Display panel and display device

By introducing a flat support plane of the second support structure into the flexible display panel, the problem of damage to electronic devices caused by curvature deformation in curved display devices is solved, the strength and stability of the devices are improved, and the size of the display devices is reduced.

CN121968899APending Publication Date: 2026-05-01WUHAN TIANMA MICRO ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202610276076.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-06
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

The electronic components of flexible display panels are easily damaged by curvature deformation in curved display devices, resulting in a loss of performance and strength.

Method used

By introducing a second support structure into the display panel, a flat support plane is provided, allowing electronic components to be set parallel to the support plane and avoiding curvature deformation caused by the curved surface. A partitioned or integral support structure design can be adopted to adapt to the installation position and size requirements of different electronic components.

Benefits of technology

It effectively protects electronic components from deformation and damage, improves their strength and operational stability, extends their service life, and helps to reduce the size of display devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121968899A_ABST
    Figure CN121968899A_ABST
Patent Text Reader

Abstract

The invention relates to a display panel and a display device. The display panel further comprises a display module, a first supporting structure and a second supporting structure, the substrate at least located in the display area is provided with a first curved surface, and the first curved surface protrudes towards the light emitting surface of the display panel; the first supporting structure is located on the side, away from the light emitting face, of the substrate, the second supporting structure is located on the side, away from the substrate, of the first supporting structure, and the orthographic projection area of the second supporting structure in the direction perpendicular to the substrate is smaller than or equal to the orthographic projection area of the first supporting structure in the direction perpendicular to the substrate. The side, away from the first supporting structure, of the second supporting structure comprises at least one supporting plane. The electronic devices are located on the side, away from the first supporting structure, of the second supporting structure, the at least one supporting plane corresponds to the at least one electronic device, and the electronic devices are located in the range of the corresponding supporting planes and are parallel to the supporting planes. Therefore, according to the display panel and the display device provided by the invention, the damage to electronic devices of the display panel can be reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Display panel and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels have many advantages, such as being all-solid-state, actively emitting light, having a fast response time, high contrast, no viewing angle limitations, and being able to achieve flexible displays. They are a new type of display technology that was developed in the mid-20th century and are widely used in people's daily production and life.

[0003] In related technologies, flexible display panels are widely used in curved wearable display devices due to their bendable properties. However, the electronic components of these display panels are easily damaged. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and display device that can reduce damage to the electronic components of the display panel.

[0005] In a first aspect, embodiments of this application provide a display panel, which includes a display area and a non-display area surrounding the display area. The display panel also includes a display module, a first support structure, and a second support structure. The display module includes a substrate, and the substrate at least located in the display area has a first curved surface that protrudes toward the light-emitting surface of the display panel. The first support structure is located on the side of the substrate away from the light-emitting surface, and the second support structure is located on the side of the first support structure away from the substrate. The orthogonal projection area of ​​the second support structure in the direction perpendicular to the substrate is less than or equal to the orthogonal projection area of ​​the first support structure in the direction perpendicular to the substrate. At least part of the side of the second support structure facing the first support structure is an arc-shaped structure, and the side of the second support structure away from the first support structure includes at least one support plane. The display panel includes at least one electronic device located on the side of the second support structure away from the first support structure. At least one support plane and at least one electronic device are correspondingly disposed, and the electronic device is located within the range of the corresponding support plane and is disposed parallel to the support plane.

[0006] Secondly, embodiments of this application provide a display device, including the display panel of the first aspect.

[0007] The display panel and display device provided in this application embodiment provide a flat planar support for electronic devices through the support plane on the side of the second support structure away from the first support structure. The electronic devices are parallel to the support plane and located within the support plane range, so that the rigid electronic devices do not need to undergo arc deformation with the first curved surface. This helps to avoid performance and strength damage to the rigid electronic devices due to deformation, and ensures the strength, working stability and service life of the electronic devices. Attached Figure Description

[0008] Figure 1 is a bottom view of the display panel before the bending part is bent, according to an embodiment of this application.

[0009] Figure 2 is a side view of the display panel before the bending part is bent, according to an embodiment of this application.

[0010] Figure 3 is a partial structural diagram of Figure 2.

[0011] Figure 4 is a bottom view of Figure 2.

[0012] Figure 5 is another side view of the display panel before the bending part is bent, according to an embodiment of this application.

[0013] Figure 6 is a partial structural schematic diagram of Figure 5.

[0014] Figure 7 is a bottom view of Figure 5.

[0015] Figure 8 is a side view of the display panel after the bending portion is bent according to an embodiment of this application.

[0016] Figure 9 is a partial structural schematic diagram of Figure 8.

[0017] Figure 10 is a bottom view of Figure 8.

[0018] Figure 11 is another side view of the display panel before the bending part is bent, according to an embodiment of this application.

[0019] Figure 12 is a bottom view of Figure 11.

[0020] Figure 13 is another side view of the display panel after the bending portion is bent according to the embodiment of this application.

[0021] Figure 14 is a bottom view of the display panel after the bending portion is bent according to an embodiment of this application.

