Chip bonding equipment

Abstract

The invention provides chip bonding equipment, and belongs to the technical field of semiconductor device bonding. The chip bonding equipment comprises a first mounting platform and a second mounting platform which are oppositely arranged, the wafer holding assembly is inversely mounted on the first mounting platform and is used for holding a wafer and enabling a to-be-bonded surface of the wafer to face downwards; the at least two pressure head modules are respectively used for holding chips, and the pressure head modules are mounted on the second mounting platform through the linear motion modules; the visual identification unit is used for identifying the relative position of the chip and the wafer; and the control unit controls the linear motion module to move according to the relative position of the chip and the wafer identified by the visual identification unit, so that the chip held by the pressure head module is bonded to the target position of the wafer, and high-productivity and high-yield chip-wafer bonding can be realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor materials and devices, and in particular to a dual-head chip bonding device. Background Technology

[0002] Chip-wafer bonding technology is an advanced packaging technology that precisely aligns a tested and selected single qualified chip with a wafer and achieves electrical and mechanical connections. It can improve the overall product yield, provide flexible heterogeneous integration, and adapt to advanced packaging and 3D stacking scenarios.

[0003] There is a lack of bonding equipment for high-capacity, high-yield chip-wafer bonding technology. Summary of the Invention

[0004] This invention provides a dual-head chip bonding device to solve the problem of the lack of high-capacity, high-yield chip-wafer bonding equipment in the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution: A chip bonding apparatus includes: a first mounting platform and a second mounting platform disposed opposite to each other; A wafer holding assembly is mounted upside down on the first mounting platform to hold the wafer and keep the wafer with the bonding surface facing down; At least two pressure head modules are used to hold the chip, and the pressure head modules are mounted on the second mounting platform via a linear motion module; A visual recognition unit is used to identify the relative position of the chip and the wafer; The control unit controls the linear motion module to move according to the relative position of the chip and the wafer identified by the vision recognition unit, so that the chip held by the pressure head module is bonded to the target position of the wafer.

[0006] As an alternative to chip bonding equipment, the wafer holding assembly includes a wafer chuck, the surface of which can selectively form an adsorption force to adsorb the non-bonded surface of the wafer.

[0007] As an alternative to a chip bonding device, the wafer holding assembly includes a hinged first mounting plate and a second mounting plate; The wafer chuck is disposed on the first mounting plate; The second mounting plate is mounted on the first mounting platform; The first mounting plate and the second mounting plate are hinged together by a six-axis displacement platform.

[0008] As an alternative solution for chip bonding equipment, the linear motion module includes at least two movable frames, which are respectively mounted on the second mounting platform via the first motion module; At least two adapter plates are respectively connected to the two movable frames via a second motion module; At least two third motion modules are respectively installed on the two adapter plates.

[0009] As an alternative solution for chip bonding equipment, the first motion module is used to drive the moving frame to move along the X direction; The second motion module is used to drive the adapter plate to move along the Y direction; The third motion module is used to drive the pressure head module to move along the Z direction.

[0010] As an alternative solution for a chip bonding device, a rotary module is also included, which is mounted on the third motion module; The pressure head module is installed on the rotating module.

[0011] As an alternative to chip bonding equipment, the visual recognition unit includes a bracket and a coaxial camera; The coaxial camera is mounted on the bracket via a mobile platform; The bracket is mounted on the movable frame.

[0012] As an alternative to chip bonding equipment, the mobile platform is used to drive the coaxial camera to move along the XY plane; The coaxial camera is used to identify the positional deviation between the second mark of the chip held by the pressure head module and the first mark of the wafer held by the wafer holding assembly.

[0013] As an alternative to chip bonding equipment, the visual recognition unit includes a visual camera; The vision camera is integrated into the pressure head module.

[0014] As an alternative to chip bonding equipment, the vision camera includes a transmitted light camera or a reflected light camera.

[0015] As an alternative to chip bonding equipment, the transmitted light camera includes an infrared camera.

[0016] As an alternative to chip bonding equipment, the reflected light camera includes a visible light camera.

[0017] As an alternative to chip bonding equipment, the imaging optical path of the vision camera can pass through the chip held by the indenter module; or the imaging optical path of the vision camera can pass through the third mark of the indenter module.

