Electronic device

Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

Description

electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410086776.3, filed on January 22, 2024, entitled "Electronic Device", the entire contents of which are incorporated herein by reference.

[0002] This application relates to the field of terminal technology, and in particular to an electronic device.

[0003] With the explosive growth of electronic devices such as smartphones and tablets, their functions are becoming increasingly diverse. During use, these devices require battery charging to ensure sufficient power for the user's extended battery life. Electronic devices include a charging interface. To charge, the charger's charging head is plugged into the charging interface. Currently, high-power fast charging is used to shorten charging time. The charging interface is electrically connected to a circuit board. The circuit board can be electrically connected to the motherboard. The battery is also electrically connected to the motherboard. The circuit board connected to the charging interface has grounding requirements to reduce current loss. However, the grounding structure of the circuit board in related technologies poses a problem that affects the internal structural design of electronic devices.

[0004] This application provides an electronic device that helps reduce structural design difficulty, assembly difficulty, and production costs.

[0005] This application provides an electronic device, which includes a charging interface, a first circuit board, a metal reinforcing member, and a bracket assembly.

[0006] The first circuit board includes a connection terminal. The connection terminal has a ground terminal. The connection terminal is electrically connected to a charging interface. A metal reinforcement is stacked with the connection terminal. The metal reinforcement is electrically connected to the ground terminal. The support assembly includes a metal support and a conductive element. At least a portion of the connection terminal is located within the metal support. The metal support includes a main body and a grounding portion. The grounding portion is electrically connected to the main body. The metal reinforcement and the main body are respectively electrically connected to the conductive element. The grounding portion is used for grounding.

[0007] In the electronic device of this application embodiment, a first circuit board connected to a charging interface includes a grounding terminal. The first circuit board can be grounded through the grounding terminal. The grounding terminal of the first circuit board can be electrically connected to a metal reinforcement. The bracket assembly includes a metal bracket and a conductive element. The metal reinforcement is electrically connected to the metal bracket through the conductive element. The metal bracket includes a grounding portion. The metal bracket is grounded through the grounding portion. The grounding path of the first circuit board can be a grounding terminal, a metal reinforcement, a conductive element, and a metal bracket. In this application embodiment, the metal reinforcement is reused, so that the metal reinforcement can form protection for the first circuit board and can also be used to transmit grounding current. The metal bracket is also reused, so that the metal bracket can provide support and fixation for the corresponding structural components and can also be used to transmit grounding current. Therefore, in this application embodiment, the grounding structure design of the first circuit board can reduce the structural design difficulty, assembly difficulty, and production cost by reusing the corresponding structural components.

[0008] In one possible implementation, a metal reinforcing member is disposed between the main body and the connecting end. A conductive member is disposed between the metal reinforcing member and the main body.

[0009] Metal reinforcements and conductive components can reuse the internal space of the metal bracket, which helps to reduce the occupancy rate of metal reinforcements and conductive components in the thickness direction of electronic devices, thereby helping to ensure that electronic devices can achieve a thinner and lighter design.

[0010] In one possible implementation, at least one of the metal reinforcing member and the main body is provided with a recess. At least a portion of the conductive member is located within the space formed by the recess.

[0011] Metal reinforcements and metal supports can protect conductive components and reduce the possibility of them being subjected to impacts or collisions.

[0012] In one possible implementation, the main body portion has a recess. The recess has an opening facing the metal reinforcement. The surface of the metal reinforcement facing the recess is planar.

[0013] The recessed design on the metal bracket eliminates the need for a structure to accommodate conductive components on the metal reinforcement. This facilitates a flat design for the metal reinforcement, meaning that the two opposing surfaces of the metal reinforcement can be flat along the thickness direction of the electronic device. Consequently, when the metal reinforcement presses against the connection end of the first circuit board, it does not exert a large local force on the connection end, thus avoiding stress concentration and structural damage.

[0014] In one possible implementation, one of the metal reinforcement and the main body is welded to the conductive element, and the other abuts against the conductive element.

[0015] Welding one of the metal reinforcing components or the main body to the conductive component helps ensure a stable and reliable connection, reducing the possibility of grounding failure due to loss of contact. Alternatively, abutting the metal reinforcing component or the main body to the conductive component eliminates the need for tools during assembly, allowing for immediate conductivity after assembly and reducing assembly complexity.

[0016] In one possible implementation, the conductive element is an elastic structural component. The metal reinforcement and the main body respectively apply compressive stress to the conductive element.

[0017] When the conductive component is under pressure, it has its own elastic restoring force. This allows the conductive component to exert a reaction force on the main body of the metal reinforcement and the metal support, ensuring good and stable contact between the conductive component and the main body of the metal reinforcement and the metal support. This helps reduce the possibility of grounding failure or poor grounding due to incomplete connection between the conductive component and the main body of the metal reinforcement and the metal support.

[0018] In one possible implementation, the conductive element is a metal structural component. The conductive element includes a base and a resilient support. One of the metal reinforcement and the main body is connected to the base, and the other is connected to the resilient support.

[0019] Because the conductive component is rigid, the main body of the metal reinforcement and the metal bracket are in rigid contact with the conductive component. As a result, the contact state between the main body of the metal reinforcement and the metal bracket and the conductive component is relatively more stable. Consequently, radiated spurious emission (RSE) is less likely to occur between the main body of the metal reinforcement and the metal bracket and the conductive component, reducing the possibility of interference signals being generated during current transmission.

[0020] In one possible implementation, one of the metal reinforcement and the main body is welded to the substrate, and the other abuts against the elastic support leg.

[0021] Welding one of the metal reinforcing components or the main body of the metal bracket to the substrate helps ensure the stability and reliability of the connection between the metal reinforcing component / main body and the substrate, reducing the possibility of grounding failure due to loss of contact. Furthermore, welding eliminates the need for additional connecting components. Additional connecting components would occupy significant space in the thickness direction of the electronic device, hindering its slim and lightweight design. Therefore, welding saves space in the thickness direction, facilitating a slimmer and lighter design.

[0022] The metal reinforcement and the main body are connected to the elastic leg by abutting, which eliminates the need for tools to connect the metal reinforcement and the main body to the elastic leg during assembly, thus reducing assembly difficulty.

[0023] In one possible implementation, the number of flexible legs is two or more.

[0024] Two or more flexible legs can be used to transmit grounding current, which can effectively increase the number of grounding paths, help disperse the current, and further reduce current loss.

