Power module

Abstract

The invention discloses a power module. The power module includes: a substrate provided with a chip mounted thereon; a molding portion provided to surround the substrate and the chip; a lead portion having one end electrically connected to the chip inside the molding portion and the other end exposed to the outside of the molding portion; and an insulating rib portion protruding from an outer surface of the molded portion on which the lead portion is provided.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0150962, filed on October 30, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This invention relates to a power module. Background Technology

[0004] With increasing environmental concerns, there is a rise in eco-friendly vehicles equipped with electric motors as their power source. Eco-friendly vehicles are also known as electric vehicles, with representative examples including electric vehicles (EVs) and hybrid electric vehicles (HEVs). Inverters are used as a core component for power control, affecting the performance and efficiency of eco-friendly vehicles.

[0005] An inverter is a device that converts direct current (DC) electricity to alternating current (AC) electricity and can drive an electric motor by receiving power from a high-voltage battery. An inverter includes a power module as its core component. The power module handles high voltage and current to perform power conversion.

[0006] In the design of power modules, ensuring the creepage distance between signal leads and power leads is useful in maintaining signal accuracy and reliability.

[0007] In the prior art, in order to ensure the creepage distance between signal leads and power leads, the position of the chip mounted on the substrate can be adjusted; however, a power module structure that can achieve miniaturization of the power module while ensuring the creepage distance between signal leads and power leads may be useful. Summary of the Invention

[0008] One aspect of the present invention is to provide a power module that provides sufficient creepage distance between signal leads and power leads while being suitable for miniaturization.

[0009] According to one aspect of the invention, a power module includes: a substrate having a chip mounted thereon; a molding portion having a molding portion having a molding portion having a lead portion having an end (e.g., a first end) electrically connected to the chip inside the molding portion and an end (e.g., a second end) exposed outside the molding portion; and an insulating rib having an insulating rib protruding from the outer surface of the molding portion on which the lead portion is disposed.

[0010] The lead portion may include signal leads for transmitting control signals and power leads for transmitting power, and the insulating rib portion may include signal lead insulating ribs protruding from one surface where the signal leads are provided and power lead insulating ribs protruding from one surface where the power leads are provided.

[0011] The signal lead may include multiple signal pins arranged adjacent to each other, and the signal lead insulation ribs may be arranged between the multiple signal pins.

[0012] The spacing between the signal pins can be configured as a first spacing and a second spacing wider than the first spacing, and the signal lead insulation ribs can include a first signal lead insulation rib disposed between the first spacing and a second signal lead insulation rib disposed between the second spacing.

[0013] The protruding length of the second signal lead insulation rib protruding from the outer surface of the molded portion can be set to be longer than the protruding length of the first signal lead insulation rib protruding from the outer surface of the molded portion.

[0014] The signal lead insulation rib may be configured to surround the inner end of at least one of the signal pins that contacts the molded portion.

[0015] The signal lead insulation ribs can be configured to surround the inner ends of a plurality of signal pins arranged adjacent to each other at the first interval.

[0016] The signal lead insulation rib can be configured to surround the inner end of the outermost signal pin among a plurality of signal pins arranged adjacent to each other at the first interval.

[0017] The power leads may include multiple input terminals for supplying power to the chip and multiple output terminals for outputting the power converted by the chip.

[0018] The power lead insulation rib may include a first power lead insulation rib and a second power lead insulation rib. The first power lead insulation rib is disposed in an adjacent input terminal or an adjacent output terminal, and the second power lead insulation rib is disposed between an input terminal and an adjacent output terminal.

[0019] The protruding length of the second power lead insulation rib protruding from the outer surface of the molded portion can be configured to be longer than the protruding length of the first power lead insulation rib protruding from the outer surface of the molded portion.

[0020] The power lead insulation rib may be configured to surround the inner end of at least one of the input terminal or the output terminal that contacts the molded portion.

[0021] According to one aspect of the invention, a power module includes: a substrate on which a chip is disposed; a molding portion disposed around the substrate and the chip; and a lead portion having one end electrically connected to the chip inside the molding portion and the other end exposed to the outside of the molding portion. The lead portion is exposed to the outside by an insulating groove formed by extending inward from the outer surface of the molding portion.