[0018] As an alternative solution for chip bonding equipment, the imaging optical path of the vision camera can simultaneously cover the third mark of the pressure head module and the wafer held by the wafer holding component; or the imaging optical path of the vision camera can respectively cover the third mark of the pressure head module and the wafer held by the wafer holding component.

[0019] As an alternative solution for chip bonding equipment, the visual recognition unit includes two components; one of them includes a bracket, a moving platform, and a coaxial camera, wherein the coaxial camera is mounted on the bracket via the moving platform, and the bracket is mounted on one of the moving frames. Another of the aforementioned visual recognition units includes a transmitted light camera, which is integrated into the pressure head module that does not have a coaxial camera.

[0020] As an alternative solution for chip bonding equipment, the pressure head module includes a pressure part and a body, wherein the pressure part is movable relative to the body at least in the X direction; The visual camera includes a reflective light camera; The moving distance of the pressing part is at least sufficient to ensure that the imaging optical path of the reflected light camera can simultaneously cover the third mark of the pressing head module and the wafer held by the wafer holding assembly; or can only cover the wafer held by the wafer holding assembly.

[0021] Beneficial effects: This invention provides a chip bonding device that adopts a bottom-up bonding direction, with the large wafer to be bonded facing downwards. Contamination particles generated in the environment will not fall onto the wafer to be bonded due to their own gravity, thereby reducing the risk of contamination caused by dust and providing a basic environmental guarantee for the manufacturing of high-yield products.

[0022] Because the chip is bonded from bottom to top, the chip does not need to be flipped from the chip removal station to the bonding station, which reduces one process. This not only increases the bonding capacity per unit time, but also optimizes and eliminates the flipping device used to flip the chip, reducing equipment costs.

[0023] The equipment is equipped with at least two independent pressure head modules, each with its own independent motion module, which enables parallel pickup and bonding operations of at least two chips, improving the bonding output per unit time and significantly increasing the equipment's capacity.

[0024] Furthermore, when the two pressure head modules of the device are equipped with a coaxial camera and an infrared camera respectively, the alignment and bonding of light-transmitting and non-light-transmitting materials can be performed. At least two materials can be bonded on the same wafer in the same device, making heterogeneous integration flexible and efficient. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a frontal schematic diagram of the device in one embodiment of this application.

[0027] Figure 2 This is a side view of the overall device in one embodiment of this application.

[0028] Figure 3 This is a schematic diagram of the coaxial camera layout in one embodiment of this application.

[0029] Figure 4 This is a frontal view of the device in another embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the optical path of the reflected light camera in the embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the optical path of the transmission light camera in the embodiments of this application.

[0032] Figure 7 This is a schematic diagram of the optical path of another transmission light camera in the embodiments of this application.

[0033] Figure 8 This is a front view of the device with two visual recognition units arranged simultaneously in the embodiments of this application.

[0034] Figure 9 This is a schematic diagram of the wafer holding assembly provided by the present invention.

[0035] Figure label: 100: Wafer; 101: First marker; 200: Chip; 201: Second marker; 1: First installation platform; 2: Second installation platform; 3: Wafer holding assembly; 31: Wafer chuck; 32: First mounting plate; 33: Second mounting plate; 34: Six-axis displacement platform; 4: Press head module; 41: Third mark; 42: Pressing part; 43: Body; 5: Linear motion module; 51: Moving frame; 52: First motion module; 53: Adapter plate; 54: Second motion module; 55: Third motion module; 6: Visual recognition unit; 61: Support; 62: Coaxial camera; 63: Moving platform; 64: Transmitted light camera; 65: Reflected light camera; 7: Rotating module. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0037] The following is combined Figures 1-9 The present invention describes a chip bonding apparatus comprising: a first mounting platform 1 and a second mounting platform 2 disposed opposite to each other; a wafer holding assembly 3 invertedly mounted on the first mounting platform 1 for holding a wafer 100 with the bonding surface of the held wafer 100 facing downwards; at least two pressure head modules 4 for holding chips 200 respectively, the pressure head modules 4 being mounted on the second mounting platform 2 via a linear motion module 5; a vision recognition unit 6 for recognizing the relative position of the chips 200 and the wafer 100; and a control unit controlling the linear motion module 5 to move according to the relative position of the chips 200 and the wafer 100 recognized by the vision recognition unit 6, so that the chips 200 held by the pressure head modules 4 can be pressed to the target position of the wafer 100.

