Loudspeaker module and electronic equipment

Abstract

The invention discloses a loudspeaker module and electronic equipment. The loudspeaker module comprises a first shell, a second shell, a third shell, a loudspeaker main body and a dustproof assembly, the first shell is provided with a sound outlet channel, the second shell is arranged on the first shell, the second shell is provided with a front cavity, the front cavity is communicated with the sound outlet channel, and the dustproof assembly is located between the first shell and the front cavity; the third shell and the second shell are connected to form a cavity for accommodating the loudspeaker main body, and the loudspeaker main body is located in the cavity. According to the scheme provided by the invention, the projection of the sealing surface formed between the dustproof assembly and the front cavity and the projection of the sealing area formed by the side, facing the front cavity, of the third shell and the second shell in the thickness direction are staggered, so that the sound output height of the front cavity in the thickness direction is ensured, and the sound output efficiency is improved. The loudspeaker module can be prevented from being integrally thick due to the fact that the sealing surface and the sealing area are located in the same thickness direction, and therefore thinning of the electronic equipment is met.

Description

Speaker modules and electronic devices Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a speaker module and electronic device. Background Technology

[0002] Electronic devices such as mobile phones, tablets, and laptops contain speaker modules, which are used to convert audio electrical signals into sound signals for output.

[0003] The speaker module in the related technology is relatively thick, which affects the development of thinner electronic devices. Summary of the Invention

[0004] This application provides a speaker module and an electronic device that can achieve the goal of reducing the thickness of electronic devices while ensuring the audio performance of the speaker module.

[0005] To address the aforementioned technical problems, in a first aspect, this application proposes a speaker module, comprising a first housing, a second housing, a third housing, a speaker body, and a dustproof component;

[0006] The first housing is provided with a sound outlet channel, the second housing is disposed on the first housing, the second housing is provided with a front cavity, the front cavity is connected to the sound outlet channel, and the dustproof component is located between the first housing and the front cavity;

[0007] The third housing is connected to the second housing to form a cavity for accommodating the speaker body, and the speaker body is located inside the cavity;

[0008] The sealing surface formed between the dustproof component and the front cavity is misaligned with the projection of the sealing area formed by the side of the third housing facing the front cavity and the second housing in a first direction, wherein the first direction is the thickness direction of the speaker module.

[0009] The speaker module provided in this application has a thickness-direction misalignment between the sealing surface formed between the dustproof component and the front cavity, the side of the third housing facing the front cavity, and the sealing area formed by the second housing. This ensures the sound output height of the front cavity along the thickness direction while preventing the sealing surface and sealing area from being located in the same thickness direction, thus avoiding an overall thicker speaker module and achieving the goal of thinning electronic devices. Simultaneously, since the sound output height of the front cavity along the thickness direction is guaranteed, the audio performance of the speaker module is ensured.

[0010] In one embodiment, the dustproof assembly includes a dustproof mesh, a first adhesive layer, and a support.

[0011] The first adhesive layer has a first extension portion along the second direction on the side facing the first housing; the bracket has a through hole, and the bracket has a second extension portion along the second direction on the side facing the first housing;

[0012] The dustproof net is bonded to the side of the bracket facing the bracket through the first adhesive layer, the side of the dustproof net facing away from the bracket abuts against the first housing, the side of the bracket facing the front cavity abuts against the front cavity, the first extension and the second extension form the sealing surface, wherein the second direction intersects with the first direction.

[0013] Because the first adhesive layer has a first extension, its size can be increased, thereby increasing the bonding area between the dustproof mesh and the first adhesive layer and improving the bonding stability. Because the bracket has a second extension, when the first adhesive layer is bonded to the bracket, the bonding area between the two can be increased, thus ensuring the bonding stability.

[0014] In one embodiment, a first support arm is provided in the through hole. This allows the dustproof net and the first adhesive layer to be bonded together to the bracket, while the first adhesive layer can also be bonded to the first support arm. This provides support for the central area of ​​the dustproof net through the first support arm, thereby improving the bonding stability between the dustproof net and the bracket.

[0015] In one embodiment, the dustproof assembly further includes a second adhesive layer disposed between the dustproof mesh and the first housing. This ensures the dustproof mesh is stably adhered to the first housing, preventing movement of the dustproof mesh relative to the first housing.

[0016] In one embodiment, the dustproof assembly further includes a first sealing gasket disposed between the bracket and the front cavity. This improves the sealing performance between the bracket and the front cavity.

[0017] In one embodiment, the bracket has a first groove on the side facing the first sealing gasket, and the first sealing gasket is at least partially located within the first groove. This allows the first sealing gasket to be stably positioned on the bracket.

[0018] In one embodiment, the bracket is provided with a first slot on the side facing the first sealing gasket, and the first sealing gasket is provided with a first locking block;

[0019] With the first sealing gasket located within the first groove, the first locking block is located within the first locking slot. In this way, when the first sealing gasket is connected to the bracket, the first groove ensures that the first sealing gasket is stably positioned on the bracket.

[0020] In one embodiment, the bracket is provided with a second slot on the side facing the first sealing gasket, and a second locking block is provided on the first sealing gasket;

[0021] With the first locking block located within the first locking slot, the second locking block is located within the second locking slot. In this way, the cooperation between the second locking block and the second locking slot ensures that the first sealing gasket is stably positioned on the bracket.