[0022] The lead portion may include signal leads for transmitting control signals and power leads for transmitting power, and the insulating groove may include signal lead insulating grooves that expose the signal leads to the outside and power lead insulating grooves that expose the power leads to the outside.

[0023] The signal lead may include a plurality of signal pins arranged adjacent to each other, and at least one of the plurality of signal pins may be arranged within the insulating groove.

[0024] The power leads may include multiple input terminals for supplying power to the chip and multiple output terminals for outputting the power converted by the chip, and at least one of the multiple input terminals and multiple output terminals may be arranged within the insulating groove.

[0025] The lead portion may include multiple leads, and the insulating rib portion may include multiple insulating ribs. The multiple insulating ribs may protrude between the multiple leads. Attached Figure Description

[0026] The above and other aspects and features of the invention will be understood from the following detailed description taken in conjunction with the accompanying drawings.

[0027] Figure 1 This is a front perspective view of the power module according to the implementation plan.

[0028] Figure 2 This is a rear 3D view of the power module according to the implementation plan.

[0029] Figure 3 It is a plan view of the power module according to the implementation plan.

[0030] Figure 4 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0031] Figure 5A This is a perspective view of the signal lead section of the power module according to the implementation plan. Figure 5B This is a front view of the power module according to the implementation plan.

[0032] Figure 6A This is a perspective view of the signal lead section of a power module according to another embodiment. Figure 6BThis is a front view of a power module according to another implementation.

[0033] Figure 7A This is a perspective view of the signal lead section of a power module according to another embodiment. Figure 7B This is a front view of a power module according to another implementation.

[0034] Figure 8A This is a perspective view of the signal lead section of a power module according to another embodiment. Figure 8B This is a front view of a power module according to another implementation.

[0035] Figure 9A This is a perspective view of the signal lead section of a power module according to another embodiment. Figure 9B This is a front view of a power module according to another implementation.

[0036] Figure 10A This is a 3D view of the power lead section of the power module according to the implementation plan. Figure 10B This is a rear view of the power module according to the implementation plan.

[0037] Figure 11A This is a perspective view of the power lead portion of a power module according to another embodiment. Figure 11B This is a rear view of the power module according to another embodiment.

[0038] Figure 12A This is a perspective view of the power lead portion of a power module according to another embodiment. Figure 12B This is a rear view of the power module according to another embodiment.

[0039] Figure 13A This is a front perspective view of the power module according to another embodiment. Figure 13B This is a front view of a power module according to another implementation.

[0040] Figure 14A This is a front perspective view of the power module according to another embodiment. Figure 14B This is a front view of a power module according to another implementation.

[0041] Figure 15A This is a rear perspective view of the power module according to another embodiment. Figure 15B This is a rear view of the power module according to another embodiment.

[0042] Figure 16A This is a rear perspective view of the power module according to another embodiment. Figure 16B This is a rear view of the power module according to another embodiment. Detailed Implementation

[0043] This invention can have various modifications and embodiments, and specific embodiments are shown and described in detail in the accompanying drawings. However, this is not intended to limit the invention to the specific embodiments, and it should be understood that modifications, equivalents, and alternatives are included within the spirit and scope of the invention.

[0044] The terms "first," "second," etc., can be used to describe various components, but components should not be limited by the terms. These terms are used to distinguish one component from another. For example, without departing from the scope of the invention, a first component can be referred to as a second component, and similarly, a second component can be referred to as a first component. The term "and / or" includes a combination of multiple related descriptive terms or one or more of multiple related descriptive terms.

[0045] The terms “unit,” “component,” “part,” etc., can be used to describe various components, but components should not be limited by the terms. These terms can refer to physically / visually different configurations, and even without (e.g., clearly) defining the distinction / division, they refer to the function or configuration of the corresponding component.

