Display device and electronic device

Abstract

A display device and an electronic device are disclosed. The display device includes a display panel including a first surface and a second surface opposite to each other; and a heat dissipation member including: a first heat dissipation layer disposed on the second surface of the display panel; and the second heat dissipation layer is arranged on the first heat dissipation layer.

Description

Technical Field

[0001] This disclosure relates to a display device including a display panel. Background Technology

[0002] Examples of display devices include liquid crystal displays (“LCDs”), plasma display panels (“PDPs”), organic light-emitting diode (“OLED”) devices, field-effect displays (“FEDs”), and electrophoretic display devices.

[0003] The light-emitting display device includes two electrodes and a light-emitting layer disposed between them, wherein electrons injected from one electrode combine with holes injected from the other electrode in the light-emitting layer to form excitons, and the excitons emit light while emitting energy.

[0004] The internal temperature of a light-emitting display device increases due to the heat generated during operation. As the internal temperature of the display device increases, the thermistor light-emitting layer may deteriorate. When the light-emitting layer and other components deteriorate, the lifespan of the light-emitting display device may be shortened, and the display quality may be compromised. Summary of the Invention

[0005] The embodiments attempt to provide a display device that has improved heat dissipation even when multiple heating zones are present.

[0006] The display device in one embodiment includes: a display panel including a first surface and a second surface opposite to each other; and a heat dissipation member including: a first heat dissipation layer disposed on the second surface of the display panel; and a second heat dissipation layer disposed on the first heat dissipation layer.

[0007] In one embodiment, the first heat dissipation layer may include a plurality of first heat dissipation fins arranged along a first direction or a second direction intersecting the first direction.

[0008] In one embodiment, the second heat dissipation layer may include a plurality of second heat dissipation fins arranged along a first direction or a second direction intersecting the first direction.

[0009] In one embodiment, adjacent first heat sinks among the plurality of first heat sinks may be separated by a first boundary line extending in the second direction, and the plurality of second heat sinks may include second heat sinks covering the first boundary line.

[0010] In one embodiment, the edge of a first heat sink extending in a first direction may be aligned with the edge of a second heat sink extending in the first direction.

[0011] In one embodiment, the first heat dissipation layer may include a plurality of first heat sinks separated by a second boundary line extending in a first direction, and the second heat dissipation layer may include a second heat sink covering the second boundary line.

[0012] In one embodiment, the first heat dissipation layer may include a plurality of first heat dissipation fins separated by a first boundary line extending in the second direction and a second boundary line extending in the first direction, and the second heat dissipation fins may not cover the first boundary line or the second boundary line.

[0013] In one embodiment, at least one edge of the first heat sink may be offset from at least one edge of the second heat sink.

[0014] In one embodiment, the distance between adjacent (or neighboring) first heat sinks among the plurality of first heat sinks may be less than 3 mm, and the distance between adjacent (or neighboring) second heat sinks among the plurality of second heat sinks may be less than 3 mm.

[0015] In one embodiment, at least one of the first heat sink and the second heat sink may include a vapor chamber.

[0016] In one embodiment, at least one of the first heat sink and the second heat sink may include a pulsating heat pipe.

[0017] In one embodiment, the first heat sink may include a first tube, which includes a first straight flow path, a first connecting flow path, and a first closed flow path; the second heat sink may include a second tube, which includes a second straight flow path, a second connecting flow path, and a second closed flow path; and the first tube and the second tube may be closed-loop pulsating heat pipes.

[0018] In one embodiment, at least one of the cross sections of the first straight flow path and the second straight flow path may include a first region, a second region, and a third region having diameters different from each other.

[0019] In one embodiment, the extension direction of the first straight flow path and the extension direction of the second straight flow path may be parallel to each other.

[0020] In one embodiment, the first straight flow path and the second straight flow path may intersect each other.

[0021] In one embodiment, a first straight flow path may extend in a first direction, and a second straight flow path may extend in a second direction.

[0022] In one embodiment, the first straight flow path and the second straight flow path may extend in an oblique direction relative to the first direction and the second direction.

[0023] In one embodiment, the extension direction of the first straight flow path and the extension direction of the second straight flow path may be parallel to each other.

[0024] In one embodiment, the extension directions of the first straight flow path and the extension directions of the second straight flow path may intersect each other.

[0025] In one embodiment, the display panel may include: a substrate, a transistor disposed on the substrate, a pixel electrode electrically connected to the transistor, a light-emitting layer disposed on the pixel electrode, and a common electrode disposed on the light-emitting layer.

[0026] One embodiment of the display device includes: a display panel, including a first surface from which light for displaying an image can be emitted and a second surface opposite to the first surface; and a heat dissipation member, including a first heat dissipation layer disposed on the second surface and a second heat dissipation layer disposed on the first heat dissipation layer.

[0027] In one embodiment, the first heat dissipation layer may include at least one first heat sink arranged along a first direction or a second direction intersecting the first direction, and the second heat dissipation layer may include at least one second heat sink arranged along the first direction or the second direction.

[0028] An electronic device in one embodiment includes: a heat source including a surface; and a heat dissipation member including a first heat dissipation layer disposed on the one surface of the heat source and a second heat dissipation layer disposed on the first heat dissipation layer.

[0029] In one embodiment, each of the first heat dissipation layer and the second heat dissipation layer may include a first heat sink and a second heat sink, and at least one of the first heat dissipation layer and the second heat dissipation layer may include a plurality of first heat sinks or a plurality of second heat sinks.

[0030] In one embodiment, the heat source may include the display panel of the display device.

[0031] Through these embodiments, the heat dissipation rate generated in the display panel can be improved. Correspondingly, localized temperature rise in the display panel can be prevented, thereby preventing damage caused by heat from heat sources within the display panel. Therefore, the display quality of the display device can be improved, and the lifespan characteristics of the display device can be extended.

[0032] Through these examples, heat dissipation is possible even when using relatively large display panels. Accordingly, even in relatively large display panels, it is possible to effectively dissipate heat and suppress localized temperature rises. Furthermore, even in relatively large display panels, the manufacturing costs for arranging heat dissipation devices can be reduced. Attached Figure Description

[0033] The above and other embodiments, advantages and features of this disclosure will become more apparent from the further detailed description of the embodiments of this disclosure with reference to the accompanying drawings.

[0034] Figure 1 This is a schematic top view of one embodiment of a display device.

[0035] Figure 2 This is a schematic cross-sectional view of a portion of an embodiment of the display area of ​​a display device.

[0036] Figure 3 This is a schematic side view of one embodiment of a display device.

[0037] Figure 4 This is a schematic side view of one embodiment of a heat dissipation component applied to a display device.

[0038] Figure 5 for Figure 4 An enlarged view of area A.

[0039] Figure 6 To show the basis Figure 5 The graph shows the thermal diffusion effect of the distance between adjacent (or nearby) heat sinks of the heat dissipation component.

[0040] Figure 7 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device.

[0041] Figure 8 for Figure 7 The diagram shows a schematic top view of the heat dissipation components.

[0042] Figure 9 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device.

[0043] Figure 10 for Figure 9 The diagram shows a schematic top view of the heat dissipation components.

[0044] Figure 11 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device.

[0045] Figure 12 for Figure 11 The diagram shows a schematic top view of the heat dissipation components.

[0046] Figure 13 This is a graph showing the temperature variation with respect to the distance from the heat source when using a steam chamber.

[0047] Figures 14 to 21 This is a schematic exploded perspective view of a heat dissipation component applied to a display device according to various embodiments.

[0048] Figure 22 This is a schematic top view of one embodiment of a heat sink applied to a display device.

[0049] Figures 23 to 25 This is a schematic side view of one embodiment of a display device.

[0050] Figure 26 This is a block diagram of one embodiment of an electronic device.

[0051] Figure 27 This is a schematic diagram of an electronic device according to various embodiments. Detailed Implementation

[0052] The present disclosure will be described in detail below with reference to the accompanying drawings illustrating embodiments thereof. As those skilled in the art will recognize, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure.

