Housing assembly and electronic device

Abstract

The invention discloses a shell assembly and electronic equipment. The shell assembly comprises a shell, an elastic buffer layer and a filling layer. A first space is formed between the front face of the shell and a battery module of the electronic equipment, and the elastic buffer layer is arranged in the first space. The elastic buffer layer is provided with a first buffer part and a second buffer part which are connected, the first buffer part is fixedly connected to the front face of the shell, and a second space is formed between the second buffer part and the front face of the shell. The filling layer is arranged in the second space, one face of the filling layer is fixedly connected to the front face of the shell in the thickness direction of the shell, and the other face of the filling layer is fixedly connected to the elastic buffer layer. According to the shell assembly provided by the embodiment of the invention, the shell vibration problem of the 5D battery cover can be effectively improved.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a housing assembly and an electronic device. Background Technology

[0002] Electronic devices such as mobile phones, tablets, and laptops are equipped with audio components, such as speaker modules. Responding to users' extreme pursuit of low-frequency sound effects, many electronic devices are designed with an open rear cavity. An open rear cavity means that the rear cavity of the speaker module is connected to the internal space of the electronic device's casing, allowing airflow. This enhances the speaker's low-frequency response, making the sound fuller and deeper. However, sound vibration in the air can cause casing vibration, meaning the electronic device's casing vibrates as audio is played. As the sound level increases, the degree of casing vibration increases accordingly, affecting the user experience.

[0003] Because of the large air gap between the battery cover and the battery module in electronic devices, the battery cover experiences significant vibration. To reduce this vibration, a layer of foam is typically placed between the battery cover and the battery module to fill this air gap. However, ordinary filling methods are only suitable for 3D battery covers, which are battery covers where the front and back of the battery compartment area are flat, with no overall slope. The battery compartment area can be understood as the area on the battery cover that covers the battery module, generally located in the middle of the battery cover, below the camera mounting hole. Electronic devices using 3D battery covers have a uniform thickness in the battery compartment area, and the air gap between the battery cover and the battery module is at the same height, so a single layer of foam can be used for filling. In recent years, to meet the requirements of thinner and lighter electronic devices, improved camera technology, and aesthetic appeal, 5D battery covers have gradually emerged. 5D battery covers have a unique shape and a surface with varying slopes. Electronic devices using 5D battery covers typically have an uneven thickness design, and the air gap between the battery cover and the battery module is also at an uneven height, meaning the height of the air gap is not consistent in different areas.

[0004] For 5D battery covers, a single layer of foam is clearly insufficient for filling requirements. If the foam thickness is designed based on the area with the smallest gap height, it cannot fill the areas with larger gap heights, significantly reducing the improvement in casing vibration. If the foam thickness is designed based on the area with the largest gap height, the foam will be subjected to strong compression in the smaller gap areas, resulting in a large rebound force, which can lead to the battery cover detaching and compromise the reliability of the entire assembly. Some electronic devices use dual-segment foam to address this issue, employing two pieces of foam: a thinner foam in areas with smaller gap heights and a thicker foam in areas with larger gap heights. This filling method offers some improvement, but the significant gap between the two foam pieces leaves a large amount of air gaps that cannot be filled, failing to effectively resolve casing vibration.

[0005] It is evident that existing technologies cannot effectively improve the shell vibration problem of 5D battery covers. Summary of the Invention

[0006] The housing assembly and electronic device provided in this application embodiment can effectively improve the housing vibration problem of 5D battery cover.

[0007] A first aspect of this application provides a housing assembly, including:

[0008] The housing has a front and a back side disposed opposite to each other in the thickness direction of the housing. The housing includes a battery compartment area disposed opposite to the battery module of the electronic device in the thickness direction of the housing, and a first space is formed between the front side of the housing and the battery module of the electronic device in the battery compartment area.

[0009] An elastic buffer layer is disposed within a first space. The elastic buffer layer has a first buffer portion and a second buffer portion disposed adjacent to each other. The first buffer portion is fixedly connected to the front side of the housing, and a second space is formed between the second buffer portion and the front side of the housing.

[0010] A filling layer is disposed in the second space. In the thickness direction of the shell, one side of the filling layer is fixedly connected to the front side of the shell, and the other side is fixedly connected to the elastic buffer layer.

[0011] The housing assembly provided in this application embodiment can be a 5D battery cover for an electronic device. The front of the housing can be understood as the side of the battery cover facing the inside of the electronic device. The battery compartment area of ​​the housing is arranged opposite to the battery module, that is, the battery compartment area is the area of ​​the housing corresponding to the battery module, and there is a first space, i.e., an air gap, between this area and the battery module.

[0012] An elastic buffer layer is installed within the first space. This layer can elastically deform, squeezing out air from the first space and reducing the vibration of the casing. The first buffer portion of the elastic buffer layer is fixedly connected to the front of the casing, meaning it fits snugly against the front without gaps. The second buffer portion has a second space between itself and the front of the casing; that is, the second buffer portion does not fit snugly against the casing, creating a gap. Alternatively, the space containing the first buffer portion can be understood as a region with a smaller height within the first space, while the space containing the second buffer portion is a region with a larger height within the first space. The height of the elastic buffer layer can be designed according to the height of the space containing the first buffer portion, directly filling it and preventing the battery cover from detaching due to excessive rebound force, thus ensuring the reliability of the entire assembly. The elastic buffer layer is thinner than the space containing the second buffer portion, insufficient to fill this space, thus creating a second space between itself and the casing.

[0013] Furthermore, a filling layer is provided within the second space. This filling layer is located between the shell and the elastic buffer layer in the thickness direction of the shell, and its two sides are respectively attached to the shell and the elastic buffer layer, filling the air gap in the second space. Alternatively, the filling layer can be understood as an interlayer placed between the shell and the elastic buffer layer, located in the area with greater height in the first space, used to compensate for the air gap between the elastic buffer layer and the shell caused by insufficient thickness. Through the cooperation of the elastic buffer layer and the filling layer, the first space is well filled, ensuring the reliability of the overall assembly. Moreover, an integrated elastic buffer layer can cover the entire battery compartment area, avoiding breaks in the elastic buffer layer and reducing breaks between filling structures. This allows the filling structure to fill the first space as much as possible, further improving the shell vibration phenomenon. Therefore, the shell assembly provided in this embodiment can effectively improve the shell vibration problem of the 5D battery cover.

[0014] In one possible implementation, the filling layer includes a first filler and a second filler stacked in the thickness direction of the housing.

[0015] The second filler has a first part and a second part that are connected together. In the thickness direction of the shell, one side of the first part of the second filler is fixedly connected to the front side of the shell, and the other side is fixedly connected to the elastic buffer layer. One side of the second part of the second filler forms a third space with the front side of the shell, and the other side is fixedly connected to the elastic buffer layer.

[0016] The first filler has a first part and a second part that are connected to each other. In the thickness direction of the shell, the first part of the first filler is located in the third space and is fixedly connected to the front side of the shell on one side and fixedly connected to the second filler on the other side. The second part of the first filler is fixedly connected to the front side of the shell on one side and fixedly connected to the elastic buffer layer on the other side. The first part of the first filler and the second part of the second filler form a stacked structure.

[0017] By adopting the above scheme, the filling layer is further layered, and the two-layer structure works together to fill the second space, further improving the filling effect and weakening the shell vibration phenomenon.

[0018] In one possible implementation, in the thickness direction of the shell, the two opposite sides of the elastic buffer layer are parallel and both are planar, the two opposite sides of the second filler are parallel and both are planar, one side of the first filler is attached to the front of the shell, and the other side is planar and attached to the side of the elastic buffer layer facing the shell and the side of the second filler.