[0038] During the bonding process between chip 200 and wafer 100, multiple chips 200 need to be bonded onto the entire wafer 100 multiple times. By inverting the wafer holding component 3 onto the first mounting platform 1, so that the bonding surface of the wafer 100 is facing down, combined with the bottom-up bonding direction, gravity naturally guides the bonding process, preventing particles such as environmental particles and particles generated by friction of the moving module from falling onto the bonding surface of the wafer 100, thus reducing the risk of contamination by particles falling onto the bonding surface of the wafer 100.

[0039] Secondly, at least two independently controlled pressure head modules 4 are set up, in conjunction with corresponding linear motion modules 5, to support the cross or parallel bonding of at least two chips 200, which can improve the efficiency of the bonding operation. Before bonding, a closed-loop control is formed by the vision recognition unit 6, the control unit, and the linear motion module 5. Through high-precision recognition of the position of the chip 200 and the wafer 100 and real-time motion feedback, it is ensured that each chip 200 can be accurately aligned and pressed onto the target position of the wafer 100.

[0040] like Figure 9As shown, the wafer holding assembly 3 includes a wafer chuck 31. The surface of the wafer chuck 31 can selectively form an adsorption force to adsorb the unbonded surfaces of the wafer 100 and selectively maintain the relative position of the wafer 100 and the wafer chuck 31. The surface of the wafer chuck 31 can selectively form an adsorption force according to process requirements, which can stably adsorb the unbonded surfaces of the wafer 100 and ensure that it will not fall off or shift when inverted.

[0041] Optionally, the wafer chuck 31 is configured to fix the wafer 100 by vacuum adsorption or electrostatic adsorption. Vacuum adsorption achieves tight adhesion of the wafer 100 through negative pressure, while electrostatic adsorption uses an electrostatic field to fix the wafer 100. Both methods can provide a stable and reliable clamping effect, avoid displacement of the wafer 100 during bonding, and ensure the accuracy of bonding and visual positioning.

[0042] In this embodiment, the wafer chuck 31 has a limiting protrusion on its surface. The limiting protrusion can abut against the sidewall of the wafer 100, thereby limiting the wafer 100 and ensuring that the wafer 100 is in an accurate position.

[0043] like Figure 9 As shown, the wafer holding assembly 3 includes a hinged first mounting plate 32 and a second mounting plate 33; a wafer chuck 31 is disposed on the first mounting plate 32; the second mounting plate 33 is mounted on the first mounting platform 1; the first mounting plate 32 and the second mounting plate 33 are hinged together by a six-axis displacement platform 34. The hinged structure of the dual mounting plates and the six-axis displacement platform 34 of the wafer holding assembly 3 enables multi-degree-of-freedom active adjustment of the wafer 100's orientation. This allows the wafer chuck 31 to compensate for its spatial angle and position even after mounting, thereby correcting any planar deviations or mounting tilts of the wafer 100 itself. This ensures that the surface of the wafer 100 to be bonded remains perpendicular to the pressure head's movement axis, providing the necessary planar reference for subsequent multi-chip 200 synchronous bonding, directly improving the overall bonding positional accuracy and process consistency.

[0044] The six-axis displacement platform 34 is an existing motion mechanism with six degrees of freedom for translation and rotation. Its specific structure and driving method are existing technologies and will not be described in detail here. The core function of this design is to actively compensate for the orientation deviation of the working plane caused by the deformation of the wafer 100 itself or installation errors, ensuring that the surface of the wafer 100 to be bonded remains perpendicular to the axis of the pressure head, thereby establishing a stable and reliable reference plane for the synchronous high-precision bonding of multiple chips 200.

[0045] like Figure 2As shown, the linear motion module 5 includes at least two movable frames 51, each mounted on the second mounting platform 2 via a first motion module 52. The first motion module 52 drives the two movable frames 51 to move along the X direction. At least two adapter plates 53 are connected to the two movable frames 51 via a second motion module 54, each driving the two adapter plates 53 to move along the Y direction. At least two third motion modules 55 are mounted on the two adapter plates 53, each driving the two pressure head modules 4 to move along the Z direction. The linear motion module 5, through the series configuration of the first motion module 52, the second motion module 54, and the third motion module 55, provides each pressure head module 4 with independent driving capabilities along the X, Y, and Z motion axes. The first motion module 52 drives the movable frames 51 to move along the X axis, the second motion module 54 drives the adapter plates 53 to move along the Y axis, and the third motion module 55 drives the pressure head modules 4 to move along the Z axis. This motion decomposition and combination method enables each pressure head module 4 to independently perform motion and operation at different coordinate positions on the wafer 100 plane, with no interference between motion paths, thereby realizing parallel operation of multiple pressure head modules 4, significantly improving the operating efficiency and capacity of the equipment.

