Packaging chip top detection device and working method thereof

Abstract

The application belongs to the technical field of electrical elements, and particularly relates to testing in a manufacturing process, and particularly relates to a packaged chip top detection device and a working method thereof, wherein the packaged chip top detection device is provided with heat dissipation strips on the stepped surfaces corresponding to the red light array, a plurality of through holes are formed in the side walls of the heat dissipation strips, and deformation members are arranged in the through holes. The deformation members are deformed by heat to adjust the internal cross-sectional shape of the heat dissipation strips to enhance the heat dissipation effect, so that the heat dissipation effect at the position of the red light array is improved after the temperature of the red light array is increased, and the light emitting performance of the red light array is prevented from being affected by the excessively high temperature.

Description

Technical Field

[0001] This invention belongs to the field of electrical component technology, specifically relating to testing during the manufacturing process, and particularly to a top-mounted testing device for packaged chips and its operating method. Background Technology

[0002] In the field of semiconductor manufacturing and packaging inspection, BGA (Ball Grid Array), QFP (Quad Flat Package), and QFN (Quad Flat No-Leader Package) are the three most widely used chip packaging forms. The quality of the top package directly determines the electrical performance, mechanical reliability, and lifespan of the chip, thus placing stringent requirements on high-precision visual inspection of the chip's top package. The core requirement of chip top package inspection is to accurately identify scratches, dirt, cracks on the package surface, as well as morphological defects in solder balls (BGA), leads (QFP), and pads (QFN). This necessitates the use of an RGB three-color lighting system to provide uniform, stable, and adaptable light source support for different packaging materials.

[0003] RGB tri-color illumination, due to its ability to adapt to the reflective characteristics of different chip packaging materials through the brightness ratio of red, green, and blue light, has become a core component for visual inspection of chip top packages. Among them, red light has the strongest reflective contrast for metal solder balls and pads, making it the main light for BGA and QFN inspection; green light is adapted to packaging resin and silicon substrates, and can also be used for the inspection of QFP pins and packages; blue light is used to identify minute defects such as scratches and dirt. Based on this, inspection equipment usually needs to be equipped with three independent red, green, and blue light modules, and the number of LEDs in each module needs to be reasonably configured according to the inspection requirements of the three types of chips. Red light, as the main light, needs to be configured with the most LEDs to ensure detection contrast and brightness.

[0004] The electro-optical conversion efficiency of RGB LEDs varies significantly, with the heat generation of a single LED following a pattern of "blue light > green light > red light." Red light, as the primary light source, requires the most LEDs, resulting in higher overall heat generation for the red light module. Furthermore, to accommodate device layout, the three modules are typically stacked vertically, with heat sinks usually located on the top layer. This means the red light module, being the primary light source, is often located on the bottom layer, furthest from the heat sink and with the worst heat dissipation conditions, leading to heat accumulation and accelerated light decay. In addition, red LEDs have the worst heat resistance; prolonged exposure to high temperatures causes light power drift and wavelength shift, directly affecting detection contrast and accuracy. Conversely, excessively enhancing heat dissipation, such as using high-power fans, can cause the red light module temperature to drop too low, leading to temperature drift and similarly compromising detection stability.

[0005] Therefore, due to the technical problem that the red light module's light emission is affected by temperature during the detection process, thus affecting the detection stability, it is necessary to design a top-mounted detection device for the packaged chip and its working method.

[0006] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0007] This disclosure provides at least one top-mounted detection device for a packaged chip and its operating method.

[0008] In a first aspect, embodiments of this disclosure provide a top-of-package chip detection device, comprising:

[0009] A light source mechanism, and a heat dissipation mechanism disposed on the light source mechanism, the heat dissipation mechanism being configured to enhance the heat dissipation effect of the red lamp array in the light source mechanism;

[0010] The heat dissipation mechanism includes: a heat dissipation strip with an open top;

[0011] The heat dissipation strip is set on the stepped surface corresponding to the red light array;

[0012] The heat sink has several through holes on its side wall, and a deformable element is installed in each of the through holes;

[0013] The deformable component is adapted to deform under heat to adjust the internal cross-sectional shape of the heat sink to enhance the heat dissipation effect.