[0019] Using the above scheme, the elastic buffer layer and the second filler can be made thinner, and the first filler adopts a design with unequal thickness, with one side conforming to the front of the shell to form a contoured structure, resulting in better filling effect.

[0020] In one possible implementation, the elastic buffer layer is made of foam, the first filler is made of thermoplastic polyurethane elastomer, and the second filler is made of polyethylene terephthalate.

[0021] Using the above solution, the foam is inexpensive, lightweight, and breathable, and is less prone to bulging during the mounting process. The first filler is made of thermoplastic polyurethane elastomer, which allows one side to be machined into a shell-like structure. The second filler is made of polyethylene terephthalate, which can be designed to be thinner, making it easier to fill the narrow spaces outside the first filler and the elastic buffer layer.

[0022] In one possible implementation, the housing has a camera mounting hole, and the battery compartment area is located on one side of the camera mounting hole along the length of the housing.

[0023] Along the length of the housing, the height of the first space gradually decreases from the side closest to the camera mounting hole to the side furthest from the camera mounting hole.

[0024] In the width direction of the shell, the height of the first space gradually decreases from the middle of the shell to both sides.

[0025] The above design features a casing that is thicker at the bottom and thinner at the top along its length, and thicker in the middle and thinner at the sides along its width. This balances the overall slim design with the requirements for electronic component installation, providing users with a superior tactile and visual experience.

[0026] In one possible implementation, the height of the first space gradually decreases from the centerline of the shell to both sides in the width direction of the shell.

[0027] With the above design, the back of the shell protrudes most at the center line, the overall shape is more symmetrical, and the feel is better.

[0028] In one possible implementation, the first buffer portion of the elastic buffer layer surrounds the outer periphery of the second buffer portion. When the filling layer includes a first filler and a second filler, the second filler has a first portion and a second portion, the first filler has a first portion and a second portion, and the first portion of the first filler and the second portion of the second filler form a stacked structure, the second portion of the first filler, the stacked structure, and the first portion of the second filler are arranged sequentially along the length direction of the housing, and the second portion of the first filler is located on the side closer to the camera mounting hole.

[0029] Using the above solution, the first filler is closer to the camera mounting hole than the second filler along the length of the housing. The second space is taller on the side closer to the camera mounting hole, making the filling effect of the first filler better in this area.

[0030] In one possible implementation, the first buffer portion of the elastic buffer layer includes a bottom region and two side regions, which are respectively connected to both sides of the bottom region in the width direction of the shell.

[0031] Along the length of the housing, the bottom area is located on the side of the second buffer portion away from the camera mounting hole; along the width of the housing, the two side areas are located on both sides of the second buffer portion.

[0032] With the above solution, the second buffer portion is located in the central region of the shell in the width direction, which is adapted to the shape of the first space.

[0033] In one possible implementation, when the filling layer includes a first filler, the thickness of the first filler gradually decreases along the length of the housing from the side closest to the camera mounting hole to the side furthest from the camera mounting hole; and along the width of the housing, the thickness of the first filler gradually decreases from the middle of the housing to both sides.

[0034] By adopting the above scheme, the thickness variation areas of the first filler are the same as those of the first space, thus making it fit more tightly with the shell.

[0035] In one possible implementation, the elastic buffer layer is further provided with multiple vent holes, which are arranged at intervals in the first buffer section, and each vent hole penetrates the elastic buffer layer in the thickness direction of the shell.

[0036] Using the above method, the vent holes can help release air during the installation of the elastic buffer layer and prevent bulging.

[0037] In one possible implementation, multiple vents are located along the length of the housing on the side of the second buffer portion away from the camera mounting hole. This area is relatively large and prone to bulging during processes such as mounting; therefore, placing the vents in this area is more conducive to air venting.

[0038] A second aspect of this application provides an electronic device including the housing assembly provided in any of the above embodiments, and further including a battery module, wherein the battery module is disposed opposite to the battery compartment region of the housing in the thickness direction of the housing.

[0039] The electronic device provided in this application embodiment effectively improves the battery cover's casing vibration phenomenon, resulting in a better user experience.

[0040] In one possible implementation, the electronic device has an outer frame and a back cover, with the housing configured as the back cover, which can improve the shell vibration phenomenon of the battery cover.

[0041] In one possible implementation, an elastic buffer layer is pressed between the housing and the battery module to cushion vibrations of the housing. Attached Figure Description

[0042] Figure 1 This is a three-dimensional structural diagram of the electronic device according to an embodiment of this application;

[0043] Figure 2 This is a schematic diagram of the electronic device according to an embodiment of this application without the display module;

[0044] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure along the N1-N1 direction;

[0045] Figure 4a This is a schematic diagram of the front structure of the housing in the housing assembly of an embodiment of this application;

[0046] Figure 4b for Figure 4a A schematic diagram of the cross-sectional structure along the N2-N2 direction;

[0047] Figure 4c for Figure 4a A schematic diagram of the cross-sectional structure along the N3-N3 direction;

[0048] Figure 5a This is a schematic diagram of the housing assembly in the first reference design;

[0049] Figure 5b for Figure 5a A schematic diagram of the cross-sectional structure along the N'-N' direction;

[0050] Figure 6a This is a schematic diagram of the housing assembly in the second reference design;

[0051] Figure 6b for Figure 6a A schematic diagram of the cross-sectional structure along the N”-N” direction;

[0052] Figure 7 This is an exploded structural diagram of the housing assembly according to an embodiment of this application;

[0053] Figure 8a This is a front structural diagram of the housing assembly according to an embodiment of this application;

[0054] Figure 8b This is a schematic diagram of the partitioned structure of the elastic buffer layer in the housing assembly of this application embodiment;

[0055] Figure 8c This is a schematic diagram of the partition structure of the second filler in the housing assembly according to an embodiment of this application;

[0056] Figure 8d This is a schematic diagram of the partition structure of the first filler in the housing assembly according to an embodiment of this application;

[0057] Figure 8e This is a schematic diagram of the filling layer in the housing assembly according to an embodiment of this application;

[0058] Figure 9 for Figure 8a A schematic diagram of the cross-sectional structure along the N4-N4 direction;

[0059] Figure 10a for Figure 8a A schematic diagram of the cross-sectional structure along the N5-N5 direction;

[0060] Figure 10b for Figure 8a A schematic diagram of the cross-sectional structure along the N6-N6 direction;

[0061] Figure 10c for Figure 8a A schematic diagram of the cross-sectional structure along the N7-N7 direction;

[0062] Figure 10d for Figure 8a A schematic diagram of the cross-sectional structure along the N8-N8 direction.

[0063] Explanation of reference numerals in the attached figures:

[0064] First reference design:

[0065] 3', Housing; 31', Front; 32', Back; 4', Foam; 82', Battery Module;

[0066] 91', First space; 33', Battery compartment area.

[0067] Second reference design:

[0068] 3”, shell; 41”, first foam; 42”, second foam; 91”, first space.

[0069] This application:

[0070] 100. Electronic devices;

[0071] 1. Housing assembly; 2. Shell assembly;

[0072] 3. Housing; 30. Camera mounting hole; 31. Front; 32. Back; 33. Battery compartment area;

[0073] 4. Elastic buffer layer; 41. First buffer section; 411. Bottom area; 412. Side area;

[0074] 42. Second buffer section; 43. Ventilation holes;

[0075] 5. Filler layer; 51. First filler; 51a. One side; 51b. The other side;

[0076] 511. Part One; 512. Part Two;

[0077] 52. Second filler; 52a. One side; 52b. The other side;

[0078] 521. Part One; 522. Part Two; 53. Layered Structure;

[0079] 61. First adhesive layer; 62. Second adhesive layer; 63. Third adhesive layer;

[0080] 7. Middle frame; 71. Outer frame; 72. Base plate;

[0081] 81. Display module; 812. Display screen; 82. Battery module; 83. Main board; 84. Sub-board;

[0082] 85. Speaker module; 851. Speaker; 852. Cavity; 8521. Upper cavity; 8522. Lower cavity;

[0083] 853. Front acoustic chamber; 854. Rear acoustic chamber; 855. Sound hole; 856. Through hole; 86. Camera module;

[0084] 91. First Space; 92. Second Space; 93. Third Space;

[0085] Z: Thickness direction of the shell; X: Length direction of the shell; Y: Width direction of the shell; Q: Centerline. Detailed Implementation

[0086] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0087] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0088] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0089] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0090] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB).

