Electronic device including heat transfer portion forming sound output channel

Abstract

An electronic device according to an embodiment of the present disclosure may include a support bracket, a display disposed on a front surface of the support bracket, a printed circuit board disposed on a rear surface of the support bracket, a sound output module, and an electronic component disposed on the printed circuit board and generating heat during operation, and a heat transfer unit disposed between the display and the support bracket and configured to transfer heat generated from the electronic component. The heat transfer unit may be configured to provide a portion of a sound output channel through which sound generated from the sound output module passes.

Description

Technical Field

[0001] This disclosure relates to an electronic device including a heat transfer unit configured to provide a sound output channel. Background Technology

[0002] Electronic devices (e.g., portable electronic devices) may include heat-generating components (e.g., application processors) that generate heat during operation and heat transfer units (e.g., vapor chambers) for improving heat dissipation performance.

[0003] A heat-generating component and a heat transfer unit in an electronic device can be provided with a support member inserted therebetween. Heat generated from the heat-generating component can be transferred to the heat transfer unit via the support member. The heat transfer unit can be used to dissipate the heat transferred from the heat-generating component of the electronic device to other areas of the electronic device.

[0004] The above information may be provided as relevant technology for the purpose of aiding understanding of this disclosure. None of the above should be claimed as prior art in connection with this disclosure, nor should it be used to determine prior art. Summary of the Invention

[0005] Technical issues The electronic device may include a sound output module configured to output sound and a sound output channel through which the sound generated by the sound output module passes.

[0006] Because displays can be made of relatively fragile materials, electronic devices can include a separate plate from the display to define a sound output channel through which sound passes. For example, at least a portion of the sound output channel can be defined by a separate plate made of stainless steel. When a separate plate defines a portion of the sound output channel, the manufacturing cost of the electronic device may increase.

[0007] Solution to the problem An electronic device according to embodiments of the present disclosure may include a support bracket, a display, a printed circuit board, a sound output module, electronic components, and a heat transfer unit.

[0008] In one embodiment, the display may be placed on the front surface of the support bracket.

[0009] In one embodiment, the printed circuit board may be placed on the rear surface of the support bracket.

[0010] In one embodiment, the electronic components may be placed on a printed circuit board and may generate heat during operation.

[0011] In one embodiment, the heat transfer unit may be disposed between the display and the support bracket, and may be configured to transfer heat generated from the electronic components.

[0012] In one embodiment, the heat transfer unit may be configured to provide part of a sound output channel through which sound generated from the sound output module passes.

[0013] An electronic device according to embodiments of the present disclosure may include a support bracket, a display, electronic components, and a heat transfer unit.

[0014] In one embodiment, the heat transfer unit may include a plate and a flow space surrounded by the plate.

[0015] In one embodiment, at least a portion of the board may provide a portion of a sound output channel through which sound propagates.

[0016] Beneficial effects of the invention In an electronic device according to an embodiment of the present disclosure, a sound output channel through which sound passes can be provided by extending a portion of the heat transfer unit.

[0017] The electronic device according to embodiments of the present disclosure does not require a separate board to provide a sound output channel through which sound passes. Therefore, since the sound output channel does not require a separate board, the manufacturing cost of the electronic device can be reduced, and the manufacturing process can be simplified. Attached Figure Description

[0018] Figure 1 This is a block diagram of an electronic device in a network environment according to an embodiment.

[0019] Figure 2 This is a view illustrating an electronic device according to an embodiment of the present disclosure.

[0020] Figure 3 This is a view illustrating an electronic device including a heat-diffusing component according to an embodiment of the present disclosure.

[0021] Figure 4 This is a view illustrating an electronic device including a flow space according to an embodiment of the present disclosure.

[0022] Figure 5 This is a view illustrating an electronic device including a support region according to an embodiment of the present disclosure.

[0023] Figure 6a and Figure 6b This is a view illustrating an electronic device including a sound output channel area defined by a first plate or a second plate according to an embodiment of the present disclosure.

[0024] Figure 7 This is a view showing a support member, a heat transfer unit, and a heat diffusion member according to an embodiment of the present disclosure. Detailed Implementation

[0025] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0026] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0027] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0028] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0029] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0030] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0031] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0033] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0034] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0035] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0036] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0038] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0039] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0040] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0041] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0042] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0043] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0044] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0045] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0046] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0047] Figure 2 This is a view showing an electronic device 200 according to an embodiment of the present disclosure.

[0048] Figure 2 Electronic device 200 can be referenced Figure 1 The electronic device 101, or may include Figure 1 Some components of the electronic device 101.

[0049] When describing the electronic device 200 according to an embodiment of the present disclosure, the length direction of the electronic device 200 may refer to the Y-axis direction, and the height direction of the electronic device 200 may refer to the Z-axis direction. The width direction of the electronic device 200 may refer to the X-axis direction, which is a direction perpendicular to the length and height directions.