[0025] In one possible implementation, the conductive element is a metal spring.

[0026] When the metal reinforcement, conductive component, and metal bracket are assembled, the metal reinforcement and metal bracket together compress the conductive component to make it flatter. As a result, the conductive component can occupy less space in the thickness direction of the electronic device, which is beneficial for the thinner and lighter design of the electronic device.

[0027] In one possible implementation, the first circuit board is a flexible circuit board.

[0028] The first circuit board is flexible and can be bent and folded under force, making it easy to flexibly install inside electronic devices. Its small thickness allows it to pass easily between the battery and battery cover, while occupying minimal space in the thickness direction of the electronic device, thus contributing to a thinner and lighter design.

[0029] In one possible implementation, the charging interface includes a ground pin. A ground terminal is electrically connected to the ground pin. A metal reinforcement is electrically connected to the ground pin.

[0030] The charging interface can form a grounding path through the first circuit board, metal reinforcement, conductive parts and metal bracket, so that the metal reinforcement and metal bracket can be reused to achieve the grounding of the charging interface, reducing the difficulty of grounding structure design, assembly difficulty and production cost.

[0031] In one possible implementation, the grounding terminal includes a via and a metal pad. The metal pad is disposed in the via. The metal pad has a central through-hole. A grounding pin passes through the central through-hole. The grounding pin is soldered to the metal pad.

[0032] The ground pin of the charging interface is soldered to the metal pad, thereby ensuring a stable and reliable connection between the ground pin of the charging interface and the metal pad. Furthermore, the ground pin of the charging interface can reuse the space in the thickness direction of the first circuit board, reducing the space occupancy rate of the ground pin of the charging interface in the thickness direction.

[0033] In one possible implementation, the metal reinforcement has clearance holes. The clearance holes are positioned corresponding to the center through-holes of the metal pads. A grounding pin passes through the clearance holes. The grounding pin is soldered to the metal reinforcement.

[0034] The ground pin of the charging interface is soldered to the metal reinforcement, allowing the ground pin to apply force to the metal reinforcement, pressing it against the connection end of the first circuit board. The ground pin of the charging interface serves both as a grounding function and as a means to connect and fix the metal reinforcement, enabling the ground pin to be reused. The metal reinforcement can be fixed in position via the ground pin of the charging interface, eliminating the need for additional connection structures, reducing structural design complexity, assembly difficulty, and production costs, while also occupying less space within the electronic device.

[0035] In one possible implementation, the electronic device further includes a metal frame. A grounding portion is electrically connected to the metal frame. The grounding portion is grounded through the metal frame.

[0036] The first circuit board can form a grounding path through metal reinforcements, conductive components, metal supports, and a metal frame, resulting in a shorter grounding path and further reducing current loss. The metal frame can perform both support and grounding functions, allowing it to be reused, reducing structural design complexity, assembly difficulty, and production costs.

[0037] In one possible implementation, the electronic device further includes a conductive connector. The grounding portion is connected to the metal frame via the conductive connector.

[0038] Conductive connectors can ensure a stable and reliable connection between the grounding part of the metal bracket and the metal frame, preventing loosening and reducing the possibility of grounding failure or poor grounding due to incomplete connection between the grounding part of the metal bracket and the metal frame.

[0039] In one possible implementation, the conductive connector includes a pressing portion and an adapter portion. The adapter portion is threadedly connected to a metal frame. The pressing portion abuts against a grounding portion.

[0040] The adapter of the conductive connector is threaded to the metal frame, which facilitates assembly of the adapter and the metal frame and ensures a stable connection between them.

[0041] The pressing part of the conductive connector abuts against the grounding part of the metal bracket. The pressing part of the conductive connector applies compressive stress to the grounding part of the metal bracket to maintain a tight contact between the pressing part of the conductive connector and the grounding part of the metal bracket, ensuring a stable connection.

[0042] In one possible implementation, the metal support includes a protrusion. The protrusion projects toward the metal frame. The protrusion forms a grounding portion. A pressing portion presses against the surface of the protrusion facing away from the metal frame.

[0043] In one possible implementation, the electronic device further includes a second circuit board. The second circuit board is located inside a metal bracket. The metal bracket provides restraint for the second circuit board. A grounding portion is electrically connected to the second circuit board. The grounding portion is grounded through the second circuit board.

[0044] The second circuit board can realize the functions of installing components and grounding, so that the second circuit board can be reused, reducing the difficulty of grounding structure design, assembly difficulty and production cost.

[0045] In one possible implementation, the electronic device further includes a second circuit board, a battery, and a motherboard. The battery is disposed between the second circuit board and the motherboard. The battery is disposed on one side of the first circuit board. The first circuit board is electrically connected to the motherboard.

[0046] In one possible implementation, the electronic device further includes a metal frame. A second circuit board is connected to the metal frame. The second circuit board is a printed circuit board.

[0047] In one possible implementation, an insulator is provided on the surface of the main body facing the metal reinforcement.

[0048] The main body of the metal bracket and the metal reinforcement are in a non-electrical connection state, that is, in a mutually insulated state, to avoid the problem of interference to the signal transmitted in the first circuit board caused by the metal bracket and the metal reinforcement being conductive.

[0049] Figure 1 is a schematic diagram of the structure of the electronic device provided in an embodiment of this application;

[0050] Figure 2 is a partial exploded view of the electronic device provided in an embodiment of this application;

[0051] Figure 3 is a partial structural schematic diagram of the electronic device provided in an embodiment of this application;

[0052] Figure 4 is a partial exploded view of the electronic device provided in an embodiment of this application;

[0053] Figure 5 is a partial structural schematic diagram of the first circuit board provided in an embodiment of this application;

[0054] Figure 6 is a partial structural schematic diagram of the support assembly provided in an embodiment of this application;

[0055] Figure 7 is a partial cross-sectional view of the electronic device provided in an embodiment of this application;

[0056] Figure 8 is an enlarged schematic diagram of point M in Figure 7;

[0057] Figure 9 is a partial exploded view of the electronic device provided in an embodiment of this application;

[0058] Figure 10 is a partial cross-sectional view of the electronic device provided in an embodiment of this application;

[0059] Figure 11 is an enlarged schematic diagram of point W in Figure 7.

