Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel and a manufacturing method thereof and a display device.The display panel comprises a plurality of light-emitting devices, the light-emitting surfaces of the light-emitting devices are provided with a plurality of grooves, the grooves comprise a plurality of first grooves, and the grooves further comprise at least one second groove and / or at least one third groove; the first groove is located in a light-emitting area of the light-emitting device, and the second groove and the third groove are located in a non-light-emitting area of the light-emitting device; in the same light-emitting device, different first grooves are internally provided with color conversion materials emitting light of different colors, the second grooves are not internally provided with color conversion materials, and the third grooves are internally provided with color conversion materials which are the same as the color conversion materials in the first grooves.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Micro-LEDs, due to their small size, high flexibility, and ease of disassembly and assembly, can be deployed in any display application with various existing display sizes, and in many cases, they will have a more unique effect than liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays.

[0003] Because Micro-LED displays have a high pixel density, the required number of components and the transfer speed need to be significantly increased. Furthermore, the transfer process demands extremely high alignment accuracy of the Micro-LED chips to ensure optimal display quality. To guarantee the quality of Micro-LED displays, the industry standard is to control the number of invalid pixels in a full HD display to an extremely low level, such as a yield rate of 99.9999%. This requires that there not be too many damaged or failed Micro-LED chips during the transfer process.

[0004] However, Micro-LED chip failures are inevitable during the transfer process. To improve the yield of Micro-LED display devices, the industry typically replaces failed Micro-LED chips upon discovery. However, chip transfer technology requires high-precision placement of the separated Micro-LED chips onto the target substrate, demanding extremely high accuracy and stability from the transfer device. Furthermore, mass transfer costs constitute a significant proportion of the total cost of Micro-LED display devices; for some high-resolution displays, mass transfer costs can account for approximately 20% of the total cost. This makes repairing failed Micro-LED chips extremely costly.

[0005] Therefore, how to repair Micro-LED chips at low cost has become a pressing technical problem. Summary of the Invention

[0006] This invention provides a display panel, a method for manufacturing the same, and a display device, to address the problem of high cost in repairing Micro-LED chips in the prior art.

[0007] In a first aspect, to solve the above-mentioned technical problems, embodiments of the present invention provide a display panel, comprising:

[0008] A plurality of light-emitting devices are provided, wherein the light-emitting surface of the light-emitting devices has a plurality of grooves, the plurality of grooves including a plurality of first grooves, and the plurality of grooves further including at least one second groove and / or at least one third groove; the first grooves are located in the light-emitting area of ​​the light-emitting devices, and the second grooves and the third grooves are located in the non-light-emitting area of ​​the light-emitting devices;

[0009] In the same light-emitting device, different first grooves are provided with color-transfer materials that emit different colors of light, the second groove is not provided with color-transfer materials, and the third groove is provided with color-transfer materials of the same material as the first groove.

[0010] One possible implementation of the light-emitting device includes:

[0011] An electrode layer comprising multiple electrodes, one of which is a common electrode and the rest are pixel sub-electrodes;

[0012] A light-emitting structure is located on one side of the electrode layer; the side of the light-emitting structure away from the electrode layer has the plurality of grooves; wherein, the plurality of grooves correspond one-to-one with the pixel sub-electrodes among the plurality of electrodes, and the orthogonal projection of the grooves on the electrode layer covers the corresponding pixel sub-electrodes;

[0013] A color transfer layer is located on the side of the light-emitting structure away from the electrode layer; the color transfer layer includes a color transfer material disposed in the groove.

[0014] One possible implementation of the light-emitting structure includes:

[0015] A first type of semiconductor layer is located on the side of the electrode layer near the color transfer layer; the first type of semiconductor layer includes a plurality of first type semiconductor structures located on the same plane; the plurality of first type semiconductor structures correspond one-to-one with the plurality of grooves, and the plurality of first type semiconductor structures are spaced apart from each other; the pixel sub-electrode is in contact with the first type semiconductor structure corresponding to the same groove;

[0016] A light-emitting layer is located on the side of the first type of semiconductor layer away from the electrode layer; the light-emitting layer includes a plurality of sub-pixel light-emitting layers, which correspond one-to-one with and overlap with the plurality of first type semiconductor structures;

[0017] The second type of semiconductor layer is located on the side of the light-emitting layer away from the electrode layer and covers the first type of semiconductor layer and the light-emitting layer. The common electrode is in contact with the second type of semiconductor layer and does not overlap with the first type of semiconductor layer and the light-emitting layer. The plurality of grooves are disposed on the first side of the second type of semiconductor layer away from the electrode layer. The orthographic projection of the first type of semiconductor structure on the second type of semiconductor layer covers the orthographic projection of the corresponding groove on the second type of semiconductor layer.

[0018] In one possible implementation, the orthographic projection shape of the first type of semiconductor structure on the second surface of the second type of semiconductor layer near the electrode layer is the same as the orthographic projection shape of the groove on the second surface.

[0019] In one possible implementation, the orthographic projection of the plurality of grooves onto the first surface is a concentric annular sector shape that does not overlap.

[0020] In one possible implementation, the orthographic projection of the plurality of grooves onto the first surface is a non-overlapping concentric ring.

[0021] In one possible implementation, the orthographic projection of the groove onto the first surface is a first quadrilateral.

[0022] The plurality of grooves are arranged in a second quadrilateral around the same center, the center being the center of the second quadrilateral, and the area of ​​the second quadrilateral is N times greater than the area of ​​the first quadrilateral, where N is the total number of the plurality of grooves.

