Electronic device

Abstract

The invention provides electronic equipment which comprises a first shell, a first rotating shaft, a second rotating shaft and a second shell, the first shell comprises a first part, a second part and a third part, the first rotating shaft is connected between the first part and the second part, and the second rotating shaft is connected between the second part and the third part. The first shell comprises a middle plate and a frame, the middle plate comprises a grounding part used for grounding, the frame surrounds the peripheral side of the middle plate and comprises a frame antenna, the second shell is installed on the frame of the third part and comprises a shell body and a conductive layer, and the conductive layer is arranged on the outer surface of the shell body and electrically connected with the grounding part; the electronic equipment has a folded state, and when the electronic equipment is in the folded state, the projection of the first rotating shaft on the shell body is at least partially overlapped with the conductive layer. The electronic equipment can shield external electromagnetic waves, so that the overall signal strength of the electronic equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] Existing foldable electronic devices can be folded once or multiple times. Among them, compared with electronic devices that are folded once, electronic devices that are folded twice or more are more susceptible to electromagnetic waves entering the device when they are folded, which can affect the overall signal strength of the electronic device. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that can shield external electromagnetic waves, thereby improving the overall signal strength of the electronic device.

[0004] This application provides an electronic device, which includes a first housing, a first rotating shaft, a second rotating shaft, and a second housing. The first housing includes a first part, a second part, and a third part. The first rotating shaft is connected between the first part and the second part, and the second rotating shaft is connected between the second part and the third part. The first housing includes a middle plate and a frame. The middle plate includes a grounding portion for grounding. The frame surrounds the periphery of the middle plate and includes a frame antenna. The second housing is mounted on the frame of the third part. The second housing includes a shell body and a conductive layer. The conductive layer is disposed on the outer surface of the shell body and is electrically connected to the grounding portion. The electronic device has a folded state. When the electronic device is in the folded state, the projection of the first rotating shaft on the shell body at least partially overlaps with the conductive layer.

[0005] In the electronic device provided in this application embodiment, a conductive layer is provided on the outer surface of the shell body in the second housing, and the conductive layer is electrically connected to the grounding part of the middle plate, so that the second housing is grounded through the conductive layer and grounded by the middle plate. When the electronic device is in a folded state, the first pivot is in contact with the second housing, and the projection of the first pivot on the shell body of the second housing at least partially overlaps with the conductive layer. Since the second housing is grounded, a grounding shield can be formed between the first pivot and the third part, thereby shielding electromagnetic waves from entering the U-shaped cavity formed by the display screen of the electronic device in the folded state. This solves the cavity membrane risk caused by the inability of the U-shaped cavity to radiate after electromagnetic waves enter the U-shaped cavity formed by the display screen, thereby enhancing the overall signal strength of the electronic device and improving the user experience.

[0006] Furthermore, in this embodiment, the second housing is electrically connected to the grounding portion of the middle plate to achieve grounding of the second housing, rather than serving as an extension of the frame antenna. This avoids the problem of the second housing contacting the frame antenna when it acts as an extension, which could affect the antenna efficiency of the electronic device. Additionally, in this embodiment, the design scheme of grounding the second housing through a conductive layer is simple, occupies little space, allows for greater antenna clearance in the electronic device, and effectively meets the antenna grounding requirements.

[0007] In one possible implementation, the outer surface of the housing includes an inner side and an outer side connected to the inner side. The conductive layer includes a first conductive layer and a second conductive layer. The first conductive layer covers the inner side of the housing and is electrically connected to the middle plate. The second conductive layer covers the outer side of the housing and is electrically connected to the first conductive layer. When the electronic device is in a folded state, the projection of the first pivot on the housing at least partially overlaps with the second conductive layer. This achieves grounding on the outer side of the housing, satisfying the grounding requirement of the second housing. Furthermore, when the electronic device is in a folded state, the first pivot easily forms a grounding shield with the second conductive layer, thereby enhancing the overall signal strength of the electronic device and improving the user experience.

[0008] In one possible implementation, the frame antenna has a slot, and the housing body includes a main housing and pins. The main housing at least partially covers the opening of the slot, and the pins protrude from the main housing and are located within the slot. The electronic device also includes a spring clip, which is mounted on the frame, with at least a portion of the spring clip located in the slot and abutting against the pins. On one hand, when installing the second housing, it is only necessary to insert the pins of the housing body into the slot, and the spring clip abuts against the pins to achieve the installation and fixation of the second housing, improving the installation stability of the second housing on the frame. Furthermore, the installation process of the second housing is simple, which helps to improve the installation efficiency. On the other hand, the spring clip is elastic and can adapt to different pin sizes, reducing the installation tolerance of the pins of the second housing within the slot.

[0009] In one possible implementation, the pin includes a peripheral side surface, which is disposed opposite to the slot sidewall of the slot. The spring includes a fixing part and an elastic part. The fixing part is mounted on the frame, and the elastic part is fixedly connected to the fixing part and located in the slot, abutting against the peripheral side surface of the pin, so that the spring generates a holding force against the peripheral side surface of the pin, thereby causing the spring to generate a holding force against the second housing in the lateral direction, avoiding the problem that the second housing will float when the spring generates a holding force against the second housing in the thickness direction of the electronic device.

[0010] In one possible implementation, the fixing part is electrically connected between the middle plate and the conductive layer, which helps to improve the good electrical contact between the middle plate and the second housing, ensuring that the second housing can be successfully grounded.