[0060] Reference numerals: 10, Electronic device; 20, Display screen; 30, Housing; 31, Metal frame; 311, Outer frame; 312, Middle plate; 32, Battery cover; 40, Main board; 50, Electronic component; 60, Battery; 70, First circuit board; 71, Connection end; 711, Grounding terminal; 711a, Via; 711b, Metal pad; 80, Second circuit board; 90, Charging interface; 91, Grounding pin; 100, Support assembly; 110, Metal support; 111, Main body; 112, Grounding part; 120, Conductive component; 121, Base; 122, Elastic support leg; 200, Metal reinforcement; 210, Clearance hole; 300, Recess; 400, Conductive connector; 410, Pressing part; 420, Adapter part; Z, Thickness direction.

[0061] The electronic devices in this application embodiment can be referred to as user equipment (UE) or terminals, etc. For example, electronic devices can be portable Android devices (PADs), personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile or fixed terminals. This application embodiment does not specifically limit the form of the terminal device.

[0062] In this embodiment, the electronic device is described as a handheld device with wireless communication capabilities. A handheld device with wireless communication capabilities can be, for example, a flat-screen phone or a foldable phone. FIG1 schematically shows the structure of the electronic device 10. Referring to FIG1, a handheld device with wireless communication capabilities can be, for example, a flat-screen phone.

[0063] Figure 2 schematically shows a partial exploded structure of the electronic device 10. Figure 3 schematically shows a partial structure of the electronic device 10. Referring to Figures 1 to 3, the electronic device 10 of this embodiment may include a display component, a housing 30, a motherboard 40, electronic devices 50, a battery 60, a first circuit board 70, a second circuit board 80, and a charging interface 90.

[0064] The display assembly has a display screen 20 for displaying image information. The display assembly is mounted on a housing 30, and the display area of ​​the display screen 20 can be used to present image information to a user. The housing 30 may include a metal frame 31 and a battery cover 32. The display assembly is connected to the metal frame 31. For example, the display assembly may be bonded to the metal frame 31. The material of the metal frame 31 may be, but is not limited to, aluminum, aluminum alloy, steel, or titanium alloy.

[0065] The motherboard 40 and battery 60 can be housed inside the electronic device 10, located inside the housing 30 and the display component, making them difficult for the user to observe from the outside. The battery 60 can be positioned between the metal frame 31 and the battery cover 32, which shields the battery 60. The battery 60 provides power to the electronic device 10 to ensure its normal operation. For example, the battery 60 can provide power to the display component to display image information or execute corresponding operation commands. Alternatively, the battery 60 can provide power to the motherboard 40 to ensure the normal operation of the electronic components 50 on the motherboard 40. The battery 60 can be a lithium-ion battery, such as a lithium iron phosphate battery.

[0066] Electronic components 50 are mounted on the motherboard 40. The motherboard 40 may be a printed circuit board (PCB). The electronic components 50 are soldered to the motherboard 40 using a soldering process. The electronic components 50 include, but are not limited to, a central processing unit (CPU), an intelligent algorithm chip, or a power management IC (PMIC).

[0067] A first circuit board 70 and a second circuit board 80 are disposed inside the electronic device 10. A battery 60 may be disposed between the main board 40 and the second circuit board 80. A charging circuit is disposed on the main board 40. The charging circuit has an input terminal and an output terminal. The first circuit board 70 is electrically connected to the input terminal of the charging circuit. The output terminal of the charging circuit is electrically connected to the battery 60. When the battery 60 of the electronic device 10 is charged using an external charging device (e.g., a charger), the first circuit board 70 can be used to deliver charging current.

[0068] The second circuit board 80 can serve as a sub-board. In embodiments where the second circuit board 80 serves as a sub-board, the area of ​​the main board 40 is relatively larger than the area of ​​the second circuit board 80, thereby allowing more electronic components 50 to be mounted on the main board 40.

[0069] In some examples, the first circuit board 70 can be a flexible printed circuit board (FPCB). The second circuit board 80 can be a printed circuit board.

[0070] The electronic device 10 also includes a charging interface 90. The charging interface 90 can be disposed on the metal frame 31. The first circuit board 70 connects the charging interface 90 and the motherboard 40. The charging interface 90 can be electrically connected to the input terminal of the charging circuit through the first circuit board 70 and the motherboard 40. When the battery 60 of the electronic device 10 is charging, an electrical signal can be input from the charging interface 90, and then reach the charging circuit through the first circuit board 70 and the motherboard 40. After the charging circuit performs a boost or buck conversion on the input electrical signal, it outputs an electrical signal to the battery 60 through the motherboard 40. The electrical signal enters the battery 60 and is stored to achieve the purpose of energy storage. When the battery 60 of the electronic device 10 is discharging, the electrical signal output by the battery 60 can be output to the motherboard 40 to supply power to the motherboard 40.

[0071] In some examples, the charging port 90 can be a USB Type-C port, a Micro USB port, or a Lightning port.

[0072] The electronic device 10 also includes a support assembly 100. Within the internal space of the electronic device 10, the support assembly 100 can support and fix the second circuit board 80 to ensure the stability of the second circuit board 80 and the charging interface 90. In the event of an impact force on the electronic device 10, the positions of the second circuit board 80 and the charging interface 90 are less likely to shift. In some examples, the support assembly 100 can be connected to the metal frame 31 to fix its position. The second circuit board 80 can be located inside the support assembly 100.

[0073] Figure 4 schematically shows a partial exploded structure of the electronic device 10. Referring to Figure 4, the electronic device 10 also includes a metal reinforcement 200. The metal reinforcement 200 is connected to the first circuit board 70. The metal reinforcement 200 can provide protection for a corresponding area of ​​the first circuit board 70, which helps reduce the possibility of structural damage to the corresponding area of ​​the first circuit board 70 under external pressure. In some examples, the metal reinforcement 200 can be a metal plate, which helps to reduce the thickness of the metal reinforcement 200 and reduce space occupancy. The material of the metal reinforcement 200 can be, but is not limited to, steel, aluminum, or aluminum alloy.

[0074] In related technologies, to effectively reduce the current flowing through the first circuit board during charging and thus reduce current loss, the first circuit board in an electronic device needs to be grounded. The first circuit board includes main lines and branch lines. The main lines of the first circuit board are used for electrical connection to the charging interface and the motherboard. The first circuit board can be grounded through additional branch lines. The branched structure design of the first circuit board leads to relatively high structural design and manufacturing difficulty, resulting in higher costs. Furthermore, the branched structure design of the first circuit board occupies relatively more space. Additionally, to accommodate the branched structure design of the first circuit board, other internal components of the electronic device need to be adapted. Therefore, the grounding structure design of the first circuit board can adversely affect the structural design of internal components of the electronic device.

