Deposition mask for depositing OLED pixels

Abstract

A deposition mask according to an embodiment of the present invention includes a support portion including a first layer having a thermal expansion coefficient less than a thermal expansion coefficient of the second layer and a second layer having a hardness greater than a hardness of the second layer, and a mask portion on the support portion, and the second layer contains the same material as the material of the mask portion. Further, the first layer has a coefficient of linear thermal expansion of from 0.310 to 6 cm / cm DEG C to 0.710 to 6 cm / cm DEG C, and the second layer has a coefficient of linear thermal expansion of from 1.410 to 6 cm / cm DEG C to 2.010 to 6 cm / cm DEG C.

Description

Technical Field

[0001] The implementation relates to a deposition mask for OLED pixel deposition. Background Technology

[0002] Display devices are used in a wide variety of devices. For example, they are used in small devices such as smartphones or tablet PCs. Alternatively, they are used in large devices such as TVs, monitors, or public display (PD) systems. Recently, there has been an increasing demand for ultra-high definition (UHD) displays with resolutions of 500 PPI (pixels per inch) or higher. Therefore, display devices with high resolution are being used in both small and large devices.

[0003] Based on the driving method, display devices are divided into LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode).

[0004] LCD is a display device that uses liquid crystals as drivers. OLED, on the other hand, is a display device that uses organic materials as drivers.

[0005] OLEDs can exhibit near-infinite contrast, have a response time 1000 times faster than LCDs, and offer superior viewing angles. Therefore, OLEDs have garnered attention as a potential replacement for LCDs.

[0006] OLEDs include an emissive layer. The emissive layer comprises an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask can include an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. Therefore, the deposition pattern can be used as a pixel.

[0007] An open-face mask is a thin sheet that forms a deposition pattern only at specific locations during OLED manufacturing. Open-face masks are used in the deposition process of forming a light-emitting layer on a backplane after the backplane is completed during the display manufacturing process. In other words, an open-face mask is a mask designed to deposit light-emitting materials across the entire surface of the display without covering any area within the display's operating range. Therefore, open-face masks are used when depositing a light-emitting layer with a single color of light-emitting material.

[0008] On the other hand, fine metal masks are used to alter the color of sub-pixels in the light-emitting layer. Therefore, fine metal masks include ultra-fine apertures. Processes using fine metal masks must perform several deposition processes. Therefore, this process requires precise alignment. Consequently, processes using fine metal masks are more difficult than processes using open masks.

[0009] When an open-mask is used to deposit the light-emitting layer of an OLED, only one color of light-emitting layer is formed. Therefore, a separate color filter (C / F) is required to achieve various colors. On the other hand, when a fine metal mask is used, an RGB light-emitting layer can be formed. Therefore, a separate color filter is not required. In other words, the technique using a fine metal mask is more difficult. However, compared to the method using an open mask, it has superior light efficiency because it does not require a filter to block light.

[0010] At the same time, as products using display devices become larger, the demand for larger deposition masks increases.

[0011] However, when a large-area deposition mask is fixed to a frame, the warpage of the deposition mask may increase. Consequently, the alignment of vias may become misaligned. Therefore, the quality of the deposition pattern may be reduced.

[0012] Therefore, a deposition mask with a novel structure is needed to solve the above problems.

[0013] As a technology related to the aforementioned deposition mask, Korean Publication No. KR10-2020-0058072 (May 27, 2020) was disclosed. Summary of the Invention

[0014] Technical issues

[0015] The implementation provides a deposition mask with improved reliability.

[0016] The technical problems to be solved by the proposed embodiments are not limited to those described above, and other technical problems not mentioned can be clearly understood by those skilled in the art to which the proposed embodiments pertain.

[0017] Technical solutions

[0018] The deposition mask according to the embodiment includes a support portion and a mask portion on the support portion, wherein the support portion includes a first layer and a second layer, wherein the coefficient of thermal expansion of the first layer is less than the coefficient of thermal expansion of the second layer, wherein the hardness of the first layer is greater than the hardness of the second layer, and wherein the second layer comprises the same material as the mask portion.

[0019] Furthermore, the linear thermal expansion coefficient of the first layer is 0.3. 10 -6 cm / cm℃ to 0.7 10 -6 The coefficient of linear thermal expansion is 1.4 cm / cm℃, and the coefficient of linear thermal expansion of the second layer is 1.4. 10 -6 cm / cm℃ to 2.0 10 -6 cm / cm℃.

[0020] Furthermore, the difference between the linear thermal expansion coefficients of the first and second layers is 1. 10 -6 cm / cm℃ to 1.5 10 -6 cm / cm℃.

[0021] In addition, the Vickers hardness (HV) of the first layer is 1100 to 1200, and the Vickers hardness (HV) of the second layer is 100 to 200.

[0022] In addition, the first layer consists of quartz, and the second layer consists of invar alloy.

[0023] In addition, the thickness of the support portion is greater than the thickness of the mask portion, and the thickness of the support portion is 100 µm to 15 mm.

