Display panel, manufacturing method and display device

Abstract

The invention is suitable for the technical field of display, and provides a display panel, a manufacturing method and a display device.The display panel comprises a substrate, an isolation structure, a plurality of light-emitting devices and a scattering layer; wherein the isolation structure is arranged on one side of the substrate, an isolation opening is defined by the isolation structure, the light-emitting device is arranged in the isolation opening, the scattering layer comprises a plurality of scattering structures, the scattering structures are arranged in the isolation opening and located on the side, away from the substrate, of the light-emitting device, and each scattering structure comprises a base layer and scattering particles doped in the base layer. The scattering particles of the scattering structure can carry out multi-angle scattering on the light entering the base layer, the large-angle light emitting rate of the light emitting device is increased, the light extraction rate and the visual angle of the display panel are improved, and the problem of large-visual-angle color cast is avoided.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a manufacturing method, and a display device. Background Technology

[0002] Compared to LCD technology, OLED (Organic Light-Emitting Diode) display technology offers numerous advantages, including higher contrast, wider color gamut, lower power consumption, thinner and lighter structure, and flexibility. Currently, OLED display technology is widely used in mobile phones, computers, televisions, and other fields.

[0003] The display performance of OLED technology still needs improvement. Summary of the Invention

[0004] The purpose of this application is to provide a display panel that offers a solution for large-view character bias.

[0005] The embodiments of this application are implemented as follows: a display panel includes: a substrate;

[0006] An isolation structure is provided on one side of the substrate, and the isolation structure defines a plurality of isolation openings;

[0007] Multiple light-emitting devices are disposed within the corresponding isolation openings; and

[0008] The scattering layer includes multiple scattering structures disposed within the corresponding isolation opening and located on the side of the corresponding light-emitting device away from the substrate. Each scattering structure includes a base layer and scattering particles doped within the base layer.

[0009] In one embodiment, the light transmittance of the substrate is greater than or equal to 90%;

[0010] Preferably, the light transmittance of the substrate is greater than or equal to 95%.

[0011] In one embodiment, the isolation structure includes an isolation portion disposed on one side of the substrate and a blocking portion disposed on the side of the isolation portion away from the substrate, wherein the orthographic projection of the isolation portion on the substrate is located within the orthographic projection of the blocking portion on the substrate.

[0012] The scattering structure includes a light-emitting surface facing away from the substrate, and the distance between the light-emitting surface and the surface of the blocking portion facing the substrate is greater than or equal to 0.

[0013] Preferably, the distance between the light-emitting surface and the surface of the blocking portion facing the substrate is greater than 0.

[0014] In one embodiment, the display panel further includes a light extraction layer, the light extraction layer comprising a plurality of light extraction structures located between a corresponding light-emitting device and a corresponding scattering structure; the refractive index of the light extraction layer is greater than or equal to 1.8;

[0015] Preferably, the refractive index of the light extraction layer is greater than or equal to 2.0.

[0016] In one embodiment, the display panel further includes a lens layer disposed between the light extraction layer and the scattering layer. The lens layer includes a plurality of microlenses, which are disposed within the isolation opening and between the corresponding light extraction structure and the scattering structure. Each microlens has an arcuate convex surface protruding away from the substrate, and the scattering layer is disposed on the arcuate convex surface. The thickness of the scattering layer gradually decreases in the direction away from the isolation structure.

[0017] Preferably, the difference between the refractive index of the microlens material and the refractive index of the substrate is less than or equal to 0.2;

[0018] Preferably, the difference between the refractive index of the microlens material and the refractive index of the substrate is less than or equal to 0.1.

[0019] In one embodiment, the microlens is an inorganic insulating material lens;

[0020] Preferably, the refractive index of the microlens material is less than or equal to 1.8;

[0021] Alternatively, the microlens may be a photoresist material lens;

[0022] Preferably, the microlens is made of a material with a refractive index of 1.5 to 1.9;

[0023] Preferably, the microlens is made of a material with a refractive index of 1.5 to 1.8;

[0024] Preferably, the refractive index of the microlens material is 1.5 to 1.7.

[0025] In one embodiment, the display panel further includes a first encapsulation layer disposed on the side of the scattering layer near the substrate; the first encapsulation layer is an inorganic material encapsulation layer.

[0026] Preferably, the refractive index of the first encapsulation layer is 1.7 to 2.0;

[0027] Preferably, the refractive index of the base layer is greater than or equal to the refractive index of the first encapsulation layer;

[0028] Alternatively, the refractive index of the substrate is less than that of the first encapsulation layer, and the difference between the refractive indices of the substrate and the first encapsulation layer is less than or equal to 0.2.

[0029] Preferably, the refractive index of the base layer is less than that of the first encapsulation layer, and the difference between the refractive indices of the base layer and the first encapsulation layer is less than or equal to 0.1.

[0030] In one embodiment, the display panel further includes a first encapsulation layer disposed on the side of the scattering layer opposite to the substrate;

[0031] Preferably, the refractive index of the first encapsulation layer is 1.7 to 2.0;

[0032] Preferably, the refractive index of the base layer is 1.4 to 1.8;

[0033] Preferably, the refractive index of the base layer is less than or equal to the refractive index of the first encapsulation layer.

[0034] In one embodiment, the scattering particles include one or more of titanium dioxide particles, zirconium dioxide particles, silicon dioxide particles, silicon oxide particles, and titanium dioxide particles;

[0035] Preferably, in the scattering structure, the doping mass percentage of the scattering particles is 10% to 60%;

[0036] Preferably, in the scattering structure, the doping mass percentage of the scattering particles is 20% to 40%;

[0037] Preferably, the light-emitting device includes a red light-emitting device, a green light-emitting device, and a blue light-emitting device; in the scattering structure corresponding to the red light-emitting device, the size of the scattering particles is 160 nm to 180 nm; in the scattering structure corresponding to the green light-emitting device, the size of the scattering particles is 130 nm to 150 nm; and in the scattering structure corresponding to the blue light-emitting device, the size of the scattering particles is 110 nm to 130 nm.

[0038] In one embodiment, the material of the base layer includes organic materials;

[0039] Preferably, the base layer is made of resin.

[0040] Another objective of this application is to provide a method for manufacturing a display panel, comprising:

[0041] Provide substrate;

[0042] An isolation structure is formed on one side of the substrate, the isolation structure defining a plurality of isolation openings;

[0043] A light-emitting device is fabricated within the isolation opening, and a scattering layer is fabricated on the side of the light-emitting device facing away from the substrate; the scattering layer includes a plurality of scattering structures, each scattering structure being located within a corresponding isolation opening and on the side of the corresponding light-emitting device facing away from the substrate, and the isolation structure including a base layer and scattering particles doped within the base layer.

