Display driving board, micro-electric cavity display device and electronic equipment

Abstract

The invention provides a display driving board, a micro electric cavity display device and electronic equipment, and relates to the field of display. The display driving board comprises a substrate layer, a gate layer, a first insulating layer, a source and drain electrode layer, a second insulating layer, a protective layer and a conductive layer. All the layers are stacked in sequence, and the source and drain electrode layer can be in contact with the grid electrode layer through a first through hole in the first insulating layer; the conductive layer can contact the source and drain electrode layer through second through holes in the second insulating layer and third through holes in the protective layer, and the area of the third through holes is not larger than the sum of the areas of the two second through holes. The problem that the large-area thickness of the frame is not uniform due to the large-size through holes can be effectively solved, stress dispersion of the display driving plate in the packaging process is better facilitated, and therefore the durability and stability of the micro-electric-cavity display device are improved; in addition, the use amount of frame glue and through hole filling materials can be reduced, and therefore the manufacturing cost of the micro-electric-cavity display device is reduced.

Description

Technical Field

[0001] This application relates to the field of display, and more particularly to a display driver board, a microcavity display device, and an electronic device. Background Technology

[0002] For microcavity display devices, such as electronic paper (e-Paper) display devices, it is generally necessary to set through holes in specific areas of the driver board to create contact points that connect with the common electrode of the packaging board, so that an electric field is formed when energized, thereby causing the display device to display a pattern.

[0003] In related technologies, most display devices typically have large through holes in the protective layer of the driver board. Since the through hole area has a certain height difference compared to the non-through hole area, the uneven bezel caused by the large through hole not only easily affects the display effect of the display device, but also requires a certain thickness of bezel adhesive to ensure structural strength. Furthermore, when filling the through hole area with material to make contact points, the large through hole requires more filling material, resulting in higher material costs. Summary of the Invention

[0004] This application provides a display driver board, a micro-cavity display device, and an electronic device, aiming to improve the product yield, durability, and stability of the display device, and reduce the manufacturing cost of the display device.

[0005] In a first aspect, this application provides a display driver board for use in a microcavity display device, the display driver board comprising: basal layer; A gate layer that covers the surface of the substrate layer; A first insulating layer covers the surface of the first gate layer away from the substrate layer, and the first insulating layer is further provided with a first through-hole; A source-drain layer, which covers the surface of the first insulating layer away from the gate layer, and the source-drain layer is also in contact with the gate layer through the first via; A second insulating layer covers the surface of the source-drain layer away from the first insulating layer, and the second insulating layer is further provided with a second through-hole; A protective layer is provided, which covers the surface of the second insulating layer away from the source-drain layer, and the protective layer is provided with a third through hole, the area of ​​which is not greater than the sum of the areas of the two second through holes; A conductive layer covers the surface of the protective layer away from the second insulating layer, and the conductive layer contacts the source and drain layers through the second via and the third via.

[0006] Secondly, this application also provides a microcavity display device, the microcavity display device comprising: The display driver board is the display driver board provided in the first aspect; A packaging board, wherein the packaging board is disposed opposite to the display driver board; A support structure is provided between the display driver board and the encapsulation board, and forms a dam structure between the display driver board and the encapsulation board; An electronic paste is filled into the cofferdam structure. The electronic paste is used to present a target pattern when the display driver board is energized and an electric field is formed, so as to realize the display of the micro-cavity display device. The frame adhesive shown is used to bond the display driver board and the encapsulation board.

[0007] Thirdly, this application also provides an electronic device, which includes the microcavity display device as provided in the second aspect.

