Heat dissipation plate, electronic assembly, and method of manufacturing electronic assembly having

Abstract

A heat sink, an electronic component having the heat sink, and a method of manufacturing the heat sink and the electronic component having improved thermal performance. One example is a heat sink configured to be mounted to a die. The heat sink includes a body including a top side and a bottom side, the top side being arranged facing away from the die, and the bottom side being arranged facing the die. The body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact location of the die, a second portion of the bottom side is thermally coupled to a second target contact location of the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat sink to dissipate heat generated by the die.

Description

Technical Field

[0001] This disclosure relates generally to cooling electronic devices, and more specifically to electronic components and methods of manufacturing electronic components with improved thermal performance. Background Technology

[0002] Electronic packages are used to provide protection, support, and connectivity for one or more electronic components. However, electronic packages are characterized by one or more components (e.g., dies) that generate heat. This heat can then negatively impact the performance of one or more electronic components, and more generally, the performance of the electronic package itself. Therefore, various techniques have been developed to improve thermal performance by dissipating heat from one or more heat-generating components of these electronic packages.

[0003] Figure 1 One of these technologies is shown, in which an electronic package in the form of a socket-type CPU 100 is equipped with an integrated heatsink 104. Although in Figure 1 Although not easily visible, the integrated heatsink 104 makes thermal contact with the exposed die of the socket-type CPU 100, allowing heat generated by the die to be transferred to the integrated heatsink 104. This heat is then dissipated via one or more heatsinks, although... Figure 1 Not shown, but the one or more heat sinks are spring-loaded onto the integrated heat sink 104 to achieve low thermal resistance between the integrated heat sink 104 and one or more heat sinks.

[0004] Figure 2 and Figure 3 Another technique among these is illustrated, in which a spring-loaded heat sink 200 is mounted on an electronic package in the form of a flip-chip ball grid array (FCBGA) 204, which is soldered to a printed circuit board (PCB) 208 via solder balls (not shown). The spring-loaded heat sink 200 then dissipates heat generated by the exposed die 212 of the FCBGA 204. Summary of the Invention

[0005] According to a first exemplary aspect of this disclosure, a heat sink is provided. The heat sink is configured to be mounted to a die. The heat sink includes a body having a top side and a bottom side, the top side being arranged facing away from the die and the bottom side being arranged facing the die. The body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact location on the die, a second portion of the bottom side is thermally coupled to a second target contact location on the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat sink to dissipate heat generated by the die.

[0006] According to a second exemplary aspect, an electronic component is provided. The electronic component includes: a die having a first target contact location and a second target contact location, the first target contact location being associated with a first predetermined internal hot spot of the die, and the second target contact location being associated with a second predetermined internal hot spot of the die. The electronic component further includes: a heat sink formed and mounted to the die such that a first portion of the heat sink is thermally coupled to the first target contact location of the die, and a second portion of the heat sink is thermally coupled to the second target contact location of the die, thereby allowing the heat sink to dissipate heat generated by the die. The electronic component further includes: a thermally conductive grease material that thermally couples the first portion of the heat sink to the first target contact location of the die and the second portion of the heat sink to the second target contact location, the thermally conductive grease material being movable between the first and second portions of the heat sink.

[0007] According to a third exemplary aspect, a method of manufacturing an electronic component is provided. The manufacturing method includes: obtaining a die; identifying a first internal hot spot and a second internal hot spot on the die; and defining a first target contact location and a second target contact location on the die, respectively associated with the first internal hot spot and the second internal hot spot. The manufacturing method then includes obtaining a heat sink based on the defined first and second target contact locations. The heat sink has a shape such that a first portion of the heat sink is thermally coupled to the first target contact location on the die, and a second portion of the heat sink is thermally coupled to the second target contact location on the die. The manufacturing method further includes mounting the heat sink to the die.

[0008] Furthermore, according to any one or more of the foregoing first exemplary aspect, second exemplary aspect or third exemplary aspect, the electronic component and / or the method of manufacturing the electronic component may include any one or more of the following additional preferred forms.

[0009] In a preferred embodiment, the first and second portions on the bottom side are offset from the central portion of the body.

[0010] In another preferred embodiment, the bottom side has a fourth portion suitable for thermal coupling to a third target contact position of the die.

[0011] In another preferred embodiment, the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.

[0012] In another preferred embodiment, the bottom side is defined by a first angular surface and a second angular surface, and a first portion of the bottom side lies on the first angular surface, and a second portion of the bottom side lies on the second angular surface.

[0013] In another preferred embodiment, the bottom side is partially flat.

[0014] In another preferred embodiment, one or more flow channels are formed in the bottom side of the heat sink.

[0015] In another preferred embodiment, the bottom side of the heat sink includes a first surface made of a first material, and the first and second portions of the heat sink are made of a second material different from the first material.

[0016] In another preferred embodiment, the heat sink has a third portion disposed between the first and second portions and spaced apart from the die.

[0017] In another preferred embodiment, the electronic component includes a flip-chip ball grid array containing dies.

[0018] In another preferred embodiment, the first target location is located between the first predetermined internal hot spot and the third predetermined internal hot spot.

[0019] In another preferred embodiment, the first and second portions of the heat sink are offset from the center of the die.

[0020] In another preferred embodiment, the die has a third target contact position associated with a third predetermined internal hot spot of the die, and the heat sink is formed and mounted to the PCB such that a third portion of the heat sink thermally contacts the third target contact position.

[0021] In another preferred embodiment, the die has a first shape, and the heat sink has a second shape different from the first shape.

[0022] In another preferred embodiment, the heat sink has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces the die, and wherein the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.