[0053] The accompanying drawings and descriptions should be considered illustrative in nature, not restrictive, and the same reference numerals denote the same elements throughout the specification.

[0054] Furthermore, since the dimensions and thicknesses of the components shown in the accompanying drawings can be arbitrarily given for ease of understanding and description, this disclosure is not limited to the illustrated dimensions and thicknesses. In the drawings, the thicknesses of layers, films, panels, areas, etc., are enlarged for clarity. In the drawings, the thicknesses of some layers and areas may be enlarged for ease of understanding and description.

[0055] It should be understood that when an element (such as a layer, film, region, or substrate) is referred to as being "on" another element, it may be directly on the other element, or an intervening element may be present. Conversely, when an element is referred to as being "directly on" another element, no intervening element is present. Furthermore, when an element is referred to as being "on" or "above" a reference element, it may be positioned above or below the reference element, and it need not necessarily be referred to as being positioned "on" or "above" the reference element in a direction opposite to gravity.

[0056] Furthermore, unless explicitly stated otherwise, the word “including” and its variations should be understood to imply the inclusion of the stated elements, but not to exclude any other elements.

[0057] Additionally, the phrase "in a plan view" refers to a view taken from above the object (e.g., from the top), and the phrase "in a cross section" refers to a view of a cross section of the object cut vertically from the side.

[0058] Figure 1 This is a schematic top view of one embodiment of a display device. Figure 2This is a schematic cross-sectional view showing a portion of the display area of ​​an embodiment of a display device.

[0059] refer to Figure 1 The display device 1 may include a display panel DP, a flexible printed circuit board 20, a driver integrated circuit chip 30, a printed circuit board 40, a power module 50, etc.

[0060] The display panel DP may include a display area DA corresponding to the screen used for displaying images, and a non-display area NA provided with circuitry and wiring for generating and transmitting various signals applied to the display area DA. The non-display area NA may be adjacent to (or near) the display area DA, or may surround the display area DA. Figure 1 In the diagram, the inner and outer regions of the boundary line B can be the display area DA and the non-display area NA, respectively.

[0061] The display area DA of the display panel DP may include pixels PX arranged in a matrix. Additionally, a data line DL for transmitting data voltage, a drive voltage line VL1 for transmitting drive voltage, a common voltage line VL2 for transmitting a common voltage, and an initialization voltage line VL3 for transmitting an initialization voltage may be disposed in the display area DA. The drive voltage line VL1, the common voltage line VL2, and the initialization voltage line VL3 may extend in a second direction (e.g., the y-axis direction). At least one of the drive voltage line VL1, the common voltage line VL2, and the initialization voltage line VL3 may be connected to an auxiliary voltage line extending in a first direction (e.g., the x-axis direction).

[0062] The non-display area NA of the display panel DP may include a drive voltage transmission line DVL, a common voltage transmission line CVL, etc., connected to the drive voltage line VL1. Each of the drive voltage transmission line DVL and the common voltage transmission line CVL may include a portion extending in a generally longitudinal direction (e.g., the y-axis direction) and a portion extending in a generally width direction (e.g., the x-axis direction). The common voltage transmission line CVL may be configured to surround the display area DA.

[0063] The flexible printed circuit board 20 may have one end connected or coupled to a display unit DS of a display panel DP and the opposite end connected or coupled to the printed circuit board 40. The flexible printed circuit board 20 may have a driver integrated circuit chip 30 disposed thereon, the driver integrated circuit chip 30 including a data driver.

[0064] A power supply module 50 for generating power supply voltages such as drive voltage and common voltage may be disposed on a printed circuit board 40. The power supply module 50 may be provided in the form of an integrated circuit chip. A signal controller (not shown) for controlling the data driver and gate driver may be disposed on the printed circuit board 40.

[0065] refer to Figure 2 The display panel DP may include a lower substrate SUB, a display unit DS, and an upper substrate 10.

[0066] The lower substrate SUB may comprise a material with rigid properties (such as glass) or a material with flexible properties (such as plastic). In one embodiment, the lower substrate SUB may be a glass substrate. The lower substrate SUB may comprise, for example, a polymer material.

[0067] The display unit DS may include a buffer layer BF, a transistor TR, insulating layers GI1, GI2, IL and VIA, a pixel defining layer PDL, a light-emitting device LE, a cover layer CPL and an encapsulation layer EN.

[0068] A buffer layer BF can be disposed on the lower substrate SUB. When the semiconductor layer AL is formed, the buffer layer BF can block impurities from the lower substrate SUB, thereby improving the characteristics of the semiconductor layer, and can also relieve stress on the semiconductor layer AL by planarizing the surface of the lower substrate SUB. The buffer layer BF can be an inorganic insulating layer that may include inorganic insulating materials, and can have a single-layer structure or a multi-layer structure.

[0069] A first conductive layer may be disposed on a lower substrate SUB. In one embodiment, the first conductive layer, which may include a light-shielding pattern, may be disposed between the lower substrate SUB and the buffer layer BF. The components included in the first conductive layer may be formed using the same process and the same material. In one embodiment, a conductive layer may be deposited and patterned on the lower substrate SUB to form, for example, a data line DL, a drive voltage line VL1, a common voltage line VL2, an initialization voltage line VL3, and a light-shielding pattern.

[0070] The transistor TR may be disposed on the lower substrate SUB. In one embodiment, for example, the transistor TR may be disposed on the buffer layer BF, which is disposed on the lower substrate SUB.

[0071] The semiconductor layer AL of the transistor TR may be disposed on the lower substrate SUB. The semiconductor layer AL may include a first semiconductor region, a second semiconductor region, and a channel region disposed between the first semiconductor region and the second semiconductor region. The semiconductor layer AL may include any one of amorphous silicon, polycrystalline silicon, and oxide semiconductor. In one embodiment, the semiconductor layer AL may include, for example, an oxide semiconductor material.

[0072] The first insulating layer GI1 may be disposed on the semiconductor layer AL. The first insulating layer GI1 may also be referred to as the first gate insulating layer. The first insulating layer GI1 may include an inorganic insulating material. The first insulating layer GI1 may have a single-layer structure or a multi-layer structure.

[0073] A gate conductive layer, including the gate electrode GE of a transistor TR, may be disposed on the first insulating layer GI1. The gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer structure or a multi-layer structure.

[0074] The second insulating layer GI2 may be disposed on the gate conductive layer. The second insulating layer GI2 may also be referred to as the second gate insulating layer. The second insulating layer GI2 may include inorganic insulating material, and the second insulating layer GI2 may have a single-layer structure or a multi-layer structure.

[0075] An interlayer insulating layer IL may be disposed on the second insulating layer GI2. The interlayer insulating layer IL may comprise an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride. The interlayer insulating layer IL may have a single-layer structure or a multilayer structure. An additional gate conductive layer may be disposed on the interlayer insulating layer IL.

[0076] A data conductive layer, including a first lower electrode SE and a second lower electrode DE of a transistor TR, may be disposed on an interlayer insulating layer IL. The first lower electrode SE and the second lower electrode DE may be connected to a first semiconductor region and a second semiconductor region of a semiconductor layer AL through contact holes defined in insulating layers GI1, GI2 and IL, respectively. One of the first lower electrode SE and the second lower electrode DE may be a source electrode, and the remaining one (or the other) may be a drain electrode.

[0077] The data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), etc., and may have a single-layer structure or a multi-layer structure. In one embodiment, the data conductive layer may include a lower layer containing a refractory metal, an intermediate layer containing a low-resistivity metal, and an upper layer containing a refractory metal.

[0078] The third insulating layer VIA may be disposed on the data conductive layer. The third insulating layer VIA may also be referred to as a planarization layer. In one embodiment, for example, the third insulating layer VIA may be disposed on a transistor TR including a semiconductor layer AL, a gate electrode GE, a first lower electrode SE, and a second lower electrode DE. The third insulating layer VIA may be disposed on the second insulating layer GI2.