[0044] In one embodiment, before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a light extraction layer on the side of the light-emitting device away from the substrate, wherein the light extraction layer includes a plurality of light extraction structures, the light extraction structures being located within the corresponding isolation opening and on the corresponding side of the light-emitting device away from the substrate;

[0045] Preferably, before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, and after the step of forming a light extraction layer on the side of the light-emitting device away from the substrate, the step further includes forming a lens layer on the side of the light extraction layer away from the substrate; wherein the lens layer includes a plurality of microlenses, the microlenses being located within the corresponding isolation opening and on the side of the corresponding light extraction structure away from the substrate.

[0046] In one embodiment, the method further includes: forming a first encapsulation layer on the side of the scattering layer opposite to the substrate;

[0047] Preferably, the steps of forming a light extraction layer on the side of the light-emitting device facing away from the substrate, forming a scattering layer on the side of the light-emitting device facing away from the substrate, forming a lens layer on the side of the light extraction layer facing away from the substrate, and forming a first encapsulation layer on the side of the scattering layer facing away from the substrate include:

[0048] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings;

[0049] A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate;

[0050] A photoresist material is coated on the side of the light extraction material layer facing away from the substrate within the isolation opening, and the photoresist material is then cured.

[0051] A base material doped with scattering particles is coated on the side of the photoresist material facing away from the substrate within the isolation opening, and the base material is then cured.

[0052] A first encapsulation material layer is deposited on the side of the base material opposite to the substrate;

[0053] The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially through a photomask process to obtain a light-emitting functional layer, a second electrode, a light extraction layer, a microlens, a scattering layer, and the first encapsulation layer that are sequentially stacked on the side of the light-emitting device away from the substrate.

[0054] In one embodiment, the steps of fabricating a light extraction layer on the side of the light-emitting device facing away from the substrate, fabricating a scattering layer on the side of the light-emitting device facing away from the substrate, and fabricating a lens layer on the side of the light extraction layer facing away from the substrate include:

[0055] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings;

[0056] A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate;

[0057] A first encapsulation material layer is deposited on the side of the light extraction material layer away from the substrate, and the first encapsulation material layer is patterned by laser etching to obtain a plurality of microlenses located in the corresponding isolation openings and having arcuate convex surfaces protruding away from the substrate.

[0058] Using the microlens as a barrier, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned to obtain a light-emitting functional layer, the second electrode, the light extraction layer, and the microlens that are sequentially stacked on the side of the light-emitting device away from the substrate.

[0059] Preferably, the step of fabricating a scattering layer on the side of the light-emitting device facing away from the substrate includes:

[0060] A base material doped with scattering particles is coated inside the isolation opening and onto the microlens, and the base material is then cured to obtain multiple scattering structures.

[0061] In one embodiment, a first encapsulation layer is further formed on the side of the scattering layer opposite to the substrate;

[0062] Preferably, the steps of forming a scattering layer on the side of the light-emitting device away from the substrate and forming a first encapsulation layer on the side of the scattering layer away from the substrate include:

[0063] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings;

[0064] A base material doped with scattering particles is coated on the side of the second electrode material layer away from the substrate within the isolation opening, and the base material is then cured.

[0065] A first encapsulation material layer is deposited on the side of the base material and the isolation structure away from the substrate. The first encapsulation material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain a light-emitting functional layer, a second electrode, a scattering layer, and the first encapsulation layer that are sequentially stacked on the side of the light-emitting device away from the substrate.

[0066] In one embodiment, before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a light extraction layer on the side of the light-emitting device away from the substrate; wherein the light extraction layer includes a plurality of light extraction structures, the light extraction structures being located within the corresponding isolation openings and on the corresponding side of the light-emitting device away from the substrate;

[0067] Preferably, after the step of forming a light extraction layer on the side of the light-emitting device away from the substrate and before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a first encapsulation layer on the side of the light extraction layer away from the substrate.

[0068] Preferably, the steps of forming a light extraction layer on the side of the light-emitting device away from the substrate and forming a first encapsulation layer on the side of the light extraction layer away from the substrate include:

[0069] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings;

[0070] A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate;

[0071] A first encapsulation material layer is deposited on the side of the light extraction material layer facing away from the substrate;

[0072] The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain a light-emitting functional layer, a second electrode, a light extraction layer, and the first encapsulation layer that are sequentially stacked on one side of the substrate.

[0073] Preferably, the step of fabricating a scattering layer on the side of the light-emitting device facing away from the substrate includes:

[0074] A base material doped with scattering particles is coated inside the isolation opening and onto the first encapsulation layer, and the base material is then cured to obtain a plurality of the scattering structures.

[0075] Another object of the embodiments of this application is to provide a display device, characterized in that it includes a display panel as described in the above embodiments, or includes a display panel manufactured as described in the above embodiments.

[0076] The display panel, manufacturing method, and display device provided in this application have the following advantages:

[0077] The display panel provided in this application embodiment includes a scattering layer, which includes multiple scattering structures. The scattering structures are disposed in corresponding isolation openings and located on the side of the corresponding light-emitting device away from the substrate. The scattering structure includes a base layer and scattering particles doped in the base layer. The scattering particles of the scattering structure can randomly scatter the light entering the base layer, increase the large-angle light emission of the light-emitting device, improve the light extraction rate and viewing angle of the display panel, and avoid the problem of large viewing angle color deviation. Attached Figure Description

[0078] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0079] Figure 1 This is a schematic diagram of the light emission from an existing display panel;

[0080] Figure 2 This is a schematic diagram of the structure of the display panel provided in the first embodiment of this application;

[0081] Figure 3 This is a partial structural schematic diagram of the display panel provided in the first embodiment of this application;

[0082] Figure 4 This is a schematic diagram of the light emission of the display panel provided in the first embodiment of this application;

[0083] Figure 5 This is a schematic diagram of the scattering layer corresponding to the red device in the display panel provided in the first embodiment of this application;

[0084] Figure 6 This is a schematic diagram of the structure of the scattering layer corresponding to the green device in the display panel provided in the first embodiment of this application;

[0085] Figure 7 This is a schematic diagram of the scattering layer corresponding to the blue device in the display panel provided in the first embodiment of this application;

[0086] Figure 8 This is a schematic diagram of the structure of the display panel provided in the second embodiment of this application;

[0087] Figure 9 This is a schematic diagram of the cooperation relationship between the microlens and the scattering layer in the display panel provided in the second embodiment of this application;

[0088] Figure 10 This is a schematic diagram of the light emission of the display panel provided in the second embodiment of this application;

[0089] Figure 11 This is a schematic diagram of the structure of the display panel provided in the third embodiment of this application;

[0090] Figure 12 This is a schematic diagram of the structure of the display panel provided in the fourth embodiment of this application;

[0091] Figure 13 This is a flowchart of a method for manufacturing a display panel according to the fifth embodiment of this application;

[0092] Figure 14 This is a flowchart of a method for manufacturing a display panel according to the sixth embodiment of this application;

[0093] Figure 15 This is a flowchart of a method for manufacturing a display panel according to the seventh embodiment of this application;

[0094] Figure 16 This is a flowchart of a method for manufacturing a display panel according to the eighth embodiment of this application.