[0014] In one optional embodiment, the deformable element is made of shape memory metal, and adjacent deformable elements deform in opposite directions;

[0015] The deformable component protrudes into or out of the heat sink during deformation;

[0016] The deformable element is connected to the inner wall of the through hole by a flexible material to seal the through hole.

[0017] In one optional embodiment, when a portion of the deformable component bulges into the heat sink when heated, the cross-sectional shape of the heat sink changes, and the width of the heat sink at the corresponding position decreases, thereby increasing the gas flow rate at the corresponding position and enhancing the heat dissipation effect.

[0018] In one alternative implementation, the number of deformable elements protruding into the heat sink is the same as the number of deformable elements protruding out of the heat sink, so as to keep the internal space volume of the heat sink unchanged when the deformable elements deform.

[0019] In one alternative embodiment, when the deformable member protrudes outward from the heat sink and contacts the sidewall of the second step surface in the light source mechanism, if the internal temperature of the heat sink is higher than the temperature at the second step surface, heat is transferred to the second step surface; if the internal temperature of the heat sink is lower than the temperature at the second step surface, heat is absorbed from the inside of the second step surface.

[0020] In one optional embodiment, the light source mechanism includes: a mounting bracket;

[0021] The bottom surface of the mounting bracket is open;

[0022] The outer wall of the mounting frame is provided with three stepped surfaces, and the corresponding positions of the stepped surfaces on the inner wall of the mounting frame are annular mounting areas. The three annular mounting areas are provided with red light array, green light array and blue light array from bottom to top.

[0023] In one alternative implementation, the mounting bracket is connected to the housing;

[0024] A camera module is installed inside the housing, and the camera module is located above the mounting bracket.

[0025] The shooting module, red light array, green light array, and blue light array are all electrically connected to the control module;

[0026] The control module is configured to control the red light array, green light array, and blue light array to provide corresponding light sources according to the required chip package form, and to control the imaging module to capture images to detect the chip package based on the images.

[0027] In one optional embodiment, the sidewall of the housing is provided with a plurality of heat dissipation holes;

[0028] A fan electrically connected to the control module is installed inside the housing;

[0029] The fan is located in the space above the mounting bracket inside the housing;

[0030] The control module is configured to control the fan to operate for heat dissipation.

[0031] Secondly, this disclosure also provides a method for operating the above-described packaged chip top detection device, comprising:

[0032] The deformable component deforms under heat to adjust the internal cross-sectional shape of the heat sink to enhance the heat dissipation effect;

[0033] When some deformable parts bulge into the heat sink when heated, the cross-sectional shape of the heat sink changes and the width of the heat sink at the corresponding position decreases, thereby increasing the gas flow rate at the corresponding position and enhancing the heat dissipation effect.

[0034] When the deformable part protrudes outward from the heat sink and contacts the side wall of the second step surface in the light source mechanism, if the internal temperature of the heat sink is higher than the temperature at the second step surface, the heat is transferred to the second step surface; if the internal temperature of the heat sink is lower than the temperature at the second step surface, the heat is absorbed from the inside of the second step surface.

[0035] In one optional implementation, the control module controls the red light array, green light array, and blue light array to provide corresponding light sources according to the required chip package form, and controls the imaging module to capture images to detect the chip package based on the images.

[0036] The beneficial effect of this invention is that the top detection device of the packaged chip sets a heat sink on the stepped surface corresponding to the red light array. Several through holes are opened on the side wall of the heat sink, and a deformable element is set in the through hole. The deformable element deforms when heated to adjust the internal cross-sectional shape of the heat sink to enhance the heat dissipation effect. In this way, the heat dissipation effect at the red light array is improved after the temperature rises, and the light emission performance of the red light array is not affected by the excessive temperature.

[0037] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0038] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0039] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of a heat dissipation mechanism provided in an embodiment of the present disclosure;

[0041] Figure 2 This is a schematic diagram of a light source mechanism provided in an embodiment of the present disclosure;

[0042] Figure 3 This is a schematic diagram of the structure of a top detection device for a packaged chip provided in an embodiment of this disclosure.