[0050] An electronic device 200 according to an embodiment of the present disclosure may include a display 210, a support 220, a printed circuit board 230, a sound output module 240, electronic components 250, a heat transfer unit 260, a battery 280, a heat transfer material 271, a rear surface support 290, and / or a rear surface cover 295.

[0051] In this embodiment, the display 210 may refer to Figure 1 The display module 160 may be included, or at least a portion thereof may be included.

[0052] In one embodiment, the display 210 can visually provide information to the outside of the electronic device 101 (e.g., to a user). The display 210 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling the corresponding device. According to another embodiment, the display 210 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0053] In an embodiment, the support 220 may include a support bracket 221, a distal member 222, and / or a separator 223.

[0054] In an embodiment, the support bracket 221 may be used to support components of the electronic device 200 (e.g., display 210 and battery 280).

[0055] In an embodiment, the support bracket 221 may be a support member configured to support components of the electronic device 200.

[0056] In an embodiment, the distal member 222 may be positioned around the distal end of the electronic device 200. For example, the distal member 222 may be located at the distal end of the electronic device 200 oriented along the +Y axis. In an embodiment, the distal member 222 may be manufactured using an injection molding process.

[0057] In this embodiment, one direction of the support bracket 221 may be the -Z-axis direction. The other direction of the support bracket 221 may be the +Z-axis direction.

[0058] In this embodiment, the front surface of the support bracket 221 may refer to the surface of the support bracket 221 oriented along the +Z axis direction. In this embodiment, the rear surface of the support bracket 221 may refer to the surface of the support bracket 221 oriented along the -Z axis direction.

[0059] In one embodiment, the printed circuit board 230 may be positioned on the support bracket 221 in one direction (e.g., the -Z axis direction).

[0060] In one embodiment, the printed circuit board 230 may be disposed on the rear surface of the support bracket 221.

[0061] In one embodiment, the printed circuit board 230 may be connected to the support member 220 via a first connecting member 237. For example, the printed circuit board 230 may be connected to and supported by the support bracket 221 and the distal member 222 via the first connecting member 237. In another embodiment, the first connecting member 237 may include an adhesive material.

[0062] In this embodiment, the display 210 may be mounted on the support bracket 221. For example, the display 210 may be positioned along the +Z axis of the support bracket 221. The display 210 may be supported by at least a portion of the support bracket 221.

[0063] In one embodiment, the display 210 may be disposed on the front surface of the support bracket 221.

[0064] In this embodiment, the sound output module 240 can refer to... Figure 1 The sound output module 155 may be included, or at least a portion thereof may be included.

[0065] In one embodiment, the sound output module 240 can output sound to the outside of the electronic device 101. The sound output module 240 may include, for example, a speaker or a receiver.

[0066] In one embodiment, the sound output module 240 may be electrically connected to the printed circuit board 230.

[0067] In one embodiment, the sound output module 240 may be configured to be at least partially surrounded by the printed circuit board 230.

[0068] In one embodiment, at least a portion of the audio output module 240 may be surrounded by a shielding cover 242. The shielding cover 242 surrounds the audio output module 240 and can be used to shield noise.

[0069] In one embodiment, the sound output module 240 may be connected to the support member 220 via a second connecting member 247. For example, the sound output module 240 may be connected to and supported by the support bracket 221 and the distal member 222 via the second connecting member 247. In another embodiment, the second connecting member 247 may include an adhesive material.

[0070] In this embodiment, the electronic component 250 may be disposed on the printed circuit board 230. For example, the electronic component 250 may be disposed on a surface of the printed circuit board 230 (e.g., the surface of the printed circuit board 230 oriented along the +Z axis direction).

[0071] In one embodiment, electronic component 250 may include a processor.

[0072] In this embodiment, electronic component 250 may be a heat-generating component that generates heat during operation. For example, electronic component 250 may be an application processor configured to control electronic device 200 and perform various data processing or operations.

[0073] In an embodiment, the printed circuit board 230 may include at least one electronic device 235. The electronic device 235 may be disposed on one surface of the printed circuit board 230 (e.g., a surface of the printed circuit board 230 oriented along the +Z axis) and / or on another surface opposite said one surface. In an embodiment, the electronic device 235 may include a processor (e.g., Figure 1 The processor 120 in the memory (e.g., Figure 1 The memory 130 in the memory) and / or interface (e.g., Figure 1 Interface 177 in the middle.

[0074] In one embodiment, the heat transfer unit 260 may be disposed in another direction (e.g., the +Z axis direction) of the support portion 2215 of the support bracket 221.

[0075] In one embodiment, the heat transfer unit 260 may be disposed between the display 210 and the support bracket 221. For example, the heat transfer unit 260 may be disposed between the display 210 and the support portion 2215 of the support bracket 221. In another embodiment, the support bracket 221 may be configured to cover the heat transfer unit 260 within the support portion 2215.