[0095] The markings in the diagram mean:

[0096] 00A - Sub-pixel, 00B - Separation structure;

[0097] 100 - Display panel;

[0098] 3-Substrate, 31-Driving circuit layer, 32-Pixel definition layer, 320-Pixel opening;

[0099] 4-Light-emitting device, 41-First electrode, 42-Light-emitting functional layer, 43-Second electrode, 4R-Red light-emitting device, 4G-Green light-emitting device, 4B-Blue light-emitting device;

[0100] 5-Optical extraction layer, 50-Optical extraction structure;

[0101] 6-Lens layer, 61-Microlens, 60-Curved convex surface;

[0102] 7-scattering layer, 70-scattering structure, 71-base layer, 72-scattering particles;

[0103] 8-Packaging structure layer, 81-First packaging layer, 82-Second packaging layer, 83-Third packaging layer;

[0104] 9-Isolation structure, 90-Isolation opening, 91-Isolation part, 92-Blocking part. Detailed Implementation

[0105] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0106] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly fixed to or set on that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the purpose of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this patent. The terms "first" and "second" are used only for the purpose of description and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly specified.

[0107] To illustrate the technical solutions described in this application, the following detailed description is provided in conjunction with specific drawings and embodiments.

[0108] Please see Figure 1 As shown, in the display panel, adjacent sub-pixels 00A are physically separated by a partition structure 00B. The light emitted by sub-pixels 00A diverges outward at a certain angle. However, due to the height of the partition structure 00B, the outward emission of light at large angles is somewhat restricted, resulting in a limited viewing angle for the display panel. Consequently, the brightness of sub-pixels 00A decreases significantly with increasing viewing angle, leading to the problem of color shift at large viewing angles.

[0109] Please see Figures 2 to 4 As shown, this application embodiment first provides a display panel 100 to solve the above-mentioned problem of large viewing angle distortion.

[0110] In the embodiments of this application, such as Figure 2 and Figure 3 As shown, the display panel 100 includes a substrate 3, an isolation structure 9, multiple light-emitting devices 4, and a scattering layer 7. The isolation structure 9 is disposed on one side of the substrate 3, is mesh-like, and defines multiple isolation openings 90. The light-emitting devices 4 are disposed within the isolation openings 90. The scattering layer 7 includes multiple scattering structures 70, which are disposed within the isolation openings 90 and located on the side of the light-emitting devices 4 facing away from the substrate 3. Please refer to [reference needed]. Figures 5 to 7 As shown, the scattering structure 70 includes a base layer 71 and scattering particles 72 doped within the base layer 71.

[0111] Here, the light-emitting device 4 is a top-emitting device, and the scattering structure 70 is located on the light-emitting side of the light-emitting device 4.

[0112] The scattering particles 72 within the scattering structure 70 can scatter light entering the substrate 71 from multiple angles, increasing the large-angle light emission rate of the light-emitting device 4, improving the light extraction rate and viewing angle of the display panel 100, and avoiding the problem of wide viewing angle distortion. Please refer to [reference needed]. Figure 4 As shown.

[0113] Please see Figure 2 and Figure 3 As shown, the substrate 3 includes a driving circuit layer 31 and a pixel definition layer 32 disposed on one side of the driving circuit layer 31. The pixel definition layer 32 is provided with pixel openings 320 at intervals. An isolation structure 9 is disposed on the side of the pixel definition layer 32 away from the driving circuit layer 31. The isolation opening 90 is connected to the pixel opening 320.

[0114] like Figure 3 As shown, the light-emitting device 4 includes a first electrode 41, a light-emitting functional layer 42, and a second electrode 43 stacked sequentially. The first electrode 41 is disposed on one side of the driving circuit layer 31, and a portion of the pixel definition layer 32 is disposed on the side of the first electrode 41 away from the driving circuit layer 31. A portion of the first electrode 41 is exposed within the pixel opening 320. The light-emitting functional layer 42 is disposed on the side of the first electrode 41 and the pixel definition layer 32 away from the driving circuit layer 31.

[0115] The first electrode 41 can be an anode, and the second electrode 43 can be a cathode.

[0116] The light-emitting device 4 includes multiple light-emitting devices of different colors, namely a first light-emitting device, a second light-emitting device, and a third light-emitting device, for example, Figure 2 As shown, multiple light-emitting devices of different colors include a red light-emitting device 4R, a green light-emitting device 4G, and a blue light-emitting device 4B. A pixel group is formed by at least one red light-emitting device 4R, at least one green light-emitting device 4G, and at least one blue light-emitting device 4B. The arrangement of the red light-emitting device 4R, green light-emitting device 4G, and blue light-emitting device 4B within the pixel group is not limited; for example, they can be arranged sequentially in one direction or in two directions.

[0117] Please see Figure 2 and Figure 3 As shown, in one embodiment, the isolation structure 9 includes an isolation portion 91 disposed on one side of the substrate 3 and a blocking portion 92 disposed on the side of the isolation portion 91 away from the substrate 3. The orthographic projection of the isolation portion 91 on the substrate 3 is completely within the orthographic projection of the blocking portion 92 on the substrate 3. That is, the edge of the blocking portion 92 is more prominent than the isolation portion 91.

[0118] The composition and preparation of the isolation structure 9 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN1179797. Further descriptions can be found in CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A, the contents of which are incorporated herein by reference.

[0119] Since the edge of the blocking portion 92 is more prominent than the isolation portion 91, the edge of the blocking portion 92, on the side facing the substrate 3, forms a blockage on the edge of the light-emitting device 4, which further reduces the light extraction rate and viewing angle of the light-emitting device 4.

[0120] In this embodiment, the edge of the scattering structure 70 is connected to the edge of the isolation part 91. In this way, the scattering particles 72 can scatter the light from the edge of the light-emitting device 4 at multiple angles, thereby changing the direction of the light and preventing it from being blocked by the edge of the blocking part 92.

