Circuit board assembly and manufacturing method thereof, camera module and packaging method thereof, and electronic equipment

Abstract

The invention provides a circuit board assembly manufacturing method, which comprises the following steps that a through hole is formed in a printed circuit board, the printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arranged, and the through hole penetrates through the first surface and the second surface; a sensor is placed in the through hole, the sensor and the inner wall of the through hole are arranged at an interval, and the sensor is lower than the first surface and higher than or equal to the second surface; and fixing the sensor on the printed circuit board, and establishing electrical connection between the sensor and the printed circuit board. The invention further provides a camera module packaging method comprising the circuit board assembly, the circuit board assembly manufactured according to the manufacturing method, the camera module and electronic equipment comprising the camera module.

Description

Technical Field

[0001] This application relates to a method for manufacturing a circuit board assembly, a method for packaging a camera module including the circuit board assembly, a circuit board assembly, a camera module, and an electronic device including the camera module. Background Technology

[0002] Camera modules are widely used in mobile phones, laptops, toys, industrial inspection, automobiles, and medical devices. Consumer digital products, such as laptops, are increasingly trending towards thinner, lighter, and smaller designs, requiring camera modules to be even smaller. Reducing the size of camera modules remains a challenge to be solved. Summary of the Invention

[0003] The first aspect of this application provides a method for manufacturing a circuit board assembly, comprising the following steps: A through-hole is formed on a printed circuit board, the printed circuit board having a first surface and a second surface spaced apart from each other and arranged opposite to each other, the through-hole penetrating the first surface and the second surface; The sensor is placed inside the through hole, with the sensor spaced apart from the inner wall of the through hole. The height of the sensor is lower than the first surface and higher than or equal to the second surface. The sensor is fixed to the printed circuit board, and an electrical connection is established between the sensor and the printed circuit board.

[0004] The aforementioned circuit board assembly manufacturing method involves creating through holes on the printed circuit board, placing the sensor inside the through holes, and then directly fixing the sensor to the printed circuit board by connecting the side of the sensor to the inner wall of the through holes. This application's circuit board assembly manufacturing method reduces the height and size of the circuit board assembly without altering the dimensions of existing components.

[0005] Furthermore, the step of creating a through hole on the printed circuit board includes: creating a through hole on the printed circuit board, and creating a groove on the first surface near the through hole, wherein the groove communicates with the through hole on the side facing the through hole; The step of establishing an electrical connection between the sensor and the printed circuit board includes: providing a plurality of first pins on the edge of the sensor and providing a plurality of second pins on the bottom wall of the groove; and The plurality of first pins and the plurality of second pins are electrically connected by wires, the height of which is lower than the first surface.

[0006] Furthermore, the step of fixing the sensor to the printed circuit board includes: An adhesive is filled between the side of the sensor and the inner wall of the through hole to fix the sensor to the inner wall of the through hole, and the adhesive surrounds the sensor.

[0007] Furthermore, the step of placing the sensor within the through hole includes: Apply a Teflon coating to the die bonder; The printed circuit board and the sensor are placed on the die bonder; and The printed circuit board and the sensor are fixed by the die bonder.

[0008] Furthermore, the step of fixing the printed circuit board and the sensor using the die bonder includes: Multiple spaced-apart vent holes are formed on the die bonder; A vacuum pump is placed in each of the vent holes, and each vacuum pump is used to adsorb the printed circuit board and the sensor respectively.

[0009] A second aspect of this application provides a camera module packaging method, including: Create through-holes on the printed circuit board; Place the sensor inside the through hole; The sensor is fixed to the printed circuit board, and an electrical connection is established between the sensor and the printed circuit board; A filter is placed over the sensor and fixed to the first surface of the printed circuit board; and The lens assembly is placed over the filter and fixedly connected to the first surface of the printed circuit board, with the filter located between the lens assembly and the sensor.

[0010] The camera module packaging method described above integrates the circuit board assembly manufacturing method described above, and can achieve all the beneficial effects of the circuit board assembly manufacturing method described above.

[0011] Furthermore, the step of fixing the lens assembly to the first surface of the printed circuit board includes: The lens assembly is fixedly connected to the first surface of the printed circuit board by forming an adhesive between the lens assembly and the first surface.

[0012] A third aspect of this application provides a circuit board assembly, comprising: A printed circuit board having through holes; the printed circuit board having a first surface and a second surface spaced apart from each other and arranged opposite to each other, the through holes penetrating the first surface and the second surface; The sensor is located inside the through hole, fixed on the printed circuit board and electrically connected to the printed circuit board; the sensor is spaced apart from the inner wall of the through hole, and the height of the sensor is lower than the first surface and higher than or equal to the second surface.

