Three-color COB light source added with green light full-color gamut dimming and manufacturing method of three-color COB light source

Abstract

The invention discloses a three-color COB light source added with green light full-color gamut dimming and a manufacturing method of the three-color COB light source, and relates to the technical field of COB light sources. The three-color COB light source added with green light full-color gamut dimming at least comprises a substrate provided with a front electric circuit and a back electric circuit which are electrically connected; the solid crystal area is arranged on the front surface circuit, and the solid crystal area is arranged to be a common anode; the light-emitting units are arranged on the solid crystal area in a vertical strip shape or a babysbreath shape and comprise a pure white light-emitting unit, a warm white light-emitting unit and a green light-emitting unit, the light-emitting units in three colors independently control the light-emitting intensity, and the light-emitting units are flip chips or ceramic lamp beads. According to the three-color COB light source provided by the invention, CRIgt under full-color gamut dimming is realized; and meanwhile, the color coordinates of the mixed light cling to the trajectory of the black body, so that the color is real and natural, and the contradiction between greenish monochromatic light and red mixed light in a double-color-temperature scheme is solved.

Description

Technical Field

[0001] This invention relates to the field of COB light source technology, specifically to a tri-color COB light source with added green light full-color gamut dimming and its manufacturing method. Background Technology

[0002] LED (Light Emitting Diode) packaging is a key step in obtaining high-quality LED lighting sources. Among them, COB (Chip On Chip) packaging is widely used in LED packaging due to its characteristics of low thermal resistance and high luminous flux density.

[0003] In commonly used COB light sources, dimming is typically achieved using several methods: One is the RGB three-primary-color mixing scheme, which generates different colors by independently controlling the brightness of red (R), green (G), and blue (B) monochromatic LEDs. However, due to the discontinuity of the RGB spectrum, the resulting white light typically has a low color rendering index (CRI), resulting in poor color reproduction and failing to meet the requirements of high-quality lighting for color fidelity. Another method is the dual-color-temperature mixing scheme of cool white and warm white light. By adjusting the luminous flux ratio of cool-toned cool white light and warm-toned warm white light, a certain range of color temperature adjustment can be achieved. However, this scheme has an inherent drawback: to ensure that the color coordinates of the mixed light fall on or near the blackbody locus (Planck's locus) (i.e., DUV values ​​close to 0), the color coordinates of both the cool white and warm white light need to be pre-adjusted to positions far from the blackbody locus (typically DUV values ​​of 0.003-0.008). This results in a noticeable green tint perceptible to the human eye when observing cool white or warm white light individually, affecting the quality of the monochromatic light. When mixing these two "greenish" monochromatic lights, although the negative DUV value of the mixed light can be reduced, it is difficult to precisely control it near zero, and the color performance of the mixed light is still unsatisfactory. Therefore, how to minimize the mutual influence between lights of different color temperatures to improve the light output effect and uniformity of COB light sources, reduce the control difficulty of COB light source production, and improve production efficiency is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a tri-color COB light source with added green full-color gamut dimming and its manufacturing method, solving the following technical problems:

[0005] Existing COB light sources suffer from poor light output, uneven light distribution, and low production efficiency.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A tri-color COB light source with added green full-gamut dimming, comprising at least:

[0008] The substrate is provided with front-side electrical lines and back-side electrical lines for electrical connection;

[0009] A die-bonding region is disposed on the front-side electrical circuit, and the die-bonding region is configured as a common anode;

[0010] The light-emitting units, arranged in a vertical stripe shape or a starry sky shape on the die-bonding area, include pure white light-emitting units, warm white light-emitting units, and green light-emitting units. The light-emitting units of the three colors independently control the light emission intensity. The light-emitting units are flip-chips or ceramic lamp beads.