[0008] The display driver board provided in this application is used in a microcavity display device. The display driver board includes: a substrate layer, a gate layer, a first insulating layer, a source / drain layer, a second insulating layer, a protective layer, and a conductive layer. The substrate layer, gate layer, first insulating layer, source / drain layer, second insulating layer, protective layer, and conductive layer are stacked sequentially. A first through-hole is formed on the first insulating layer so that the source / drain layer can contact the gate layer through the first through-hole. A second through-hole is formed on the second insulating layer, and a third through-hole is formed on the protective layer so that the conductive layer can contact the source / drain layer through the second and third through-holes. The area of ​​the third through-hole is not greater than the sum of the areas of the two second through-holes. This application improves the problem of uneven bezel thickness caused by large-sized through holes by making the area of ​​the third through hole in the protective layer no greater than the sum of the areas of the two second through holes, i.e., the third through hole is a small-sized through hole. The display driver board with small-sized through holes is more conducive to stress dispersion during the packaging process, thereby improving product yield and the durability and stability of the micro-cavity display device. Moreover, compared with the prior art of making large-sized through holes, this application can also reduce the amount of bezel adhesive and through hole filling material, thereby reducing the manufacturing cost of the micro-cavity display device. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1A schematic diagram illustrating a scenario where a first substrate and a second substrate are bonded together, providing information for related technologies; Figure 2 A top view schematic diagram of a display device provided for related technologies; Figure 3 A partial cross-sectional view of a driver board provided for related technologies; Figure 4 A top view of a display device 100 provided for an embodiment of this application; Figure 5 A cross-sectional view of a display driver board provided for an embodiment of this application; Figure 6a A partial top view of a display driver board provided for an embodiment of this application; Figure 6b A partial top view of another display driver board provided for an embodiment of this application; Figure 6c A partial top view of another display driver board provided for an embodiment of this application; Figure 7 A schematic diagram of the structure of a microcavity display device provided for an embodiment of this application; Figure 8 This is a schematic block diagram of the structure of an electronic device provided in an embodiment of this application.

[0011] Figure label: 100. Microcavity display device; 200. Display area; 300. Bezel area; 10. Display driver board; 11. Substrate layer; 12. Gate layer; 13. First insulating layer; 131. First via; 14. Source / drain layer; 15. Second insulating layer; 151. Second through hole; 16. Protective layer; 161. Third through-hole; 17. Conductive layer; 20. Encapsulation board; 30. Flowing medium; 40. Support structure; 50. Frame adhesive; 1000. Electronic devices. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0013] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0014] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0015] It should be understood that, in order to clearly describe the technical solutions of the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. For example, the first callback function and the second callback function are only used to distinguish different callback functions and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" do not necessarily mean they must be different.

[0016] It should also be understood that the term "and / or" as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0017] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0018] Please see Figures 1-3 , Figure 1 A schematic diagram illustrating a scenario where a first substrate and a second substrate are bonded together, providing information for related technologies; Figure 2 A top view schematic diagram of a display device provided for related technologies; Figure 3 This is a partial cross-sectional view of a display device provided for related technologies, specifically showing a partial cross-sectional view of the driver board of the display device at the opening position.

[0019] like Figure 1 As shown, in related technologies, most display devices typically apply bezel adhesive to the bezel area and use the bezel adhesive to directly bond a first substrate and a second substrate. The first substrate can be the driver board of the display device, and the second substrate is the encapsulation board of the display device, thereby achieving adhesion and fixing between the driver board and the encapsulation board into a housing. For example... Figure 2 and Figure 3As shown, during the process of adhering and fixing the display device into a box, it is necessary to apply adhesive to the edge of the display device, such as... Figure 2 In area A, gold bonding is applied. It's important to note that gold bonding involves creating through-holes in the protective layer of the driver board. This exposes the electrode layer within the driver board, allowing it to connect with the common electrode of the package board. When power is applied, an electric field is generated, causing the electron paste between the two boards to flip, thus displaying different patterns in the display area. In applications where through-holes are created to facilitate electrical connection between the driver board and the package board, a large through-hole with a diameter of approximately 2mm is usually created in the protective layer of area A. Figure 3 As shown, the large-sized via area includes multiple vias in the insulating layer to connect with the electrode layer of the driver board. Since the thickness of the protective layer is about 2.0 μm, the thickness of the area with vias is 2.0 μm or more thinner than the area without vias. Therefore, this area is prone to causing insufficient uniformity of the bezel thickness of the packaged display device, which can affect the display effect. Furthermore, the large via size requires more filler material and more bezel adhesive for bonding, resulting in a higher material consumption.

[0020] To address the aforementioned issues, this application provides a display driver board in which a small-sized third through-hole is formed. Specifically, the area of ​​the third through-hole is no greater than the sum of the areas of two second through-holes formed in the second insulating layer. By replacing the large-sized through-hole with a small-sized third through-hole, the problem of uneven thickness over a large area in the area where the hole is located can be effectively improved. Furthermore, the small-sized third through-hole is more conducive to stress dispersion during the encapsulation process, thereby improving the bonding strength of the interface and further enhancing the durability and stability of the micro-cavity display device. Compared to forming a large-sized through-hole, the small-sized third through-hole requires less filler material and frame adhesive during the encapsulation process, thus reducing the manufacturing cost of the micro-cavity display device.