[0022] Figure 15 is another side view of the display panel before the bending part is bent, according to an embodiment of this application.

[0023] Figure 16 is a side view of the display panel after the bending section of Figure 15 has been bent.

[0024] Figure 17 is another side view of the display panel after the bending portion is bent according to the embodiment of this application.

[0025] Figure 18 is a schematic diagram of the first support structure and the enclosure provided in the embodiment of this application when they are in a planar state.

[0026] Figure 19 is a schematic diagram of the first support structure and the enclosure provided in the embodiment of this application when they are in a bent state.

[0027] Figure 20 is a schematic diagram of the first support structure, the enclosure, and the second support structure provided in the embodiments of this application.

[0028] Figure 21 is a schematic diagram of the structure using LIPO potting provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100. Display panel; AA, display area; NAA, non-display area; 110. First support structure; 111. First adhesive layer; 112. Buffer layer; 113. Metal layer; 120. Second support structure; 121. First sub-support structure; 122. Second sub-support structure; 123. Support plane; 123a. First support plane; 123b. Second support plane; 130. Display module; 140. Substrate; 141. First curved surface; 142. Bending portion; 143. Binding part; 150. Electronic component; 150a. First electronic component; 150b. Second electronic component; 160. Enclosure; 161. First side; 162. Receiving groove; 171. Cover plate; 172. Second adhesive layer; 173. Polarizing film; 174. Support and protective layer; 175. Flexible circuit board; 176. Protective layer; 183. Third adhesive layer; 184. Fourth adhesive layer; 210. First tool; 220. Second tool; Z. First direction. Detailed Implementation

[0031] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0034] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0035] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0036] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0037] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0038] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0039] As described in the background section, flexible display panels are widely used in curved wearable display devices due to their bendable properties. The display panel includes a display module and a cover plate, with electronic components disposed on the side of the display module facing away from the cover plate. In a dual-spherical wearable product, both the side of the cover plate facing the display module and the side facing away from the display module are spherical, with the surface of the cover plate facing the display module being a first spherical surface.

[0040] However, electronic devices (e.g., chips) are rigid devices. Both the display module and the rigid electronic devices will undergo arc deformation under the action of the first spherical surface of the cover plate. The deformation of the rigid electronic devices will lead to damage to the strength and performance of the electronic devices.

[0041] Based on the above-mentioned technical problems, the inventors discovered that by using the support plane on the side of the second support structure away from the first support structure to provide a flat planar support for the electronic device, and with the electronic device parallel to the support plane and located within the support plane range, the rigid electronic device does not need to undergo arc deformation with the first curved surface. This helps to avoid performance and strength damage to the rigid electronic device due to deformation, and ensures the strength, operational stability and service life of the electronic device.

[0042] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0043] The display panel and display device provided in the embodiments of this application will be described below with reference to Figures 1-21.

[0044] Referring to Figure 1, this embodiment of the application provides a display panel 100, which includes a display area AA and a non-display area NAA surrounding the display area AA. The display area AA can display an image.

[0045] Referring to Figures 2-4, the display panel 100 also includes a display module 130, which includes a substrate 140. At least the substrate 140 located in the display area AA (Figure 1) has a first curved surface 141 that protrudes towards the light-emitting surface of the display panel 100. This protrusion of the first curved surface 141 towards the light-emitting surface of the display panel 100 allows for more installation space, thus reducing the size of the display device. The light-emitting surface is the side of the display panel 100 that displays the image and emits light. The backlight surface is positioned opposite the light-emitting surface along a direction perpendicular to the substrate 140 (i.e., the first direction Z in Figure 2). For example, the top surface in Figure 2 is the light-emitting surface.

[0046] In some embodiments, the first surface 141 may also be located in the non-display area NAA.

[0047] In some embodiments, the substrate 140 located in the display area AA has a second curved surface on the side facing the light-emitting surface of the display panel 100, and the second curved surface protrudes towards the light-emitting surface of the display panel 100. For example, both the first curved surface 141 and the second curved surface can be spherical, and the display panel 100 is a double-spherical display panel.

[0048] For example, display module 130 is a flexible display module.

[0049] Referring to Figures 5-7, the display panel 100 also includes a first support structure 110 and a second support structure 120. The first support structure 110 is located on the side of the substrate 140 away from the light-emitting surface of the display panel 100, and the second support structure 120 is located on the side of the first support structure 110 away from the light-emitting surface of the display panel 100. The orthogonal projection area of ​​the second support structure 120 in the direction perpendicular to the substrate 140 (i.e., the first direction Z) is less than or equal to the orthogonal projection area of ​​the first support structure 110 in the direction perpendicular to the substrate 140. This makes the area of ​​the first support structure 110 larger, so that the first support structure 110 can provide better support for the second support structure 120. At least part of the side of the second support structure 120 facing the first support structure 110 is an arc-shaped structure, which is equivalent to at least part of the side of the second support structure 120 facing the first support structure 110 being a curved surface. At least part of the shape of the side of the first support structure 110 facing the second support structure 120 and the side of the second support structure 120 facing the first support structure 110 are both arc-shaped structures and are adapted to each other so that the side of the first support structure 110 facing the second support structure 120 and the side of the second support structure 120 facing the first support structure 110 can fit tightly together.