[0079] The third insulating layer (VIA) may include an organic insulating material, including common general-purpose polymers, polymer derivatives with phenolic groups, acrylic polymers, imide polymers, or siloxane polymers.

[0080] The light-emitting device LE may be disposed on the third insulating layer VIA. The light-emitting device LE may include a pixel electrode E1, a light-emitting layer EL, and a common electrode E2. The light-emitting device LE is disposed on the third insulating layer VIA and may be electrically connected to the transistor TR.

[0081] The light-emitting device LE may include a pixel electrode E1. The pixel electrode E1 may be disposed on a third insulating layer VIA disposed on a lower substrate SUB. The pixel electrode E1 may serve as the anode of the light-emitting device LE. The pixel electrode E1 may be electrically connected to a transistor TR. In one embodiment, for example, the pixel electrode E1 may be connected to a second lower electrode DE of the transistor TR through a contact hole defined in the third insulating layer VIA.

[0082] The pixel electrode E1 may include or be composed of a reflective conductive material or a semi-transparent conductive material, or may include or be composed of a transparent conductive material. The pixel electrode E1 may include a metal or a metal alloy. The pixel electrode E1 may have a multilayer structure.

[0083] A pixel defining layer PDL, which defines an opening overlapping with the pixel electrode E1, may be disposed on the third insulating layer VIA. The pixel electrode E1 may be disposed within the opening in the pixel defining layer PDL. The opening may correspond to the light-emitting area of ​​the light-emitting device LE.

[0084] The pixel-defining layer (PDL) may include organic insulating materials.

[0085] The light-emitting layer EL may be disposed on at least one of the pixel electrode E1 and the pixel defining layer PDL. The light-emitting layer EL is a layer that enables electro-optical transmission through the combination of electrons and holes, and may include at least one of organic and inorganic materials that emit light of a predetermined color. The light-emitting layer EL may be disposed in an opening of the pixel defining layer PDL and may overlap with the pixel electrode E1. A portion of the light-emitting layer EL may be disposed on the pixel defining layer PDL. The light-emitting layer EL may include an organic light-emitting diode or an inorganic light-emitting diode.

[0086] A functional layer may be disposed below or above the light-emitting layer EL. The functional layer may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The functional layer may include a first functional layer disposed between the pixel electrode E1 and the light-emitting layer EL, and a second functional layer disposed between the light-emitting layer EL and the common electrode E2. The first functional layer may include at least one of a hole injection layer and a hole transport layer. The second functional layer may include at least one of an electron transport layer and an electron injection layer. The functional layer may span as shown in the reference. Figure 1 The entire display area DA is described. Functional layers can be positioned within the openings of the pixel-limiting layer (PDL). Functional layers can also be positioned outside the openings of the pixel-limiting layer (PDL).

[0087] A common electrode E2 may be disposed on at least one of the light-emitting layer EL and the functional layer. A pixel electrode E1 may serve as the anode of the light-emitting device LE, and a common electrode E2 may serve as the cathode of the light-emitting device LE. The common electrode E2 may span as shown in the reference. Figure 1 The DA settings for the entire display area are described.

[0088] The common electrode E2 may comprise a metal or metal alloy having a relatively low work function. In one embodiment, for example, light transmittance may be achieved by forming a relatively thin layer of a metal or metal alloy having a relatively low work function. The common electrode E2 may comprise a transparent conductive oxide.

[0089] The common electrode E2, together with the pixel electrode E1 and the light-emitting layer EL, can form a light-emitting device LE. The light-emitting device LE may include functional layers, which include a first functional layer and a second functional layer.

[0090] The capping layer CPL can be placed on the common electrode E2. The optical efficiency of the capping layer CPL can be improved by adjusting its refractive index.

[0091] The encapsulation layer EN can be disposed on the capping layer CPL. The encapsulation layer EN can encapsulate the light-emitting device LE, including the light-emitting layer EL, to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EN can be a thin film encapsulation layer including one or more inorganic layers EIL1 and EIL2 and one or more organic layers EOL.

[0092] The upper substrate 10 may be disposed on the display unit DS. The upper substrate 10 may comprise a material substantially the same as that of the lower substrate SUB. The upper substrate 10 may comprise a material having rigid properties (such as glass) or a material having flexible properties (such as plastic). In one embodiment, for example, the upper substrate 10 may be a glass substrate and may also comprise a polymer material.

[0093] Figure 3 This is a schematic side view of one embodiment of a display device. Figure 4 This is a schematic side view of one embodiment of a heat dissipation component applied to a display device.

[0094] refer to Figure 3 The heat dissipation component 100 may be disposed on at least one surface of the display panel DP.

[0095] The display panel DP may include a first surface S1 and a second surface S2 that are opposite to each other. The first surface S1 may refer to the surface from which light is emitted from the display unit DS of the display panel DP to the outside of the display panel DP. The first surface S1 may refer to the surface on which an image emitted from the display unit DS can be displayed, thus making the image recognizable from the outside of the display panel DP. In one embodiment, for example, the first surface S1 may refer to the surface of the upper substrate 10 on which the display panel DP is disposed. The second surface S2 may refer to the surface from which light is not emitted from the display unit DS of the display panel DP to the outside of the display panel DP. The second surface S2 may refer to the surface on which the image of the display panel DP is not visible from the outside. In one embodiment, for example, the second surface S2 may refer to the surface of the lower substrate SUB on which the display panel DP is disposed. A heat dissipation member 100 may be disposed on the second surface S2 of the display panel DP. In one embodiment, for example, the lower substrate SUB of the display panel DP may be disposed on the heat dissipation member 100.

[0096] The heat dissipation component 100 may include a first heat dissipation layer 110 and a second heat dissipation layer 120. The first heat dissipation layer 110 may be disposed on the second surface S2 of the display panel DP. The second heat dissipation layer 120 may be disposed on the first heat dissipation layer 110. The first heat dissipation layer 110 may be disposed between the display panel DP and the second heat dissipation layer 120. In one embodiment, for example, the first heat dissipation layer 110 may be disposed on the display panel DP, and the second heat dissipation layer 120 may be disposed on the first heat dissipation layer 110.

[0097] The first heat dissipation layer 110 may include a plurality of first heat sinks 115 arranged along a first direction (e.g., the x-axis direction). Because the first heat dissipation layer 110 may include a plurality of first heat sinks 115, the manufacturing process can be simplified and the manufacturing cost reduced even when a relatively large panel is used as the display panel DP.

[0098] The second heat dissipation layer 120 may include a plurality of second heat sinks 125 arranged along a first direction (e.g., the x-axis direction). Because the second heat dissipation layer 120 may include a plurality of second heat sinks 125, the manufacturing process can be simplified and the manufacturing cost reduced even when a relatively large panel is used as the display panel DP.

[0099] exist Figure 3 In this embodiment, the first heat dissipation layer 110 is illustrated as including a plurality of first heat sinks 115 arranged along a first direction (e.g., the x-axis direction), and the second heat dissipation layer 120 is illustrated as including a plurality of second heat sinks 125 arranged along a first direction (e.g., the x-axis direction). However, the arrangement of the first heat sinks 115 of the first heat dissipation layer 110 and the second heat sinks 125 of the second heat dissipation layer 120 is not limited thereto.

[0100] The first heat dissipation layer 110 may include a plurality of first heat sinks 115 arranged along a first direction (e.g., the x-axis direction). The second heat dissipation layer 120 may include a plurality of second heat sinks 125 arranged along a second direction (e.g., the y-axis direction) intersecting the first direction (e.g., the x-axis direction).