[0021] For example, the display device provided in this application can be a micro-cavity electronic paper display (MED), a display based on electrophoretic display (EPD) technology, a display electronic slurry (DES), etc., or other display devices. Any display device that requires the use of frame adhesive to adhere and fix two substrates into a box and requires gold dots to be applied at the frame position can be the display device provided in this application. No specific limitation is made here.

[0022] The following description uses a microcavity electronic paper display as an example to illustrate the display device and electronic equipment provided in this application.

[0023] Electronic paper (ePaper) is a novel reflective display technology. Its core technology uses electronic ink to display images and text, achieving a display effect close to traditional paper. It boasts unique advantages such as paper-like display, low power consumption, and eye-friendliness. Major applications of ePaper include e-book readers, electronic tags, educational equipment, smart wearable devices, IoT displays, and advertising and information displays. With continuous technological advancements, the application scenarios of ePaper are expected to expand further, making it one of the important future development directions for display technology.

[0024] Microcavity electronic paper displays (MEDs) primarily involve creating a dam structure on the surface of thin-film transistors (TFTs) to surround each pixel unit. An electronic paste containing black and white particles for imaging is then used to fill the fluid medium. Finally, the display is encapsulated with a top board (display driver board). The cavity formed by the dam structure in the MED is called the microcavity structure. MEDs can control the color changes of the particles in the electronic paste using an electric field, achieving high contrast and high reflectivity through particle reflection.

[0025] Please see Figure 4 and Figure 5 , Figure 4 A top view of a display device 100 provided for an embodiment of this application. Figure 5 This is a cross-sectional view of a display driver board provided for an embodiment of this application.

[0026] like Figure 4 As shown, the display device 100 includes a display area 200 and a border area 300 located around the display area 200. The display area 200 can be an area used to implement display functions. It should be noted that... Figure 4 The display area 200 shown can display color; in other embodiments, it can also display only black and white, which is not a limitation of this application. The border area 300 is located around the periphery of the display area 200, that is, the border area 300 is generally the edge area of ​​the display device 100. The through hole in the embodiment of this application is located in the border area 300.

[0027] like Figure 5As shown, in the display driver board 10, the gate layer 12 covers the surface of the base layer 11, which provides support. The surface of the gate layer 12 away from the base layer 11 is covered by a first insulating layer 13. The first insulating layer 13 includes at least one first via 131, providing a physical path for the subsequent source-drain layer 14 to contact the lower layer. The source-drain layer 14 covers the surface of the first insulating layer 13 away from the gate layer 12 and contacts the gate layer 12 through the first via 131, thereby achieving electrical connection. The surface of the source-drain layer 14 away from the first insulating layer 13 is covered by a second insulating layer 15. The source-drain layer 14 serves as the "entry and exit" of current. Charge carriers (electrons or holes) are injected into the semiconductor channel from the source and flow out of the channel at the drain to form an output current, which flows through the source. The voltage difference between the source and drain drives the flow of charge carriers. The second insulating layer 15, which covers the surface of the source-drain layer 14 away from the first insulating layer 13, has at least one second through-hole 151, providing a physical path for the uppermost conductive layer 17 to contact the source-drain layer 14. The protective layer 16 covers the surface of the second insulating layer 15 away from the source-drain layer 14. The protective layer 16 is mainly used to block water vapor and oxygen to prevent corrosion. This layer has at least one third through-hole 161, and the area of ​​the third through-hole 161 is not greater than the sum of the areas of the two second through-holes 151, so as to provide a path for electrical connection between different layers by opening small-sized through-holes. The conductive layer 17 is connected to the source-drain layer 14 through the second through-hole 151 and the third through-hole 161 to provide a connection point for external circuits.