[0023] In another preferred embodiment, the heat sink has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces the die, wherein the bottom side is defined by a first angled surface and a second angled surface, and wherein a first portion of the bottom side is located on the first angled surface and a second portion of the bottom side is located on the second angled surface.

[0024] In another preferred embodiment, the heat sink is designed based on the defined first target contact position and second target contact position. The heat sink can then be manufactured.

[0025] In another preferred embodiment, the first and second internal hot spots can be identified from the thermal image generated using a thermal imager of the die. Attached Figure Description

[0026] Figure 1 A known electronic package is shown, having an integrated heat sink for dissipating heat generated by the electronic package.

[0027] Figure 2 Another known electronic package is shown.

[0028] Figure 3 It shows the dissipation of by Figure 2 Known heat sinks are used to dissipate heat generated by electronically packaged components.

[0029] Figure 4 Another known electronic package is shown, which is similar to Figure 2 But it also includes the electronic package of the backplane coupled thereto.

[0030] Figure 5 Another known electronic package with a die is shown.

[0031] Figure 6 yes Figure 5 An enlarged side view of the die.

[0032] Figure 7 It shows Figure 5 The internal hotspots of the die.

[0033] Figure 8 This is a schematic diagram illustrating an example of a method for manufacturing an electronic component according to the teachings of this disclosure.

[0034] Figures 9A to 9C An example of a mold that can be customized and used to manufacture a heat sink, based on the teachings of this disclosure, is shown.

[0035] Figures 10A to 10D An example of a portion of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0036] Figures 11A to 11C Another example of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0037] Figures 12A to 12C Another example of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0038] Figures 13A to 13C Another example of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0039] Figures 14A to 14C Another example of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0040] Figures 15A to 15C Another example of an electronic component constructed in accordance with the teachings of this disclosure is shown.

[0041] Figure 16Another example of a heat sink constructed in accordance with the teachings of this disclosure is shown.

[0042] Figure 17 Another example of a heat sink constructed in accordance with the teachings of this disclosure is shown. Detailed Implementation

[0043] One problem with the aforementioned technology is that spring-loaded heat sinks (such as spring-loaded heat sink 200) introduce forces and therefore mechanical stresses into the electronic package, and at least in Figure 2 and Figure 3 In this technical case, a PCB 208 is introduced, along with the solder balls that connect the FCBGA 204 to the PCB 208. In some cases, a backplate needs to be mounted on the rear side of the PCB 208 to reinforce the area and reduce mechanical stress on the solder balls, FCBGA 204, and PCB 208. However, even when the backplate is mounted on the rear side of the PCB 208, the solder balls will eventually begin to crack in response to the mechanical stress introduced by the spring-loaded heatsink 200. Over time, these cracks will cause the solder joint between the FCBGA 204 and the PCB 208 to fail.

[0044] Another problem with the aforementioned technologies (and other similar technologies) stems from the fact that exposed dies (such as...) Figure 5 The dies 212 and 500 shown (which are similar to die 212) are not flat. In fact, the inventors of this application have discovered that dies (such as die 212 and die 500) have a convex shape, such as... Figure 6 As shown (for illustrative purposes, the convex nature of die 500 is exaggerated). The inventors theoretically believe that this is a result of the soldering process of soldering FCBGA 204 to PCB 208 and FCBGA 600, including die 212, to PCB (not shown), because die 500 and die 500 (each made of, for example, silicone) have different coefficients of thermal expansion than the rest of FCBGA 204 and FCBGA 600 (each made of, for example, FR4). As a result, during this soldering process, die 212 and die 500 tend to shrink less than the rest of FCBGA 204 and FCBGA 600, respectively, thus causing die 212 and 500 to exhibit this convex shape.

[0045] Due to the convex shape of dies 212 and 500, the internal hot spots of dies 212 and 500 tend not to be centrally (or uniformly) distributed on dies 212 and 500. In many cases, the internal hot spots of dies 212 and 500 will be offset from the center portions of dies 212 and 500, respectively. For example, as... Figure 7As shown, the die 500 has four internal hot spots 700, each of which is offset from the central portion 704 of the die 500. However, it should be understood that the distribution of the internal points may vary depending on, for example, the die's topology, shape, size, or material.

[0046] Meanwhile, the spring-loaded radiator 200 and other conventional heat sinks (or cooling plates) are typically designed to have thermal contact with the central portion of the die 212 (or die 500), which was previously understood to be ideal for heat dissipation. Therefore, when the internal hot spots of the die are not centered within the die, the spring-loaded radiator 200 and other conventional heat sinks, while effective in heat dissipation, are not optimally designed and installed to achieve optimal heat dissipation.

[0047] This disclosure aims to address these and other problems of conventional techniques by providing a heat sink specifically designed based on the internal hot spots of the die, and thermally coupling the heat sink to the die at or via certain target contact locations on the die that are associated with (and therefore likely to generate the most heat) the internal hot spots. Subsequently, by thermally coupling the heat sink at or near the points likely to generate the most heat, the heat sink dissipates the heat generated by the die in a more efficient manner than spring-loaded radiators 200 and other conventional heat sinks.

[0048] Figure 8 This is a schematic diagram of an example of a method 800 for manufacturing an electronic component including a heat sink constructed according to the teachings of this disclosure. Consequently, the electronic component (and heat sink) manufactured according to method 800 provides improved thermal performance compared to conventional electronic components (and conventional heat sinks). Method 800 is performed in the order shown and described herein, but may be implemented in any number of different orders or according to any number of different orders. In other examples, method or process 800 may include additional, fewer, or different actions.