[0023] In one possible implementation, the light-emitting structure further includes:

[0024] A photoresist layer comprising a plurality of photoresist structures located between two adjacent grooves, wherein the photoresist structure is composed of at least a portion of a first-type semiconductor layer doped with ions located between the two adjacent grooves.

[0025] In one possible implementation, the color-transfer material that emits blue light among the various color-transfer materials is doped with light-scattering particles.

[0026] In one possible implementation, the display panel further includes:

[0027] A backplate is located on the side of the light-emitting device away from the light-emitting surface; the side of the backplate close to the light-emitting device has multiple sets of bonding pads, each set of bonding pads corresponds to one of the multiple light-emitting devices, each set of bonding pads includes multiple bonding pads, and the multiple bonding pads are arranged opposite to one of the multiple electrodes.

[0028] Multiple electroplated structures are connected between the electrodes of the light-emitting device and the corresponding bonding pads.

[0029] Secondly, embodiments of the present invention provide a method for manufacturing a display panel, comprising:

[0030] The backplate and multiple light-emitting devices are aligned, with a gap between the backplate and the multiple light-emitting devices; wherein, one side of the backplate has multiple sets of bonding pads, and the light-emitting surface of the light-emitting device has multiple grooves, the multiple grooves including multiple first grooves, and the multiple grooves also including at least one second groove;

[0031] The aligned backplate and the plurality of light-emitting devices are placed in an electroplating solution bath for electroplating, so that an electroplating structure is formed between the bonding pads and the corresponding electrodes.

[0032] Detect whether light can be emitted from each area of ​​the groove containing the color-converting material in the light-emitting device;

[0033] If any area containing a color-transfer material cannot emit light, then a color-transfer material is placed in the second groove. The groove containing the color-transfer material but unable to emit light is designated as the third groove. The color-transfer material in the second groove is the same as that in the third groove. The second groove containing the color-transfer material is designated as the first groove. In the same light-emitting device, different first grooves contain color-transfer materials that emit different colors of light. If all areas containing the color-transfer material can emit light, then the second groove remains unfilled with color-transfer material. The first groove is located in the light-emitting area of ​​the light-emitting device, and the second and third grooves are located in the non-light-emitting area of ​​the light-emitting device.

[0034] Thirdly, embodiments of the present invention provide a display device, including a display panel as shown in the first aspect. Attached Figure Description

[0035] Figure 1 A top view of a display panel provided in an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the structure of a light-emitting device provided in an embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of another light-emitting device provided in an embodiment of the present invention;

[0038] Figure 4 A bottom view of a light-emitting device provided in an embodiment of the present invention;

[0039] Figure 5 Provided for embodiments of the present invention Figure 4 Top view of the corresponding light-emitting device;

[0040] Figure 6 A top view of another light-emitting device provided in an embodiment of the present invention;

[0041] Figure 7 The embodiments of the present invention provide and Figure 6 Bottom view of the corresponding light-emitting device;

[0042] Figure 8 A top view of another light-emitting device provided in an embodiment of the present invention;

[0043] Figure 9 A bottom view of another light-emitting device provided in an embodiment of the present invention;

[0044] Figure 10 A top view of another light-emitting device provided in an embodiment of the present invention;

[0045] Figure 11 A bottom view of another light-emitting device provided in an embodiment of the present invention;

[0046] Figure 12 A top view of another light-emitting device provided in an embodiment of the present invention;

[0047] Figure 13 A cross-sectional view of another light-emitting device provided in an embodiment of the present invention;

[0048] Figure 14 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention;

[0049] Figure 15 A three-dimensional schematic diagram of a set of bonding pads in a backplane provided in an embodiment of the present invention;

[0050] Figure 16 This is a schematic diagram of the structure of a display panel in related technologies;

[0051] Figure 17 This is a schematic diagram illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0052] Figure 18 This is a schematic diagram of forming a light-emitting device according to an embodiment of the present invention;

[0053] Figure 19 A three-dimensional schematic diagram of a light-emitting structure provided in an embodiment of the present invention;

[0054] Figure 20 A three-dimensional schematic diagram of another light-emitting structure provided in an embodiment of the present invention;

[0055] Figure 21This is a three-dimensional schematic diagram of the groove in a light-emitting structure provided in an embodiment of the present invention;

[0056] Figure 22 This is a three-dimensional schematic diagram of a color transfer layer formed according to an embodiment of the present invention.

[0057] Figure label:

[0058] Light-emitting device 1, groove K, light-emitting area A, non-light-emitting area B, electrode layer 11, electrode P, common electrode P1, pixel sub-electrode P2, light-emitting structure 12, color transfer layer 13, first type semiconductor layer 121, first type semiconductor structure 1211, light-emitting layer 122, sub-pixel light-emitting layer 1221, second type semiconductor layer 123, first surface 123a, second surface 123b, photoresist layer 124, photoresist structure 1241, encapsulation layer 14, backplate 2, bonding pad 21, electroplating structure 3;

[0059] First temporary substrate 10, electroplating solution tank 100, second temporary substrate 10', and substrate 00. Detailed Implementation

[0060] This invention provides a display panel, a method for manufacturing the same, and a display device, to address the problem of high cost in repairing Micro-LED chips in the prior art.

[0061] It should be understood that the specific structural and functional details disclosed in the embodiments of the present invention are merely representative and are intended to describe exemplary embodiments of this application. However, this application can be implemented in many alternative or combined forms and should not be construed as being limited solely to the embodiments set forth herein.

[0062] In the description of this application, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0063] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0064] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein are also intended to include the plural. It should also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the stated features, integers, steps, operations, units, and / or components, without excluding the presence or addition of one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0065] In this invention, the term "and / or" is merely a description of the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following associated objects have an "or" relationship.