[0024] In addition, the thickness of the first layer is greater than the thickness of the second layer, and the thickness of the second layer is 1 to 2 times the thickness of the mask portion.

[0025] In addition, the mask portion includes a deposition region and a non-deposition region. The deposition region includes multiple effective regions. Each effective region includes a first effective region and a second effective region surrounding the first effective region. Through holes are disposed in the first effective region, and dummy through holes are disposed in the second effective region.

[0026] In addition, the support includes a plurality of holes that overlap with each effective area. The holes include a short width area and a long width area. The short width area overlaps with the first effective area, but does not overlap with the second effective area.

[0027] In addition, the second layer is disposed on at least one of the lower portion, upper portion and side portion of the first layer.

[0028] Additionally, a second layer is disposed on the lower portion and the upper portion of the first layer, the second layer including a second first layer disposed on the lower portion of the first layer and a second second layer disposed on the upper portion of the second layer, and at least one of the second first layer and the second second layer includes a recess.

[0029] In addition, the concave areas overlap with non-depositional areas.

[0030] Additionally, the non-deposited area includes a semi-etched portion and an opening portion, and the recess overlaps with at least one of the semi-etched portion and the opening portion.

[0031] In addition, the thickness of the mask portion is 5 µm to 40 µm, and the length of the mask portion exceeds 1200 mm to 2500 mm.

[0032] In addition, a second layer of mask frame is joined to the fixed mask part and the support part.

[0033] In addition, the second layer consists of the same material as the mask frame.

[0034] Meanwhile, the deposition mask according to the embodiment includes a support portion and a plurality of mask portions on the support portion, wherein the support portion includes Invar alloy, quartz, or a mixture of Invar alloy and quartz, and the mask portions include a first mask portion and a second mask portion, and the first mask portion and the second mask portion are spaced apart from each other.

[0035] In addition, each of the first mask portion and the second mask portion includes a deposition region and a non-deposition region. The deposition region includes multiple effective regions. Each effective region includes a first effective region and a second effective region surrounding the first effective region. A through-hole is disposed in the first effective region, and a dummy through-hole is disposed in the second effective region.

[0036] In addition, the support portion includes a plurality of holes that overlap with the effective areas of the first mask portion and the second mask portion. The holes include a short-width area and a long-width area. The short-width area overlaps with the first effective area, but does not overlap with the second effective area.

[0037] Beneficial effects

[0038] The deposition mask according to the embodiment includes a support portion. The support portion supports the mask.

[0039] The support consists of a first layer and a second layer.

[0040] The first layer has a relatively small coefficient of thermal expansion and high rigidity. Therefore, it can prevent deformation and damage to the support, thus improving the reliability of the deposition mask. Additionally, it can prevent misalignment of vias.

[0041] The second layer comprises at least one material that is the same as or similar to that of the mask and the mask frame. Therefore, the support can be easily joined to the mask and the mask frame. This improves the process efficiency and reliability of the deposition mask.

[0042] The support portion may include multiple recesses. At least one of the mask and mask frame engages while filling the interior of the recesses. This improves the bonding strength of the support portion, mask, and mask frame. Consequently, it enhances the process efficiency and reliability of the deposition mask.

[0043] The support includes multiple holes. These holes overlap with the effective area of ​​the mask. Specifically, the holes overlap with the through-holes of the mask. Furthermore, the holes do not overlap with the dummy through-holes of the mask. Therefore, organic material can be prevented from passing through the dummy through-holes. Thus, it is possible to prevent adjacent deposition patterns from overlapping due to organic material passing through the dummy through-holes. Furthermore, the shading effect of the deposition pattern can be reduced. Therefore, the deposition efficiency of the deposition mask is improved. Attached Figure Description

[0044] Figure 1 This is a view showing the combination of a deposition mask and a frame according to an embodiment.

[0045] Figure 2 This is a cross-sectional view of an organic deposition apparatus including a deposition mask according to an embodiment.

[0046] Figure 3 This is a view showing a deposition pattern formed on a deposition substrate through through-holes in a deposition mask according to an embodiment.

[0047] Figure 4 This is a view showing a stretched deposition mask according to an embodiment.

[0048] Figure 5 This is a top view of the deposition mask according to the implementation method.

[0049] Figure 6 It is along Figure 5 A cross-sectional view of the A-A' region.

[0050] Figure 7 This is a top view of the support portion of the deposition mask according to the embodiment.

[0051] Figures 8 to 11 It is along Figure 7 A cross-sectional view of the B-B' region.

[0052] Figure 12 This is a top view of a deposition mask according to another embodiment.

[0053] Figures 13 to 16 This is a cross-sectional view showing the combination of the deposition mask and frame according to an embodiment.

[0054] Figures 17 to 19 This is a view showing various combinations of deposition masks and frames according to embodiments. Detailed Implementation

[0055] In the following, embodiments of the invention will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the invention are not limited to the portion of the described embodiments and may be implemented in various other forms. Furthermore, within the spirit and scope of the invention, one or more elements of the embodiments may be selectively combined and substituted. Moreover, unless otherwise explicitly defined and described, the terms used in the embodiments of the invention (including technical and scientific terms) may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in commonly used dictionaries may be interpreted as having a meaning consistent with their meaning in the context of the relevant field.

