Quality inspection device for wafer tape-out

Abstract

The invention relates to a wafer tape-out quality inspection device, and relates to the technical field of chip manufacturing, the wafer tape-out quality inspection device comprises a connection support column used for supporting a chip backboard, the connection support column is fixedly installed on a transmission slide block, and the top of the connection support column is provided with an adsorption port. According to the invention, support and vacuum adsorption are carried out below a chip backboard (a non-circuit surface) through the connecting support columns, and then the chip is driven by the conveying chain to horizontally move to a quality inspection station. In the process, a suction nozzle and other components are completely prevented from contacting, pressing or rubbing a precise circuit on the front surface of the chip from the upper part, so that the core problem that a chip circuit is scratched, polluted or damaged by static electricity due to the fact that an adsorption position is deviated in the background technology is thoroughly solved, and the safety and yield of the chip in the transfer process are remarkably improved; the method is especially suitable for quality inspection and circulation of high-precision and high-value chips.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, specifically to a quality inspection device for wafer fabrication. Background Technology

[0002] When the chip is in the process of being picked up, it needs to be fixed on the backplane. The chip is then picked up from above the backplane and moved to the quality inspection position, thus achieving the transfer of the chip's position. However, during this process, a fixed area needs to be left on the chip's backplane for adsorption. If the adsorption position is off, it will affect the quality of the chip and have a certain impact on the circuitry on the chip. Summary of the Invention

[0003] The purpose of this invention is to provide a quality inspection device for wafer fabrication.

[0004] The technical problem solved by this invention is to solve the problem of misalignment caused by adsorption on the top of the chip backplate in the prior art.

[0005] The present invention can be achieved through the following technical solution: a quality inspection device for wafer fabrication, including a connecting support column for supporting the chip backplane, the connecting support column being fixedly installed on a conveying sliding block, and an adsorption port being provided at the top of the connecting support column.

[0006] A further technical improvement of the present invention is that: a support base is provided on the frame, a conveying groove is provided on the support base, the conveying groove and the conveying sliding block are slidably connected, and the conveying sliding block is installed on the conveying chain.

[0007] A further technical improvement of the present invention is that it also includes an auxiliary processing mechanism, which includes a limiting base plate, the limiting base plate is fixedly installed on the frame, and a sliding limiting post is slidably arranged on the limiting base plate. A supporting base plate is fixed to the top of the sliding limiting post, and an adsorption plate is arranged on the supporting base plate. The distance between the supporting base plate and the limiting base plate is adjustable.

[0008] A further technical improvement of the present invention is that: a tension spring is fixed between the supporting base plate and the limiting base plate, a mating seat is fixed at the bottom of the supporting base plate, an upper inclined surface is provided on the mating seat, an upper contact end is provided on the upper inclined surface, the upper contact end is the bottommost end, a pushing seat is slidably provided on the limiting base plate, a lower inclined surface is provided on the pushing seat, and a lower contact end is provided on the lower inclined surface.

[0009] A further technical improvement of the present invention is that a side limiting rod is rotatably provided on the support base. When the conveying sliding block moves to the position of the side limiting rod, the side limiting rod acts on the conveying sliding block. The side limiting rod is fixedly installed on the rotating base.

[0010] A further technical improvement of the present invention is that: the rotating base is rotatably mounted on the support base by a torsion spring, a rotating disk is fixed on the rotating shaft of the rotating base, the rotating shaft and the support base are rotatably connected, and a rotating rod is fixed on the rotating disk; a bottom limiting base is fixed on the limiting base plate, a rotating limiting slider is slidably arranged on the bottom limiting base, the rotating limiting slider is fixedly connected to the push seat, and a connecting rod is rotatably arranged on the rotating limiting slider, and the connecting rod and the rotating rod are fixedly connected.

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. This application uses connecting support pillars to support and vacuum-adsorb the chip from below the backplane (non-circuit side), and then uses a conveyor chain to move the chip horizontally to the quality inspection station. This process completely avoids components such as suction nozzles contacting, pressing, or rubbing the delicate circuitry on the front of the chip from above, thus thoroughly solving the core problem in the prior art of scratching, contaminating, or damaging the chip circuitry due to "adsorption position misalignment." This significantly improves the safety and yield of the chip during the transfer process, and is especially suitable for the quality inspection of high-precision, high-value chips.