[0066] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms describing position and direction in the present invention are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of the present invention. The accompanying drawings of the present invention are for illustrative purposes only and do not represent actual proportions.

[0067] It should be noted that specific details are set forth in the following description to provide a full understanding of the invention. However, the invention can be practiced in many ways other than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below. The following description is a preferred embodiment for carrying out the present application; however, the description is for the purpose of illustrating the general principles of the application and is not intended to limit the scope of the application. The scope of protection of this application shall be determined by the appended claims.

[0068] The following description, in conjunction with the accompanying drawings, details a display panel, its manufacturing method, and a display device provided by an embodiment of the present invention.

[0069] Please see Figure 1 This invention provides a top view of a display panel according to an embodiment of the invention. The display panel includes:

[0070] Multiple light-emitting devices 1, the light-emitting surface of the light-emitting device 1 has multiple grooves K, the multiple grooves K include multiple first grooves K1, the multiple grooves K also include at least one second groove K2 and / or at least one third groove K3; the first grooves K1 are located in the light-emitting area A of the light-emitting device 1, and the second grooves K2 and the third grooves K3 are located in the non-light-emitting area B of the light-emitting device 1;

[0071] In the same light-emitting device 1, different first grooves K1 are provided with color-transfer materials that emit different colors of light, the second groove K2 is not provided with color-transfer materials, and the third groove K3 is provided with color-transfer materials of the same material as the first groove K1.

[0072] like Figure 1 As shown, a light-emitting device 1 may include 4 grooves K, assuming Figure 1 Except for the groove K in the lower right corner, which is used as a spare groove K without color transfer material when manufacturing the light-emitting device 1, the other three grooves K are used as common grooves K with color transfer material when manufacturing the light-emitting device 1. In this way, after performing a screen test on the display panel, if the color transfer material in the three common grooves K cannot emit light, the same color transfer material is set in the spare groove K to enable it to emit light. This eliminates the need to use a transfer device to replace the Micro-LED chip when repairing it, as is required in the existing technology. This not only saves the huge transfer cost incurred during the replacement process, but also saves repair time and improves repair efficiency, i.e., product yield.

[0073] by Figure 1 For example, if the light-emitting device 1 includes 4 grooves K, please refer to [link / reference]. Figure 1 The first light-emitting device 1 in the first row has three common grooves K, each containing red, green, and blue color-conversion materials. If the color-conversion materials in these three common grooves K can emit light during the screen test, it indicates that the corresponding light-emitting device 1 is effective. These three common grooves K are all first grooves K1, and the area they are located in is the display area of ​​the corresponding light-emitting device 1. The spare grooves K do not need to contain color-conversion materials. The area where the spare grooves K are located is the non-display area of ​​the corresponding light-emitting device 1. The spare grooves K are second grooves K2.

[0074] Please see Figure 1In the first row, the second light-emitting device 1 has three common grooves K, each containing red, green, and blue color transfer materials. If the color transfer material in the lower left groove K of these three common grooves K cannot emit light during the screen test, while the color transfer materials in the other two common grooves K can emit light, it indicates that the structure of the area where the lower left groove K of the corresponding light-emitting device 1 is located has failed. The two common grooves K where the color transfer material can emit light are both the first grooves K1, and the one common groove K where the color transfer material cannot emit light is the third groove K3. The area where the third groove K3 is located is the non-display area of ​​the corresponding light-emitting device 1. The spare groove K needs to be set with the same color transfer material as the third groove K3. At this time, the spare groove K is the first groove K1, and the area where the three first grooves K1 are located is the display area of ​​the corresponding light-emitting device 1.

[0075] Please see Figure 1 In the first row, the third light-emitting device 1 has three common grooves K, each containing red, green, and blue color transfer materials. If the color transfer material in the upper right groove K fails to emit light during screen testing, while the color transfer materials in the other two common grooves K do emit light, it indicates that the structure of the area where the lower left groove K of the corresponding light-emitting device 1 is located has failed. The two common grooves K where the color transfer material emits light are both the first groove K1, and the one common groove K where the color transfer material does not emit light is the third groove K3. The area where the third groove K3 is located is the non-display area of ​​the corresponding light-emitting device 1. The spare groove K needs to be set with the same color transfer material as the third groove K3. At this time, the spare groove K is the first groove K1, and the area where the three first grooves K1 are located is the display area of ​​the corresponding light-emitting device 1.

[0076] Please see Figure 1 In the first row, the fourth light-emitting device 1, three common grooves K are respectively equipped with red, green, and blue color transfer materials. If the color transfer material in the upper left groove K of these three common grooves K cannot emit light during the screen test, while the color transfer materials in the other two common grooves K can emit light, it indicates that the structure of the area where the lower left groove K of the corresponding light-emitting device 1 is located has failed. The two common grooves K where the color transfer material can emit light are both the first grooves K1, and the one common groove K where the color transfer material cannot emit light is the third groove K3. The area where the third groove K3 is located is the non-display area of ​​the corresponding light-emitting device 1. The spare groove K needs to be equipped with the same color transfer material as the third groove K3. At this time, the spare groove K is the first groove K1, and the area where the three first grooves K1 are located is the display area of ​​the corresponding light-emitting device 1.

[0077] The light-emitting device 1 may also include two grooves K, one of which is a commonly used groove K and the other is a spare groove K; alternatively, the light-emitting device 1 may include three grooves K, two of which are commonly used grooves K and the remaining one is a spare groove K; or, the light-emitting device 1 may also include five grooves K, three of which are commonly used grooves K and two are spare grooves K. There is no specific limitation on the number of grooves K included in the light-emitting device 1, or which of these grooves K are commonly used grooves K and which are spare grooves K.