[0076] In an embodiment, the heat transfer unit 260 can be used to diffuse heat generated from the electronic component 250 to other areas of the electronic device 200.

[0077] In an embodiment, the heat transfer unit 260 can be used to transfer heat generated from the electronic component 250 to other areas of the electronic device 200.

[0078] In an embodiment, the heat transfer unit 260 may include a heat pipe and / or a graphite sheet.

[0079] In this embodiment, heat transfer material 271 may be disposed between electronic component 250 and heat transfer unit 260. Heat transfer material 271 may contact electronic component 250 on one surface (e.g., the surface of heat transfer material 271 oriented along the -Z axis direction) and may contact heat transfer unit 260 on another surface.

[0080] In this embodiment, heat generated from the electronic component 250 can be transferred to the support bracket 221 via the heat transfer material 271. The heat transferred to the support bracket 221 can then be transferred to the heat transfer unit 260, which is configured to contact the support bracket 221.

[0081] In this embodiment, the heat transfer material 271 may include a thermal interface material (TIM). For example, the heat transfer material 271 may include a liquid or solid TIM.

[0082] In one embodiment, the battery 280 may be positioned in one direction (e.g., the -Z-axis direction) of the support bracket 221. In another embodiment, the battery 280 may supply power to at least one component of the electronic device 200. According to an embodiment, the battery 280 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0083] In an embodiment, the support member 220 may include a partition 223 extending along the height direction (e.g., the Z-axis direction) of the electronic device 200.

[0084] In one embodiment, the separator 223 may extend from the support portion 2215 of the support bracket 221 along the height direction of the electronic device 200.

[0085] In an embodiment, the separator 223 may define the space where the battery 280 is disposed and allow the battery 280 to be disposed separately from other components of the electronic device 200.

[0086] In this embodiment, the battery 280 and the printed circuit board 230 may be arranged in different directions relative to the separator 223. For example, the battery 280 may be positioned in the -Y-axis direction relative to the separator 223, and the printed circuit board 230 may be positioned in the +Y-axis direction.

[0087] In one embodiment, the rear surface support 290 may be positioned in the opposite direction to the support 220. For example, the rear surface support 290 may be positioned in the -Z axis direction relative to the printed circuit board 230 and the battery 280.

[0088] In one embodiment, a rear surface cover 295 may be disposed on a rear surface support 290. The rear surface cover 295 may be used to protect the rear surface of the electronic device 200 (e.g., the surface of the electronic device 200 oriented in the -Z axis direction).

[0089] In an embodiment, the sound output module 240, electronic components 250, and battery 280 may be arranged in this order along the length of the electronic device 200 (e.g., the Y-axis direction).

[0090] In one embodiment, the heat transfer unit 260 may extend from a position overlapping with the sound output module 240 to a position overlapping with the battery 280. For example, when viewed in the height direction (e.g., the Z-axis direction) of the electronic device 200, the heat transfer unit 260 may overlap with the sound output module 240 and the battery 280.

[0091] In an embodiment, the heat transfer unit 260 may include a first plate 261, a second plate 262, and / or a flow space 263.

[0092] In this embodiment, the heat transfer unit 260 may refer to a heat spreader.

[0093] In one embodiment, the heat transfer unit 260 may include a heat spreader. In another embodiment, the heat spreader may include a first plate 261, a second plate 262, and / or a flow space 263.

[0094] In one embodiment, the vapor chamber may include a rear surface defining a portion of the sound output channel 245 and a front surface on which the display 210 is disposed.

[0095] In this embodiment, the rear surface of the heat spreader may refer to the rear surface of the first plate 261 or the second plate 262. The front surface of the heat spreader may refer to the front surface of the first plate 261 or the second plate 262.

[0096] In this embodiment, the first plate 261 may contact the support bracket 221. For example, the first plate 261 may extend while contacting the support portion 2215 of the support bracket 221.

[0097] In one embodiment, the first plate 261 may extend along the length direction (e.g., the Y-axis direction) of the electronic device 200. In another embodiment, the first plate 261 may extend while being at least partially bent.

[0098] In an embodiment, the second plate 262 may be disposed in the direction from the first plate 261 toward the display 210 (e.g., the +Z axis direction).

[0099] In one embodiment, the second plate 262 may be connected to the first plate 261. In another embodiment, the second plate 262 may extend along the length direction (e.g., the Y-axis direction) of the electronic device 200.

[0100] In this embodiment, the first plate 261 and the second plate 262 may comprise materials with high thermal conductivity. For example, the first plate 261 and the second plate 262 may comprise metallic materials with high thermal conductivity.

[0101] In an embodiment, the first plate 261 may be a metal plate containing metallic material.

[0102] In an embodiment, the second plate 262 may be a metal plate containing metallic material.