[0011] In one possible implementation, the pin includes a peripheral side surface, which is disposed opposite to the slot sidewall of the slot. A spring clip is installed on the bottom wall of the slot, and the spring clip has a insertion hole with the opening of the insertion hole facing the opening of the slot. The pin is inserted into the insertion hole, and the peripheral side surface abuts against the inner wall of the insertion hole. The inner wall of the insertion hole and the pin abut against each other, so that the spring clip can generate a clamping force on the pin in the lateral direction. On the one hand, this improves the installation stability of the second housing, and on the other hand, it can also make the spring clip generate a supporting force on the second housing in the lateral direction, avoiding the problem that the second housing will float when the spring clip generates a supporting force on the second housing in the thickness direction of the electronic device.

[0012] In one possible implementation, the spring includes a fixing part, a first elastic part and a second elastic part. The fixing part is installed on the bottom wall of the slot. The first elastic part and the second elastic part are both located on the side of the fixing part away from the bottom wall of the slot. The first elastic part and the second elastic part are spaced apart to form a insertion hole. The pin is inserted between the first elastic part and the second elastic part and abuts against the surfaces of the first elastic part and the second elastic part facing the insertion hole.

[0013] In one possible implementation, the electronic device further includes an electrical connector mounted on the first housing and electrically connected between the middle plate and the conductive layer, ensuring good electrical contact between the middle plate and the second housing, thereby ensuring the grounding effect of the second housing.

[0014] In one possible implementation, the middle plate is provided with a mounting groove. The electrical connector includes a fixing member and a first circuit board. The fixing member is installed in the mounting groove. The first circuit board includes a fixing portion, a connecting portion, and a supporting portion. The fixing portion is connected to the side of the fixing member away from the middle plate. The connecting portion is connected between the fixing portion and the supporting portion. The supporting portion is electrically connected to the conductive layer. On the one hand, the electrical connector is fixedly connected to the middle plate through the fixing member, which can improve the installation stability between the electrical connector and the middle plate. On the other hand, the electrical connector is electrically connected to the middle plate through the fixing member and electrically connected to the conductive layer of the second housing through the supporting portion of the first circuit board, so as to realize the electrical connection between the electrical connector and the middle plate and the second housing, ensuring good electrical contact between the conductive layers of the middle plate and the second housing, thereby ensuring the grounding effect of the second housing.

[0015] In one possible implementation, the electronic device further includes a second circuit board mounted on the side of the middle board away from the first circuit board. The second circuit board has a ground point and a feed point. The ground point is electrically connected to the grounding part, and the feed point is electrically connected to the frame antenna.

[0016] In one possible implementation, the second housing further includes a paint film layer, which is disposed on the outer surface of the housing body and covers the second conductive layer. The paint film layer serves two purposes: firstly, it provides protection for the second conductive layer, thereby improving the wear resistance and corrosion resistance of the second housing; secondly, it also enhances the appearance of the second housing.

[0017] In one possible implementation, the outer surface includes a first region having recesses and / or protrusions, and a second conductive layer is applied to the first region. Because the first region has recesses and / or protrusions, it has a higher surface roughness. By placing the second conductive layer in the first region of the outer surface, the adhesion of the second conductive layer to the outer surface of the housing is improved, preventing the second conductive layer from detaching from the housing in scenarios such as drops of electronic devices.

[0018] In one possible implementation, there are multiple slots spaced apart from each other, multiple pins located on the same side of the main housing and spaced apart from each other, each pin located in a slot, and multiple spring clips installed in a slot and between the frame and a pin, which can improve the stability of the second housing on the frame, thereby facilitating the use of electronic devices in scenarios such as drops. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the structure of the electronic device provided in this application in a first embodiment;

[0021] Figure 2 A schematic diagram of the structure of the electronic device provided in the embodiments of this application in a second embodiment;

[0022] Figure 3 for Figure 1 The electronic device shown is a partial structural schematic diagram of the first example.

[0023] Figure 4 for Figure 3 A schematic diagram of the exploded structure of the part shown.

[0024] Figure 5 for Figure 4 An exploded structural diagram of the second shell in the partial structure shown;

[0025] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure of the second shell shown;

[0026] Figure 7 for Figure 4 A schematic diagram of part A in the shown structure;

[0027] Figure 8 for Figure 4 A schematic diagram of the cross-sectional structure of the portion shown;

[0028] Figure 9 for Figure 1 An exploded structural diagram of a portion of the electronic device shown in the second example.

[0029] Figure 10 for Figure 9 A schematic diagram of the spring sheet structure shown in the diagram;

[0030] Figure 11 for Figure 9 A schematic diagram of part B in the shown structure;

[0031] Figure 12 for Figure 9 A schematic diagram of the cross-sectional structure of the part shown. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Please see Figure 1 , Figure 1 A schematic diagram of the structure of the electronic device 1 provided in this application in a first embodiment.

[0034] Electronic device 1 can be a mobile phone, laptop computer, tablet computer, monitor, vehicle-mounted device, or other similar device. In this embodiment, electronic device 1 is a foldable electronic device, meaning it can switch between a folded state and an unfolded state. The foldable electronic device can be folded two or more times. For ease of understanding, the following description uses a mobile phone capable of two folds, i.e., a triple-fold screen phone, as an example.

[0035] Specifically, the electronic device 1 includes a first housing 100, a display screen 300, and a second housing 500. The display screen 300 is mounted on the first housing 100, and the second housing 500 is mounted on the first housing 100 and surrounds the display screen 300.

[0036] The first housing 100 includes a first portion 110, a second portion 120, and a third portion 130. The electronic device 1 also includes a first rotating shaft 610 and a second rotating shaft 620. The first rotating shaft 610 is rotatably connected between the first portion 110 and the second portion 120, allowing the first portion 110 and the second portion 120 to rotate around the first rotating shaft 610. The second rotating shaft 620 is rotatably connected between the second portion 120 and the third portion 130, allowing the second portion 120 and the third portion 130 to rotate around the second rotating shaft 620. The second housing 500 is mounted on the third portion 130 of the first housing 100.