[0078] In some embodiments, the color transfer material can be a color resist or a quantum dot film, and there is no specific limitation.

[0079] In some embodiments, light-scattering particles are doped into the blue light-emitting color-transfer materials among various color-transfer materials. For example, the light-scattering particles can be titanium dioxide (TiO2). Doping the blue light-emitting color-transfer materials with high blue light emission efficiency with light-scattering particles can improve the blue light extraction efficiency.

[0080] In the embodiments provided by the present invention, multiple light-emitting devices 1 are arranged in the light-emitting device 1 of the display panel, and the light-emitting surface of the light-emitting device 1 has multiple grooves K. The multiple grooves K include multiple first grooves K1, and the multiple grooves K also include at least one second groove K2 and / or at least one third groove K3. The first grooves K1 are located in the light-emitting area A of the light-emitting device 1, and the second grooves K2 and the third grooves K3 are located in the non-light-emitting area B of the light-emitting device 1. In the same light-emitting device 1, different first grooves K1 are provided with color transfer materials that emit different colors of light, the second grooves K2 are not provided with color transfer materials, and the third grooves K3 are provided with color transfer materials of the same material as the first grooves K1. When a structural failure is found in any area of ​​the light-emitting device 1 where a groove K is located during screen testing, color transfer materials are provided in the grooves K where no color resist material is provided, thereby quickly and conveniently repairing the light-emitting device 1, thereby improving product yield, reducing repair costs, and improving repair efficiency.

[0081] Please see Figure 2 This is a schematic diagram of the structure of a light-emitting device provided in an embodiment of the present invention. Figure 2 for Figure 1 Cross-sectional view along the AA' direction. Light-emitting device 1 includes:

[0082] Electrode layer 11 includes multiple electrodes P, one of which is a common electrode P1, and the rest are pixel sub-electrodes P2.

[0083] The light-emitting structure 12 is located on one side of the electrode layer 11; the side of the light-emitting structure 12 away from the electrode layer 11 has a plurality of grooves K; wherein, the plurality of grooves K correspond one-to-one with the pixel sub-electrodes P2 in the plurality of electrodes P, and the orthogonal projection of the grooves K on the electrode layer 11 covers the corresponding pixel sub-electrodes P2.

[0084] The color transfer layer 13 is located on the side of the light-emitting structure 12 away from the electrode layer 11; the color transfer layer 13 includes a color transfer material disposed in the groove K. The thickness h of the color transfer layer 13 ranges from 2 μm to 3.5 μm.

[0085] Please refer to Figure 1 and Figure 2 If the light-emitting device 1 includes four recesses K, then the electrode layer 11 includes four pixel sub-electrodes P2 corresponding one-to-one with the four recesses K, and a common electrode P1; the four recesses K are located on the side of the light-emitting structure 12 away from the electrode layer 11, and the color transfer material in the color transfer layer 13 is disposed in at least some of the recesses K. When manufacturing the light-emitting device 1, the recesses K used as spare recesses K are not disposed of with color transfer material, while the other recesses K are disposed of with different color transfer materials.

[0086] By setting multiple grooves K on the side of the light-emitting structure 12 away from the electrode layer 11, and setting the color transfer material of the color transfer layer 13 in the grooves K, it is convenient to set the electrode P on the side of the light-emitting structure 12 away from the light-emitting surface, thereby making it easier to bind the electrode P, preventing the electrode P from affecting the light emission of the light-emitting structure 12, and improving the light emission of the light-emitting structure 12.

[0087] Please see Figure 3 This is a schematic diagram of another light-emitting device provided in an embodiment of the present invention. The light-emitting structure 12 in the light-emitting device 1 includes:

[0088] The first type semiconductor layer 121 is located on the side of the electrode layer 11 near the color transfer layer 13; the first type semiconductor layer 121 includes a plurality of first type semiconductor structures 1211 located on the same plane; the plurality of first type semiconductor structures 1211 correspond one-to-one with a plurality of grooves K, and the plurality of first type semiconductor structures 1211 are spaced apart from each other; the pixel sub-electrode P2 is in contact with the first type semiconductor structure 1211 corresponding to the same groove K;

[0089] The light-emitting layer 122 is located on the side of the first type semiconductor layer 121 away from the electrode layer 11; the light-emitting layer 122 includes a plurality of sub-pixel light-emitting layers 1221, and the plurality of sub-pixel light-emitting layers 1221 correspond one-to-one with and overlap with a plurality of first type semiconductor structures 1211;

[0090] The second type semiconductor layer 123 is located on the side of the light-emitting layer 122 away from the electrode layer 11 and covers the first type semiconductor layer 121 and the light-emitting layer 122. The common electrode P1 is in contact with the second type semiconductor layer 123 and does not overlap with the first type semiconductor layer 121 and the light-emitting layer 122. A plurality of grooves K are disposed on the first surface 123a (i.e. the light-emitting surface of the light-emitting device 1) of the second type semiconductor layer 123 away from the electrode layer 11. The orthographic projection of the first type semiconductor structure 1211 on the second type semiconductor layer 123 covers the orthographic projection of the corresponding groove K on the second type semiconductor layer 123.

[0091] The first type of semiconductor layer 121 can be an N-type gallium nitride layer, the second type of semiconductor layer 123 can be a P-type gallium nitride layer, and the light-emitting layer 122 can be a multilayer quantum well layer. Multiple sub-pixel light-emitting layers 1221 emit white light, which facilitates changing the color of the light emitted from different grooves K through the color conversion layer 13.