[0091] In the description of this application, it should be noted that the mutual perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., the included angle between two structural features is 89.9°) is also within the scope of mutual perpendicularity in this application. Similarly, the mutual parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., the included angle between two structural features is 0.1°) is also within the scope of mutual parallelism in this application. The axial symmetry in this application is not absolute axial symmetry. Approximate axial symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of axial symmetry in this application. The central symmetry in this application is not absolute central symmetry. Approximate central symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of central symmetry in this application. This application does not impose specific limitations in these respects.

[0092] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0093] This application provides an electronic device, which may be, but is not limited to, a mobile phone, laptop, tablet computer, monitor, personal digital assistant (PDA), personal computer (PC), smartphone, smart wearable device, in-vehicle device, etc. This does not limit the scope of protection of this application. The following description uses a mobile phone as an example to illustrate the structure of the electronic device.

[0094] Please see Figures 1 to 3 , Figure 1 This is a three-dimensional structural diagram of the electronic device according to an embodiment of this application; Figure 2 This is a schematic diagram of the electronic device according to an embodiment of this application without the display module; Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure along the N1-N1 direction.

[0095] like Figures 1 to 3 As shown, the electronic device 100 includes a housing assembly 1, which has an internal accommodating space for accommodating, mounting, and protecting internal electronic components and supporting the entire device. In one possible implementation, the electronic device 100 further includes a display module 81, which is mounted on the housing assembly 1. The display screen 812 of the display module 81 and the housing assembly 1 form an accommodating space around it, enclosing other components within this accommodating space. The display screen 812 is used for image display and human-computer interaction, and may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, or a quantum dot light-emitting diode (QLED) display screen, etc. This application does not limit the type or specific structure of the display screen 812.

[0096] like Figures 1 to 3As shown, the electronic device 100 also includes a battery module 82, which is installed within the housing assembly 1 and is used to store electrical energy and power other electronic components. The specific structure of the battery module 82 is not limited. In one possible implementation, the battery module 82 may include battery cells, a protection circuit board, a battery management system (BMS), and a housing. The battery cells are responsible for storing and releasing electrical energy. The protection circuit board prevents overcharging, over-discharging, and short circuits, ensuring safe battery use. The battery management system monitors and manages the charging and discharging process to ensure battery safety and stable performance. The housing is primarily responsible for the insulation protection of internal components and for securing it to the phone's housing assembly 1 and other components. In one possible implementation, the battery module 82 also has a tear-off film, also known as easy-pull adhesive, which serves to secure the battery module 82, protect internal components, and prevent the battery module 82 from moving or falling out of the phone. On the other hand, it facilitates the replacement and repair of the battery module 82. The battery module 82 can be easily removed by pulling and tearing the film without leaving any residue or damaging the battery and other internal components of the phone.

[0097] like Figures 1 to 3 As shown, in one possible implementation, the electronic device 100 further includes a motherboard 83 (i.e., main circuit board) and a sub-board 84 (i.e., secondary circuit board), both of which are installed within the housing assembly 1. Both the motherboard 83 and the sub-board 84 are used to integrate electronic components and circuits, but they perform different functions. For example, the motherboard 83 can house core components such as a central processing unit (CPU), a graphics processing unit (GPU), and random access memory (RAM), responsible for handling the phone's main computing tasks and data storage. It can also integrate communication modules, data interfaces, display control chips, power management chips, camera interfaces, sensor interfaces, etc. The sub-board 84 is used to expand the functionality of the motherboard 83, providing additional interfaces or connecting other peripheral devices. Examples include a radio frequency management module, a SIM card interface, a button interface, and an audio processing module. In some possible implementations, the electronic device 100 may also omit the sub-board 84, integrating all functional modules onto the motherboard 83; this application does not impose any limitations on this.

[0098] like Figures 1 to 3As shown, in one possible implementation, the electronic device 100 further includes a camera module, which integrates a camera and related circuit components for enabling functions such as taking photos and recording videos. A camera mounting hole 30 is provided on the housing assembly 1, and a portion of the camera module's structure passes through the camera mounting hole 30, exposing the camera to the outside of the electronic device 100 to capture ambient light. In one possible implementation, the camera mounting hole 30 is located on the back cover (i.e., housing 3) of the housing assembly 1, allowing the camera module to capture images of the back of the electronic device 100. The electronic device 100 may also include a front-facing camera module for selfies; this application does not limit this.

[0099] like Figures 1 to 3 As shown, in one possible implementation, the electronic device 100 further includes a speaker module 85 installed within the housing assembly 1, the specific structure of which is not limited. Figure 3 As shown, in one possible implementation, the speaker module 85 includes a cavity 852, a speaker 851, and a flexible circuit board. The speaker 851 and the flexible circuit board are installed inside the cavity 852 and are fixedly connected to the housing assembly 1 of the electronic device 100 through the cavity 852. The speaker 851 can convert electrical signals into sound signals and output audio. The core components of the speaker 851 include a vibrating element, a magnetic circuit assembly, and a voice coil. The voice coil can vibrate relative to the magnetic circuit assembly and is connected to the vibrating element, driving the vibrating element to vibrate and produce sound. The magnetic circuit assembly can be, for example, composed of an electromagnet or a permanent magnet and forming a stable magnetic field. The voice coil can be configured as an electromagnet with a coil wound around it, and at least a portion of the voice coil is located in the magnetic field formed by the magnetic circuit assembly. When an electrical signal passes through the coil in the voice coil, the voice coil can form a magnetic field that repels or attracts the magnetic circuit assembly, thereby vibrating in the magnetic field formed by the magnetic circuit assembly, which in turn causes the voice coil to drive the vibrating element to vibrate and produce sound, thus converting the electrical signal into a sound signal. The flexible circuit board is electrically connected to the electrodes of the speaker 851 and extends to the outside of the cavity 852 for communicating with the speaker module 85 and the main board 83 or the sub-board 84.

[0100] Those skilled in the art will understand that the speaker module 85 has a front acoustic cavity 853 and a rear acoustic cavity 854, each cavity being formed by the cavity 852 and the diaphragm of the speaker 851. The front acoustic cavity 853 primarily affects high-frequency sounds, while the rear acoustic cavity 854 primarily affects low-frequency sounds. In one possible implementation, the cavity 852 includes an upper cavity 8521 and a lower cavity 8522 that overlap each other. One side of the vibrating element surrounds the lower cavity 8522 to form the front acoustic cavity 853. A sound passage 855 may be provided on the side wall of the lower cavity 8522, connecting the front acoustic cavity 853 to the outside of the electronic device 100, allowing sound to propagate to the outside of the electronic device 100. The other side of the vibrating element surrounds the speaker 851's mounting bracket and the upper cavity 8521 to form the rear acoustic cavity 854. The rear acoustic cavity 854 can be open or closed. In one possible implementation, the rear acoustic cavity 854 is open, specifically, the upper cavity 8521 has a through hole 856 on its side wall, which connects the rear acoustic cavity 854 to the receiving space of the outer casing assembly 1. Increasing the space of the rear acoustic cavity 854 helps to improve the sound quality of the speaker module 85, making the sound fuller and deeper.