[0012] 2. This application's device incorporates a sophisticated mechanical linkage mechanism (auxiliary processing mechanism). When the chip-carrying conveyor slide reaches the quality inspection station, it touches and pushes the side limit rod. This action is converted into the horizontal movement of the push seat through a series of components, including the rotating base, rotating disk, rotating rod, and connecting rod. The lower inclined surface of the push seat interacts with the upper inclined surface of the mating seat at the bottom of the support base, overcoming the tension of the tension spring and precisely lifting the support base and its suction cup, allowing it to firmly adhere to the chip backplane from below. This process achieves full automation of "transfer to position, trigger locking, and adaptive lifting support." During the brief time of quality inspection, the chip is simultaneously subjected to lateral adsorption from the connecting support column, lateral clamping from the side limit rod, and bottom support adsorption from the suction cup, forming a three-dimensional fixation that greatly eliminates micro-vibrations and displacements, ensuring extreme positional stability during quality inspection imaging or testing.

[0013] 3. The device in this application integrates the transmission mechanism (chain, slider) with the quality inspection and stabilization mechanism into one unit. The process of chip feeding, transmission, positioning, locking, and quality inspection is seamlessly connected, reducing intermediate manual intervention and secondary positioning, and improving the overall quality inspection cycle. The support base plate is guided by sliding limit posts, and its lifting action is stable. Moreover, the adsorption plate is in a low position when not in operation, and only lifts to contact the back plate when needed, avoiding friction between the chip and the support components during transmission, further protecting the chip back plate and the overall structure. The inclined surface and spring design enable the system to adapt to chip back plates of different thicknesses or with slight unevenness within a certain range, ensuring a stable adsorption effect and enhancing the versatility and reliability of the equipment. Attached Figure Description

[0014] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the auxiliary processing mechanism of the present invention; Figure 2 This is a schematic diagram showing the positions of the push seat and the mating seat of the present invention; Figure 3 This is a schematic diagram showing the location of the auxiliary processing mechanism of the present invention; Figure 4 This is a schematic diagram showing the location of the conveyor slot in this invention.

[0016] In the diagram: 1. Support mechanism; 2. Conveyor chain; 3. Auxiliary processing mechanism; 4. Back plate; 5. Conveyor groove; 6. Support base; 7. Upper inclined surface; 8. Upper contact end; 9. Lower contact end; 10. Lower inclined surface; 11. Sliding limit post; 12. Tension spring; 13. Mating seat; 14. Limiting base plate; 15. Connecting rod; 16. Bottom limiting base; 17. Conveyor sliding block; 18. Side limiting rod; 19. Rotating limiting slider; 20. Push seat; 21. Support base plate; 22. Adsorption plate; 23. Rotating disk; 24. Rotating rod; 25. Connecting support post; 26. Rotating base; 27. Rotating torsion spring. Detailed Implementation

[0017] To further illustrate the technical means and effects adopted by the present invention in order to achieve the intended purpose, the following detailed description is provided in conjunction with the accompanying drawings and preferred embodiments, based on the specific implementation methods, structures, features and effects of the present invention.

[0018] Please see Figure 1-4 As shown, the wafer fabrication quality inspection device includes a connecting support column 25 for supporting the chip backplane. The connecting support column 25 is fixedly mounted on the transfer sliding block 17. The top of the connecting support column 25 is provided with an adsorption port. In use, the inner plate of the chip is placed on the connecting support column 25, and the chip is vacuum adsorbed by the adsorption port on the connecting support column 25. The movement of the transfer sliding block 17 drives the chip to move, thereby realizing the transfer of the chip.