[0092] In the embodiments provided by the present invention, a first type semiconductor layer 121, a light-emitting layer 122, and a second type semiconductor layer 123 are sequentially stacked between the electrode layer 11 and the color conversion layer 13. The first type semiconductor layer 121 includes a plurality of first type semiconductor structures 1211 disposed with gaps between each other, and a plurality of sub-pixel light-emitting layers 1221 in the light-emitting layer 122 correspond one-to-one with and overlap with the plurality of first type semiconductor structures 1211. This allows the plurality of first type semiconductor structures 1211 and the plurality of sub-pixel light-emitting layers 1221 to share a single second type semiconductor structure, which is beneficial for miniaturization of the light-emitting device 1 and facilitates improvement of the resolution of the display panel.

[0093] Please see Figure 4 The bottom view of a light-emitting device provided in an embodiment of the present invention shows that the orthographic projection shape of the first type semiconductor structure 1211 in the light-emitting device 1 on the second surface 123b near the electrode layer 11 of the second type semiconductor layer 123 is the same as the orthographic projection shape of the groove K on the second surface 123b.

[0094] By setting the orthographic projection shape of the first type semiconductor structure 1211 on the second surface 123b to be the same as the orthographic projection shape of the groove K on both surfaces, it is convenient for the light emitted by the sub-pixel light-emitting layer 1221 that overlaps with the first type semiconductor structure 1211 to exit from the second groove and be converted into light of the desired color by the color conversion material provided in the second groove, thereby improving the light conversion efficiency and utilization rate.

[0095] Please see Figure 5 Provided for embodiments of the present invention Figure 4According to the top view of the corresponding light-emitting device, the orthographic projection shape of the multiple grooves K on the first surface 123a is a concentric annular fan shape that does not overlap; correspondingly, the multiple first-type semiconductor structures 1211 (such as...) corresponding to the multiple grooves K are... Figure 4 As shown, the orthographic projection of the second surface 123b of the second type semiconductor layer 123 is also a concentric annular sector that does not overlap.

[0096] In some embodiments, the diameter d of the light-emitting device 1 using the above structure is less than 100 μm.

[0097] In the embodiments provided by the present invention, by making the orthographic projection shape of the plurality of grooves K on the first surface 123a a concentric ring-shaped fan shape that does not overlap, the color transfer material disposed in the plurality of grooves K can also be in a concentric ring-shaped fan shape that does not overlap on the orthographic projection of the first surface 123a, thereby improving the sub-pixel density in the light-emitting device 1 while improving the color mixing uniformity.

[0098] Please see Figure 6 A top view of another light-emitting device provided in an embodiment of the present invention, and Figure 7 The embodiments of the present invention provide and Figure 6 In the bottom view corresponding to the light-emitting device, the orthographic projection shape of the plurality of grooves K on the first surface 123a is a concentric ring that does not overlap. Correspondingly, the orthographic projection shape of the plurality of first-type semiconductor structures 1211 corresponding to the plurality of grooves K on the second surface 123b is also a concentric ring that does not overlap.

[0099] By setting multiple grooves K as concentric rings that do not overlap, the color transfer materials set in the multiple grooves K also form concentric rings that do not overlap, making the light emission of the light-emitting device 1 more symmetrical. This can solve the color shift problem under different viewing angles in yellow-green-blue and white light images, and improve the color display saturation and color mixing effect.

[0100] Please see Figure 8 This is a top view of another light-emitting device provided in an embodiment of the present invention. The orthographic projection shape of the groove K on the first surface 123a is a first quadrilateral.

[0101] Multiple grooves K are arranged in a second quadrilateral around a common center, with the center being the center of the second quadrilateral. The area of ​​the second quadrilateral is N times greater than the area of ​​the first quadrilateral, where N is the total number of grooves K. Correspondingly, the orthographic projection shape of the first type semiconductor structure 1211 on the first surface 123a is also a first quadrilateral, as shown below. Figure 9 The image shown is a bottom view of another light-emitting device provided in an embodiment of the present invention.

[0102] The first quadrilateral and the second quadrilateral have the same shape. For example, the first quadrilateral and the second quadrilateral can both be rhombuses, or they can be rectangles, squares, etc. There are no specific restrictions.

[0103] like Figure 8 The light-emitting device 1 has four grooves K. The outer edge shape of the second type semiconductor layer 123 in the light-emitting device 1 can be regarded as a second quadrilateral. Of course, the outer edge shape of the four grooves K as a whole can also be regarded as a second quadrilateral. No restriction is made here.

[0104] By setting the groove K as a quadrilateral in the orthographic projection of the first surface 123a, the manufacturing difficulty and the arrangement difficulty of the light-emitting device 1 on the display panel are reduced, thereby improving production efficiency.

[0105] Please see Figure 10 This is a top view of another light-emitting device provided in an embodiment of the present invention. The orthographic projection shape of the groove K on the first surface 123a can also be other shapes, such as a regular hexagon. Correspondingly, the orthographic projection shape of the first type semiconductor structure 1211 on the first surface 123a is also a first quadrilateral, such as... Figure 11 The image shown is a bottom view of another light-emitting device provided in an embodiment of the present invention. In the embodiments provided by the present invention, the specific shape of the groove K can be set as needed and is not limited here.

[0106] Please see Figure 12 This is a top view of another light-emitting device provided in an embodiment of the present invention. The light-emitting structure 12 further includes:

[0107] The photoresist layer 124 includes a plurality of photoresist structures 1241, which are located between two adjacent grooves K. The photoresist structures are composed of at least a portion of the first type semiconductor layer 121 located between two adjacent grooves K and doped with ions.