[0056] Furthermore, the terminology used in the embodiments of the present invention is for describing the embodiments and is not intended to limit the invention. In this specification, unless specifically stated in the phrase, the singular form may also include the plural form, and may include at least one of all combinations of A, B and C that can be combined when described in “at least one (or more) of A, B and C”.

[0057] Furthermore, when describing the elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and the terms are not limited to the nature, order, or sequence of the elements.

[0058] Furthermore, when an element is described as being “connected” or “coupled” to another element, it can include not only cases where the element is directly “connected” or “coupled” to another element, but also cases where the element is “connected” or “coupled” to another element through which the element is connected or “coupled” to other elements.

[0059] Furthermore, when described as being formed or positioned “above” or “below” in each element, “above” or “below” can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or positioned between the two elements.

[0060] Furthermore, when expressed as "up" or "down", it can include not only the upward direction based on a single element, but also the downward direction based on a single element.

[0061] In the following description, the deposition mask according to the embodiments will be described with reference to the accompanying drawings.

[0062] The deposition mask described below is a fine metal mask (FMM), which can form RGB pixel patterns on a deposition substrate by depositing organic materials such as red, green and blue on the deposition substrate, and the following description does not apply to open masks (OM).

[0063] Figures 1 to 4 This is a view used to illustrate the process of depositing organic materials on a deposition substrate 300 using a deposition mask 100 according to an embodiment.

[0064] Reference Figures 1 to 4 The organic material deposition equipment includes a deposition mask 100, a mask frame 200, a deposition substrate 300, an organic material deposition container 400, and a vacuum chamber 500.

[0065] The deposition mask 100 includes at least one of a metal and a non-metal. Specifically, the deposition mask 100 includes both a metal and a non-metal. The deposition mask 100 will be described in detail below.

[0066] The deposition mask 100 includes an effective portion. Organic material passes through the effective portion. The effective portion includes a plurality of vias TH. The vias TH are formed to correspond to a pattern to be formed on the deposition substrate 300.

[0067] The mask frame 200 includes an opening 205. Through-holes TH are provided in the region corresponding to the opening 205. Therefore, organic material supplied to the organic material deposition container 400 is deposited on the deposition substrate 300. A deposition mask 100 is arranged and fixed to the mask frame 200. For example, the deposition mask 100 is fixed to the mask frame 200 by welding.

[0068] The mask frame 200 is made of a material with a small coefficient of thermal expansion. For example, the mask frame 200 is made of Invar alloy. Therefore, deformation of the mask frame 200 during welding can be prevented.

[0069] The deposition substrate 300 is a substrate used in the manufacture of display devices. For example, an OLED pixel pattern is formed on the deposition substrate 300. In order to form pixels that are the three primary colors of light, organic patterns of red, green, and blue are formed on the deposition substrate 300. That is, an RGB pattern is formed on the deposition substrate 300.

[0070] The organic deposition container 400 is a crucible. Organic material is provided inside the crucible. The organic deposition container 400 moves within a vacuum chamber 500. That is, the organic deposition container 400 moves in one direction within the vacuum chamber 500. For example, the organic deposition container 400 moves in the width direction of the deposition mask 100 within the vacuum chamber 500.

[0071] A heat source and / or current is supplied to the organic material deposition container 400. As a result, organic material is deposited on the deposition substrate 300.

[0072] Reference Figure 3The deposition mask 100 includes a first surface 1S and a second surface 2S. Specifically, the deposition mask 100 includes a mask portion 110 and a support portion 120. The mask 100 includes a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are opposing surfaces.

[0073] The first surface 1S includes a small-area hole V1. The second surface 2S includes a large-area hole V2. For example, multiple small-area holes V1 and multiple large-area holes V2 are formed on the first surface 1S and the second surface 2S, respectively.

[0074] Additionally, the deposition mask 100 includes vias TH. The vias TH are formed by a connecting portion CA that links the boundaries of small-area vias V1 and large-area vias V2.

[0075] The width of the large-area hole V2 is greater than the width of the small-area hole V1. The width of the small-area hole V1 is measured on the first surface 1S. The width of the large-area hole V2 is measured on the second surface 2S.

[0076] Additionally, the width of the connecting portion CA has a defined dimension. Specifically, the width of the connecting portion CA can be from 15 µm to 33 µm. More specifically, the width of the connecting portion CA can be from 19 µm to 33 µm. Even more specifically, the width of the connecting portion CA can be from 20 µm to 27 µm. If the width of the connecting portion CA exceeds 33 µm, it becomes difficult to achieve a resolution of 500 PPI or higher. Furthermore, if the width of the connecting portion CA is less than 15 µm, defects may occur during the deposition process.