[0043] In the picture:

[0044] Light source mechanism 1, mounting bracket 11, stepped surface 12, annular mounting area 13, red light array 14, green light array 15, blue light array 16;

[0045] 2. Heat dissipation mechanism; 21. Heat dissipation strip; 22. Through hole; 23. Deformable part; 24. Flexible material;

[0046] 3. Outer shell, 31. Heat dissipation holes. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0049] The electro-optical conversion efficiency of RGB LEDs varies significantly, with the heat generation of a single LED following a pattern of "blue light > green light > red light." Red light, as the primary light source, requires the most LEDs, resulting in higher overall heat generation for the red light module. Furthermore, to accommodate device layout, the three modules are typically arranged vertically in a stacked configuration, with heat sinks usually placed on the top layer. This means the red light module, as the primary light source, is often located on the bottom layer, furthest from the heat sink and with the worst heat dissipation conditions, making it prone to heat accumulation and accelerated light decay. In addition, red LEDs have the worst heat resistance; prolonged exposure to high temperatures can cause light power drift and wavelength shift, directly affecting detection contrast and accuracy. Conversely, excessively enhanced heat dissipation can lead to excessively low temperatures in the red light module, causing temperature drift and similarly compromising detection stability.

[0050] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0051] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0052] like Figure 1As shown, at least one disclosed embodiment provides a top detection device for a packaged chip, including: a light source mechanism 1, and a heat dissipation mechanism 2 disposed on the light source mechanism 1. The heat dissipation mechanism 2 is configured to enhance the heat dissipation effect of the red light array 14 in the light source mechanism 1. The heat dissipation mechanism 2 includes: a heat dissipation strip 21 with an open top; the heat dissipation strip 21 is disposed on the stepped surface 12 corresponding to the red light array 14; a plurality of through holes 22 are formed on the side wall of the heat dissipation strip 21, and a deformable element 23 is disposed in the through hole 22; the deformable element 23 is adapted to deform under heat to adjust the internal cross-sectional shape of the heat dissipation strip 21 to enhance the heat dissipation effect, thereby improving the heat dissipation effect at the position after the temperature of the red light array 14 rises, and avoiding the red light array 14 from affecting the light emission performance due to excessive temperature.

[0053] like Figure 2 As shown, in an optional embodiment, the light source mechanism 1 includes: a mounting frame 11; the bottom surface of the mounting frame 11 is open; the outer wall of the mounting frame 11 is provided with three stepped surfaces 12, and the corresponding position of the stepped surfaces 12 on the inner wall of the mounting frame 11 is an annular mounting area 13, and the three annular mounting areas 13 are arranged from bottom to top as a red light array 14, a green light array 15 and a blue light array 16.

[0054] In this embodiment, the red light array 14, green light array 15, and blue light array 16 are fixedly installed by the mounting bracket 11.

[0055] In this embodiment, the annular mounting area 13 can be a slope, so that the light emitted by the red light array 14, green light array 15 and blue light array 16 can illuminate the required detection chip package.

[0056] In one optional embodiment, the mounting bracket 11 is connected to the housing 3; a camera module is disposed inside the housing 3, the camera module is located above the mounting bracket 11, and the camera module is obscured by the housing 3 and is therefore not shown in the figure; the camera module, the red light array 14, the green light array 15, and the blue light array 16 are all electrically connected to the control module; the control module is configured to control the red light array 14, the green light array 15, and the blue light array 16 to provide corresponding light sources according to the required chip package form, and to control the camera module to capture images to detect the chip package based on the images.

[0057] like Figure 3 As shown, in one optional embodiment, the side wall of the housing 3 is provided with a plurality of heat dissipation holes 31; a fan electrically connected to the control module is provided inside the housing 3, and the fan is covered by the housing 3 and is therefore not shown in the figure; the fan is located in the space above the mounting bracket 11 inside the housing 3; the control module is configured to control the fan to work for heat dissipation.

[0058] In this embodiment, airflow is generated by a fan to facilitate heat dissipation.

[0059] like Figure 1 As shown, in one optional embodiment, the deformable element 23 is made of shape memory metal, and adjacent deformable elements 23 deform in opposite directions; the deformable element 23 protrudes into or out of the heat sink 21 when deformed; the deformable element 23 is connected to the inner wall of the through hole 22 by a flexible material 24 to seal the through hole 22.

[0060] In this embodiment, the flexible material 24 can be rubber or the like.