[0011] As a further aspect of the present invention: the substrate is a flip-chip substrate with a thickness of 1-4 mm, the substrate uses a thermally conductive material with a thermal conductivity of 8-15 W / m·K, the substrate is a flip-chip superconducting aluminum substrate or a flip-chip copper substrate, the front-side electrical circuits and the back-side electrical circuits are electrically connected through conductive vias with a diameter of 0.1-0.3 mm, the conductive vias are filled with electroplated copper paste, thermally conductive silicone grease or resin, and the die-bonding region has a length of 0.5-2.0 mm and a width of 0.5-2.0 mm.

[0012] As a further aspect of the present invention: when the vertical strip shape is set, the pure white light emitting unit and the warm white light emitting unit are arranged in sequence, and the green light emitting unit is evenly arranged between the pure white light emitting unit and the warm white light emitting unit, and the outermost vertical strip is the pure white light emitting unit; when the starry sky shape is set, the pure white light emitting unit, the warm white light emitting unit and the green light emitting unit are evenly distributed with staggered positions.

[0013] As a further aspect of the present invention: the color temperature of the pure white light emitting unit is set to 5000-20000K, the color temperature of the warm white light emitting unit is set to 1800-3500K, and the wavelength of the green light emitting unit is 520-530nm.

[0014] As a further aspect of the present invention: the flip chip is a flip-chip gold-tin motor electrode structure, and the length of the flip chip is 0.5-2mm and the width is 0.5-2mm. The flip chip includes a pure white light chip, a warm white light chip and a green light chip.

[0015] As a further aspect of the present invention: the ceramic lamp beads include pure white light lamp beads, warm white light lamp beads and green light lamp beads, and the ceramic lamp beads are obtained by encapsulating the flip chip on the lamp bead substrate.

[0016] As a further aspect of the present invention: the lamp bead substrate is a ceramic substrate, the thickness of the lamp bead substrate is 0.5-1mm, and the lamp bead substrate is provided with a front conductive pad and a back thermal conductive pad electrically connected through the lamp bead conductive through hole, the diameter of the lamp bead conductive through hole is 0.1-0.2mm.

[0017] A method for manufacturing a tri-color COB light source with added green full-color gamut dimming includes the following steps:

[0018] A substrate is provided on which front electrical lines and back electrical lines are formed for electrical connection.

[0019] A die-bonding area is formed on the front-side electrical circuit, and solder paste is printed on the die-bonding area to form pads;

[0020] The light-emitting unit is fixed on the pad;

[0021] Phosphor paste is coated onto the light-emitting unit to form a warm white light-emitting unit, a neutral white light-emitting unit, and a green light-emitting unit, thereby obtaining a three-color COB light source with added green full-color gamut dimming.

[0022] As a further aspect of the present invention, the thickness of the solder paste is 0.04-0.12 mm.

[0023] As a further aspect of the present invention: the fluorescent powder adhesive is obtained by mixing red fluorescent powder, green fluorescent powder, silica gel and diluent.

[0024] The beneficial effects of this invention are:

[0025] This invention provides a tri-color COB light source with added green full-gamut dimming. The tri-color COB light source integrates three light-emitting units—pure white, warm white, and green—on the same substrate. The surfaces of the pure white and warm white light-emitting units are covered with specially formulated warm white phosphor adhesive and pure white phosphor adhesive, respectively, while the green chip is a bare die. The light-emitting units of different colors are surrounded by a barrier formed by a damming adhesive to prevent phosphor adhesive overflow. The light-emitting units are arranged in a vertical stripe or starry pattern on the substrate to achieve optimal spatial mixing of light colors. The green light-emitting units are not independently partitioned but are evenly distributed among the pure white and warm white light-emitting units. The brightness of the three light colors is controlled independently. During full-gamut dimming, the addition of green light can precisely compensate for the shift in color coordinates, resulting in a final mixed light with a high color rendering index and a color coordinate Y value close to the blackbody locus. Furthermore, it can precisely adjust the color deviation (DUV) value to near zero or a small positive deviation, thereby obtaining an extremely natural and realistic lighting effect.