[0101] It should be noted that the installation position and method of the speaker module 85 in the electronic device 100 are not limited. For example, the thickness direction of the speaker module 85 can be parallel or not parallel to the thickness direction of the electronic device 100, and the rear sound cavity 854 of the speaker module 85 can face the rear cover (i.e., housing 3) of the housing assembly 1, or it can face the display screen 812 or other positions. The attached drawings are for illustration only.

[0102] Those skilled in the art will understand that while an open rear cavity can improve the sound quality of the speaker module 85, sound vibration in the air can cause shell vibration, meaning the outer shell assembly 1 of the electronic device 100 vibrates as audio is played. As the sound increases, the degree of shell vibration increases accordingly, affecting the user experience. The specific structure of the outer shell assembly 1 will be described below with reference to the accompanying drawings to facilitate understanding of the main areas and causes of shell vibration.

[0103] Please see Figures 4a to 4c , Figure 4a This is a schematic diagram of the front structure of the housing in the housing assembly of an embodiment of this application; Figure 4b for Figure 4a A schematic diagram of the cross-sectional structure along the N2-N2 direction; Figure 4c for Figure 4a A schematic diagram of the cross-sectional structure along the N3-N3 direction.

[0104] like Figures 3 to 4cAs shown, in one possible implementation, the housing assembly 1 includes a middle frame 7 and a housing assembly 2, the housing assembly 2 having a housing 3. The housing 3, also known as the rear cover or battery cover of the electronic device 100, is located on the back of the electronic device 100 and is used to enclose the components of the electronic device 100 inside the electronic device 100, while also providing protection against dust, impacts, and hardware scratches.

[0105] The middle frame 7 includes a base plate 72 and an outer frame 71 surrounding and connected to the outer periphery of the base plate 72. In the thickness direction of the electronic device 100, the display screen 812 and the housing 3 are respectively mounted at both ends of the outer frame 71, so that the display screen 812 and the housing 3 are located on both sides of the base plate 72. The base plate 72 of the middle frame 7 serves as the internal support frame of the electronic device 100, and the outer frame 71 is a frame structure surrounding the outer periphery of the electronic device 100, which helps to fix the display screen 812. It should be noted that the base plate 72 and the outer frame 71 can be a separate structure or an integrated structure; this application does not limit this. Both the middle frame 7 and the housing 3 can be made of metal, non-metal, or a combination of metal and non-metal, etc.; this application does not limit this. In one possible implementation, the housing assembly 2 of the electronic device 100 may not have a base plate 72, but instead use the housing 3 as the base plate 72 (it can also be understood that the housing 3 is reused as the middle frame of the electronic device); this application does not limit this.

[0106] like Figure 3 As shown, in one possible implementation, a mounting cavity is provided between the housing 3 and the base plate 72 for mounting components such as the battery, main board 83, sub-board 84, camera module, and speaker module 85. Each component can be fixed to the housing 3 or to the base plate 72; for example, it can be inserted into corresponding mounting holes in the base plate 72. This application does not impose any limitations on this. It should be noted that the shape, position, and mounting method of each component in the accompanying drawings are merely illustrative and do not limit the actual structure of the electronic device 100.

[0107] like Figures 3 to 4c As shown, the housing 3 has a front side 31 and a back side 32 disposed opposite to each other in the thickness direction Z of the housing. The thickness direction Z of the housing is parallel to the thickness direction of the electronic device 100. Similarly, the length direction X of the housing, mentioned later, is parallel to the length direction of the electronic device 100, and the width direction Y of the housing is parallel to the width direction of the electronic device 100. The front side 31 of the housing 3 is the side of the housing 3 facing the display screen 812, that is, the side located inside the electronic device 100, while the back side 32 of the housing 3 is the side of the housing 3 facing away from the display screen 812, that is, the back side of the electronic device 100.

[0108] The front surface 31 of the housing 3 and the battery module 82 are positioned opposite each other in the thickness direction Z of the housing. Since the battery module 82 cannot be completely fitted to the front surface 31 of the housing 3, a first space 91 exists between them. Because the battery module 82 occupies a large volume in the electronic device 100, the area occupied by the first space 91 is also large. This can be understood as a large air gap existing between the housing 3 and the battery module 82, i.e., the first space 91. As mentioned earlier, the rear acoustic cavity 854 of the speaker module 85 is an open rear acoustic cavity, which communicates with the first space 91, causing particularly severe housing vibration in the housing 3. To reduce the degree of housing vibration, a buffer material is generally filled between the housing 3 and the battery module 82 to fill the air gap in the first space 91.

[0109] Please see Figures 5a to 5b , Figure 5a This is a schematic diagram of the housing assembly in the first reference design; Figure 5b for Figure 5a A schematic diagram of the cross-sectional structure along the N'-N' direction.

[0110] like Figures 5a to 5b As shown, in the first reference design, there is a first space 91' between the housing 3' of the electronic device and the battery module 82', and foam 4' is disposed within the first space 91'. Figure 5b The space occupied by foam 4' is the first space 91', which is already filled with foam 4' and therefore not visually apparent. The housing 3' is a 3D battery cover. Specifically, the front 31' and back 32' of the battery compartment area 33' of housing 3' are flat, with no overall slope. The battery compartment area 33' of housing 3' can be understood as the area on housing 3' used to cover the battery module 82', generally located in the middle area of ​​housing 3', below the camera mounting hole. In electronic devices using the 3D battery cover, the battery compartment area 33' has a uniform thickness, and the first space 91' has a uniform height. Therefore, a single layer of foam can be used for filling. Foam 4' can be compressed between housing 3' and the battery module 82', expelling air from the first space 91' and solving the housing vibration problem. However, single-layer foam filling is only suitable for 3D battery covers.

[0111] In recent years, in order to meet the requirements of thinner and lighter electronic devices, improved camera technology, and aesthetic appearance, 5D battery covers have gradually emerged. The electronic device 100 provided in this application embodiment uses a 5D battery cover.

[0112] like Figures 3 to 4c As shown, in one possible implementation, the front 31 and back 32 of the housing 3 have varying slopes. The electronic device 100 has an overall design with unequal thickness, and the first space 91 between the housing 3 and the battery module 82 is also of unequal height, that is, the height of the first space 91 is not consistent in different areas.

[0113] It should be noted that the specific shape of the shell 3 is not limited. One possible implementation is... Figure 4c As shown, the camera mounting hole 30 has a battery compartment area 33 on one side of the housing along the length X direction, and the battery module 82 is disposed opposite to the battery compartment area 33. Alternatively, the battery compartment area 33 can be understood as the area on the housing 3 used to cover the battery module 82. Along the length X direction of the housing, the height of the first space 91 gradually decreases from the side closer to the camera mounting hole 30 to the side farther away from the camera mounting hole 30. Figure 4b As shown, along the width direction Y of the shell, the height of the first space 91 gradually decreases from the middle of the shell 3 to both sides. The middle of the shell 3 can be understood as the central region of the shell 3 along its width direction.

[0114] Or it can be understood as, such as Figure 4a and Figure 4b As shown, in the width direction Y of the housing, the battery compartment area 33 of the housing 3 is thicker in the middle and thinner at both sides. Figure 4c As shown, along the length X of the housing, the battery compartment area 33 of the housing 3 gradually thins from top to bottom (the side where the camera mounting hole 30 is located is considered top). Correspondingly, the shape change trend of the first space 91 is the same as that of the housing 3. In one possible implementation, the shape change trend of the entire housing 3 is the same as that of the battery compartment area 33, that is, it is thicker at the top and thinner at the bottom along the length X of the housing, and thicker in the middle and thinner at both sides along the width Y of the housing. This structure takes into account both the overall slim design and the requirements for electronic component installation, providing users with a rich tactile and visual experience.