[0049] Method 800 includes the action of obtaining a heat-generating component (action 804). In this example, the heat-generating component is typically in the form of an exposed die of an electronic package, such as die 500 of the aforementioned FCBGA 600, which is then soldered to a PCB (e.g., PCB 208) via solder balls. However, in other examples, the electronic package may take the form of a different type of integrated circuit package (e.g., organic lead grid array, lead array box, lead grid array, or ceramic lead grid array) and / or the integrated circuit package may be mounted to the PCB using methods other than soldering. In these or other examples, the heat-generating component may alternatively take the form of a resistor, a cap (e.g., a plastic cap, a metal cap), or another component of the electronic package that generates heat.

[0050] In some examples, obtaining a heat-generating component may include manufacturing the heat-generating component (or more generally, an electronic package) using conventional manufacturing techniques and / or additive manufacturing techniques. In other examples, obtaining a heat-generating component may include retrieving a heat-generating component that has already been manufactured (or more generally, a manufactured electronic device package).

[0051] Method 800 also includes the action of identifying internal hot spots of the heat-generating component (action 808). Hot spots are typically found where a large amount of power is generated in a small volume. In this example, because the heat-generating component is in the form of a die, the action includes identifying internal hot spots of the die. In some examples, internal hot spots of the die can be identified using a thermal image of the die generated using a thermal imager. In some examples, internal hot spots of the die can be identified using documentation about the die provided by the die's supplier. In other examples, internal hot spots of the die can be identified using simulation of the operation of the die (and more generally, electronic packages). It will also be understood that internal hot spots of the die can be identified using two or more of these methods (and / or via one or more other methods).

[0052] Method 800 also includes the action of defining target contact locations of the heat-generating component (in this example, a die), which are associated with identified internal hot spots (action 812) and correspond to the desired locations where the heat-generating component is in thermal contact with the heat sink for optimal heat dissipation. More specifically, defining the target contact locations of the die typically includes defining the location and number (or quantity) of the target contact locations. In some examples, the number of defined target contact locations will be equal to the number of identified internal hot spots. However, in other examples, the number of defined target contact locations will be less than or greater than the number of identified internal hot spots. In some examples, some or all of the target contact locations will be located at the exact same location as some or all of the identified internal hot spots. In other examples, some (or all) of the target contact locations will be spaced apart from the identified internal hot spots. In these other examples, the target contact locations may be adjacent to the identified internal hot spots. For example, one of the defined target contact locations may be located between two adjacent or opposing internal hot spots of the die.

[0053] Method 800 typically also includes the action of obtaining a heat sink based on defined target contact locations of the heat-generating component (in this example, a die) (action 816). More specifically, the action of obtaining a heat sink includes obtaining a heat sink having a size and shape such that certain portions of the heat sink are arranged to be thermally coupled to (i.e., in thermal contact with) the defined target contact locations of the die, while other portions of the heat sink are spaced apart from the die in a manner that forms an internal cavity between the heat sink and the die. In some examples, two target contact locations will be defined, in which case the heat sink will have a shape such that a first portion of the heat sink is arranged to be thermally coupled to a first target contact location of the die, and a second portion of the heat sink is arranged to be thermally coupled to a second target contact location of the die.

[0054] Preferably, obtaining the heat sink involves designing the heat sink based on the defined target contact locations, and subsequently manufacturing the designed heat sink. In other words, the heat sink can be custom-designed based on defined target contact locations and then manufactured. In some examples, 3D modeling software (e.g., computer-aided design or CAD software) can be used to design the desired heat sink. Once the desired heat sink is designed, it can be manufactured using conventional manufacturing techniques and / or additive manufacturing techniques.

[0055] Conventional manufacturing techniques may include techniques such as casting, milling, forging, machining, and stamping. Figures 9A to 9C An example is shown of a mold 900 (and a frame 904 coupled to the mold 900 and a frame 908 for the heat sink 912) that can be customized (e.g., using 3D modeling software) and subsequently used to manufacture the desired heat sink 912. Meanwhile, additive manufacturing technology can be any additive manufacturing technique or process that constructs a three-dimensional object by adding successive layers of material onto a material. Additive manufacturing technology typically involves or uses computers, 3D modeling software (e.g., computer-aided design or CAD software), machinery, and layered materials. Once a CAD model is generated, machinery can read data from the CAD file and layers, or add successive layers of liquid, powder, or sheet material (e.g.) in a layer-by-layer manner to manufacture the three-dimensional object. Additive manufacturing technology can include any of several techniques or processes, such as, for example, fused deposition modeling (“FDM”) processes, multi-jet modeling (“MJM”) processes, and selective laser sintering (“SLS”) processes. In some embodiments, additive manufacturing processes may include directed energy laser deposition processes. This directed energy laser deposition process can be performed by a multi-axis computer numerical control (“CNC”) lathe with directed energy laser deposition capabilities.

[0056] Finally, method 800 includes the action of mounting the obtained heat sink to the die (action 820). Preferably, the heat sink is mounted to the die by positioning the heat sink in a desired location relative to the die and subsequently holding the heat sink in that desired location. The heat sink can be positioned and held in the desired location using any technique discussed, for example, in U.S. Patent No. 11,114,361, which is incorporated herein by reference in its entirety. For example, the heat sink can be ideally positioned and held in that location using a magnetic assembly comprising two or more magnets, a single magnet, a single weight, one or more weights, one or more springs, or combinations thereof. However, in other examples, the heat sink may be glued to the die or mounted to the die in a different manner. In any case, the heat sink is mounted to the die such that a specific portion of the heat sink is thermally coupled to the die via a target contact location on or near an internal hot spot of the die. The heat sink is then optimally positioned to dissipate heat generated by the die (and more specifically, heat generated by internal hot spots of the die). In addition, because the heat sink makes thermal contact with multiple parts of the die, the pressure applied to the die by the heat sink is distributed over a large surface area, thereby reducing any localized stress at and on the die.