[0022] In one embodiment, the first housing is provided with a third slot, and the bracket is provided with a connecting arm;

[0023] With the bracket positioned between the first housing and the front cavity, the connecting arm is located within the third slot. This prevents the bracket from moving relative to the first housing when it is connected, thanks to the cooperation between the connecting arm and the third slot.

[0024] In one embodiment, a second support arm is provided in the sound outlet channel. This second support arm supports the sound outlet channel, preventing it from deforming due to impact.

[0025] In one embodiment, the speaker module further includes a second sealing gasket disposed between the first housing and the second housing. This improves the sealing performance between the first housing and the second housing.

[0026] In one embodiment, the speaker module further includes a third adhesive layer disposed between the second sealing gasket and the first housing. This allows the second sealing gasket to be stably adhered to the first housing.

[0027] In one embodiment, the first housing has a second groove on the side facing the second housing, and the third adhesive layer is located in the second groove.

[0028] In one embodiment, a limiting groove is provided on the side of the second housing facing the third housing, and the speaker body is located within the limiting groove. This prevents the speaker body from moving within the second housing.

[0029] In one embodiment, the speaker module further includes a clamping plate detachably connected to the second housing;

[0030] With the speaker body located within the limiting groove, the clamping plate presses the speaker body against it. This allows the speaker body to be stably positioned within the second housing.

[0031] In one embodiment, the clamping plate has a protrusion, and the speaker body has a pressing surface, with the protrusion engaging with the pressing surface. This facilitates the pressing fit between the clamping plate and the speaker body.

[0032] In one embodiment, a first adhesive surface is provided inside the second housing, and the first adhesive surface and the front cavity are located on the same side of the second housing;

[0033] The third housing has a second adhesive surface on the side facing the front cavity, and the first adhesive surface and the second adhesive surface are bonded together to form the sealing area.

[0034] In one embodiment, the first housing and / or the third housing is a rigid structure. This increases the strength of the first and third housings, thereby protecting the speaker body located within the first and third housings from impact damage.

[0035] Secondly, this application proposes an electronic device including a speaker module as described in any one of the embodiments of this application.

[0036] The specific structure of the speaker module in this embodiment refers to the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0037] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort.

[0039] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0040] Figure 2 is a schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application;

[0041] Figure 3 is a schematic diagram of the structure of a speaker module provided in an embodiment of this application;

[0042] Figure 4 is an exploded view of Figure 3;

[0043] Figure 5 is a cross-sectional view of Figure 3;

[0044] Figure 6 is an enlarged view of point A in Figure 5;

[0045] Figure 7 is a schematic diagram of a speaker module provided in one embodiment of this application from another perspective;

[0046] Figure 8 is a schematic diagram of Figure 7 from another perspective;

[0047] Figure 9 is a schematic diagram of the connection structure between the bracket and the first sealing gasket provided in an embodiment of this application;

[0048] Figure 10 is a schematic diagram of a first housing provided in an embodiment of this application;

[0049] Figure 11 is a schematic diagram of the connection structure between the first housing and the bracket provided in an embodiment of this application;

[0050] Figure 12 is a schematic diagram of the first housing provided in an embodiment of this application from another perspective;

[0051] Figure 13 is a schematic diagram of the structure of the first housing and the second housing provided in an embodiment of this application;

[0052] Figure 14 is a schematic diagram of the connection structure between the second housing and the speaker body provided in an embodiment of this application;

[0053] Figure 15 is an exploded view of Figure 14.

[0054] Explanation of reference numerals in the attached figures:

[0055] 100. Electronic devices;

[0056] 10. Housing; 11. Mid-frame; 111. Mid-plate; 112. Frame; 1121. Port; 1122. Sound outlet; 12. Back cover;

[0057] 20. Screen; 21. Display screen; 22. Light-transmitting cover;

[0058] 30. Circuit board; 31. Main circuit board; 32. Sub-circuit board;

[0059] 40. Battery;

[0060] 50. Camera module;

[0061] 60. Speaker module; 61. First housing; 611. Second groove; 612. Sound outlet channel; 613. Third slot; 614. Second support arm; 62. Second housing; 621. Limiting groove; 622. Front cavity; 6221. Front cavity channel; 623. First bonding surface; 624. Fixing plate; 625. Notch; 63. Third housing; 631. Second bonding surface; 64. Speaker body; 641. Pressing surface; 65. Dustproof component; 651. Second bonding layer; 652. Anti-dustproof Dust net; 653, First adhesive layer; 6531, First extension; 654, Bracket; 6541, Through hole; 6542, Second extension; 6543, First groove; 6544, First slot; 6545, Second slot; 6546, Connecting arm; 6547, First support arm; 655, First sealing gasket; 6551, First locking block; 6552, Second locking block; 66, Second sealing gasket; 67, Third adhesive layer; 68, Pressing plate; 681, Protrusion; 682, Bending section;

[0062] 70. Connection structure. Detailed Implementation

[0063] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0064] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable devices, televisions, and other mobile or fixed terminals. This application uses a mobile phone as an example for illustration.