[0061] In this embodiment, the shape memory metal material used in the deformable component 23 can be a Ti-Ni shape memory metal spring with a customized phase transition temperature of 40 degrees Celsius.

[0062] In one optional embodiment, when a portion of the deformable part 23 protrudes into the heat dissipation strip 21 due to heat, the internal cross-sectional shape of the heat dissipation strip 21 changes, and the internal width of the heat dissipation strip 21 at the corresponding position decreases, thereby increasing the gas flow rate at the corresponding position and enhancing the heat dissipation effect.

[0063] In this embodiment, when the temperature at the red light array 14 reaches the deformation temperature of the deformable element 23, the deformable element 23 begins to deform. The deformable element 23 protruding inside the heat sink 21 will change the cross-sectional shape inside the heat sink 21, that is, the width inside the heat sink 21 at the corresponding position will decrease, and the airflow velocity at this position will increase to improve the heat dissipation effect. Meanwhile, the outward protruding deformable element 23 can ensure that the volume of the internal space of the heat sink 21 remains unchanged, thus ensuring the heat dissipation effect.

[0064] In one alternative embodiment, the number of deformable members 23 protruding into the heat sink 21 is the same as the number of deformable members 23 protruding out of the heat sink 21, so as to keep the internal space volume of the heat sink 21 unchanged when the deformable members 23 deform.

[0065] In one alternative embodiment, when the deformable member 23 protrudes outward from the heat sink 21 and contacts the side wall of the second step surface 12 in the light source mechanism 1, if the internal temperature of the heat sink 21 is higher than the temperature at the second step surface 12, heat is transferred to the second step surface 12; if the internal temperature of the heat sink 21 is lower than the temperature at the second step surface 12, heat is absorbed from the inside of the second step surface 12.

[0066] In this embodiment, when the outwardly protruding deformable member 23 contacts the side wall of the second step surface 12, if the internal temperature of the heat dissipation strip 21 is higher than the temperature at the second step surface 12, the heat is transferred to the second step surface 12, and the heat dissipation is assisted by the second step surface 12 to improve the heat dissipation effect. If the internal temperature of the heat dissipation strip 21 is lower than the temperature at the second step surface 12, the heat is absorbed from the inside of the second step surface 12, thereby improving the heat dissipation effect at the location of the second step surface 12.

[0067] At least one other disclosed embodiment also provides a method of operating the above-described packaged chip top detection device, comprising: deforming the deformable element 23 by heating to adjust the internal cross-sectional shape of the heat sink 21 to enhance the heat dissipation effect; when a portion of the deformable element 23 protrudes into the heat sink 21 by heating, the internal cross-sectional shape of the heat sink 21 changes, and the internal width of the heat sink 21 at the corresponding position decreases, so as to increase the gas flow rate at the corresponding position and enhance the heat dissipation effect; when the deformable element 23 protrudes outward from the heat sink 21 and contacts the side wall of the second step surface 12 in the light source mechanism 1, if the internal temperature of the heat sink 21 is higher than the temperature at the second step surface 12, heat is transferred to the second step surface 12; if the internal temperature of the heat sink 21 is lower than the temperature at the second step surface 12, heat is absorbed from the inside of the second step surface 12.

[0068] In one alternative implementation, the control module controls the red light array 14, green light array 15 and blue light array 16 to provide corresponding light sources according to the required chip package form, and controls the imaging module to capture images to detect the chip package based on the images.

[0069] In summary, the top detection device of this packaged chip provides a heat sink 21 on the stepped surface 12 corresponding to the red light array 14. Several through holes 22 are provided on the side wall of the heat sink 21, and a deformable element 23 is provided in the through hole 22. The deformable element 23 deforms when heated to adjust the internal cross-sectional shape of the heat sink 21 to enhance the heat dissipation effect. This improves the heat dissipation effect at the location of the red light array 14 after the temperature rises, and avoids the red light array 14 from affecting the light emission performance due to excessive temperature.