[0077] The small-area aperture V1 faces the deposition substrate 300. The small-area aperture V1 is arranged close to the deposition substrate 300. Therefore, the small-area aperture V1 has a shape corresponding to the deposition pattern DP.

[0078] The large-area aperture V2 faces the organic deposition container 400. Therefore, organic material supplied from the organic deposition container 400 can be contained with a wide width through the large-area aperture V2. In addition, fine patterns can be rapidly formed on the deposition substrate 300 through the small-area aperture V1.

[0079] Therefore, the organic material contained in the large-area aperture V2 is deposited on the deposition substrate 300 through the small-area aperture V1. Thus, one of the red, green, or blue pixel patterns is formed on the deposition substrate 300. Then, the above process is repeated. Therefore, red, green, or blue pixel patterns are all formed on the deposition substrate 300.

[0080] Reference Figure 4 The deposition mask 100 is stretched in one direction to be fixed to the mask frame. Specifically, the deposition mask 100 is stretched in the longitudinal direction.

[0081] The opening area of ​​the deposition mask 100 is different for each region. Therefore, the magnitude of the tension applied to each region may be different. Consequently, the tensioning length of the deposition mask 100 may be different for each region.

[0082] Furthermore, the alignment of vias can be misaligned due to stress generated by tension. This misalignment can increase as the deposition mask becomes larger. Consequently, the quality of the deposition pattern deposited through the deposition mask may decrease.

[0083] The following section will describe deposition masks that can solve the above problems.

[0084] Reference Figure 5 and Figure 6 The deposition mask 100 may include multiple layers. Specifically, the deposition mask 100 includes a mask portion 110 and a support portion 120.

[0085] The mask 100 is disposed on the support portion 120. Specifically, the mask 100 and the support portion 120 are engaged.

[0086] The mask portion 110 comprises metal. Specifically, the mask portion 110 comprises a metal with a small coefficient of thermal expansion. For example, the mask portion 110 may comprise an iron-nickel alloy. For example, the mask portion 110 may comprise an Invar alloy.

[0087] Mask section 110 includes a deposition area DA and a non-deposition area NDA.

[0088] The deposition region DA is the area used to form the deposition pattern. The deposition region DA can be defined as the area in the longitudinal direction of the mask 100 from the point where the via first begins to the point where the via ends.

[0089] The deposition area DA includes the effective area AA and the ineffective area UA. The effective area AA is the area where vias TH and island portions IS are formed. The ineffective area UA is the area where no vias TH or island portions IS are formed. The island portions IS are the areas of mask portion 110 that have not been etched.

[0090] Furthermore, the sedimentary region DA comprises multiple effective regions AA. Effective regions AA include a first effective region AA1 and a second effective region AA2. The second effective region AA2 is arranged to surround the first effective region AA1. The area of ​​the first effective region AA1 is larger than the area of ​​the second effective region AA2.

[0091] Multiple through-holes TH are set in the first effective area AA1. Multiple dummy through-holes DTH are set in the second effective area AA2.

[0092] The organic material passes through the first effective region AA1. However, the organic material does not pass through the second effective region AA2. Specifically, the organic material does not move towards the dummy via TH. Therefore, the organic material passes through the via TH and is deposited on the deposition substrate 300.

[0093] By creating a dummy through-hole DTH, the uniformity of the through-hole TH can be improved. Furthermore, the stress difference between the first effective region AA1 and the ineffective region UA ​​can be reduced through the second effective region AA2. Therefore, cracks can be prevented from forming in both the effective region AA and the ineffective region UA.

[0094] The sedimentary region DA comprises multiple separation regions IA1 and IA2. Separation regions IA1 and IA2 are arranged between adjacent effective regions. Multiple effective regions are separated by separation regions IA1 and IA2.

[0095] The non-deposition region NDA is the region that does not participate in deposition. The non-deposition region NDA may include a semi-etched portion HF and an opening portion. The semi-etched portion HF can disperse the stress generated when the mask portion 110 is tensioned. In addition, the opening portion is the area for fixing the fixture for tensioning the mask portion 110. Therefore, the wave deformation of the mask portion 110 can be reduced.

[0096] The mask portion 110 may have a set thickness. Specifically, the thickness T1 of the mask portion 110 may be 5 µm to 40 µm, 10 µm to 30 µm, or 15 µm to 25 µm.

[0097] The mask portion 110 may have a set length. Specifically, the length L1 of the mask portion 110 may exceed 1200 mm. More specifically, the length of the mask portion 110 may exceed 1200 mm to 2500 mm, 1500 mm to 2000 mm, or 1700 mm to 1900 mm.

[0098] The length L1 of the mask portion 110 can be less than or equal to the length L2 of the support portion 120. For example, the length L1 of the mask portion 110 can be less than the length L2 of the support portion 120.

[0099] If the length of the mask portion 110 is less than or equal to 1200 mm, the tensioning process can be controlled to prevent misalignment of the through holes. However, if the length of the mask portion 110 exceeds 1200 mm, misalignment of the through holes may occur during the tensioning process.