[0115] It should be noted that, in the width direction Y of the shell, the first space 91 can be a region in the middle of the shell with a uniform height throughout, and the height gradually decreases on both sides of this region. Alternatively, it can have a maximum height at a certain position in the middle of the shell, and the height gradually decreases on both sides of that position. For example, as... Figure 4a , Figure 4b As shown, in one possible implementation, the height of the first space 91 gradually decreases from the centerline Q of the housing 3 to both sides along the width direction Y. The centerline Q is located in the middle of the housing 3, and the distance from the centerline Q to the two sides in the width direction is equal. With this structure, the back surface 32 of the housing 3 protrudes most prominently at the centerline Q, resulting in a more symmetrical overall shape and a better feel. In some possible implementations, the height of the first space 91 can also be maximized at other locations, such as near the centerline Q; this application does not impose any limitations on this.

[0116] The battery compartment area 33 of the housing 3, and the entire housing 3, can also be designed in other shapes. For example, the housing may have no slope change (uniform thickness) in the length direction X, and only adopt a form that is thicker in the middle and thinner on both sides in the width direction Y. Alternatively, the housing may have no slope change (uniform thickness) in the width direction Y, and only adopt a form that is thicker at the top and thinner at the bottom in the length direction X. This application does not impose any limitations on this. The shape of the first space 91 can vary according to the shape of the housing 3, and is not specifically limited.

[0117] For a 5D battery cover, a single layer of foam is clearly insufficient to fill the first space 91. Those skilled in the art will understand that the thickness of the first space 91 varies throughout. If we consider the portion of the first space 91 with the smaller height (e.g.,...) Figure 4b If the foam thickness is designed based on h1 in the first space, it will not be able to fill the area with a larger height in the first space 91, significantly reducing the improvement effect on shell vibration. If the thickness is designed based on the portion with a larger height in the first space 91 (e.g., h1), it will be insufficient to fill the area with a larger height in the first space 91. Figure 4b If the thickness of the foam is designed using h2), then the foam will be subjected to strong compression in areas with a small height, resulting in a large rebound force. In severe cases, this can cause the battery cover to detach, and the reliability of the entire assembly cannot be guaranteed.

[0118] Please see Figures 6a to 6b , Figure 6a This is a schematic diagram of the housing assembly in the second reference design; Figure 6b for Figure 6a A schematic diagram of the cross-sectional structure in the N”-N” direction.

[0119] like Figures 6a to 6b As shown, in the second reference design, two spaced-apart foam pieces are used to fill the first space 91” between the housing 3” and the battery module (not shown). Specifically, a first foam 41 is placed in the area with a larger height in the first space 91”, and a second foam 42 is placed in the area with a smaller height in the first space 91”. The thickness of the first foam 41” is greater than the thickness of the second foam 42”. The thickness of each foam refers to its thickness in its natural state. This filling method has a certain improvement effect, but a large number of air gaps still cannot be filled, and, as... Figure 6b As shown, there is a severe break between the two foam pieces, preventing them from fully bonding and affecting the filling effect. The shell vibration phenomenon cannot be effectively resolved.

[0120] To effectively improve the shell vibration problem of the 5D battery cover, this application provides a shell assembly 2, which fills the first space 91 in layers by filling the filler, thus achieving a better filling effect.

[0121] Please see Figures 7 to 10d , Figure 7 This is an exploded structural diagram of the housing assembly according to an embodiment of this application; Figure 8a This is a front structural diagram of the housing assembly according to an embodiment of this application; Figure 8b This is a schematic diagram of the partitioned structure of the elastic buffer layer in the housing assembly of this application embodiment; Figure 8c This is a schematic diagram of the partition structure of the second filler in the housing assembly according to an embodiment of this application; Figure 8d This is a schematic diagram of the partition structure of the first filler in the housing assembly according to an embodiment of this application; Figure 8e This is a schematic diagram of the filling layer in the housing assembly according to an embodiment of this application; Figure 9 for Figure 8a A schematic diagram of the cross-sectional structure along the N4-N4 direction; Figure 10a for Figure 8a A schematic diagram of the cross-sectional structure along the N5-N5 direction; Figure 10b for Figure 8a A schematic diagram of the cross-sectional structure along the N6-N6 direction; Figure 10c for Figure 8a A schematic diagram of the cross-sectional structure along the N7-N7 direction; Figure 10d for Figure 8a A schematic diagram of the cross-sectional structure along the N8-N8 direction.

[0122] It should be noted that, Figure 8a Different areas on the shell 3 are distinguished by different shaded patterns, and the structure obscured by the object above is represented by a dashed line in the view of the image.

[0123] like Figures 7 to 9 As shown, and in combination Figure 3 This application provides a housing assembly 2, including a housing 3, an elastic buffer layer 4, and a filling layer 5. The housing 3 includes a battery compartment region 33. In the thickness direction Z of the housing, the battery compartment region 33 is disposed opposite to the battery module 82 of the electronic device 100, and a first space 91 is formed between the front surface 31 of the housing 3 and the battery module 82 of the electronic device 100 at the battery compartment region 33. The elastic buffer layer 4 is disposed within the first space 91. The battery compartment region 33 of the housing 3 can be understood as the area directly opposite the battery module 82 of the electronic device 100, that is, the area where the elastic buffer layer 4 is located. Figure 8a The regions A+B+C+D are given.

[0124] Among them, the elastic buffer layer 4 is elastic and can generate elastic deformation in the thickness direction Z of the shell, compressing and filling the first space 91 to buffer the vibration of the shell 3.

[0125] Furthermore, such as Figure 8a , Figure 8b , Figure 9As shown, the elastic buffer layer 4 has a first buffer portion 41 and a second buffer portion 42 disposed adjacent to each other. The first buffer portion 41 is fixedly connected to the front surface 31 of the housing 3, and a second space 92 is formed between the second buffer portion 42 and the front surface 31 of the housing 3. The first buffer portion 41 is, for example, a portion corresponding to the first buffer portion 41 in the elastic buffer layer 4. Figure 8a The middle region A, and the second buffer portion 42, for example, corresponds to the portion of region B+C+D. Figure 10d As shown, the first buffer portion 41 of the elastic buffer layer 4 is fixedly connected to the front surface 31 of the housing 3, which can be understood as the first buffer portion 41 of the elastic buffer layer 4 fitting against the front surface 31 of the housing 3 without any gap between it and the housing 3. Figures 10a to 10c As shown, there is a second space 92 between the second buffer portion 42 and the front surface 31 of the housing 3, that is, the second buffer portion 42 is not in contact with the housing 3, but there is a gap between them. Figure 10a , Figure 10b The second space in the middle was completely filled. Figure 10c The second space in the middle was filled in 92 parts. Figure 10d There is no second space 92). The connection between the first buffer part 41 and the second buffer part 42 can be understood as having no gap between them, for example, it can be a one-piece structure.

[0126] The filling layer 5 is disposed within the second space 92. Along the thickness direction Z of the shell, one side of the filling layer 5 is fixedly connected to the front surface 31 of the shell 3, and the other side is fixedly connected to the elastic buffer layer 4. Alternatively, it can be understood that the filling layer 5 is stacked between the shell 3 and the elastic buffer layer 4, filling the second space 92 between the second buffer portion 42 and the shell 3. It can be understood that since the elastic buffer layer 4 is entirely disposed within the first space 91, the second space 92 is contained within the first space 91. For example... Figure 8a In the first space 91, the region A+B+C+D is defined, and the region B+C+D is defined, and the second space 92 is defined, which is contained within the first space 91.