[0037] It is understood that in other embodiments, the first housing 100 may also include a fourth part, a fifth part, etc., in which case the electronic device 1 corresponds to a four-fold screen electronic device, a five-fold screen electronic device, etc.

[0038] Electronic device 1 has an unfolded state and a folded state, and can switch between the two states. In this embodiment, the unfolded state includes a fully unfolded state and a partially unfolded state. When electronic device 1 is in the fully unfolded state, the first portion 110, the second portion 120, and the third portion 130 of the first housing 100 are relatively flattened, and the display screen 300 is approximately flat, allowing electronic device 1 to display a relatively large display screen 300, thereby increasing the user's viewing range. When electronic device 1 is in the partially unfolded state, the first portion 110 and the second portion 120 of the first housing 100 are relatively folded, and the third portion 130 and the second portion 120 are relatively flattened. When electronic device 1 is in the folded state, as shown... Figure 1 As shown, the first part 110, the second part 120 and the third part 130 are folded relative to each other, the display screen 300 is bent, and the electronic device 1 occupies a relatively small space.

[0039] When the electronic device 1 is in a folded state, the first part 110 is located between the second part 120 and the third part 130, and the first pivot 610 contacts the second housing 500 mounted on the third part 130. In this embodiment, the first pivot 610 includes a metal component, and when the electronic device 1 is in a folded state, the metal component of the first pivot 610 contacts the second housing 500. For example, the metal component is a shaft cover of the first pivot 610.

[0040] See Figure 2 , Figure 2 A schematic diagram of the structure of the electronic device 1 provided in the embodiments of this application in a second embodiment.

[0041] The difference between the electronic device 1 of the second embodiment and the electronic device 1 of the first embodiment is that the folding method of the electronic device 1 of the second embodiment is different from that of the electronic device 1 of the first embodiment.

[0042] Specifically, in the second embodiment, when the electronic device 1 is in its fully unfolded state, the first portion 110, the second portion 120, and the third portion 130 of the first housing 100 are relatively flattened, and the display screen 300 is approximately flat, allowing the electronic device 1 to display a relatively large display screen 300. When the electronic device 1 is in its partially unfolded state, the first portion 110 and the second portion 120 of the first housing 100 are folded relative to each other, and the third portion 130 and the second portion 120 are relatively flattened; alternatively, the first portion 110 is flattened relative to the second portion 120, and the third portion 130 is folded relative to the second portion 120. When the electronic device 1 is in its folded state, the second portion 120 is located between the first portion 110 and the third portion 130, and the metal part of the first pivot 610 contacts the second housing 500 mounted on the third portion 130.

[0043] See also Figure 3 and Figure 4 , Figure 3 for Figure 1 The electronic device 1 shown is a partial structural schematic diagram of the first example. Figure 4 for Figure 3 The diagram shows the exploded structure of the part shown.

[0044] For ease of description, the following definitions are provided. Figure 3 The width direction of the electronic device 1 shown is the X-axis direction, the length direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are all perpendicular to each other.

[0045] Specifically, the first housing 100 includes a middle plate 20 and a frame 30, with the frame 30 surrounding the periphery of the middle plate 20. The side of the middle plate 20 facing the positive Z-axis direction is used to mount the display screen 300. The middle plate 20 includes a grounding portion for grounding. Figure 3 and Figure 4 (Not shown in the image) to ground the middle plate 20. The middle plate 20 is provided with a mounting groove 21, the opening of which is located on one surface of the middle plate 20 along the thickness direction. In this embodiment, the opening of the mounting groove 21 is located on one side surface of the middle plate 20 along the positive Z-axis direction.

[0046] The frame 30 is provided with antenna slots 31, which penetrate the frame 30 along the thickness direction of the electronic device 1 to divide the frame 30 into multiple frame antennas 33. In this embodiment, when the electronic device 1 is in a folded state, the projection of the first rotating shaft 610 on the frame 30 at least partially overlaps with the frame antennas 33. In this embodiment, the frame 30 also includes an insulating portion 35, which fills the antenna slots 31 and is fixedly connected between two adjacent frame antennas 33. The frame 30 is also provided with slots 37. In this embodiment, the opening of the slot 37 is located on the surface of the frame 30 facing the positive Z-axis direction. The frame antennas 33 and the insulating portion 35 surround and form the slot 37. Part of the frame antennas 33 and part of the insulating portion 35 constitute the sidewall of the slot 37, and part of the frame antennas 33 constitute the bottom wall of the slot 37.

[0047] See also Figure 5 and Figure 6 , Figure 5 for Figure 4 An exploded view of the second shell 500 in the partial structure shown. Figure 6 for Figure 5 The cross-sectional structural diagram of the second housing 500 is shown.

[0048] The second housing 500 includes a housing body 510, a conductive layer 530, and a paint film layer 550. The housing body 510 is mounted on the frame 30 of the first housing 100 and surrounds the periphery of the display screen 300. The conductive layer 530 is disposed on the outer surface of the housing body 510 and is electrically connected to the middle plate 20 to ground the second housing 500. The conductive layer 530 is spaced apart from the frame antenna 33 of the frame 30 to achieve relative insulation between the conductive layer 530 and the frame antenna 33, thereby eliminating electrical connection between the second housing 500 and the frame antenna 33. The paint film layer 550 is disposed on the outer surface of the housing body 510 and covers at least a portion of the conductive layer 530.

