Internal heating test method, system and device of memory chip and storage medium
By combining independent excitation of a single memory cell with multi-view infrared thermal imaging acquisition and three-dimensional surface fitting, the problem of traditional temperature measurement methods being unable to capture subtle temperature changes inside memory chips is solved, enabling precise positioning and efficient testing of heat sources in memory chips.
CN121995199BActive Publication Date: 2026-06-26KINGTIGER TESTING TECH (SZ) LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KINGTIGER TESTING TECH (SZ) LTD
- Filing Date
- 2026-04-08
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Traditional temperature measurement methods are unable to accurately capture temperature changes in minute areas inside memory chips, thus failing to effectively guide thermal management design and dynamic power consumption control.
Method used
A testing method combining independent excitation of a single memory bank and hibernation of multiple memory banks was adopted. A temperature distribution model of the memory chip was generated by acquiring multi-view infrared thermal images and fitting three-dimensional surfaces.
Benefits of technology
It enables precise location of internal heat sources in memory chips, improves the accuracy of thermal management and testing efficiency, and ensures the integrity of the chip structure.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121995199B_ABST
Abstract
The application provides a memory chip internal heating test method, system, device and storage medium, and relates to the technical field of semiconductors. The method comprises: applying an electrical excitation signal to each memory bank of a target memory chip one by one, so that each memory bank continuously performs characteristic heating in turn; controlling a temperature observation device to collect multi-view infrared thermal image sets of each memory bank in turn, and recording the collection information; performing image preprocessing and data extraction on the multi-view infrared thermal image sets to obtain a temperature data set; performing data correlation analysis on the temperature data set and the collection information to obtain a temperature coordinate correlation data set; and performing three-dimensional curved surface fitting on the temperature coordinate correlation data set to obtain a temperature distribution model of the target memory chip. The application accurately controls the working state of each memory bank, significantly improves the accuracy of heat source positioning, effectively maintains the integrity of the chip structure while ensuring test accuracy, and significantly improves test efficiency.
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