[0101] "The second direction intersecting the first direction" can refer to a direction that is not parallel to the first direction. In one embodiment, for example, it can refer to a straight line extending in the first direction and a straight line extending in the second direction on the same plane intersecting at a predetermined angle. The first direction and the second direction can also mean directions perpendicular to each other. In one embodiment, for example, the first direction can refer to a reference... Figure 1 The description of the display panel DP refers to its "first direction (e.g., the x-axis direction)" or "approximate width direction (e.g., the x-axis direction)". The first direction may refer to... Figure 3 The x-axis direction in the equation. In one embodiment, for example, the second direction may refer to the x-axis direction. Figure 1 The description of the display panel DP refers to its "second direction (e.g., the y-axis direction)" or "generally longitudinal direction (e.g., the y-axis direction)". The second direction may refer to... Figure 3 The first and second directions are not limited to these, and may refer to directions defined in a planar diagram parallel to the plane. In one embodiment, for example, the first direction may refer to a reference... Figure 1 The description of the display panel DP refers to its "second direction (e.g., the y-axis direction)" or "generally longitudinal direction (e.g., the y-axis direction)". The second direction may also refer to... Figure 1 The description of the display panel DP refers to its "first direction (e.g., the x-axis direction)" or "approximate width direction (e.g., the x-axis direction)". However, for ease of explanation, in the following description, the first direction refers to the x-axis direction and the second direction refers to the y-axis direction.

[0102] The first heat dissipation layer 110 may include a plurality of first heat sinks 115 arranged along a second direction (e.g., the y-axis direction). The first heat dissipation layer 110 may include a plurality of first heat sinks 115 arranged along both a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction).

[0103] The second heat dissipation layer 120 may include a plurality of second heat sinks 125 arranged along a second direction (e.g., the y-axis direction). The second heat dissipation layer 120 may include a plurality of second heat sinks 125 arranged along both a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction).

[0104] Figure 5 for Figure 4 An enlarged view of area A.

[0105] refer to Figure 5The first heat sink 115 adjacent (or near) to the first heat dissipation layer 110 may have a gap of a first distance L1. Figure 5 In this design, first heat sinks 115 adjacent to each other in a first direction (e.g., the x-axis direction) are illustrated with gaps, but first heat sinks 115 adjacent to each other in a second direction (e.g., the y-axis direction) may also have gaps. Gaps may exist between adjacent (or adjacent) second heat sinks 125 of the second heat dissipation layer 120. Figure 5 In the example, the second heat sinks 125 that are adjacent to each other in the first direction (e.g., the x-axis direction) are illustrated to have a gap, but the second heat sinks 125 that are adjacent to each other in the second direction (e.g., the y-axis direction) may also have a gap.

[0106] The first heat sinks 115 adjacent to each other may have a first distance L1. The first distance L1 may be less than 3 mm, less than 2 mm, or less than 1 mm. The distance between the first heat sinks 115 adjacent to each other may be more than 0 mm, more than 0.01 mm, or more than 0.05 mm. The distance between the first heat sinks 115 adjacent to each other in the first direction (e.g., the x-axis direction) and the distance between the first heat sinks 115 adjacent to each other in the second direction (e.g., the y-axis direction) are both within the above ranges.

[0107] The second heat sinks 125 adjacent to each other may have a gap of a second distance L2. The second distance L2 may be less than 3 mm, less than 2 mm, or less than 1 mm. The distance between the second heat sinks 125 adjacent to each other may be more than 0 mm, more than 0.01 mm, or more than 0.05 mm. The distance between the second heat sinks 125 adjacent to each other in the first direction (e.g., the x-axis direction) and the distance between the second heat sinks 125 adjacent to each other in the second direction (e.g., the y-axis direction) are both within the above ranges.

[0108] Figure 6 The graphs show the heat dissipation effect when the distance between adjacent (or near) heat sinks is 1 mm (DP1), 2.5 mm (DP2), 4.5 mm (DP3), and 0 mm (DP4). Figure 6 In the figure, the temperature at the vertical position of 790.0 mm corresponds to the initial temperature.

[0109] In one embodiment, for example, when the distance between adjacent (or close to) heat sinks is less than 3 mm (DP1, DP2 and DP4), the temperature difference between the initial temperature and the maximum temperature in the vertical position is less than 3 degrees Celsius (°C).

[0110] When the distance between adjacent (or nearby) heat sinks is less than 2 mm (DP1 and DP4), the temperature difference between the initial temperature and the maximum temperature in the vertical position is less than 1℃.

[0111] When the distance between adjacent (or nearby) heat sinks is less than 1 mm (DP4), the initial temperature and maximum temperature in the vertical position correspond.

[0112] However, when the distance between adjacent (or nearby) heat sinks exceeds 3 mm (DP3), the temperature difference between the initial temperature and the maximum temperature in the vertical position exceeds 4°C.

[0113] like Figure 6 As seen in the figure, when adjacent (or adjacent) heat sinks 115 and 125 have a reference Figure 5 When the gap is within the described range, the heat diffusion efficiency is improved because the temperature does not increase excessively in the predetermined section.

[0114] refer to Figure 5 and Figure 6 When the first distance L1 and the second distance L2 become too large, the heat transfer efficiency between adjacent (or nearby) first heat sinks 115 and between adjacent (or nearby) second heat sinks 125 may decrease. Conversely, when the first distance L1 and the second distance L2 become too small, the manufacturing process may become more complex. By spacing each of the adjacent (or nearby) first heat sinks 115 and adjacent (or nearby) second heat sinks 125 apart by the aforementioned first distance L1 and second distance L2, the manufacturing process can be simplified and the heat transfer efficiency improved.

[0115] Figure 7 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device. Figure 8 for Figure 7 The diagram shows a schematic top view of the heat dissipation components.

[0116] refer to Figure 7 and Figure 8 The first heat dissipation layer 110 may include a plurality of first heat sinks 115a separated by a first boundary line BL1 extending in a second direction (e.g., the y-axis direction), and the second heat dissipation layer 120 may include a second heat sink 125a covering the first boundary line BL1. In one embodiment, for example, the second heat sink 125a may partially overlap with two first heat sinks 115a that are adjacent (or near) to each other with respect to the first boundary line BL1, and may be configured to overlap with the first boundary line BL1 simultaneously.

[0117] A second heat sink 125a may cover the first boundary line BL1 extending in a second direction (e.g., the y-axis direction). In one embodiment, for example, the edges of the first heat sink 115a extending in the second direction (e.g., the y-axis direction) and the edges of the second heat sink 125a extending in the second direction (e.g., the y-axis direction) may be staggered from each other. Each of two first heat sinks 115a that are adjacent (or near) to each other in the first direction (e.g., the x-axis direction) may partially overlap with the second heat sink 125a. In one embodiment, for example, two first heat sinks 115a that are adjacent (or near) to each other (with the first boundary line BL1 extending in the second direction (e.g., the y-axis direction) between them) may overlap with the second heat sink 125a. Accordingly, a second heat sink 125a that overlaps with two first heat sinks 115a that are adjacent (or near) each other in the first direction (e.g., the x-axis direction) can transfer heat between the two first heat sinks 115a (which are adjacent (or near) the first boundary line BL1 between them) thereby increasing the heat transfer rate in the first direction (e.g., the x-axis direction).

[0118] The edge of the first heat sink 115a extending in the first direction (e.g., the x-axis direction) may be aligned with the edge of the second heat sink 125a extending in the first direction (e.g., the x-axis direction). The edges of the first heat sink 115a extending in the first direction (e.g., the x-axis direction) may be aligned with the edges of the second heat sink 125a extending in the first direction (e.g., the x-axis direction) without being separated. In one embodiment, for example, the first heat dissipation layer 110 may include a plurality of first heat sinks 115a separated by a second boundary line BL2 extending in the first direction (e.g., the x-axis direction), and the second heat sinks 125a of the second heat dissipation layer 120 may not cover the second boundary line BL2. Accordingly, by reducing the heat transfer rate between first heat sinks 115a that are adjacent (or close to) each other in the second direction (e.g., the y-axis direction), the heat transfer rate in the first direction (e.g., the x-axis direction) may be relatively increased when heat sources are on opposite sides and the second boundary line BL2 is between them. Therefore, heat can be transferred to show a uniform heat distribution in both the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction).