[0121] The substrate 71 has high light transmittance to avoid affecting the light emission of the light-emitting device 4. In an optional embodiment, the light transmittance of the substrate 71 is greater than or equal to 90%.

[0122] Optionally, the light transmittance of the base layer 71 is greater than or equal to 95%.

[0123] Alternatively, the light transmittance of the base layer 71 is greater than or equal to 97%.

[0124] In some specific embodiments, the light transmittance of the base layer 71 can be 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 97%, 98%, 99%, etc.

[0125] Please see Figure 3As shown, in the orthogonal projection direction of the substrate 3, the scattering structure 70 has a light-emitting surface facing away from the substrate 3, and the distance H between the light-emitting surface of the scattering structure 70 and the side surface of the blocking portion 92 facing the substrate 3 is greater than or equal to 0. That is, in the orthogonal projection direction of the substrate 3, the light-emitting surface of the scattering structure 70 will not be higher than the side surface of the blocking portion 92 facing the substrate 3, and the scattering structure 70 is always kept on the side of the blocking portion 92 facing the substrate 3. The purpose of this arrangement is, on the one hand, to facilitate the fabrication of the scattering structure 70 and avoid interference from the blocking portion 92 in the fabrication of the scattering structure 70, and on the other hand, to avoid light crosstalk between adjacent light-emitting devices 4 of different colors while maintaining a large viewing angle.

[0126] In one alternative embodiment, the distance H between the light-emitting surface of the scattering structure 70 and the side surface of the blocking portion 92 facing the substrate 3 is greater than 0. This further facilitates the fabrication of the scattering structure 70.

[0127] The base layer 71 of the scattering structure 70 can be a transparent organic material layer.

[0128] The refractive index of the base layer 71 of the scattering structure 70 is 1.4 to 1.8.

[0129] Optionally, the refractive index of the base layer 71 of the scattering structure 70 is 1.5 to 1.7.

[0130] Specifically, the refractive index of the base layer 71 of the scattering structure 70 is 1.4, 1.5, 1.6, 1.7 or 1.8.

[0131] Please see Figure 2 and Figure 3 As shown, in one embodiment, the display panel 100 further includes a light extraction layer 5, which includes multiple light extraction structures 50 located between the corresponding second electrode 43 and the corresponding scattering structure 70. The refractive index of the light extraction layer 5 is greater than that of the second electrode 43 and also greater than that of each film layer in the light-emitting functional layer 42. The light extraction layer 5 is used to refract and extract the light emitted from the light-emitting functional layer 42 as completely as possible, avoiding internal reflection of the light between the light-emitting functional layer 42 and the cathode.

[0132] Based on the light extraction structure 50, the scattering structure 70 further scatters the extracted light at a large angle. In this way, the display panel 100 as a whole has a high light extraction rate and a wide viewing angle.

[0133] Optionally, the refractive index of the light extraction layer 5 is greater than or equal to 1.8.

[0134] Optionally, the refractive index of the light extraction layer 5 is greater than or equal to 1.9.

[0135] Optionally, the refractive index of the light extraction layer 5 is greater than or equal to 2.0.

[0136] In one alternative embodiment, the refractive index of the light extraction layer 5 is 1.8, 1.9, 2.0, 2.1, 2.2, etc.

[0137] Please see Figure 2 and Figure 3 As shown, the display panel 100 also includes an encapsulation structure layer 8, which includes a first encapsulation layer 81. The first encapsulation layer 81 is disposed on the side of the scattering layer 7 and the adjacent isolation structure 9 away from the substrate 3, so as to encapsulate the corresponding scattering structure 70, light extraction structure 50 and light-emitting device 4 inside, and prevent moisture from entering the light-emitting device 4.

[0138] The first encapsulation layer 81 can be an inorganic material encapsulation layer, which has a good water vapor barrier effect.

[0139] Optionally, the refractive index of the first encapsulation layer 81 is 1.7 to 2.0.

[0140] Optionally, the refractive index of the first encapsulation layer 81 is 1.7 to 1.9.

[0141] In some embodiments, the refractive index of the first encapsulation layer 81 is 1.7, 1.8, 1.9, or 2.0.

[0142] Since the scattering structure 70 is located on the side of the first encapsulation layer 81 close to the substrate 3, optionally, the refractive index of the base layer 71 of the scattering structure 70 is less than or equal to the refractive index of the first encapsulation layer 81.

[0143] Optionally, the refractive index of the base layer 71 of the scattering structure 70 is lower than that of the first encapsulation layer 81. Light entering the light extraction structure 50 undergoes multi-angle scattering under the action of the scattering particles 72. When the light further enters the first encapsulation layer 81 from the light extraction structure 50, it is refracted again. The angle of refraction is smaller than the angle of incidence, allowing large-angle light to be refracted without being blocked by the isolation structures 9 on both sides. This further ensures the light extraction effect. In other words, the first encapsulation layer 81 is a high-refractive-index layer relative to the base layer 71 of the scattering structure 70, thus facilitating the extraction and emission of light from the scattering structure 70 to the first encapsulation layer 81.

[0144] In one embodiment, the refractive index of the base layer 71 of the scattering structure 70 may be greater than or equal to 1.4 and less than 1.8. Thus, the refractive index of the base layer 71 of the scattering structure 70 is less than the refractive index of the first encapsulation layer 81.

[0145] In one embodiment, the refractive index of the first encapsulation layer 81 is greater than 1.8 and less than or equal to 2.0. Therefore, the refractive index of the first encapsulation layer 81 is greater than the refractive index of the base layer 71 of the scattering structure 70.

[0146] like Figure 2 and Figure 3 As shown, the encapsulation structure layer 8 further includes a second encapsulation layer 82 and a third encapsulation layer 83. The second encapsulation layer 82 may include an organic material encapsulation layer, and the third encapsulation layer 83 may include an inorganic material encapsulation layer. The material of the third encapsulation layer 83 can be the same as the material of the first encapsulation layer 81. In this way, while providing good moisture barrier effect, the display panel 100 is also given a certain degree of flexibility, making it suitable for flexible display panels.

[0147] In the scattering structure 70, the scattering particles 72 include one or more of titanium dioxide particles, zirconium dioxide particles, silicon dioxide particles, silicon oxide particles, and titanium oxide particles.

[0148] Optionally, in the scattering structure 70, the doping mass percentage of the scattering particles 72 is 10% to 60%.

[0149] Further optionally, in the scattering structure 70, the doping mass percentage of the scattering particles 72 is 20% to 50%;

[0150] Further optionally, in the scattering structure 70, the doping mass percentage of the scattering particles 72 is 30% to 50%.