[0013] The circuit board assembly described above, manufactured according to the aforementioned circuit board assembly manufacturing method, can achieve all the beneficial effects of the aforementioned circuit board assembly manufacturing method.

[0014] Furthermore, the first surface has a groove formed on at least one side of the through hole, the groove communicating with the through hole on the side facing the through hole, the edge of the sensor is provided with a plurality of first pins, the bottom wall of the groove is provided with a plurality of second pins, and the plurality of first pins and the plurality of second pins are electrically connected by a wire, the height of the wire being lower than the first surface.

[0015] Furthermore, an adhesive is filled between the side of the sensor and the inner wall of the through hole to fix the sensor to the inner wall of the through hole.

[0016] A fourth aspect of this application provides a camera module, comprising: The circuit board assembly as described above; A filter element is applied to the sensor and fixedly connected to the first surface of the printed circuit board, the filter element being spaced apart from the sensor; and A lens assembly covers the side of the filter furthest from the sensor and is fixedly connected to the first surface of the printed circuit board; wherein... The lens assembly is used to receive and transmit external light. The filter is located in the optical path from which the light is emitted by the lens assembly and is used to filter out part of the light. Another part of the light passes through the filter and is received by the sensor. The sensor is used to generate a corresponding image based on the light signal in the other part of the light.

[0017] The camera module described above, including the circuit board assembly described above, can achieve all the beneficial effects of the circuit board assembly described above.

[0018] The fifth aspect of this application provides an electronic device, comprising: The camera module as described above; and The display module is electrically connected to the printed circuit board and is used to display the images generated by the camera module.

[0019] The aforementioned electronic device, including the aforementioned camera module, can achieve all the beneficial effects of the camera module as described above. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the modules of an electronic device according to an embodiment of this application.

[0021] Figure 2 This is a three-dimensional structural diagram of the camera module according to an embodiment of this application.

[0022] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure along section line III-III.

[0023] Figure 4 for Figure 2 A schematic diagram of the exploded structure of the camera module.

[0024] Figure 5 This is a flowchart illustrating a method for manufacturing a circuit board assembly according to an embodiment of this application.

[0025] Figure 6 To manufacture using a die bonder Figure 2 The image shows an exploded view of the camera module.

[0026] Figure 7 This is a flowchart illustrating a camera module packaging method according to an embodiment of this application.

[0027] Explanation of main component symbols Electronic devices: 1 Camera module: 100 Circuit board assembly: 10 Printed circuit board: 11 First surface: 11a Second surface: 11b Through hole: 110 Inner wall: 110a Groove: 111 Bottom wall: 111a Second pin: 112 Sensors: 12 Pin 1: 121 Wire: 13 Filter: 20 Lens group: 30 Adhesive: 40 Display module: 200 Die bonders: 3 Vent hole: 300 The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0028] This application provides a camera module and an electronic device (e.g., a laptop, mobile phone, etc.) including the camera module. The camera module has a small size, which meets the requirements for miniaturization of electronic devices.

[0029] Please see Figure 1 The electronic device 1 in this application embodiment includes a camera module 100 and a display module 200. The camera module 100 is electrically connected to the display module 200. The camera module 100 is used to generate an image based on an optical signal, and the display module 200 is used to display the image generated by the camera module 100.

[0030] Please refer to the following: Figure 2 and Figure 3 The camera module 100 includes a circuit board assembly 10, a filter 20, and a lens assembly 30. The filter 20 is located between the circuit board assembly 10 and the lens assembly 30, and both the filter 20 and the lens assembly 30 are fixedly connected to the same surface of the circuit board assembly 10. In the camera module 100, the lens assembly 30 receives and transmits ambient light. The filter 20 is located in the optical path of the light emitted from the lens assembly 30, filtering out some of the light. The remaining light passes through the filter 20 and is received by the circuit board assembly 10, which generates a corresponding image based on the remaining light. The display module 200 is electrically connected to the circuit board assembly 10 and displays the image generated by the camera module 100.

[0031] Please see Figure 4 In this embodiment, the circuit board assembly 10 includes a printed circuit board 11 and a sensor 12. The sensor 12 is used to receive the light and generate a sensing electrical signal based on the light, which is used to generate an image.