[0049] For example, the shell body 510 is made of plastic. In this embodiment, the shell body 510 is provided with a clearance groove 501, the opening of which is located on the surface of the shell body 510 facing the display screen 300. The clearance groove 501 is used to insert the display screen 300 to fix it in place. In this embodiment, the opening of the clearance groove 501 is located on the surface of the shell body 510 facing the negative X-axis direction and extends through the surface of the shell body 510 facing the negative Z-axis direction.

[0050] The outer surface of the housing body 510 includes an inner side surface 511 and an outer side surface 513 connected to the inner side surface 511. In this embodiment, the inner side surface 511 faces the inside of the electronic device 1, and the outer side surface 513 faces the outside of the electronic device 1. It can be understood that the outer side surface 513 is the outer surface of the housing body 510.

[0051] In this embodiment, the outer surface 513 of the housing body 510 includes a first region 515 and a second region 517. The projection of the first region 515 onto the frame 30 at least partially overlaps with the frame antenna 33. When the electronic device 1 is in a folded state, the projection of the first pivot 610 onto the outer surface 513 of the housing body 510 at least partially overlaps with the first region 515, and the projection of the first pivot 610 onto the outer surface 513 of the housing body 510 does not overlap with the second region 517. In this embodiment, the first region 515 has recesses and / or protrusions, such that the surface roughness of the first region 515 is greater than the surface roughness of the second region 517. For example, the first region 515 of the outer surface 513 can be laser-engraved to form recesses and / or protrusions in the first region 515, thereby increasing the surface roughness of the first region 515 and thus achieving a surface roughness greater than that of the second region 517.

[0052] In this embodiment, the conductive layer 530 includes a first conductive layer 40 and a second conductive layer 60. The first conductive layer 40 covers the inner surface 511 of the shell body 510 and is electrically connected to the grounding portion of the middle plate 20 to achieve ground connection between the first conductive layer 40 and the middle plate 20. For example, in this embodiment, the first conductive layer 40 is an Ag layer. The Ag layer can be made very thin to reduce the mounting thickness of the second shell 500, thereby facilitating the reduction of the thickness of the electronic device 1 and thus contributing to the thinning and lightening of the electronic device 1.

[0053] The second conductive layer 60 covers the first region 515 of the outer side 513 of the housing body 510, so that when the electronic device 1 is in a folded state, the projection of the first pivot 610 on the housing body 510 at least partially overlaps with the second conductive layer 60. The second conductive layer 60 is electrically connected to the first conductive layer 40, so that the second conductive layer 60 is connected to the middle plate 20 through the first conductive layer 40, thereby connecting the second housing 500 to the middle plate 20, and thus grounding the second housing 500. The first region 515 has recesses and / or protrusions, giving it a high surface roughness. By placing the second conductive layer 60 in the first region 515 of the outer side 513, the adhesion of the second conductive layer 60 to the outer side 513 of the housing body 510 is improved, preventing the second conductive layer 60 from detaching from the housing body 510 in scenarios such as drops. In this embodiment, the second conductive layer 60 is spaced apart from the frame antenna 33 of the frame 30 to achieve relative insulation between the second conductive layer 60 and the frame antenna 33 of the frame 30. This ensures relative insulation between the conductive layer 530 and the frame antenna 33, preventing the second housing 500 from being directly connected to the frame antenna 33 of the frame 30. This avoids the second housing 500 acting as an extension of the antenna, thereby preventing any impact on the antenna efficiency of the frame antenna 33. In this embodiment, the distance H between the second conductive layer 60 and the frame antenna 33 along the X-axis is [missing information].

[0054] The second conductive layer 60 can be a metal plating layer. For example, in this embodiment, the second conductive layer 60 is a Ni-Cu-Ni layer, comprising an inner Ni layer, a Cu layer, and an outer Ni layer stacked sequentially. The inner Ni layer covers the first region 515 of the outer surface 513, the Cu layer covers the surface of the inner Ni layer facing away from the shell body 510, and the outer Ni layer covers the surface of the Cu layer facing away from the inner Ni layer. Since pure Ni has insufficient conductivity, while Cu has high conductivity but low adhesion and is easily oxidized, this embodiment uses an inner Ni layer as a base layer to further improve the adhesion of the second conductive layer 60 in the first region 515. The Cu layer is used to improve the conductivity of the second conductive layer 60. The outer Ni layer serves a protective function, preventing the Cu layer from being oxidized.

[0055] It is understood that the second conductive layer 60 can also be selected from other material layers capable of achieving high adhesion and high conductivity. This application does not limit the number of material layers in the second conductive layer 60. For example, Au has relatively high adhesion and conductivity, so the second conductive layer 60 can be only an Au layer. Based on the selection of material layers for the second conductive layer 60, for example, in other embodiments, the second conductive layer 60 can also be a Ni-Au layer, a Ni-Au-Ni layer, a Ni-Ag layer, a Rh-Au layer, or a Rh-Ag layer, etc.

[0056] A paint film layer 550 is applied to the outer surface 513 of the shell body 510 and covers the second conductive layer 60, so that the paint film layer 550 is disposed on the outer surface of the shell body 510 and at least partially covers the conductive layer 530. Specifically, in this embodiment, the paint film layer 550 covers the surface of the second conductive layer 60 facing away from the outer surface 513 and at least partially covers the second region 517 of the outer surface 513. For example, in this embodiment, the paint film layer 550 is an insulating layer. The paint film layer 550 can be used to protect the second conductive layer 530, thereby improving the wear resistance, corrosion resistance, and other properties of the second shell 500, and can also provide an aesthetic effect for the second shell 500. For example, the material of the paint film layer 550 is matte paint, and the paint film layer 550 can be formed by spraying.