[0151] In one specific embodiment, the doping mass percentage of the scattering particles 72 in the scattering structure 70 is 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, or 60%.

[0152] For light-emitting devices 4 of different colors, the diameter of the scattering particles 72 in their scattering structure 70 is different, so as to ensure that the scattering particles 72 can effectively scatter light of the corresponding wavelength band.

[0153] Please see Figure 5 As shown, in the scattering structure 70 corresponding to the red light-emitting device 4R, the size D1 of the scattering particles 72 is 160 nm to 180 nm.

[0154] Optionally, in the scattering structure 70 corresponding to the red light-emitting device 4R, the size D1 of the scattering particles 72 is 170 nm to 180 nm.

[0155] Please see Figure 6 As shown, in the scattering structure 70 corresponding to the green light-emitting device 4G, the size D2 of the scattering particles 72 is 130 nm to 150 nm.

[0156] Optionally, in the scattering structure 70 corresponding to the green light-emitting device 4G, the size D2 of the scattering particles 72 is 140 nm to 150 nm.

[0157] Please see Figure 7 As shown, in the scattering structure 70 corresponding to the blue light-emitting device 4B, the size D3 of the scattering particles 72 is 110 nm to 130 nm.

[0158] Optionally, in the scattering structure 70 corresponding to the blue light-emitting device 4B, the size D3 of the scattering particles 72 is 120 nm to 130 nm.

[0159] Please see Figures 8 to 10 As shown, in this embodiment, the display panel 100 further includes a lens layer 6 disposed on the side of the scattering layer 7 facing the substrate 3. The lens layer 6 includes a plurality of microlenses 61. Specifically, the microlenses 61 are disposed between the corresponding scattering structure 70 and the corresponding light extraction structure 50. The microlenses 61 have an arcuate convex surface 60 protruding toward the scattering structure 70, and the scattering structure 70 is disposed on the arcuate convex surface 60.

[0160] Please see Figure 10 As shown, the microlens 61 has an arcuate convex surface 60 protruding toward the scattering structure 70. When light is incident on the scattering structure 70 through the arcuate convex surface 60, the outgoing light is deflected toward the isolation structures 9 on both sides, thereby increasing the large-angle light and improving the large viewing angle brightness of each light-emitting device 4.

[0161] In one embodiment, the microlens 61 is made of a material with a refractive index of 1.5 to 1.9.

[0162] In one embodiment, the microlens 61 is made of a material with a refractive index of 1.5 to 1.8.

[0163] In one embodiment, the microlens 61 is made of a material with a refractive index of 1.5 to 1.7.

[0164] Specifically, the refractive index of the material of the microlens 61 is 1.5, 1.6, 1.65, 1.7, 1.75, 1.8, 1.85, or 1.9.

[0165] like Figure 9 As shown, the thickness of the scattering structure 70 gradually decreases in the direction away from the isolation structure 9.

[0166] The scattering structure 70 can be fabricated using a self-leveling method, such as inkjet printing, to ensure that the surface of the scattering structure 70 away from the substrate 3 is planar. This design aims to reduce step differences and facilitate the fabrication of other film layers on the side of the scattering structure 70 away from the substrate 3. Furthermore, the microlens 61 has an arcuate convex surface 60 protruding towards the scattering structure 70. Under the action of this arcuate convex surface 60, the self-leveling material can automatically fill the areas on both sides of the isolation structure 9, and the scattering structure 70 has a greater height in the area near the isolation structure 9, ensuring effective light scattering.

[0167] Please see Figure 8 As shown, in this embodiment, the distance H' between the arcuate surface 60 of the microlens 61 and the side surface of the blocking portion 92 facing the substrate 3 is greater than or equal to 0, so as to ensure that the scattering structure material can fill both sides of the isolation structure 9 and the side of the blocking portion 92 facing the substrate 3.

[0168] In one embodiment, the material of the base layer 71 includes organic materials.

[0169] Optionally, the base layer 71 may be made of resin material.

[0170] In one embodiment, the refractive index of the material of the microlens 61 is less than the refractive index of the first encapsulation layer 81. In other words, the refractive index of the first encapsulation layer 81 is greater than the refractive index of the material of the microlens 61. The first encapsulation layer 81 is a high-refractive-index layer relative to the microlens 61, which is beneficial for the extraction of light from the microlens 61 to the first encapsulation layer 81.

[0171] The refractive index of the material of microlens 61 is not significantly different from that of the substrate 71 of scattering structure 70, not exceeding 0.2. Optionally, the difference between the refractive index of microlens 61 and the refractive index of substrate 71 of scattering structure 70 is less than or equal to 0.1. The purpose of this arrangement is to reduce light reflection between microlens 61 and scattering structure 70, ensuring the efficiency of light emission from microlens 61, and thus ensuring the overall brightness of display panel 100.

[0172] In one embodiment, the microlens 61 is an inorganic insulating material lens. Specifically, the material of the microlens 61 is silicon oxide, silicon nitride, or a mixture of silicon oxide and silicon nitride.

[0173] In one embodiment, the microlens 61 is a photoresist material lens, which is made of photoresist and has a refractive index of 1.5 to 1.7. Specifically, the liquid photoresist material undergoes a liquid-to-solid transformation under ultraviolet irradiation, forming the aforementioned arcuate surface 60 due to volume shrinkage and surface tension.

[0174] Please see Figure 11 As shown, in this embodiment, the scattering structure 70 is replaced by being disposed on the side of the first encapsulation layer 81 facing away from the substrate 3. The height difference H between the surface of the scattering structure 70 facing away from the substrate 3 and the surface of the blocking portion 92 facing the substrate 3 is still greater than or equal to 0.

[0175] In this embodiment, the scattering structure 70 is located on the side of the first encapsulation layer 81 away from the substrate 3. Optionally, the refractive index of the base layer 71 of the scattering structure 70 is greater than or equal to the refractive index of the first encapsulation layer 81.

[0176] Alternatively, the material of the first encapsulation layer 81 may be selected based on the primary criterion of achieving water and oxygen barrier effects. In some embodiments, the refractive index of the scattering structure 70 may be less than that of the first encapsulation layer 81. Optionally, the difference in refractive index between the two should be as small as possible to avoid excessive reflection of light from the first encapsulation layer 81 to the scattering structure 70. Optionally, the difference between the refractive index of the scattering structure 70 and the refractive index of the first encapsulation layer 81 may be less than or equal to 0.2. More preferably, the difference between the refractive index of the scattering structure 70 and the refractive index of the first encapsulation layer 81 may be less than or equal to 0.1.