[0046] The first motion module 52, the second motion module 54 and the third motion module 55 can be selected from linear motor modules, precision ball screw slides or synchronous belt linear modules, etc., which are all existing mature solutions, and will not be described in detail here.

[0047] In this embodiment, the chip bonding apparatus further includes a rotation module 7, which is mounted on the third motion module 55; the pressure head module 4 is mounted on the rotation module 7. The rotation module 7 adds a degree of freedom of rotation about the Z-axis to the pressure head module 4, which already possesses translational capabilities along the X, Y, and Z axes. This rotational degree of freedom can be directly used to correct the angular deviation of the chip 200 in the horizontal plane, ensuring that its marking direction is precisely aligned with the target position on the wafer 100.

[0048] The rotary module 7 can be implemented using existing rotary drive mechanisms such as servo motors with reducers, direct-drive torque motors, or stepper motors. These are mature technologies and will not be elaborated upon here.

[0049] In this embodiment, the pressure head module 4 includes a support plate, which can adsorb and fix the chip 200.

[0050] Example 1: like Figures 1-3As shown, the visual recognition unit 6 includes a bracket 61 and a coaxial camera 62; the coaxial camera 62 is mounted on the bracket 61 via a moving platform 63; the bracket 61 is mounted on a moving frame 51. The moving platform 63 is used to drive the coaxial camera 62 to move in the XY direction; the coaxial camera 62 is used to identify the positional deviation between the second mark 201 of the chip 200 held by the pressure head module 4 and the first mark 101 of the wafer 100 held by the wafer holding assembly 3. By mounting at least two sets of visual recognition units 6 on two moving frames 51 respectively, the moving platform 63 drives the coaxial camera 62 to move in the XY plane, so that it can be aligned with the second mark 201 of the chip 200 and the first mark 101 of the wafer 100 respectively; the coaxial camera 62 directly acquires the marked images on the chip 200 and the wafer 100 and calculates the positional deviation. Setting up two sets of visual recognition units 6 can simultaneously and independently recognize the markings on the two sets of chips 200 and wafers 100 without waiting for each other or sharing the same visual path, thereby shortening the alignment time in the poor or parallel bonding process of chip 200 and improving the overall operation efficiency.

[0051] In this embodiment, the second mark 201 is disposed on the bonding surface of the chip 200, and usually two are symmetrically disposed. Correspondingly, the first mark 101 is disposed on the bonding surface of the wafer 100, and two first marks 101 are disposed at the positions corresponding to the second mark 201.

[0052] The coaxial camera 62 is a vision component for high-precision optical positioning, characterized by its illumination and imaging optical paths being located on the same axis. During operation, light emitted from the light source is reflected by a beam splitter and perpendicularly illuminates the marking surface of chip 200 or wafer 100. The light reflected from the marking returns along the same path, passes through the beam splitter, is collected by the imaging lens, and forms a clear image of the marking on the camera sensor. This system can simultaneously acquire high-contrast images of the markings on chip 200 and wafer 100, and identify the positional deviation between them using existing mature image processing algorithms, thereby providing precise visual feedback to the motion control system and achieving sub-micron level alignment accuracy.

[0053] The mobile platform 63 can independently drive the coaxial camera 62 to move in the XY plane when the pressure head module 4 is stationary. The mobile platform 63 can be implemented by existing linear motion mechanisms such as linear motor modules, precision lead screw slides or synchronous belt modules. These are mature technologies and will not be described in detail here.

[0054] like Figure 1 As shown, the two sets of visual recognition units 6 are symmetrically arranged. Taking one of the visual recognition units 6 as an example, the bonding steps are as follows: (1) The wafer 100 is fixed by the wafer chuck 31 of the wafer holding assembly 3, and the spatial orientation of the bonding surface of the wafer 100 is adjusted by the six-axis displacement platform 34 between the first mounting plate 32 and the second mounting plate 33 so that it reaches a horizontal state.