[0046] The terminology used in this invention is for describing exemplary (e.g., specific) embodiments and is not intended to limit the invention. Singular expressions include plural expressions unless the context (e.g., clearly indicates otherwise). In this invention, the terms "comprising," "having," etc., should be understood to indicate the presence of features, values, steps, operations, components, parts, or combinations thereof described in this invention, but these terms do not exclude the possibility of the presence or addition of one or more other features, values, steps, operations, components, parts, or combinations thereof.

[0047] Unless otherwise provided, the terminology used herein, including technical or scientific terms, has the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms from common dictionaries should be interpreted as having the same meaning as they have in the context of the relevant art, and not in an ideal or overly formal sense, unless provided herein.

[0048] In this publication, the terms “front”, “back”, etc., are provided for the use of direction based on the illustrations in the accompanying drawings.

[0049] In this document, example implementations will be described in more detail with reference to the accompanying drawings.

[0050] Figure 1 This is a front perspective view of the power module based on the implementation plan. Figure 2 This is a rear 3D view of the power module according to the implementation plan. Figure 3 It is a plan view of the power module according to the implementation scheme, and Figure 4 It is along Figure 1The cross-sectional view taken from line I-I'.

[0051] Reference Figures 1 to 4 The power module 1 according to the embodiment includes a substrate 100, a molding portion 200, a lead portion 300, and an insulating rib 400. Meanwhile, the technical features of the power module 10 according to the embodiment are the lead portion 300 exposed to the outside of the molding portion 200 and the insulating rib 400 for ensuring the creepage distance of the lead portion 300. It should be noted that various configurations commonly used in the power module technology field to which this invention pertains can be applied to the configuration of other components / elements disposed inside the molding portion 200. Hereinafter, for ease of explanation, the internal configuration of the power module according to the embodiment is described as a power module 1 using a double-sided cooling method.

[0052] The substrate 100 may include a lower substrate 110 and an upper substrate 120. The lower substrate 110 may include a first insulating layer 111, a first inner metal layer 112 disposed on the upper surface of the first insulating layer 111, and a first outer metal layer 113 disposed on the lower surface of the first insulating layer 111. The upper substrate 120 may include a second insulating layer 121, a second inner metal layer 122 disposed on the lower surface of the second insulating layer 121, and a second outer metal layer 123 disposed on the upper surface of the second insulating layer 121.

[0053] The upper substrate 120 can be disposed above the lower substrate 110. A spacer 130 can be provided between the upper substrate 120 and the lower substrate 110 for electrical / physical connection between the upper substrate 120 and the lower substrate 110. The spacer 130 can separate the upper substrate 120 and the lower substrate 110 from each other, while simultaneously electrically connecting the upper substrate 120 and the lower substrate 110 to each other.

[0054] Chip 140 can be disposed between lower substrate 110 and upper substrate 120. Chip 140 can be mounted on the upper part of lower substrate 110 or the lower part of upper substrate 120. Chip 140 can be electrically connected to at least one of first internal metal layer 112 or second internal metal layer 122.

[0055] Chip 140 may include at least one of, for example, an insulated gate bipolar transistor (IGBT), a compound semiconductor (SiC), a shunt circuit, a silicon controlled rectifier (SCR), a power transistor, a MOS transistor, a power rectifier, a power regulator, or a diode.

[0056] At least a portion of the first outer metal layer 113 and the second outer metal layer 123 may be exposed to the outside of the molding portion 200. Separate cooling channels (not shown) may be connected to the exposed portions of the first outer metal layer 113 and the second outer metal layer 123. The first outer metal layer 113 and the second outer metal layer 123 may release heat generated during the operation of the power module 1 to the outside.

[0057] The lead portion 300 can be configured to input / output current or input / output control signals. One end of the lead portion 300 can be electrically connected to the chip 140 inside the molding portion 200. The other end of the lead portion 300 can be exposed outside the molding portion 200.

[0058] One end of the lead portion 300 can be electrically connected to the chip 140 via at least one of the first internal metal layer 112 or the second internal metal layer 122 of the substrate 100, or it can be directly connected to the chip 140.

[0059] The lead section 300 may include a plurality of leads, and the leads may include signal leads 310 for transmitting control signals and power leads 320 for transmitting power.