[0057] Simultaneously, a heat sink is installed, with other portions of the heat sink spaced apart from the die, thus forming the internal cavity briefly discussed above. This internal cavity allows excess thermal interface material, for example, applied to the die, to move freely within the cavity toward locations where thermal interface material is needed and / or away from locations where it is not needed (e.g., the portion of the heat sink in thermal contact with the die at the target contact point), thereby optimizing the distribution of thermal interface material along the die.

[0058] In some examples, method 800 may also include the action of obtaining a PCB (e.g., PCB 204). In one example, obtaining a PCB may include manufacturing the PCB, but in another example, obtaining a PCB may include retrieving a PCB that has already been manufactured. The PCB is preferably in the form of a 136 circuit board, which includes or is formed from any number of electronic components known in the art. However, in other examples, the PCB may take the form of a different circuit board. In some examples, method 800 may also include the action of mounting an electronic device package (which includes a die) to the PCB. In one example, the electronic package is mounted to the PCB by soldering (e.g., using a surface mount soldering process, a wave soldering process, or any other known soldering process).

[0059] In some examples, method 800 may also include measuring the shape of the heating element. When the heating element is a die, the measurement includes measuring the convexity of the die. In some examples, method 800 also includes generating a three-dimensional model of the heating element, which represents the measured shape of the heating element. In some examples, actions defining target contact locations and / or actions obtaining a heat sink may be based on the generated three-dimensional model. In one example, the three-dimensional model may be used to define tangents at each target contact location, and the heat sink may be designed based on those tangential surfaces. For example, when defining two target contact locations, the heat sink may be designed such that a first portion of the heat sink is in tangential contact with a first target contact location, and a second surface of the heat sink is in tangential contact with a second target contact location.

[0060] In some examples, method 800 may further include applying a thermal interface material (e.g., thermally conductive grease) to the heating element before mounting the heat sink to the heating element. Subsequently, when the heat sink is mounted to the heating element, the thermal interface material is disposed between the heating element and the heat sink. Preferably, the thermal interface material is applied such that at least some of the thermal interface material is located at or near the target contact location of the die.

[0061] In some examples, method 800 may further include modifying some or all of the designed surfaces of the heat sink before mounting it to the heat-generating component to enhance the thermal connection between the heat sink and the heat-generating component. For example, some or all of the designed surfaces of the heat sink may be modified by brushing or polishing some or all of the surfaces, trimming some or all of the surfaces, structuring (e.g., laser structuring) some or all of the surfaces, or a combination thereof.

[0062] It should be understood that any one or more of the aforementioned actions of method 800 may be performed partially or completely by controller 850. Controller 850 may, for example, cause a thermal imager to perform a thermal scan of the die, generate a thermal image from the scan, and use the generated thermal image to identify internal hot spots on the die. Alternatively, controller 850 may define target contact locations on the die based on the identified internal hot spots. Furthermore, controller 850 may design a heat sink to be manufactured and / or facilitate the manufacture of the heat sink.

[0063] The method 800 described herein can be used to provide heat sinks of all shapes and sizes to optimally dissipate heat generated by dies (or other heat-generating components) of different shapes and sizes. Generally, the provided heat sink will have one or more portions that are particularly matched to the shape and size of the die. More specifically, the provided heat sink will have a body comprising a top side and a bottom side, the top side being arranged facing away from the die, and the bottom side being arranged facing the die and comprising two or more portions shaped and adapted to be thermally coupled to two or more defined target contact locations on the die, respectively. In some examples, the bottom side of the provided heat sink may be at least partially defined by a plurality of edges and a central portion recessed relative to the plurality of edges. In some examples, the bottom side of the provided heat sink may be partially flat, while in other examples, the bottom side of the provided heat sink may be fully curved. In some examples, the bottom side of the provided heat sink may be at least partially defined by one or more angular surfaces that are not parallel to the PCB and / or not parallel to the top surface of the die. In some examples, the bottom side of the provided heat sink may be at least partially defined by two or more angular surfaces. In one example, two or more angular surfaces are not coplanar with each other. In another example, some or all of the angular surfaces may contact the die at different target contact locations. In other words, some or all of the angular surfaces may carry one or more portions of a portion shaped and adapted for thermal coupling to the defined target contact location. In this example, one or more internal cavities may be formed between different target contact locations by gaps where the surfaces do not contact the top surface of the die.

[0064] Figures 10A to 10D An example of a portion of an electronic component 1000 produced using method 800 (or a different method constructed according to the teachings of this disclosure) is shown. The electronic component 1000 typically includes an exposed silicon die 1004 and a heat sink 1008 designed to be thermally coupled to the die 1000 and to optimally dissipate heat generated by the die. Although not shown herein, it should be understood that the exposed die 1004 is part of an electronic package, such as a flip-chip ball grid array, which is then mounted to a PCB. Therefore, it should be understood that... Figures 10A to 10D Only a portion of the heat sink 1008 is shown, which is typically larger than the exposed silicon die 1004 (and sometimes significantly larger).

[0065] like Figure 10AAs shown, the exposed die 1004 has four peripheral edges 1010 and four internal hot spots 1012 within those peripheral edges 1010, each internal hot spot offset from the center portion 1016 of the die 1004. The four internal hot spots 1012 can be identified, for example, using a thermal map of the die 1008 or documentation provided by the supplier regarding the die 1004. Based on the internal hot spots 1012, two target contact locations 1020A and 1020B are defined. The two target contact locations 1020A and 1020B are also offset from the center portion 1016 of the die 1004, wherein the first target contact location 1020A is generally located between the two upper internal hot spots 1012, and the second target contact location 1020B is generally located between the two lower internal hot spots 1012. Thus, the first target contact location 1020A is associated with the two upper internal hot spots 1012, and the second target contact location 1020B is associated with the two lower internal hot spots 1012.