[0026] This invention also provides a tri-color COB light source combining an NCSP LED structure with a double-layer thermally separated copper substrate. NCSP ceramic LEDs for pure white, warm white, and green light are encapsulated on a high thermal conductivity aluminum nitride ceramic substrate. The miniature NCSP LEDs are soldered onto a specially designed double-layer thermally separated copper substrate in a vertical strip or starry array pattern using solder paste. The copper substrate has raised copper bosses for heat conduction and electrical connection, and a white oil coating improves light reflectivity, achieving excellent heat dissipation, electrical isolation, and optical performance. This ensures luminous efficacy and lifespan at high power, and the NCSP structure further improves packaging density and reliability. The tri-color COB light source provided by this invention achieves a high color rendering index (CRI) > 95 under full color gamut dimming. Simultaneously, the mixed light color coordinates closely follow the blackbody trajectory, resulting in realistic and natural colors. This resolves the contradiction between the greenish bias of single-color light and the reddish bias of mixed light in dual-color temperature schemes. The three light colors can be independently controlled, the dimming curve is smooth, and the color temperature adjustment range is wide, meeting the needs of various scenarios from warm yellow to cool white. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a three-color COB light source in one embodiment of the present invention.

[0029] Figure 2 This is a schematic diagram of the substrate of a three-color COB light source in one embodiment of the present invention.

[0030] Figure 3 This is a schematic diagram of the front electrical circuit of the light-emitting unit arranged in a vertical strip shape in one embodiment of the present invention.

[0031] Figure 4 This is a schematic diagram of the front-side electrical circuit of the light-emitting units arranged in a starry sky shape in one embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram of the back-side electrical circuits of the light-emitting units arranged in a vertical strip shape according to an embodiment of the present invention.

[0033] Figure 6 This is a schematic diagram of the back-side electrical circuits of the light-emitting units arranged in a starry sky shape in one embodiment of the present invention.

[0034] Figure 7 This is a schematic diagram of the pads arranged in a vertical strip shape for the light-emitting unit in one embodiment of the present invention.

[0035] Figure 8This is a schematic diagram of the pads arranged in a starry sky shape for the light-emitting unit in one embodiment of the present invention.

[0036] Figure 9 This is a schematic diagram of conductive through holes arranged in a vertical strip shape for the light-emitting units in one embodiment of the present invention.

[0037] Figure 10 This is a schematic diagram of conductive vias arranged in a starry sky shape for the light-emitting units in one embodiment of the present invention.

[0038] Figure 11 This is a schematic diagram of the front conductive pad of a ceramic lamp bead in one embodiment of the present invention.

[0039] Figure 12 This is a schematic diagram of the back heat-conducting pad of the ceramic lamp bead in one embodiment of the present invention.

[0040] Figure 13 This is a schematic diagram of the back heat-conducting pad of the ceramic lamp bead in another embodiment of the present invention.

[0041] Figure 14 This is a schematic diagram of the phosphor paste arranged in vertical strips of the light-emitting unit in one embodiment of the present invention.

[0042] Figure 15 This is a schematic diagram of a phosphor paste with light-emitting units arranged in a starry sky shape in one embodiment of the present invention.

[0043] Figure 16 This is a schematic diagram of a flip-chip with vertical stripe-shaped light-emitting units arranged in one embodiment of the present invention.

[0044] Figure 17 This is a schematic diagram of a flip-chip with light-emitting units arranged in a starry sky shape according to an embodiment of the present invention. Detailed Implementation

[0045] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0046] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0047] It should also be noted that the directional terms such as left, right, up, and down in the embodiments of this application are only relative concepts or are based on the normal use state of the product, and should not be considered as restrictive.