[0100] To address this issue, the deposition mask 100 includes a support portion 120. The support portion 120 supports the mask portion 110.

[0101] The support portion 120 includes a plurality of holes H. Each hole H has a short width and a long width. Organic material moves in the direction from the long width to the short width. Therefore, the organic material can easily move into the effective area AA of the mask 100.

[0102] The hole H can be located in the region overlapping with the effective region AA. Specifically, the hole H can be located in the region overlapping with the first effective region AA1. More specifically, the short-width region of the hole can be arranged in the region overlapping with the first effective region AA1.

[0103] Additionally, the hole H can be located in a region that does not overlap with the second effective region AA2. Specifically, the short-width region of the hole can be located in a region that does not overlap with the second effective region AA2.

[0104] Therefore, the short-width region of hole H can overlap with the via TH, but does not need to overlap with the dummy via DTH. Thus, organic material can be deposited on the deposition substrate 300 by sequentially passing through hole H and via TH.

[0105] Reference Figures 7 to 11 The support portion 120 may include multiple layers. Specifically, the support portion 120 may include a first layer 121 and a second layer 122.

[0106] Depending on the engagement or connection position of the mask frame 200, the second layer 122 can be arranged in various positions.

[0107] Reference Figure 8 The second layer 122 may include a second first layer 122a and a second second layer 122b. The second first layer 122a is disposed on the lower surface of the first layer 121. The second second layer 122b is disposed on the upper surface of the first layer 121.

[0108] Therefore, the second first layer 122a can be bonded to the mask frame 200, and the second second layer 122b can be bonded to the mask portion 110.

[0109] Reference Figure 9 The second layer 122 can be disposed on the side surface and the top surface of the first layer 121. Therefore, the second layer 122 disposed on the top surface of the first layer 121 can be bonded to the mask portion 110, and the second layer 122 disposed on the side surface of the first layer 121 can be bonded to the mask frame 200.

[0110] The second first layer 122a can be joined to the mask frame 200, and the second second layer 122b can be joined to the mask portion 110.

[0111] Reference Figure 10The second layer 122 can be disposed on the lower surface, upper surface and side surface of the first layer 121. Specifically, the second layer 122 can be disposed around the outer surface of the first layer 121.

[0112] Therefore, the second layer 122 disposed on the upper surface can be joined to the mask portion 110, and the second layer 122 disposed on the lower surface and the side surface can be joined to the mask frame 200.

[0113] The first layer 121 and the second layer 122 may be made of different materials. Specifically, the coefficients of thermal expansion of the first layer 121 and the second layer 122 may be different. Alternatively, the hardness of the first layer 121 and the second layer 122 may be different.

[0114] For example, the linear thermal expansion coefficient of the first layer 121 can be smaller than that of the second layer 122. For instance, the linear thermal expansion coefficient of the first layer 121 can be 0.3. 10 -6 cm / cm℃ to 0.7 10 -6 cm / cm℃. Additionally, the linear thermal expansion coefficient of the second layer, 122, can be 1.4. 10 -6 cm / cm℃ to 2.0 10 -6 cm / cm℃. Additionally, the difference between the linear thermal expansion coefficients of the first layer 121 and the second layer 122 can be 2. 10 -6 cm / cm℃ or less. Specifically, the difference between the linear thermal expansion coefficients of the first layer 121 and the second layer 122 can be 1. 10 -6 cm / cm℃ to 1.5 10 -6 cm / cm℃.

[0115] The hardness of the first layer 121 can be greater than that of the second layer 122. For example, the Vickers hardness (HV) of the first layer 121 can be 1100 to 1200. Conversely, the Vickers hardness (HV) of the second layer 122 can be 100 to 200. Furthermore, the difference in Vickers hardness between the first layer 121 and the second layer 122 can be 1000 or less. Specifically, the difference in Vickers hardness between the first layer 121 and the second layer 122 can be 800 to 1000. The first layer 121 may comprise a material different from that of the mask portion 110.

[0116] Additionally, the second layer 122 may comprise the same or similar material as the mask portion 110. For example, the first layer 121 may comprise quartz. Furthermore, the second layer 122 may comprise Invar alloy.

[0117] The first layer 110 has a small coefficient of thermal expansion and relatively high hardness. Therefore, deformation of the support portion 120 caused by temperature changes can be reduced. Therefore, misalignment of the through holes in the mask portion 110 due to deformation of the support portion 120 can be prevented.

[0118] Furthermore, the support portion 120 can have improved rigidity. Therefore, the support portion 120 can be protected from damage by external impacts. In addition, it can prevent impacts from being transmitted to the mask portion 110 through the support portion 120. Therefore, the reliability of the deposition mask can be improved.

[0119] The second layer 120 has a relatively large coefficient of thermal expansion and a relatively low hardness. However, the second layer 120 comprises the same or similar material as the mask portion 110 and the mask frame 200. Therefore, the support portion 120 can be easily joined to the mask portion 110 and the mask frame 200 through the second layer 122.