[0066] The heat sink 1008 is specifically designed based on the target contact positions 1020A and 1020B defined by the die 1004. More specifically, the heat sink 1008 is specifically designed (e.g., shape and size) such that when the heat sink 1008 is mounted to the die 1004, the first portion 1024A and the second portion 1024B of the heat sink 1008 are respectively thermally coupled directly or via a thermal interface material 1026 disposed therebetween to the target contact positions 1020A and 1020B of the die 1008.

[0067] like Figure 10B As shown, the heat sink 1008 in this example has a body (only a portion of which is visible) and includes a first portion 1024A and a second portion 1024B. The body has a top side 1028 and a bottom side 1032 opposite to the top side 1028. The top side 1028... Figure 10B The visible portion is generally flat (if not perfectly flat). However, the bottom 1032... Figure 10B The visible portion has a generally triangular shape defined by a first edge 1036, a second edge 1040 opposite to the first edge 1036, a first angular surface 1044 extending inward from the first edge 1036, and a second angular surface 1048 extending inward from the second edge 1040 toward the first edge 1036. The second angular surface 1048 intersects the first angular surface 1044 at a central portion 1052, which is then recessed relative to the first edge 1036 and the second edge 1040.

[0068] After applying the thermal interface material 1026 to the die 1004, the heat sink 1008 is mounted onto the die 1004 such that the first edge 1036 and the second edge 1040 of the bottom side 1032 of the heat sink 1008 are substantially aligned with two edges of the edge 1010 of the die 1004, as shown below. Figure 10C As shown. Subsequently, the first portion 1024A of the heat sink 1008 is thermally coupled to the first target contact position 1020A via the thermal interface material 1026, and the second portion 1024B of the heat sink 1008 (also via the thermal interface material 1026) is thermally coupled to the second target contact position 1020B, as shown. Figure 10C and Figure 10D As shown in both examples, multiple portions of the heat sink 1008 (including a central portion 1052 located between the first portion 1024A and the second portion 1024B) are spaced apart from the die 1004. Therefore, one or more internal cavities 1056 are formed between the bottom side 1032 of the heat sink 1008 and the die 1004. In this example, three such cavities 1056 are formed: one adjacent to the first edge 1036, one adjacent to the second edge 1040, and one below the central portion 1052.

[0069] In operation, the heat sink 1008 dissipates heat generated by the die 1004. More specifically, the heat sink 1008 is optimally positioned and mounted to the die 1004 to dissipate heat generated by the internal hot spots 1012 of the die 1004. This is achieved through thermal coupling between the first portion 1024A and the second portion 1024B of the heat sink 1008 and the first target contact position 1020A and the second target contact position 1020B of the die 1004, respectively. The internal cavity 1056 facilitates optimal heat dissipation, which allows the thermal interface material 1026 to move freely within the internal cavity 1056, such that excess thermal interface material can move toward locations where thermal interface material is needed (e.g., below the central portion 1052) and / or away from locations where thermal interface material is not needed (e.g., the first portion 1024A and the second portion 1024B).

[0070] Figures 11A to 11C Another example of a portion of an electronic component 1100 produced using method 800 (or a different method constructed according to the teachings of this disclosure) is shown. The electronic component 1100 is structurally and functionally similar to the electronic component 1000, but differs in several respects.

[0071] First, unlike the exposed die 1004, the electronic assembly 1100 has an exposed die 1104 with three internal hot spots 1112. Based on those internal hot spots 1112, three target contact positions 1120A, 1120B, and 1120C are defined. Similar to target contact positions 1020A and 1020B, target contact positions 1120A, 1120B, and 1120C are offset from the center portion of the die 1104, but are aligned with the three internal hot spots 1112 respectively.

[0072] Secondly, due to the differences between internal hotspots 1012 and 1112 and their target contact locations 1020A, 1020B and 1120A, 1120B, 1120C, electronic component 1100 has a heat sink 1108 that differs from heat sink 1008. More specifically, heat sink 1108 (in...) Figure 11B and Figure 11C Only a portion of the heat sink 1108 is visible in the die 1104. The heat sink 1108 is specifically designed (e.g., shape and size) such that when the heat sink 1108 is mounted to the die 1104, the first portion 1124A, the second portion 1124B, and the third portion 1124C of the heat sink 1108 are thermally coupled to the target contact locations 1120A, 1120B, and 1120C, respectively, directly or via a thermal interface material (not shown) disposed therebetween.

[0073] Third, and for this purpose, the heat sink 1108 has a bottom side 1132, which has a different shape from the bottom side 1032 of the heat sink 1008. Figure 11B The portion of the bottom side 1132 shown is defined by a first edge 1136, a second edge 1140 opposite to the first edge 1136, a first angular surface 1144 extending inward from the first edge 1136, a second angular surface 1148 extending inward from the first angular surface 1144, and a third angular surface 1150 disposed between the second edge 1140 and the second angular surface 1148.

[0074] After applying the thermal interface material to the die 1104, the heat sink 1108 is mounted onto the die 1104 such that the first edge 1136 and the second edge 1140 of the bottom side 1132 of the heat sink 1108 are substantially aligned with two edges of the edge 1110 of the die 1104, as follows: Figure 11C As shown. Subsequently, the first portion 1124A of the heat sink 1108 is thermally coupled to the first target contact position 1120A via a thermal interface material, the second portion 1124B of the heat sink 1108 (also via a thermal interface material) is thermally coupled to the second target contact position 1120B, and the third portion 1124C of the heat sink 1108 (also via a thermal interface material) is thermally coupled to the third target contact position 1120C, as... Figure 11C As shown. Simultaneously, and similar to electronic component 1000, multiple portions of the heat sink 1108 are spaced apart from the die 1104. Therefore, one or more internal cavities are formed between the bottom side 1132 of the heat sink 1108 and the die 1104.