[0060] The signal lead 310 can be configured to input control signals to the chip 140 mounted on the substrate 100 or to receive status information from the chip 140. The signal lead 310 may include a plurality of signal pins 311. One end of the signal pin 311 may be disposed inside the molding portion 200, while the other end may be exposed outside the molding portion 200.

[0061] Multiple signal pins 311 can be arranged adjacent to each other along one direction on one surface of the molding portion 200. For example, the signal pins 311 can be based on... Figure 1The signal pins 311 are arranged adjacent to each other in the X-axis direction. Multiple signal pins 311 can be arranged with a first interval d1 or a second interval d2. In this case, the second interval d2 can be formed to be wider than the first interval d1. Among the multiple signal pins 311, signal pins 311 with similar electrical specifications can be arranged with a first interval d1. In this case, similar electrical specifications may mean that the applied potential is similar. Signal pins 311 with similar electrical specifications and dissimilar signal pins 311 can be arranged with a second interval d2 to distinguish them from each other. At least one insulating rib 400 can be provided between adjacent signal pins 311. The insulating rib 400 can be configured to ensure an insulating distance between the signal pins 311. Specifically, the insulating rib 400 can increase the creepage distance between the signal pins 311. In this case, the creepage distance between the signal pins 311 can refer to the shortest distance between the signal pins 311 measured along the surface of the molding portion 200. The insulating rib 400 can ensure the creepage distance of the signal pins 311 to prevent electrical interference and noise between terminals.

[0062] The power lead 320 can be configured to supply power to the chip 140 mounted on the substrate 100 or to output power converted by the chip 140. The power lead 320 may include, for example, a plurality of input terminals 321 connected to a high-voltage battery (not shown) to receive DC current and supply the current to the chip 140, and a plurality of output terminals 322 to output AC current converted by the chip 140.

[0063] One end of the input terminal 321 and one end of the output terminal 322 can be disposed inside the molding section 200 and electrically connected to the substrate 100 or the chip 140. The other ends of the input terminal 321 and the output terminal 322 can be exposed outside the molding section 200. The input terminal 321 and the output terminal 322 can be arranged adjacent to each other in one direction. For example, the input terminal 321 and the output terminal 322 can be arranged in multiple numbers adjacent to each other along the X-axis direction on another surface of the molding section 200.

[0064] At least one insulating rib 400 may be provided between input terminals 321 or between output terminals 322. The insulating rib 400 may be provided between input terminals 321, between output terminals 322, and / or between input terminals 321 and output terminals 322 to ensure an insulating distance between the terminals. Specifically, the insulating rib 400 may increase the creepage distance of the terminals constituting the power lead 320. In this case, the creepage distance may refer to the shortest distance between the terminals constituting the power lead 320 measured along the surface of the molding portion 200. The insulating rib 400 can ensure the creepage distance between the terminals constituting the power lead 320 to prevent electrical interference and noise between the terminals.

[0065] The molding portion 200 can form the exterior of the power module 1. The molding portion 200 can be configured to surround the substrate 100 and the chip 140. The molding portion 200 can be made of various engineering plastics. For example, the molding portion 200 can be provided using epoxy molding compound (EMC).

[0066] The molding portion 200 may be disposed in the internal space between the lower substrate 110 and the upper substrate 120 and is configured to surround the outer peripheral surfaces of the lower substrate 110 and the upper substrate 120. At least a portion of the first external metal layer 113 of the lower substrate 110 and at least a portion of the second external metal layer 123 of the upper substrate 120 may be exposed to the outside of the molding portion 200. For example, at least a portion of the first external metal layer 113 may be exposed to the lower surface of the molding portion 200, and at least a portion of the second external metal layer 123 may be exposed to the upper surface of the molding portion 200.