[0103] In an embodiment, the flow space 263 may be defined in at least a portion of the space between the first plate 261 and the second plate 262. For example, the first plate 261 and / or the second plate 262 may be extended while being at least partially bent, such that the flow space 263 may be disposed between the first plate 261 and the second plate 262.

[0104] In this embodiment, a diffusion material may be disposed within the flow space 263. The diffusion material may be in a liquid or gaseous state. The diffusion material may be used to diffuse heat transferred from the heat transfer unit 260 throughout the electronic device 200.

[0105] In an embodiment, the amount of diffusion material disposed within the flow space 263 can vary proportionally to the size of the flow space 263.

[0106] In this embodiment, the flow space 263 can be completely sealed from the outside. For example, the first plate 261 and the second plate 262 can be connected to define a flow space 263 that is completely sealed from the outside.

[0107] In this embodiment, the sound S generated from the sound output module 240 can propagate along the sound output channel 245. The sound S can be transmitted to the outside of the electronic device 200 through the sound output channel 245.

[0108] In an embodiment, the heat transfer unit 260 may include a sound output channel region 260A defining a sound output channel 245. For example, refer to... Figure 2 The sound output channel region 260A of the heat transfer unit 260 extends in a direction toward the distal member 222 (e.g., the +Y axis direction) to surround at least a portion of the sound output channel 245.

[0109] In this embodiment, during the manufacturing of the electronic device 200, a surface treatment process can be performed on the sound output channel region 260A of the heat transfer unit 260. For example, the surface of the sound output channel region 260A of the heat transfer unit 260 can be smoothly formed by the surface treatment process. The smoothly formed surface of the sound output channel region 260A can be more conducive to the lossless propagation of sound S in the sound output channel 245 because a smooth surface results in less sound energy absorption and reflection compared to a rough or porous surface.

[0110] Figure 3 This is a view showing an electronic device 200 including a heat diffusion member 275 according to an embodiment of the present disclosure.

[0111] In description Figure 3 When the electronic device 200 shown is used, the connection to the electronic device can be omitted. Figure 2 The configuration of the electronic device 200 shown is substantially the same as that described.

[0112] In one embodiment, the electronic device 200 may include a heat diffusion member 275. In another embodiment, the heat diffusion member 275 may be disposed between the heat transfer unit 260 and the display 210.

[0113] In an embodiment, the heat diffusion member 275 may include a material with high thermal conductivity.

[0114] In an embodiment, the heat diffusion member 275 may refer to a graphite sheet. In an embodiment, the heat diffusion member 275 may include a graphite sheet.

[0115] In this embodiment, a heat diffusion member 275 is disposed on the heat transfer unit 260 to further improve the heat diffusion effect of the heat transfer unit 260. For example, when the electronic device 200 includes a heat diffusion member 275, the heat transfer unit 260 can transfer the heat generated in the electronic component 250 to the diffusion member 275, and the diffusion member 275 can then diffuse the heat to other areas of the electronic device 200.

[0116] In one embodiment, the electronic device 200 may include adhesive members 272 and 273. Adhesive members 272 and 273 may be disposed between the heat transfer unit 260 and the support member 220.

[0117] In an embodiment, adhesive members 272 and 273 may refer to adhesive material. In an embodiment, adhesive members 272 and 273 may contain adhesive material.

[0118] In this embodiment, the heat transfer unit 260 is at least partially coupled to the support member 220 via adhesive members 272 and 273. For example, the heat transfer unit 260 may be coupled to the support bracket 221 of the support member 220 via the first adhesive member 272. The heat transfer unit 260 may also be coupled at its distal end to the distal member 222 of the support member 220 via the second adhesive member 273.

[0119] In an embodiment, adhesive members 272 and 273 can be used to seal the space between the heat transfer unit 260 and the support member 220.

[0120] In this embodiment, because the first adhesive member 272 and the second adhesive member 273 seal the space between the heat transfer unit 260 and the support member 220, the sound output channel 245 can extend in a state of complete isolation from the outside. For example, the sound output channel 245 can extend toward the distal opening portion in a state of complete isolation from the outside.

[0121] In this embodiment, the sound output channel 245 extends toward the opening at the distal end of the electronic device 200. The sound output channel is completely isolated from the outside, which facilitates the propagation of sound S along the sound output channel 245 and improves the performance of the sound output module 240 because the acoustic energy in the sound output channel 245 is not affected by external interference.

[0122] Figure 4 This is a view showing an electronic device 200 including a flow space 263 according to an embodiment of the present disclosure.

[0123] In description Figure 4 When the electronic device 200 shown is used, the connection to the electronic device can be omitted. Figure 2 The configuration of the electronic device 200 shown is substantially the same as that described.