[0075] In operation, the heat sink 1108 dissipates heat generated by the die 1104. More specifically, the heat sink 1108 is optimally positioned and mounted to the die 1104 to dissipate heat generated by the internal hot spots 1112 of the die 1104. This is achieved through thermal coupling between the first portion 1124A, the second portion 1124B, and the third portion 1124C of the heat sink 1108 and the first target contact positions 1120A, 1120B, and 1120C of the die 1104, respectively. The internal cavity facilitates optimal heat dissipation, allowing the thermal interface material to move freely within the internal cavity, enabling excess thermal interface material to move toward locations where thermal interface material is needed and / or away from locations where thermal interface material is not needed (e.g., the first portion 1124A, the second portion 1124B, and the third portion 1124C).

[0076] Figures 12A to 12C Another example of an electronic component 1200 produced using method 800 (or a different method constructed in accordance with the teachings of this disclosure) is provided. Electronic component 1200 is structurally and functionally similar to electronic component 1000, but differs in several respects.

[0077] First, similar to the exposed die 1004, the electronic assembly 1200 has an exposed die 1204 with four internal hotspots 1212, but the internal hotspots 1212 are located at different positions than the internal hotspots 1012 of the exposed die 1004. Based on those internal hotspots 1212, four target contact positions 1220A, 1220B, 1220C, and 1220D are defined. Like target contact positions 1020A and 1020B, target contact positions 1220A, 1220B, 1220C, and 1220D are offset from the central portion of the die 1204, but are aligned with the four internal hotspots 1212 respectively.

[0078] Secondly, due to the differences between internal hotspots 1212 and 1012 and their target contact locations 1020A, 1020B, and 1220A-1120D, electronic component 1200 has a heat sink 1208 that differs from heat sink 1008. More specifically, heat sink 1208 (in...) Figure 12B and Figure 12COnly a portion of the heat sink 1208 is visible in the die 1204. The heat sink 1208 is specifically designed (e.g., shape and size) such that when the heat sink 1208 is mounted to the die 1204, the first portion 1224A, the second portion 1224B, the third portion 1224C, and the fourth portion 1224D of the heat sink 1208 are respectively thermally coupled directly or via a thermal interface material (not shown) disposed therebetween to the target contact locations 1220A, 1220B, 1220C, and 1220D.

[0079] Third, and for this purpose, the heat sink 1208 has a bottom side 1232, which has a different shape from the bottom side 1032 of the heat sink 1008. In fact, Figure 12B The portion of the bottom side 1232 shown is defined by a first edge 1236, a second edge 1240 opposite to the first edge 1236, a third edge 1241, a fourth edge 1242 opposite to the third edge 1241, and four angled surfaces that extend inward from the four edges 1236, 1240, 1241 and 1242 and intersect at the recessed central portion 1252.

[0080] After applying the thermal interface material to the die 1204, the heat sink 1208 is mounted onto the die 1204, such that the edges 1236, 1240, 1241, and 1242 of the bottom side 1232 of the heat sink 1208 are substantially aligned with the edge 1210 of the die 1204. Figure 12C As shown. Subsequently, the first portion 1224A of the heat sink 1208 is thermally coupled to the first target contact position 1220A via a thermal interface material; the second portion 1224B of the heat sink 1208 (also via a thermal interface material) is thermally coupled to the second target contact position 1220B; the third portion 1224C of the heat sink 1208 (also via a thermal interface material) is thermally coupled to the third target contact position 1220C; and the fourth portion 1224D of the heat sink 1208 is thermally coupled to the fourth target contact position 1220D, as... Figure 12C As shown. Simultaneously, and similar to electronic component 1000, multiple portions of heat sink 1208 are spaced apart from die 1204. Therefore, one or more internal cavities are formed between the bottom side 1232 of heat sink 1208 and die 1204.

[0081] In operation, the heat sink 1208 dissipates heat generated by the die 1204. More specifically, the heat sink 1208 is optimally positioned and mounted to the die 1204 to dissipate heat generated by internal hot spots 1212 of the die 1204. This is achieved through thermal coupling between the first portion 1224A, the second portion 1224B, the third portion 1224C, and the fourth portion 1224D of the heat sink 1208 and the first target contact positions 1220A, 1220B, 1220C, and 1220D of the die 1204, respectively. The internal cavity facilitates optimal heat dissipation, allowing the thermal interface material to move freely within the internal cavity, enabling excess thermal interface material to move toward locations where thermal interface material is needed and / or away from locations where thermal interface material is not needed (e.g., the first portion 1224A, the second portion 1224B, the third portion 1224C, and the fourth portion 1224D).

[0082] Figures 13A to 13C Another example of an electronic component 1300 produced using method 800 (or a different method constructed in accordance with the teachings of this disclosure) is provided. Electronic component 1300 is structurally and functionally similar to electronic component 1000, but differs in several respects.

[0083] First, unlike the exposed die 1004, the electronic assembly 1300 has an exposed die 1304 with two internal hot spots 1312. Based on those internal hot spots 1312, two target contact locations 1320A and 1320B are defined. Like target contact locations 1020A and 1020B, target contact locations 1320A and 1320B are offset from the center portion of the die 1304, but target contact locations 1320A and 1320B are aligned with the two internal hot spots 1312, respectively.