[0067] One end of the lead portion 300 can be embedded inside the molding portion 200. For example, signal lead 310 and power lead 320 can be electrically connected to chip 140 or substrate 100, with one end of signal lead 310 and one end of power lead 320 embedded inside the molding portion 200. The other ends of signal lead 310 and power lead 320 can be exposed outside the molding portion 200. In this case, signal lead 310 can be exposed to the outside on one side of the molding portion 200, and power lead 320 can be exposed to the outside on the other side of the molding portion 200. However, the exposed positions of signal lead 310 and power lead 320 are not limited to the above embodiment, and can be exposed to the outside at various positions in the molding portion 200 according to the design.

[0068] The insulating rib 400 may be provided on the outer surface of the molding portion 200. For example, the insulating rib 400 may be configured to protrude from a surface of the molding portion 200 where the lead portion 300 is provided. The insulating rib 400 may be formed during the forming of the molding portion 200 (e.g., integrally). Therefore, the insulating rib 400 and the molding portion 200 may be provided from the same material.

[0069] The insulating rib 400 can be configured to ensure an insulating distance between the signal lead 310 and the power lead 320.

[0070] The insulating rib 400 may include a plurality of insulating ribs, and the insulating ribs may include a signal lead insulating rib 410 protruding from a surface of the molding portion 200 on which the signal lead 310 is provided, and a power lead insulating rib 420 protruding from a surface of the molding portion 200 on which the power lead 320 is provided.

[0071] Insulating ribs 400 can be provided between signal leads 310 and power leads 320 to increase creepage distance. Creepage distance refers to the surface distance between conductors with different potentials on an insulator. Therefore, the creepage distance between signal pins 311 of signal leads 310 can be increased by signal lead insulating ribs 410. Additionally, the creepage distance between input terminals 321 and output terminals 322, and between input terminals 321 and output terminals 322 of power leads 320 can be increased by power lead insulating ribs 420. Various embodiments of insulating ribs 400 will be described herein with reference to the accompanying drawings. Furthermore, aside from the construction of insulating ribs 400, the embodiments described below are similar to... Figures 1 to 4 The structures shown are the same or substantially the same; therefore, descriptions of the same structures are omitted and replaced by the above descriptions.

[0072] Reference Figure 5A and Figure 5B Multiple signal pins 311 can be disposed on one surface of the molding portion 200. The multiple signal pins 311 can be arranged adjacent to each other in one direction. The multiple signal pins 311 can be arranged with a first interval d1 and a second interval d2 wider than the first interval d1. Among the multiple signal pins 311, signal pins 311 with similar electrical specifications can be arranged with the first interval d1. Therefore, dissimilar signal pins 311 can be arranged with the second interval d2 to distinguish them from the signal pins 311 arranged with the first interval d1.

[0073] The signal lead insulation rib 410 can be configured to increase the creepage distance between signal pins 311. The signal lead insulation rib 410 can be provided between adjacent signal pins 311. For example, the signal lead insulation rib 410 can be provided in the shape of a protruding wall.

[0074] The signal lead insulation rib 410 may include a first signal lead insulation rib 411 disposed between first intervals d1 and a second signal lead insulation rib 412 disposed between second intervals d2. The second signal lead insulation rib 412 has a protrusion length d4 projecting from the outer surface of the molding portion 200 (see...). Figure 3 The projection length d3 can be set to be greater than the projection length d3 of the first signal lead insulation rib 411 protruding from the outer surface of the molding portion 200 (see...). Figure 3 The creepage distance between signal pins 311 arranged at the second interval d2 is long because the signal pins 311 arranged at the second interval d2 have different electrical specifications. Therefore, a relatively large creepage distance between signal pins 311 arranged at the second interval d2 can be ensured by ensuring that the protruding length of the second signal lead insulation rib 412 disposed between the second intervals d2 is relatively long.

[0075] At the same time, refer to Figure 6Aand Figure 6B To (e.g., more effectively) ensure creepage distance between signal pins 311 with different electrical specifications, a plurality of second signal lead insulation ribs 412 may be provided between the signal pins 311 arranged at a second interval d2. The shape and number of the first signal lead insulation ribs 411 and the second signal lead insulation ribs 412 may be varied according to insulation specifications (e.g., requirements).