[0050] Referring to Figures 8 and 9, the side of the second support structure 120 away from the first support structure 110 includes at least one support plane 123. The display panel 100 includes at least one electronic device 150, which is located on the side of the second support structure 120 away from the first support structure 110. At least one support plane 123 and at least one electronic device 150 are correspondingly arranged, and the electronic device 150 is located within the range of the corresponding support plane 123 and is arranged parallel to the support plane 123. In this way, the support plane 123 on the side of the second support structure 120 away from the first support structure 110 provides a flat planar support for the electronic device 150, and the electronic device 150 is parallel to the support plane 123 and located within its range. This prevents the rigid electronic device 150 from undergoing arc deformation with the first curved surface 141, which helps to avoid performance damage (e.g., circuit breakage, poor contact, performance degradation, etc.) and strength damage to the rigid electronic device 150 caused by deformation, thus ensuring the strength, working stability and service life of the electronic device 150.

[0051] The phrase "electronic device 150 is located within the corresponding support plane 123" can mean that the orthographic projection of the electronic device 150 in the direction perpendicular to the substrate 140 is located within the orthographic projection of the support plane 123 in the direction perpendicular to the substrate 140.

[0052] For example, the number of electronic devices 150 can be any number of 1, 2, 3 or more.

[0053] Referring to Figures 1 and 9, in some embodiments, the display panel 100 includes a flexible circuit board 175, and the substrate 140 includes a bending portion 142 and a bonding portion 143. The bending portion 142 is connected between the bonding portion 143 and the substrate 140 located in the display area AA. The bonding portion 143 and the flexible circuit board 175 are located on the side of the second support structure 120 away from the light-emitting surface of the display panel 100. The bonding portion 143 and the flexible circuit board 175 are connected. Thus, by providing the bending portion 142, the bonding portion 143 and the flexible circuit board 175 can be bent to the backlight side of the display panel 100, which can reduce the area occupied by the bonding portion 143 and the flexible circuit board 175 in the display panel 100, which is beneficial to achieving a narrow bezel.

[0054] Referring to Figures 8 and 10, in some embodiments, there are multiple electronic devices 150, including a first electronic device 150a and a second electronic device 150b spaced apart. The first electronic device 150a is disposed on the bonding portion 143, and the second electronic device 150b is disposed on the flexible circuit board 175. The first electronic device 150a and the second electronic device 150b are located within the corresponding support plane 123.

[0055] For example, the first electronic device 150a can be a chip.

[0056] For example, the number of first electronic devices 150a can be at least one. Each first electronic device 150a is disposed on the binding part 143. Each first electronic device 150a can be disposed corresponding to the same support plane 123, and each first electronic device 150a is located within the corresponding support plane 123.

[0057] For example, the number of second electronic devices 150b can be at least one. Each second electronic device 150b is disposed on the flexible circuit board 175. Each second electronic device 150b can be disposed corresponding to the same support plane 123, and each second electronic device 150b is located within the corresponding support plane 123.

[0058] Referring to Figures 8, 11, and 16, in some embodiments, there is only one supporting plane 123, and the first electronic device 150a and the second electronic device 150b are located within the same supporting plane 123. This reduces the number of supporting planes 123, simplifies the overall structural form of the second supporting structure 120, reduces the difficulty of processing and forming the second supporting structure 120, and lowers the design difficulty of the second supporting structure 120. In this case, the second supporting structure 120 can be a single integral structure.

[0059] Referring to Figure 17, in some embodiments, there are multiple support planes 123, including a first support plane 123a and a second support plane 123b. The first support plane 123a and the second support plane 123b are spaced apart and parallel to each other. The first electronic device 150a is located within the range of the first support plane 123a, and the second electronic device 150b is located within the range of the second support plane 123b. In this way, the first electronic device 150a of the bonding part 143 and the second electronic device 150b of the flexible circuit board 175 are respectively configured with independent first support planes 123a and second support planes 123b. This allows for targeted matching of the installation position, size specifications, height requirements, etc. of the two types of electronic devices 150. The partitioned support design allows both types of electronic devices 150 to accurately fit the corresponding support planes 123, improving the compatibility accuracy of the second support structure 120 with different electronic devices 150 and adapting to more diverse electronic device 150 layout schemes.

[0060] Referring to Figure 17, in some examples, multiple support planes 123 include a first support plane 123a and a second support plane 123b. The second support structure 120 includes a first sub-support structure 121 and a second sub-support structure 122 arranged at intervals. The first support plane 123a is located on the side of the first sub-support structure 121 away from the first support structure 110, and the second support plane 123b is located on the side of the second sub-support structure 122 away from the first support structure 110. In this way, by using the separately arranged first sub-support structure 121 and second sub-support structure 122 to support the first electronic device 150a and the second electronic device 150b respectively, the volume of the first sub-support structure 121 and the second sub-support structure 122 is smaller, which helps to reduce the total material cost of the second support structure 120 and also improves the layout flexibility of the first sub-support structure 121 and the second sub-support structure 122. The flexible circuit board 175 is bound to the side of the binding part 143 away from the first support structure 110. By adjusting the relative position of the second support plane 123b perpendicular to the substrate 140, the flexible circuit board 175 can be tightly attached to the second support plane 123b without bending.