[0119] refer to Figure 7 and Figure 8It has been explained that the edges of the first heat sink 115a extending in the first direction (e.g., the x-axis direction) and the edges of the second heat sink 125a extending in the first direction (e.g., the x-axis direction) are aligned with each other, and the edges of the first heat sink 115a extending in the second direction (e.g., the y-axis direction) and the edges of the second heat sink 125a extending in the second direction (e.g., the y-axis direction) are staggered with each other. However, the edges of the first heat sink extending in the first direction (e.g., the x-axis direction) and the edges of the second heat sink extending in the first direction (e.g., the x-axis direction) may be staggered with each other, and the edges of the first heat sink extending in the second direction (e.g., the y-axis direction) and the edges of the second heat sink extending in the second direction (e.g., the y-axis direction) may be aligned with each other.

[0120] In one embodiment, for example, the first heat dissipation layer may include a plurality of first heat sinks separated by a second boundary line extending in a first direction (e.g., the x-axis direction), and the second heat dissipation layer may include a second heat sink covering the second boundary line.

[0121] A second heat sink may cover a second boundary line extending in a first direction (e.g., the x-axis direction). In one embodiment, for example, the edges of the first heat sink extending in the first direction (e.g., the x-axis direction) and the edges of the second heat sink extending in the first direction (e.g., the x-axis direction) may be staggered from each other. Two first heat sinks adjacent to each other in the second direction (e.g., the y-axis direction) may overlap with a second heat sink. In one embodiment, for example, two first heat sinks adjacent to each other (with the second boundary line extending in the first direction (e.g., the x-axis direction) between them may overlap with a second heat sink. Accordingly, the second heat sink overlapping with two first heat sinks adjacent to each other in the second direction (e.g., the y-axis direction) can transfer heat between the two adjacent first heat sinks (with the second boundary line between them), thereby increasing the heat transfer rate in the second direction (e.g., the y-axis direction).

[0122] The edge of the first heat sink extending in the second direction (e.g., the y-axis direction) may be aligned with the edge of the second heat sink extending in the second direction (e.g., the y-axis direction). The edges of the first heat sink extending in the second direction (e.g., the y-axis direction) may be aligned with the edges of the second heat sink extending in the second direction (e.g., the y-axis direction) without being separated. In one embodiment, for example, the first heat dissipation layer may include a plurality of first heat sinks separated by a first boundary line extending in the second direction (e.g., the y-axis direction), and the second heat sinks of the second heat dissipation layer may not cover the first boundary line. Accordingly, by reducing the heat transfer rate between first heat sinks 115 that are adjacent (or close to) each other in the first direction (e.g., the x-axis direction), the heat transfer rate in the second direction (e.g., the y-axis direction) can be relatively increased when the heat source is on opposite sides and the first boundary line BL1 is between them. Therefore, heat can be transferred to exhibit a uniform heat distribution in both the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction).

[0123] In one embodiment, at least one edge of the first heat sink may be offset from at least one edge of the second heat sink. In another embodiment, for example, one, two, three, or four edges of the first heat sink may be offset from the edges of the second heat sink. Accordingly, even when the areas of the first and second heat sinks are different from each other, heat between the first heat sinks separated by at least one boundary line can be effectively transferred through the second heat sink.

[0124] Figure 9 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device. Figure 10 for Figure 9 The diagram shows a schematic top view of the heat dissipation components.

[0125] refer to Figure 9 and Figure 10 The first heat dissipation layer 110 includes a plurality of first heat sinks 115b separated by a first boundary line BL1 extending in a second direction (e.g., the y-axis direction) and a second boundary line BL2 extending in a first direction (e.g., the x-axis direction), and a second heat sink may cover both the first boundary line BL1 and the second boundary line BL2. In one embodiment, for example, the second heat sink 125b may partially overlap with all four first heat sinks 115b that are adjacent (or neighboring) to each other relative to the first boundary line BL1 and the second boundary line BL2, and may be configured to overlap with both the first boundary line BL1 and the second boundary line BL2.

[0126] A second heat sink 125b may cover both a first boundary line BL1 extending in a second direction (e.g., the y-axis direction) and a second boundary line BL2 extending in a first direction (e.g., the x-axis direction). In one embodiment, for example, the edges of the first heat sink 115b extending in the first direction (e.g., the x-axis direction) and the edges extending in the second direction (e.g., the y-axis direction) may be offset from the edges of the second heat sink 125b extending in the first direction (e.g., the x-axis direction) and the edges extending in the second direction (e.g., the y-axis direction), respectively. Each of four first heat sinks 115b that are adjacent (or adjacent) to each other in the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction) may partially overlap with a second heat sink 125b. In one embodiment, for example, two first heat sinks 115b that are adjacent (or adjacent) to each other (with the first boundary line BL1 extending in the second direction (e.g., the y-axis direction) between them) may overlap with a second heat sink 125b. Furthermore, each of two adjacent (or near) first heat sinks 115b (with a first boundary line BL1 between them) and two adjacent (or near) first heat sinks 115b (with a second boundary line BL2 between them) can overlap with a second heat sink 125b. Accordingly, heat between the first heat sinks 115b separated by the first boundary line BL1 and the second boundary line BL2 can be transferred through a second heat sink 125b. Therefore, even when multiple first heat sinks 115b are used, heat transfer efficiency can be improved.

[0127] Figure 11 This is a schematic perspective view of one embodiment of a heat dissipation component used in a display device. Figure 12 for Figure 11 The diagram shows a schematic top view of the heat dissipation components.

[0128] refer to Figure 11 and Figure 12 The first heat dissipation layer 110 may include a plurality of first heat sinks 115c separated by a first boundary line BL1 extending in a second direction (e.g., the y-axis direction) and a second boundary line BL2 extending in a first direction (e.g., the x-axis direction). The second heat sink 125c may not cover the first boundary line BL1 or the second boundary line BL2.

[0129] Any one of the first heat sinks 115c of the first heat dissipation layer 110 may overlap only with one of the second heat sinks 125c of the second heat dissipation layer 120. The edges of the first heat sink 115c extending in a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction) may be aligned with the edges of the second heat sink 125c extending in the same direction. In one embodiment, for example, all edges of the first heat sink 115c may not be separated from all edges of the second heat sink 125c. Accordingly, the heat transfer rate in a third direction (e.g., the z-axis direction) perpendicular to both the first and second directions (e.g., the x-axis direction) may be relatively increased. Accordingly, when a heat source corresponding to each first heat sink 115 is present, the temperature around the heat source can be reduced by rapidly transferring heat in the third direction (e.g., the z-axis direction).

[0130] In one embodiment, the first and second heat sinks may include a vapor chamber (“VC”). The vapor chamber is a heat transfer device having a flat plate shape and containing or composed of a liquid refrigerant. The vapor chamber can transfer or dissipate heat as the liquid refrigerant inside is vaporized by a heat source and transforms into a gaseous refrigerant, and the gaseous refrigerant liquefies into a liquid refrigerant as it circulates within the chamber.

[0131] The vapor chamber transfers heat after the gaseous refrigerant has vaporized from the liquid refrigerant and changed phase to gas, thereby allowing a relatively high heat transfer rate in the horizontal direction (e.g., a first direction (e.g., the x-axis), a second direction (e.g., the y-axis), etc.). The first and second heat sinks may include the vapor chamber, thereby improving heat transfer efficiency in the horizontal direction.

[0132] Figure 13 This is a graph showing the temperature variation with respect to the distance from the heat source when using a steam chamber. Figure 13 To illustrate the temperature variation curves based on the vertical distance from the heat source when using a steam chamber, when using a double-layered steam chamber (flat), and when using a single-layered steam chamber.