[0120] The first layer 121 comprises a different material than the mask portion 110 and the mask frame 200. Therefore, the bonding force between the first layer 121 and the mask portion 110 can be reduced. In addition, the bonding force between the first layer 121 and the mask frame 200 can be reduced.

[0121] Additionally, when separate bonding layers are arranged in the region between the first layer 121 and the mask portion 110, and in the region between the first layer 121 and the mask frame 200, the thickness and weight of the deposition mask 100 may increase. Furthermore, the shape of the support portion 120 may be altered due to the difference in the coefficients of thermal expansion between the bonding layer and the support portion 120.

[0122] Therefore, the second layer 122 is disposed on the first layer 121. The second layer 122 comprises the same or similar material as at least one of the mask portion 110 and the mask frame 200.

[0123] Therefore, the bonding force between the mask portion 110 and the support portion 120 can be improved. Furthermore, the bonding force between the mask frame 200 and the support portion 120 can be improved. Additionally, the difference in the coefficients of thermal expansion between the first layer 121 and the second layer 122 has a set range. That is, the difference in the coefficients of thermal expansion between the first layer 121 and the second layer 122 is small. Therefore, shape deformation of the deposition mask due to the difference in the coefficients of thermal expansion between the first layer 121 and the second layer 122 can be prevented.

[0124] The thickness T2 of the support portion 120 may differ from the thickness T1 of the mask portion 110. Specifically, the thickness T2 of the support portion 120 may be greater than the thickness T1 of the mask portion 110. The thickness T2 of the support portion 120 may be 20 times or more than the thickness T1 of the mask portion 110. For example, the thickness T2 of the support portion 120 may be 100 µm to 15 mm, 500 µm to 10 mm, 1 mm to 8 mm, or 3 mm to 6 mm.

[0125] If the thickness T2 of the support portion 120 is less than 100 µm, the mask portion 110 cannot be adequately supported on the support portion 120. Furthermore, the support portion 120 may be damaged by external impacts. If the thickness T2 of the support portion 120 exceeds 15 mm, the total thickness and weight of the deposition mask 100 increase. Therefore, processing the deposition mask becomes difficult, and process efficiency may decrease. Additionally, the thickness of the mask frame 200 may also increase.

[0126] The thicknesses of the first layer 121 and the second layer 122 can be different. Specifically, the thickness T2-1 of the first layer 121 can be greater than the thickness T2-2 of the second layer 122.

[0127] The thickness T2-2 of the second layer 122 can be greater than or equal to the thickness T1 of the mask portion 110. Alternatively, the thickness T2-2 of the second layer 122 can be greater than or equal to the thickness of the mask frame 200. For example, the thickness T2-2 of the second layer 122 can be 1 to 2 times the thickness T1 of the mask portion 110. Alternatively, the thickness T2-2 of the second layer 122 can be 1 to 2 times the thickness of the mask frame 200.

[0128] If the thickness T2-2 of the second layer 122 is less than the thickness of the mask portion 110 or the mask frame 200, bonding defects in the second layer 122 may occur. Specifically, if the thickness T2-2 of the second layer 122 becomes smaller, the first layer 121 may be exposed during the bonding process. Therefore, the bonding strength of the support portion 120, the mask portion 110, and the mask frame 200 may be reduced. Consequently, the reliability of the deposition mask may be reduced.

[0129] Reference Figure 11 The support portion 120 may include at least one recess G. For example, the support portion 120 may include multiple recesses G.

[0130] The recess G is formed on the second layer 122. For example, the recess G may be formed in at least one of the second first layer 122a and the second second layer 122b.

[0131] The recesses G can be provided in the two edge regions of the support portion 120. Specifically, the recesses G can face each other in the longitudinal direction of the support portion 120. The bonding force between the second layer 122 and the mask portion 110 or between the second layer 122 and the mask frame 200 can be improved by the recesses G.

[0132] The second layer 122 is welded to the mask portion 110 and the mask frame 200. That is, the second layer 122, the mask portion 110, and the mask frame 200 are partially fused and bonded. The molten material of the mask portion 110 and the mask frame 200 can bond while filling the interior of the recess G. Therefore, since the mask portion 110 and the mask frame 200 are fixed by the recess G, the bonding force of the second layer 122, the mask portion 110, and the mask frame 200 can be improved.

[0133] The recess G does not overlap with the deposition area DA of the mask portion 110. The recess G may overlap with the non-deposition area NDA of the mask portion 110. The recess G may overlap with the half-etched portion HF. Alternatively, the recess G may overlap with the opening portion.

[0134] Therefore, the recess G can be an alignment mark. For example, the recess G and the half-etched portion HF can be aligned. Alternatively, the recess G and the opening portion can be aligned. Furthermore, the recess G and the alignment mark of the mask frame 200 can be aligned.

[0135] Therefore, the alignment of the support portion 120, the mask portion 110, and the mask frame 200 can be improved. In addition, the process of forming individual alignment marks in the support portion 120 can be omitted.

[0136] Figure 12 This is a top view of a deposition mask according to another embodiment.

