Method and apparatus for extracting components, method and apparatus for manufacturing electronic components

The method and apparatus use suction and peripheral engagement to safely extract and transport small electronic components, addressing damage and positioning issues in existing technologies.

JP7887266B2Active Publication Date: 2026-07-09TDK CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TDK CORP
Filing Date
2022-03-22
Publication Date
2026-07-09

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Abstract

To provide a method of taking out a component from a manufacturing device or the like without causing damage or the like to the component, and a device.SOLUTION: An air-core coil 810 wound around a core rod 710 by a winding device or the like is adsorbed by an adsorption nozzle 210, projections 140, 140 and contact surfaces 142, 142 of columnar parts 101a, 101b of a hand part 100 are brought into contact with the air-core coil 810 from a proximal end side of the core rod 710, and the hand part 100 is moved to a distal end side of the core rod 710, so that the air-core coil 810 is separated from the core rod 710.SELECTED DRAWING: Figure 11
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