[0133] refer to Figure 13 When the steam chamber is used in a double layer (flat), the temperature decreases at all vertical distances from the heat source compared to when the steam chamber is used in a single layer. Furthermore, when the steam chamber is used in a single layer, there is a rapid temperature rise at the heat source, but when the steam chamber is used in a double layer (flat), the temperature is similar to the temperature when the steam chamber is vertically separated from the heat source by 0.2 m.

[0134] Therefore, when the steam chamber is used in a double layer (flat), compared with the steam chamber used in a single layer, it can be seen that the degree of heat dispersion is improved and the temperature at the heat source is reduced.

[0135] In one embodiment, at least one of the first and second heat sinks may include a vapor chamber, and the remaining one (or the other) may include a pulsating heat pipe (“PHP”). A pulsating heat pipe is a heat transfer device comprising a tube through which liquid and gas can circulate repeatedly. As the liquid and gaseous refrigerant move together within the tube of the pulsating heat pipe, the refrigerant can transfer or dissipate heat through repeated vaporization and liquefaction. The pulsating heat pipe may have a constant temperature in the vertical direction (e.g., a third direction, such as the z-axis), thereby allowing a relatively fast heat transfer rate in the vertical direction.

[0136] When the first heat sink 115 includes a vapor chamber and the second heat sink 125 includes a pulsating heat pipe, heat rapidly transferred horizontally through the first heat sink 115 can be dispersed vertically through the second heat sink 125. In one embodiment, for example, when the heat source of the display panel is concentrated at the center of the first heat sink 115, heat can be effectively dispersed.

[0137] When the first heat sink includes a pulsating heat pipe and the second heat sink includes a vapor chamber, heat rapidly transferred vertically through the first heat sink can be dispersed horizontally by the second heat sink. In one embodiment, for example, when the heat source of the display panel is distributed across the entire first heat sink, heat can be effectively dispersed.

[0138] Figures 14 to 21 This is a schematic exploded perspective view of a heat dissipation component applied to a display device according to various embodiments.

[0139] The heat dissipation component 100 may include a first heat dissipation layer 110, which includes a plurality of first heat dissipation fins 115a arranged along a first direction (e.g., the x-axis direction) and a plurality of first heat dissipation fins 115a arranged along a second direction (e.g., the y-axis direction). Reference Figure 14 The first heat dissipation layer 110 may include three first heat sinks 115a arranged along a first direction (e.g., the x-axis direction) and two first heat sinks 115a arranged along a second direction (e.g., the y-axis direction). The heat dissipation member 100 may include a second heat dissipation layer 120, which includes four second heat sinks 125a arranged along a first direction (e.g., the x-axis direction) and two second heat sinks 125a arranged along a second direction (e.g., the y-axis direction).

[0140] The first heat sink 115a and the second heat sink 125a may include a pulsating heat pipe. The first heat sink 115a may include a first tube 210a, which includes a first direct flow path 211a, a first connecting flow path 212a, and a first closed flow path 213a. The first tube 210a may be a closed-loop pulsating heat pipe. The first direct flow path 211a is connected via the first connecting flow path 212a, and the first closed flow path 213a seals the first direct flow path 211a or the first connecting flow path 212a, such that the first tube 210a may have a closed loop.

[0141] The second heat sink 125a may include a second tube 220a, which includes a second straight flow path 221a, a second connecting flow path 222a, and a second closed flow path 223a. The second tube 220a may be a closed-loop pulsating heat pipe. The second straight flow path 221a is connected via the second connecting flow path 222a, and the second closed flow path 223a seals the second straight flow path 221a or the second connecting flow path 222a, so that the second tube 220a can have a closed loop.

[0142] The first straight flow path 211a and the second straight flow path 221a may extend in parallel directions. Both the first straight flow path 211a and the second straight flow path 221a may extend in a second direction (e.g., the y-axis direction).

[0143] "Parallel to each other" can be used to mean that the extension directions of the first straight flow path 211a and the second straight flow path 221a are physically parallel and inclined at an angle of -2.5° to 2.5°, -1° to 1°, -0.5° to 0.5°, or 0°. In one embodiment, for example, when the first straight flow path 211a and the second straight flow path 221a are configured to overlap, "parallel to each other" can be used to mean that the angle between the first straight flow path 211a and the second straight flow path 221a is 0° to 5°, 0° to 3°, 0° to 1°, or 0°.

[0144] Two first heat sinks 115a adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. Additionally, both a first straight flow path 211a and a second straight flow path 221a may extend in the second direction (e.g., the y-axis direction). Accordingly, a second straight flow path 221a of the second heat sink 125a may be disposed between the first straight flow paths 211a of the first heat sink 115a. Consequently, the heat transfer rate between the first heat sink 115a and the second heat sink 125a can be increased. Therefore, the rate at which heat input to the first heat sink 115a moves to the second heat sink 125a and adjacent (or adjacent) first heat sinks 115a can be increased, and the dissipation rate of heat input from the heat source to the first heat sink 115a can be increased.

[0145] refer to Figure 15 Two first heat sinks 115d adjacent to each other in a second direction (e.g., the y-axis direction) may be separated by a second boundary line extending in a first direction (e.g., the x-axis direction), and a second heat sink 125d may cover the second boundary line. Additionally, both the first straight flow path 211a and the second straight flow path 221a may extend in the second direction (e.g., the y-axis direction). Accordingly, a first closed flow path 213a of the first heat sink 115d may be configured to cross the second straight flow path 221a of the second heat sink 125d, and a second closed flow path 223a of the second heat sink 125d may be configured to cross the first straight flow path 211a of the first heat sink 115d. Therefore, the rate at which heat input to the first heat sink 115d moves to the second heat sink 125d and the rate at which heat moving to the second heat sink 125d moves to the adjacent (or neighboring) first heat sink 115d can be increased, and the rate of heat dissipation from the heat source can be improved.

[0146] refer to Figure 16Two first heat sinks 115b adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction). Two first heat sinks 115b adjacent to each other in the second direction (e.g., the y-axis direction) may be separated by a second boundary line extending in the first direction. A second heat sink 125b may cover both the first and second boundary lines. Both a first straight flow path 211a and a second straight flow path 221a may extend in the second direction (e.g., the y-axis direction). Accordingly, the second straight flow path 221a of the second heat sink 125b may be disposed between the first straight flow paths 211a of the first heat sinks 115b. In addition, a first closed flow path 213a may be configured to cross the second straight flow path 221a, and a second closed flow path 223a may be configured to cross the first straight flow path 211a. Accordingly, the heat transfer rate from the first heat sink 115b to the second heat sink 125b may be further improved. Accordingly, the rate at which heat input to the first heat sink 115b moves to the second heat sink 125b and the rate at which heat moving to the second heat sink 125b moves to the adjacent (or nearby) first heat sink 115b can be further increased. In addition, the rate at which heat from the heat source is dispersed can be further increased.

[0147] exist Figures 14 to 16 In the diagram, both the first and second straight flow paths are shown extending in a second direction (e.g., the y-axis direction), but the first and second straight flow paths may extend parallel to a direction other than the second direction (e.g., the y-axis direction). In one embodiment, for example, both the first and second straight flow paths may extend in a first direction (e.g., the x-axis direction).

[0148] refer to Figure 17 The first straight flow path 211b and the second straight flow path 221a may intersect each other. In one embodiment, for example, the first straight flow path 211b may extend in a first direction (e.g., the x-axis direction), and the second straight flow path 221a may extend in a second direction (e.g., the y-axis direction).

[0149] Two first heat sinks 115a adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. Additionally, a first straight flow path 211b may extend in the first direction (e.g., the x-axis direction), and a second straight flow path 221a may extend in the second direction (e.g., the y-axis direction). The first straight flow path 211b and the second straight flow path 221a may intersect each other. Accordingly, heat from the first straight flow path 211b may simultaneously move to the second straight flow path 221a, thereby increasing the heat transfer rate from the first heat sink 115a to the second heat sink 125a. Therefore, the dissipation rate of heat input from the heat source to the first heat sink 115a can be increased.