[0019] Furthermore, a support base 6 is provided on the frame, and a conveying groove 5 is provided on the support base 6. The conveying groove 5 and the conveying sliding block 17 are slidably connected. At the same time, the conveying sliding block 17 is installed on the conveying chain 2. The conveying chain 2 moves under the action of the power gear, thereby driving the conveying sliding block 17 to move, thereby realizing the movement of the chip to the quality inspection station. In this application, by connecting the support column 25, the backplate of the chip is attracted and moved, ensuring that the chip circuit is not affected, and the chip can be moved multiple times without affecting the chip circuit.

[0020] Furthermore, when the chip moves to the quality inspection station, in order to achieve stable support for the chip, this application also includes an auxiliary processing mechanism 3. The auxiliary processing mechanism 3 is used to maintain the stability of the chip, thereby ensuring the positional accuracy during chip quality inspection.

[0021] Specifically, the auxiliary processing mechanism 3 includes a limiting base plate 14, which is fixedly installed on the frame. A sliding limiting post 11 is slidably arranged on the limiting base plate 14, and a supporting base plate 21 is fixed to the top of the sliding limiting post 11. An adsorption plate 22 is arranged on the supporting base plate 21. The distance between the supporting base plate 21 and the limiting base plate 14 is adjustable. In use, when the chip moves to the quality inspection station, the longitudinal movement of the supporting base plate 21 relative to the limiting base plate 14 enables the adsorption plate 22 to act on the back plate, thereby adsorbing the back plate and maintaining the stability of the chip's position, ensuring the positional accuracy of the chip during quality inspection, and further ensuring the quality of quality inspection.

[0022] Furthermore, in order to adjust the distance between the supporting base plate 21 and the limiting base plate 14, a tension spring 12 is fixed between the supporting base plate 21 and the limiting base plate 14 in this application. The tension spring 12 is used to ensure that the supporting base plate 21 always has a tensile force in the direction of the limiting base plate 14. A mating seat 13 is fixed at the bottom of the supporting base plate 21, wherein the mating seat 13 is provided with an upper inclined surface 7, wherein an upper contact end 8 is provided on the upper inclined surface 7, and the lowest end of the upper contact end 8 is provided. At the same time, a push seat 20 is slidably disposed on the limiting base plate 14, wherein the push seat 20 has... The device is provided with a lower inclined surface 10, on which a lower contact end 9 is provided. In use, when the push base 20 moves, the lower inclined surface 10 of the push base 20 moves on the upper contact end 8, thereby controlling the height of the support base plate 21. When the chip moves to the quality inspection station, the support base plate 21 moves to a certain height. At this time, the adsorption plate 22 on the support base plate 21 supports and adsorbs the back plate at the bottom of the chip, avoiding friction caused when the chip moves on the support base plate 21, thereby ensuring the quality of the chip back plate and the overall quality of the chip.

[0023] To enable the movement of the push seat 20, a side limiting rod 18 is rotatably mounted on the support base 6 in this application. This side limiting rod 18 is tilted under the action of a torsion spring. When the conveying sliding block 17 moves to the position of the side limiting rod 18, the side limiting rod 18 gradually rotates. At this time, the side limiting rod 18 is fixedly mounted on the rotating base 26, which is rotatably mounted on the support base 6 via a torsion spring. A rotating disk 23 is fixed on the rotating shaft of the rotating base 26, and this rotating shaft is rotatably connected to the support base 6. A rotating rod 24 is fixed on the rotating disk 23. A bottom limiting base 16 is fixed on the limiting base plate 14, and a rotating limiting slider 19 is slidably mounted on the bottom limiting base 16. The rotating limiting slider 19 is fixedly connected to the push seat 20. Simultaneously, the rotating limiting slider... A connecting rod 15 is rotatably mounted on block 19, wherein the connecting rod 15 and the rotating rod 24 are fixedly connected. In use, when the conveying sliding block 17 moves to the position of the side limiting rod 18, the side limiting rod 18 gradually rotates. At this time, the side limiting rod 18 clamps the position of the conveying sliding block 17, maintaining the stability of the conveying sliding block 17, thereby maintaining the positional stability of the chip. During this process, when the rotating base 26 rotates, it drives the rotating shaft to rotate, thereby driving the rotating disk 23 to rotate, causing the rotating rod 24 to rotate to a certain extent, thereby adjusting the position of the connecting rod 15, so that the push seat 20 can slide laterally under the action of the bottom limiting base 16, further adjusting the height of the supporting base plate 21, so that the supporting base plate 21 can act on the back plate of the chip, achieving stable support for the chip.