[0065] Figure 1 is a structural schematic diagram of an electronic device 100 provided in an embodiment of this application, and Figure 2 is a disassembled structural schematic diagram of an electronic device 100 provided in an embodiment of this application. Referring to Figures 1 and 2, the electronic device 100 provided in this embodiment may include: a housing 10, a screen 20, a circuit board 30, a battery 40, a camera module 50, a Universal Serial Bus (USB) device (not shown in the figure), and a speaker module 60.

[0066] It should be understood that Figures 1 and 2 are not drawn to scale, nor are the other figures. Therefore, this application should not be limited to the scales, dimensions, etc., shown in the figures. Furthermore, in this application, "connection" or "electrical connection" can mean not only a direct connection between two parts, but also a connection through one or more intermediate devices. In this application, "installation" or "assembly" can include any existing installation method; for example, one component can be fixed above, below, or in between another component using connectors (e.g., bolts, rivets, etc.) and / or adhesives. These understandings all fall within the scope of the embodiments of this application. Additionally, when the electronic device 100 is a device of other forms, the electronic device 100 may not include at least one of the following: screen 20, circuit board 30, battery 40, camera module 50, and USB device.

[0067] Specifically, referring to Figures 1 and 2, the housing 10 can provide a structural framework for the electronic device 100. For example, in Figures 1 and 2, the housing 10 may include a mid-frame 11 and a back cover 12. When the electronic device 100 has a display function, it may also have a screen 20. The mid-frame 11, circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 are disposed between the screen 20 and the back cover 12. The mid-frame 11 can be used as the structural "skeleton" of the electronic device 100. The circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the mid-frame 11. For example, the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the side of the mid-frame 11 facing the back cover 12, or the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be disposed on the side of the mid-frame 11 facing the screen 20.

[0068] The middle frame 11 may include a middle plate 111 and a frame 112, with the frame 112 surrounding the outer perimeter of the middle plate 111. Generally, the frame 112 may include a top frame, a bottom frame, a left frame, and a right frame. The top frame, bottom frame, left frame, and right frame form a square ring structure. The middle plate 111 may be made of aluminum, aluminum alloy, or magnesium alloy. The frame 112 may be a metal frame or a ceramic frame. The middle plate 111 and the frame 112 may be snap-fitted, welded, bonded, or integrally formed, or the metal middle plate 111 and the frame 112 may be fixedly connected by injection molding.

[0069] It is readily understood that the housing 10 of the electronic device 100 provided in this application includes, but is not limited to, the structures described above. For example, in some other embodiments, the housing 10 may be a one-piece or separate shell made of metal or plastic. In this embodiment, the housing 10 is specifically described using the structure composed of a mid-frame 11 and a back cover 12 as an example. When the electronic device 100 does not include the mid-frame 11, the circuit board 30, battery 40, camera module 50, USB device, and speaker module 60 can be fixed to the surface of the screen 20 facing the back cover 12 by means of threaded connection, snap-fit, welding, etc., or they can be fixed to the surface of the back cover 12 facing the screen 20 by means of threaded connection, snap-fit, welding, etc.

[0070] It should be noted that in the electronic device 100, the mid-frame 11 and the back cover 12 include, but are not limited to, the structures shown in Figures 1 and 2. In some other embodiments, the back cover 12 can be integrally formed with the frame 112. For example, the electronic device 100 may include: a screen 20, a mid-frame 111, and a housing, and the housing can be integrally formed with the frame 112 and the back cover 12. In this way, the circuit board 30, the battery 40, the camera module 50, the USB device, and the speaker module 60 are disposed in the accommodating space formed by the mid-frame 111 and the housing.

[0071] Screen 20 is used to display images, videos, etc. Screen 20 may include a light-transmitting cover 22 and a display screen 21 (also called a display panel). The light-transmitting cover 22 and the display screen 21 are stacked and fixedly connected by adhesive or other means. The light-transmitting cover 22 mainly serves to protect the display screen 21 and prevent dust. The material of the light-transmitting cover 22 includes, but is not limited to, glass. The display screen 21 can be a flexible display screen or a rigid display screen. For example, the display screen 21 can be an Organic Light-Emitting Diode (OLED) display screen, an Active-Matrix Organic Light-Emitting Diode (AMOLED) display screen, a Mini Organic Light-Emitting Diode display screen, a Micro Organic Light-Emitting Diode display screen, a Quantum Dot Light-Emitting Diode (QLED) display screen, a Liquid Crystal Display (LCD), etc.

[0072] The back cover 12 protects the internal electronic components of the electronic device 100. The materials of the back cover 12 include, but are not limited to, metal, ceramic, plastic, and glass. To ensure both the thinness and lightness of the electronic device 100 and the structural strength of the back cover 12, the material of the back cover 12 can be metal. The light-transmitting cover 22, the frame 112, and the back cover 12 together form the internal accommodating space of the electronic device 100. This accommodating space houses the display screen 21, circuit board 30, battery 40, camera module 50, USB device, and speaker module 60.

[0073] Referring again to FIG2, in the electronic device 100 provided in the embodiments of this application, the circuit board 30 may include: a main circuit board 31 and a secondary circuit board 32.