[0150] exist Figure 17 In this embodiment, a first straight flow path 211b of the first tube 210b is illustrated as extending in a first direction (e.g., the x-axis direction), and a second straight flow path 221a is illustrated as extending in a second direction (e.g., the y-axis direction), but the direction of extension is not limited when the first and second straight flow paths intersect. In one embodiment, for example, the first straight flow path may extend in the second direction (e.g., the y-axis direction), and the second straight flow path may extend in the first direction (e.g., the x-axis direction). The first tube 210b may further include a first connecting flow path 212b and a first closed flow path 213b.

[0151] refer to Figure 18 The first straight flow path 211c of the first tube 210c and the second straight flow path 221c of the second tube 220c may extend in an oblique direction relative to a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction). Furthermore, the extending directions of the first straight flow path 211c and the second straight flow path 221c may be parallel to each other. The first tube 210c may further include a first connecting flow path 212c and a first closed flow path 213c, and the second tube 220c may further include a second connecting flow path 222c and a second closed flow path 223c.

[0152] Two first heat sinks 115a adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. Additionally, both the first straight flow path 211c and the second straight flow path 221c may extend in oblique directions relative to the first (e.g., the x-axis direction) and the second (e.g., the y-axis direction). Accordingly, the heat dissipation rate from heat sources located at the corner regions of the first heat sinks 115 can be improved.

[0153] refer to Figure 19 The first straight flow path 211c of the first pipe 210c and the second straight flow path 221d of the second pipe 220d extend in oblique directions relative to a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction), and the extending directions of the first straight flow path 211c and the second straight flow path 221d may intersect. The second pipe 220d may further include a second connecting flow path 222d and a second closed flow path 223d.

[0154] Two first heat sinks 115a adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. Additionally, a first straight flow path 211c and a second straight flow path 221d may extend in oblique directions relative to the first (e.g., the x-axis direction) and the second (e.g., the y-axis direction) to intersect. Heat from one first straight flow path 211c may simultaneously move to multiple second straight flow paths 221d, and heat from one second straight flow path 221d may simultaneously move to multiple first straight flow paths 211c. Accordingly, the speed of heat movement from the first heat sink 115a to the second heat sink 125a and the speed of heat movement from the second heat sink 125a to the adjacent (or adjacent) first heat sink 115a can be increased. Therefore, the dispersion rate of heat from the heat source input to the first heat sink 115a to the second heat sink 125a and the dispersion rate of heat moving to the second heat sink 125a to the adjacent (or nearby) first heat sink 115a can be increased.

[0155] refer to Figure 20 and Figure 21 One of the first and second straight flow paths may extend in an oblique direction relative to the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction), and the remaining one (or the other) may extend in either the first direction (e.g., the x-axis direction) or the second direction (e.g., the y-axis direction).

[0156] refer to Figure 20 Two first heat sinks 115a that are adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. Additionally, a first straight flow path 211a may extend in either the first direction (e.g., the x-axis direction) or the second direction (e.g., the y-axis direction), and a second straight flow path 221c may extend in an oblique direction relative to both the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction).

[0157] refer to Figure 21 Two first heat sinks 115a that are adjacent to each other in a first direction (e.g., the x-axis direction) may be separated by a first boundary line extending in a second direction (e.g., the y-axis direction), and a second heat sink 125a may cover the first boundary line. A first straight flow path 211c may extend in an oblique direction relative to the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction), and a second straight flow path 221a may extend in either the first direction (e.g., the x-axis direction) or the second direction (e.g., the y-axis direction).

[0158] exist Figures 17 to 21 In this embodiment, the second heat sink 125a is illustrated as extending in a second direction (e.g., the y-axis direction) to cover the first boundary line separating adjacent first heat sinks, but the arrangement of the first and second heat sinks is not limited thereto. In one embodiment, for example, the second heat sink may cover the second boundary line extending in the first direction (e.g., the x-axis direction), which separates two first heat sinks that are adjacent (or neighboring) to each other in the second direction (e.g., the y-axis direction). A second heat sink may cover both the first and second boundary lines.

[0159] Figure 22 This is a schematic top view of one embodiment of a heat sink. Figure 22 The heat sink can be applied to a structure in which the tubes extend parallel to the edge of the heat sink. In one embodiment, for example, Figure 22 The heat sink can be applied to Figure 14 First heat sink 115a and second heat sink 125a, Figure 15 First heatsink 115d and second heatsink 125d, Figure 16 First heatsink 115b and second heatsink 125b Figure 17 First heat sink 115a and second heat sink 125a, Figure 20 The first heat sink 115a and Figure 21 At least one of the second heat sinks 125a. Figure 22 In the diagram, the first straight flow path 211a is shown extending in a second direction (e.g., the y-axis direction), but the type and direction of the straight flow path are not limited thereto. In one embodiment, for example, the straight flow path may be a second straight flow path 221a. In one embodiment, for example, the first straight flow path 211a and the second straight flow path 221a may extend in a second direction (e.g., the y-axis direction) and may extend in an oblique direction relative to the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction).

[0160] refer to Figure 22The cross-section of the first straight flow path 211a may include a first region, a second region, and a third region with different diameters from each other. Similarly, the cross-section of the second straight flow path may include a first region, a second region, and a third region with different diameters from each other.

[0161] The first region may refer to the region that includes a cross section with a first diameter d1.

[0162] The second region may refer to the region including a cross-section with a second diameter d2. The third region may refer to the region including a cross-section with a third diameter d3. The first diameter d1 may be larger than both the second diameter d2 and the third diameter d3. The second diameter d2 may be smaller than the first diameter d1 and larger than the third diameter d3. The third diameter d3 may be smaller than both the first diameter d1 and the second diameter d2.

[0163] As the diameter of the flow path increases, the fluid velocity can decrease, and the pressure can increase. Correspondingly, as the diameter of the flow path increases, the temperature can decrease. Because the first straight flow path 211a includes all regions with different diameters d1, d2, and d3, the temperature of the fluid (e.g., refrigerant) passing through the first straight flow path 211a can decrease. In one embodiment, for example, the temperature can decrease when the fluid moves from a third region having a third diameter d3 to a second region having a second diameter d2. Additionally, the temperature can decrease when the fluid moves from a second region having a second diameter d2 to a first region having a first diameter d1. Accordingly, when heat from a heat source passes through the pipe, not only is the heat dispersed, but the temperature inside the pipe can also decrease. Therefore, the rate of temperature decrease around the heat source can be further increased.

[0164] exist Figures 7 to 12 as well as Figures 14 to 21 In this embodiment, a heat dissipation component is illustrated as including a first heat dissipation layer and a second heat dissipation layer. Furthermore, each of the first and second heat dissipation layers is illustrated as including a plurality of first heat sinks and a plurality of second heat sinks. However, a heat dissipation component may include three or more heat dissipation layers, and each heat dissipation layer may include only one heat sink.

[0165] Figures 23 to 25 This is a schematic side view of one embodiment of a display device.

[0166] refer to Figure 23 The display panel DP may include a first surface S1 and a second surface S2 that are opposite to each other, and a heat dissipation member 100 may be disposed on the second surface S2. The heat dissipation member 100 may include a first heat dissipation layer 110 and a second heat dissipation layer 120. The first heat dissipation layer 110 may include only a first heat sink 115. The second heat dissipation layer 120 may include only a second heat sink 125.

[0167] refer to Figure 24The heat dissipation component 100 may be disposed on the second surface S2 of the display panel DP. The heat dissipation component 100 may include a first heat dissipation layer 110 and a second heat dissipation layer 120. The first heat dissipation layer 110 may include a plurality of first heat dissipation fins 115 extending in a first direction (e.g., the x-axis direction). The first heat dissipation layer 110 may include a plurality of first heat dissipation fins 115 extending in a second direction (e.g., the y-axis direction). The second heat dissipation layer 120 may include a second heat dissipation fin 125. The second heat dissipation layer 120 may have only one second heat dissipation fin 125 disposed along the first direction (e.g., the x-axis direction) and may have a plurality of second heat dissipation fins 125 disposed along the second direction (e.g., the y-axis direction).