[0108] Please see Figure 13 A cross-sectional view of another light-emitting device provided in an embodiment of the present invention. The light-emitting device 1 further includes:

[0109] The encapsulation layer 14 is located on the side of the color transfer layer 13 away from the electrode layer 11.

[0110] The encapsulation layer 14 can be made of optical adhesive, and the encapsulation layer 14 covers the groove K on which the color transfer material is provided.

[0111] By providing an encapsulation layer 14 on the side of the color transfer layer 13 away from the electrode layer 11, the color transfer material can be protected from moisture intrusion.

[0112] Please see Figure 14 This is a schematic diagram of another display panel provided in an embodiment of the present invention, the display panel further comprising:

[0113] Backplate 2 is located on the side of the light-emitting device 1 away from the light-emitting surface; the side of backplate 2 closest to the light-emitting device 1 has multiple sets of bonding pads 21, each set of bonding pads 21 corresponding to multiple light-emitting devices 1, each set of bonding pads 21 including multiple bonding pads 21, and the multiple bonding pads 21 are arranged opposite to multiple electrodes P; for example Figure 15 The diagram shown is a three-dimensional schematic of a set of bonding pads in a backplane according to an embodiment of the present invention. This set of bonding pads is related to... Figure 4 The electrodes of the light-emitting device correspond to each other.

[0114] Multiple electroplated structures 3 are connected between the electrode P of the light-emitting device 1 and the corresponding bonding pad 21.

[0115] The backplane 2 can be a silicon-based backplane 2 or an array substrate; there are no specific restrictions.

[0116] The bonding pads 21 on the backplate 2 are made of the same material as the corresponding bonded electrodes P, and the orthographic projections of the bonding pads 21 and the corresponding bonded electrodes P on the backplate 2 at least partially intersect.

[0117] The material used to bond the pad 21 to the electrode P can be copper, nickel, or other metals, and there are no restrictions on this.

[0118] Please see Figure 16 This is a schematic diagram of the display panel structure in related technologies. In the fabrication of Micro-LEDs in related technologies, there is often an inconsistency in the thickness of the Micro-LED or the electrode P, which leads to connection failures or reliability issues caused by poor soldering inside the metal solder when bonding with the bonding pads 21 on the backplate 2.

[0119] In the embodiments provided by the present invention, by setting an electroplating structure 3 between the bonding pad 21 and the electrode P, the electroplating structure 3 can be grown on the bonding pad 21 and the electrode P by electroplating to connect the bonding pad 21 and the electrode P, thereby improving the problem of poor connection between the bonding pad 21 and the electrode P in the related art.

[0120] Based on the same inventive concept, this invention provides a method for manufacturing a display panel. The structure of the display panel manufactured by this method can be referred to the aforementioned description of the display panel, and will not be repeated here. Please refer to [link to relevant documentation]. Figure 17 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention. The method includes:

[0121] S11: The back plate 2 and multiple light-emitting devices 1 are aligned, and the back plate 2 and the multiple light-emitting devices 1 are spaced apart; wherein, one side of the back plate 2 has multiple sets of bonding pads 21, and the light-emitting surface of the light-emitting device 1 has multiple grooves K, the multiple grooves K include multiple first grooves, and the multiple grooves K also include at least one second groove.

[0122] like Figure 17 As shown, multiple light-emitting devices 1 are typically disposed on a temporary substrate. The multiple light-emitting devices 1 can be transferred to the temporary substrate using adhesion difference or laser transfer technology. A transfer device can be used to align the multiple light-emitting devices 1 disposed on the first temporary substrate 10 with the back plate 2, but there is a gap between the electrode P of the light-emitting device 1 and the bonding pad 21 on the back plate 2 (i.e., non-adhesive state).

[0123] S12: The aligned backplate 2 and multiple light-emitting devices 1 are placed in the electroplating solution tank 100 for electroplating, so that the bonding pad 21 and the corresponding electrode P form an electroplating structure 3.

[0124] The electroplating process (taking nickel plating as an example) includes:

[0125] Pretreatment: Thoroughly clean the surfaces to be plated (i.e., the surface of electrode P and the surface of bonding pad 21) to remove dirt, oil, or other contaminants. Different chemicals can be used for cleaning. Catalysis: Remove any oxide layer by catalyzing the surface to be plated in an acidic solution.

[0126] Pretreatment: Depending on the substrate material, pretreatment may be required to improve the adhesion and corrosion resistance of the nickel plating layer, including applying zincate or palladium catalysts to the surface to be nickel plated.

[0127] Electroless nickel plating: The module (backplate 2 and multiple light-emitting devices 1) to be nickel-plated is immersed in a solution containing nickel ions, reducing agents and other required chemicals. Through the action of the reducing agent, nickel ions are converted into nickel and deposited on the surface of metal Cu.

[0128] Post-treatment: After electroless nickel plating, the metal is rinsed, dried, and subjected to other post-treatments to improve adhesion, corrosion resistance, and other properties, according to industry requirements.

[0129] The electroless nickel plating process can be summarized as follows: organic solvent degreasing → chemical degreasing → hot water rinsing → electrochemical degreasing → hot water rinsing → cold water rinsing → a series of acid pickling and cold water rinsing processes → flash nickel plating → electroless nickel plating → chemical gold protection.

[0130] After forming the electroplating structure 3, the first temporary substrate 10 can be removed to obtain the display panel through the above electroplating process.