[0074] The main circuit board 31 is used to integrate a control chip. The control chip can be, for example, an application processor (AP), double data rate synchronous dynamic random access memory (DDR), or universal flash storage (UFS). In some embodiments, the main circuit board 31 is electrically connected to the display screen 21, and the main circuit board 31 is used to control the display screen 21 to display images or videos. The main circuit board 31 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The main circuit board 31 can use an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of FR-4 and Rogers, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board.

[0075] Sub-circuit board 32 is used to integrate electronic components such as antenna (e.g., 5G antenna) RF front-end and Universal Serial Bus (USB) devices. Sub-circuit board 32 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. Sub-circuit board 32302 can use FR-4 dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of FR-4 and Rogers, etc.

[0076] The secondary circuit board 32 is electrically connected to the main circuit board 31 via a connection structure 70 to enable data and signal transmission between the secondary circuit board 32 and the main circuit board 31. The connection structure 70 can be a flexible printed circuit (FPC). In other embodiments, the connection structure 70 can also be a wire or enameled wire.

[0077] Of course, in other embodiments, the circuit board 30 may be one or more pieces. Here, this application does not limit the number of circuit boards 30.

[0078] The battery 40 is used to provide power to electronic devices such as the display screen 21, main circuit board 31, sub-circuit board 32, camera module 50, and speaker module 60 within the electronic device 100. In some embodiments, a battery mounting slot may be provided on the surface of the middle frame 11 facing the rear cover 12, and the battery 40 may be installed in the battery mounting slot.

[0079] The camera module 50 enables the electronic device 100 to take photos and videos. The camera module 50 is electrically connected to the circuit board 30. The camera module 50 can be a front-facing camera, a rear-facing camera, etc. The number of front-facing cameras and rear-facing cameras can be one or more. For example, as shown in Figure 2, the camera module 50 in this embodiment is described using three rear-facing cameras as an example.

[0080] The USB device is connected to the secondary circuit board 32. The USB device is an interface device conforming to the USB standard specification. Specifically, the USB device can be a Mini USB device, a Micro USB device, a USB Type-C device, etc. The USB device is used to connect a charger to the electronic device 100 via the port 1121 on the frame 112 to charge the electronic device 100. It can also be used to transfer data between the electronic device 100 and peripheral devices, and to connect headphones for audio playback. The USB device can also be used to connect other electronic devices, such as augmented reality (AR) devices.

[0081] The speaker module 60 is used to convert audio electrical signals such as music and voice into sound, and can support audio playback. In some embodiments, the speaker module 60 is electrically connected to the sub-circuit board 32. In this case, the audio signal sent by the main circuit board 31 is transmitted to the speaker module 60 via the sub-circuit board 32, and is converted into a sound signal for output by the speaker module 60. Specifically, referring to FIG2 and in conjunction with FIG1, the housing of the speaker module 60 is provided with a sound outlet channel. The sound signal output by the speaker module 60 is output through this sound outlet channel, and a sound outlet hole 1122 is provided on the frame 112, which is connected to the sound outlet channel. The sound output by the sound outlet channel is output to the outside of the electronic device 100 through the sound outlet hole 1122.

[0082] In other embodiments, the speaker module 60 can also be directly electrically connected to the main circuit board 31 via FPC, wires, enameled wires, etc.

[0083] It should be noted that the accompanying drawings of this application describe a single speaker module 60. Of course, there can be multiple speaker modules 60. For example, in some other embodiments of this application, there can be two speaker modules 60, one of which is located at the top of the phone and the other at the bottom. Furthermore, the placement of the speaker modules 60 can be customized according to specific needs, including but not limited to the placement examples described above.

[0084] The following is a detailed description of this application.

[0085] Electronic devices such as mobile phones, tablets, and laptops contain speaker modules, which are used to convert audio electrical signals into sound signals for output.

[0086] As the demand for thinner and lighter electronic devices increases, the thickness of the speaker module is often the bottleneck of the overall electronic device. In related technologies, the front cavity of the speaker module is superimposed with the sealing height of the front and rear shells (usually 0.30mm-0.35mm), resulting in a relatively thick speaker module overall.

[0087] As a result, since the sound output height of the front cavity and the sealing height of the front and rear shells are located in the same thickness direction, the constraints of the sound output height of the front cavity and the sealing height of the front and rear shells are not conducive to the development of thinner electronic devices.

[0088] To address the aforementioned issues, as shown in Figures 3, 4, and 5, an embodiment of this application provides a speaker module 60. The speaker module 60 includes a first housing 61, a second housing 62, a third housing 63, a speaker body 64, and a dustproof component 65. The first housing 61 has a sound outlet channel 612. The second housing 62 is disposed on the first housing 61 and has a front cavity 622 connected to the sound outlet channel 612. The dustproof component 65 is located between the first housing 61 and the front cavity 622. The third housing 63 is connected to the second housing 62 to form a cavity for accommodating the speaker body 64, which is located within the cavity. The sealing surface formed between the dustproof component 65 and the front cavity 622 is misaligned with the projection of the side of the third housing 63 facing the front cavity 622 and the sealing area formed by the second housing 62 in a first direction, where the first direction is the thickness direction of the speaker module.

[0089] In this embodiment, the first direction is the X-axis direction as shown in Figure 5.