[0032] The printed circuit board 11 has a first surface 11a and a second surface 11b that are spaced apart from each other and arranged opposite to each other. A through hole 110 is formed on the printed circuit board 11, which penetrates the first surface 11a and the second surface 11b. The sensor 12 is housed in the through hole 110, fixed on the printed circuit board 11, and electrically connected to the printed circuit board 11.

[0033] In this embodiment, a groove 111 is formed on at least one side of the through hole 110 on the first surface 11a of the printed circuit board 11. The side of the groove 111 facing the through hole 110 communicates with the through hole 110. A plurality of first pins 121 are provided on the edge of the sensor 12, and a plurality of second pins 112 are provided within the groove 111. In this embodiment, a plurality of second pins 112 are provided on the bottom wall 111a of the groove 111. The plurality of first pins 121 and the plurality of second pins 112 are electrically connected via wires 13 to electrically connect the sensor 12 to the printed circuit board 11. The height of the wires 13 is lower than the first surface 11a, meaning the wires 13 are completely contained within the groove 111. The opening of the through hole 110 is larger than the sensor 12, therefore the sensor 12 can be completely contained within the through hole 110, and there is a gap between the side of the sensor 12 and the inner wall 110a of the through hole 110. An adhesive 40 is filled between the side of the sensor 12 and the inner wall 110a to fix the side of the sensor 12 to the inner wall 110a of the through hole 110, thus fixing the sensor 12 to the printed circuit board 11. The recessed design of the groove 111 is to lower the second pin 112 of the printed circuit board 11 used for electrical connection with the sensor 12. This facilitates the lowering of the wire 13 that connects the printed circuit board 11 and the sensor 12 into the area of ​​the printed circuit board 11, saving space in the circuit board assembly 10 and the camera module 100, thereby reducing the thickness of the circuit board assembly 10 and the camera module 100. Therefore, the setting position of the groove 111 is determined according to the position of the first pin 121 on the sensor 12. Figure 4 In the illustrated embodiment, the sensor 12 has first pins 121 on opposite side edges. Correspondingly, grooves 111 and second pins 112 are formed on both sides of the through hole 110 corresponding to the sensor 12 with the first pins 121. In other embodiments, if the sensor 12 has first pins 121 on only one side edge, then it is only necessary to form grooves 111 and second pins 112 on the side of the through hole 110 corresponding to the sensor 12 with the first pins 121; conversely, if each side edge of the sensor 12 has first pins 121 for connection with the printed circuit board 11, then grooves 111 and second pins 112 can be formed on each side of the through hole 110.

[0034] The filter 20 completely covers the sensor 12 and the through-hole 110, and is fixedly connected to the first surface 11a of the printed circuit board 11. The filter 20 is spaced apart from the sensor 12 and the wire 13. The lens assembly 30 covers the side of the filter 20 away from the sensor 12 and is fixedly connected to the first surface 11a of the printed circuit board 11. In this embodiment, the projection of the filter 20 onto the printed circuit board 11 completely covers the sensor 12, and the projection of the lens assembly 30 onto the printed circuit board 11 completely covers the filter 20, so that light entering from the lens assembly 30 can reach the filter 20 and be received by the sensor 12 after passing through the filter 20.

[0035] Please see Figure 5 This application provides a method for manufacturing the above-described circuit board assembly 10, comprising the following steps: S1, a through hole 110 is formed on the printed circuit board 11. The printed circuit board 11 has a first surface 11a and a second surface 11b that are spaced apart from each other and arranged opposite to each other. The through hole 110 passes through the first surface 11a and the second surface 11b.

[0036] S2, the sensor 12 is placed in the through hole 110, the sensor 12 is spaced apart from the inner wall 111 of the through hole 110, and the height of the sensor 12 is lower than the first surface 11a and higher than or equal to the second surface 11b.

[0037] S3, fix the sensor 12 to the printed circuit board 11 and establish an electrical connection between the sensor 12 and the printed circuit board 11.

[0038] In step S1, a groove 111 is formed on the first surface 11a of the printed circuit board 11 near the through hole 110, and the side of the groove 111 facing the through hole 110 is connected to the through hole 110.

[0039] Step S2, the step of placing the sensor 12 into the through hole 110, includes: A Teflon coating is applied to the die bonder 3; The printed circuit board 11 and the sensor 12 are placed on the die bonder 3; The printed circuit board 11 and the sensor 12 are fixed by the die bonder 3.