[0075] The electronic device 10 provided in this application embodiment can use the bracket assembly 100 located in the internal space of the electronic device 10 to ground the first circuit board 70, thereby reusing the bracket assembly 100, so that the bracket assembly 100 can realize the support and fixation function and the grounding function, which is beneficial to reduce the difficulty of structural design, assembly difficulty and production cost.

[0076] The implementation of the electronic device 10 provided in the embodiments of this application will be described below.

[0077] Figure 5 schematically shows a partial structure of the first circuit board 70. Referring to Figures 4 and 5, the first circuit board 70 of this embodiment includes a connection terminal 71. The connection terminal 71 is formed at the end of the first circuit board 70 near the charging interface 90. The end of the first circuit board 70 near the motherboard 40 is electrically connected to the motherboard 40. The connection terminal 71 has a ground terminal 711. The first circuit board 70 can be grounded through the ground terminal 711. The connection terminal 71 of the first circuit board 70 is electrically connected to the charging interface 90.

[0078] The charging interface 90 has multiple pins. The connection terminal 71 has multiple conductive tabs. Each conductive tab can be electrically connected to a corresponding pin. When the charging interface 90 is plugged into an external charging device, the current at the charging interface 90 can be transmitted to the first circuit board 70 through the connection terminal 71.

[0079] In this embodiment, the metal reinforcing member 200 and the connection end 71 of the first circuit board 70 are stacked. The metal reinforcing member 200 can be disposed on the side of the connection end 71 facing the battery cover 32. At least a portion of the connection end 71 is located below the metal reinforcing member 200. The connection end 71 can contact and adhere to the metal reinforcing member 200. The metal reinforcing member 200 itself has high rigidity and deformation resistance. The metal reinforcing member 200 can protect the connection end 71, reducing the possibility of structural damage such as tearing or cracking caused by external compressive stress on the connection end 71. The metal reinforcing member 200 is electrically connected to the grounding terminal 711 of the connection end 71. Therefore, the metal reinforcing member 200 can be reused, giving it both protective and connecting functions.

[0080] In some examples, the grounding terminal 711 may be welded to the metal reinforcement 200.

[0081] In some examples, the metal reinforcing member 200 is a one-piece molded structure. The metal reinforcing member 200 can be a metal plate. In the embodiments of this application, the shape of the metal reinforcing member 200 itself is not specifically limited, as long as the shape of the metal reinforcing member 200 can effectively cover the connecting end 71.

[0082] In this embodiment, the support assembly 100 includes a metal support 110. The metal support 110 can improve the overall rigidity of the support assembly 100. While ensuring the rigidity requirements are met, the thickness of the metal support 110 is relatively small, which helps to reduce the volume and space occupancy of the support assembly 100. The support assembly 100 may also include an insulating structure. The insulating structure is connected to the metal support 110. The insulating structure is used to correspond to devices that are sensitive to metal structural components, in order to reduce interference. At least a portion of the connection end 71 is located within the metal support 110, thereby providing protection for the connection end 71. The metal support 110 includes a main body 111 and a grounding portion 112. The grounding portion 112 is electrically connected to the main body 111. The grounding portion 112 of the metal support 110 is used for grounding.

[0083] In some examples, the material of the metal bracket 110 may be, but is not limited to, steel, aluminum, or aluminum alloy. The bracket assembly 100 may be connected to the metal frame 31. For example, both the metal bracket 110 and the insulating structure of the bracket assembly 100 may be used to connect to the metal frame 31.

[0084] In some examples, the metal bracket 110 can be a one-piece molded structure. Exemplarily, the metal bracket 110 can be formed from a sheet blank through a stamping process.

[0085] In this embodiment, the support assembly 100 further includes a conductive element 120. The conductive element 120 itself has good conductivity. The metal reinforcing element 200 and the main body 111 of the metal support 110 are electrically connected to the conductive element 120. The conductive element 120 serves as a transitional connector, allowing conductivity between the metal reinforcing element 200 and the metal support 110. Since the metal reinforcing element 200 is electrically connected to the grounding terminal 711 of the first circuit board 70, the metal support 110 can be electrically connected to the grounding terminal 711 of the first circuit board 70 through the conductive element 120 and the metal reinforcing element 200. In this embodiment, the grounding terminal 711 of the first circuit board 70 is grounded through the metal reinforcing element 200, the conductive element 120, and the grounding portion 112 of the metal support 110.

[0086] In the electronic device 10 of this application embodiment, a first circuit board 70 connected to a charging interface 90 includes a grounding terminal 711. The first circuit board 70 can be grounded through the grounding terminal 711. The grounding terminal 711 of the first circuit board 70 can be electrically connected to the metal reinforcement 200. The bracket assembly 100 includes a metal bracket 110 and a conductive member 120. The metal reinforcement 200 is electrically connected to the metal bracket 110 through the conductive member 120. The metal bracket 110 includes a grounding portion 112. The metal bracket 110 is grounded through the grounding portion 112. The grounding path of the first circuit board 70 can be the grounding terminal 711, the metal reinforcement 200, the conductive member 120, and the metal bracket 110. In this application embodiment, the metal reinforcement 200 is reused, so that the metal reinforcement 200 can form protection for the first circuit board 70 and can also be used to transmit grounding current. The metal bracket 110 is also reused, so that the metal bracket 110 can provide support and fixation for the corresponding structural components and can also be used to transmit grounding current. Therefore, in this embodiment of the application, the grounding structure design of the first circuit board 70 can reduce the difficulty of structural design, assembly difficulty and production cost by reusing the corresponding structural components.

[0087] The metal reinforcing member 200 of this embodiment can be disposed between the main body 111 of the metal bracket 110 and the connection end 71 of the first circuit board 70. The conductive member 120 is disposed between the metal reinforcing member 200 and the main body 111 of the metal bracket 110. In the thickness direction Z of the electronic device 10, the connection end 71 of the first circuit board 70, the metal reinforcing member 200, and the main body 111 of the metal bracket 110 are stacked. The thickness direction Z of the electronic device 10 can be the same as the thickness direction of the display screen 20. The connection end 71 of the first circuit board 70 can be located on the side of the metal reinforcing member 20 facing the display screen 20. The metal reinforcing member 200 can be located on the side of the main body 111 of the metal bracket 110 facing the display screen 20. The conductive member 120 can be located on the side of the main body 111 of the metal bracket 110 facing the display screen 20.