[0057] In this embodiment, the electronic device 1 further includes a second circuit board, which has a grounding point and a feed point. The grounding point is electrically connected to the grounding portion of the middle plate 20 to ground the middle plate 20. The feed point is electrically connected to the frame antenna 33 of the frame 30 to realize the antenna function. Exemplarily, in this embodiment, the second circuit board is the main board of the electronic device 1, and the main board is located on one side of the middle plate 20 along the negative Z-axis. The grounding point and the grounding portion of the middle plate 20 can be connected by means of spring contacts, screws, etc. to realize the electrical connection between the grounding point and the grounding portion of the middle plate 20. The feed point and the frame antenna 33 of the frame 30 can be connected by means of spring contacts, screws, etc. to realize the electrical connection between the feed point 330 and the frame antenna 33 of the frame 30.

[0058] When the electronic device 1 is working, the second circuit board transmits the feed current to the frame antenna 33 of the frame 30 through the feed point, so that the frame antenna 33 can realize the antenna function. The second circuit board grounds the ground part of the middle board 20 through the ground point, so that the electronic device 1 can be grounded through the middle board 20.

[0059] See also Figure 1 The applicant's research found that when the electronic device 1 is in a folded state, the display screen 300 installed in different parts of the first housing 100 in the electronic device 1 will form a U-shaped cavity. External electromagnetic waves will enter the U-shaped cavity through the gap between the third part 130 of the first housing 100 and the part where the first rotating shaft 610 is installed. The large cavity formed by the display screen 300 cannot radiate, thus forming a cavity membrane risk, which in turn affects the overall signal strength of the electronic device 1.

[0060] To address the aforementioned issues, this application provides an electronic device 1. A conductive layer 530 is provided on the outer surface of the shell body 510 in the second housing 500, and this conductive layer 530 is electrically connected to the grounding portion of the middle plate 20. This allows the second housing 500 to be grounded via the conductive layer 530 to the middle plate 20. When the electronic device 1 is in a folded state, the first pivot 610 contacts the second housing 500. The projection of the first pivot 610 onto the shell body 510 of the second housing 500 at least partially overlaps with the conductive layer 530. Since the second housing 500 is grounded, a grounding shield can be formed between the first pivot 610 and the third portion 130. This shields electromagnetic waves from entering the U-shaped cavity formed by the display screen 300 in the folded state, solving the cavity membrane risk caused by the inability of the U-shaped cavity to radiate electromagnetic waves after they enter. This enhances the overall signal strength of the electronic device 1 and improves the user experience.

[0061] In this embodiment, when the electronic device 1 is in a folded state, the metal part (such as the shaft cover) of the first pivot 610 contacts the second housing 500, and the projection of the metal part on the shell body 510 of the second housing 500 at least partially overlaps with the second conductive layer 60 in the conductive layer 530.

[0062] It is understood that in the second housing 500 of this embodiment, the conductive layer 530 is covered with a paint film layer 550 on the surface opposite to the housing body 510. When the electronic device 1 is in a folded state, the metal part of the first rotating shaft 610 is in direct contact with the paint film layer 550. The paint film layer 550 is generally very thin, and due to the coupling effect of the current, it can achieve the shielding effect of the electronic device 1 against external electromagnetic waves, thereby improving the overall signal strength of the electronic device 1. It is understood that in some other embodiments, when the paint film layer 550 is not provided in the second housing 500, the second conductive layer 60 in the conductive layer 530 can be in direct contact with the metal part of the first rotating shaft 610 to form a grounding shield.

[0063] Furthermore, in this embodiment, by electrically connecting the second housing 500 to the grounding portion of the middle plate 20, the second housing 500 is grounded, rather than serving as an extension of the frame antenna 33. This avoids the problem that contact between the second housing 500 and the frame antenna 33 would affect the antenna efficiency of the electronic device 1. Additionally, in this embodiment, the design of grounding the second housing 500 through the conductive layer 530 is simple, occupies little space, allows for greater antenna clearance of the electronic device 1, and effectively meets the antenna grounding requirements.

[0064] Furthermore, by providing a conductive layer 530 including a first conductive layer 40 and a second conductive layer 60, and by providing the first conductive layer 40 covering the inner side 511 of the shell body 510 to be electrically connected to the grounding part of the middle plate 20, and providing the second conductive layer 60 covering the outer side 513 of the shell body 510 to be electrically connected to the first conductive layer 40, on the one hand, grounding can be formed on the outer side 513 of the shell body 510, satisfying the grounding requirement of the second shell 500; on the other hand, when the electronic device 1 is in a folded state, the first pivot 610 can easily form a grounding shield with the second conductive layer 60, thereby enhancing the overall signal strength of the electronic device 1 and improving the user experience.

[0065] See also Figure 3 , Figure 7 and Figure 8 , Figure 7 for Figure 4 The diagram shows the structure of part A in the partial structure shown. Figure 8 for Figure 4 The diagram shows a cross-sectional view of the partial structure. In this embodiment, the electronic device 1 also includes an electrical connector 700, which is installed between the first housing 100 and the second housing 500, and is electrically connected between the middle plate 20 of the first housing 100 and the conductive layer 530 of the second housing 500.

[0066] Specifically, the electrical connector 700 includes a fixing member 710 and a first circuit board 730. The fixing member 710 is installed in the mounting groove 21 in the middle plate 20 of the first housing 100, and the first circuit board 730 is installed between the fixing member 710 and the second housing 500, so that the electrical connector 700 can be installed between the first housing 100 and the second housing 500.