[0061] In other examples, the multiple support planes 123 include a first support plane 123a and a second support plane 123b. The second support structure 120 can be an integral structure, which makes the volume of the second support structure 120 larger and can provide greater support for the binding part 143 and the flexible circuit board 175.

[0062] In some examples, multiple support planes 123 include a first support plane 123a and a second support plane 123b. The first support plane 123a and the second support plane 123b are coplanar, which makes the design of the first support plane 123a and the second support plane 123b simpler and helps to reduce the design difficulty of the first support plane 123a and the second support plane 123b.

[0063] Referring to Figure 17, in some other examples, multiple support planes 123 include a first support plane 123a and a second support plane 123b. The first support plane 123a and the second support plane 123b are not coplanar, which helps to improve the layout flexibility of the first support plane 123a and the second support plane 123b, and can be specifically matched to the installation height requirements of the first electronic device 150a and the second electronic device 150b.

[0064] Referring to Figures 9 and 13, in some embodiments, the orthographic projection of the second support structure 120 in the direction perpendicular to the substrate 140 is spaced apart from the orthographic projection of the bent portion 142 in the direction perpendicular to the substrate 140. This helps to prevent the second support structure 120 from affecting the bending of the bent portion 142.

[0065] Referring to Figure 11, the outer contours of the orthographic projection of the second support structure 120 in the direction perpendicular to the substrate 140 and the orthographic projection of the first support structure 110 in the direction perpendicular to the substrate 140 are spaced apart. For example, the edges of the second support structure 120 and the first support structure 110 on the side facing away from the substrate 140 are spaced apart. There is a gap d1 between the edge of the side of the second support structure 120 facing away from the substrate 140 and the edge of the side of the first support structure 110 facing away from the substrate 140 along the direction perpendicular to the substrate 140. This gap d1 can reserve more installation space for the whole device, which is beneficial to reduce the size of the display device.

[0066] Referring to Figures 12 and 13, in some embodiments, the thickness of the second support structure 120 gradually increases from the end near the bend 142 to the end away from the bend 142. In this way, the second support structure 120 can adapt to the shape of the surface of the first support structure 110 away from the light-emitting surface of the display panel. It also makes the installation area of ​​the second support structure 120 smaller. The space enclosed by the side of the second support structure 120 away from the bend 142 and the surface of the first support structure 110 away from the light-emitting surface of the display panel is larger, which can reserve more installation space for the whole machine and help to reduce the size of the display device.

[0067] Referring to Figures 12 and 13, by way of example, the area formed by the side of the second support structure 120 away from the bending portion 142 and the surface of the first support structure 110 away from the light-emitting surface of the display panel is gradually smaller along the depth in the direction perpendicular to the substrate 140 from the end near the bending portion 142 to the end away from the bending portion 142.

[0068] Referring to Figures 7 and 8, in some embodiments, the thickness of the second support structure 120 gradually increases and then gradually decreases along the direction from the end near the bending portion 142 to the end away from the bending portion 142. In this way, the second support structure 120 can adapt to the shape of the surface of the first support structure 110 away from the light-emitting surface of the display panel, and also makes the installation area of ​​the second support structure 120 larger, so that the second support structure 120 can provide a larger range of support for the bonding portion 143 and the flexible circuit board 175.

[0069] Referring to Figures 8 and 10, in some embodiments, the display panel 100 includes a barrier 160. The barrier 160 is located on the side of the first support structure 110 away from the light-emitting surface of the display panel, and the barrier 160 surrounds the outer periphery of the second support structure 120. The barrier 160 is annular. Thus, by setting the barrier 160, the second support structure 120 can be limited. For example, in the molding process of the second support structure 120 using dispensing, low-pressure injection molding, etc., the barrier 160 can effectively limit the overflow of uncured adhesive, ensuring that the second support structure 120 is molded within a preset area, so that the second support structure 120 can accurately match the support position of the electronic device 150. The display panel 100 may or may not have the barrier 160.

[0070] In some examples, the surface of the second support structure 120 facing away from the light-emitting surface of the display panel is configured as the support plane 123. Alternatively, a portion of the surface of the second support structure 120 facing away from the light-emitting surface of the display panel 100 is configured as the support plane 123.