[0084] Secondly, due to the differences between internal hotspots 1312 and 1012 and their target contact locations 1020A, 1020B, as well as between 1320A and 1320B, electronic component 1300 has a heat sink 1308 that differs from heat sink 1008. More specifically, heat sink 1308 (in...) Figure 13B and Figure 13C Only a portion of it is visible. It is specially designed (e.g., shape and size) so that when the heat sink 1308 is mounted to the die 1304, the first portion 1324A and the second portion 1324B of the heat sink 1308 are thermally coupled to the target contact locations 1320A and 1320B, respectively, directly or via a thermal interface material (not shown) disposed therebetween.

[0085] Third, and for this purpose, the heat sink 1308 has a bottom side 1332, which has a different shape from the bottom side 1032 of the heat sink 1008. Figure 13B The portion of the bottom side 1332 shown is defined by a first edge 1336, a second edge 1340 opposite to the first edge 1336, a third edge 1341, a fourth edge 1342 opposite to the third edge 1341, two flat surfaces, and two angled surfaces extending inward from the two flat surfaces and intersecting at the central portion 1352.

[0086] After applying the thermal interface material to the die 1304, the heat sink 1308 is mounted onto the die 1304, such that the edges 1336, 1340, 1341, and 1342 of the bottom side 1332 of the heat sink 1308 are substantially aligned with the edge 1310 of the die 1304. Figure 13C As shown. Subsequently, a first portion 1324A of the heat sink 1308 is thermally coupled to a first target contact position 1320A via a thermal interface material, and a second portion 1324B of the heat sink 1308 (also via a thermal interface material) is thermally coupled to a second target contact position 1320B. Simultaneously, and similar to the electronic component 1000, multiple portions of the heat sink 1308 are spaced apart from the die 1304. Therefore, one or more internal cavities are formed between the bottom side 1332 of the heat sink 1308 and the die 1304.

[0087] In operation, the heat sink 1308 dissipates heat generated by the die 1304. More specifically, the heat sink 1308 is optimally positioned and mounted to the die 1304 to dissipate heat generated by the internal hot spots 1312 of the die 1304. This is achieved through thermal coupling between the first portion 1324A and the second portion 1324B of the heat sink 1308 and the first target contact position 1320A and the second target contact position 1320D of the die 1304, respectively. The internal cavity facilitates optimal heat dissipation, allowing the thermal interface material to move freely within the internal cavity, enabling excess thermal interface material to move toward and / or away from locations where thermal interface material is needed.

[0088] Figures 14A to 14C and Figures 15A to 15CVarious portions of other examples of electronic components 1400 and 1500 produced using method 800 (or different methods constructed according to the teachings of this disclosure) are shown respectively. Electronic components 1400 and 1500 are structurally similar to electronic component 1000. However, because electronic components 1400 and 1500 have exposed dies 1404 and 1504 respectively, which have different internal hot spots, electronic components 1400 and 1500 have different target contact locations 1420 and 1520 respectively, and different heat sinks 1408 and 1508 respectively, which are designed to be thermally coupled to those different target contact locations 1420 and 1520 respectively. However, despite these differences, heat sinks 1408 and 1508 (in...) Figure 14B , Figure 14C and Figure 15B , Figure 15C (Only a portion of it is visible) dissipates the heat generated by the 1404 and 1504 dies in a similar manner to the other heat sinks mentioned above.

[0089] Figure 16 An example of a portion of a heat sink 1608 is shown, which can be used in any electronic component described herein (or other electronic components constructed in accordance with the teachings of this disclosure). Heat sink 1608 is similar to heat sink 1408, but heat sink 1608 has... Figure 16 The visible portion also includes one or more flow channels formed in the bottom side 1632 of the heat sink 1608. In this example, the heat sink 1608 includes a plurality of flow channels 1660 formed in the bottom side 1632 of the heat sink 1608. The plurality of flow channels 1660 are formed in the angled surface of the bottom side 1632 of the heat sink 1608, but in other examples, the plurality of flow channels 1660 may be formed in different ways. In any case, the plurality of flow channels 1660 helps to facilitate the movement of thermal interface material between the heat sink 1608 and the heat-generating component to which the heat sink 1608 is mounted.

[0090] Figure 17 Another example of a portion of heat sink 1708 is shown, which can be used in any electronic component described herein (or other electronic components constructed in accordance with the teachings of this disclosure). Heat sink 1708 is similar to heat sink 1408, but heat sink 1708 has... Figure 17The visible portion includes one or more portions made of a material different from the rest of the heat sink 1708. In this example, the heat sink 1708 includes four portions 1724 made of a second material different from the first material used to make the rest of the heat sink 1708, and these four portions 1724 are portions of the heat sink 1708 configured to be thermally coupled to four target contact locations of the heat-generating component to which the heat sink 1708 is mounted. In this example, the second material has a greater surface roughness than the first material, such that the four portions 1724 are rougher than the rest of the heat sink 1708, which facilitates better heat dissipation from the four target contact locations to which they are thermally coupled. However, in other examples, the second material may have a smaller surface roughness than the first material.

[0091] The heat sink described herein is preferably made of a sheet of metal with high thermal conductivity, such as, for example, copper, steel, nickel, tin, or a metal alloy. In some cases, the heat sink described herein may be brushed or polished. In some cases, the heat sink described herein may be partially or completely surface-treated with a surface material (e.g., gold, nickel, or tin) that is compatible with the metallic material of the rest of the heat sink, is solderable, and is also thermally conductive. For example, the heat sink may be made of copper, and as discussed above, part or all of the heat sink may be polished with nickel and gold plates. And in some cases, the heat sink described herein may be partially or entirely constructed (e.g., laser-constructed) or subjected to another type of post-manufacturing process.