[0177] Please see Figure 12 As shown, in this embodiment, the microlens 61 is formed by a first encapsulation layer 81. Alternatively, in this embodiment, the first encapsulation layer 81 is configured to have an arcuate convex surface 60 protruding toward the scattering structure 70.

[0178] In this embodiment, the microlens 61 is formed simultaneously by the first encapsulation layer 81, which can reduce one manufacturing step, thus saving process steps and reducing the overall thickness of the display panel 100.

[0179] In this embodiment, optionally, the refractive index of the microlens 61 material, i.e., the refractive index of the first encapsulation layer 81, is not significantly different from the refractive index of the base layer 71 of the scattering structure 70, and does not exceed 0.2. Alternatively, the difference between the refractive index of the microlens 61 material, i.e., the refractive index of the first encapsulation layer 81, and the refractive index of the base layer 71 of the scattering structure 70 is less than or equal to 0.1.

[0180] The refractive index of the material of the first encapsulation layer 81 is less than or equal to 1.8, so as to minimize the difference in refractive index between the first encapsulation layer 81 and the scattering structure 70 and reduce the reflection of light between the first encapsulation layer 81 and the scattering structure 70.

[0181] Next, please refer to Figure 13 As shown in the embodiments of this application, a method for manufacturing a display panel is also provided, which includes:

[0182] Step S1: Provide substrate 3; fabricate isolation structure 9 on one side of substrate 3, the isolation structure 9 defining a plurality of isolation openings 90;

[0183] Step S2: A light-emitting device 4 is fabricated within the isolation opening 90, and a scattering layer 7 is fabricated on the side of the light-emitting device 4 away from the substrate 3. The scattering layer includes a plurality of scattering structures 70, which are located within the corresponding isolation opening 90 and on the side of the corresponding light-emitting device 4 away from the substrate 3. The scattering structure 70 includes a base layer 71 and scattering particles 72 doped in the base layer 71.

[0184] Specifically, in step S1, the substrate 3 includes a driving circuit layer 31 and a pixel definition layer 32 on one side of the driving circuit layer 31, and a plurality of pixel openings 320 are formed on the pixel definition layer 32.

[0185] In step S1, the isolation structure 9 is fabricated on the pixel definition layer 32, and the pixel opening 320 is connected to the isolation opening 90.

[0186] In one embodiment, before fabricating the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 in step S2, the light extraction layer 5 is fabricated on the side of the light-emitting device 4 away from the substrate 3. The light extraction layer 5 includes a plurality of light extraction structures 50, which are located within the corresponding isolation openings 90 and on the side of the light-emitting device 4 away from the substrate 3.

[0187] In one embodiment, after the step of forming the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 in step S2, the method further includes forming a first encapsulation layer 81 on the side of the scattering layer 7 away from the substrate 3.

[0188] Specifically, step S2 includes:

[0189] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within multiple pixel openings 320;

[0190] A photoextraction material layer is deposited on the side of the second electrode material away from the substrate 3;

[0191] A base material doped with scattering particles 72 is coated on the side of the light extraction material layer away from the substrate 3 within the pixel opening 320, and the base material is then cured.

[0192] A first encapsulation material layer is deposited on the side of the base material and isolation structure 9 away from the substrate 3. The first encapsulation material layer, light extraction material layer, second electrode material layer and light-emitting functional material layer are patterned sequentially using a photomask process to obtain the light-emitting functional layer 42, second electrode 43, light extraction structure 50, scattering structure 70 and first encapsulation layer 81 that are sequentially stacked on the side of the first electrode 41 away from the substrate 3.

[0193] Thus, a first light-emitting device and its corresponding light extraction structure 50, scattering structure 70, and first encapsulation layer 81 are obtained. The above steps are repeated to fabricate a second light-emitting device and its corresponding light extraction structure 50, scattering structure 70, and first encapsulation layer 81, and to fabricate a third light-emitting device and its corresponding light extraction structure 50, scattering structure 70, and first encapsulation layer 81.

[0194] Please see Figure 14As shown, in one embodiment, in step S2, after the step of fabricating the light extraction layer 5 on the side of the light-emitting device 4 away from the substrate 3 and before the step of fabricating the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3, the method further includes fabricating a lens layer 6 on the side of the light extraction layer 5 away from the substrate 3. The lens layer 6 includes a plurality of microlenses 61 made of photoresist material. The microlenses 61 are disposed in corresponding isolation openings 90. The microlenses 61 on the side of the light extraction structure 50 away from the substrate 3 have an arcuate convex surface 60 protruding away from the substrate 3. The scattering structure 70 is located on the arcuate convex surface 60.

[0195] In one embodiment, after the step of forming the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 in step S2, the method further includes forming a first encapsulation layer 81 on the side of the scattering layer 7 away from the substrate 3.

[0196] Specifically, step S2 includes:

[0197] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within multiple pixel openings 320;

[0198] A photoextraction material layer is deposited on the side of the second electrode material away from the substrate 3;

[0199] Photoresist material is coated on the side of the light extraction material layer away from the substrate 3 and then cured.

[0200] A base material doped with scattering particles 72 is coated on the side of the photoresist material away from the substrate 3 and then the base material is cured.

[0201] A first encapsulation material layer is deposited on the side of the base material away from the substrate 3. The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain the light-emitting functional layer 42, the second electrode 43, the light extraction structure 50, the microlens 61, the scattering structure 70, and the first encapsulation layer 81 that are sequentially stacked on the side of the light-emitting device 4 away from the substrate 3.

[0202] Thus, the first light-emitting device and its corresponding light extraction structure 50, microlens 61, scattering structure 70, and first encapsulation layer 81 are obtained. The above steps are repeated to fabricate the second light-emitting device and its corresponding light extraction structure 50, microlens 61, scattering structure 70, and first encapsulation layer 81, as well as the third light-emitting device and its corresponding light extraction structure 50, microlens 61, scattering structure 70, and first encapsulation layer 81.

[0203] Please see Figure 15As shown, in step S2, after the step of fabricating the light extraction layer 5 on the side of the light-emitting device 4 away from the substrate 3 and before the step of fabricating the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3, the method further includes fabricating a lens layer 6 on the side of the light extraction layer 5 away from the substrate 3. The lens layer 6 includes a plurality of microlenses 61 made of inorganic insulating material. The microlenses 61 are disposed in the corresponding isolation openings 90. The microlenses 61 on the side of the light extraction structure 50 away from the substrate 3 have an arcuate convex surface 60 protruding away from the substrate 3. The scattering structure 70 is located on the arcuate convex surface 60.