[0071] Referring to Figures 5 and 20, in some embodiments, the enclosure 160 includes a first side surface 161 facing the second support structure 120, and the support plane 123 does not protrude beyond the first side surface 161 along the direction from the light-emitting surface of the display panel 100 to the first support structure 110. In other words, the support plane 123 is flush with the end of the first side surface 161 opposite to the light-emitting surface of the display panel 100, or the first side surface 161 protrudes beyond the support plane 123 along the direction from the light-emitting surface of the display panel 100 to the first support structure 110. This results in a smaller thickness of the second support structure 120 corresponding to the support plane 123, which helps to reserve more installation space for the entire device and reduces the size of the display device. For example, the light-emitting surface of the display panel 100 can be the surface of the cover plate 171 opposite to the first support structure 110.

[0072] Referring to Figures 5 and 20, in some embodiments, the surface of the second support structure 120 on the side opposite to the light-emitting surface of the display panel 100 does not protrude beyond the first side surface 161 along the direction from the light-emitting surface to the first support structure 110. This results in a smaller thickness of the second support structure 120, which helps to reserve more installation space for the entire device and reduces the size of the display device.

[0073] Referring to Figure 20, in an embodiment where the surface of the second support structure 120 facing away from the light-emitting surface is flush with the end of the first side 161 facing away from the light-emitting surface, there is a gap d6 between the outer edge of the surface of the second support structure 120 facing away from the light-emitting surface and the outer edge of the surface of the enclosure 160 facing away from the light-emitting surface. This gap d6 can reserve more installation space for the whole machine, which is beneficial to reduce the size of the display device.

[0074] For example, referring to Figures 2 and 4, before the bending portion 142 is bent, a barrier 160 is provided on the side of the first support structure 110 away from the light-emitting surface of the display panel 100. The first side 161 of the barrier 160 and the surface of the first support structure 110 away from the light-emitting surface of the display panel 100 together form a receiving groove 162. Then, referring to Figure 5, adhesive is applied to the receiving groove 162 to fill the curved bottom wall of the receiving groove 162. After the adhesive cures, the second support structure 1 is formed. 20. The support plane 123 of the second support structure 120 can be at the same height as the first side 161 (i.e., the support plane 123 can be flush with the end of the first side 161 that is away from the light-emitting surface of the display panel 100) or not at the same height. Then, referring to FIG8, the bending part 142 is bent, and the first electronic device 150a of the binding part 143 and the second electronic device 150b of the flexible circuit board 175 are attached to the support plane 123 to prevent the rigid electronic device 150 from being deformed and damaged.

[0075] For example, before the enclosure 160 is installed on the side of the first support structure 110 away from the light-emitting surface of the display panel 100, the first support structure 110 and the display module 130 are not assembled. At this time, the first support structure 110 can be in a planar state (Figure 18). Then, after the enclosure 160 is installed on the first support structure 110, the first support structure 110 and the display module 130 are assembled. At this time, the first support structure 110 is in a bent state (Figure 19). In this way, the first support structure 110 is in a planar state during the process of installing the enclosure 160 on the first support structure 110, which can reduce the difficulty of installing the enclosure 160 on the first support structure 110.

[0076] For example, the enclosure 160 and the first support structure 110 can be bonded together using an adhesive layer.

[0077] Referring to Figure 9, in some embodiments, a portion of the enclosure 160 is disposed close to the bending portion 142. In this way, a portion of the bonding portion 143 can be disposed on the side of the portion of the enclosure 160 away from the light-emitting surface, so that the portion of the enclosure 160 is located between the bonding portion 143 and the substrate 140 of the display area AA. This can increase the number of film layers between the bonding portion 143 and the substrate 140 of the display area AA, which is beneficial to increase the bending radius of the bending portion 142, thereby reducing the bending stress of the bending portion 142. In addition, by having the portion of the enclosure 160 and the bonding portion 143 overlap in a direction perpendicular to the substrate 140, the area of ​​the display panel 100 occupied by the portion of the enclosure 160 and the bonding portion 143 can be reduced.

[0078] For example, the material of the enclosure 160 includes at least one of polyimide (PI) and polyethylene terephthalate (PET).

[0079] It should be noted that the enclosure 160 can also be formed by the first support structure 110. For example, the first support structure 110 may include a first film layer, which is the film layer in the first support structure 110 furthest from the first curved surface 141. The thickness of the edge of the first film layer may be greater than the thickness of the rest of the first film layer, so that the edge of the first film layer forms an enclosure 160 that protrudes beyond the rest of the first film layer. The material of the first film layer may include at least one of PI and PET. The first film layer can be a PET film layer or a PI film layer.

[0080] Referring to Figure 20, exemplarily, the dimension d5 of the enclosure 160 in the direction perpendicular to the substrate 140 is greater than or equal to 0.25 mm. This avoids the enclosure 160 having an excessively small dimension d5 in the direction perpendicular to the substrate 140, thereby improving the limiting effect of the enclosure 160 on the second support structure 120. For example, the dimension d5 of the enclosure 160 in the direction perpendicular to the substrate 140 can be any value greater than 0.25 mm, such as 0.25 mm, 0.27 mm, 0.29 mm, 0.30 mm, 0.32 mm, 0.35 mm, or 0.25 mm.