[0040] In this embodiment, a Teflon coating is applied to the die bonder 3 to prevent the adhesive 40 from sticking to the die bonder 3 when the sensor 12 is fixedly connected to the printed circuit board 11, thus preventing the circuit board assembly 10 from being difficult to remove from the die bonder 3. In other embodiments, other types of materials, such as polyamide or polytetrafluoroethylene, may also be applied to the die bonder 3.

[0041] Furthermore, the step of fixing the printed circuit board 11 and the sensor 12 by the die bonder 3 includes: Multiple spaced-apart vent holes 300 are formed on the die bonder 3; A vacuum pump is placed in each vent 300, and each vacuum pump is used to adsorb the printed circuit board 11 and the sensor 12 respectively.

[0042] In step S3, the sensor 12 and the inner wall 111 of the through hole 110 are spaced apart, so there is a gap between the side of the sensor 12 and the inner wall 111.

[0043] The method for fixing the sensor 12 to the printed circuit board 11 is as follows: adhesive 40 is filled between the side of the sensor 12 and the inner wall 111 to fix the sensor 12 to the inner wall 111 of the through hole 110, and the adhesive 40 surrounds the sensor 12. The adhesive 40 can be a quick-drying glue.

[0044] The steps for establishing an electrical connection between sensor 12 and printed circuit board 11 include: Multiple first pins 121 are provided on the edge of the sensor 12, and multiple second pins 112 are provided on the bottom wall 111a of the groove 111; and Multiple first pins 121 and multiple second pins 112 are electrically connected by wires 13. The height of wires 13 is lower than that of the first surface 11a, so that wires 13 are completely located within the groove 111.

[0045] Please refer to the following: Figure 6 and Figure 7 This application also provides a packaging method for a camera module 100, which, based on the already fabricated circuit board assembly 10, requires the following steps: S4, the filter 20 is covered on the sensor 12 and fixed to the first surface 11a of the printed circuit board 11.

[0046] S5, the lens group 30 is placed over the filter 20 and fixedly connected to the first surface 11a of the printed circuit board 11, with the filter 20 located between the lens group 30 and the sensor 12.

[0047] In step S4, when the filter 20 is covered on the sensor 12 and fixed to the first surface 11a of the printed circuit board 11, since the height of the wire 13 is lower than the first surface 11a, the filter 20 and the wire 13 are spaced apart, so that the filter 20 can be directly attached to the first surface 11a of the printed circuit board 11.

[0048] In step S5, the lens assembly 30 is fixedly connected to the first surface 11a of the printed circuit board 11 by forming an adhesive 40 between the lens assembly 30 and the first surface 11a. The adhesive 40 may be a quick-drying glue.

[0049] In at least one pair of examples, the circuit board assembly includes a printed circuit board and a sensor. The sensor is directly disposed on one surface of the printed circuit board and is electrically connected to the printed circuit board. Thus, the total thickness of the circuit board assembly in this pair of examples is the sum of the thickness of the printed circuit board and the thickness of the sensor.

[0050] In the manufacturing method of the circuit board assembly 10, the packaging method of the camera module 100, the circuit board assembly 10, the camera module 100, and the electronic device 1 described in this application, a through hole 110 penetrating the first surface 11a and the second surface 11b is formed on the printed circuit board 11. The sensor 12 is disposed in the through hole 110, and the height of the sensor 12 is kept lower than the first surface 11a, so that the sensor 12 is completely housed in the through hole 110. Therefore, the sensor 12 does not occupy space in the thickness direction, and the overall thickness of the circuit board assembly 10 is equivalent to the thickness of the printed circuit board 11 alone. Therefore, this application can effectively reduce the total thickness of the circuit board assembly 10 compared to the above comparative example.

[0051] Furthermore, a groove 111 is formed on at least one side of the through hole 110 on the first surface 11a of the printed circuit board 11. A plurality of second pins 112 are provided on the bottom wall 111a of the groove 111, and a plurality of first pins 121 are provided on the sensor 12. The plurality of first pins 121 and the plurality of second pins 112 are connected by wires 13. The height of the wires 13 is lower than the first surface 11a of the printed circuit board 11, so the wires 13 are all located in the groove 111 and do not occupy the space in the thickness direction of the circuit board assembly 10. This allows the filter 20 to be directly mounted on the through hole 110 and adhered to the first surface 11a of the printed circuit board 11, further reducing the height of the camera module 100.