[0204] In one embodiment, after the step of forming the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 in step S2, the method further includes forming a first encapsulation layer 81 on the side of the scattering layer 7 away from the substrate 3.

[0205] Specifically, step S2 includes:

[0206] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within multiple pixel openings 320;

[0207] A photoextraction material layer is deposited on the side of the second electrode material away from the substrate 3;

[0208] A first encapsulation material layer is deposited on the side of the light extraction material layer away from the substrate 3, and the first encapsulation material layer is patterned by laser etching to obtain a microlens 61 located within the pixel opening 320 and having an arcuate convex surface 60 protruding away from the substrate 3.

[0209] Using microlens 61 as a block, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned to obtain the light-emitting functional layer 42, the second electrode 43, the light extraction structure 50, and the microlens 61, which are sequentially stacked on the side of the light-emitting device 4 away from the substrate 3.

[0210] The steps for fabricating the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 include:

[0211] A base material doped with scattering particles 72 is coated on the side of the microlens 61 away from the substrate 3 and then cured.

[0212] Thus, the first light-emitting device and its corresponding light extraction structure 50, microlens 61, and scattering structure 70 are obtained. The above steps are repeated to fabricate the second light-emitting device and its corresponding light extraction structure 50, microlens 61, and scattering structure 70, as well as the third light-emitting device and its corresponding light extraction structure 50, microlens 61, and scattering structure 70.

[0213] Please see Figure 16As shown, in step S2, after the step of forming the light extraction layer 5 on the side of the light-emitting device 4 away from the substrate 3 and before the step of forming the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3, the step further includes forming a first encapsulation layer 81 on the side of the light extraction layer 5 away from the substrate 3.

[0214] Specifically, step S2 includes:

[0215] A light-emitting functional material layer and a second electrode material layer are sequentially deposited within multiple pixel openings 320;

[0216] Photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate 3;

[0217] A first encapsulation material layer is deposited on the side of the light extraction material layer away from the substrate 3. The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain the light-emitting functional layer 42, the second electrode 43, the light extraction structure 50, and the first encapsulation layer 81 that are sequentially stacked on the substrate 3.

[0218] The steps for fabricating the scattering layer 7 on the side of the light-emitting device 4 away from the substrate 3 include:

[0219] A base material doped with scattering particles 72 is coated on the side of the first encapsulation layer 81 away from the substrate 3 within the pixel opening 320, and the base material is then cured.

[0220] Thus, a first light-emitting device and its corresponding light extraction structure 50, first encapsulation layer 81, and scattering structure 70 are obtained. The above steps are repeated to fabricate a second light-emitting device and its corresponding light extraction structure 50, first encapsulation layer 81, and scattering structure 70, as well as a third light-emitting device and its corresponding light extraction structure 50, first encapsulation layer 81, and scattering structure 70.

[0221] Finally, this application also provides a display device, which includes the display panel 100 as described in the above embodiments, or a display panel manufactured by the manufacturing method described in the above embodiments. The features, manufacturing process, and technical effects of the display panel 100 can be found in the above embodiments.

[0222] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is provided on one side of the substrate, and the isolation structure defines a plurality of isolation openings; Multiple light-emitting devices are disposed within the corresponding isolation openings; as well as The scattering layer includes multiple scattering structures disposed within the corresponding isolation opening and located on the side of the corresponding light-emitting device away from the substrate. Each scattering structure includes a base layer and scattering particles doped within the base layer.

2. The display panel as described in claim 1, characterized in that, The light transmittance of the substrate is greater than or equal to 90%; Preferably, the light transmittance of the substrate is greater than or equal to 95%.

3. The display panel as described in claim 1, characterized in that, The isolation structure includes an isolation portion disposed on one side of the substrate and a blocking portion disposed on the side of the isolation portion away from the substrate, wherein the orthographic projection of the isolation portion on the substrate is located within the orthographic projection of the blocking portion on the substrate. The scattering structure includes a light-emitting surface facing away from the substrate, and the distance between the light-emitting surface and the surface of the blocking portion facing the substrate is greater than or equal to 0. Preferably, the distance between the light-emitting surface and the surface of the blocking portion facing the substrate is greater than 0.

4. The display panel as described in claim 1, characterized in that, The display panel further includes a light extraction layer, which comprises multiple light extraction structures located between the corresponding light-emitting device and the corresponding scattering structure; the refractive index of the light extraction layer is greater than or equal to 1.

8. Preferably, the refractive index of the light extraction layer is greater than or equal to 2.

0.

5. The display panel as described in claim 4, characterized in that, The display panel further includes a lens layer disposed between the light extraction layer and the scattering layer. The lens layer includes a plurality of microlenses. The microlenses are disposed within the isolation opening and between the corresponding light extraction structure and the scattering structure. The microlenses have an arcuate convex surface protruding away from the substrate. The scattering layer is disposed on the arcuate convex surface. The thickness of the scattering layer gradually decreases in the direction away from the isolation structure. Preferably, the difference between the refractive index of the microlens material and the refractive index of the substrate is less than or equal to 0.2; Preferably, the difference between the refractive index of the microlens material and the refractive index of the substrate is less than or equal to 0.

1.

6. The display panel as described in claim 5, characterized in that, The microlens is an inorganic insulating material lens; Preferably, the refractive index of the microlens material is less than or equal to 1.8; Alternatively, the microlens may be a photoresist material lens; Preferably, the microlens is made of a material with a refractive index of 1.5 to 1.9; Preferably, the microlens is made of a material with a refractive index of 1.5 to 1.8; Preferably, the refractive index of the microlens material is 1.5 to 1.

7.

7. The display panel as described in claim 1, characterized in that, The display panel further includes a first encapsulation layer, which is disposed on the side of the scattering layer near the substrate; the first encapsulation layer is an inorganic material encapsulation layer. Preferably, the refractive index of the first encapsulation layer is 1.7 to 2.0; Preferably, the refractive index of the base layer is greater than or equal to the refractive index of the first encapsulation layer; Alternatively, the refractive index of the substrate is less than that of the first encapsulation layer, and the difference between the refractive indices of the substrate and the first encapsulation layer is less than or equal to 0.

2. Preferably, the refractive index of the base layer is less than that of the first encapsulation layer, and the difference between the refractive indices of the base layer and the first encapsulation layer is less than or equal to 0.

1.

8. The display panel as described in claim 1, characterized in that, The display panel further includes a first encapsulation layer, which is disposed on the side of the scattering layer away from the substrate; Preferably, the refractive index of the first encapsulation layer is 1.7 to 2.0; Preferably, the refractive index of the base layer is 1.4 to 1.8; Preferably, the refractive index of the base layer is less than or equal to the refractive index of the first encapsulation layer.