[0081] Referring to Figure 20, for example, the distance d4 between the surface of the enclosure 160 closest to the second support structure 120 and the surface furthest from the second support structure 120 ranges from 1mm to 3mm, meaning the width of the enclosure 160 ranges from 1mm to 3mm. This avoids the enclosure 160 being too narrow, which helps improve its structural strength. Additionally, it prevents the enclosure 160 from being too wide, thus avoiding occupying too much area of ​​the display panel 100. For example, the width of the enclosure 160 can be 1mm, 1.5mm, 2.0mm, 2.5mm, 3mm, or any value between 1mm and 3mm.

[0082] Referring to Figure 20, for example, the distance d3 between the surface of the enclosure 160 near the light-emitting surface and the surface away from the light-emitting surface ranges from 30μm to 100μm, that is, the thickness of the enclosure 160 ranges from 30μm to 100μm. This avoids the enclosure 160 being too thin, which helps to improve the limiting effect of the first side 161 on the second support structure 120. In addition, it avoids the enclosure 160 being too thick, which helps to make the display panel 100 thinner and lighter. For example, the thickness of the enclosure 160 can be 30μm, 50μm, 70μm, 90μm, 100μm or any value between 30μm and 100μm.

[0083] Referring to Figure 8, exemplarily, the distance d7 between the orthographic projection of the enclosure 160 in the direction perpendicular to the substrate 140 and the orthographic projection of the electronic device 150 in the direction perpendicular to the substrate 140 is greater than or equal to 0.5 mm. The orthographic projection of the enclosure 160 in the direction perpendicular to the substrate 140 can be located on the outer periphery of the orthographic projection of the electronic device 150 in the direction perpendicular to the substrate 140. In this way, the distance between the outer contour of the orthographic projection of the second support structure 120 in the direction perpendicular to the substrate 140 and the orthographic projection of the electronic device 150 in the direction perpendicular to the substrate 140 is relatively large, which is beneficial to setting the support plane 123 to be larger and to providing a larger range of planar support for the electronic device 150.

[0084] For example, the second support structure 120 is formed using low-pressure injection molding, dispensing, foaming, or 3D printing. For instance, referring to Figures 5 and 11, before the bending portion 142 is bent, the second support structure 120 can be formed on the first support structure 110 using low-pressure injection molding, dispensing, foaming, or 3D printing; or, referring to Figure 15, it can be formed on the side of the flexible circuit board 175 and / or the bonding portion 143 opposite to the electronic device 150 using 3D printing. Then, referring to Figures 8, 13, and 16, the bending portion 142 is bent to position the second support structure 120 between the first support structure 110, the bonding portion 143, and the flexible circuit board 175.

[0085] In embodiments where the second support structure 120 is formed using low-pressure injection molding, dispensing, foaming, or 3D printing, for example, when the second support structure 120 is formed on the first support structure 110, the display panel 100 includes a third adhesive layer 183 located between the bonding portion 143 and the second support structure 120 to bond the bonding portion 143 and the second support structure 120. Additionally, the display panel 100 includes a fourth adhesive layer 184 located between the flexible circuit board 175 and the second support structure 120 to bond the flexible circuit board 175 and the second support structure 120. The third adhesive layer 183 and the fourth adhesive layer 184 can be spaced apart. As another example, when the second support structure 120 is formed on the bonding portion 143 and / or the flexible circuit board 175, an adhesive layer can be provided between the second support structure 120 and the first support structure 110 to bond the first support structure 110 and the second support structure 120.

[0086] In other embodiments, referring to Figures 5 and 11, the second support structure 120 can be double-sided adhesive. Before bending the bending portion 142, the second support structure 120 made of double-sided adhesive is bonded to the first support structure 110. Alternatively, referring to Figure 15, the second support structure 120 made of double-sided adhesive is bonded to the flexible circuit board 175 and / or the bonding portion 143 on the side away from the electronic device 150. Then, referring to Figures 8, 13, and 16, the bending portion 142 is bent to place the second support structure 120 between the first support structure 110, the bonding portion 143, and the flexible circuit board 175. At this time, since the second support structure 120 is double-sided adhesive, it is not necessary to provide a separate adhesive layer between the second support structure 120 and the first support structure 110, nor is it necessary to provide a separate adhesive layer between the second support structure 120 and the bonding portion 143 and the flexible circuit board 175 (for example, it is not necessary to provide a third adhesive layer 183 and a fourth adhesive layer 184).

[0087] Referring to Figures 5-7, in the embodiment with the enclosure 160, the second support structure 120 can be formed using low-pressure injection molding, dispensing, foaming, or 3D printing. Figures 5-7 show schematic diagrams with the enclosure 160 installed and the bent portion 142 before bending. Figures 8-10 show schematic diagrams with the enclosure 160 installed and the bent portion 142 after bending.

[0088] In embodiments without the enclosure 160, the second support structure 120 can be formed using 3D printing. The 3D printing process does not rely on the enclosure 160 to limit the second support structure 120. During the forming process, the material of the second support structure 120 accumulates within a preset range, eliminating the need for the physical enclosure 160 to restrict the material and thus saving the design of the enclosure 160.