[0090] In this embodiment, the specific materials of the first shell 61, the second shell 62, and the third shell 63 are not limited. For example, in one embodiment of this application, the first shell 61, the second shell 62, and the third shell 63 can be metal plates or plastic benches. The specific materials can be determined according to the actual situation, and this specification does not limit them.

[0091] In this embodiment, as shown in FIG6, the first end of the sound outlet channel 612 is connected to the outside, and the second end of the sound outlet channel 612 is connected to the front cavity channel 6221 on the front cavity 622. The sound outlet channel 612 can be a hole-shaped channel, and the cross-section of the sound outlet channel 612 can be elliptical, rectangular, trapezoidal, etc., which can be determined according to the actual situation. This embodiment of the specification does not limit this.

[0092] Referring to Figure 4, in this embodiment, the first housing 61, the second housing 62, the speaker body 64, and the third housing 63 are arranged sequentially from bottom to top. The first housing 61 is located below the second housing 62, and the first housing 61 and the second housing 62 are sealed together. The speaker body 64 is located within the cavity formed by the connection of the second housing 62 and the third housing 63. The dustproof assembly 65 is located between the left side of the second housing 62 and the left side of the first housing 61.

[0093] When in use, the sound emitted by the speaker body 64 is transmitted to the outside through the front cavity channel 6221 and the sound outlet channel 612.

[0094] The speaker module 60 provided in this embodiment has a thickness-direction misalignment between the sealing surface formed between the dustproof component 65 and the front cavity 622, the side of the third housing 63 facing the front cavity 622, and the sealing area formed by the second housing 62. This misalignment ensures the sound output height of the front cavity 622 along the thickness direction while preventing the sealing surface and sealing area from being located in the same thickness direction, thus achieving the goal of thinning electronic devices. Simultaneously, since the sound output height of the front cavity 622 along the thickness direction is guaranteed, the audio performance of the speaker module 60 is ensured.

[0095] In some embodiments, as shown in FIG7 and in conjunction with FIG8, the dustproof assembly 65 includes a dustproof net 652, a first adhesive layer 653, and a bracket 654; wherein, the first adhesive layer 653 has a first extension 6531 along a second direction on the side facing the first housing 61; the bracket 654 has a through hole 6541, and the side of the bracket 654 facing the first housing 61 has a second extension 6542 along a second direction; the side of the dustproof net 652 facing the bracket 654 is bonded to the first adhesive layer 653, the side of the dustproof net 652 away from the bracket 654 abuts against the first housing 61, the side of the bracket 654 facing the front cavity 622 abuts against the front cavity 622, and the first extension 6531 and the second extension 6542 form a sealing surface, wherein the second direction intersects with the first direction.

[0096] In this embodiment, as shown in Figure 7, the second direction is the Y-axis direction. The angle between the X-axis and the Y-axis can be 80°, 85°, 90°, etc. This embodiment will be described with the X-axis and Y-axis being perpendicular to each other as an example.

[0097] The mesh diameter of the dustproof net 652 in this embodiment can be 30um, 25um, or 20um, and can be determined according to the actual situation. This embodiment does not limit this.

[0098] As shown in Figure 7, in this embodiment, a first extension 6531 is provided on the lower side of the first adhesive layer 653 along the Y-axis direction. The first extension 6531 is integrally formed with the first adhesive layer 653. The first extension 6531 and the first adhesive layer 653 are made of the same material, and the first extension 6531 itself is also adhesive.

[0099] Referring to Figure 7, in this embodiment, a second extension 6542 is provided on the lower side of the bracket 654 along the Y-axis direction. The second extension 6542 is integrally formed with the bracket 654. At the same time, the extension direction of the second extension 6542 is the same as the extension direction of the first extension 6531.

[0100] During assembly, the first extension 6531 on the first adhesive layer 653 increases its size, thereby increasing the bonding area between the dustproof mesh 652 and the first adhesive layer 653, and improving the bonding stability between the two. Similarly, the second extension 6542 on the bracket 654 increases the bonding area when the first adhesive layer 653 is bonded to the bracket 654, further ensuring a stable bond.

[0101] In some embodiments, as shown in FIG9, a first support arm 6547 is provided in the through hole 6541.

[0102] In this embodiment, one or two first support arms 6547 can be provided in the through hole 6541. The specific configuration can be determined according to the actual situation, and this embodiment does not limit this.

[0103] Referring to Figure 8 and Figure 9, when the dustproof net 652 and the first adhesive layer 653 are bonded together to the bracket 654, the first adhesive layer 653 can also be bonded to the first support arm 6547, thereby supporting the central area of ​​the dustproof net 652 through the first support arm 6547, thereby improving the bonding stability of the dustproof net 652 and the bracket 654.

[0104] In some embodiments, as shown in FIG7 and in conjunction with FIG8, the dustproof assembly 65 further includes a second adhesive layer 651 disposed between the dustproof mesh 652 and the first housing 61.

[0105] In this embodiment, a third extension (not shown in the figure) can be provided on the second adhesive layer 651, and the extension direction of the third extension is the same as the extension direction of the second extension 6542. At the same time, the periphery of the second adhesive layer 651 is greater than or equal to the periphery of the dustproof net 652, so that the entire side of the dustproof net 652 facing the second adhesive layer 651 can be adhered to the second adhesive layer 651.