[0048] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0052] Please see Figures 1 to 17This invention provides a tri-color COB light source with added green full-gamut dimming, including a substrate 110, a die-bonding area, and light-emitting units. The die-bonding area is disposed on the substrate 110, and the light-emitting units are electrically connected to the die-bonding area in a vertical strip or starry sky shape. The light-emitting units include a pure white light-emitting unit, a warm white light-emitting unit, and a green light-emitting unit, and the light intensity of the three types of light-emitting units is independently controlled. The light-emitting units are flip-chips or ceramic LEDs. Specifically, in the vertical strip arrangement, pure white light chips and warm white light chips are arranged sequentially, with green light chips evenly arranged in between, and the outermost vertical strip is a pure white light chip; in the starry sky cross arrangement, the light-emitting units of the three colors are staggered and evenly distributed. The die-bonding area is set as a common anode, and each of the pure white light-emitting unit, warm white light-emitting unit, and green light-emitting unit is independently controlled by a single circuit. The 2700K-7500K full-gamut mixing is adjusted using green light, so that the pure white light and warm white light achieve a color rendering index (CRI) > 95 when combined across the full color gamut. In one embodiment of the present invention, the substrate 110 is selected as a flip-chip substrate, such as a flip-chip superconducting aluminum substrate or a flip-chip copper substrate, and the thermal conductivity of the thermally conductive material used in the flip-chip substrate is 8-15 W / m·K. The substrate 110 is provided with front-side electrical lines 113 and back-side electrical lines 114 electrically connected through conductive vias 115. A die-bonding region is provided on the front-side electrical lines 113, with a length of, for example, 0.5-2.0 mm and a width of, for example, 0.5-2.0 mm. The die-bonding region is formed, for example, by immersion gold, tin plating, or OSP processes. In one embodiment of the present invention, the electrical lines are copper foil lines, with a width of 0.1-3.0 mm, a spacing between copper foil lines of 0.05-0.2 mm, a copper foil thickness of 0.035-0.2 mm, and a diameter of 0.1-0.3 mm for the conductive vias 115. The conductive vias 115 are filled with electroplated copper paste, thermally conductive grease, or resin. In one embodiment of the present invention, the light-emitting unit is a flip chip 140, which is disposed on the die-bonding region. The flip chip 140 is, for example, a flip-chip gold-tin electrode structure, with a length of, for example, 0.5-2.0 mm and a width of, for example, 0.5-2.0 mm. The flip chip 140 includes a warm white light chip, a neutral white light chip, and a green light chip, and the flip chips 140 are arranged in a vertical stripe arrangement or a starry sky cross arrangement.

[0053] Please see Figures 1 to 17This invention provides a method for manufacturing a tri-color COB light source with added green full-gamut dimming. Solder paste, made of nano-grade high thermal conductivity and high temperature resistance material, is printed onto the die-bonding area of ​​a flip-chip substrate 110 using a printer to form pads 112. The solder paste thickness is, for example, 0.04-0.12 mm. A flip chip 140 is then fixed onto the die-bonding area using an automatic die bonder, and subsequently soldered in a vacuum nitrogen reflow oven to achieve circuit connection between the flip chip 140 and the substrate 110. Depending on the arrangement of the flip chips 140, vertical stripe powder-coated stencils or a starry pattern of powder-coated stencils are formed on the flip-chip substrate 110. Next, phosphor adhesive 130 is coated to form warm white light wafers and neutral white light wafers. For example, warm white light phosphor adhesive 210 is prepared by taking green phosphor with a main wavelength of 495-535nm and red phosphor with a main wavelength of 630-670nm, and mixing it with silicone and diluent according to the warm white light formula ratio. After thorough mixing, it is poured into an automatic powder spraying machine and sprayed onto the wafer in the warm white light area through a powder spraying steel mesh with vertical strip windows. After spraying, photoelectric testing is performed to ensure that the color temperature and luminous flux are within the preset range. After the test is qualified, an automatic damming machine is used to coat the periphery of the light-emitting area of ​​the entire substrate with damming adhesive. The width of the damming adhesive is set to 0.5-1.0mm for example, and the height is set to 0.5-1.0mm for example. Next, prepare the fluorescent adhesive 210 for pure white light. Take green phosphor with a main wavelength of 495-535nm and red phosphor with a wavelength of 630-670nm, and silicone according to the pure white light formula ratio. Use an automatic dispensing machine to apply the adhesive to the pre-dammed area, covering the pure white light chip, and perform photoelectric testing again. Finally, put the whole board into an oven, set the oven temperature to a low temperature of 40-70℃ for baking and allow it to settle naturally for 1.5-3 hours, so that the fluorescent adhesive 210 settles and covers the surface of the flip chip 140. Test its photoelectric parameters and find that they are within the preset range. Then transfer it to an oven for curing, set the temperature to 150-160℃ for 2 hours, to obtain a three-color COB light source with added green full-color gamut dimming. The color coordinates of the pure white and warm white light of the tri-color COB light source prepared by this invention are already very close to the target values ​​after adjustment. Then, a uniformly distributed green light is added as tuning. Through three independent drives, continuous dimming can be achieved in the range of 2700K-6500K. In addition, the CRI of the mixed light is greater than 96 throughout the dimming process, and the DUV value can be controlled between -0.001 and +0.002, closely following the blackbody trajectory line.