[0131] S13: Detect whether light can be emitted from the area where each groove K containing the color-converting material is located in the light-emitting device 1;

[0132] S14: If any area where a groove K containing a color-transfer material is located cannot emit light, then a color-transfer material is placed in the second groove, and the groove K corresponding to which a color-transfer material is placed but cannot emit light is designated as the third groove. The color-transfer material placed in the second groove is the same as that placed in the third groove, and the second groove containing the color-transfer material is designated as the first groove. In the same light-emitting device 1, different first grooves contain color-transfer materials that emit different colors of light. If all areas where a groove K containing a color-transfer material is located can emit light, then the second groove remains un-contained. The first groove is located in the light-emitting area A of the light-emitting device 1, and the second and third grooves are located in the non-light-emitting area B of the light-emitting device 1.

[0133] Please see Figure 18 This is a schematic diagram of forming a light-emitting device according to an embodiment of the present invention.

[0134] S21: Provide a substrate 00;

[0135] The substrate 00 is made of materials including, but not limited to, sapphire, silicon (Si) and silicon carbide (SiC).

[0136] S22: A second type semiconductor layer 123, a light-emitting layer 122, and a first type semiconductor layer 121 are sequentially formed on one side of the substrate 00;

[0137] S23: Pattern the light-emitting layer 122 and the first type semiconductor layer 121 to obtain multiple sub-pixel light-emitting layers 1221 and multiple first type semiconductor structures 1211;

[0138] S24: An electrode layer 11 is formed on the side of the first type semiconductor structure 1211 away from the second type semiconductor layer 123, and the electrode layer 11 is patterned to obtain a sub-pixel electrode P connected to the first type semiconductor structure 1211 and a common electrode P1 connected to the second type semiconductor layer 123; as shown Figure 19 The image shown is a three-dimensional schematic diagram of a light-emitting structure provided in an embodiment of the present invention.

[0139] After forming the electrode layer 11, particles can be doped into the region of the second type semiconductor structure covered by the gap between two adjacent first type semiconductor structures 1211 to form a light-blocking structure, such as... Figure 20 The diagram shown is a three-dimensional schematic of another light-emitting structure provided in an embodiment of the present invention. Before ion doping, conventional processes such as cleaning, indium tin oxide (ITO) coating, Mesa etching, and ITO annealing can be performed on the light-emitting structure 12.

[0140] Ion doping techniques include:

[0141] The first method involves doping with ions possessing specific electrical properties (such as donor or acceptor impurities). This allows for the modification of the conductivity and resistivity of the second-type semiconductor layer 123. In some cases, this change in electrical properties can indirectly affect optical crosstalk. For example, reducing the resistivity of the second-type semiconductor layer 123 through doping can decrease current distribution unevenness and optical crosstalk caused by resistance non-uniformity.

[0142] Common donor impurities include phosphorus (P) and arsenic (As), which can provide additional electrons; while acceptor impurities such as boron (B) and aluminum (Al) can accept electrons to form holes.

[0143] The second type is recombination center ions: After being doped into the second type semiconductor layer 123, certain ions can act as effective recombination centers, promoting carrier recombination and the light emission process. Although these ions themselves may not directly solve the optical crosstalk problem, they can indirectly improve the display effect by increasing the luminous efficiency and internal quantum efficiency of the light-emitting device 1, thereby mitigating the impact of optical crosstalk to a certain extent.

[0144] The dopant ions need to have good compatibility with the second type of semiconductor layer 123 to avoid introducing excessive defects or damage during the doping process. Furthermore, when selecting dopant ions, their impact on the luminous efficiency, spectral characteristics, electrical performance, and optical crosstalk reduction effect of the light-emitting device 1 must be comprehensively considered to achieve optimal overall performance. During the doping process, parameters such as the concentration, distribution, and depth of the dopant ions need to be precisely controlled to ensure the consistency and stability of the doping effect.

[0145] S25: Transfer multiple light-emitting structures 12 onto the second temporary substrate 10', make the electrode layer 11 contact the second temporary substrate 10', and remove the substrate 00.

[0146] Specifically, the light-emitting device 1 can be bonded to a second temporary substrate 10' coated with polydimethylsiloxane (PDMS) adhesive, and the substrate 00 can be peeled off.

[0147] S26: Etching is performed on the side of the second type semiconductor away from the electrode layer 11 to form multiple grooves K. For example... Figure 21 The image shown is a three-dimensional schematic diagram of the groove in a light-emitting structure provided in an embodiment of the present invention.

[0148] S27: Print color transfer material in part of the groove K to form color transfer layer 13 (e.g., ...). Figure 22 The diagram shown is a three-dimensional schematic diagram of a color transfer layer formed according to an embodiment of the present invention, and a protective layer is formed on the surface of the groove K on which the color transfer material is provided.

[0149] S28: Transfer the plurality of light-emitting devices 1 to the first temporary substrate 10 and remove the first temporary substrate 10. Then steps S11 to S14 can be performed.

[0150] The above embodiment only shows the case where the orthographic projection of the groove K on the second type semiconductor layer 123 is an annular gate shape. When the groove K is of other shapes, the manufacturing method is similar to that described above, and will not be repeated here.

[0151] Based on the same inventive concept, embodiments of the present invention provide a display device, which includes a display panel as described above.

[0152] This display device can be an electroluminescent display, electroluminescent screen, electroluminescent television, or other display devices, as well as mobile devices such as mobile phones, tablets, laptops, personal digital assistants (PDAs), and in-vehicle computers. The display device includes a frame, a display panel housed within the frame, a circuit board, a display driver IC, and other electronic components.

[0153] The display panel can be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, a micro light-emitting diode (Micro LED) display panel, etc., and this invention does not specifically limit it.