[0124] In this embodiment, at least a portion of the flow space 263 may be disposed at a location overlapping with the sound output channel 245. For example, when viewed in the height direction (e.g., the Z-axis direction) of the electronic device 200, a portion of the flow space 263 may overlap with the sound output channel 245. The flow space 263 may be disposed in the sound output channel region 260A of the heat transfer unit 260, wherein at least a portion of the flow space 263 overlaps with the sound output channel 245.

[0125] In this embodiment, the flow space 263 of the heat transfer unit 260 may extend along the length direction (e.g., the Y-axis direction) of the electronic device 200. For example, the flow space 263 may extend along the length direction of the electronic device 200 from a position overlapping with the sound output channel 245 to a position overlapping with the battery 280. When viewed in the height direction (e.g., the Z-axis direction) of the electronic device 200, the flow space 263 may overlap with the sound output channel 245 and the battery 280.

[0126] In this embodiment, as the flow space 263 is made larger, the heat transfer effect of the heat transfer unit 260 can be improved. For example, as the flow space 263 is made larger, the diffusion material within the flow space 263 can be easily moved to other areas of the electronic device 200, thus improving the heat transfer effect of the heat transfer unit 260.

[0127] In this embodiment, since the flow space 263 extends from the position overlapping with the battery 280 to the position overlapping with the sound output channel 245, the heat transfer effect of the heat transfer unit 260 can be improved due to the increase of the flow space 263.

[0128] Figure 5 This is a view showing an electronic device 200 including a support region 260B according to an embodiment of the present disclosure.

[0129] In description Figure 5 When the electronic device 200 shown is used, the connection to the electronic device can be omitted. Figure 2 The configuration of the electronic device 200 shown is substantially the same as that described.

[0130] In one embodiment, the heat transfer unit 260 may include a support region 260B. The support region 260B may be a portion of the heat transfer unit 260 supported by a support bracket 221. In another embodiment, the support region 260B may be a region located between the flow spaces 263.

[0131] In an embodiment, the support region 260B may be the region where the first plate 261 and the second plate 262 are in contact with each other.

[0132] In an embodiment, the support region 260B of the heat transfer unit 260 can be formed in a shape corresponding to the support bracket 221. For example, refer to Figure 5 When a portion of the support bracket 221 protrudes in the +Z axis direction, the support area 260B located at the corresponding position can be formed into a shape in which a portion of the heat transfer unit 260 is recessed in the +Z axis direction.

[0133] In an embodiment, the heat transfer unit 260 may contact the support bracket 221 in the support region 260B. For example, a portion of the first plate 261 of the heat transfer unit 260 may be formed in a recessed shape in the +Z axis direction to contact a protruding portion of the support bracket 221 in the +Z axis direction.

[0134] In an embodiment, the heat transfer unit 260 may not include a flow space 263 in the support region 260B. For example, the heat transfer member 260 may have a first plate 261 and a second plate 262 connected to each other in the support region 260B, and may not include a flow space 263.

[0135] In an embodiment, the support region 260B of the electronic device 200 may be formed only in a portion of the electronic device 200. For example, the electronic device 200 may include a portion of a cross-section perpendicular to the width direction (e.g., the X-axis direction) of the electronic device 200. Figure 5 The support region 260B shown herein, and in the remaining portion of the cross-section perpendicular to the width direction of the electronic device 200, the electronic device 200 may include... Figure 4 The flow space 263 is of the form shown without a support region 260B. Therefore, the flow spaces 263 located in the -Y-axis direction and the +Y-axis direction respectively relative to the support region 260B can be connected to each other in a part of the electronic device 200.

[0136] In this embodiment, since the first plate 261 and the second plate 262 of the heat transfer unit 260 are connected in contact with each other in the support region 260B, the heat transfer unit 260 can be stably supported by the support bracket 221. For example, the heat transfer unit 260 does not include empty space (e.g., flow space 263) between the first plate 261 and the second plate 262 in the support region 260B, which may be more advantageous for the bracket 221 to bear the load applied to the heat transfer unit 260.

[0137] Figure 6a and Figure 6b This is a view showing an electronic device 200 including a sound output channel region 260A defined by a first plate 261 or a second plate 262 according to an embodiment of the present disclosure.

[0138] In description Figure 6a and Figure 6b When the electronic device 200 shown is described, the connection to the electronic device can be omitted. Figure 2 The configuration of the electronic device 200 shown is basically the same as that described.

[0139] Figure 6a This is a view showing the sound output channel region 260A defined by the second plate 262 according to an embodiment. Figure 6bThis is a view showing the sound output channel region 260A defined by the first plate 261 according to an embodiment.

[0140] In an embodiment, the sound output channel region 260A may be defined by one board instead of two boards 261 and 262. For example, refer to Figure 6a According to the embodiment, the sound output channel region 260A may be defined solely by the second plate 262. The second plate 262 may extend in a direction toward the distal end of the electronic device 200 (e.g., the +Y axis direction) to define at least a portion of the sound output channel region 260A surrounding the sound output channel 245.