[0127] The housing assembly 2 provided in this application embodiment, the housing 3 can be a 5D battery cover of the electronic device 100, and the front 31 of the housing 3 can be understood as the side of the battery cover facing the inside of the electronic device 100. The battery compartment area 33 of the housing 3 is arranged opposite to the battery module 82, that is, the battery compartment area 33 is the area of ​​the housing 3 corresponding to the battery module 82, and there is a first space 91, that is, an air gap, between this area and the battery module 82.

[0128] An elastic buffer layer 4 is provided within the first space 91. The elastic buffer layer 4 can undergo elastic deformation, squeezing out the air within the first space 91 and reducing the vibration of the housing 3. Alternatively, it can be understood that the space containing the first buffer portion 41 is a region with a smaller height within the first space 91, while the space containing the second buffer portion 42 is a region with a larger height within the first space 91. The height of the elastic buffer layer 4 can be designed according to the height of the space containing the first buffer portion 41, directly filling the space and preventing the housing 3 from detaching due to excessive rebound force, thus ensuring the reliability of the entire assembly. For the space containing the second buffer portion 42, the elastic buffer layer 4 is thinner and insufficient to fill this space, thus forming the second space 92 between it and the housing 3.

[0129] A filling layer 5 is provided within the second space 92. The filling layer 5 is located between the housing 3 and the elastic buffer layer 4 along the thickness direction Z of the housing, and its two sides are respectively attached to the housing 3 and the elastic buffer layer 4, filling the air gap in the second space 92. Alternatively, the filling layer 5 can be understood as an interlayer placed between the housing 3 and the elastic buffer layer 4, located in the area with greater height in the first space 91, used to compensate for the air gap between the elastic buffer layer 4 and the housing 3 caused by insufficient thickness. Through the cooperation of the elastic buffer layer 4 and the filling layer 5, the first space 91 is well filled, ensuring the reliability of the overall assembly. Furthermore, an integrated elastic buffer layer 4 can cover the entire battery compartment area 33, avoiding breaks in the elastic buffer layer 4 and reducing breaks between filling structures. This allows the filling structure to fill the first space 91 as much as possible, further improving the housing vibration phenomenon. Therefore, the housing assembly 2 provided in this embodiment can effectively improve the housing vibration problem of the 5D battery cover.

[0130] like Figure 3 As shown, in one possible implementation, the elastic buffer layer 4 is pressed between the housing 3 and the battery module 82. Alternatively, it can be understood that the elastic buffer layer 4 is in a compressed state within the assembled electronic device 100, thereby fitting more closely to the housing 3 and the battery module 82 and expelling as much air as possible from the first space. In some possible implementations, the elastic buffer layer 4 may also be in a natural state within the assembled electronic device 100; this application does not impose any limitations on this.

[0131] It should be noted that the specific shape of the elastic buffer layer 4 is not limited, and the specific shapes of the first buffer portion 41 and the second buffer portion 42 are not limited.

[0132] like Figure 8a , Figure 8bAs shown, in one possible implementation, the first buffer portion 41 of the elastic buffer layer 4 surrounds the outer periphery of the second buffer portion 42. It should be noted that the first buffer portion 41 may surround the entire outer periphery of the second buffer portion 42, or it may surround only a portion of the outer periphery of the second buffer portion 42; this application does not impose any limitation on this.

[0133] In one possible implementation, the first buffer portion 41 (corresponding to region A) surrounds a portion of the outer periphery of the second buffer portion 42 (corresponding to regions B+C+D). Specifically, as shown... Figure 8a , Figure 8b As shown, the first buffer portion 41 includes a bottom region 411 and two side regions 412. The two side regions 412 are respectively connected to both sides of the bottom region 411 in the width direction Y of the housing. In the length direction X of the housing, the bottom region 411 is located on the side of the second buffer portion 42 away from the camera mounting hole 30. In the width direction Y of the housing, the two side regions 412 are respectively located on both sides of the second buffer portion 42. Alternatively, it can be understood that in the length direction X of the housing, the second buffer portion 42 is located below the camera mounting hole 30 and on the side closer to the camera mounting hole 30. In the width direction Y of the housing, the second buffer portion 42 is located in the central region of the housing 3. This structure is adapted to the shape of the first space 91, with the height of the first buffer portion 41 in the first space 91 being relatively small, and the height of the second buffer portion 42 in the first space 91 being relatively large.

[0134] like Figure 7 , Figure 8b As shown, in one possible implementation, the elastic buffer layer 4 is a one-piece structure, with the first buffer portion 41 and the second buffer portion 42 not separated, which is more conducive to filling the first space 91. The elastic buffer layer 4 can adopt a design with uniform thickness, that is, the first buffer portion 41 and the second buffer portion 42 have the same thickness in their natural state. Specifically, as shown... Figure 10d As shown, in one possible implementation, the elastic buffer layer 4 has two opposite faces that are parallel and both are planar in the thickness direction Z of the shell. It should be noted that the elastic buffer layer 4 is elastic, and the above scheme refers to its two faces being parallel and planar in its natural state, while it may not be planar under compression.

[0135] like Figure 7 , Figure 8aAs shown, in one possible implementation, the elastic buffer layer 4 has a polygonal structure. Specifically, the battery module 82 is provided with structures such as a peelable film and graphite. These structures protrude from the surface of the battery module 82 and can fill the first space 91. The elastic buffer layer 4 can be only provided in the relatively recessed area on the surface of the battery module 82, so that the elastic buffer layer 4 and the battery module 82 fit more tightly in the thickness direction Z of the shell, avoiding excessive compression of the elastic buffer layer 4 by the protruding structures on the surface of the battery module 82, which could lead to excessive rebound force or delamination of the shell 3. In some possible implementations, the elastic buffer layer 4 can also be a rectangular structure, a circular structure, etc., and this application does not limit this.

[0136] In one possible implementation, the elastic buffer layer 4 is made of foam. Foam is not only inexpensive but also lightweight and breathable, making it less prone to bulging during the mounting process. In some possible implementations, the elastic buffer layer 4 can also be made of foam, elastic cotton, etc., and this application does not impose any restrictions on this.

[0137] like Figure 8a , Figure 8b As shown, in one possible implementation, the elastic buffer layer 4 is further provided with multiple vent holes 43. These vent holes 43 are arranged at intervals in the first buffer portion 41, and each vent hole 43 penetrates the elastic buffer layer 4 in the thickness direction Z of the housing. The vent holes 43 help to release air during the installation of the elastic buffer layer 4, preventing bulging. The specific number, shape, and arrangement of the vent holes 43 are not limited and can be designed according to actual needs. The attached diagram is for illustrative purposes only. Figure 8a , Figure 8b As shown, in one possible implementation, multiple vent holes 43 are located on the side of the second buffer portion 42 away from the camera mounting hole 30 along the length X of the housing. Alternatively, the vent holes 43 can be understood as being located in the bottom region 411 of the first buffer portion 41. It is understood that the bottom region 411 has a large area and is prone to bulging during processes such as mounting; therefore, placing the vent holes 43 in this region is more conducive to air venting.

[0138] It should be noted that the connection method between the elastic buffer layer 4 and the shell 3 is not limited; for example, it can be fixed to the shell 3 by means of adhesive bonding. Figure 7 As shown, in one possible implementation, the housing assembly 2 further includes a first adhesive layer 61, through which the elastic buffer layer 4 is bonded to the housing 3. The first adhesive layer 61 can be a solid adhesive or a cured liquid adhesive; this application does not limit this. In one possible implementation, such as... Figure 10d As shown, the first buffer portion 41 of the elastic buffer layer 4 is directly bonded to the housing 3 via the first adhesive layer 61. Figures 10a to 10cAs shown, the second buffer portion 42 of the elastic buffer layer 4 is bonded to the filling layer 5 via the first adhesive layer 61, and then fixedly connected to the housing 3 via the filling layer 5. Alternatively, it can be understood that the elastic buffer layer 4 is bonded to both the housing 3 and the filling layer 5 simultaneously. In some possible implementations, the elastic buffer layer 4 may also be bonded only to the housing 3 or only to the filling layer 5; this application does not impose any limitations on this.