[0067] In this embodiment, the fixing member 710 is electrically connected to the middle plate 20, and the first circuit board 730 is electrically connected to the first conductive layer 40 of the conductive layer 530 in the second housing 500, so that the electrical connector 700 is electrically connected between the middle plate 20 and the conductive layer 530. For example, in this embodiment, the fixing member 710 is a steel sheet, which can be fixedly connected to the bottom wall of the mounting groove 21 by spot welding.

[0068] For example, the first circuit board 730 is a flexible printed circuit (FPC). The first circuit board 730 includes a fixing portion 731, a connecting portion 733, and a supporting portion 735, with the connecting portion 733 connected between the fixing portion 731 and the supporting portion 735. In this embodiment, the first circuit board 730 and the second circuit board are located on opposite sides of the middle plate 20 along its thickness direction. The fixing portion 731 is fixedly connected to the side of the fixing member 710 away from the middle plate 20 to achieve a fixed connection between the first circuit board 730 and the fixing member 710. For example, the fixing portion 731 can be fixedly connected to the fixing member 710 by spot welding or other methods. The supporting portion 735 is installed between the middle plate 20 and the shell body 510 of the second housing 500, and is electrically connected to the first conductive layer 40 of the conductive layer 530 in the second housing 500 to achieve an electrical connection between the first circuit board 730 and the conductive layer 530, thereby achieving an electrical connection between the electrical connector 700 and the middle plate 20 and the conductive layer 530. For example, the supporting portion 735 can be bonded to the middle plate 20 by means of adhesive backing.

[0069] In the electronic device of this application embodiment, by providing electrical connectors 700 to be electrically connected to the conductive layers 530 of the middle plate 20 and the second housing 500 respectively, good electrical contact can be achieved between the middle plate 20 and the conductive layers 530 of the second housing 500, ensuring good electrical contact between the middle plate 20 and the second housing 500, thereby ensuring the grounding effect of the second housing 500.

[0070] Furthermore, by providing the electrical connector 700, which includes a fixing member 710 and a first circuit board 730, the electrical connector 700 is fixedly connected to the middle plate 20 via the fixing member 710, improving the installation stability between the electrical connector 700 and the middle plate 20. On the other hand, the electrical connector 700 is electrically connected to the middle plate 20 via the fixing member 710 and to the conductive layer 530 of the second housing 500 via the supporting portion 735 of the first circuit board 730. This ensures good electrical contact between the middle plate 20 and the conductive layer 530 of the second housing 500, thereby guaranteeing the grounding effect of the second housing 500. In addition, when the first circuit board 730 is a flexible circuit board, it can bend to conform to the shape of the middle plate 20, facilitating installation and maintaining good electrical contact between the first circuit board 730 and the conductive layer 530.

[0071] Continue reading Figure 6 , Figure 7 and Figure 8To facilitate the installation of the second housing 500 and improve its stability on the first housing 100, in this embodiment, the housing body 510 of the second housing 500 further includes a pin 70, which is mounted to the frame 30 of the first housing 100 via the pin 70. The electronic device also includes a spring contact 800, which is mounted to the frame 30 and abuts against the pin 70.

[0072] Specifically, the housing body 510 includes a main housing 50 and a pin 70, with the pin 70 protruding from the main housing 50. The pin 70 protrudes relative to the main housing 50 along a first direction. In this embodiment, the first direction is the negative Z-axis direction. The surfaces of the main housing 50 and the pin 70 facing the inner side of the electronic device 1 together constitute the inner surface 511 of the housing body 510, and the surface of the main housing 50 facing the outer side of the electronic device 1 constitutes the outer surface 513 of the housing body 510. The outer surface of the pin 70 includes a peripheral surface and an end surface, with the peripheral surface surrounding the edge of the end surface.

[0073] In this embodiment, the spring 800 includes a fixing part 810 and an elastic part 830, and the elastic part 830 is fixedly connected to the fixing part 810. In this embodiment, the elastic part 830 is fixedly connected to one end of the fixing part 810 and extends in a direction away from the thickness of the fixing part 810, and the spring 800 is approximately "L" shaped.

[0074] In the assembly structure of the second housing 500, the first housing 100, and the spring piece 800, the insert 70 in the shell body 510 of the second housing 500 is located in the slot 37 of the frame 30. The peripheral side of the insert 70 is opposite to the side wall of the slot 37, and the end face is opposite to the bottom wall of the slot 37. The main housing 50 at least partially covers the opening of the slot 37. The fixing part 810 of the spring piece 800 is installed on the frame 30 to realize the installation of the spring piece 800 on the frame 30. The elastic part 830 is located in the slot 37 and abuts against the peripheral side of the insert 70 to realize the spring piece 800 abuts against the insert 70. The spring piece 800 abuts against the insert 70 along a second direction. The second direction is not parallel to the first direction to improve the installation stability of the second housing 500. In this embodiment, the second direction is the X-axis direction, and the elastic part 830 abuts against the peripheral side of the insert 70 along the X-axis direction.

[0075] In this embodiment, the fixing part 810 is located on the side of the supporting portion 735 of the first circuit board 730 away from the middle plate 20, and is installed between the supporting portion 735 and the main housing 50 of the housing body 510. For example, in this embodiment, the fixing part 810 is generally plate-shaped. The fixing part 810 is mounted to the supporting portion 735 of the first circuit board 730 using surface mount technology (SMT) and is spot-welded to the frame 30. In this embodiment, the fixing part 810 is electrically connected between the first circuit board 730 and the first conductive layer 40 of the conductive layer 530. It also enables the first circuit board 730 to make electrical contact with the first conductive layer 40 of the conductive layer 530 through the fixing part 810, thereby allowing the middle plate 20 to make electrical contact with the conductive layer 530 through the fixing part 810 of the spring clip 800. This improves the electrical contact between the middle plate 20 and the second housing 500, ensuring that the second housing 500 can be successfully grounded.