[0055] (2) Place the chip 200 to be bonded on the pressure head module 4 and fix it. Then, drive the pressure head module 4 to move in the X, Y and Z directions through the linear motion module 5, and adjust the angle of the chip 200 in combination with the rotation module 7 so that the chip 200 is roughly aligned with the target position on the wafer 100.

[0056] (3) Drive the moving platform 63 of the visual recognition unit 6 to move the coaxial camera 62 to the target area between the chip 200 and the wafer 100 that has been roughly aligned, so as to ensure that the first mark 101 on the wafer 100 and the second mark 201 on the chip 200 are both within the field of view of the coaxial camera 62.

[0057] (4) The images of the first mark 101 and the second mark 201 are acquired synchronously by the coaxial camera 62, the positional deviation between them (including X and Y direction offsets and rotation angle deviations) is identified, and the calculated high-precision position information is fed back to the control unit of the device in real time.

[0058] (5) Based on the position deviation data from the visual feedback, the control unit drives the linear motion module 5 to perform micro-motion compensation in the X, Y, and Z axes, and controls the rotation module 7 to correct the angle of the chip 200, ultimately achieving precise alignment between the chip 200 and the target position of the wafer 100. After alignment, the control unit controls the pressure head module 4 to apply a preset pressure along the Z direction to complete the bonding of the chip 200 and the wafer 100.

[0059] Example 2: like Figures 4-7 As shown, the difference between Embodiment 2 and Embodiment 1 is that the visual recognition unit 6 includes a transmitted light camera 64; the transmitted light camera 64 is integrated into the pressure head module 4, and in this embodiment, the transmitted light camera 64 is an infrared camera. The imaging optical path of the transmitted light camera 64 can pass through the second mark 201 of the chip 200 held by the pressure head module 4. Figure 7 ); or the imaging optical path of the transmission light camera 64 can pass through the third mark 41 on the pressure head module 4 ( Figure 6Since infrared light can penetrate certain semiconductor materials such as silicon, when the chip 200 is fabricated with special marks that are sensitive to infrared light (such as etched patterns or metallized marks on the back of the chip 200), the transmission light camera 64 integrated on the pressure head module 4 can directly image the mark through the chip 200 material; at the same time, the transmission light camera 64 can also observe the corresponding mark on the surface of the wafer 100 through the specially designed third mark 41 (light-transmitting window) on the pressure head module 4, so as to achieve alignment between the pressure head module 4 and the wafer 100.

[0060] In this embodiment, the third mark 41 is a mark set on the non-chip 200 holding area on the pressure head module 4, and is usually set symmetrically as two.

[0061] In this embodiment, the detection principle of the transmission light camera 64 is based on the penetrability of infrared light of a specific wavelength band through semiconductor materials such as silicon. Specifically, the transmission light camera 64 uses infrared light imaging. When infrared light passes through the chip 200 and illuminates the wafer 100, the inherent marking features on the chip 200 and wafer 100 are recorded and captured by the transmission light camera 64 to form an image. By analyzing the relative positions of the first mark 101 of the wafer 100 and the second mark 201 of the chip 200 (at this time, the second mark 201 is set on the non-bonded surface of the chip 200, i.e., the back side) in the image using an image processing algorithm (this is prior art and will not be elaborated here), the positional deviation between the two can be calculated. Thus, high-precision penetrating alignment of the chip 200 and the wafer 100 can be achieved without relying on the optical features on the front side of the chip 200.

[0062] In this embodiment, the transmission light camera 64 is integrated into the pressure head module 4, and the pressure head module 4 is connected to the rotating module 7.

[0063] like Figure 4 As shown, the two sets of visual recognition units 6 are symmetrically arranged. Taking one of the visual recognition units 6 as an example, the bonding steps are as follows: (1) Fix the wafer 100 on the wafer holding assembly 3 and adjust the horizontal orientation of the bonding surface of the wafer 100 by the six-axis displacement platform 34.

[0064] (2) Pick up and fix the chip 200 onto the pressure head module 4, which integrates the transmission light camera 64. Through the linear motion module 5 and the rotation module 7, the chip 200 and the target bonding area on the wafer 100 are coarsely aligned. In some specific schemes, the coarse alignment process can be omitted by preset motion parameters of the linear motion module 5 and the rotation module 7.