[0076] Reference Figure 7A and Figure 7B The signal lead insulation rib 410 can be configured to surround the inner end of at least one signal pin 311 that contacts the molding portion 200. In this case, the inner surface of the signal lead insulation rib 410 can be spaced apart from the outer surface of the signal pin 311. The signal lead insulation rib 410 can be configured, for example, in the shape of a quadrangular prism. In this case, the thickness t2 of some signal lead insulation ribs 410 arranged in the second interval d2 can be configured to be thicker than the thickness t1 of some signal lead insulation ribs 410 arranged in the first interval d1.

[0077] Reference Figure 8A and Figure 8B The signal lead insulation rib 410 can be configured to surround the inner ends of a plurality of signal pins 311 that contact the molding portion 200. For example, the signal lead insulation rib 410 can be configured to surround the inner ends of a plurality of signal pins 311 arranged adjacent to each other at a first interval d1. Thus, signal pins 311 having similar electrical specifications can be arranged (e.g., at least) within one signal lead insulation rib 410.

[0078] Reference Figure 9A and Figure 9B The signal lead insulation rib 410 can be configured to surround the inner end of the outermost signal pin 311a among a plurality of signal pins 311 arranged adjacent to each other at a first interval d1. The signal lead insulation rib 410 can, for example, be configured in a quadrangular prism shape. Therefore, at least a portion of the signal lead insulation rib 410 can be arranged between second intervals d2 and at least a portion can be arranged between first intervals d1. Simultaneously, a wall-shaped signal lead insulation rib 410 can be additionally provided between the first intervals d1. In this case, the protruding length of the quadrangular prism-shaped signal lead insulation rib 410 can be set to be equal to or greater than the protruding length of the wall-shaped signal lead insulation rib 410.

[0079] Reference Figure 10A and Figure 10BThe power lead 320 can be disposed on one side of the molding section 200. The power lead 320 may include a plurality of input terminals 321 and a plurality of output terminals 322. The power lead insulation rib 420 may be configured to protrude from the side of the molding section 200 where the power lead 320 is disposed. The power lead insulation rib 420 may be configured to increase the creepage distance between input terminals 321, between output terminals 322, or between input terminals 321 and output terminals 322. For this purpose, the power lead insulation rib 420 may be disposed between (a) input terminals 321, (b) output terminals 322, and / or (c) between input terminals 321 and output terminals 322. For example, the power lead insulation rib 420 may be configured as a protruding wall shape.

[0080] The power lead insulation rib 420 may include a first power lead insulation rib 421 disposed between adjacent input terminals 321 or adjacent output terminals 322, and a second power lead insulation rib 422 disposed between adjacent input terminals 321 and output terminals 322. In this case, the protruding length d6 of the second power lead insulation rib 422 extending from the outer surface of the molding portion 200 may be set to be longer than the protruding length d5 ​​of the first power lead insulation rib 421 extending from the outer surface of the molding portion 200. Since the electrical specifications between the input terminals 321 and the output terminals 322 are relatively different, the protruding length d6 of the second power lead insulation rib 422 may be set to be longer than the protruding length d5 ​​of the first power lead insulation rib 421 to (e.g., effectively) ensure creepage distance between the input terminals 321 and the output terminals 322.

[0081] At the same time, refer to Figure 11A and Figure 11B To (e.g., more effectively) ensure the creepage distance between the input terminal 321 and the output terminal 322, a plurality of second power lead insulation ribs 422 may be provided between the input terminal 321 and the output terminal 322. The shape and number of the first power lead insulation ribs 421 and the second power lead insulation ribs 422 may be varied according to insulation specifications (e.g., requirements).

[0082] Reference Figure 12A and Figure 12B The power lead insulation rib 420 may be configured to surround the inner end of at least one of the input terminals 321 or output terminals 322 that contacts the molding portion 200. For example, the power lead insulation rib 420 may be configured to surround the inner end of a plurality of adjacently arranged input terminals 321 or a plurality of adjacently arranged output terminals 322 that contacts the molding portion 200. As another example, the power lead insulation rib 420 may be configured to surround the respective inner ends of a plurality of input terminals 321 and a plurality of output terminals 322 that contact the molding portion 200.