[0076] In the electronic device provided in this application embodiment, a slot 37 is provided in the frame 30, and the pins 70 of the housing body 510 are located in the slot 37, with a spring piece 800 abutting against the pins 70 of the housing body 510. On the one hand, when installing the second housing 500, it is only necessary to insert the pins 70 of the housing body 510 in the second housing 500 into the slot 37, and the spring piece 800 abutting against the pins 70 to achieve the installation and fixation of the second housing 500, thereby improving the installation stability of the second housing 500 on the frame 30, and the installation process of the second housing 500 is simple, which is conducive to improving the installation efficiency of the second housing 500. On the other hand, the spring piece 800 is elastic and can adapt to different sizes of pins 70, reducing the installation tolerance of the pins 70 of the second housing 500 in the slot 37.

[0077] Furthermore, in this embodiment, by setting the elastic portion 830 of the spring 800 to abut against the peripheral side of the pin 70, the spring 800 generates a holding force against the peripheral side of the pin 70, thereby causing the spring 800 to generate a holding force against the second housing 500 in the lateral direction, thus avoiding the problem that the second housing 500 would float when the spring 800 generates a holding force against the second housing 500 in the thickness direction of the electronic device 1.

[0078] See Figure 9 , Figure 10 and Figure 11 , Figure 9 for Figure 1 The exploded structural diagram of a portion of the electronic device 1 in the second example shown is a schematic diagram of its structure. Figure 10 for Figure 9 The diagram shows the structure of the spring piece 800 in the partial structure shown. Figure 11 for Figure 9The diagram shows the structure of part B in the partial structure shown.

[0079] The difference between the electronic device 1 in the second example and the electronic device 1 in the second example is that the structure and installation position of the spring 800 of the electronic device in the second embodiment are different from those in the second example.

[0080] In the first housing 100 of the second example electronic device 1, a spring 800 is mounted on the bottom wall of a slot 37. The spring 800 has a insertion hole 801, and the opening of the insertion hole 801 faces the opening of the slot 37. Specifically, the spring 800 includes a fixing part 810, a first elastic part 850, and a second elastic part 870. The first elastic part 850 and the second elastic part 870 are connected to the same side of the fixing part 810 and are spaced apart from each other.

[0081] In this embodiment, the fixing part 810 is generally plate-shaped. The first elastic part 850 and the second elastic part 870 are connected to one side of the fixing part 810 along the positive Z-axis. The first elastic part 850 and the second elastic part 870 form a insertion hole 801 at intervals. The surfaces of the first elastic part 850 and the second elastic part 870 facing the insertion hole 801 constitute the inner wall of the insertion hole 801.

[0082] See also Figure 12 , Figure 12 for Figure 9 The diagram shows a cross-sectional view of the partial structure. In the assembly structure of the second housing 500, the first housing 100, and the spring piece 800, the fixing part 810 of the spring piece 800 is installed on the bottom wall of the slot 37 of the frame 30, so that the spring piece 800 is installed on the bottom wall of the slot 37. The first elastic part 850 and the second elastic part 870 are located on the side of the fixing part 810 away from the bottom wall of the slot 37. The insert 70 in the shell body 510 of the second housing 500 is located in the slot 37 of the frame 30, and the main housing 50 at least partially covers the opening of the slot 37. The insert 70 is inserted between the first elastic part 850 and the second elastic part 870, so that the insert 70 is inserted into the insertion hole 801. At this time, the peripheral side of the insert 70 abuts against the surfaces of the first elastic part 850 and the second elastic part 870 facing the insertion hole 801, so that the peripheral side of the insert 70 abuts against the inner wall of the insertion hole 801.

[0083] In the electronic device 1 provided in this embodiment, by installing the fixing part 810 of the spring piece 800 on the bottom wall of the slot 37, and setting the opening of the insertion hole 801 in the spring piece 800 to face the opening of the slot 37, the inner wall of the insertion hole 801 abuts against the pin 70, so that the spring piece 800 can generate a clamping force on the pin 70 in the lateral direction. On the one hand, this improves the installation stability of the second housing 500, and on the other hand, it also enables the spring piece 800 to generate a supporting force on the second housing 500 in the lateral direction, avoiding the problem that the second housing 500 will float when the spring piece 800 generates a supporting force on the second housing 500 in the thickness direction of the electronic device 1.

[0084] In addition, in conjunction with reference Figure 6 and Figure 11 In the electronic device 1 of this application embodiment, the frame 30 may have multiple slots 37, and the multiple slots 37 are arranged at intervals from each other. For example, Figure 6 In addition to the slot 37 located at position A, slots 37 can also be located at positions A1 to A5. Figure 11 In addition to the slot 37 at position B, slots 37 can also be set at positions B1 to B5 respectively.

[0085] In electronic device 1, each pin 70 in the housing body 510 of the second housing 500 is located in a slot 37. Multiple spring clips 800 are present, each spring clip 800 being installed in a slot 37 and abutting against a pin 70. The spring clip 800 can be any of the spring clips 800 described in the first or second example above.

[0086] At this time, the middle plate 20 of the electronic device 1 can have multiple mounting slots 21, which are spaced apart from each other. For example, Figure 6 In addition to the mounting slot 21 at position A, mounting slots 21 can also be provided at positions A1 to A5 respectively. Figure 11 In addition to the mounting slot 21 in part B, mounting slots 21 can also be provided at positions B1 to B5. The conductive layer 530 of the second housing 500 has multiple first conductive layers 40 (see...). Figure 7 Multiple first conductive layers 40 are spaced apart from each other and are all electrically connected to the second conductive layer 60.