[0028] The gate voltage of the gate layer 12 controls the switching of the channel through the electric field effect. The source and drain of the source-drain layer 14 are connected to the gate layer 12 through the first via 131. When the channel is formed, the current flows from the source to the drain through the channel. The output of the drain is transmitted to the conductive layer 17 through the second via 151 in the second insulating layer 15 and the third via 161 in the protective layer 16. The second insulating layer 15 and the protective layer 16 together achieve insulation protection. In this way, a compact three-dimensional circuit is constructed through the above-mentioned layer stacking and via arrangement.

[0029] It should be understood that the area of ​​the third through-hole 161 opened on the protective layer 16 is no greater than the sum of the areas of the two second through-holes 151 opened on the second insulating layer 15, so as to achieve a small-sized opening in the protective layer 16; this prevents the area with a thinner protective layer 16 from being too large, thereby effectively improving the problem of uneven bezel caused by large-sized openings, thus improving the product yield of the micro-cavity display device; and the small-sized opening is more conducive to stress dispersion during the packaging process, thereby improving the durability and stability of the micro-cavity display device; and the small-sized opening can also reduce the use of filler materials and bezel adhesive, thereby reducing the manufacturing cost of the micro-cavity display device.

[0030] In some embodiments, the diameters of both the first through hole 131 and the second through hole 151 are 5~100um. The diameters of the first through hole 131 and the second through hole 151 may be the same or different, and this is not limited here.

[0031] It should be understood that the function of the third via 161 is to allow the conductive layer 17 to contact the source / drain layer 14 through the second via 151. Therefore, the size of the third via 161 can be slightly larger than the second via 151 to achieve a small-sized opening on the protective layer 16. For example, the aperture of the third via 161 ranges from 5 to 100 μm, and the third via 161 is slightly larger than the second via 151. In other embodiments, the areas of the first via 131, the second via 151, and the third via 161 are all in the range of 25 square micrometers to 0.01 square millimeters. Similarly, the area of ​​the third via 161 is slightly larger than the area of ​​the second via 151. For example, when the area of ​​the second via 151 is 25 square micrometers, the area of ​​the third via 161 is 35 square micrometers, thus achieving a small-sized opening on the protective layer 16. It should be noted that the vias can be circular, matrix, or other shapes, and the area of ​​the specific pattern corresponding to the via is also within the above-mentioned area range. It should be noted that the diameters of the first through hole 131, the second through hole 151, and the third through hole 161 provided in this embodiment are merely illustrative examples. Those skilled in the art can adjust the size of the third through hole 161 according to the actual usage requirements of each through hole and the actual size of the second through hole 151 and the usage requirements of the third through hole 161. The diameter of the third through hole 161 can be much smaller than 2mm and slightly larger than the second through hole 151. This application does not limit the specific values ​​of the diameter and area of ​​the third through hole 161.

[0032] In some embodiments, the projection shape of the third via 161 on the source-drain layer 14 is at least one of a rectangle, a circle, and an ellipse.

[0033] For example, the third through hole 161 can be formed in different shapes according to actual needs, including but not limited to rectangles, circles, and ellipses. In other embodiments, the third through hole 161 can also be formed in irregular shapes, which is not limited in this application.

[0034] It should be noted that if the third through hole 161 is a rectangle or other polygon, the length of the longest diagonal in the projection pattern corresponding to the third through hole 161 is no more than 100um, so as to achieve a small-sized opening in the protective layer 16.

[0035] In some embodiments, the projection of the second via 151 on the source-drain layer 14 overlaps with the projection of the third via 161 on the source-drain layer 14.

[0036] For example, the projection of the second via 151 on the source-drain layer 14 at least partially overlaps with the projection of the third via 161 on the source-drain layer 14, that is, the position of the second via 151 at least partially overlaps with the position of the third via 161, thereby enabling the conductive layer 17 to enter the second via 151 from the third via 161 and contact the source-drain layer 14.

[0037] Please see Figure 6a , Figure 6b and Figure 6c , Figure 6a A partial top view of a display driver board 10 provided for an embodiment of this application; Figure 6b A partial top view of another display driver board 10 provided for an embodiment of this application; Figure 6c A partial top view of another display driver board 10 provided for an embodiment of this application.

[0038] In some embodiments, the projection of the second via 151 on the source-drain layer 14 lies within the projection of the third via 161 on the source-drain layer 14.