[0088] The metal reinforcement 200 and the conductive component 120 can reuse the internal space of the metal bracket 110, which helps to reduce the occupancy rate of the metal reinforcement 200 and the conductive component 120 on the internal space of the electronic device 10 in the thickness direction Z, thereby helping to ensure that the electronic device 10 achieves a thin and light design.

[0089] At least one of the metal reinforcing member 200 and the main body portion 111 of the metal bracket 110 is provided with a recess. At least a portion of the conductive member 120 is located within the space formed by the recess. When the metal reinforcing member 200 and the main body portion 111 of the metal bracket 110 are stacked, the recess between the metal reinforcing member 200 and the metal bracket 110 can form an installation space to facilitate the placement of the conductive member 120 within this space. The metal reinforcing member 200 and the metal bracket 110 can provide protection for the conductive member 120, reducing the possibility of the conductive member 120 being subjected to impact or collision.

[0090] In some examples, Figure 6 schematically shows a partial structure of the support assembly 100. Figure 7 schematically shows a partial cross-sectional view of the electronic device 10. Figure 8 is an enlarged view of point M in Figure 7. Referring to Figures 6, 7, and 8, the main body 111 of the metal support 110 is provided with a recess 300. The recess 300 has an opening facing the metal reinforcement 200. The conductive element 120 is located within the space formed by the recess 300. Exemplarily, in the thickness direction Z of the electronic device 10, the distance between the bottom wall of the recess 300 and the surface of the metal reinforcement 200 can be greater than or equal to 0.2 mm, thereby helping to ensure that the conductive element 120 occupies a small space in the thickness direction Z of the electronic device 10, which is beneficial for achieving a thinner and lighter design of the electronic device 10.

[0091] For example, the surface of the metal reinforcement 200 facing the recess 300 is planar. The surface of the metal reinforcement 200 facing the connection end 71 is planar.

[0092] By providing a recess 300 on the metal bracket 110, the metal reinforcement 200 does not need to have a structure to accommodate the conductive element 120. This facilitates a flat design for the metal reinforcement 200, meaning that the two opposing surfaces of the metal reinforcement 200 can be flat in the thickness direction Z of the electronic device 10. As a result, when the metal reinforcement 200 presses against the connection end 71 of the first circuit board 70, it will not exert a large local force on the connection end 71, thus avoiding stress concentration at the connection end 71 and structural damage.

[0093] In some examples, the metal reinforcement 200 is provided with a recess 300. The conductive element 120 is located within the space formed by the recess 300. Exemplarily, in the thickness direction Z of the electronic device 10, the distance between the bottom wall of the recess 300 and the surface of the main body 111 can be greater than or equal to 0.2 mm.

[0094] In some examples, both the metal reinforcement 200 and the main body 111 of the metal support 110 are provided with recesses 300. The conductive element 120 is entirely located within the space formed by the recesses 300. Exemplarily, in the thickness direction Z of the electronic device 10, the distance between the bottom walls of the two recesses 300 can be greater than or equal to 0.2 millimeters (mm).

[0095] In this embodiment, the main body 111 of the metal bracket 110 can be connected to the conductive element 120. Exemplarily, the metal bracket 110 and the conductive element 120 can be an integrally formed structure. Alternatively, the metal bracket 110 and the conductive element 120 can be manufactured separately and then assembled to achieve connection. The metal reinforcing member 200 can be connected to or abut against the conductive element 120. It should be noted that abutting refers to the two structural members being in contact and applying compressive stress to each other.

[0096] In this embodiment, the metal reinforcing member 200 can also be connected to the conductive member 120. Exemplarily, the metal reinforcing member 200 and the conductive member 120 can be an integrally formed structure. Alternatively, the metal reinforcing member 200 and the conductive member 120 can be manufactured separately and then assembled to achieve connection. The metal bracket 110 can be connected to or abut against the conductive member 120.

[0097] In some feasible embodiments, one of the metal reinforcing member 200 and the main body 111 of the metal support 110 is welded to the conductive member 120, and the other abuts against the conductive member 120. Welding one of the metal reinforcing member 200 and the main body 111 to the conductive member 120 helps ensure the stability and reliability of the connection between them, and reduces the possibility of grounding failure due to loss of contact. The metal reinforcement 200 and the main body 111 are connected to the conductive member 120 by abutting. This means that when assembling the metal reinforcement 200 and the main body 111, it is not necessary to use tools to connect the metal reinforcement 200 and the main body 111 to the conductive member 120. As a result, after the metal reinforcement 200 and the main body 111 are assembled, the metal reinforcement 200, the conductive member 120 and the main body 111 can be electrically connected, which helps to reduce the assembly difficulty.

[0098] In some examples, the metal reinforcement 200 is welded to the conductive element 120, while the main body 111 of the metal support 110 abuts against the conductive element 120.

[0099] In some examples, the main body 111 of the metal support 110 is welded to the conductive element 120, while the metal reinforcement 200 abuts against the conductive element 120.

[0100] In this embodiment, the conductive element 120 can be an elastic structural component. The conductive element 120 can deform under external force. The metal reinforcing member 200 and the main body 111 of the metal support 110 can respectively apply compressive stress to the conductive element 120. When the conductive element 120 is under pressure, it possesses elastic restoring force, thereby allowing it to apply a reaction force to the metal reinforcing member 200 and the main body 111 of the metal support 110. This ensures that the main body 111 of the metal reinforcing member 200 and the main body 111 of the metal support 110 maintains a good and stable contact with the conductive element 120, which helps reduce the possibility of grounding failure or poor grounding due to incomplete connections between the main body 111 of the metal reinforcing member 200 and the conductive element 120.

[0101] In addition, the conductive element 120 can deform in the thickness direction Z of the electronic device 10, thereby reducing the space occupancy rate of the conductive element 120 in the thickness direction Z of the electronic device 10.

[0102] In some examples, the conductive element 120 itself is a flexible structural component. Under stress, the conductive element 120 can deform in the stressed area. The metal reinforcing member 200 and the main body 111 of the metal support 110 can respectively abut against the conductive element 120. Alternatively, one of the metal reinforcing member 200 and the main body 111 can be bonded to the conductive element 120, while the other abuts against it. Exemplarily, the conductive element 120 can be conductive foam.