[0054] Please see Figures 1 to 17In another embodiment of the present invention, the flip chip 140 is fabricated into an NCSP ceramic LED as a light-emitting unit. In another embodiment of the present invention, the flip chip 140 is packaged onto an LED substrate to obtain a ceramic LED. The LED substrate 120 is, for example, a ceramic substrate, specifically a high thermal conductivity aluminum nitride ceramic substrate, and the thickness of the LED substrate 120 is, for example, 0.5-1 mm. A front conductive pad 121 and a back thermal conductive pad 122 are provided on the LED substrate 120, and the front conductive pad 121 and the back thermal conductive pad 122 are connected by a conductive via 115. A front-side conductive pad 121 has a front-side die-bonding area. Using flux, an automatic die-bonding machine fixes the flip chip 140 onto the front-side die-bonding area of ​​the LED substrate 120. The substrate is then placed in a high-vacuum nitrogen eutectic furnace for high-temperature sintering, forming a circuit connection between the flip chip 140 and the LED substrate 120. White adhesive is sprayed around the flip chip 140 to block side-emitting light from the edges, ensuring the chip 140 maintains front-side illumination. Phosphor adhesive 210 is then sprayed onto the white adhesive-coated flip chip 140 to prepare a neutral white LED and a warm white LED. The green LED does not require phosphor adhesive 210. The neutral white LED, warm white LED, and green LED are then encapsulated on the LED substrate 120 and cut into individual NCSP ceramic LEDs according to a preset dicing path, yielding neutral white LEDs, warm white LEDs, and green LEDs.

[0055] Please see Figures 1 to 17In another embodiment of the present invention, the ceramic lamp beads prepared above are used as light-emitting units to further prepare a tri-color COB light source with green full-color gamut dimming. The substrate 110 is provided with front circuit 113 and back circuit 114 electrically connected through conductive vias 115. The front circuit 113 is provided with bosses 111 and pads 112. In another embodiment of the present invention, the bosses 111, pads 112 and the bottom of the substrate 110 are treated with OSP anti-oxidation treatment. White oil is sprayed outside the areas of the bosses 111 and pads 112 to improve the reflectivity of the substrate 110. Solder paste is printed onto the protrusions 111 and pads 112 on the front side of substrate 110 using a printing machine. Then, an automatic die bonder fixes the prepared pure white, warm white, and green NCSP ceramic LED beads onto the protrusions 111 and pads 112 of substrate 110 in a preset vertical stripe or starry sky arrangement. A vacuum nitrogen reflow oven is then used to connect the pure white, warm white, and green LED beads to substrate 110 via circuitry. The vacuum reflow oven is protected with 99.999% pure nitrogen gas, which prevents the protrusions 111 and pads 112 on the surface of the double-layer thermally separated copper substrate 110, as well as the white solder mask, from oxidizing and discoloring during high-temperature heating. In another specific embodiment of the invention, the NCSP ceramic LED beads are fixed according to a preset starry sky arrangement with X / Y coordinates. The reflow soldered tri-color COB light source is then placed in a testing and color sorting machine to obtain a tri-color COB light source with NCSP LEDs. This invention uses aluminum nitride ceramic with extremely high thermal conductivity and a thermoelectrically separated copper substrate, resulting in excellent heat dissipation performance and the ability to withstand higher power densities. The uniform distribution of NCSP LEDs achieves excellent light mixing effects. Through three independent controls, the light source can achieve smooth dimming within an ultra-wide color temperature range of 1800K-20000K, with a full-range CRI>95, and the DUV value can be precisely adjusted to near-zero deviation. It is suitable for professional film and television lighting, museum lighting, and other fields with extremely high requirements for light color quality.