[0139] It should be noted that the specific structure of filler layer 5 is not limited. For example... Figures 7 to 9 As shown, in one possible implementation, the filling layer 5 includes a first filling member 51 and a second filling member 52 stacked in the thickness direction Z of the shell. Wherein, as... Figure 8a , Figure 8c As shown, the second filler 52 has a first portion 521 that is connected to it (corresponding to...). Figure 8a Part of Region B) and Part 522 (corresponding) Figure 8a (Part of region D). For example... Figure 10c As shown, in the thickness direction Z of the shell, one side 52a of the first portion 521 of the second filler 52 is fixedly connected to the front surface 31 of the shell 3, and the other side 52b is fixedly connected to the elastic buffer layer 4. Figure 10b As shown, one side 52a of the second portion 522 of the second filler 52 forms a third space 93 with the front side 31 of the housing 3. Figure 9 The third space 93 has been filled, and the other side 52b is fixedly connected to the elastic buffer layer 4. Alternatively, it can be understood that the first part 521 of the second filler 52 is sandwiched between the elastic buffer layer 4 and the shell 3, with one side 52a adhering to the front surface 31 of the shell 3 without any gap between them. The second part 522 does not adhere to the shell 3, and there is a gap between them, i.e., the third space 93. The third space 93 can be, for example, a... Figure 8a The space corresponding to region D can be understood as the third space 93 being a part of the second space 92.

[0140] Furthermore, Figure 8a , Figure 8d and Figure 8e As shown, the first filler 51 has a first portion 511 (corresponding to) disposed in contact with the first filler. Figure 8a Part of region D) and part 512 (corresponding) Figure 8a (Part of region C in the middle). For example... Figure 10a As shown, one side 51a of the second part 512 of the first filler 51 is fixedly connected to the front side 31 of the housing 3, and the other side 51b is fixedly connected to the elastic buffer layer 4. Figure 10bAs shown, in the thickness direction Z of the shell, the first part 511 of the first filler 51 is located in the third space 93, and one side 51a is fixedly connected to the front side 31 of the shell 3, and the other side 51b is fixedly connected to the second filler 52. The first part 511 of the first filler 51 and the second part 522 of the second filler 52 form a stacked structure 53.

[0141] Using the above structure, the filling layer 5 is further layered, and the two layers work together to fill the second space 92, further improving the filling effect and weakening the shell vibration phenomenon. Among them, the first filling element 51 is the innermost structure, and its side closest to the shell 3 is completely attached to the front 31 of the shell 3. The second filling element 52 is a stack between the first filling element 51 and the elastic filling layer 5, but only a part of it overlaps with the first filling element 51, that is, the first part 511 of the first filling element 51 and the first part 522 of the second filling element 52 are stacked at region D.

[0142] like Figures 9 to 10d As shown, the first filler 51 can fill the area with the largest height in the second space 92, and the second filler 52 can fill the area with the smaller height in the second space 92. Furthermore, the first part 521 of the second filler 52 is located in a smaller area of ​​the second space 92. If the thickness of the second filler 52 is designed based on the height of this portion of the space, the second part 522 of the second filler 52 cannot completely fill its area, thus forming a third space 93 between it and the shell 3. The first part 511 of the first filler 51 fills the third space 93.

[0143] Those skilled in the art will understand that, due to space height limitations, the elastic buffer layer 4 and the second filler 52 can only be made relatively thin, which is difficult in terms of structural design. For ease of production, they can generally be designed as layered structures of equal thickness. However, the first filler 51 occupies a larger space and can be designed to be thicker. Therefore, a design of unequal thickness can be adopted, so that one side 51a fits against the front 31 of the shell 3, forming a contoured structure. Specifically, as... Figure 10b As shown, in one possible implementation, the two opposite faces of the second filler 52 in the thickness direction Z of the shell are parallel and both are planar. One side 51a of the first filler 51 is attached to the front surface 31 of the shell 3, and the other side 51b is planar and is attached to the side of the elastic buffer layer 4 facing the shell 3 and the side 52a of the second filler 52. In some possible implementations, one side 51a of the first filler 51 may not be completely attached to the front surface 31 of the shell 3, for example, it may be designed as a planar surface. The two sides of the second filler 52 may also not be parallel, and this application does not limit this.

[0144] It should be noted that the connection method between the first filler 51 and the second filler 52 and the housing 3 is not limited; for example, they can be fixed to the housing 3 by means of adhesive bonding. Figure 7 As shown, in one possible implementation, the housing assembly 2 further includes a second adhesive layer 62 and a third adhesive layer 63. The second filler 52 is bonded to the housing 3 via the second adhesive layer 62, and the first filler 51 is bonded to the housing 3 via the third adhesive layer 63. Each adhesive layer can be a solid adhesive or a cured liquid adhesive; this application does not limit this. In one possible implementation, such as... Figure 10c As shown, the first portion 521 of the second filler 52 is directly bonded to the housing 3 via the second adhesive layer 62. Figure 10b As shown, the second portion 522 of the second filler 52 is bonded to the first filler 51 via the second adhesive layer 62, and then fixedly connected to the housing 3 via the first filler 51. Alternatively, it can be understood that the second filler 52 is bonded to both the housing 3 and the first filler 51. In some possible implementations, the second filler 52 may be bonded only to the housing 3 or only to the first filler 51; this application does not impose any limitations on this.

[0145] like Figures 7 to 8e As shown, in one possible implementation, both the first filler 51 and the second filler 52 are integral structures, with no layers, thus improving the filling effect. In some possible implementations, the filling layer 5 can also be designed without layers, with the first filler 51 and the second filler 52 directly designed as an integral structure. Alternatively, the filling layer 5 can be divided into more layers, etc., and this application does not limit this.

[0146] It should be noted that the first filler 51 and the second filler 52 can be made of elastic or non-elastic materials, as long as they can fill the second space 92. This application does not impose any restrictions on this. In one possible implementation, both the first filler 51 and the second filler 52 are made of non-elastic materials, which can increase the stiffness of the shell 3 and weaken shell vibration to a certain extent.

[0147] It should be noted that the specific materials of the first filler 51 and the second filler 52 are not limited. In one possible implementation, the first filler 51 is thermoplastic polyurethane elastomer (TPU), and the second filler 52 is made of polyethylene terephthalate (PET). TPU can be processed to a relatively thick thickness and can be formed into shapes of varying thicknesses, but its edge areas cannot be too thin, generally requiring a thickness greater than 0.25 mm. PET, on the other hand, is generally thinner, only about 0.1 mm, and can only be formed into shapes of uniform thickness. Therefore, using TPU for the first filler 51 facilitates the processing of one side 51a into a contoured structure similar to the shell 3. Using PET for the second filler 52 allows for a thinner design, making it easier to fill the narrow spaces outside the first filler 51 and the elastic buffer layer 4. Other materials can also be used for the first filler 51 and the second filler 52; this application does not impose any restrictions on this.

[0148] It should be noted that the specific shape and position of the first filler 51 and the second filler 52 are not limited. For example... Figure 8d and Figure 9 As shown, in one possible implementation, the second part 512 of the first filler 51, the stacked structure 53, and the first part 521 of the second filler 52 are arranged sequentially along the length direction X of the housing, with the second part 512 of the first filler 51 located on the side closer to the camera mounting hole 30. Alternatively, it can be understood that, along the length direction X of the housing, the first filler 51 is closer to the camera mounting hole 30 than the second filler 52. It is understood that the second space 92 on the side closer to the camera mounting hole 30 has a larger height, therefore, placing the first filler 51 in this area results in better filling effect.