[0083] At this time, the power lead insulation rib 420 can be arranged in a quadrangular prism shape. The inner surface of the power lead insulation rib 420 and the outer surface of the input terminal 321 or output terminal 322 can be spaced apart from each other. Input terminals 321 or output terminals 322 with similar electrical specifications can be arranged on the inner surface of any power lead insulation rib 420.

[0084] Figure 13A This is a front perspective view of the power module according to another embodiment. Figure 13B This is a front view of a power module according to another embodiment. Figure 14A This is a front perspective view of a power module according to another embodiment, and Figure 14B This is a front view of a power module according to another implementation.

[0085] Reference Figures 13A to 14B According to another embodiment, the power module 1 may include a substrate 100 on which a chip is mounted, a molding portion 200 configured to surround the substrate 100 and the chip, and a lead portion 300 having one end electrically connected to the chip inside the molding portion 200 and the other end exposed outside the molding portion 200.

[0086] The lead section 300 may include signal leads 310 for transmitting control signals and power leads 320 for transmitting power. The signal leads 310 may include a plurality of signal pins 311 arranged adjacent to each other. The power leads 320 may include a plurality of input terminals 321 for supplying power to the chip and a plurality of output terminals 322 for outputting power converted by the chip.

[0087] The molding section 200 may be provided with an insulating groove 500. The insulating groove 500 can be formed by pulling a portion of the outer surface of the molding section 200 inward. The insulating groove 500 may be provided on a surface of the molding section 200 where the lead portion 300 is provided. The lead portion 300 can be exposed to the outside through the insulating groove 500 of the molding section 200. Specifically, at least a portion of the lead portion 300 may be arranged within the insulating groove 500.

[0088] The insulating groove 500 may include a signal lead insulating groove 510 that exposes the signal lead 310 to the outside and a power lead insulating groove 520 that exposes the power lead 320 to the outside.

[0089] The signal lead insulation groove 510 can be formed by pulling inward a surface of the molding portion 200 that contacts the inner end of the signal pin 311. The signal lead insulation groove 510 can increase the creepage distance between adjacent signal pins 311.

[0090] At least one signal pin 311 may be disposed within a signal lead insulation slot 510. For example, the signal lead insulation slot 510 is configured to correspond to the number of signal pins 311, such that one signal pin 311 may be disposed within one signal lead insulation slot 510 (see [link]). Figure 13A and Figure 13B Additionally, multiple signal pins 311 with the same electrical specifications can be arranged within the signal lead insulation groove 510 (see [link]). Figure 14A and Figure 14B ).

[0091] The power lead insulation groove 520 can be formed by introducing an inwardly molded surface of the molding portion 200 that contacts the inner end of the input terminal 321 or output terminal 322. The power lead insulation groove 520 can increase the creepage distance between adjacently arranged input terminals 321 or output terminals 322.

[0092] At least one of the multiple input terminals 321 and output terminals 322 may be arranged within the power lead insulation groove 520. For example, a single input terminal 321 or output terminal 322 may be arranged within the power lead insulation groove 520 (see [link]). Figure 15A and Figure 15B Alternatively, multiple input terminals 321 or output terminals 322 with the same / similar electrical specifications can be arranged (see...). Figure 16A and Figure 16B ).

[0093] In the power module 1 according to the above embodiment, the insulating ribs 400 and insulating grooves 500 can increase the creepage distance of the signal pins 311 or input / output terminals 321, 322 that constitute the signal leads 310 or power leads 320. Therefore, even if the spatial distance between the signal pins 311 or input / output terminals 321, 322 is arranged very close, the insulation performance can be ensured, thus having an effect on miniaturizing the power module 1.

[0094] Furthermore, the above embodiments can be implemented in combination with each other, as long as they do not correspond to contradictory constructions. For example, the constructions of the insulating rib 400 and the insulating groove 500 in the power module 1 according to the embodiment can be (e.g., substantially) applied simultaneously.

[0095] As described above, the power module according to the embodiment achieves miniaturization while ensuring sufficient creepage distance between signal leads and power leads.