[0103] In some examples, the conductive element 120 is a metal structural component. The conductive element 120 itself is a rigid structural component. The conductive element 120 can be deformed by being jointly compressed by the metal reinforcing element 200 and the main body 111 of the metal support 110. Because the conductive element 120 is rigid, the metal reinforcing element 200 and the main body 111 of the metal support 110 are in rigid contact with the conductive element 120, thus the contact state between the metal reinforcing element 200 and the main body 111 of the metal support 110 and the conductive element 120 is relatively more stable. Consequently, radiated spurious emission (RSE) is less likely to occur between the metal reinforcing element 200 and the main body 111 of the metal support 110 and the conductive element 120, reducing the possibility of interference signals being generated during current transmission.

[0104] As exemplarily shown in Figures 6 and 8, the conductive element 120 includes a base 121 and an elastic support 122. One of the main bodies 111 of the metal reinforcing member 200 and the metal support 110 is connected to the base 121, and the other is connected to the elastic support 122. When the elastic support 122 is subjected to force, it can move relative to the base 121, causing the conductive element 120 to deform accordingly. When the metal reinforcing member 200, the conductive element 120, and the main body 111 of the metal support 110 are assembled, the metal reinforcing member 200 and the main body 111 of the metal support 110 jointly compress the conductive element 120, causing the elastic support 122 to deform and accumulate elastic potential energy.

[0105] For example, in the main body 111 of the metal reinforcement 200 and the metal bracket 110, one is welded to the base 121 and the other abuts against the elastic leg 122.

[0106] The metal reinforcing member 200 and the main body 111 of the metal bracket 110 are welded to the base 121. This method helps ensure the stability and reliability of the connection between the metal reinforcing member 200 and the main body 111 and the base 121, and reduces the possibility of grounding failure due to loss of contact between the metal reinforcing member 200 and the main body 111 and the base 121. Furthermore, welding eliminates the need for additional connecting components. Additional connecting components would occupy more space in the thickness direction Z of the electronic device 10, affecting its slim design. Therefore, welding saves space in the thickness direction Z of the electronic device 10, contributing to its slim design.

[0107] One of the metal reinforcing member 200 and the main body 111 is in contact with the elastic support leg 122. This eliminates the need for tools to connect the metal reinforcing member 200 and the main body 111 to the elastic support leg 122 during the assembly of the metal reinforcing member 200 and the metal bracket 110, thus reducing assembly difficulty. For example, during the process of the metal reinforcing member 200 and the main body 111 of the metal bracket 110 jointly pressing against the conductive member 120, the elastic support leg 122 can slide relative to one of the metal reinforcing member 200 and the main body 111.

[0108] In some examples, the main body 111 of the metal support 110 is welded to the base 121, while the metal reinforcement 200 abuts against the resilient leg 122. There is a gap between the base 121 of the conductive element 120 and the metal reinforcement 200 to ensure that the base 121 does not come into contact with the metal reinforcement 200.

[0109] In some examples, the metal reinforcement 200 is welded to the base 121, while the main body 111 of the metal support 110 abuts against the resilient leg 122. A gap exists between the base 121 of the conductive element 120 and the main body 111 of the metal support 110 to ensure that the base 121 does not contact the main body 111 of the metal support 110.

[0110] In some examples, the base 121 and the elastic support 122 of the conductive element 120 are integrally formed.

[0111] In this embodiment, the number of elastic legs 122 can be one.

[0112] In this embodiment, the number of elastic legs 122 can be two or more. The grounding current on the first circuit board 70 can be transmitted to the metal bracket 110 via the metal reinforcement 200, the two or more elastic legs 122, and the base 121. Then, the grounding current is grounded through the grounding portion 112 of the metal bracket 110. The two or more elastic legs 122 can all be used to transmit grounding current, thereby effectively increasing the number of grounding paths, facilitating current dispersion, and further reducing current loss. The two or more elastic legs 122 are spaced apart around the base 121.

[0113] In some examples, the number of flexible legs 122 can be two, three or four, and this application embodiment does not specifically limit this.

[0114] In some examples, the width of the elastic leg 122 gradually decreases along the direction away from the base 121. The end of the elastic leg 122 away from the base 121 can be an arc-shaped structure.

[0115] In this embodiment, the conductive element 120 can be a metal spring. The material of the conductive element 120 can be, but is not limited to, copper, copper alloy, steel, aluminum, or aluminum alloy. The elastic support 122 is intersecting with the base 121, so that the elastic support 122 is in a raised state relative to the base 121. When the metal reinforcing member 200, the conductive element 120, and the metal bracket 110 are assembled, the metal reinforcing member 200 and the metal bracket 110 jointly compress the conductive element 120 to make the conductive element 120 flatter. As a result, the conductive element 120 can occupy less space in the thickness direction Z of the electronic device 10, which is beneficial to the thin and light design of the electronic device 10.

[0116] In this embodiment, the first circuit board 70 is a flexible circuit board. The first circuit board 70 is flexible and can be bent and folded under force, thus facilitating its flexible placement inside the electronic device 10. The first circuit board 70 has a small thickness, allowing it to pass easily between the battery 60 and the battery cover 32, while occupying minimal space in the thickness direction Z of the electronic device 10, which is beneficial for the thinner and lighter design of the electronic device 10. Along the thickness direction of the first circuit board 70, the metal reinforcing member 200 is stacked with the connection end 71 of the first circuit board 70, so that the metal reinforcing member 200 shields the connection end 71, thereby providing effective protection for the connection end 71. The metal reinforcing member 200 is located on the side of the connection end 71 facing the battery cover 32. The thickness direction of the first circuit board 70 can be the same as the thickness direction Z of the electronic device 10.

[0117] In this embodiment, FIG9 schematically shows a partial exploded view of the electronic device 10. FIG10 schematically shows a partial cross-sectional view of the electronic device 10. Referring to FIG9 and FIG10, the charging interface 90 includes a ground pin 91. The charging interface 90 can be grounded through the ground pin 91 to effectively improve the safety when charging using the charging interface 90. The ground terminal 711 of the first circuit board 70 is electrically connected to the ground pin 91 of the charging interface 90. The metal reinforcement 200 is electrically connected to the ground pin 91 of the charging interface 90. The charging interface 90 can form a grounding path through the first circuit board 70, the metal reinforcement 200, the conductive element 120, and the metal bracket 110, thereby reusing the metal reinforcement 200 and the metal bracket 110 to achieve grounding of the charging interface 90, reducing the difficulty of grounding structure design, assembly difficulty, and production cost.