[0052] In summary, the circuit board assembly 10 manufacturing method, camera module 100 packaging method, circuit board assembly 10, camera module 100 and electronic device 1 of this application further reduce the height of camera module 100 without changing the existing component size, thereby reducing the size of camera module 100 and making electronic device 1 including camera module 100 thinner and lighter.

[0053] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, Includes the following steps: A through-hole is formed on a printed circuit board, the printed circuit board having a first surface and a second surface spaced apart from each other and arranged opposite to each other, the through-hole penetrating the first surface and the second surface; The sensor is placed inside the through hole, with the sensor spaced apart from the inner wall of the through hole. The height of the sensor is lower than the first surface and higher than or equal to the second surface. The sensor is fixed to the printed circuit board, and an electrical connection is established between the sensor and the printed circuit board.

2. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, The step of creating through holes on the printed circuit board includes: A through hole is formed on the printed circuit board, and a groove is formed on the first surface near the through hole, with the groove communicating with the through hole on the side facing the through hole; The step of establishing the electrical connection between the sensor and the printed circuit board includes: Multiple first pins are provided on the edge of the sensor, and multiple second pins are provided on the bottom wall of the groove; and The plurality of first pins and the plurality of second pins are electrically connected by wires, the height of which is lower than the first surface.

3. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, The step of fixing the sensor to the printed circuit board includes: An adhesive is filled between the side of the sensor and the inner wall of the through hole to fix the sensor to the inner wall of the through hole, and the adhesive surrounds the sensor.

4. The method for manufacturing a circuit board assembly as described in claim 1, characterized in that, The step of placing the sensor within the through hole includes: Apply a Teflon coating to the die bonder; The printed circuit board and the sensor are placed on the die bonder; and The printed circuit board and the sensor are fixed by the die bonder.

5. The method for manufacturing a circuit board assembly as described in claim 4, characterized in that, The step of fixing the printed circuit board and the sensor using the die bonder includes: Multiple spaced-apart vent holes are formed on the die bonder; A vacuum pump is placed in each of the vent holes, and each vacuum pump is used to adsorb the printed circuit board and the sensor respectively.

6. A camera module packaging method, characterized in that, include: Create through-holes on the printed circuit board; Place the sensor inside the through hole; The sensor is fixed to the printed circuit board, and an electrical connection is established between the sensor and the printed circuit board; The filter is covered on the sensor and fixed to the first surface of the printed circuit board; as well as The lens assembly is placed over the filter and fixedly connected to the first surface of the printed circuit board, with the filter located between the lens assembly and the sensor.

7. The camera module packaging method as described in claim 6, characterized in that, The step of fixing the lens assembly to the first surface of the printed circuit board includes: The lens assembly is fixedly connected to the first surface of the printed circuit board by forming an adhesive between the lens assembly and the first surface.

8. A circuit board assembly, characterized in that, include: A printed circuit board having through holes; the printed circuit board having a first surface and a second surface spaced apart from each other and arranged opposite to each other, the through holes penetrating the first surface and the second surface; The sensor is located inside the through hole, fixed on the printed circuit board and electrically connected to the printed circuit board; the sensor is spaced apart from the inner wall of the through hole, and the height of the sensor is lower than the first surface and higher than or equal to the second surface.

9. The circuit board assembly as claimed in claim 8, characterized in that, The first surface has a groove formed on at least one side of the through hole, the groove communicating with the through hole on the side facing the through hole, the edge of the sensor is provided with a plurality of first pins, the bottom wall of the groove is provided with a plurality of second pins, and the plurality of first pins and the plurality of second pins are electrically connected by a wire, the height of the wire being lower than the first surface.

10. The circuit board assembly as claimed in claim 8, characterized in that, An adhesive is filled between the side of the sensor and the inner wall of the through hole to fix the sensor to the inner wall of the through hole.

11. A camera module, characterized in that, include: The circuit board assembly as described in any one of claims 8-10; A filter is applied to the sensor and fixedly connected to the first surface of the printed circuit board, with the filter spaced apart from the sensor. as well as A lens assembly covers the side of the filter furthest from the sensor and is fixedly connected to the first surface of the printed circuit board; in The lens assembly is used to receive and transmit external light. The filter is located in the optical path from which the light is emitted by the lens assembly and is used to filter out part of the light. Another part of the light passes through the filter and is received by the sensor. The sensor is used to generate a corresponding image based on the light signal in the other part of the light.

12. An electronic device, characterized in that, include: The camera module as described in claim 11; as well as The display module is electrically connected to the printed circuit board and is used to display the images generated by the camera module.

Images