[0039] For example, the maximum opening of the third through-hole 161 completely surrounds the location of the second through-hole 151 to facilitate the placement of the conductive layer 17 and the filling of other materials. For instance, Figure 6a The projection pattern of the third through hole 161 is shown to be a circle. The projection patterns of the second through hole 151 and the third through hole 161 form concentric circles, and the circle corresponding to the second through hole 151 is completely located within the circle corresponding to the third through hole 161. Figure 6b The projection pattern of the third through hole 161 is shown to be elliptical, and the circle corresponding to the second through hole 151 is also completely located within the ellipse corresponding to the third through hole 161. Figure 6c This shows the case where the projected shape of the third through hole 161 is a square. This square can be the circumscribed square of the circle corresponding to the second through hole 151, thereby making the size of the third through hole 161 as small as possible, thus avoiding the disadvantages of large-sized openings and saving the cost of the display device.

[0040] In some embodiments, the second insulating layer 15 is provided with a plurality of second through holes 151, and the protective layer 16 is provided with a plurality of third through holes 161, wherein the second through holes 151 and the third through holes 161 correspond one-to-one.

[0041] For example, the second insulating layer 15 is provided with a plurality of second through holes 151 to meet the connection requirements of the source and drain layers 14, while the protective layer 16 is provided with third through holes 161 corresponding to the second through holes 151.

[0042] For example, when the second insulating layer 15 has 20 second through holes 151, the protective layer 16 also has 20 corresponding third through holes 161; when the second insulating layer 15 has 25 second through holes 151, the protective layer 16 also has 25 third through holes 161, so that the second through holes 151 and the third through holes 161 correspond one-to-one. It should be understood that the projected shape and size of the third through holes 161 corresponding to the second through holes 151 can be referred to the size and shape of the third through holes 161 provided in the previous embodiments, and will not be described again here.

[0043] In some embodiments, the cross-sectional area of ​​the third through-hole 161 gradually decreases along the direction from the conductive layer 17 to the second insulating layer 15.

[0044] For example, since the protective layer 16 has a certain thickness, the third through hole 161 has a certain depth. Specifically, the cross-sectional area of ​​the third through hole 161 along the depth direction can remain constant or gradually decrease; it should be understood that the depth direction of the third through hole 161 is also the direction from the conductive layer 17 to the second insulating layer 15.

[0045] For example, if the cross-sectional area of ​​the third through hole 161 gradually decreases along the depth direction, that is, the cross-sectional shape of the third through hole 161 is trapezoidal, by setting the third through hole 161 with a trapezoidal cross-sectional shape, it is easier to fill the material of the third through hole 161, so as to improve the ease of use of the third through hole 161.

[0046] For example, the third through hole 161 is exactly the same in size and shape as the second through hole 151 at the position where it contacts the second through hole 151, so as to avoid the second insulating layer 15 being exposed, thereby ensuring the protective function of the protective layer 16. That is, on the side of the third through hole 161 away from the second insulating layer 15, the area corresponding to the third through hole 161 can be larger than the area of ​​the second through hole 151, and the projected image of the third through hole 161 at this position can completely contain the projected image of the second through hole 151; while on the side of the third through hole 161 close to the second insulating layer 15, the area corresponding to the third through hole 161 is basically the same as that of the second through hole 151, and the projected image of the third through hole 161 at this position is basically the same as that of the second through hole 151. In fact, at the contact position between the protective layer 16 and the second insulating layer 15, the edge of the third through hole 161 basically matches the edge of the second through hole 151, so as to avoid the situation where the third through hole 161 is too large at this position, resulting in the second insulating layer 15 being exposed, or the third through hole 161 is too small at this position, resulting in the second through hole 151 not being fully utilized, thereby ensuring the protective effect of the protective layer 16 and improving the material utilization rate in the micro cavity driver board.

[0047] In some embodiments, the first through hole 131, the second through hole 151, and the third through hole 161 are located in the corner area of ​​the display driver board 10.

[0048] For example, the first through hole 131, the second through hole 151 and the third through hole 161 should be located at the gold point of the display driver board 10, that is, in the corner area, so as to reduce the impact on other areas while satisfying the common connection with the package board.

[0049] In some embodiments, the surface of the conductive layer 17 away from the protective layer 16 is planar.