[0141] In this embodiment, the front surface of the second plate 262 may refer to the surface of the second plate 262 oriented along the positive Z-axis. The rear surface of the second plate 262 may refer to the surface of the second plate 262 oriented along the -Z-axis.

[0142] refer to Figure 6a In one embodiment, a portion of the audio output channel 245 may be defined by the rear surface of the second plate 262. The display 210 may be disposed on the front surface of the second plate 262.

[0143] refer to Figure 6b According to the embodiment, the sound output channel region 260A may be defined solely by the first plate 261. The first plate 261 may extend in a direction toward the distal end of the electronic device 200 (e.g., the +Y axis direction) to define the sound output channel region 260A surrounding at least a portion of the sound output channel 245.

[0144] In this embodiment, the front surface of the first plate 261 may refer to the surface of the first plate 261 oriented along the positive Z-axis direction. The rear surface of the first plate 261 may refer to the surface of the first plate 261 oriented along the -Z-axis direction.

[0145] refer to Figure 6b In one embodiment, a portion of the audio output channel 245 may be defined by the rear surface of the first plate 261. The display 210 may be disposed on the front surface of the first plate 261.

[0146] In an embodiment, when the sound output channel region 260A is defined by only one plate (e.g., a first plate 261 or a second plate 262), the sound output channel 245 can be configured to be larger than the sound output channel obtained when the sound output channel region 260A is defined by two plates 261 and 262. In the electronic device 200 according to the embodiment, since the sound output channel 245 can be configured to be larger, sound S can propagate more easily along the sound output channel 245.

[0147] Figure 7This is a view showing the support portion 220, the heat transfer unit 260, and the heat diffusion member 275 according to an embodiment of the present disclosure.

[0148] exist Figure 7 In the middle, it can be omitted. Figure 2 Some of the components of the electronic device 200 shown.

[0149] refer to Figure 7 The support member 220 may extend along the width direction (e.g., the X-axis direction) and the length direction (e.g., the Y-axis direction) of the electronic device 200. The support member 220 may be used to support other components of the electronic device 200.

[0150] In one embodiment, the heat transfer unit 260 may be disposed on the support member 220. (See reference...) Figure 7 The heat transfer unit 260 may be disposed on a part of the support member 220.

[0151] In an embodiment, the heat transfer unit 260 may extend along the width direction (e.g., the X-axis direction) and the length direction (e.g., the Y-axis direction) of the electronic device 200. For example, the heat transfer unit 260 may extend from the distal end of the electronic device 200 (e.g., the distal end of the electronic device 200 oriented along the +Y-axis direction) along the length direction (e.g., along the Y-axis direction) of the electronic device 200.

[0152] In one embodiment, the heat transfer unit 260 may extend to the sound output module 240 (see [link]). Figure 2 ) and audio output channel 245 (see Figure 2 The overlapping positions. For example, the heat transfer unit 260 may extend to include the sound output channel region 260A overlapping with the sound output channel 245 (see...). Figure 2 The audio output channel area 260A can be around the audio output channel 245 (see...). Figure 2 At least a portion of the area of ​​the sound output module 240 (see) Figure 2 The generated sound S (see) Figure 2 It is transmitted through the sound output channel 245.

[0153] In this embodiment, the electronic device 200 is configured such that the sound output channel 245 (see...) Figure 2 A portion of the sound output channel 245 is surrounded by the heat transfer unit 260, thus defining the sound output channel 245 (see [link]). Figure 2 A separate board may not be necessary.

[0154] In this embodiment, the heat diffusion member 275 may be disposed on the heat transfer unit 260. For example, the heat diffusion member 275 may be disposed on the surface of the heat transfer unit 260 opposite to the surface facing the support member 220.

[0155] In an embodiment, the heat diffusion member 275 may be configured to cover the heat transfer unit 260.

[0156] refer to Figure 7 According to the embodiment, the heat diffusion member 275 can be configured to completely cover one surface of the heat transfer unit 260. Figure 7 The arrangement of the heat diffusion member 275 shown is exemplary, and the heat diffusion member 275 according to the embodiment can be configured to cover a portion of a surface of the heat transfer unit 260.

[0157] In an embodiment, the heat diffusion member 275 can be used to improve the heat transfer effect obtained via the heat transfer unit 260.

[0158] The electronic device may include a sound output module configured to output sound and a sound output channel through which sound generated by the sound output module passes.

[0159] Because displays may be made of relatively fragile materials, electronic devices may include a separate plate from the display to define a sound output channel through which sound passes. For example, at least a portion of the sound output channel may be defined by a separate plate made of stainless steel. When a separate plate defines a portion of the sound output channel, the manufacturing cost of the electronic device may increase.