[0065] (3) The imaging optical path of the transmission light camera 64 passes through the chip 200 and the wafer 100 respectively, and receives the relative position images marked on the chip 200 and the wafer 100.

[0066] (4) Analyze the infrared image using an image processing algorithm (this is existing technology and will not be described in detail here), calculate the positional deviation between the second marker 201 and the first marker 101, and feed back the calculated high-precision position information to the control unit of the device in real time.

[0067] (5) Based on the position deviation data from the visual feedback, the control unit drives the linear motion module 5 to perform micro-motion compensation in the X, Y, and Z axes, and controls the rotation module 7 to correct the angle of the chip 200, ultimately achieving precise alignment between the chip 200 and the target position of the wafer 100. After alignment, the control unit controls the pressure head module 4 to apply a preset pressure along the Z direction to complete the bonding of the chip 200 and the wafer 100.

[0068] In another embodiment, (3) above can also be achieved by using a transmission light camera 64, whose imaging light path passes through a specially designed third mark 41 (light-transmitting window) on the pressure head module 4 and the wafer 100, and receives an image of the relative position of the third mark 41 and the first mark 101. In this embodiment, the chip 200 and the third mark 41 are pre-positioned to ensure that the chip 200 and the third mark 41 are relatively fixed.

[0069] Example 3 like Figure 8 As shown, the difference between Embodiment 3 and Embodiments 1 and 2 is that the visual recognition unit 6 includes two units; one of them includes a bracket 61, a moving platform 63 and a coaxial camera 62, the coaxial camera 62 is mounted on the bracket 61 via the moving platform 63, and the bracket 61 is mounted on one of the moving frames 51; the other visual recognition unit 6 includes a transmissive light camera 64, which is integrated on the pressure head module 4 without the coaxial camera 62.

[0070] A hybrid vision alignment system was constructed by integrating two different types of vision recognition units 6 (a coaxial camera system 62 and a transmissive light camera system 64) into a single device and configuring them separately into two independent pressure head modules 4. This design enables the device to simultaneously possess two alignment capabilities: alignment of opaque materials based on the coaxial camera 62 and alignment of transmissive materials based on the transmissive light camera 64. It allows for the bonding of at least two materials onto the same wafer 100 within the same device, making heterogeneous integration flexible and efficient.

[0071] Example 4 like Figure 5 , Figure 8 As shown, the pressure head module 4 includes a pressure fitting part 42 and a body 43. The vision camera includes a reflective light camera 65, which is disposed on the body 43. The pressure fitting part 42 has a first position, namely... Figure 5The displayed position is such that the imaging optical path of the reflected light camera 65 can simultaneously cover the third mark 41 on the pressure head module 4 and the first mark 101 of the wafer 100 held by the wafer holding assembly 3. The relative distance between the third mark 41 and the first mark 101 held by the wafer holding assembly 3 determines whether the chip 200 and the wafer 100 are aligned. In this alignment method, the chip 200 has been positioned when it is fixed on the pressing part 42, that is, the relative position of the chip 200 and the pressing part 42 is determined.

[0072] In other embodiments, the crimping portion 42 is movable relative to the body 43 at least in the X direction, and has a second position different from the first position. In the second position, the crimping portion 42 moves out of the imaging optical path of the reflective light camera 65, so that the imaging optical path of the reflective light camera 65 only illuminates the wafer 100. This method is applicable when the first mark 101 is blocked by the crimping portion 42. For example, the distance between the line connecting the two corresponding sets of first marks 101 on the wafer 100 is less than the distance between the line connecting the two corresponding sets of third marks 41 on the crimping head module 4. When the crimping portion 42 is in the first position, the imaging optical path of the reflective light camera 65 cannot simultaneously cover the third mark 41 on the crimping head module 4 and the first mark 101 held by the wafer holding component 3.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip bonding apparatus, characterized in that, include: The first installation platform (1) and the second installation platform (2) are set relative to each other; A wafer holding assembly (3) is mounted upside down on the first mounting platform (1) to hold the wafer (100) and make the bonding surface of the wafer (100) face down; At least two pressure head modules (4) are used to hold the chip (200), and the pressure head modules (4) are mounted on the second mounting platform (2) via a linear motion module (5); A visual recognition unit (6) is used to identify the relative position of the chip (200) and the wafer (100); The control unit controls the linear motion module (5) to move according to the relative position of the chip (200) and the wafer (100) identified by the visual recognition unit (6), so that the chip (200) held by the pressure head module (4) is bonded to the target position of the wafer (100).