[0050] For example, the conductive layer 17 located at a position other than the third through hole 161 is a single plane, that is, except for the conductive layer 17 at the position of the third through hole 161, the other conductive layers 17 are on the same horizontal plane, so as to reduce the area of ​​uneven border, reduce the use of border adhesive, and facilitate stress dispersion during the encapsulation process, thereby improving the durability and stability of the micro cavity display device.

[0051] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a microcavity display device 100 provided for an embodiment of this application.

[0052] like Figure 7 As shown, the microcavity display device 100 includes a display driver board 10, a packaging board 20, a support structure 40, an electronic paste 30, and a frame adhesive 50. The display driver board 10 can be any of the display driver boards provided in the preceding embodiments. The packaging board 20 is disposed opposite to the display driver board 10, and a common electrode layer is provided within the packaging board 20. The conductive layer of the display driver device located in the third through-hole can be connected to the common electrode layer, thereby forming an electric field in the region between the display driver board 10 and the packaging board 20 when the display driver board 10 is energized. A support structure 40 is disposed between the display driver board 10 and the encapsulation board 20 to support the two boards and ensure the spacing between them. The support structure 40 also forms a dike structure between the display driver board 10 and the encapsulation board 20 in the display area. This dike structure is used to fill the electronic paste 30, thereby forming individual pixels in the microcavity display device 100. The electronic paste 30 can flip when the display driver board 10 and the encapsulation board 20 are energized and an electric field is formed, thus presenting different gray levels. Different patterns can be formed by utilizing the gray levels displayed by the electronic paste 30 within each pixel, thereby realizing the display of the microcavity display device 100. The frame adhesive 50 is used to adhere the display driver board 10 and the encapsulation board 20 into a box to form the microcavity display device 100.

[0053] For example, the microcavity display device 100 may be a microcavity electronic paper display, in which case the electronic paste 30 includes a filling liquid and conductive particles, the conductive particles may include black particles and white particles with different electrical properties.

[0054] Specifically, the electronic paste 30 is disposed between the display driver board 10 and the encapsulation board 20 to form a sealed cavity, and the sealed cavity contains a filling liquid and conductive particles distributed in the filling liquid.

[0055] For example, black and white particles can have different electrical charges. For instance, white particles may carry a negative charge and black particles may carry a positive charge; or white particles may carry a positive charge and black particles may carry a negative charge. No specific limitation is made here.

[0056] Black and white particles can undergo electrophoresis under the influence of voltage, controlling their positional distribution within the electron paste 30 and thus creating different grayscale levels on the screen surface. Utilizing the principle of attraction between positive and negative particles, when an electric field is applied, corresponding black or white particles move to the top of the electron paste 30, allowing the user to see black or white within that area (pixel). Applying different voltages to the same electron paste 30 will result in a half-black, half-white appearance at the top, allowing the user to see gray within that area (pixel).

[0057] For example, the display driver board 10 and the packaging board 20 can be arranged correspondingly in a first direction, which can be the vertical direction of the display driver board 10 and the packaging board 20, that is, the thickness direction of the micro cavity display device 100.

[0058] In some embodiments, the side of the encapsulation board 20 facing away from the display driver board 10 serves as the display surface of the microcavity display device 100, allowing the user to see the content presented by the microcavity display device 100 using the electronic paste 30 in the display area of ​​the microcavity display device 100 through the encapsulation board 20.

[0059] In other embodiments, the surface of the display driver board 10 facing away from the packaging board 20 can also serve as the display surface of the micro-cavity display device 100. In this embodiment, the pixel needs to be provided with a light-transmitting part so that the reflected light can be transmitted through the light-transmitting part.

[0060] Specifically, the light-transmitting portion refers to the effective area in the display driver panel 10 through which light can pass. The ratio of the area of ​​the light-transmitting portion to the area of ​​the pixel is the ratio of the area of ​​the effective area of ​​the display driver panel 10 through which light can pass to the area of ​​the entire pixel area.

[0061] The area of ​​each pixel generally includes a light-transmitting area and a non-light-transmitting area. The non-light-transmitting area is generally the part occupied by devices such as circuits, thin-film transistors, and storage capacitors.