[0106] Since the second adhesive layer 651 is disposed between the dustproof net 652 and the first housing 61, when the dustproof assembly 65 is fixed between the second housing 62 and the left side of the first housing 61, the side of the dustproof net 652 facing the first housing 61 can be bonded to the first housing 61 through the second adhesive layer 651, thereby ensuring the stability of the connection between the dustproof net 652 and the first housing 61 and preventing the dustproof net 652 from moving relative to the first housing 61.

[0107] In some embodiments, as shown in FIG9, the dustproof assembly 65 further includes a first sealing gasket 655 disposed between the bracket 654 and the front cavity 622.

[0108] The material of the first sealing gasket 655 in this embodiment can be rubber, polytetrafluoroethylene, etc., and can be determined according to the actual situation. This embodiment does not limit this.

[0109] Because a first sealing gasket 655 is provided between the bracket 654 and the front cavity 622, the sealing performance between the bracket 654 and the front cavity 622 can be improved when the bracket 654 abuts against the front cavity 622.

[0110] In some embodiments, as shown in FIG9, the bracket 654 is provided with a first groove 6543 on the side facing the first sealing gasket 655, and the first sealing gasket 655 is at least partially located in the first groove 6543.

[0111] In this embodiment, the shape of the first groove 6543 is the same as the shape of the first sealing gasket 655.

[0112] When the first sealing gasket 655 is disposed between the bracket 654 and the front cavity 622, the first sealing gasket 655 is at least partially located within the first groove 6543. In this way, under the constraint of the first groove 6543, the first sealing gasket 655 can be stably located on the bracket 654.

[0113] In some embodiments, as shown in FIG9, the bracket 654 is provided with a first slot 6544 on the side facing the first sealing gasket 655, and a first block 6551 is provided on the first sealing gasket 655; when the first sealing gasket 655 is located in the first groove 6543, the first block 6551 is located in the first slot 6544.

[0114] In this embodiment, the first card block 6551 and the first sealing gasket 655 are integrally formed.

[0115] Referring to Figure 9, in this embodiment, a first slot 6544 is provided at the upper middle position of the bracket 654 facing the first sealing gasket 655. Of course, it can be understood that the first slot 6544 can also be provided at other positions on the bracket 654, and this embodiment does not limit this.

[0116] In this embodiment, when the first sealing gasket 655 is located in the first groove 6543, the first locking block 6551 on the first sealing gasket 655 is simultaneously located in the first slot 6544. In this way, under the constraint of the first locking block 6551 and the first slot 6544, the first sealing gasket 655 can be stably located in the first groove 6543, preventing the first sealing gasket 655 from moving around in the first groove 6543.

[0117] In some embodiments, as shown in FIG9, a second slot 6545 is provided on the side of the bracket 654 facing the first sealing gasket 655, and a second block 6552 is provided on the first sealing gasket 655; when the first block 6551 is located in the first slot 6544, the second block 6552 is located in the second slot 6545.

[0118] Referring to Figure 9, in this embodiment, a second slot 6545 is provided at each of the front and rear ends of the bracket 654 facing the first sealing gasket 655, and two second blocks 6552 are also provided on the first sealing gasket 655. It should be noted that this embodiment does not limit the number of second slots 6545 and the number of second blocks 6552, which can be determined according to the actual situation.

[0119] In this embodiment, the first locking block 6551 is located in the middle of the first sealing gasket 655, and the second locking block 6552 is located at both ends of the first sealing gasket 655. The first locking block 6551 and the second locking block 6552 are located on different planes. In this way, when the first locking block 6551 is located in the first locking groove 6544, the cooperation between the second locking block 6552 and the second locking groove 6545 can make the first sealing gasket 655 more stably located in the first groove 6543 on the bracket 654.

[0120] In some embodiments, as shown in FIG10 and in conjunction with FIG11 and FIG9, a third slot 613 is provided on the first housing 61, and a connecting arm 6546 is provided on the bracket 654; when the bracket 654 is located between the first housing 61 and the front cavity 622, the connecting arm 6546 is located in the third slot 613.

[0121] Referring to Figure 10, this embodiment has two third slots 613 on the first housing 61. Referring to Figure 9, this embodiment has two connecting arms 6546 at the front and rear ends of the bracket 654. The front connecting arm 6546 forms a notch with the front side wall of the bracket 654, and the rear connecting arm 6546 forms a notch with the rear side wall of the bracket 654.

[0122] When the bracket 654 is connected to the first housing 61, after the second adhesive layer 651 is bonded to the part around the sound outlet channel 612, as shown in Figure 11, the connecting arm 6546 is correspondingly locked in the third slot 613, which can prevent the bracket 654 from moving upward relative to the first housing 61.

[0123] In some embodiments, as shown in FIG12, a second support arm 614 is provided in the sound outlet channel 612.

[0124] In this embodiment, one or two second support arms 614 may be provided in the sound output channel 612. The specific configuration can be determined according to the actual situation, and this embodiment does not limit this.

[0125] Since a second support arm 614 is provided in the sound outlet channel 612, the sound outlet channel 612 is supported by the second support arm 614, thus preventing the sound outlet channel 612 from being deformed by collision.