[0118] In some examples, the ground terminal 711 of the first circuit board 70 includes a via 711a and a metal pad 711b. The metal pad 711b is disposed in the via 711a. The metal pad 711b has a central through hole. The ground pin 91 of the charging interface 90 passes through the central through hole of the metal pad 711b. The ground pin 91 of the charging interface 90 is soldered to the metal pad 711b, thereby ensuring a stable and reliable connection between the ground pin 91 of the charging interface 90 and the metal pad 711b. Furthermore, the ground pin 91 of the charging interface 90 can reuse the space of the first circuit board 70 in the thickness direction, reducing the space occupancy rate of the ground pin 91 of the charging interface 90 in the thickness direction.

[0119] In some examples, the metal reinforcement 200 can be electrically connected to the metal pad 711b. The metal reinforcement 200 has a clearance hole 210. The clearance hole 210 of the metal reinforcement 200 is provided corresponding to the center through hole of the metal pad 711b. The ground pin 91 of the charging interface 90 passes through the clearance hole 210 of the metal reinforcement 200. The ground pin 91 of the charging interface 90 passes sequentially through the first circuit board 70 and the metal reinforcement 200. The ground pin 91 of the charging interface 90 is soldered to the metal reinforcement 200, so that the ground pin 91 of the charging interface 90 can apply a force to the metal reinforcement 200, causing the metal reinforcement 200 to press against the connection end 71 of the first circuit board 70. The metal reinforcement 200 can be electrically connected to the metal pad 711b through the ground pin 91. The grounding pin 91 of the charging interface 90 can perform grounding function and can also be connected to and fixed to the metal reinforcement 200, so that the grounding pin 91 of the charging interface 90 can be reused. The metal reinforcement 200 can be fixed in position through the grounding pin 91 of the charging interface 90, without the need for additional connection structure, reducing structural design difficulty, assembly difficulty and production cost, while occupying less space inside the electronic device 10.

[0120] In some examples, the charging interface 90 includes two or more ground pins 91. A corresponding number of metal pads 711b are provided on the first circuit board 70. A corresponding number of clearance holes 210 are provided on the metal reinforcement 200.

[0121] In this embodiment, the electronic device 10 further includes a metal frame 31. The grounding portion 112 of the metal bracket 110 is electrically connected to the metal frame 31. The grounding portion 112 of the metal bracket 110 can be grounded through the metal frame 31. The metal frame 31 can be used to provide a mounting base for the components inside the electronic device 10, while ensuring that the electronic device 10 has good overall rigidity and resistance to deformation. The second circuit board 80 and the charging interface 90 can both be connected to the metal frame 31. The first circuit board 70 can form a grounding path through the metal reinforcement 200, the conductive component 120, the metal bracket 110, and the metal frame 31, thereby shortening the grounding path of the first circuit board 70 and further reducing current loss. The metal frame 31 can realize both support and grounding functions, allowing the metal frame 31 to be reused, reducing structural design difficulty, assembly difficulty, and production costs.

[0122] In some examples, the metal frame 31 includes an outer frame 311 and a middle plate 312 that are interconnected. The outer frame 311 may be an annular frame. The middle plate 312 is located inside the outer frame 311. The grounding portion 112 of the metal bracket 110 may be electrically connected to the middle plate 312 of the metal frame 31.

[0123] In this embodiment, Figure 11 is an enlarged view of section W in Figure 7. Referring to Figures 4 and 11, the electronic device 10 also includes a conductive connector 400. The grounding portion 112 of the metal bracket 110 is connected to the metal frame 31 via the conductive connector 400. The conductive connector 400 can serve as a transitional electrical connection. After the second circuit board 80, the first circuit board 70, the metal reinforcement 200, the conductive component 120, and the metal bracket 110 are assembled, the conductive connector 400 is used to connect the grounding portion 112 of the metal bracket 110 to the metal frame 31. The conductive connector 400 ensures a stable and reliable connection between the grounding portion 112 of the metal bracket 110 and the metal frame 31, preventing loosening and reducing the possibility of grounding failure or poor grounding due to a loose connection between the grounding portion 112 of the metal bracket 110 and the metal frame 31.

[0124] In some examples, the conductive connector 400 includes a pressing portion 410 and an adapter portion 420. The adapter portion 420 is threadedly connected to the metal frame 31, facilitating assembly of the adapter portion 420 and the metal frame 31, and ensuring a stable connection between the adapter portion 420 and the metal frame 31. The pressing portion 410 of the conductive connector 400 abuts against the grounding portion 112 of the metal bracket 110. The pressing portion 410 of the conductive connector 400 applies compressive stress to the grounding portion 112 of the metal bracket 110, ensuring a tight contact between the pressing portion 410 of the conductive connector 400 and the grounding portion 112 of the metal bracket 110, thus guaranteeing a stable connection.

[0125] For example, the grounding portion 112 of the metal bracket 110 is spaced apart from the conductive element 120. The grounding portion 112 of the metal bracket 110 is positioned close to the conductive element 120 to shorten the transmission path of the grounding current. The grounding portion 112 of the metal bracket 110 has a mounting through hole. The adapter portion 420 of the conductive connector 400 can pass through the mounting through hole of the grounding portion 112 and connect to the metal frame 31.

[0126] For example, the number of conductive connectors 400 can be two or more. The number of grounding portions 112 of the metal bracket 110 can be two or more. The conductive connectors 400 and the grounding portions 112 of the metal bracket 110 can be arranged in a one-to-one correspondence. Two or more conductive connectors 400 can all be used to transmit grounding current, thereby effectively increasing the number of grounding paths, which is beneficial for dispersing current and further reducing current loss.

[0127] In some examples, the metal bracket 110 includes a protrusion. The protrusion protrudes toward the metal frame 31. For example, the protrusion protrudes toward the middle plate 312 of the metal frame 31. The protrusion forms a grounding portion 112. A pressing portion 410 presses against the surface of the protrusion facing away from the metal frame 31. The protrusion of the metal bracket 110 contacts the metal frame 31. After the adapter portion 420 of the conductive connector 400 is connected to the metal frame 31, the pressing portion 410 presses the protrusion together, thereby grounding the metal bracket 110 to the metal frame 31.