[0087] There are multiple electrical connectors 700. The fixing member 710 of each electrical connector 700 is installed in a mounting groove 21. The first circuit board 730 of each electrical connector 700 is connected to the side of the fixing member 710 away from the middle plate 20 and is electrically connected to a first conductive layer 40, so that each electrical connector 700 is electrically connected between the middle plate 20 and the second housing 500.

[0088] In the electronic device of this application embodiment, by setting the shell body 510 of the second shell 500 to include a plurality of pins 70, and by using a plurality of spring pieces 800 to abut against the plurality of pins 70 respectively, the installation stability of the second shell 500 on the frame 30 can be improved, thereby facilitating the use of the electronic device 1 in scenarios such as drops.

[0089] Furthermore, by setting the conductive layer 530 of the second housing 500 to include multiple first conductive layers 40, and by using multiple electrical connectors 700 to be electrically connected to the multiple first conductive layers 40 respectively, the middle plate 20 can be electrically connected to the second conductive layer 60 of the second housing 500 through the multiple electrical connectors 700, thereby enabling the current of the middle plate 20 to be quickly transmitted to the second housing 500 through multiple paths, and thus enabling the second housing 500 to be quickly grounded.

[0090] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments and equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes a first housing, a first rotating shaft, a second rotating shaft, and a second housing. The first housing includes a first part, a second part, and a third part. The first rotating shaft is connected between the first part and the second part, and the second rotating shaft is connected between the second part and the third part. The first housing includes a middle plate and a frame. The middle plate includes a grounding portion for grounding. The frame surrounds the periphery of the middle plate and includes a frame antenna. The second housing is mounted on the frame of the third part. The second housing includes a shell body and a conductive layer. The conductive layer is disposed on the outer surface of the shell body and is electrically connected to the grounding portion. The electronic device is in a folded state, and when the electronic device is in the folded state, the projection of the first rotating shaft on the shell body at least partially overlaps with the conductive layer.

2. The electronic device according to claim 1, characterized in that, The outer surface of the shell body includes an inner side and an outer side connected to the inner side. The conductive layer includes a first conductive layer and a second conductive layer. The first conductive layer covers the inner side of the shell body and is electrically connected to the middle plate. The second conductive layer covers the outer side of the shell body and is electrically connected to the first conductive layer. When the electronic device is in the folded state, the projection of the first rotating shaft on the shell body at least partially overlaps with the second conductive layer.

3. The electronic device according to claim 1, characterized in that, The frame antenna is provided with a slot. The housing body includes a main housing and a pin. The main housing at least partially covers the opening of the slot. The pin protrudes from the main housing and is located in the slot. The electronic device also includes a spring clip. The spring clip is installed on the frame. At least part of the spring clip is located in the slot and abuts against the pin.

4. The electronic device according to claim 3, characterized in that, The pin includes a peripheral side surface, which is disposed opposite to the slot sidewall of the slot. The spring includes a fixing part and an elastic part. The fixing part is installed on the frame, and the elastic part is fixedly connected to the fixing part and located in the slot, and abuts against the peripheral side surface of the pin.

5. The electronic device according to claim 4, characterized in that, The fixing part is electrically connected between the middle plate and the conductive layer.

6. The electronic device according to claim 3, characterized in that, The pin includes a peripheral side surface, which is disposed opposite to the side wall of the slot. The spring is installed on the bottom wall of the slot and has a insertion hole with the opening facing the opening of the slot. The pin is inserted into the insertion hole and the peripheral side surface abuts against the inner wall of the insertion hole.

7. The electronic device according to claim 6, characterized in that, The spring includes a fixing part, a first elastic part and a second elastic part. The fixing part is installed on the bottom wall of the slot. The first elastic part and the second elastic part are both located on the side of the fixing part away from the bottom wall of the slot. The first elastic part and the second elastic part are spaced apart to form the insertion hole. The pin is inserted between the first elastic part and the second elastic part and abuts against the surfaces of the first elastic part and the second elastic part facing the insertion hole.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The electronic device further includes an electrical connector, which is mounted on the first housing and electrically connected between the middle plate and the conductive layer.

9. The electronic device according to claim 8, characterized in that, The middle plate is provided with a mounting groove. The electrical connector includes a fixing member and a first circuit board. The fixing member is installed in the mounting groove. The first circuit board includes a fixing part, a connecting part and a supporting part. The fixing part is connected to the side of the fixing member away from the middle plate. The connecting part is connected between the fixing part and the supporting part. The supporting part is electrically connected to the conductive layer.

10. The electronic device according to claim 9, characterized in that, The electronic device further includes a second circuit board, which is mounted on the side of the middle plate away from the first circuit board. The second circuit board has a grounding point and a power supply point. The grounding point is electrically connected to the grounding part, and the power supply point is electrically connected to the frame antenna.

11. The electronic device according to claim 2, characterized in that, The second housing further includes a paint film layer, which is disposed on the outer side of the housing body and covers the second conductive layer.

12. The electronic device according to claim 2, characterized in that, The outer surface includes a first region, the first region having recesses and / or protrusions, and the second conductive layer covering the first region.

13. The electronic device according to any one of claims 3 to 6, characterized in that, There are multiple slots, which are spaced apart from each other. There are multiple pins, which are located on the same side of the main shell and spaced apart from each other. Each pin is located in one of the slots. There are multiple spring clips, which are installed in one of the slots and between the frame and one of the pins.

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