[0089] In Figures 11 and 12, before the bending portion 142 is bent, the second support structure 120 is formed on the first support structure 110. In Figure 15, before the bending portion 142 is bent, the second support structure 120 is formed on the bonding portion 143 and the flexible circuit board 175. In Figures 13, 14, 16, and 17, the area of ​​the second support structure 120 in the orthographic projection perpendicular to the substrate direction is relatively small, and the end of the second support structure 120 away from the bending portion 142 is located near the boundary of the flexible circuit board 175 on the side away from the bending portion 142. This allows for more installation space to be reserved for the entire device. Referring to Figure 8, the area of ​​the second support structure 120 in the orthographic projection perpendicular to the substrate direction is relatively large, and the end of the second support structure 120 away from the bending portion 142 extends significantly beyond the boundary of the flexible circuit board 175 on the side away from the bending portion 142.

[0090] Referring to Figure 21, in the embodiment where the second support structure 120 is manufactured using low-pressure injection molding, the dimensional accuracy of the second support structure 120 can be improved through low-pressure injection molding. During low-pressure injection molding, the display panel 100 can be placed on the first tool 210, and the surface of the first tool 210 facing the display panel 100 is in contact with the cover plate 171, thus providing support for the display panel 100. A second tool 220 is provided on the side of the enclosure 160 away from the first tool 210. The second tool 220 has an injection port for injecting adhesive into the receiving groove 162.

[0091] Referring to Figures 8 and 9, in some embodiments, the display panel 100 may include a support protective layer 174 for supporting the display module 130. The support protective layer 174 is attached to the display module 130. Part of the support protective layer 174 is located between the first support structure 110 and the light-emitting surface of the display panel 100, and part of the support protective layer 174 is located between the first support structure 110 and the bonding portion 143. The support protective layer 174 has an opening, which is corresponding to at least a portion of the bent portion 142. That is, at least a portion of the bent portion 142 is not provided with the support protective layer 174 to prevent the support protective layer 174 from affecting the bending of the bent portion 142.

[0092] Referring to Figures 8 and 9, in some embodiments, the first support structure 110 includes a first adhesive layer 111 facing the light-emitting surface of the display panel 100, the first adhesive layer 111 being used to bond the first support structure 110 to an adjacent support protective layer 174.

[0093] Referring to Figures 8 and 9, in some embodiments, the first support structure 110 includes a buffer layer 112. The buffer layer 112 is located on the side of the first adhesive layer 111 that is away from the light-emitting surface of the display panel 100. The buffer layer 112 can be used to buffer the impact of external forces on the display panel 100 and improve the drop resistance of the display panel 100.

[0094] For example, the buffer layer 112 can be foam.

[0095] Referring to Figures 8 and 9, in some embodiments, the first support structure 110 includes a metal layer 113. The metal layer 113 is located on the side of the buffer layer 112 away from the first adhesive layer 111. The metal layer 113 and the buffer layer 112 are stacked. The metal layer 113 can be used to dissipate heat generated during the operation of the display panel 100, and can also improve the mechanical strength of the first support structure 110, providing better support for the display panel 100 and enhancing the overall structural strength of the display panel 100. In addition, the metal layer 113 can be used to connect to the grounding line in the display module 130 to release static electricity from the display panel 100 and reduce the adverse effects of static electricity on the display panel 100.

[0096] For example, an adhesive layer may be provided between the metal layer 113 and the buffer layer 112 to bond the metal layer 113 and the buffer layer 112.

[0097] For example, the first support structure 110 may be a composite membrane (SCF).

[0098] Referring to Figures 8 and 9, in some embodiments, the display panel 100 includes a polarizer 173 located on the side of the first support structure 110 facing the light-emitting surface of the display panel 100. The polarizer 173 can be used to reduce reflected light from the external environment and improve the contrast of the display panel 100.

[0099] Referring to Figures 8 and 9, in some embodiments, the display panel 100 includes a cover plate 171 (lens) located on the side of the polarizer 173 facing away from the display module 130. The cover plate 171 is used to protect the display module 130 from scratches by the user. For example, the surfaces of the cover plate 171 on both sides along the direction perpendicular to the substrate 140 are curved, allowing the cover plate 171 to achieve a uniform thickness design, which is beneficial for achieving better optical effects.

[0100] Referring to Figures 8 and 9, in some embodiments, the display panel 100 includes a second adhesive layer 172 located between the cover plate 171 and the polarizer 173. The second adhesive layer 172 is used to bond the cover plate 171 and the polarizer 173 together. The adhesive layer provided in this application embodiment can be an adhesive, used to provide adhesive force to the film layers located on both sides of the adhesive layer, so as to bond the film layers on both sides together.

[0101] For example, the second adhesive layer 172 may be formed of optically transparent adhesive.

[0102] Referring to Figures 8 and 9, in some embodiments, the display panel 100 includes a protective layer 176, which is disposed at least corresponding to the bending portion 142, and the protective layer 176 is located on the side of the display module 130 away from the first support structure 110.