[0092] It will also be understood that the electronic components described herein typically include heat sinks (e.g., spring-loaded heat sinks). The heat sink is thermally coupled to a corresponding heat sink plate to facilitate the dissipation of heat generated by a heat-generating component (e.g., a die) and transferred to the heat sink plate. In some examples, the heat sink is thermally coupled to the heat sink plate via a thermally conductive material (e.g., thermal grease, thermal paste, or thermal pad) disposed between the heat sink and the heat sink plate.

[0093] This document describes preferred embodiments of the invention, including one or more best modes known to the inventors for carrying out the invention. Although many examples are shown and described herein, it will be readily understood by those skilled in the art that the details of the various embodiments need not be mutually exclusive. Rather, those skilled in the art, upon reading the teachings herein, should be able to combine one or more features of one embodiment with one or more features of the remaining embodiments. Furthermore, it should be understood that the illustrated embodiments are merely exemplary and should not be construed as limiting the scope of the invention. Unless otherwise indicated herein or otherwise clearly contradicted by the context, all methods described herein can be performed in any suitable order. The use of any and all examples or exemplary language (e.g., “such as”) provided herein is intended only to better illustrate aspects of one or more exemplary embodiments of the invention and does not constitute a limitation on the scope of the invention. No language in this specification should be construed as indicating any unclaimed element as essential to the practice of the invention.

Claims

1. A heat sink configured to be mounted on a die, the heat sink comprising: The body includes a top side and a bottom side, the top side being arranged facing away from the die, and the bottom side being arranged facing the die. The body is shaped and adapted to be mounted to the die such that a first portion of the bottom side is thermally coupled to a first target contact position of the die, a second portion of the bottom side is thermally coupled to a second target contact position of the die, and a third portion of the bottom side is spaced apart from the die, thereby allowing the heat sink to dissipate the heat generated by the die.

2. The heat sink according to claim 1, wherein the first portion and the second portion on the bottom side are offset from the central portion of the body.

3. The heat sink according to claim 1, wherein the bottom side has a fourth portion adapted to thermally couple to a third target contact position of the die.

4. The heat sink of claim 1, wherein the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.

5. The heat sink of claim 1, wherein the bottom side is defined by a first angled surface and a second angled surface, and wherein the first portion of the bottom side is located on the first angled surface, and the second portion of the bottom side is located on the second angled surface.

6. The heat sink according to claim 1, wherein the bottom side is partially flat.

7. The heat sink according to claim 1, wherein the heat sink further comprises one or more flow channels formed in the bottom side of the heat sink.

8. The electronic component of claim 1, wherein the bottom side of the heat sink includes a first surface made of a first material, and the first portion and the second portion of the heat sink are made of a second material different from the first material.

9. An electronic component, the electronic component comprising: A die having a first target contact position and a second target contact position, the first target contact position being associated with a first predetermined internal hot spot of the die, and the second target contact position being associated with a second predetermined internal hot spot of the die; A heat sink is formed and mounted to the die such that a first portion of the heat sink is thermally coupled to a first target contact position of the die, and a second portion of the heat sink is thermally coupled to a second target contact position of the die, thereby allowing the heat sink to dissipate heat generated by the die. and A thermally conductive grease material that thermally couples a first portion of the heat sink to a first target contact position of the die and a second portion of the heat sink to a second target contact position, wherein the thermally conductive grease material is movable between the first portion and the second portion of the heat sink.

10. The electronic component of claim 9, wherein the heat sink has a third portion disposed between the first portion and the second portion and spaced apart from the die.

11. The electronic component of claim 9, further comprising a flip-chip ball grid array (FCBGA) including the die.

12. The electronic component of claim 9, wherein the first target location is located between the first predetermined internal hot spot and the third predetermined internal hot spot.

13. The electronic assembly of claim 9, wherein the first and second portions of the heat sink are offset from the center of the die.

14. The electronic component of claim 9, wherein the die has a third target contact location associated with a third predetermined internal hot spot of the die, and wherein the heat sink is formed and mounted to the die such that a third portion of the heat sink is in thermal contact with the third target contact location.

15. The electronic component of claim 9, wherein the die has a first shape and the heat sink has a second shape different from the first shape.

16. The electronic assembly of claim 9, wherein the heat sink has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces the die, and wherein the bottom side is defined by a plurality of edges and a central portion recessed relative to the plurality of edges.

17. The electronic assembly of claim 9, wherein the heat sink has a top side and a bottom side, wherein the top side faces away from the die and the bottom side faces the die, wherein the bottom side is defined by a first angular surface and a second angular surface, and wherein the first portion of the bottom side is located on the first angular surface and the second portion of the bottom side is located on the second angular surface.

18. A method for manufacturing an electronic component, the method comprising: Obtain the die; Identify the first and second internal hot spots of the die; Define the first target contact position and the second target contact position of the die, which are respectively associated with the first internal hot spot and the second internal hot spot; A heat sink is obtained based on a defined first target contact position and a second target contact position, wherein the heat sink has a shape such that a first portion of the heat sink is thermally coupled to the first target contact position of the die, and a second portion of the heat sink is thermally coupled to the second target contact position of the die. as well as The heat sink is installed onto the die.

19. The manufacturing method according to claim 18, wherein obtaining the heat sink comprises: The heat sink is designed based on the defined first and second target contact positions. And the manufacturing of the designed heat sink.

20. The manufacturing method of claim 18, further comprising generating a thermal image of the die using a thermal imager, wherein the first internal hot spot and the second internal hot spot are identified from the generated thermal image.

Images