[0126] In some embodiments, as shown in FIG13, the speaker module 60 further includes a second sealing gasket 66 disposed between the first housing 61 and the second housing 62.

[0127] The material of the second sealing gasket 66 in this embodiment can be rubber, polytetrafluoroethylene, etc., and can be determined according to the actual situation. This embodiment does not limit this.

[0128] Because a second sealing gasket 66 is provided between the first housing 61 and the second housing 62, the sealing performance between the first housing 61 and the second housing 62 can be improved.

[0129] In some embodiments, as shown in FIG13, the speaker module 60 further includes a third adhesive layer 67 disposed between the second sealing gasket 66 and the first housing 61.

[0130] In this embodiment, the third adhesive layer 67 has the same structural shape as the second sealing gasket 66. When connecting the first housing 61 and the second housing 62, the third adhesive layer 67 is adhered to the side of the first housing 61 facing the second housing 62, then the second sealing gasket 66 is adhered to the third adhesive layer 67, and finally the second housing 62 is fixed to the first housing 61. This facilitates the fixing of the second sealing gasket 66 between the first housing 61 and the second housing 62.

[0131] In some embodiments, as shown in FIG13, a second groove 611 is provided on the side of the first housing 61 facing the second housing 62, and a third adhesive layer 67 is located in the second groove 611.

[0132] In this embodiment, the structure of the second groove 611 is the same as that of the third adhesive layer 67.

[0133] During assembly, the third adhesive layer 67 is placed within the second groove 611, and then the second sealing gasket 66 is adhered to the third adhesive layer 67. At this time, the second sealing gasket 66 is at least partially located within the second groove 611. In this way, the second sealing gasket 66 can be stably positioned on the first housing 61 by being confined by the second groove 611.

[0134] In some embodiments, as shown in FIG13, a limiting groove 621 is provided on the side of the second housing 62 facing the third housing 63, and the speaker body 64 is located in the limiting groove 621.

[0135] In this embodiment, the limiting groove 621 can be integrally formed with the second housing 62, or the limiting groove 621 can be snapped onto the second housing 62. The specific method can be determined according to the actual situation, and this embodiment does not limit it.

[0136] Since the speaker body 64 is located within the limiting groove 621, this prevents the speaker body 64 from moving within the second housing 62.

[0137] In some embodiments, as shown in FIG14, the speaker module further includes a clamping plate 68, which is detachably connected to the second housing 62; when the speaker body 64 is located in the limiting groove 621, the clamping plate 68 clamps the speaker body 64.

[0138] In this embodiment, the clamping plate 68 can be bolted to the second housing 62, or the clamping plate 68 can be snapped onto the second housing 62. The specific method can be determined according to the actual situation, and this embodiment does not limit it.

[0139] During assembly, when the speaker body 64 is located in the limiting groove 621, the clamping plate 68 can simultaneously clamp the speaker body 64, so that the speaker body 64 can be stably located in the second housing 62.

[0140] In some embodiments, as shown in FIG15, a protrusion 681 is provided on the clamping plate 68, and a pressing surface 641 is provided on the speaker body 64, with the protrusion 681 cooperating with the pressing surface 641.

[0141] Referring to Figure 15, in this embodiment, a notch 625 is provided on the second housing 62. At the same time, a fixing plate 624 is bolted to the second housing 62, and the fixing plate 624 covers the upper side of the notch 625.

[0142] A bent section 682 is provided on the clamping plate 68. The clamping plate 68 is located inside the second housing 62, and the bent section 682 passes at least partially through the notch 625 and is located outside the second housing 62. At this time, the fixing plate 624 and the notch 625 enclose and define the bent section 682. At the same time, the protrusion 681 presses against the pressing surface 641, thereby facilitating the pressing fit between the clamping plate 68 and the speaker body 64.

[0143] It should be noted that the connection structure between the clamping plate and the second housing described above is merely an example. Other alternative structures can also be used, such as the clamping plate being snapped onto the second housing. This application does not impose any special restrictions on the specific connection structure between the clamping plate and the second housing, as long as the above structure can achieve the purpose of this application.

[0144] In some embodiments, as shown in FIG4, a first adhesive surface 623 is provided inside the second housing 62, and the first adhesive surface 623 and the front cavity 622 are located on the same side of the second housing 62; at the same time, a second adhesive surface 631 is provided on the side of the third housing 63 facing the front cavity 622, and the first adhesive surface 623 and the second adhesive surface 631 are bonded together to form a sealing area.

[0145] In this embodiment, the first adhesive surface 623 is disposed inside the second housing 62. The first adhesive surface 623 is a raised structure. The second adhesive surface 631 is integrally formed with the third housing 63. When the third housing 63 is connected to the second housing 62, the second adhesive surface 631 and the first adhesive surface 623 are bonded together by sealant.

[0146] In some embodiments, the first housing 61 and / or the third housing 63 are rigid structures.

[0147] In this embodiment, the materials of the first shell 61 and the third shell 63 can be metal, alloy, etc., which can be determined according to the actual situation. This specification does not limit this embodiment.