[0103] It should be noted that the surfaces of the cover plate 171, the second adhesive layer 172, the polarizer 173, the display module 130 of the display area AA, the support and protective layer 174 of the display area AA, the first support structure 110 and the enclosure 160 along both sides of the direction perpendicular to the substrate 140 can all be curved surfaces.

[0104] For example, the display panel 100 may include an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, etc. This application embodiment uses an OLED display panel as an example for illustration.

[0105] The following describes the display device provided in the embodiments of this application.

[0106] This application provides a display device that includes the display panel 100 in any of the above embodiments. Therefore, this display device also possesses the beneficial effects of the display panel 100 in the above embodiments. The similarities can be understood by referring to the above explanation of the display panel 100, and will not be repeated here.

[0107] For example, the display device can be a mobile phone or any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, industrial control equipment, medical display screen, touch interactive terminal, etc. The embodiments of this application do not make any special limitations on this.

[0108] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area surrounding the display area, and also includes a display module. The display module includes a substrate, at least in the display area, having a first curved surface that protrudes towards the light-emitting surface of the display panel; a first support structure and a second support structure, the first support structure being located on the side of the substrate away from the light-emitting surface, and the second support structure being located on the side of the first support structure away from the substrate. The orthographic projection area of ​​the second support structure in the direction perpendicular to the substrate is less than or equal to the orthographic projection area of ​​the first support structure in the direction perpendicular to the substrate. At least part of the side of the second support structure facing the first support structure is an arc-shaped structure, and the side of the second support structure away from the first support structure includes at least one support plane. The display panel includes at least one electronic device located on the side of the second support structure away from the first support structure. The at least one support plane and the at least one electronic device are correspondingly arranged, and the electronic device is located within the corresponding support plane range and is arranged parallel to the support plane.

2. The display panel according to claim 1, characterized in that, The display panel includes a flexible circuit board, and the substrate includes a bending portion and a bonding portion. The bending portion is connected between the bonding portion and the substrate located in the display area. The bonding portion and the flexible circuit board are located on the side of the second support structure opposite to the light-emitting surface of the display panel, and the bonding portion and the flexible circuit board are connected. There are multiple electronic devices, including first electronic devices and second electronic devices arranged at intervals. The first electronic devices are disposed in the bonding portion, and the second electronic devices are disposed in the flexible circuit board. The first electronic devices and the second electronic devices are located within the corresponding support plane area.

3. The display panel according to claim 2, characterized in that, There is one supporting plane, and the first electronic device and the second electronic device are located within the same supporting plane.

4. The display panel according to claim 2, characterized in that, The support planes are multiple, including a first support plane and a second support plane. The first support plane and the second support plane are spaced apart and parallel to each other. The second support structure includes a first sub-support structure and a second sub-support structure that are spaced apart. The first support plane is located on the side of the first sub-support structure that is away from the first support structure, and the second support plane is located on the side of the second sub-support structure that is away from the first support structure. The first electronic device is located within the range of the first support plane, and the second electronic device is located within the range of the second support plane.

5. The display panel according to claim 4, characterized in that, The first support plane and the second support plane are coplanar, or the first support plane and the second support plane are not coplanar.

6. The display panel according to any one of claims 2-5, characterized in that, The orthographic projection of the second support structure in the direction perpendicular to the substrate is spaced apart from the orthographic projection of the bent portion in the direction perpendicular to the substrate.

7. The display panel according to any one of claims 2-5, characterized in that, The thickness of the second support structure gradually increases from the end near the bend to the end away from the bend.

8. The display panel according to any one of claims 2-5, characterized in that, The thickness of the second support structure gradually increases and then gradually decreases along the direction from the end near the bend to the end away from the bend.

9. The display panel according to any one of claims 2-5, characterized in that, The display panel includes a enclosure located on the side of the first support structure away from the light-emitting surface of the display panel, and surrounding the outer periphery of the second support structure.

10. The display panel according to claim 9, characterized in that, The enclosure includes a first side facing the second support structure, and the support plane does not protrude beyond the first side along the direction from the light-emitting surface to the first support structure.

11. The display panel according to claim 9, characterized in that, Part of the enclosure is positioned near the bend.

12. The display panel according to claim 9, characterized in that, The material of the enclosure includes at least one of polyimide and polyethylene terephthalate.

13. The display panel according to claim 9, characterized in that, The size of the enclosure in the direction perpendicular to the substrate is greater than or equal to 0.25 mm; and / or, the distance between the surface of the enclosure near the second support structure and the surface away from the second support structure is 1 mm to 3 mm; and / or, the distance between the surface of the enclosure near the light-emitting surface and the surface away from the light-emitting surface is 30 μm to 100 μm; and / or, the distance between the orthographic projection of the enclosure in the direction perpendicular to the substrate and the orthographic projection of the electronic device in the direction perpendicular to the substrate is greater than or equal to 0.5 mm.

14. The display panel according to any one of claims 1-5, characterized in that, The second support structure is formed by low-pressure injection molding, dispensing, foaming or 3D printing.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1-14.