[0149] like Figure 9 As shown, in one possible implementation, along the length direction X of the housing, the thickness of the first filler 51 gradually decreases from the side closest to the camera mounting hole 30 to the side furthest from the camera mounting hole 30. Along the width direction Y of the housing, the thickness of the first filler 51 gradually decreases from the middle of the housing 3 to both sides. This can be understood as the thickness variation areas of the first filler 51 being the same as the first space 91, thus achieving a tighter fit with the housing 3. In another possible implementation, along the width direction Y of the housing, the thickness of the first filler 51 gradually decreases from the centerline Q of the housing 3 to both sides; that is, the filler 51 has the greatest thickness at the centerline Q, which matches the front shape of the housing 3. It should be noted that the specific shape of the first filler 51 can be designed according to the shape of the first space 91, and this application does not impose any limitations on this.

[0150] like Figure 8dAs shown, in one possible implementation, in a plane perpendicular to the thickness direction Z of the housing, the first filler 51 has an inverted trapezoidal structure, with a wider width on the side closer to the camera opening, conforming to the changing trend of the internal space of the housing 3. For example... Figure 8c As shown, in one possible implementation, the second filler 52 includes a rectangular structural portion and a semi-circular structural portion that are connected to each other. The semi-circular structural portion is located on the side closest to the camera opening, and its width in the width direction Y of the housing is generally smaller than that of the rectangular structural portion. The first filler structure is mainly stacked with the semi-circular structural portion of the second filler structure. The first filler 51 and the second filler 52 can also be configured in other shapes, which are not limited in this application.

[0151] It should be noted that this application does not limit the thickness of the elastic buffer layer 4, the first filler 51, the second filler 52, and each adhesive layer; the specific thickness can be designed according to the internal space of the electronic device. Figure 10a As shown, in one example, the maximum height h3 of the first space in region C is 0.8 mm, so the maximum total thickness of the elastic buffer layer 4 (in the compressed state), the first filler 51, the first adhesive layer 61, and the third adhesive layer 63 at that location is 0.8 mm. Figure 10b As shown, the maximum height h4 of the first space in region D is 0.6 mm, therefore the maximum total thickness of the elastic buffer layer 4 (in the compressed state), the first filler 51, the second filler 52, and the three adhesive layers at that location is 0.6 mm. Figure 10c As shown, the maximum height h5 of the first space in region B is 0.5mm. Therefore, the total thickness of the elastic buffer layer 4 (in the compressed state), the second filler 52, the first adhesive layer 61, and the second adhesive layer 62 at that location is less than 0.5mm (a portion of the space above the second adhesive layer 62 cannot be filled). Figure 10d As shown, the maximum height h6 of the first space in region A is 0.4 mm, so the maximum total thickness of the elastic buffer layer 4 (in the compressed state) and the first adhesive layer 61 at that location is 0.4 mm.

[0152] It should be noted that the above scenario is only an example and does not impose any limitations on the thickness of the various layers of the shell assembly.

[0153] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A housing assembly, characterized in that, include: A housing having a front and a back disposed opposite to each other in the thickness direction of the housing; The housing includes a battery compartment area, which is disposed opposite to the battery module of the electronic device in the thickness direction of the housing, and a first space is formed between the front of the housing and the battery module of the electronic device in the battery compartment area. An elastic buffer layer is disposed within the first space; the elastic buffer layer has a first buffer portion and a second buffer portion disposed adjacent to each other, the first buffer portion is fixedly connected to the front side of the housing, and a second space is formed between the second buffer portion and the front side of the housing; A filling layer is disposed within the second space. In the thickness direction of the housing, one side of the filling layer is fixedly connected to the front side of the housing, and the other side is fixedly connected to the elastic buffer layer.

2. The housing assembly as claimed in claim 1, characterized in that, The filling layer includes a first filling element and a second filling element stacked in the thickness direction of the housing; The second filler has a first part and a second part that are connected to each other. In the thickness direction of the housing, one side of the first part of the second filler is fixedly connected to the front side of the housing and the other side is fixedly connected to the elastic buffer layer. One side of the second part of the second filler forms a third space with the front side of the housing and the other side is fixedly connected to the elastic buffer layer. The first filler has a first part and a second part that are connected to each other. In the thickness direction of the shell, the first part of the first filler is located in the third space and is fixedly connected to the front side of the shell on one side and fixedly connected to the second filler on the other side. The second part of the first filler is fixedly connected to the front side of the shell on one side and fixedly connected to the elastic buffer layer on the other side. The first part of the first filler and the second part of the second filler form a stacked structure.

3. The housing assembly as claimed in claim 2, characterized in that, In the thickness direction of the shell, the two opposite sides of the elastic buffer layer are parallel and both are planar, the two opposite sides of the second filler are parallel and both are planar, one side of the first filler is attached to the front of the shell, and the other side is planar and attached to the side of the elastic buffer layer facing the shell and the side of the second filler.

4. The housing assembly as claimed in claim 2 or 3, characterized in that, The elastic buffer layer is made of foam, the first filler is thermoplastic polyurethane elastomer, and the second filler is made of polyethylene terephthalate.

5. The housing assembly as claimed in any one of claims 1-4, characterized in that, The housing has a camera mounting hole, and the battery compartment area is located on one side of the camera mounting hole along the length of the housing; Along the length of the housing, the height of the first space gradually decreases from the side closest to the camera mounting hole to the side furthest from the camera mounting hole; In the width direction of the housing, the height of the first space gradually decreases from the middle of the housing to both sides.

6. The housing assembly as claimed in claim 5, characterized in that, In the width direction of the housing, the height of the first space gradually decreases from the center line of the housing to both sides.

7. The housing assembly as claimed in claim 5, characterized in that, The first buffer portion of the elastic buffer layer surrounds the outer periphery of the second buffer portion; When the filling layer includes a first filling element and a second filling element, the second filling element has a first part and a second part, the first filling element has a first part and a second part, and the first part of the first filling element and the second part of the second filling element form a stacked structure, the second part of the first filling element, the stacked structure, and the first part of the second filling element are arranged sequentially along the length direction of the housing, and the second part of the first filling element is located on the side close to the camera mounting hole.

8. The housing assembly as claimed in claim 7, characterized in that, The first buffer portion of the elastic buffer layer includes a bottom region and two side regions, wherein the two side regions are respectively connected to both sides of the bottom region in the width direction of the housing; Along the length of the housing, the bottom region is located on the side of the second buffer portion away from the camera mounting hole; along the width of the housing, the two side regions are located on both sides of the second buffer portion.

9. The housing assembly as claimed in any one of claims 5-8, characterized in that, When the filling layer includes a first filler, the thickness of the first filler gradually decreases along the length of the housing from the side closest to the camera mounting hole to the side furthest from the camera mounting hole; and along the width of the housing, the thickness of the first filler gradually decreases from the middle of the housing to both sides.

10. The housing assembly as claimed in any one of claims 5-9, characterized in that, The elastic buffer layer is also provided with a plurality of vent holes, which are arranged at intervals in the first buffer portion, and each vent hole penetrates the elastic buffer layer in the thickness direction of the shell.

11. The housing assembly as claimed in claim 10, characterized in that, Along the length of the housing, the plurality of vent holes are located on the side of the second buffer portion away from the camera mounting hole.

12. An electronic device, characterized in that, The housing assembly as described in any one of claims 1-11 further includes a battery module disposed opposite to the battery compartment region of the housing in the thickness direction of the housing.

13. The electronic device as claimed in claim 12, characterized in that, The electronic device has an outer frame and a back cover, with the housing configured as the back cover.

14. The electronic device as claimed in claim 12 or 13, characterized in that, The elastic buffer layer is pressed between the housing and the battery module.

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