[0148] Since the first housing 61 and the third housing 63 are rigid structures, their strength can be increased, thereby protecting the speaker body 64 located inside the first housing 61 and the third housing 63 and preventing the speaker body 64 from being damaged by impact.

[0149] This application also provides an electronic device, including a speaker module as described in any of the embodiments of this application.

[0150] The specific structure of the speaker module in this embodiment refers to the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0151] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0152] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0153] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A speaker module, characterized in that, The system includes a first housing (61), a second housing (62), a third housing (63), a speaker body (64), and a dustproof assembly (65). The first housing (61) has a sound outlet channel (612), the second housing (62) is disposed on the first housing (61), and the second housing (62) has a front cavity (622) that communicates with the sound outlet channel (612). The dustproof assembly (65) is located between the first housing (61) and the front cavity (622). The third housing (63) is connected to the second housing (62) to form a cavity for accommodating the speaker body (64), and the speaker body (64) is located in the cavity. The sealing surface formed between the dustproof assembly (65) and the front cavity (622) is misaligned with the projection of the sealing area formed by the third housing (63) facing the front cavity (622) and the second housing (62) in a first direction, wherein the first direction is the thickness direction of the speaker module.

2. The speaker module according to claim 1, characterized in that, The dustproof assembly (65) includes a dustproof net (652), a first adhesive layer (653), and a bracket (654); the first adhesive layer (653) has a first extension (6531) along a second direction on the side facing the first housing (61); the bracket (654) has a through hole (6541), and the bracket (654) has a second extension (6542) along the second direction on the side facing the first housing (61); the dustproof net (652) is bonded to the side facing the bracket (654) by the first adhesive layer (653), the side of the dustproof net (652) away from the bracket (654) abuts against the first housing (61), the side of the bracket (654) facing the front cavity (622) abuts against the front cavity (622), the first extension (6531) and the second extension (6542) form the sealing surface, wherein the second direction intersects with the first direction.

3. The speaker module according to claim 2, characterized in that, A first support arm (6547) is provided in the through hole (6541).

4. The speaker module according to claim 2, characterized in that, The dustproof assembly (65) further includes a second adhesive layer (651), which is disposed between the dustproof mesh (652) and the first housing (61).

5. The loudspeaker module according to any one of claims 2 to 4, characterized in that, The dustproof assembly (65) further includes a first sealing gasket (655), which is disposed between the bracket (654) and the front cavity (622).

6. The speaker module according to claim 5, characterized in that, The bracket (654) has a first groove (6543) on the side facing the first sealing gasket (655), and the first sealing gasket (655) is at least partially located in the first groove (6543).

7. The speaker module according to claim 6, characterized in that, The bracket (654) is provided with a first slot (6544) on the side facing the first sealing gasket (655), and a first block (6551) is provided on the first sealing gasket (655); when the first sealing gasket (655) is located in the first groove (6543), the first block (6551) is located in the first slot (6544).

8. The speaker module according to claim 7, characterized in that, The bracket (654) has a second slot (6545) on the side facing the first sealing gasket (655), and a second block (6552) is provided on the first sealing gasket (655); when the first block (6551) is located in the first slot (6544), the second block (6552) is located in the second slot (6545).

9. The loudspeaker module according to any one of claims 2 to 4, characterized in that, The first housing (61) is provided with a third slot (613), and the bracket (654) is provided with a connecting arm (6546); when the bracket (654) is located between the first housing (61) and the front cavity (622), the connecting arm (6546) is located in the third slot (613).

10. The speaker module according to claim 1, characterized in that, A second support arm (614) is provided in the sound outlet channel (612).

11. The speaker module according to claim 1, characterized in that, The speaker module further includes a second sealing gasket (66), which is disposed between the first housing (61) and the second housing (62).

12. The speaker module according to claim 11, characterized in that, The speaker module further includes a third adhesive layer (67), which is disposed between the second sealing gasket (66) and the first housing (61).

13. The speaker module according to claim 12, characterized in that, The first housing (61) has a second groove (611) on the side facing the second housing (62), and the third adhesive layer (67) is located in the second groove (611).

14. The speaker module according to claim 1, characterized in that, The second housing (62) is provided with a limiting groove (621) on the side facing the third housing (63), and the speaker body (64) is located in the limiting groove (621).

15. The speaker module according to claim 14, characterized in that, The speaker module also includes a clamping plate (68), which is detachably connected to the second housing (62); when the speaker body (64) is located in the limiting groove (621), the clamping plate (68) clamps the speaker body (64).

16. The speaker module according to claim 15, characterized in that, The pressing plate (68) is provided with a protrusion (681), and the speaker body (64) is provided with a pressing surface (641), and the protrusion (681) cooperates with the pressing surface (641).

17. The speaker module according to claim 1, characterized in that, The second housing (62) has a first adhesive surface (623) inside, and the first adhesive surface (623) and the front cavity (622) are located on the same side of the second housing (62); the third housing (63) has a second adhesive surface (631) on the side facing the front cavity (622), and the first adhesive surface (623) and the second adhesive surface (631) are bonded together to form the sealing area.

18. The speaker module according to claim 1, characterized in that, The first housing (61) and / or the third housing (63) are rigid structures.

19. An electronic device, characterized in that, Includes the speaker module as described in any one of claims 1 to 18.

Images