[0154] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0155] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A display panel, characterized in that, include: A plurality of light-emitting devices are provided, wherein the light-emitting surface of the light-emitting devices has a plurality of grooves, the plurality of grooves including a plurality of first grooves, and the plurality of grooves further including at least one second groove and / or at least one third groove; the first grooves are located in the light-emitting area of ​​the light-emitting devices, and the second grooves and the third grooves are located in the non-light-emitting area of ​​the light-emitting devices; In the same light-emitting device, different first grooves are provided with color-transfer materials that emit different colors of light, the second groove is not provided with color-transfer materials, and the third groove is provided with color-transfer materials of the same material as the first groove.

2. The display panel as described in claim 1, characterized in that, The light-emitting device includes: An electrode layer comprising multiple electrodes, one of which is a common electrode and the rest are pixel sub-electrodes; A light-emitting structure is located on one side of the electrode layer; the side of the light-emitting structure away from the electrode layer has the plurality of grooves; wherein, the plurality of grooves correspond one-to-one with the pixel sub-electrodes among the plurality of electrodes, and the orthogonal projection of the grooves on the electrode layer covers the corresponding pixel sub-electrodes; A color transfer layer is located on the side of the light-emitting structure away from the electrode layer; the color transfer layer includes a color transfer material disposed in the groove.

3. The display panel as described in claim 2, characterized in that, The light-emitting structure includes: A first type of semiconductor layer is located on the side of the electrode layer near the color transfer layer; the first type of semiconductor layer includes a plurality of first type semiconductor structures located on the same plane; the plurality of first type semiconductor structures correspond one-to-one with the plurality of grooves, and the plurality of first type semiconductor structures are spaced apart from each other; the pixel sub-electrode is in contact with the first type semiconductor structure corresponding to the same groove; A light-emitting layer is located on the side of the first type of semiconductor layer away from the electrode layer; the light-emitting layer includes a plurality of sub-pixel light-emitting layers, which correspond one-to-one with and overlap with the plurality of first type semiconductor structures; The second type of semiconductor layer is located on the side of the light-emitting layer away from the electrode layer and covers the first type of semiconductor layer and the light-emitting layer. The common electrode is in contact with the second type of semiconductor layer and does not overlap with the first type of semiconductor layer and the light-emitting layer. The plurality of grooves are disposed on the first side of the second type of semiconductor layer away from the electrode layer. The orthographic projection of the first type of semiconductor structure on the second type of semiconductor layer covers the orthographic projection of the corresponding groove on the second type of semiconductor layer.

4. The display panel as described in claim 3, characterized in that, The orthographic projection shape of the first type of semiconductor structure on the second surface of the second type of semiconductor layer near the electrode layer is the same as the orthographic projection shape of the groove on the second surface.

5. The display panel as described in claim 4, characterized in that, The orthographic projection of the plurality of grooves onto the first surface is a concentric annular fan shape that does not overlap.

6. The display panel as described in claim 4, characterized in that, The orthographic projection of the plurality of grooves onto the first surface is a concentric ring that does not overlap.

7. The display panel as described in claim 4, characterized in that, The orthographic projection of the groove onto the first surface is a first quadrilateral. The plurality of grooves are arranged in a second quadrilateral around the same center, the center being the center of the second quadrilateral, and the area of ​​the second quadrilateral is N times greater than the area of ​​the first quadrilateral, where N is the total number of the plurality of grooves.

8. The display panel as described in any one of claims 2-7, characterized in that, The light-emitting structure further includes: A photoresist layer comprising a plurality of photoresist structures located between two adjacent grooves, wherein the photoresist structure is composed of at least a portion of a first-type semiconductor layer doped with ions located between the two adjacent grooves.

9. The display panel as described in any one of claims 1-7, characterized in that, Among the various color-transfer materials, the one that emits blue light is doped with light-scattering particles.

10. The display panel as described in any one of claims 2-7, characterized in that, The display panel also includes: A backplate is located on the side of the light-emitting device away from the light-emitting surface; the side of the backplate close to the light-emitting device has multiple sets of bonding pads, each set of bonding pads corresponds to one of the multiple light-emitting devices, each set of bonding pads includes multiple bonding pads, and the multiple bonding pads are arranged opposite to one of the multiple electrodes. Multiple electroplated structures are connected between the electrodes of the light-emitting device and the corresponding bonding pads.

11. A method for manufacturing a display panel, characterized in that, include: The backplate and multiple light-emitting devices are aligned, with a gap between the backplate and the multiple light-emitting devices; wherein, one side of the backplate has multiple sets of bonding pads, and the light-emitting surface of the light-emitting device has multiple grooves, the multiple grooves including multiple first grooves, and the multiple grooves also including at least one second groove; The aligned backplate and the plurality of light-emitting devices are placed in an electroplating solution bath for electroplating, so that an electroplating structure is formed between the bonding pads and the corresponding electrodes. Detect whether light can be emitted from each area of ​​the groove containing the color-converting material in the light-emitting device; If any area containing a color-transfer material cannot emit light, then a color-transfer material is placed in the second groove. The groove containing the color-transfer material but unable to emit light is designated as the third groove. The color-transfer material in the second groove is the same as that in the third groove. The second groove containing the color-transfer material is designated as the first groove. In the same light-emitting device, different first grooves contain color-transfer materials that emit different colors of light. If all areas containing the color-transfer material can emit light, then the second groove remains unfilled with color-transfer material. The first groove is located in the light-emitting area of ​​the light-emitting device, and the second and third grooves are located in the non-light-emitting area of ​​the light-emitting device.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-10.

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