Light-emitting substrate and display device
CN121968840APending Publication Date: 2026-05-01BOE TECHNOLOGY GROUP CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202411508997.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2026-05-01
AI Technical Summary
Technical Problem
Existing Micro/Mini LED display devices have complex manufacturing processes, low production efficiency, and high manufacturing costs.
Method used
A light-emitting substrate structure is provided, including a driving backplate, a light-emitting device, a first encapsulation layer and a second electrode layer. By setting an air gap in the groove and increasing the thickness of the encapsulation layer or the electrode layer, disconnection is avoided, the process flow is simplified, and the planarization layer is omitted.
Benefits of technology
The preparation process was simplified, production efficiency was improved, preparation costs were reduced, luminescence efficiency was increased, and energy consumption was reduced.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121968840A_ABST
Abstract
The embodiment of the invention provides a light-emitting substrate and a display device, relates to the technical field of display, and is used for reducing the preparation cost. The light-emitting substrate comprises a driving backboard, a light-emitting device, a first packaging layer and a second electrode layer. The driving backboard comprises a first bonding pad and a second bonding pad, the light-emitting device comprises a light-emitting stacking layer and a first electrode, and the first electrode is connected with the first bonding pad and shrinks inwards relative to the light-emitting stacking layer and the first bonding pad to form a groove. The first packaging layer comprises a first packaging part and a second packaging part, the first packaging part covers the driving backboard, and the second packaging part covers the light emitting device. The second electrode layer is in direct contact with the first encapsulation layer. The second electrode layer comprises a first conductive part and a second conductive part, the first conductive part is connected with the first bonding pad or the second bonding pad, and the second conductive part wraps the second packaging part and is connected with the light-emitting device. And an air gap is formed between the second electrode layer and the first electrode at the groove. The light-emitting substrate is used for the display device.
Need to check novelty before this filing date? Find Prior Art