[0096] Although exemplary embodiments have been described and illustrated above, it will be apparent to those skilled in the art that modifications and alterations may be made without departing from the scope of the invention as provided by the appended claims.

Claims

1. A power module, comprising: A substrate on which chips are mounted; A molding section, which is configured to surround the substrate and the chip; The lead portion has a first end that is electrically connected to the chip inside the molding portion and a second end that is exposed to the outside of the molding portion; as well as An insulating rib protrudes from the outer surface of the molded portion where the lead portion is provided.

2. The power module according to claim 1, wherein, The lead section includes signal leads for transmitting control signals and power leads for transmitting power. The insulating rib includes a signal lead insulating rib protruding from the first surface on which the signal lead is provided and a power lead insulating rib protruding from the first surface on which the power lead is provided.

3. The power module according to claim 2, wherein, The signal lead includes a plurality of adjacent signal pins, and the signal lead insulation ribs are arranged between the plurality of signal pins.

4. The power module according to claim 3, wherein, The spacing between the signal pins is configured as a first spacing and a second spacing, wherein the second spacing is wider than the first spacing. The signal lead insulation rib includes a first signal lead insulation rib arranged in the first interval and a second signal lead insulation rib arranged in the second interval.

5. The power module according to claim 4, wherein, The protruding length of the second signal lead insulation rib protruding from the outer surface of the molded portion is set to be longer than the protruding length of the first signal lead insulation rib protruding from the outer surface of the molded portion.

6. The power module according to claim 4, wherein, Multiple second signal lead insulation ribs are arranged in the second interval.

7. The power module according to claim 4, wherein, The signal lead insulation rib is configured to surround the inner end of at least one signal pin that contacts the molded portion.

8. The power module according to claim 7, wherein, The signal lead insulation ribs are configured to surround the inner ends of a plurality of signal pins arranged adjacent to each other at the first interval.

9. The power module according to claim 7, wherein, The signal lead insulation ribs are configured to surround the inner end of the outermost signal pin of a plurality of signal pins arranged adjacent to each other at the first interval.

10. The power module according to claim 2, wherein, The power leads include multiple input terminals for supplying power to the chip and multiple output terminals for outputting the power converted by the chip.

11. The power module according to claim 10, wherein, The power lead insulation rib includes: The first power lead insulation rib is disposed between adjacent input terminals or adjacent output terminals; and The second power lead insulation rib is located between the input terminal and the adjacent output terminal.

12. The power module according to claim 11, wherein, The protruding length of the second power lead insulation rib protruding from the outer surface of the molded portion is configured to be longer than the protruding length of the first power lead insulation rib protruding from the outer surface of the molded portion.

13. The power module according to claim 10, wherein, The power lead insulation rib is configured to surround the inner end of at least one of the input terminal or the output terminal that contacts the molded portion.

14. A power module, comprising: A substrate on which chips are mounted; A molding section, which is configured to surround the substrate and the chip; as well as The lead portion has a first end that is electrically connected to the chip inside the molding portion and a second end that is exposed to the outside of the molding portion. The lead portion is exposed to the outside through an insulating groove, which is formed by recessing inward from the outer surface of the molded portion.

15. The power module according to claim 14, wherein, The lead section includes signal leads for transmitting control signals and power leads for transmitting power. The insulating groove includes a signal lead insulating groove that exposes the signal lead to the outside and a power lead insulating groove that exposes the power lead to the outside.

16. The power module according to claim 15, wherein, The signal lead includes multiple adjacent signal pins. At least one of the multiple signal pins is arranged in a signal lead insulation groove.

17. The power module according to claim 15, wherein, The power leads include multiple input terminals for supplying power to the chip and multiple output terminals for outputting the power converted by the chip.

18. The power module according to claim 17, wherein, The plurality of input terminals are arranged within the power lead insulation groove.

19. The power module according to claim 17, wherein, The plurality of output terminals are arranged in the power lead insulation groove.

20. The power module according to claim 1, wherein, The lead section includes multiple leads. The insulating rib portion includes multiple insulating ribs. The plurality of insulating ribs protrude between the plurality of leads.

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