[0168] refer to Figure 25 The heat dissipation component 100 may be disposed on the second surface S2 of the display panel DP. The heat dissipation component 100 may include a first heat dissipation layer 110, a second heat dissipation layer 120, and a third heat dissipation layer 130. The first heat dissipation layer 110 may include a plurality of first heat sinks 115 extending in a first direction (e.g., the x-axis direction). The second heat dissipation layer 120 may include a plurality of second heat sinks 125 extending in a first direction (e.g., the x-axis direction). The third heat dissipation layer 130 may include a plurality of third heat sinks 135 extending in a first direction (e.g., the x-axis direction). Each of the first heat dissipation layer 110, the second heat dissipation layer 120, and the third heat dissipation layer 130 may include a plurality of first heat sinks 115, a plurality of second heat sinks 125, and a plurality of third heat sinks 135 extending in a second direction (e.g., the y-axis direction).

[0169] The arrangement of the first heat sink 115, the second heat sink 125, and the third heat sink 135 is not limited. In one embodiment, for example, at least two of the arrangement structures of the first heat sink 115, the second heat sink 125, and the third heat sink 135 may be the same, and all three arrangement structures may be different.

[0170] exist Figures 23 to 25 The first heat sink 115 and the second heat sink 125 described herein, and in Figure 25 The third heat sink 135 described herein may include at least one of a vapor chamber and a pulsating heat pipe. In one embodiment, for example, both the first heat sink 115 and the second heat sink 125 may include a vapor chamber. Both the first heat sink 115 and the second heat sink 125 may include a pulsating heat pipe. The first heat sink 115 or the second heat sink 125 may include a vapor chamber, and the remaining one (or the other) may include a pulsating heat pipe. Alternatively, independent of the first heat sink 115 and the second heat sink 125, the third heat sink 135 may include either a vapor chamber or a pulsating heat pipe.

[0171] When the first heat sink 115 and the second heat sink 125 include pulsating heat pipes, the arrangement of the pipes included in the pulsating heat pipes can be consistent with the reference. Figures 14 to 21 The arrangement of the pipes described are basically the same.

[0172] The first heat sink 115, the second heat sink 125, and the third heat sink 135 may all include pulsating heat pipes. In this case, the pipe arrangement structure included in the third heat sink 135 may be the same as the pipe arrangement structure included in at least one of the first heat sink 115 and the second heat sink 125. Alternatively, the pipe arrangement structure included in the third heat sink 135 may be different from the pipe arrangement structures included in both the first heat sink 115 and the second heat sink 125.

[0173] The heat dissipation component, including the first heat dissipation layer and the second heat dissipation layer, can be applied to electronic devices. The display device in one embodiment can be applied to various electronic devices. The electronic device in one embodiment may include a display device, and may further include modules or devices with additional functions besides the display device.

[0174] Figure 26 This is a block diagram of one embodiment of an electronic device. (See reference) Figure 26 In one embodiment, the electronic device 1000 may include a display module 1100, a processor 1200, a memory 1300, and a power module 1400.

[0175] The processor 1200 may include at least one of a central processing unit (“CPU”), an application processor (“AP”), a graphics processing unit (“GPU”), a communication processor (“CP”), an image signal processor (“ISP”), and a controller.

[0176] The memory 1300 can store data information required for the operation of the processor 1200 or the display module 1100. When the processor 1200 executes the application stored in the memory 1300, video data signals and / or input control signals are transmitted to the display module 1100, and the display module 1100 can process the received signals to output video information through the display screen.

[0177] The power module 1400 may include a power supply module such as a power adapter or battery device and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1000.

[0178] At least one of the components of electronic device 1000 may be included within the display device according to the above embodiments. Additionally, some individual modules functionally included in a single module may be incorporated into the display device, while other modules may be provided separately from the display device. In one embodiment, for example, the display device may include a display module 1100, while the processor 1200, memory 1300, and power module 1400 may be provided as other devices in electronic device 1000 that are not part of the display device.

[0179] Figure 27 Schematic diagrams of electronic devices according to various embodiments are shown. Reference Figure 27 The various electronic devices having the display devices in the embodiments may include not only image display electronic devices, such as smartphones 1000_1a, tablet computers 1000_1b, laptop computers 1000_1c, televisions (“TV”) 1000_1d and desktop monitors 1000_1e, but also wearable electronic devices with display modules, such as smart glasses 1000_2a, head-mounted displays 1000_2b and smartwatches 1000_2c, and vehicle electronic devices 1000_3 with display modules, such as vehicle electronic devices placed on vehicle dashboards, center instrument panels, center information displays (“CID”), interior mirror displays, etc.

[0180] The heat dissipation layer can be placed in any area of ​​the electronic device, as long as it is an area with a heat source.

[0181] An electronic device in one embodiment of this disclosure may include a heat source and a heat dissipation component. The heat source includes a surface. The heat dissipation component may include a first heat dissipation layer disposed on one surface of the heat source and a second heat dissipation layer disposed on the first heat dissipation layer.

[0182] The first heat dissipation layer of the heat dissipation component may include a first heat sink, and the second heat dissipation layer of the heat dissipation component may include a second heat sink.

[0183] In a heat dissipation component, only the first heat dissipation layer may include multiple first heat sinks. In a heat dissipation component, only the second heat dissipation layer may include multiple second heat sinks. Each of the first and second heat dissipation layers may include multiple first heat sinks and multiple second heat sinks.

[0184] The heat source is not limited, as long as it is a location within the electronic device that generates heat. In one embodiment, for example, the heat source could be the display panel of a display device.

[0185] While this disclosure has been described in conjunction with embodiments now considered to be practical embodiments, it should be understood that this disclosure is not limited to the disclosed embodiments, but rather, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A display device, comprising: The display panel includes a first surface and a second surface that are opposite to each other; as well as Heat dissipation components, including: A first heat dissipation layer is disposed on the second surface of the display panel; and The second heat dissipation layer is disposed on the first heat dissipation layer.

2. The display device according to claim 1, wherein: The first heat dissipation layer includes a plurality of first heat dissipation fins arranged along a first direction or a second direction intersecting the first direction, and The second heat dissipation layer includes a plurality of second heat dissipation fins arranged along the first direction or the second direction.

3. The display device according to claim 2, wherein: The adjacent first heat sinks among the plurality of first heat sinks are separated by a first boundary line extending in the second direction, and The plurality of second heat sinks includes a second heat sink that covers the first boundary line.

4. The display device according to claim 2, wherein: The first heat dissipation layer includes a plurality of first heat dissipation fins separated by a first boundary line extending in the second direction and a second boundary line extending in the first direction, and The second heat sink does not cover the first boundary line or the second boundary line.

5. The display device according to claim 2, wherein: At least one edge of the first heat sink is offset from at least one edge of the second heat sink.

6. The display device according to claim 2, wherein: The distance between adjacent first heat sinks in the plurality of first heat sinks is less than 3 mm, and The distance between adjacent second heat sinks in the plurality of second heat sinks is less than 3 mm.

7. The display device according to any one of claims 2 to 6, wherein: At least one of the first heat sink and the second heat sink includes a vapor chamber.

8. The display device according to any one of claims 2 to 6, wherein: At least one of the first heat sink and the second heat sink includes a pulsating heat pipe.

9. A display device, comprising: The display panel includes a first surface capable of displaying an image and a second surface opposite to the first surface; as well as The heat dissipation component includes a first heat dissipation layer disposed on the second surface and a second heat dissipation layer disposed on the first heat dissipation layer.

10. An electronic device comprising: A heat source, including a surface; as well as A heat dissipation component includes a first heat dissipation layer disposed on one surface of the heat source and a second heat dissipation layer disposed on the first heat dissipation layer.

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