[0128] For example, a recess is formed on the metal bracket 110 in the area corresponding to the protrusion. At least a portion of the pressing portion 410 is located within the recess of the metal bracket 110.

[0129] In this embodiment, the second circuit board 80 can be located inside the metal bracket 110. The metal bracket 110 can limit the position of the second circuit board 80, improving its positional stability. The grounding portion 112 of the metal bracket 110 is electrically connected to the second circuit board 80. The grounding portion 112 of the metal bracket 110 is grounded through the second circuit board 80. The second circuit board 80 can perform both component mounting and grounding functions, allowing it to be reused, reducing the difficulty of grounding structure design, assembly difficulty, and production costs.

[0130] In some examples, the charging interface 90 may be electrically connected to the second circuit board 80. The second circuit board 80 is a printed circuit board. The second circuit board 80 may serve as a sub-board.

[0131] In some examples, the grounding portion 112 of the metal bracket 110 is electrically connected to both the metal frame 31 and the second circuit board 80, so that grounding can be achieved simultaneously through both the metal frame 31 and the second circuit board 80. This effectively increases the number of grounding paths, facilitates current dispersion, and further reduces current loss. The second circuit board 80 includes a grounding point. The grounding portion 112 of the metal bracket 110 is electrically connected to the grounding point of the second circuit board 80.

[0132] In this embodiment, the main body 111 of the metal bracket 110 and the metal reinforcement 200 are in a non-electrically connected state, i.e., mutually insulated, to avoid interference with the signals transmitted in the first circuit board 70 caused by the metal bracket 110 and the metal reinforcement 200 being electrically connected. Along the thickness direction Z of the electronic device 10, there may be a gap between the main body 111 of the metal bracket 110 and the metal reinforcement 200, so that they do not contact each other. An insulator (not shown in the figure) may be provided on the surface of the main body 111 of the metal bracket 110 facing the metal reinforcement 200. The insulator can insulatingly separate the main body 111 of the metal bracket 110 and the metal reinforcement 200.

[0133] In some examples, the surface of the metal support 110 is sprayed with insulating varnish to form an insulator.

[0134] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0135] The embodiments described herein are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0136] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, systems, products, or devices.

[0137] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0138] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0139] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

An electronic device, characterized in that, include: Charging port; The first circuit board includes a connection terminal, the connection terminal having a ground terminal, and the connection terminal being electrically connected to the charging interface; A metal reinforcing member is stacked with the connecting end and is electrically connected to the grounding terminal; a bracket assembly includes a metal bracket and a conductive member, at least a portion of the connecting end is located within the metal bracket, the metal bracket includes a main body and a grounding part, the grounding part is electrically connected to the main body, the metal reinforcing member and the main body are respectively electrically connected to the conductive member, and the grounding part is used for grounding. The electronic device according to claim 1, characterized in that, The metal reinforcing member is disposed between the main body and the connecting end, and the conductive member is disposed between the metal reinforcing member and the main body. The electronic device according to claim 2, characterized in that, At least one of the metal reinforcing member and the main body is provided with a recess, and at least a portion of the conductive member is located within the space formed by the recess. The electronic device according to claim 3, characterized in that, The main body is provided with the recess, the recess has an opening facing the metal reinforcement, and the surface of the metal reinforcement facing the recess is a plane. The electronic device according to any one of claims 1 to 4 is characterized in that, One of the metal reinforcing member and the main body is welded to the conductive member, and the other abuts against the conductive member. The electronic device according to any one of claims 1 to 5 is characterized in that, The conductive component is an elastic structural component, and the metal reinforcing component and the main body respectively apply compressive stress to the conductive component. The electronic device according to claim 6, characterized in that, The conductive component is a metal structural component, which includes a base and an elastic support. One of the metal reinforcing component and the main body is connected to the base, and the other is connected to the elastic support. The electronic device according to claim 7, characterized in that, One of the metal reinforcing member and the main body is welded to the substrate, and the other abuts against the elastic support leg. The electronic device according to claim 7 or 8 is characterized in that, The number of the elastic support legs is two or more. The electronic device according to any one of claims 1 to 9 is characterized in that, The conductive element is a metal spring. The electronic device according to any one of claims 1 to 10, characterized in that, The first circuit board is a flexible circuit board. The electronic device according to any one of claims 1 to 11 is characterized in that, The charging interface includes a grounding pin, the grounding terminal is electrically connected to the grounding pin, and the metal reinforcement is electrically connected to the grounding pin. The electronic device according to claim 12, characterized in that, The grounding terminal includes a via and a metal pad. The metal pad is disposed in the via and has a central through hole. The grounding pin passes through the central through hole and is soldered to the metal pad. The electronic device according to claim 13 is characterized in that, The metal reinforcement has a clearance hole, which is provided corresponding to the center through hole of the metal pad. The grounding pin passes through the clearance hole and is welded to the metal reinforcement. The electronic device according to any one of claims 1 to 14 is characterized in that, The electronic device also includes a metal frame, and the grounding part is electrically connected to the metal frame, and the grounding part is grounded through the metal frame. The electronic device according to claim 15, characterized in that, The electronic device also includes a conductive connector, and the grounding part is connected to the metal frame through the conductive connector. The electronic device according to claim 16, characterized in that, The conductive connector includes a pressing part and an adapter part. The adapter part is threadedly connected to the metal frame, and the pressing part abuts against the grounding part. The electronic device according to claim 17, characterized in that, The metal bracket includes a protrusion that protrudes toward the metal frame and forms the grounding portion. The pressing portion presses against the surface of the protrusion facing away from the metal frame. The electronic device according to any one of claims 1 to 18 is characterized in that, The electronic device further includes a second circuit board located inside the metal bracket, the metal bracket limiting the second circuit board, and the grounding part electrically connected to the second circuit board, the grounding part being grounded through the second circuit board. The electronic device according to any one of claims 1 to 19 is characterized in that, The electronic device further includes a second circuit board, a battery, and a motherboard. The battery is disposed between the second circuit board and the motherboard, and is disposed on one side of the first circuit board. The first circuit board is electrically connected to the motherboard. The electronic device according to claim 19 or 20 is characterized in that, The electronic device also includes a metal frame, and the second circuit board is connected to the metal frame. The second circuit board is a printed circuit board. The electronic device according to any one of claims 1 to 21 is characterized in that, An insulator is provided on the surface of the main body facing the metal reinforcement.

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