[0160] The electronic device 200 may include a support bracket 221, a display 210 disposed on the front surface of the support bracket 221, a printed circuit board 230 disposed on the rear surface of the support bracket 221, a sound output module 240, an electronic component 250 disposed on the printed circuit board 230 and generating heat during operation, and a heat transfer unit 260 disposed between the display 210 and the support bracket 221 and configured to transfer heat generated from the electronic component 250.

[0161] In one embodiment, the heat transfer unit 260 may be configured to provide part of a sound output channel 245 through which sound S generated from the sound output module 240 propagates.

[0162] In an electronic device 200 according to an embodiment of the present disclosure, sound S can be provided through a sound output channel 245 therein by extending a portion of a heat transfer unit 260.

[0163] The electronic device 200 according to embodiments of the present disclosure does not require a separate board to provide sound S through the sound output channel 245 therein. Therefore, the manufacturing cost of the electronic device 200 can be reduced, and the manufacturing process can be simplified because the sound output channel does not require a separate board.

[0164] In an embodiment, the heat transfer unit 260 may include a heat spreader plate, which includes a first metal plate 261, a second metal plate 262, and a flow space 263 defined between the first metal plate 261 and the second metal plate 262.

[0165] In one embodiment, the vapor chamber may include a rear surface configured to provide part of an audio output channel and a front surface on which the display 210 is disposed.

[0166] In one embodiment, electronic component 250 may include a processor.

[0167] In one embodiment, a portion of the sound output channel 245 may be provided by the rear surface of the first metal plate 261.

[0168] In one embodiment, at least a portion of the display 210 may be disposed on the front surface of the first metal plate 261.

[0169] In one embodiment, a portion of the sound output channel 245 is provided by the rear surface of the second metal plate 262.

[0170] In one embodiment, at least a portion of the display 210 may be disposed on the front surface of the second metal plate 262.

[0171] In one embodiment, at least a portion of the flow space 263 may be located at a position overlapping with the sound output channel 245.

[0172] In an embodiment, the heat transfer unit 260 may further include a support region 260B, which is supported by a support bracket 221 and in which the first metal plate 261 and the second metal plate 262 are in contact with each other.

[0173] In an embodiment, the heat transfer unit 260 may include a diffusion material disposed inside the flow space 263 and convertible into liquid and gas states.

[0174] In an embodiment, the electronic device 200 may further include a heat transfer material 271 that contacts the electronic component 250 on one surface and the heat transfer unit 260 on another surface.

[0175] In this embodiment, the heat generated from the electronic component 250 can be transferred to the heat transfer unit 260 via a heat transfer material 271 made of a thermal interface material.

[0176] In an embodiment, the electronic device 200 may further include an adhesive material 272 disposed between the support bracket 221 and the heat transfer unit 260 to connect the support bracket 221 and the heat transfer unit 260 to each other.

[0177] In one embodiment, adhesive material 272 can seal the space between support bracket 221 and heat transfer unit 260.

[0178] In an embodiment, the electronic device 200 may further include a graphite sheet 275 disposed between the heat transfer unit 260 and the display 210.

[0179] In an embodiment, the electronic device 200 may further include a battery 280 disposed on the rear surface of the support bracket 221.

[0180] In this embodiment, the sound output module 240, electronic components 250, and battery 280 are arranged sequentially along the length of the electronic device 200.

[0181] In one embodiment, the heat transfer unit 260 can extend from the position overlapping with the sound output module 240 to the position overlapping with the battery 280.

[0182] An electronic device 200 according to an embodiment of the present disclosure may include a support bracket 221, a display 210 disposed on the front surface of the support bracket 221, an electronic component 250 that generates heat during operation, and a heat transfer unit 260 disposed between the display 210 and the support bracket 221 and configured to transfer heat generated from the electronic component 250. The heat transfer unit 260 may include plates 261 and 262 and a flow space 263 surrounded by plates 261 and 262, and a portion of plates 261 and 262 may provide a portion of a sound output channel 245 through which sound S propagates.

[0183] In one embodiment, at least a portion of the flow space 263 may be positioned at a location overlapping a portion of the sound output channel 245.

[0184] In an embodiment, the electronic device 200 may further include an adhesive material 272 disposed between the support bracket 221 and the heat transfer unit 260 to connect the support bracket 221 and the heat transfer unit 260 to each other.

[0185] In an embodiment, plates 261 and 262 may include a first plate 261 that is at least partially in contact with the support bracket 221 and a second plate 262 connected to the first plate 261.

[0186] In one embodiment, the sound output channel 245 may be defined by the rear surface of the first plate 261.

[0187] In one embodiment, the sound output channel 245 may be defined by the rear surface of the second plate 262.

[0188] In an embodiment, the heat transfer unit 260 may further include a support region 260B supported by a support bracket 221 and excluding the flow space 263.