[0056] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0057] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A tri-color COB light source with added green full-gamut dimming, characterized in that, At least including: The substrate is provided with front-side electrical lines and back-side electrical lines for electrical connection; A die-bonding region is disposed on the front-side electrical circuit, and the die-bonding region is configured as a common anode; The light-emitting units, arranged in a vertical stripe shape or a starry sky shape on the die-bonding area, include pure white light-emitting units, warm white light-emitting units, and green light-emitting units. The light-emitting units of the three colors independently control the light emission intensity. The light-emitting units are flip-chips or ceramic lamp beads.

2. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, The substrate is a flip-chip substrate with a thickness of 1-4 mm. The substrate uses a thermally conductive material with a thermal conductivity of 8-15 W / m·K. The substrate is a flip-chip superconducting aluminum substrate or a flip-chip copper substrate. The front-side and back-side electrical circuits are electrically connected through conductive vias with a diameter of 0.1-0.3 mm. The conductive vias are filled with electroplated copper paste, thermal grease, or resin. The die-bonding region has a length of 0.5-2.0 mm and a width of 0.5-2.0 mm.

3. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, When the vertical strip shape is set, the pure white light emitting unit and the warm white light emitting unit are arranged in sequence, and the green light emitting unit is evenly arranged between the pure white light emitting unit and the warm white light emitting unit, with the outermost vertical strip being the pure white light emitting unit; when the starry sky shape is set, the pure white light emitting unit, the warm white light emitting unit and the green light emitting unit are evenly distributed with staggered positions.

4. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, The color temperature of the pure white light emitting unit is set to 5000-20000K, the color temperature of the warm white light emitting unit is set to 1800-3500K, and the wavelength of the green light emitting unit is 520-530nm.

5. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, The flip chip is a flip-chip gold-tin motor electrode structure, and the length and width of the flip chip are 0.5-2mm. The flip chip includes a pure white light chip, a warm white light chip, and a green light chip.

6. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, The ceramic LED beads include cool white LED beads, warm white LED beads, and green LED beads, and the ceramic LED beads are obtained by encapsulating the flip chip on the LED bead substrate.

7. The tri-color COB light source with added green full-gamut dimming according to claim 1, characterized in that, The lamp bead substrate is a ceramic substrate with a thickness of 0.5-1mm. The lamp bead substrate is provided with a front conductive pad and a back thermal conductive pad that are electrically connected through the lamp bead conductive through-holes. The diameter of the lamp bead conductive through-holes is 0.1-0.2mm.

8. A method for manufacturing a tri-color COB light source with added green full-gamut dimming, used to manufacture the tri-color COB light source with added green full-gamut dimming as described in any one of claims 1 to 7, characterized in that, The manufacturing method of the tri-color COB light source with added green full-color gamut dimming includes the following steps: A substrate is provided on which front electrical lines and back electrical lines are formed for electrical connection. A die-bonding area is formed on the front-side electrical circuit, and solder paste is printed on the die-bonding area to form pads; The light-emitting unit is fixed on the pad; Phosphor paste is coated onto the light-emitting unit to form a warm white light-emitting unit, a neutral white light-emitting unit, and a green light-emitting unit, thereby obtaining a three-color COB light source with added green full-color gamut dimming.

9. The method for manufacturing a tri-color COB light source with added green full-gamut dimming according to claim 8, characterized in that, The thickness of the solder paste is 0.04-0.12 mm.

10. The method for manufacturing a tri-color COB light source with added green full-gamut dimming according to claim 8, characterized in that, The fluorescent powder adhesive is obtained by mixing red fluorescent powder, green fluorescent powder, silica gel and diluent.

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