[0024] In use, this invention utilizes the connecting support column 25 to allow the chip's backplate to be adsorbed and moved, ensuring the chip's circuitry remains unaffected. The chip can be moved multiple times without impacting its circuitry. During this process, when the chip moves to the quality inspection station, the longitudinal movement of the support base plate 21 relative to the limiting base plate 14 causes the adsorption disk 22 to act on the backplate, adsorbing the backplate and maintaining the chip's positional stability. This ensures the chip's positional accuracy during quality inspection, further guaranteeing the quality of the inspection. Specifically, when the conveying sliding block 17 moves to the side limiting rod 18 position, the side... As the limiting rod 18 gradually rotates, it clamps the conveying sliding block 17, maintaining its stability and thus the chip's positional stability. During this process, when the rotating base 26 rotates, it drives the rotating shaft to rotate, which in turn drives the rotating disk 23 to rotate, causing the rotating rod 24 to rotate to a certain extent. This adjusts the position of the connecting rod 15, allowing the push seat 20 to slide laterally under the action of the bottom limiting base 16. This further adjusts the height of the supporting base plate 21, enabling it to act on the chip's backplate and achieve stable chip support.

[0025] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A quality inspection device for wafer fabrication, characterized in that: It includes a connecting support column (25) for supporting the chip backplane, the connecting support column (25) is fixedly installed on the transfer sliding block (17), and the top of the connecting support column (25) is provided with an adsorption port.

2. The quality inspection device for wafer fabrication according to claim 1, characterized in that, A support base (6) is provided on the frame, and a conveying groove (5) is provided on the support base (6). The conveying groove (5) and the conveying sliding block (17) are slidably connected. The conveying sliding block (17) is installed on the conveying chain (2).

3. The quality inspection device for wafer fabrication according to claim 2, characterized in that, It also includes an auxiliary processing mechanism (3), which includes a limiting base plate (14), which is fixedly installed on the frame, and a sliding limiting post (11) is slidably provided on the limiting base plate (14). A supporting base plate (21) is fixed on the top of the sliding limiting post (11), and an adsorption plate (22) is provided on the supporting base plate (21). The distance between the supporting base plate (21) and the limiting base plate (14) is adjustable.

4. The quality inspection device for wafer fabrication according to claim 3, characterized in that, A tension spring (12) is fixed between the supporting base plate (21) and the limiting base plate (14). A mating seat (13) is fixed at the bottom of the supporting base plate (21). An upper inclined surface (7) is provided on the mating seat (13). An upper contact end (8) is provided on the upper inclined surface (7). The upper contact end (8) is the bottommost end. A push seat (20) is slidably provided on the limiting base plate (14). A lower inclined surface (10) is provided on the push seat (20). A lower contact end (9) is provided on the lower inclined surface (10).

5. The quality inspection device for wafer fabrication according to claim 4, characterized in that, A side limiting rod (18) is rotatably provided on the support base (6). When the conveying sliding block (17) moves to the position of the side limiting rod (18), the side limiting rod (18) acts on the conveying sliding block (17). The side limiting rod (18) is fixedly installed on the rotating base (26).

6. The quality inspection device for wafer fabrication according to claim 5, characterized in that, The rotating base (26) is rotatably mounted on the support base (6) by a torsion spring. A rotating disk (23) is fixed on the rotating shaft of the rotating base (26). The rotating shaft and the support base (6) are rotatably connected. A rotating rod (24) is fixed on the rotating disk (23). A bottom limiting base (16) is fixed on the limiting base plate (14). A rotating limiting slider (19) is slidably arranged on the bottom limiting base (16). The rotating limiting slider (19) is fixedly connected to the push seat (20). A connecting rod (15) is rotatably arranged on the rotating limiting slider (19). The connecting rod (15) is fixedly connected to the rotating rod (24).

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