[0137] Reference Figure 12 According to another embodiment, the deposition mask includes a plurality of mask portions. Specifically, a first mask portion 111 and a second mask portion 112 are disposed on the support portion 120.

[0138] The first mask portion 111 and the second mask portion 112 are disposed on the same support portion 120. That is, the first mask portion 111 and the second mask portion 112 are disposed on one support portion 120.

[0139] exist Figure 12 In this embodiment, two mask portions are disposed on one support portion. However, the implementation is not limited to this. Specifically, three or more mask portions may be disposed on one support portion.

[0140] The first mask portion 111 and the second mask portion 112 are disposed on the support portion 120 at a distance from each other.

[0141] The support portion 120 may include a single layer or multiple layers.

[0142] For example, the support portion 120 may include multiple layers. Specifically, the support portion 120 may include a first layer 121 and a second layer 122, which corresponds to the previously described embodiments.

[0143] Alternatively, the support portion 120 may include a single layer. Specifically, the support portion 120 may consist of only a first layer 121.

[0144] The support portion 120 may include quartz or Invar alloy. Alternatively, the support portion 120 may include a mixture of quartz and Invar alloy.

[0145] The first mask portion 111 and the second mask portion 112 are fixed by the support portion 120. Therefore, when the first mask portion 111 and the second mask portion 112 are joined to the mask frame 200, misalignment of the effective area AA and the ineffective area UA can be prevented.

[0146] Furthermore, since multiple mask sections are arranged on a single support 120, the area of ​​ineffective and non-deposition regions of the mask sections can be reduced. Therefore, more mask sections can be arranged on a mask frame of the same size. In other words, more effective regions can be arranged on a mask frame of the same size.

[0147] The support portion includes multiple holes. Specifically, the support portion includes multiple holes corresponding to the effective areas of the first mask portion 111 and the second mask portion 112.

[0148] Reference Figures 13 to 16 The deposition mask 100 is joined to the frame 300.

[0149] Reference Figure 13 The mask portion 110 and the mask frame 200 are disposed on the support portion 120 and are engaged.

[0150] Specifically, the mask portion 110 and the second second layer 122b are fixed together by welding. The mask portion 110 and the second second layer 122b are made of the same or similar materials, so they are easy to join.

[0151] In addition, the mask frame 200 and the second first layer 122a are fixed together by welding. The mask frame 200 and the second first layer 122a are made of the same or similar materials, so they are easy to join.

[0152] Reference Figure 14 The mask portion 110 is disposed on and engaged with the support portion 120.

[0153] Specifically, the mask portion 110 and the second layer 122 disposed on the upper surface are fixed by welding. The mask portion 110 and the second layer 122 are easily joined because the mask portion 110 and the second layer 122 contain the same or similar materials.

[0154] Furthermore, the mask frame 200 and the second layer 122 disposed on the side surface are fixed together by welding. The mask frame 200 and the second layer 122 are easily joined because the mask frame 200 and the second layer 122 contain the same or similar materials.

[0155] Reference Figure 15 The mask portion 110 is disposed on and engaged with the support portion 120.

[0156] Specifically, the mask portion 110 and the second layer 122 disposed on the upper side are fixed by welding. The mask portion 110 and the second layer 122 disposed on the upper side are easily joined because they contain the same or similar materials.

[0157] Furthermore, the mask frame 200 and the second layer 122 disposed on the side surface and the underside are fixed together by welding. The mask frame 200 and the second layer 122 are easily joined because they contain the same or similar materials.

[0158] Reference Figure 16 The mask portion 110 and the mask frame 200 are disposed on the support portion 120 and are engaged.

[0159] Specifically, the mask portion 110 and the second second layer 122b are fixed by welding. The mask portion 110 and the second second layer 122b are easily joined because they contain the same or similar materials. In addition, a portion of the mask portion 110 is inserted into the interior of the recess G. Therefore, the bonding force between the mask portion 110 and the support portion 120 is increased.

[0160] Furthermore, the mask frame 200 and the second first layer 122a are fixed together by welding. The mask frame 200 and the second first layer 122a are easily joined because they contain the same or similar materials. Additionally, a portion of the mask frame 200 is inserted into the interior of the recess G. Therefore, the bonding force between the mask frame 200 and the support portion 120 is increased.

[0161] The deposition mask according to the embodiment includes a support portion. The support portion supports the mask.

[0162] The support consists of a first layer and a second layer.

[0163] The first layer has a relatively small coefficient of thermal expansion and high rigidity. Therefore, it can prevent deformation and damage to the support, thus improving the reliability of the deposition mask. Additionally, it can prevent misalignment of vias.

[0164] The second layer comprises at least one material that is the same as or similar to that of the mask and the mask frame. Therefore, the support can be easily joined to the mask and the mask frame. This improves the process efficiency and reliability of the deposition mask.

[0165] The support portion may include multiple recesses. At least one of the mask and mask frame engages while filling the interior of the recesses. This improves the bonding strength of the support portion, mask, and mask frame. Consequently, it enhances the process efficiency and reliability of the deposition mask.