2. The chip bonding apparatus according to claim 1, characterized in that, The wafer holding assembly (3) includes a wafer chuck (31), the surface of which can selectively form an adsorption force to adsorb the unbonded surface of the wafer (100).

3. The chip bonding apparatus according to claim 2, characterized in that, The wafer holding assembly (3) includes a hinged first mounting plate (32) and a second mounting plate (33); The wafer chuck (31) is disposed on the first mounting plate (32); The second mounting plate (33) is mounted on the first mounting platform (1); The first mounting plate (32) and the second mounting plate (33) are hinged together by a six-axis displacement platform (34).

4. The chip bonding apparatus according to claim 1, characterized in that, The linear motion module (5) includes at least two movable frames (51), which are respectively mounted on the second mounting platform (2) via the first motion module (52); At least two adapter plates (53) are respectively connected to the two movable frames (51) via a second motion module (54); At least two third motion modules (55) are respectively installed on the two adapter plates (53).

5. The chip bonding apparatus according to claim 4, characterized in that, The first motion module (52) is used to drive the moving frame (51) to move along the X direction; The second motion module (54) is used to drive the adapter plate (53) to move along the Y direction; The third motion module (55) is used to drive the pressure head module (4) to move along the Z direction.

6. The chip bonding apparatus according to claim 5, characterized in that, It also includes a rotating module (7), which is mounted on the third motion module (55); The pressure head module (4) is installed on the rotating module (7).

7. The chip bonding apparatus according to claim 4, characterized in that, The visual recognition unit (6) includes a bracket (61) and a coaxial camera (62). The coaxial camera (62) is mounted on the bracket (61) via a mobile platform (63); The bracket (61) is mounted on the movable frame (51).

8. The chip bonding apparatus according to claim 7, characterized in that, The mobile platform (63) is used to drive the coaxial camera (62) to move along the XY plane; The coaxial camera (62) is used to identify the positional deviation between the second mark (201) of the chip (200) held by the pressure head module (4) and the first mark (101) of the wafer (100) held by the wafer holding assembly (3).

9. The chip bonding apparatus according to claim 1 or 4, characterized in that, The visual recognition unit (6) includes a visual camera; The vision camera is integrated into the pressure head module (4); Preferably, the vision camera includes a transmissive light camera (64) or a reflective light camera (65). Preferably, the transmitted light camera (64) includes an infrared camera; Preferably, the reflected light camera (65) includes a visible light camera.

10. The chip bonding apparatus according to claim 9, characterized in that, The imaging optical path of the visual camera can pass through the chip (200) held by the pressure head module (4); or the imaging optical path of the visual camera can pass through the third mark (41) of the pressure head module (4).

11. The chip bonding apparatus according to claim 10, characterized in that, The imaging optical path of the vision camera can simultaneously cover the third mark (41) of the pressure head module (4) and the wafer (100) held by the wafer holding component (3); or the imaging optical path of the vision camera can respectively cover the third mark (41) of the pressure head module (4) and the wafer (100) held by the wafer holding component (3).

12. The chip bonding apparatus according to claim 9, characterized in that, The visual recognition unit (6) includes two units; one of them includes a bracket (61), a moving platform (63) and a coaxial camera (62), the coaxial camera (62) is mounted on the bracket (61) via the moving platform (63), and the bracket (61) is mounted on one of the moving frames (51). Another of the visual recognition units (6) includes a transmissive light camera (64), which is integrated on the pressure head module (4) which does not have a coaxial camera (62).

13. The chip bonding apparatus according to claim 11, characterized in that, The pressure head module (4) includes a pressing part (42) and a body (43), wherein the pressing part (42) is movable relative to the body (43) at least in the X direction; The visual camera includes a reflective light camera (65); The moving distance of the pressing part (42) is at least sufficient to ensure that the imaging optical path of the reflected light camera (65) can simultaneously cover the third mark (41) of the pressing head module (4) and the wafer (100) held by the wafer holding component (3); or can only cover the wafer (100) held by the wafer holding component (3).

Images