[0062] To ensure the display effect of the micro-cavity display device 100, the ratio of the area of ​​the light-transmitting portion to the area of ​​the pixel must be at least greater than 50%, typically 70%-80%. In the micro-cavity display device 100, it is generally necessary to maximize the aperture ratio to maximize the area through which light passes, thereby improving the brightness and energy efficiency of the micro-cavity display device 100. Therefore, in this embodiment, while ensuring that the circuitry and chip select signal (CS) meet the requirements, the ratio of the area of ​​the light-transmitting portion to the area of ​​the pixel can be increased as much as possible, thereby effectively improving the brightness and energy efficiency of the micro-cavity display device 100. For example, the shape of the light-transmitting portion includes square, rectangular, circular, and hexagonal shapes, etc., and is not specifically limited here.

[0063] Please see Figure 8 , Figure 8 This is a schematic block diagram of the structure of an electronic device provided in an embodiment of this application.

[0064] like Figure 8 As shown, this application also provides an electronic device 1000, which includes a microcavity display device 100 as described in any embodiment of this application. The electronic device 1000 uses a third through-hole in the protective layer of the frame region to meet the connection requirements between the electrodes in the display driver board and the packaging board electrodes in the microcavity display device 100. The area of ​​the third through-hole is no greater than the sum of the areas of the two second through-holes, wherein the second through-holes are through-holes formed in the second insulating layer of the display driver board. This design makes the third through-hole a small-sized through-hole, thus effectively improving the problem of uneven frame thickness caused by large-sized through-holes, making it easier to disperse stress during the packaging process, thereby improving product yield and enhancing the durability and stability of the microcavity display device. Compared with related technologies that use large-sized through-holes, this application can also reduce the amount of frame adhesive and through-hole filling material, thereby reducing the manufacturing cost of the microcavity display device.

[0065] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0066] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0067] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0069] The above embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of protection of this application. Any non-substantial changes and substitutions made by those skilled in the art based on this application shall fall within the scope of protection claimed by this application.

Claims

1. A display driver board, characterized in that, The display driver board, used in a microcavity display device, includes: basal layer; A gate layer that covers the surface of the substrate layer; A first insulating layer covers the surface of the gate layer away from the substrate layer, and the first insulating layer is further provided with a first through-hole; A source-drain layer, which covers the surface of the first insulating layer away from the gate layer, and the source-drain layer is also in contact with the gate layer through the first via; A second insulating layer covers the surface of the source-drain layer away from the first insulating layer, and the second insulating layer is further provided with a second through-hole; A protective layer covers the surface of the second insulating layer away from the source-drain layer, and the protective layer is provided with a third through-hole, the area of ​​which is not greater than the sum of the areas of the two second through-holes; A conductive layer covers the surface of the protective layer away from the second insulating layer, and the conductive layer contacts the source and drain layers through the second via and the third via.

2. The display driver board as described in claim 1, characterized in that, The projection of the second via on the source-drain layer overlaps with the projection of the third via on the source-drain layer.

3. The display driver board as described in claim 2, characterized in that, The projection of the second via on the source-drain layer lies within the projection of the third via on the source-drain layer.

4. The display driver board as described in any one of claims 1-3, characterized in that, The second insulating layer has a plurality of second through holes, and the protective layer has a plurality of third through holes, with the second through holes corresponding one-to-one with the third through holes.

5. The display driver board as described in any one of claims 1-3, characterized in that, The first through hole, the second through hole, and the third through hole are located in the corner area of ​​the display driver board.

6. The display driver board as described in any one of claims 1-3, characterized in that, The projection shape of the third via on the source-drain layer is at least one of rectangle, circle, and ellipse.

7. The display driver board as described in any one of claims 1-3, characterized in that, The surface of the conductive layer away from the protective layer is planar.

8. The display device according to any one of claims 1-3, characterized in that, The cross-sectional area of ​​the third through hole gradually decreases along the direction from the conductive layer to the second insulating layer.

9. A microcavity display device, characterized in that, The microcavity display device includes: The display driver board is the display driver board according to any one of claims 1-8; A packaging board, wherein the packaging board is disposed opposite to the display driver board; A support structure is provided between the display driver board and the encapsulation board, and forms a dam structure between the display driver board and the encapsulation board; An electronic paste is filled into the cofferdam structure. The electronic paste is used to present a target pattern when the display driver board is energized and an electric field is formed, so as to realize the display of the micro-cavity display device. The frame adhesive shown is used to bond the display driver board and the encapsulation board.

10. An electronic device, characterized in that, The electronic device includes the microcavity display device as described in claim 9.

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