[0166] The support includes multiple holes. These holes overlap with the effective area of ​​the mask. Specifically, the holes overlap with the through-holes of the mask. Furthermore, the holes do not overlap with the dummy through-holes of the mask. Therefore, organic material can be prevented from passing through the dummy through-holes. Thus, it is possible to prevent adjacent deposition patterns from overlapping due to organic material passing through the dummy through-holes. Furthermore, the shading effect of the deposition pattern can be reduced. Therefore, the deposition efficiency of the deposition mask is improved.

[0167] Figures 17 to 19 This is a view showing various combinations of deposition masks and frames according to embodiments.

[0168] Reference Figure 17 The deposition mask 100 has a rod shape. Furthermore, multiple deposition masks can be combined with the mask frame 300. The multiple deposition masks 100 can be arranged to be spaced apart from each other or in contact with each other. Each deposition mask 100 includes multiple effective regions AA.

[0169] Therefore, a deposition mask can be used to form multiple pixel patterns for the same electronic component.

[0170] The description of the deposition mask above can be applied to Figure 16 The deposition mask. However, the implementation is not limited to this.

[0171] Reference Figure 18 The deposition mask 100 includes multiple effective regions AA. These multiple effective regions AA can be arranged in multiple rows (horizontal) and multiple columns (vertical). Therefore, the number of deposition masks bonded to the mask frame 300 is reduced. This improves the efficiency of the deposition process. Furthermore, the deposition mask can be used to form multiple pixel patterns for the same electronic component.

[0172] Reference Figure 19 A deposition mask 100 is attached to a mask frame 300. The deposition mask 100 includes multiple effective regions AA. The multiple effective regions AA can be arranged in multiple rows (horizontal) and multiple columns (vertical). Therefore, the number of deposition masks attached to the mask frame is reduced. Therefore, the deposition process efficiency is improved.

[0173] Furthermore, the effective area AA can be defined as multiple cell regions (UN). Each cell region (UN) can include different vias. Different mask portions 110 can be arranged in each of the cell regions (UN). Therefore, the deposition mask 100 can have multiple mask portions 110 arranged on a support portion 120.

[0174] Therefore, deposition masks can be used to form multiple pixel patterns for different electronic components.

[0175] The features, structures, effects, etc., described in the embodiments are included in at least one embodiment, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, content related to such combinations and variations should be interpreted as being included within the scope of the embodiments.

[0176] The foregoing has primarily described embodiments, but these are merely examples and not limiting. Those skilled in the art will recognize that various modifications and applications not shown above are possible without departing from the fundamental characteristics of these embodiments. For example, each component specifically shown in the embodiments can be implemented through modifications. Furthermore, differences associated with these modifications and applications should be interpreted as including within the scope of the embodiments set forth in the appended claims.

Claims

1. A deposition mask, comprising: Support section; as well as The mask portion on the support portion, The support portion includes a first layer and a second layer. The coefficient of thermal expansion of the first layer is smaller than that of the second layer. Wherein, the hardness of the first layer is greater than the hardness of the second layer, and The second layer comprises the same material as the mask portion.

2. The deposition mask according to claim 1, wherein, The linear thermal expansion coefficient of the first layer is 0.

3. 10 -6 cm / cm℃ to 0.7 10 -6 cm / cm℃, and The linear thermal expansion coefficient of the second layer is 1.

4. 10 -6 cm / cm℃ to 2.0 10 -6 cm / cm℃.

3. The deposition mask according to claim 1, wherein, The difference between the linear thermal expansion coefficients of the first layer and the second layer is 1. 10 -6 cm / cm℃ to 1.5 10 -6 cm / cm℃.

4. The deposition mask according to claim 1, wherein, The Vickers hardness (HV) of the first layer is 1100 to 1200, and The Vickers hardness (HV) of the second layer is 100 to 200.

5. The deposition mask according to claim 1, wherein, The first layer includes quartz, and The second layer includes Invar alloy.

6. The deposition mask according to claim 1, wherein, The thickness of the support portion is greater than the thickness of the mask portion, and The thickness of the support portion is 100 µm to 15 mm.

7. The deposition mask according to claim 1, wherein, The thickness of the first layer is greater than the thickness of the second layer, and The thickness of the second layer is 1 to 2 times the thickness of the mask portion.

8. The deposition mask according to claim 1, wherein, The mask portion includes a deposition area and a non-deposition area. The deposition area includes multiple effective areas. Each effective region includes a first effective region and a second effective region surrounding the first effective region. Wherein, the through hole is disposed in the first effective area, and The dummy through-hole is located in the second effective area.

9. The deposition mask according to claim 8, wherein, The support portion includes multiple holes that overlap with each effective area. The hole includes a short-width region and a long-width region. Wherein, the short-width region overlaps with the first effective region, and The short-width region does not overlap with the second effective region.

10. The deposition mask according to claim 8, wherein, The second layer is disposed on at least one of the lower portion, upper portion, and side portion of the first layer.

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