterized in that, The first capacitor is a surface mount capacitor; The filter also includes a circuit board, the first capacitor is connected to the circuit board and electrically conductive, and the circuit board is electrically conductive to the connecting busbar.

3. The filter according to claim 2, characterized in that, The filter also includes a housing, and the magnetic ring, the connecting busbar and the second capacitor are all connected to the housing, with the housing covering a portion of the connecting busbar; The circuit board is provided with a positioning part, which is connected to the housing for mounting and positioning the circuit board relative to the housing.

4. The filter according to claim 2, characterized in that, The filter further includes an adapter sub-bar, which is connected to the circuit board and to the connecting busbar; The adapter sub-bar and the connecting busbar are integrally formed or welded together.

5. The filter according to claim 1, characterized in that, The second capacitor is configured as a leaded capacitor, the connecting busbar is provided with a connecting part, the second capacitor is provided with a first lead and a second lead, and the first lead and the second lead are respectively connected to the connecting part; The connecting busbar includes a positive busbar and a negative busbar. One end of the first lead and the second lead are connected to the second capacitor. The other end of the first lead is connected to the connection part of the positive busbar, and the other end of the second lead is connected to the connection part of the negative busbar.

6. The filter according to claim 1, characterized in that, The second capacitor is configured as a leaded capacitor. The filter also includes an adapter sub-bar, which is connected to the connecting busbar. The adapter sub-bar is provided with a connecting part. The second capacitor is provided with a first lead and a second lead, which are respectively connected to the connecting part. The adapter sub-bar includes a positive sub-bar and a negative sub-bar. One end of the first lead and the second lead are connected to the second capacitor. The other end of the first lead is connected to the connection part of the positive sub-bar, and the other end of the second lead is connected to the connection part of the negative sub-bar.

7. The filter according to claim 1, characterized in that, The filter also includes a third capacitor, which is electrically connected to the connecting busbar and grounded. The third capacitor can cooperate with the magnetic ring to form a common-mode filter circuit.

8. The filter according to claim 7, characterized in that, The third capacitor is configured as a leaded capacitor, the connecting busbar is provided with a connecting part, the third capacitor is provided with a third lead and a fourth lead, the third lead is connected to the connecting part, and the fourth lead is used for grounding; The connecting busbar includes a positive busbar and a negative busbar. The number of third capacitors is at least two. Each third capacitor is provided with a third lead and a fourth lead. The third lead of at least one third capacitor is connected to the positive busbar, and the third lead of at least one third capacitor is connected to the negative busbar.

9. The filter according to claim 7, characterized in that, The third capacitor is configured as a leaded capacitor. The filter also includes an adapter sub-bar, which is connected to the connecting busbar. The adapter sub-bar is provided with a connecting part. The third capacitor is provided with a third lead and a fourth lead. The third lead is connected to the connecting part, and the fourth lead is used for grounding. The adapter sub-bar includes a positive sub-bar and a negative sub-bar. The number of third capacitors is at least two. Each third capacitor is provided with a third lead and a fourth lead. The third lead of at least one third capacitor is connected to the positive sub-bar, and the third lead of at least one third capacitor is connected to the negative sub-bar.

10. The filter according to claim 1, characterized in that, The magnetic ring includes a first magnetic ring and a second magnetic ring. Both the first magnetic ring and the second magnetic ring are sleeved on the connecting busbar. The first magnetic ring and the second magnetic ring are spaced apart. The capacitor is connected to the connecting busbar at the position between the first magnetic ring and the second magnetic ring. The first magnetic ring is set as a differential mode magnetic ring, and the second magnetic ring is set as a common mode magnetic ring.

11. The filter according to any one of claims 1-10, characterized in that, The filter also includes a heat dissipation copper busbar, a portion of which is disposed between the second capacitor and the magnetic ring, so that the heat from the second capacitor and the magnetic ring is transferred to the heat dissipation copper busbar.

12. The filter according to claim 11, characterized in that, Another portion of the heat dissipation copper busbar is disposed on one side of the second capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the second capacitor falls on the other portion of the heat dissipation copper busbar, so that at least part of the heat of the second capacitor can be transferred to the heat dissipation copper busbar.

13. The filter according to claim 12, characterized in that, The heat dissipation copper busbar includes a plate and a heat absorption part. The heat absorption part is connected to the plate. At least a portion of the heat absorption part is disposed between the second capacitor and the magnetic ring. The plate is disposed on one side of the second capacitor.

14. The filter according to claim 13, characterized in that, The heat-absorbing part is connected to the edge of the plate, and the heat-absorbing part is close to the second capacitor and spaced apart from the second capacitor.

15. The filter according to claim 13, characterized in that, The heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the filter further includes a third capacitor. The first heat-absorbing element corresponds to the second capacitor, and the second heat-absorbing element corresponds to the third capacitor.

16. The filter according to claim 15, characterized in that, The first heat-absorbing element is plate-shaped and is angled to the plate. One side of the second capacitor faces the first heat-absorbing element, and the other side of the second capacitor faces the plate.

17. The filter according to claim 15, characterized in that, The second heat-absorbing element includes a pin, one end of which is connected to the plate body, and the other end of which is provided with a connector. The third capacitor is provided with a fourth lead, which is connected to the connector. One side of the third capacitor faces the plate body.

18. The filter according to claim 11, characterized in that, The heat dissipation copper busbar is provided with a mounting part for connecting to the base. The heat dissipation copper busbar is used to transfer heat to the base and is grounded through the base.

19. The filter according to any one of claims 1-10, characterized in that, The low-frequency differential-mode noise has a frequency of 10KHz-100KHz, the mid-frequency differential-mode noise has a frequency of 100KHz-10MHz, and the high-frequency differential-mode noise has a frequency greater than 10MHz.

20. An inverter, characterized in that, Includes the filter as described in any one of claims 1-19.

21. A vehicle, characterized in that, It includes the filter as described in any one of claims 1-19, or the inverter as described in claim 20.

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