[0070] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0071] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0072] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0073] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A top-mounted detection device for a packaged chip, characterized in that, include: A light source mechanism (1) and a heat dissipation mechanism (2) disposed on the light source mechanism (1), the heat dissipation mechanism (2) being configured to enhance the heat dissipation effect of the red lamp array (14) in the light source mechanism (1); The heat dissipation mechanism (2) includes: a heat dissipation strip (21) with an open top; The heat dissipation strip (21) is set on the step surface (12) corresponding to the red light array (14); The heat dissipation strip (21) has several through holes (22) on its side wall, and a deformable element (23) is provided in the through hole (22). The deformable element (23) is adapted to deform under heat to adjust the internal cross-sectional shape of the heat dissipation strip (21) to enhance the heat dissipation effect; The deformable element (23) is made of shape memory metal, and the deformation directions of adjacent deformable elements (23) are opposite. The deformable part (23) protrudes into or out of the heat sink (21) when deformed; The deformable element (23) is connected to the inner wall of the through hole (22) by a flexible material (24) to seal the through hole (22); When the deformable part (23) is heated and protrudes into the heat dissipation strip (21), the cross-sectional shape of the heat dissipation strip (21) changes, and the width of the heat dissipation strip (21) at the corresponding position decreases, so as to increase the gas flow rate at the corresponding position and enhance the heat dissipation effect.

2. The chip top detection device as described in claim 1, characterized in that: The number of deformable parts (23) protruding into the heat sink (21) is the same as the number of deformable parts (23) protruding out of the heat sink (21) so as to keep the internal space volume of the heat sink (21) unchanged when the deformable parts (23) deform.

3. The chip top detection device as described in claim 1, characterized in that: When the deformable part (23) protrudes outward from the heat sink (21) and contacts the side wall of the second step surface (12) in the light source mechanism (1), if the internal temperature of the heat sink (21) is higher than the temperature at the second step surface (12), the heat is transferred to the second step surface (12). If the internal temperature of the heat sink (21) is lower than the temperature at the second step surface (12), the heat inside the second step surface (12) is absorbed.

4. The chip top detection device as described in claim 1, characterized in that: The light source mechanism (1) includes: a mounting bracket (11); The bottom surface of the mounting bracket (11) is open; The outer wall of the mounting frame (11) is provided with three stepped surfaces (12). The corresponding position of the stepped surfaces (12) on the inner wall of the mounting frame (11) is a ring-shaped mounting area (13). The three ring-shaped mounting areas (13) are provided with a red light array (14), a green light array (15) and a blue light array (16) from bottom to top.

5. The chip top detection device as described in claim 4, characterized in that: The mounting bracket (11) is connected to the outer casing (3); A camera module is provided inside the outer casing (3), and the camera module is located above the mounting bracket (11); The shooting module, red light array (14), green light array (15) and blue light array (16) are all electrically connected to the control module; The control module is configured to control the red light array (14), green light array (15) and blue light array (16) to provide corresponding light sources according to the required chip package form, and to control the imaging module to capture images to detect the chip package based on the images.

6. The chip top detection device as described in claim 5, characterized in that: The outer casing (3) has several heat dissipation holes (31) on its side wall. A fan electrically connected to the control module is provided inside the outer casing (3); The fan is located in the space above the mounting bracket (11) inside the housing (3); The control module is configured to control the fan to operate for heat dissipation.

7. A method for operating the top detection device of the packaged chip as described in claim 1, characterized in that, include: The deformable part (23) deforms under heat to adjust the internal cross-sectional shape of the heat dissipation strip (21) to enhance the heat dissipation effect; When the deformable part (23) is heated and protrudes into the heat dissipation strip (21), the cross-sectional shape of the heat dissipation strip (21) changes, and the width of the heat dissipation strip (21) at the corresponding position decreases, so as to increase the gas flow rate at the corresponding position and enhance the heat dissipation effect. When the deformable part (23) protrudes outward from the heat sink (21) and contacts the side wall of the second step surface (12) in the light source mechanism (1), if the internal temperature of the heat sink (21) is higher than the temperature at the second step surface (12), the heat is transferred to the second step surface (12). If the internal temperature of the heat sink (21) is lower than the temperature at the second step surface (12), the heat inside the second step surface (12) is absorbed.

8. The working method as described in claim 7, characterized in that: The control module controls the red light array (14), green light array (15) and blue light array (16) to provide corresponding light sources according to the required chip packaging form, and controls the imaging module to capture images to detect the chip packaging based on the images.

Images