[0189] In an embodiment, the electronic device 200 may include a graphite sheet 275 disposed between the heat transfer unit 260 and the display 210.

[0190] The technical problems to be solved by this disclosure are not limited to those described above, and other technical problems not described above can be clearly understood by those skilled in the art to which this disclosure pertains.

[0191] The effects achievable by this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand other effects not described above.

[0192] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0193] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “connected to another element (e.g., a second element),” “linked to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0194] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0195] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can, under the control of the processor, invoke and execute at least one instruction from one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0196] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0197] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (200), the electronic device (200) comprising: Support bracket (221); A display (210) is disposed on the front surface of the support bracket (221); A printed circuit board (230) is disposed on the rear surface of the support bracket (221); Audio output module (240); Electronic components (250), said electronic components (250) are disposed on said printed circuit board (230) and generate heat during operation; and A heat transfer unit (260) is disposed between the display (210) and the support bracket (221) and is configured to transfer heat generated from the electronic components (250). The heat transfer unit (260) is configured to provide part of a sound output channel (245) through which sound (S) generated from the sound output module (240) passes.

2. The electronic device (200) according to claim 1, wherein, The heat transfer unit (260) includes a heat spreader, which includes a first metal plate (261), a second metal plate (262), and a flow space (263) formed between the first metal plate (261) and the second metal plate (262). The heat spreader includes a rear surface configured to provide a portion of the sound output channel (245) and a front surface on which the display (210) is disposed.

3. The electronic device (200) according to claim 2, wherein, A portion of the sound output channel (245) is provided by the rear surface of the first metal plate (261), and At least a portion of the display (210) is disposed on the front surface of the first metal plate (261).

4. The electronic device (200) according to claim 2, wherein, A portion of the sound output channel (245) is provided by the rear surface of the second metal plate (262), and At least a portion of the display (210) is disposed on the front surface of the second metal plate (262).

5. The electronic device according to claim 2, wherein, At least a portion of the flow space is formed at a location overlapping with the sound output channel.

6. The electronic device (200) according to any one of claims 2 to 5, wherein, The heat transfer unit (260) further includes a support region (260B) supported by the support bracket (221) and the first metal plate (261) and the second metal plate (262) are in contact with each other in the support region (260B).

7. The electronic device (200) according to any one of claims 2 to 6, wherein, The heat transfer unit (260) also includes a diffusion material disposed inside the flow space (263) and convertible into liquid and gas states.

8. The electronic device (200) according to any one of claims 1 to 7, wherein the electronic device (200) further comprises: A heat transfer material (271) is in contact with the electronic component (250) on one surface and with the heat transfer unit (260) on another surface. The heat generated from the electronic component (250) is transferred to the heat transfer unit (260) via the heat transfer material.

9. The electronic device (200) according to any one of claims 1 to 8, wherein the electronic device (200) further comprises: An adhesive material (272) is disposed between the support bracket (221) and the heat transfer unit (260) to connect the support bracket (221) and the heat transfer unit (260) to each other. The adhesive material (272) seals the space between the support bracket (221) and the heat transfer unit (260).

10. The electronic device (200) according to any one of claims 1 to 9, wherein the electronic device (200) further comprises: A graphite sheet (275) is disposed between the heat transfer unit (260) and the display (210).

11. The electronic device (200) according to any one of claims 1 to 10, wherein the electronic device (200) further comprises: A battery (280) is disposed on the rear surface of the support bracket (221). The sound output module (240), the electronic component (250) and the battery (280) are arranged sequentially along the length of the electronic device (200), and the heat transfer unit (260) extends from the position overlapping with the sound output module (240) to the position overlapping with the battery (280).

12. An electronic device (200), the electronic device (200) comprising: Support bracket (221); A display (210) is disposed on the front surface of the support bracket (221); Electronic component (250), which generates heat during operation; and A heat transfer unit (260) is disposed between the display (210) and the support bracket (221) and is configured to dissipate heat generated from the electronic components (250). The heat transfer unit includes: Board; and The flow space (263) surrounded by the plate, and At least a portion of the board is configured to provide a portion of a sound output channel (245) through which sound (S) is propagated.

13. The electronic device according to claim 12, wherein, At least a portion of the flow space is located at a position overlapping with the sound output channel.

14. The electronic device (200) according to claim 12, wherein the electronic device (200) further comprises: An adhesive material (272) is disposed between the support bracket (221) and the heat transfer unit (260) to bond the support bracket (221) and the heat transfer unit (260) together. The adhesive material (272) seals the space between the support bracket (221) and the heat transfer unit (260).

15. The electronic device (200) according to any one of claims 12 to 14, wherein, The plate includes: The first plate (261) is in at least partial contact with the support bracket (221); and The second plate (262) is connected to the first plate (261), and The sound output channel (245) is defined by the rear surface of the first plate (261) or the rear surface of the second plate (262).

Images