9. The display panel as described in any one of claims 1 to 8, characterized in that, The scattering particles include one or more of titanium dioxide particles, zirconium dioxide particles, silicon dioxide particles, silicon oxide particles, and titanium dioxide particles; Preferably, in the scattering structure, the doping mass percentage of the scattering particles is 10% to 60%; Preferably, in the scattering structure, the doping mass percentage of the scattering particles is 20% to 40%; Preferably, the light-emitting device includes a red light-emitting device, a green light-emitting device, and a blue light-emitting device; in the scattering structure corresponding to the red light-emitting device, the size of the scattering particles is 160 nm to 180 nm; in the scattering structure corresponding to the green light-emitting device, the size of the scattering particles is 130 nm to 150 nm; and in the scattering structure corresponding to the blue light-emitting device, the size of the scattering particles is 110 nm to 130 nm.

10. The display panel as claimed in any one of claims 1 to 8, characterized in that, The base material includes organic materials; Preferably, the base layer is made of resin.

11. A method for manufacturing a display panel, characterized in that, include: Provide substrate; An isolation structure is formed on one side of the substrate, the isolation structure defining a plurality of isolation openings; A light-emitting device is fabricated within the isolation opening, and a scattering layer is fabricated on the side of the light-emitting device facing away from the substrate; The scattering layer includes multiple scattering structures, which are located within the corresponding isolation openings and on the side of the corresponding light-emitting device facing away from the substrate. The isolation structure includes a base layer and scattering particles doped within the base layer.

12. The method for manufacturing a display panel as described in claim 11, characterized in that, Before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a light extraction layer on the side of the light-emitting device away from the substrate, wherein the light extraction layer includes a plurality of light extraction structures, and the light extraction structures are located in the corresponding isolation openings and on the corresponding side of the light-emitting device away from the substrate. Preferably, before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, and after the step of forming a light extraction layer on the side of the light-emitting device away from the substrate, the step further includes forming a lens layer on the side of the light extraction layer away from the substrate; wherein the lens layer includes a plurality of microlenses, the microlenses being located within the corresponding isolation opening and on the side of the corresponding light extraction structure away from the substrate.

13. The method for manufacturing a display panel as described in claim 12, characterized in that, Also includes: A first encapsulation layer is formed on the side of the scattering layer opposite to the substrate; Preferably, the steps of forming a light extraction layer on the side of the light-emitting device facing away from the substrate, forming a scattering layer on the side of the light-emitting device facing away from the substrate, forming a lens layer on the side of the light extraction layer facing away from the substrate, and forming a first encapsulation layer on the side of the scattering layer facing away from the substrate include: A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings; A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate; A photoresist material is coated on the side of the light extraction material layer facing away from the substrate within the isolation opening, and the photoresist material is then cured. A base material doped with scattering particles is coated on the side of the photoresist material facing away from the substrate within the isolation opening, and the base material is then cured. A first encapsulation material layer is deposited on the side of the base material opposite to the substrate; The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially through a photomask process to obtain a light-emitting functional layer, a second electrode, a light extraction layer, a microlens, a scattering layer, and the first encapsulation layer that are sequentially stacked on the side of the light-emitting device away from the substrate.

14. The method for manufacturing a display panel as described in claim 12, characterized in that, The steps of fabricating a light extraction layer on the side of the light-emitting device facing away from the substrate, fabricating a scattering layer on the side of the light-emitting device facing away from the substrate, and fabricating a lens layer on the side of the light extraction layer facing away from the substrate include: A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings; A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate; A first encapsulation material layer is deposited on the side of the light extraction material layer away from the substrate, and the first encapsulation material layer is patterned by laser etching to obtain a plurality of microlenses located in the corresponding isolation openings and having arcuate convex surfaces protruding away from the substrate. Using the microlens as a barrier, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned to obtain a light-emitting functional layer, the second electrode, the light extraction layer, and the microlens that are sequentially stacked on the side of the light-emitting device away from the substrate. Preferably, the step of fabricating a scattering layer on the side of the light-emitting device facing away from the substrate includes: A base material doped with scattering particles is coated inside the isolation opening and onto the microlens, and the base material is then cured to obtain multiple scattering structures.

15. The method for manufacturing a display panel as described in claim 11, characterized in that, It also includes forming a first encapsulation layer on the side of the scattering layer opposite to the substrate; Preferably, the steps of forming a scattering layer on the side of the light-emitting device away from the substrate and forming a first encapsulation layer on the side of the scattering layer away from the substrate include: A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings; A base material doped with scattering particles is coated on the side of the second electrode material layer away from the substrate within the isolation opening, and the base material is then cured. A first encapsulation material layer is deposited on the side of the base material and the isolation structure away from the substrate. The first encapsulation material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain a light-emitting functional layer, a second electrode, a scattering layer, and the first encapsulation layer that are sequentially stacked on the side of the light-emitting device away from the substrate.

16. The method for manufacturing a display panel as described in claim 11, characterized in that, Before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a light extraction layer on the side of the light-emitting device away from the substrate; wherein the light extraction layer includes a plurality of light extraction structures, and the light extraction structures are located in the corresponding isolation openings and on the corresponding side of the light-emitting device away from the substrate. Preferably, after the step of forming a light extraction layer on the side of the light-emitting device away from the substrate and before the step of forming a scattering layer on the side of the light-emitting device away from the substrate, the method further includes: forming a first encapsulation layer on the side of the light extraction layer away from the substrate. Preferably, the steps of forming a light extraction layer on the side of the light-emitting device away from the substrate and forming a first encapsulation layer on the side of the light extraction layer away from the substrate include: A light-emitting functional material layer and a second electrode material layer are sequentially deposited within the multiple isolation openings; A photoextraction material layer is deposited on the side of the second electrode material layer away from the substrate; A first encapsulation material layer is deposited on the side of the light extraction material layer facing away from the substrate; The first encapsulation material layer, the light extraction material layer, the second electrode material layer, and the light-emitting functional material layer are patterned sequentially using a photomask process to obtain a light-emitting functional layer, a second electrode, a light extraction layer, and the first encapsulation layer that are sequentially stacked on one side of the substrate. Preferably, the step of fabricating a scattering layer on the side of the light-emitting device facing away from the substrate includes: A base material doped with scattering particles is coated inside the isolation opening and onto the first encapsulation layer, and the base material is then cured to obtain a plurality of the scattering structures.

17. A display device, characterized in that, It includes the display panel as described in any one of claims 1 to 10, or the display panel manufactured by the method described in any one of claims 11 to 16.

Images